WO2017190676A1 - 一种液冷散热机柜 - Google Patents

一种液冷散热机柜 Download PDF

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Publication number
WO2017190676A1
WO2017190676A1 PCT/CN2017/083130 CN2017083130W WO2017190676A1 WO 2017190676 A1 WO2017190676 A1 WO 2017190676A1 CN 2017083130 W CN2017083130 W CN 2017083130W WO 2017190676 A1 WO2017190676 A1 WO 2017190676A1
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WIPO (PCT)
Prior art keywords
liquid
heat
cabinet
heat dissipation
cooled
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PCT/CN2017/083130
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English (en)
French (fr)
Inventor
柴宏生
刘帆
郭雨龙
徐永田
高磊
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中兴通讯股份有限公司
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Publication of WO2017190676A1 publication Critical patent/WO2017190676A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of electronic device heat dissipation technology, for example, to a liquid cooling heat dissipation cabinet.
  • the liquid cooling technology has been applied more and more to large-power single-board cabinets to solve the problem of heat dissipation in the cabinet.
  • the related liquid cooling system usually adopts a scheme in which the liquid cooling plate is directly fixed to the service board, and the liquid cooling plate is provided with a fluid joint, which is inserted and removed along with the business board.
  • a certain risk in such a design such as the risk of liquid leakage in the process of plugging and unplugging of the fluid joint, and the risk of corrosion and clogging of the fluid joint, which may cause safety hazards in the single-plate cabinet.
  • the present disclosure provides a liquid cooling heat dissipation cabinet to solve the problem of the risk of the liquid cooling system of the related single board cabinet.
  • the liquid-cooling heat dissipation cabinet provided by the present disclosure includes a cabinet, a liquid-cooled plate installed in the cabinet, a service chip and a heat-conducting connecting member, wherein the liquid-cooling plate is internally provided with a cooling passage for the cooling liquid to flow.
  • One end of the heat conducting connector is in contact with the liquid cooling plate, and the other end of the heat conducting connector is in contact with the service chip, and heat generated by the service chip is transmitted to the liquid cold plate through the heat conducting connector Cooling and cooling by the coolant in the liquid cooling plate.
  • the liquid cooling heat dissipation cabinet may further include: a service board installed in the cabinet;
  • the service chip and the heat conduction connector are installed on the service board.
  • the liquid cooling heat dissipation cabinet may further include a main liquid supply pipe and a main liquid return pipe, and the liquid cooling plate further includes a minute a liquid supply pipe and a return liquid pipe, wherein a port of the sub-supply pipe is connected to a port of the cooling channel, and another port of the sub-supply pipe is connected to a port of the main liquid supply pipe, One port of the return liquid pipe is connected to another port of the cooling channel, and the other port of the liquid return pipe is connected to one port of the main liquid return pipe, and the other of the main liquid supply pipe A port is connected to the other port of the main return pipe.
  • the main liquid supply pipe and the main liquid return pipe may be disposed on the same side of the cabinet or on both sides of the cabinet.
  • the liquid cooling heat dissipation cabinet may further include a chip heat sink mounted on the service chip and closely fitting with the service chip, and the chip heat sink is in contact with the other end of the heat conduction connector .
  • the liquid cooling heat dissipation cabinet may further include a fixing member configured to fix the heat conduction connecting member and the liquid cooling plate.
  • the fixing member may have a hollow slot, the heat conducting connector is inserted into the hollow slot, the fixing member is mounted on the liquid cooling plate by screws, and the fixing member and the liquid cooling plate are disposed There are interface materials.
  • the fixing member may adopt a wedge locking structure, and an interface material is disposed between the liquid cooling plate and the heat conducting connector.
  • the liquid cooling plate may be detachably mounted in the cabinet.
  • a heat dissipating component may be disposed on the chip heat sink.
  • the thermally conductive connector can be a heat pipe or a thermally conductive metal block.
  • liquid-cooled heat-dissipating cabinet of the present disclosure since the liquid-cooled plate is directly installed in the cabinet, it is not directly fixed to the service board, but is indirectly connected through the heat-conducting connecting member, so the liquid The cold plate does not need to be inserted and removed with the service board to achieve the effect of separating the service board and the liquid cooling board, thereby avoiding the risk of liquid leakage and reducing the safety hazard of the liquid cooling and cooling cabinet.
  • FIG. 1 is a schematic structural view of a liquid cooling heat dissipation cabinet according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram showing the connection between a service board and a liquid cooling board according to an embodiment of the present disclosure.
  • FIG. 3 is a schematic view showing the fixing of the fixing member according to an embodiment of the present disclosure.
  • Fig. 4 is a view showing the fixing of the fixing member of another embodiment of the present disclosure.
  • the embodiment of the present disclosure provides a liquid-cooled heat dissipation cabinet, including a cabinet 100, a service board 101 installed in the cabinet 100, and a liquid-cooled board 102 installed in the cabinet 100.
  • the service chip 103 and the heat conduction connector 104 are installed on the service board 100.
  • the cabinet 100 can provide structural installation support for service boards, liquid cooling boards, and the like.
  • the service chip 103 generates a large amount of heat when processing a service.
  • the inside of the liquid cooling plate 102 is provided with a cooling passage for the coolant to flow.
  • One end of the heat conducting connector 104 is in contact with the liquid cooling plate 102, and the other end of the heat conducting connector 104 is in contact with the service chip 103, and the heat generated by the service chip 103 is generated by the heat conducting connector 104.
  • the liquid cooling plate 102 is transferred to the liquid cooling plate 102 for cooling and cooling by the cooling liquid in the liquid cooling plate 102.
  • the liquid-cooled plate 102 is directly installed in the cabinet 100, it is not directly fixed to the service board 101, but is indirectly connected through the heat-conducting connection member 104. Therefore, the liquid-cooled board is The effect of separating the service board 101 and the liquid cooling board 102 is achieved without the plugging and unplugging of the service board 101. The risk of liquid leakage can be avoided, and the safety hazard of the liquid cooling cabinet is reduced. In this way, the liquid cooling cabinet can be designed to reduce the wiring on the service board.
  • the liquid cooling plate 102 may be detachably installed in the cabinet 100 for maintenance.
  • the heat conducting connector 104 can be a heat pipe or a heat conductive material such as a heat conducting metal block to ensure heat transfer.
  • the liquid cooling heat dissipation cabinet of the embodiment of the present disclosure may further include a main liquid supply pipe 105 and a main liquid return pipe 106 , and the liquid cooling plate 102 further includes a divided liquid supply pipe 1021 and a liquid return pipe 1022 .
  • One port of the sub-supply pipe 1021 is connected to one port of the cooling channel, and the sub-supply pipe 1021 is another One port is connected to one port of the main liquid supply pipe 105, one port of the liquid return pipe 1022 is connected to another port of the cooling channel, and the other port of the liquid return pipe 1022 is One port of the main liquid return pipe 106 is connected, and the other port of the main liquid supply pipe 105 is connected to the other port of the main liquid return pipe 106.
  • the main liquid supply pipe 105, the liquid cooling plate 102, and the main liquid return pipe 106 form a closed liquid circuit configured to flow the coolant.
  • the main liquid supply pipe 105 may be disposed at a side of the cabinet 100 to provide cooling liquid for the cooling passage.
  • the main liquid return pipe 106 may also be disposed at the side of the cabinet 100, and the coolant may be recovered from the cooling passage.
  • the main liquid supply pipe 105 and the main liquid return pipe 106 may be disposed on the same side of the cabinet 100 (as shown in FIG. 1), or may be disposed on both sides of the cabinet, and the present disclosure does not Make restrictions.
  • the main liquid supply pipe 105 and the main liquid return pipe 106 may be profiled or metal pipe processed.
  • the connection manner of the main liquid supply pipe 105 and the sub-supply liquid pipe 1021, or the connection manner of the main liquid return pipe 106 and the return liquid pipe 1022 may be welding, or may be a joint connection, a hose Connections and the like are not limited by the present disclosure.
  • the liquid-cooled heat dissipation cabinet of the embodiment of the present disclosure further includes a chip heat sink 107 mounted on the service chip 103 and closely attached to the service chip 103 to absorb The heat generated by the service chip 103.
  • the chip heat sink 107 is in contact with the other end of the heat conducting connector 104 to transfer heat to the heat conducting connector 104 and then to the liquid cooling plate 102.
  • the material of the chip heat sink 109 may be made of metal.
  • the chip heat sink 107 may be provided with a heat dissipating member 1071 configured to enhance heat exchange and enhance heat dissipation.
  • the heat dissipating member 1071 is, for example, a strip attached to the chip heat sink 107, but it is not disclosed and is not limited thereto.
  • the liquid-cooled heat dissipation cabinet of the embodiment of the present disclosure further includes a fixing member 108, and the fixing member 108 can fix the heat-conducting connecting member 104 and the liquid-cooling plate 102 together.
  • FIG. 3 a schematic diagram of the fixing of the fixing member 108 according to an embodiment of the present disclosure is shown.
  • the fixing member 108 has a hollow slot into which the heat conducting connector 104 is inserted, and the fixing member 108 is mounted on the liquid cooling plate 102 by screws 31, the fixing member An interface material 32 is disposed between the 108 and the liquid cooling plate 102, and the interface material 32 is configured to ensure that the fixing member 108 and the liquid cooling plate 102 are closely attached.
  • the heat transferred by the heat conducting connector 104 can be smoothly transmitted to the liquid cooling plate 102 through the fixing member 108 and the interface material 32 in sequence.
  • FIG. 4 a schematic diagram of the fixing of the fixing member 108 according to another embodiment of the present disclosure is shown.
  • the fixing member 108 adopts a wedge-shaped locking structure, and the heat-conducting connecting member 104 and the liquid-cooling plate 102 are pressed together by self-extrusion, and the heat-conducting connecting member 104 and the An interface material 41 is disposed between the liquid cooling plates 102, and the interface material 41 is configured to ensure that the heat conducting connector 104 and the liquid cooling plate 102 are closely attached.
  • the heat transferred by the heat conducting connector 104 can be smoothly transmitted to the liquid cooling plate 102 through the interface material 41.
  • the liquid cooling heat dissipation cabinet provided by the present application can avoid the risk of liquid leakage and reduce the safety hazard of the liquid cooling and cooling cabinet.

Abstract

一种液冷散热机柜，包括机柜（100）、安装在所述机柜内的液冷板（102）、业务芯片（103）和导热连接件（104），其中，所述液冷板（102）的内部设置有冷却液流动的冷却通道，所述导热连接件（104）的一端与所述液冷板（102）接触，所述导热连接件（104）的另一端与所述业务芯片（103）接触，通过所述导热连接件（104）将所述业务芯片（103）产生的热量传递至所述液冷板（102），由所述液冷板（102）内的冷却液进行冷却散热。该液冷散热机柜，由于液冷板直接安装在机柜内，没有与业务单板直接固定在一起，而是通过导热连接件间接连接，所以液冷板不用随着业务单板一起插拔，达到分离业务单板和液冷板的效果，能够避免漏液的风险，降低液冷散热机柜的安全隐患。

Description

一种液冷散热机柜 技术领域
本申请涉及电子设备散热技术领域，例如涉及一种液冷散热机柜。
背景技术
近年来，随着互联网技术的不断发展，通讯和IT等领域对电子设备的集成度要求越来越高，高集成化的大功耗芯片越来越多的被应用到业务单板中，进而导致单板芯片发热点问题凸显。为解决业务单板内的发热点问题，一般采用增大单板机柜风扇转速的方法来增大单板槽位风量，但这会导致单板机柜的噪音过高。
目前，液冷散热技术已经越来越多的被应用到大功耗单板机柜，以解决机柜散热的问题。然而，相关的液冷散热系统通常采用液冷板与业务单板直接固定的方案，液冷板上设置有流体接头，随着业务单板一起插拔。这样的设计方案存在一定的风险，例如流体接头在插拔过程中存在漏液风险、流体接头存在腐蚀堵塞风险等，从而导致单板机柜存在安全隐患。
发明内容
本公开提供一种液冷散热机柜，以解决相关单板机柜的液冷散热系统存在风险的问题。
本公开提供的液冷散热机柜，包括机柜、安装在所述机柜内的液冷板、业务芯片和导热连接件，其中，所述液冷板的内部设置有供冷却液流动的冷却通道，所述导热连接件的一端与所述液冷板接触，所述导热连接件的另一端与所述业务芯片接触，通过所述导热连接件将所述业务芯片产生的热量传递至所述液冷板，由所述液冷板内的冷却液进行冷却散热。
所述液冷散热机柜还可以包括：安装在所述机柜内的业务单板；
所述业务芯片和所述导热连接件安装在所述业务单板上。
所述液冷散热机柜还可以包括主供液管和主回液管，所述液冷板还包括分 供液管和分回液管，所述分供液管的一端口与所述冷却通道的一端口连接，所述分供液管的另一端口与所述主供液管的一端口连接，所述分回液管的一端口与所述冷却通道的另一端口连接，所述分回液管的另一端口与所述主回液管的一端口连接，所述主供液管的另一端口与所述主回液管的另一端口连接。
所述主供液管和所述主回液管可以设置在所述机柜的同侧，或设置在所述机柜的两侧。
所述液冷散热机柜还可以包括芯片散热器，所述芯片散热器安装在所述业务芯片上，与所述业务芯片紧密贴合，所述芯片散热器与所述导热连接件的另一端接触。
所述液冷散热机柜还可以包括固定件，所述固定件被配置为将所述导热连接件和所述液冷板固定。
所述固定件可以具有空心槽，所述导热连接件插入到所述空心槽内，所述固定件通过螺钉安装在所述液冷板上，所述固定件和所述液冷板之间设置有界面材料。
所述固定件可以采用楔形锁紧结构，所述液冷板和所述导热连接件之间设置有界面材料。
所述液冷板可以是可拆卸地安装在所述机柜内。
所述芯片散热器上可以设置有散热部件。
所述导热连接件可以是热管或导热金属块。
通过本公开的上述技术方案，本公开的有益效果在于：
本公开的液冷散热机柜，由于所述液冷板直接安装在所述机柜内，没有与所述业务单板直接固定在一起，而是通过所述导热连接件间接连接，所以，所述液冷板不用随着所述业务单板一起插拔，达到分离所述业务单板和所述液冷板的效果，能够避免漏液的风险，降低液冷散热机柜的安全隐患。
附图概述
图1表示本公开实施例的液冷散热机柜的结构示意图。
图2表示本公开实施例的业务单板和液冷板的连接示意图。
图3表示本公开一实施例的固定件的固定示意图。
图4表示本公开另一实施例的固定件的固定示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
参见图1和图2所示，本公开实施例提供一种液冷散热机柜，包括机柜100、安装在所述机柜100内的业务单板101、安装在所述机柜100内的液冷板102、安装在所述业务单板100上的业务芯片103和导热连接件104。
其中，所述机柜100可以为业务单板、液冷板等提供结构安装支持。所述业务芯片103在处理业务时会产生大量的热量。所述液冷板102的内部设置有供冷却液流动的冷却通道。所述导热连接件104的一端与所述液冷板102接触，所述导热连接件104的另一端与所述业务芯片103接触，通过所述导热连接件104将所述业务芯片103产生的热量传递至所述液冷板102，由所述液冷板102内的冷却液进行冷却散热。
这样，由于所述液冷板102直接安装在所述机柜100内，没有与所述业务单板101直接固定在一起，而是通过所述导热连接件104间接连接，所以，所述液冷板102不用随着所述业务单板101一起插拔，达到分离所述业务单板101和所述液冷板102的效果，能够避免漏液的风险，降低液冷散热机柜的安全隐患。且这样设计液冷散热机柜，能够减少业务单板上的布线。
本公开实施例中，所述液冷板102可以是可拆卸地安装在所述机柜100内，以便于维修。
而所述导热连接件104可以为热管，也可以为导热金属块等导热材料，以保证热量的传递。
参见图2所示，本公开实施例的液冷散热机柜还可以包括主供液管105和主回液管106，所述液冷板102还包括分供液管1021和分回液管1022。所述分供液管1021的一端口与所述冷却通道的一端口连接，所述分供液管1021的另 一端口与所述主供液管105的一端口连接，所述分回液管1022的一端口与所述冷却通道的另一端口连接，所述分回液管1022的另一端口与所述主回液管106的一端口连接，所述主供液管105的另一端口与所述主回液管106的另一端口连接。这样，所述主供液管105、所述液冷板102和所述主回液管106会形成封闭的液体回路，被配置为冷却液的流动。
其中，所述主供液管105可设置在所述机柜100的侧面，可以为冷却通道提供冷却液。所述主回液管106也可设置在所述机柜100的侧面，可以从冷却通道回收冷却液。并且，所述主供液管105和所述主回液管106可以设置在所述机柜100的同侧(见图1所示)，也可以设置在所述机柜的两侧，本公开不对其进行限制。
所述主供液管105和所述主回液管106可以为型材加工，也可以为金属管加工。所述主供液管105与所述分供液管1021的连接方式，或所述主回液管106与所述分回液管1022的连接方式可以为焊接，也可以为接头连接、软管连接等，本公开不对其进行限制。
参见图2所示，本公开实施例的液冷散热机柜还包括芯片散热器107，所述芯片散热器107安装在所述业务芯片103上，并与所述业务芯片103紧密贴合，可以吸收所述业务芯片103产生的热量。所述芯片散热器107与所述导热连接件104的另一端接触，以将热量传递至所述导热连接件104，再传递至所述液冷板102。
所述芯片散热器109的材质可以是金属材质。
此外，所述芯片散热器107上可设置有散热部件1071，所述散热部件1071被配置为强化换热，增强散热效果。所述散热部件1071例如为附着于所述芯片散热器107上的条状物，但不公开不对其进行限制。
再参见图2所示，本公开实施例的液冷散热机柜还包括固定件108，所述固定件108可以将所述导热连接件104和所述液冷板102固定在一起。
参见图3所示，为本公开一实施例的固定件108的固定示意图。在图3中，所述固定件108具有空心槽，所述导热连接件104插入到所述空心槽内，所述固定件108通过螺钉31安装在所述液冷板102上，所述固定件108和所述液冷板102之间设置有界面材料32，所述界面材料32被配置为保证所述固定件108和所述液冷板102紧密贴合。
这样，所述导热连接件104传递的热量可依次通过所述固定件108和所述界面材料32顺利传递到所述液冷板102。
参见图4所示，为本公开另一实施例的固定件108的固定示意图。在图4中，所述固定件108采用楔形锁紧结构，借助自身挤压作用，将所述导热连接件104和所述液冷板102挤压在一起，且所述导热连接件104和所述液冷板102之间设置有界面材料41，所述界面材料41被配置为保证所述导热连接件104和所述液冷板102紧密贴合。
这样，所述导热连接件104传递的热量可通过所述界面材料41顺利传递到所述液冷板102。
以上所述仅是本公开的实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开实施例范围的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。
工业实用性
本申请提供的液冷散热机柜，能够避免漏液的风险，降低液冷散热机柜的安全隐患。

Claims (11)

  1. 一种液冷散热机柜，包括机柜、安装在所述机柜内的液冷板、业务芯片和导热连接件，其中，所述液冷板的内部设置有供冷却液流动的冷却通道，所述导热连接件的一端与所述液冷板接触，所述导热连接件的另一端与所述业务芯片接触，以通过所述导热连接件将所述业务芯片产生的热量传递至所述液冷板，由所述液冷板内的冷却液进行冷却散热。
  2. 根据权利要求1所述的液冷散热机柜，还包括：安装在所述机柜内的业务单板；
    所述业务芯片和所述导热连接件安装在所述业务单板上。
  3. 根据权利要求1所述的液冷散热机柜，还包括主供液管和主回液管，所述液冷板还包括分供液管和分回液管，所述分供液管的一端口与所述冷却通道的一端口连接，所述分供液管的另一端口与所述主供液管的一端口连接，所述分回液管的一端口与所述冷却通道的另一端口连接，所述分回液管的另一端口与所述主回液管的一端口连接，所述主供液管的另一端口与所述主回液管的另一端口连接。
  4. 根据权利要求3所述的液冷散热机柜，其中，所述主供液管和所述主回液管设置在所述机柜的同侧，或设置在所述机柜的两侧。
  5. 根据权利要求1所述的液冷散热机柜，还包括芯片散热器，所述芯片散热器安装在所述业务芯片上，与所述业务芯片紧密贴合，所述芯片散热器与所述导热连接件的另一端接触。
  6. 根据权利要求1所述的液冷散热机柜，还包括固定件，所述固定件被配置为将所述导热连接件和所述液冷板固定。
  7. 根据权利要求6所述的液冷散热机柜，其中，所述固定件具有空心槽， 所述导热连接件插入到所述空心槽内，所述固定件通过螺钉安装在所述液冷板上，所述固定件和所述液冷板之间设置有界面材料。
  8. 根据权利要求6所述的液冷散热机柜，其中，所述固定件采用楔形锁紧结构，所述液冷板和所述导热连接件之间设置有界面材料。
  9. 根据权利要求1-8任一所述的液冷散热机柜，其中，所述液冷板可拆卸地安装在所述机柜内。
  10. 根据权利要求1-8任一所述的液冷散热机柜，其中，所述芯片散热器上设置有散热部件。
  11. 根据权利要求1-8任一所述的液冷散热机柜，其中，所述导热连接件为热管或导热金属块。
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