WO2017049867A1 - 散热装置及其散热板 - Google Patents

散热装置及其散热板 Download PDF

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Publication number
WO2017049867A1
WO2017049867A1 PCT/CN2016/074657 CN2016074657W WO2017049867A1 WO 2017049867 A1 WO2017049867 A1 WO 2017049867A1 CN 2016074657 W CN2016074657 W CN 2016074657W WO 2017049867 A1 WO2017049867 A1 WO 2017049867A1
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liquid
fluid passage
substrate
heat
heat dissipation
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English (en)
French (fr)
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刘帆
柴宏生
郭雨龙
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ZTE Corp
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ZTE Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the field of heat dissipation of heat-generating electronic components, in particular to a heat-dissipating device for liquid cooling of a heat-generating unit and a heat-dissipating plate thereof.
  • the liquid-cooled heat sink refers to a heat exchanger with a fluid passage on the substrate, and a liquid-cooled heat exchanger that uses a liquid flow to take away the heat of the chip, and the design of the heat exchanger directly affects the heat dissipation effect of the liquid cooling system. .
  • the liquid cooling solution adopted in the commonly used electronic equipment and communication equipment the liquid cooling plate often adopts a serpentine single flow channel scheme as shown in FIG. 1 , and 11 is a fluid passage through the fluid passage 11 .
  • the circulating fluid flow removes heat to dissipate heat, but it has been proved that the heat dissipation effect of the heat sink does not achieve the desired effect, and the heat dissipation capability at different positions is large, which leads to uneven heat dissipation and poor heat dissipation efficiency.
  • the present invention provides a heat dissipating device including a substrate having a fluid passage, And a cover plate that is coupled to the substrate to seal the fluid passage, and at least two liquid holes respectively disposed on the side of the substrate or the cover plate and penetrating the fluid passage for respectively entering and discharging liquid
  • the fluid passage includes a main fluid passage respectively coupled to the liquid orifice and at least two branch fluid passages having unequal diameters.
  • the diameter of the branch fluid channel is the process length of the branch fluid channel to the liquid hole for liquid input divided by n, where n is a positive integer greater than one.
  • two ends of the branch fluid channel are respectively connected to one or more of the main fluid channels.
  • the substrate is made of a copper or aluminum material
  • the cover is made of a copper or aluminum material.
  • a heat dissipation plate including at least one heat dissipating device connected through a draft tube and attached to a heat generating component, wherein the heat dissipating device includes at least one connected through a draft tube and a heat dissipating device attached to the heating element, the heat dissipating device comprising a substrate having a fluid passage, and a cover plate interlocking with the substrate to seal the fluid passage, and being disposed on a side of the substrate or the cover plate and
  • the fluid passages are respectively connected to at least two liquid holes for liquid inlet and outlet, and the fluid passages include a main fluid passage respectively coupled to the liquid holes and at least two branch fluid passages having unequal diameters.
  • the diameter of the branch fluid channel is the process length of the branch fluid channel to the liquid hole for liquid input divided by n, where n is a positive integer greater than one.
  • two ends of the branch fluid channel are respectively connected to one or more of the main fluid channels.
  • the substrate is made of a copper or aluminum material
  • the cover is made of a copper or aluminum material.
  • a draft tube sealingly connected to the liquid hole and a coolant connector connected to the draft tube are further included.
  • the fluid passage includes a main fluid passage and a branch fluid passage
  • the branch fluid passage includes at least two fluid passages having unequal diameters, taking into account the influence of different diameters of the fluid passages on heat dissipation, and passing through the branches.
  • the design of the fluid channel can increase the heat exchange area between the heat source and the liquid, improve the heat dissipation capacity and heat dissipation efficiency, and obviously can reduce the negative influence of the single-diameter fluid passage on the heat dissipation capability of the heat sink, and improve the heat dissipation capability and efficiency.
  • FIG. 1 is a schematic view showing the structure of a fluid passage of a conventional serpentine heat dissipating device
  • FIG. 2a is a schematic diagram of a heat sink substrate provided by an embodiment of the present invention.
  • FIG. 2b is a schematic view of a heat sink cover plate according to an embodiment of the present invention.
  • FIG. 3 is a schematic view of another fluid passage provided by an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a heat dissipation plate provided by an embodiment of the present invention.
  • the diameter of the fluid passage included in the heat sink can determine the heat exchange area between the liquid and the heat source in the fluid passage and the distance between the heat sources, so the heat dissipation effect is affected; and the distance of the flow affects the fluid passage.
  • the amount and distribution of the liquid will also affect the heat dissipation effect.
  • the location where the heat source is distributed on the heat sink may also affect the heat dissipation effect.
  • the embodiment provides a heat dissipation device including a substrate and a cover plate; the substrate includes a fluid passage, and the fluid passage is divided into a main fluid passage and at least two branched fluid passages having unequal diameters, which reduce the single diameter. The negative effect of the fluid passage on the heat dissipation capability of the heat sink.
  • an embodiment of the present invention provides a heat dissipating device including a substrate 5 designed with fluid passages 1, 2, and 3, and the substrate 5 a cover plate 7 sealing the fluid passages 1, 2, 3, and at least two liquid holes 4 disposed on a side of the substrate 5 or the cover plate 7 and penetrating the fluid passages 1, 2, 3, 6.
  • the liquid hole 4 is a liquid hole for liquid inlet
  • the liquid hole 6 is a liquid hole for liquid discharge.
  • the fluid passages 1, 2, 3 include main fluid passages 2, 3 respectively coupled to the liquid holes 4, 6, and at least two branch fluid passages 1 of unequal diameter, the diameter of the branch fluid passage 1 being The length of the flow of the branch fluid channel 1 to the liquid hole 4 for liquid introduction is divided by n, where n is a positive integer greater than one.
  • the diameter in the present embodiment can be understood as the diameter value of the branch fluid passage 1.
  • the main fluid passage may be a fluid passage directly connected to the liquid hole 4 or the liquid hole 6.
  • the branch fluid passage is a fluid passage connected to the main fluid passage through the main fluid passage to be connected to the liquid orifice.
  • the diameter of the branch fluid passage is less than the diameter of the main fluid passage.
  • the heat exchange is performed, the temperature is gradually increased, and finally the high temperature liquid flows out from the liquid hole for the liquid discharge.
  • the low temperature liquid and the high temperature liquid are relatively the same, and the high temperature liquid in this embodiment is a liquid having a temperature higher than the low temperature liquid.
  • the design of the fluid channel as shown in Fig. 2(a) adds a branch fluid channel to the main fluid channel, and the number of fluid channels is increased, so that the liquid and the heat source can be increased relative to the single fluid channel.
  • the heat exchange area and the larger the thermal interaction area the higher the rate at which the cryogenic liquid absorbs heat from the heat source, thereby improving heat dissipation and heat dissipation efficiency.
  • the diameter of each branch fluid channel 1 is determined by the branch fluid channel 1 to the above.
  • the flow length of the liquid hole 4 in the liquid is divided by n, where n is the common divisor when the diameter of each branch fluid channel 1 is determined, so that some branch fluid channels can be reduced in liquid flow, and branched fluid channels are provided. There is no liquid flow, and the liquid flowing in the branch fluid channel does not match the diameter. These phenomena may cause uneven heat dissipation. With the structure of the heat dissipating device of the embodiment, the above problem can be well solved. .
  • Both ends of the branch fluid passage 1 are respectively connected to one or more of the main fluid passages 2 or 3.
  • the fluid passages 1, 2, 3 are in the shape shown in Fig. 2(a).
  • Fig. 2(a) the fluid passages 1, 2, 3 are in the shape shown in Fig. 2(a).
  • other similarly combined fluid passages are equally applicable to the heat sink provided by the present invention.
  • the substrate 5 is integrally made of a material made of copper or aluminum
  • the cover plate 7 is made of a material made of copper or aluminum.
  • Another embodiment of the present invention further provides a heat dissipation plate including at least one heat dissipation device that is connected through the draft tubes 8 and 9 and is attached to the heat generating component, and the heat dissipation device has fluid passages 1 and 2 a substrate 5 designed to be fastened to the substrate 5 to seal the cover plate 7 of the fluid passages 2, 3, and disposed on the side of the substrate 5 or the cover plate 7 and penetrate the fluid passageway At least two liquid holes 4, 6 of 2, 3, wherein the liquid hole 4 is a liquid hole for liquid inlet, and the liquid hole 6 is a liquid hole for liquid discharge.
  • the fluid passages 1, 2, 3 include main fluid passages 2, 3 respectively coupled to the liquid holes 4, 6, and at least two branch fluid passages 1 of unequal diameter, the diameter of the branch fluid passage 1 being The length of the flow of the branch fluid channel 1 to the liquid hole 4 for liquid introduction is divided by n, where n is a positive integer greater than one.
  • Both ends of the branch fluid channel 1 are respectively connected to one or more of the main fluid 2 or 3 channels.
  • the fluid passages 1, 2, 3 are in the shape shown in Fig. 2(a).
  • Fig. 2(a) the fluid passages 1, 2, 3 are in the shape shown in Fig. 2(a).
  • other similarly combined fluid passages are equally applicable to the heat sink provided by the present invention.
  • the substrate 5 is integrally made of a material made of copper or aluminum
  • the cover plate 7 is made of a material made of copper or aluminum.
  • the cover plate 7 is embedded in the substrate 5, and the cover plate 7 and the substrate 5 are firmly bonded by a brazing or friction stir welding process.
  • the soldering process may be performed by brazing or friction stir welding;
  • the substrate 5 is made of a copper material and the cover plate 7 is made of an aluminum alloy, the welding process is friction stir. Welding and other methods. Since aluminum alloy is lighter in weight, lower in cost and higher in strength than copper, the use of such a heat sink can not only reduce cost and weight, but also increase the compressive strength of the entire heat sink to make the heat sink Not easily deformed.
  • the entire assembled heat sink is fixed on the heat sink, and the heat sinks are connected through the liquid holes 4 and 6 to the flow tubes 8, 9 to connect the coolant connector 10 to the external coolant, and the entire heat sink is assembled.
  • the heat sink is formed to achieve heat dissipation to the heat generating unit.
  • the substrate 5 of the heat sink is fabricated by a process such as ordinary milling or casting.
  • a common milling or casting process is used to produce the fluid passages 1, 2, 3 and the inlet and outlet holes 4, 6 as shown in Fig. 2(a), wherein the left to right branch fluid passages are used for
  • the cover 7 is made by a conventional milling or casting process.
  • the cover plate 7 made of an aluminum alloy and the copper substrate 5 are joined by welding such as friction stir welding. Since aluminum alloy is lighter than copper in the same volume, lower in cost, and higher in strength, the use of such a heat sink can not only reduce cost and weight, but also improve the overall pressure resistance of the heat sink, making the heat sink difficult. Deformation.
  • the heat dissipation device is connected through the liquid holes 4 and 6, and the heat sink is connected to the liquid hole 4 to dissipate the heat.
  • the substrate 5 of the heat sink is fabricated by a process such as ordinary milling or casting.
  • a common milling or casting process is used to produce the fluid passages 1', 2', 3' and the inlet and outlet holes as shown in FIG. 3, wherein the left to right branch fluid passages are used for the liquid inlet.
  • the cover 7 is made by a common milling process.
  • the cover plate made of the aluminum alloy is combined with the copper substrate by friction welding or the like. Since aluminum alloy is lighter than copper in the same volume, lower in cost, and higher in strength, the use of such a heat sink can not only reduce cost and weight, but also improve the overall pressure resistance of the heat sink, making the heat sink difficult. Deformation.
  • the heat dissipation device is connected through the liquid holes 4 and 6, and the heat sink is connected to the liquid hole 4 to dissipate the heat.
  • the substrate 5 of the heat sink is fabricated by a process such as ordinary milling or casting.
  • a conventional milling or casting process is used to produce the fluid passages 1, 2, 3 as shown in Fig. 2(a), wherein 2 is the main fluid passage inlet and 3 is the main fluid passage outlet, wherein from left to
  • the cover 7 is made by a conventional milling or casting process.
  • the cover plate 7 made of an aluminum alloy and the copper substrate 5 are joined by welding such as friction stir welding. Since aluminum alloy is lighter than copper in the same volume, lower in cost, and higher in strength, the use of such a heat sink can not only reduce cost and weight, but also improve the overall pressure resistance of the heat sink, making the heat sink difficult. Deformation.
  • the utility model overcomes the problem that the heat dissipation effect of the heat dissipation plate in the prior art is poor, the difference in heat dissipation between different positions is large, and the heat dissipation capacity is unstable, and the method of adjusting the diameter according to the distance of the branch fluid channel from the liquid inlet hole is adopted.
  • the effect of the heat sink is more desirable and significant.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cookers (AREA)

Abstract

本实用新型公开了一种散热装置及散热板，所述散热装置包括其间布有流体通道（1，2，3）的基板（5），以及与所述基板（5）相扣以密封所述流体通道（1，2，3）的盖板（7），以及布置于所述基板（5）或盖板（7）之侧面并与所述流体通道（1，2，3）贯通的分别用于进液及出液的至少两个液孔（4，6），还包括至少一个通过导流管（8，9）连通起来的且与发热元器件贴合的散热装置形成的散热板。

Description

散热装置及其散热板 技术领域
本实用新型涉及发热电子元器件的散热领域，具体而言，涉及一种用于对发热单元进行液体冷却的散热装置及其一种散热板。
背景技术
随着通信行业的发展，在电子设备、通讯设备中，由于人们对性能的要求越来越高，其内部各种器件的运行速度也越来越快，从而产生大量的热量，芯片功耗也不断增大，传统风冷技术已经难以解决大功耗芯片(如功耗150W以上芯片)的散热问题，其散热问题越来越严峻，液冷散热方案正逐渐被开始使用。液冷散热板是指基板上带流体通道的换热器，内部通循环液体，利用液体流动将芯片热量带走的液冷换热器，其设计的好坏会直接影响液冷系统的散热效果。
目前常用的电子设备、通讯设备中所采用的液冷散热方案，其液冷散热板常采用的方案为如图1所示的蛇形单流道方案，11为流体通道，通过流体通道11内的循环流动液体流动的带走热量进行散热，但是实践证明这种散热板的散热效果没有达到预期效果，且不同位置散热能力差异大，这样就导致散热不均匀及散热效率差的问题。
实用新型内容
本实用新型的期望提供一种散热装置及其散热板，以至少部分解决现有散热装置均热效果差、散热能力不稳定的问题。
本实用新型一方面提供了一种散热装置，包括有流体通道的基板，以 及与所述基板相扣以密封所述流体通道的盖板，以及布置于所述基板或盖板之侧面并与所述流体通道贯通的分别用于进液及出液的至少两个液孔，所述流体通道包括分别与所述液孔配合连接的主流体通道以及至少两条直径不相等的分支流体通道。
可选地，所述分支流体通道的直径大小为所述分支流体通道到所述用于进液的液孔的流程长度除以n，其中n为大于1的正整数。
可选地，所述分支流体通道的两端分别与一条或多条所述主流体通道相连。
可选地，所述基板由铜质或铝制材料一体制成，以及所述盖板由铜质或铝制材料制成。
本实用新型另一方面还提供了一种散热板，包括至少一个通过导流管连通起来的且与发热元器件贴合的散热装置，所述散热装置包括至少一个通过导流管连通起来的且与发热元件贴合的散热装置，所述散热装置包括有流体通道的基板，以及与所述基板相扣以密封所述流体通道的盖板，以及布置于所述基板或盖板之侧面并与所述流体通道贯通的分别用于进液及出液的至少两个液孔，所述流体通道包括分别与所述液孔配合连接的主流体通道以及至少两条直径不相等的分支流体通道。
可选地，所述分支流体通道的直径大小为所述分支流体通道到所述用于进液的液孔的流程长度除以n，其中n为大于1的正整数。
可选地，所述分支流体通道的两端分别与一条或多条所述主流体通道相连。
可选地，所述基板由铜质或铝制材料一体制成，以及所述盖板由铜质或铝制材料制成。
可选地，还包括与液孔密封连接的导流管，以及连接至导流管的冷却液连接器。
通过上述本实用新型的技术方案，流体通道包括主流体通道和分支流体通道，且分支流体通道包括至少两条直径不相等的流体通道，考虑到了流体通道的不同直径对散热的影响，且通过分支流体通道的设计，能够增加热源与液体的热交换面积，提升散热能力和散热效率，显然能够减少单一直径的流体通道对散热装置散热能力的负面影响，提升散热能力和效率。
附图说明
此处所说明的附图用来提供对本实用新型的进一步理解，构成本申请的一部分，本发明实用新型的示意性实施例及其说明用于解释本发明实用新型，并不构成对本发明实用新型的不当限定。在附图中：
图1是传统蛇形散热装置的流体通道结构示意图；
图2a是本实用新型实施例提供的散热装置基板示意图；
图2b是本实用新型实施例提供的一种散热装置盖板示意图；
图3是本实用新型实施例提供的另一种流体通道示意图；
图4是本实用新型实施例提供的散热板结构示意图。
具体实施方式
研究分析，散热板中包括的流体通道的直径尺寸，能够决定流体通道内的液体与热源之间的热交换面积和热源之间的距离，故会影响散热效果；同时流程的远近会影响流体通道内液体的量和分布，也会影响散热效果。且可能热源在散热板上分布的位置不同，也会影响散热效果。综合考虑上述因素，本实施例提供一种散热装置，包括基板和盖板；基板上包括有流体通道，流体通道分为主流体通道和至少两条直径不相等的分支流体通道，减少单一直径的流体通道对散热装置散热能力的负面影响。
下面结合附图和具体实施例对本实用新型所述技术方案作进一步的详 细描述，以使本领域的技术人员可以更好的理解本实用新型并能予以实施，但所举实施例不作为对本实用新型的限定。
参照图2(a)、图2(b)和图4，本实用新型实施例一方面提供了一种散热装置，包括有流体通道1、2、3设计的基板5，与所述基板5相扣以密封所述流体通道1、2、3的盖板7，以及布置于所述基板5或盖板7之侧面并与所述流体通道1、2、3贯通的至少两个液孔4、6，其中液孔4为用于进液的液孔，液孔6为用于出液的液孔。
所述流体通道1、2、3包括分别与上述液孔4、6配合连接的主流体通道2、3以及至少两条直径不相等的分支流体通道1，所述分支流体通道1的直径大小为所述分支流体通道1到所述用于进液的液孔4的流程长度除以n，其中n为大于1的正整数。
本实施例中所述直径大小可理解为分支流体通道1的直径值。在本实施例中所述主流体通道可为直接与液孔4或液孔6相连的流体通道。所述分支流体通道为与主流体通道相连，通过主流体通道才能连接到液孔的流体通道。通常，分支流体通道的直径都小于所述主流体通道的直径。在本实用新型中提供的散热装置中，低温液体通过从用于进液的液孔进入主流体通道，再由主流体通道分散到各个分支流体通道，低温液体进入到散热装置之后就开始与热源进行热交换，温度逐步上升，最后高温液体从用于出液的液孔流出。这里的低温液体和高温液体是相对而言，本实施例中的高温液体为温度高于所述低温液体的液体。
如图2(a)所示的流体通道的设计，在主流体通道的基础上增加了分支流体通道，流体通道的数目增加了，这样相对于单一的流体通道，能够增加液体与热源之间的热交换面积，热交互面积越大，则低温液体从热源吸收热量的速率越高，从而能够提升散热能力和散热效率。
在本实施例中各条分支流体通道1的直径决定于分支流体通道1到所述用 于进液的液孔4的流程长度除以n，这里的n为各条分支流体通道1确定直径值时的共用被除数，这样就能够减少有的分支流体通道有液体流动，而有分支流体通道没有液体流动，分支流体通道内流动的液体与其直径不相匹配的现象，这些现象都可能会导致散热不均的问题，采用本实施例所述散热装置的结构，就能够很好的解决上述问题。
所述分支流体通道1的两端分别与一条或多条所述主流体通道2或3相连。
所述流体通道1、2、3为如图2(a)所示形状。除此之外，本领域的技术人员不难想到，其他类似组合的流体通道也同样适用本实用新型提供的散热装置。
所述基板5由铜质或铝制材料一体制成，以及，所述盖板7由铜质或铝制材料制成。
本实用新型实施例另一方面还提供了一种散热板，包括至少一个通过导流管8、9连通起来的且与发热元器件贴合的散热装置，所述散热装置有流体通道1、2、3设计的基板5，与所述基板5相扣以密封所述流体通道2、3的盖板7，以及布置于所述基板5或盖板7之侧面并与所述流体通道贯通1、2、3的至少两个液孔4、6，其中液孔4为用于进液的液孔，液孔6为用于出液的液孔。
所述流体通道1、2、3包括分别与上述液孔4、6配合连接的主流体通道2、3以及至少两条直径不相等的分支流体通道1，所述分支流体通道1的直径大小为所述分支流体通道1到所述用于进液的液孔4的流程长度除以n，其中n为大于1的正整数。
所述分支流体通道1的两端分别与一条或多条所述主流体2或3通道相连。
所述流体通道1、2、3为如图2(a)所示形状。除此之外，本领域的技术人员不难想到，其他类似组合的流体通道也同样适用本实用新型提供的散热装置。
所述基板5由铜质或铝制材料一体制成，以及，所述盖板7由铜质或铝制材料制成。将盖板7嵌入基板5中，采用钎焊或者摩擦搅拌焊的工艺将盖板7与基板5牢牢结合。如果基板5和盖板7都采用铜质材料，则焊接工艺可使用钎焊或摩擦搅拌焊等方式；如果基板5为铜质材料和盖板7为铝合金质材料，则焊接工艺采用摩擦搅拌焊等方式。由于铝合金较铜在相同的体积下更轻，成本更低，而且强度更高，所以使用这种散热装置不但可以降低成本和重量，而且可以提高整块散热板的耐压强度，使散热板不易变形。
最后，把整个组装好的散热装置固定在散热板上，通过液孔4、6接导流管8、9将散热装置连接起来，将冷却液连接器10连接外部冷却液，整个散热板组装完成，其内部如图4所示，至此，散热板形成,即可实现对发热单元的散热。
下面结合附图通过举例对技术方案的实施作进一步的描述：
例一
应用场景：结合图2(a)和图2(b)所示，首先，用普通铣或者铸造等工艺制作散热装置的基板5。在基板5中使用普通的铣或铸造的工艺制作出如图2(a)所示的流体通道1、2、3及进出液孔4、6，其中从左至右各分支流体通道到用于进液的液孔的流程长度分别为40mm、30mm、20mm、10mm、10mm、20mm、30mm、40mm，n＝10，从左至右各分支流体通道直径依次为4mm、3mm、2mm、1mm、1mm、2mm、3mm、4mm。采用普通铣或铸造工艺制作盖板7。
将铝合金制作的盖板7与铜质基板5以摩擦搅拌焊等焊接方式结合。 由于铝合金较铜在相同的体积下更轻，成本更低，而且强度更高，所以使用这种散热装置不但可以降低成本和重量，而且可以提高散热板整体的耐压强度，使散热板不易变形。
最后，通过液孔4、6连通导流管8、9后将散热装置连接并往液孔4通冷却液，即可实现对发热单元的散热。
例二
应用场景：首先，用普通铣或者铸造等工艺制作散热装置的基板5。在基板5中使用普通的铣或铸造的工艺制作出如图3所示的流体通道1’、2’、3’及进出液孔，其中从左至右各分支流体通道到用于进液的液孔的距离分别为80mm、70mm、60mm、50mm、40mm、30mm、20mm、10mm，取n＝10，从左至右各分支流体通道直径依次为8mm、7mm、6mm、5mm、4mm、3mm、2mm、1mm。采用普通铣工艺制作盖板7。
将铝合金制作的盖板与铜质基板以摩擦搅拌焊等焊接方式结合。由于铝合金较铜在相同的体积下更轻，成本更低，而且强度更高，所以使用这种散热装置不但可以降低成本和重量，而且可以提高散热板整体的耐压强度，使散热板不易变形。
最后，通过液孔4、6连通导流管8、9后将散热装置连接并往液孔4通冷却液，即可实现对发热单元的散热。
例三
应用场景：结合图2(a)、图2(b)和图4所示，首先，用普通铣或者铸造等工艺制作散热装置的基板5。在基板5中使用普通的铣或铸造的工艺制作出如图2(a)所示的流体通道1、2、3，其中2为主流体通道入口，3为主流体通道出口，其中从左至右各分支流体通道到用于进液的液孔的距离分别为40mm、30mm、20mm、10mm、10mm、20mm、30mm、40mm，n＝10，从左至右各分支流体通道直径依次为4mm、3mm、2mm、1mm、1mm、 2mm、3mm、4mm，进出液孔4、6。采用普通铣或铸造工艺制作盖板7。
将铝合金制作的盖板7与铜质基板5以摩擦搅拌焊等焊接方式结合。由于铝合金较铜在相同的体积下更轻，成本更低，而且强度更高，所以使用这种散热装置不但可以降低成本和重量，而且可以提高散热板整体的耐压强度，使散热板不易变形。
最后，把整个组装好的若干个相同的散热装置按照图4所示结构固定在散热板上，通过液孔4、6连通导流管8、9将散热装置连接起来，将冷却液连接器10连接外部冷却液，整个散热板组装完成，其结构如图4所示，即可实现对发热单元的散热。
本实用新型为了克服现有技术中存在的散热板均热效果差、不同位置散热差异大、散热能力不稳定的情况，采用根据分支流体通道距离进液孔的流程远近而调整其直径的方法，使得该散热板的效果更为理想和显著。
以上所述仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡按照本发明原理所作的修改，都应当理解为落入本实用新型的保护范围。

Claims (9)

  1. 一种散热装置，包括有流体通道的基板，以及与所述基板相扣以密封所述流体通道的盖板，以及布置于所述基板或盖板之侧面并与所述流体通道贯通的分别用于进液及出液的至少两个液孔，所述流体通道包括分别与所述液孔配合连接的主流体通道以及至少两条直径不相等的分支流体通道。
  2. 如权利要求1所述的散热装置，其中，所述分支流体通道的直径大小为所述分支流体通道到所述用于进液的液孔的流程长度除以n，其中n为大于1的正整数。
  3. 如权利要求1所述的散热装置，其中，所述分支流体通道的两端分别与一条或多条所述主流体通道相连。
  4. 如权利要求1所述的散热装置，其中，所述基板由铜质或铝制材料一体制成，以及所述盖板由铜质或铝制材料制成。
  5. 一种散热板，包括至少一个通过导流管连通起来的且与发热元件贴合的散热装置，所述散热装置包括有流体通道的基板，以及与所述基板相扣以密封所述流体通道的盖板，以及布置于所述基板或盖板之侧面并与所述流体通道贯通的分别用于进液及出液的至少两个液孔，所述流体通道包括分别与所述液孔配合连接的主流体通道以及至少两条直径不相等的分支流体通道。
  6. 如权利要求5所述的散热板，其中，所述分支流体通道的直径大小为所述分支流体通道到所述用于进液的液孔的流程长度除以n，其中n为大于1的正整数。
  7. 如权利要求5所述的散热板，其中，所述分支流体通道的两端分别与一条或多条所述主流体通道相连。
  8. 如权利要求5所述的散热板，其中，所述基板由铜质或铝制材料一体制成，以及所述盖板由铜质或铝制材料制成。
  9. 如权利要求5所述的散热板，其中，还包括与液孔密封连接的导流管，以及连接至导流管的冷却液连接器。
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109585970B (zh) * 2018-02-07 2024-04-26 骆驼集团武汉光谷研发中心有限公司 一种耐压液冷散热片
US12287151B2 (en) * 2021-02-26 2025-04-29 Teradyne, Inc. Thermal plate having a fluid channel
CN113835305A (zh) * 2021-09-22 2021-12-24 哈尔滨工业大学 光刻机电路板冷却装置
CN114121850A (zh) * 2021-10-29 2022-03-01 中国电子科技集团公司第十三研究所 嵌入液冷微流道陶瓷封装结构、陶瓷封装外壳及制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100085712A1 (en) * 2008-10-02 2010-04-08 Dell Products L.P. Liquid Cooling System
CN101696857A (zh) * 2009-10-20 2010-04-21 无锡佳龙换热器制造有限公司 一种板翅式换热器
CN201548091U (zh) * 2009-10-20 2010-08-11 无锡佳龙换热器制造有限公司 一种板翅式换热器
CN201563331U (zh) * 2009-10-29 2010-08-25 比亚迪股份有限公司 一种直通水道冷却装置
CN102478927A (zh) * 2010-11-25 2012-05-30 鸿富锦精密工业（深圳）有限公司 服务器机柜
TW201222205A (en) * 2010-11-25 2012-06-01 Hon Hai Prec Ind Co Ltd Server cabinet
CN202931727U (zh) * 2012-08-20 2013-05-08 中兴通讯股份有限公司 散热装置及其散热板
US20130271918A1 (en) * 2012-04-16 2013-10-17 John Philip Neville Hughes Cold plate with reduced bubble effects

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100085712A1 (en) * 2008-10-02 2010-04-08 Dell Products L.P. Liquid Cooling System
CN101696857A (zh) * 2009-10-20 2010-04-21 无锡佳龙换热器制造有限公司 一种板翅式换热器
CN201548091U (zh) * 2009-10-20 2010-08-11 无锡佳龙换热器制造有限公司 一种板翅式换热器
CN201563331U (zh) * 2009-10-29 2010-08-25 比亚迪股份有限公司 一种直通水道冷却装置
CN102478927A (zh) * 2010-11-25 2012-05-30 鸿富锦精密工业（深圳）有限公司 服务器机柜
TW201222205A (en) * 2010-11-25 2012-06-01 Hon Hai Prec Ind Co Ltd Server cabinet
US20130271918A1 (en) * 2012-04-16 2013-10-17 John Philip Neville Hughes Cold plate with reduced bubble effects
CN202931727U (zh) * 2012-08-20 2013-05-08 中兴通讯股份有限公司 散热装置及其散热板

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