WO2017188129A1 - 流体制御装置、流体制御装置の制御方法、および、流体制御システム - Google Patents
流体制御装置、流体制御装置の制御方法、および、流体制御システム Download PDFInfo
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- WO2017188129A1 WO2017188129A1 PCT/JP2017/015974 JP2017015974W WO2017188129A1 WO 2017188129 A1 WO2017188129 A1 WO 2017188129A1 JP 2017015974 W JP2017015974 W JP 2017015974W WO 2017188129 A1 WO2017188129 A1 WO 2017188129A1
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- 239000012530 fluid Substances 0.000 title claims abstract description 161
- 238000000034 method Methods 0.000 title claims description 24
- 238000012545 processing Methods 0.000 claims abstract description 6
- 238000004891 communication Methods 0.000 claims description 33
- 238000011144 upstream manufacturing Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000004044 response Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 230000010365 information processing Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 101100484930 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) VPS41 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
- F16K37/0025—Electrical or magnetic means
- F16K37/005—Electrical or magnetic means for measuring fluid parameters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
- F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/25—Pc structure of the system
- G05B2219/25312—Pneumatic, hydraulic modules, controlled valves
Definitions
- the present invention relates to a fluid control device, a control method for the fluid control device, and a fluid control system, and more particularly, to a fluid control device corresponding to miniaturization, a control method therefor, and a fluid control system including the fluid control device.
- the pressure type flow rate control device can control the flow rates of various fluids with high accuracy by a relatively simple mechanism in which a piezo element drive type control valve and a throttle (for example, an orifice plate or a critical nozzle) are combined. Widely used because it can.
- the critical expansion condition P1 / P2 ⁇ about 2 P1: gas pressure upstream of the throttle unit, P2: gas pressure downstream of the throttle unit
- the flow rate of the gas passing through the throttle unit is The fluid control is performed using the principle that it is determined by the upstream pressure P1 regardless of the downstream pressure P2.
- the critical expansion conditions depend on the gas type and temperature.
- the flow rate Qc is given by the following equation, for example.
- a pressure type flow control device in which a pressure sensor is provided not only on the upstream side of the throttle unit but also on the downstream side of the throttle unit.
- the flow rate Qc can be calculated based on n (where K is a proportional constant depending on the type of fluid and the fluid temperature, and m and n are indices derived based on the actual flow rate).
- Patent Document 1 discloses a flow rate control system in which a control device that collectively manages a plurality of flow rate measuring devices is attached.
- a part of the configuration of a plurality of flow rate measuring devices is made common and given to the control device, thereby reducing the thickness of each flow rate measuring device.
- each flow meter stores relevant flow calculation related data, and the control device calculates flow measurement values using the flow calculation related data and measurement data acquired from the storage unit of the flow meter. ing.
- the installation space may not be sufficiently reduced if a control device connected thereto is provided in the vicinity of the semiconductor manufacturing device.
- a control device connected thereto is provided in the vicinity of the semiconductor manufacturing device.
- the pressure-type flow rate control device provided with the upstream pressure sensor and the downstream pressure sensor described above there is a limit to downsizing the internal elements, so it is easy to secure a space for control equipment in the vicinity of the semiconductor manufacturing device. is not.
- the present invention has been made in order to solve the above-described problems, and has as its main object to provide a fluid control device, a control method thereof, and a fluid control system including the fluid control device that can be reduced in size and thickness. .
- a fluid control device is a fluid control device including a fluid control module and an external control module, and the fluid control module includes a flow path, a control valve on the flow path, and the control valve.
- a valve driving circuit for driving, a fluid measuring device provided on the flow path, and a first processor for processing a signal output from the fluid measuring device, wherein the external control module includes the first control module.
- a second processor for processing a signal output by the processor, wherein the second processor outputs a valve control signal in response to a signal of the fluid measuring device output from the first processor,
- the valve control signal is directly input to the valve driving circuit without going through the first processor, and the valve driving circuit receives the valve from the second processor. And it outputs a driving voltage for driving the control valve in response to a control signal.
- the signal from the fluid measuring device is A / D converted before being output to the external control module.
- the second processor generates a PWM signal as a valve control signal
- the valve drive circuit generates a drive voltage according to a duty ratio of the PWM signal
- control valve is a piezo element drive type valve
- valve drive circuit steps up or down a piezo actuator based on the valve control signal.
- the fluid control module and the external control module each include a differential transmission interface unit, and are digitally communicated by a differential transmission method via a plurality of cables.
- the second processor is configured to receive an information signal from an external device, communication between the external control module and the external device is performed by EtherCAT, and the external control module includes An RJ45 connector is provided.
- a memory is provided in the fluid control module, and individual information associated with the fluid control module is stored in the memory, and the second processor reads the individual information. Is possible.
- the fluid measuring device is a flow sensor or a pressure sensor.
- the fluid measuring device includes a throttle portion provided on the flow path, a first pressure sensor provided upstream of the throttle portion and downstream of the control valve, and downstream of the throttle portion. And a second pressure sensor provided on the side.
- the fluid control module further includes a temperature sensor for measuring a gas temperature between the control valve and the throttle unit.
- the fluid control module includes an orifice built-in valve including an orifice member as the restrictor, an electromagnetic valve connected to the orifice built-in valve, and a drive circuit for the solenoid valve
- the external control module includes The signal for controlling the opening and closing of the solenoid valve is output directly to the drive circuit of the solenoid valve without going through the first processor.
- a plurality of gas supply lines are provided in parallel to one common gas supply line, and each of the plurality of gas supply lines includes any one of the fluid control devices described above.
- the fluid control module and the external control module are provided in a one-to-one relationship.
- the fluid control device includes a flow path, a control valve for fluid control, a valve drive circuit that controls the degree of opening and closing of the control valve, a fluid measuring device provided on the flow path, A fluid control module having a first processor for receiving an output from the fluid meter; and an external unit disposed separately from the fluid control module and communicatively connected to the fluid control module via a plurality of cables.
- a control module having a second processor configured to receive a signal from the first processor and outputting an information signal generated by the second processor to an external device, or external An external control module configured to input an information signal from a device to the second processor, wherein the second processor Receiving a signal of the fluid measuring device from one processor and generating a valve control signal based on the signal of the fluid measuring device, and the valve control signal is transmitted to the valve driving circuit without passing through the first processor.
- the control valve is driven by being directly input and converted into a drive voltage in the valve drive circuit.
- a control method of a fluid control apparatus is a control method of a fluid control apparatus including a fluid control module having a first processor and an external control module having a second processor, wherein the fluid control A step of outputting a flow rate signal from a flow rate measuring device provided in the module; and a step of outputting the flow rate signal output from the flow rate measuring device to the second processor via the first processor; A step in which a second processor outputs a valve control signal based on the output flow rate signal; and the output valve control signal is arranged in the fluid control module without going through the first processor. A step of outputting to the valve drive circuit, and based on the valve control signal, the valve drive circuit outputs a drive voltage, And a step of driving the located control valve.
- FIG. 1 shows a fluid control system incorporating a fluid control apparatus according to an embodiment of the present invention.
- n gas supply lines 2 are provided in parallel to one common gas supply line connected to the process chamber 3 of the semiconductor manufacturing apparatus.
- N fluid control devices 10 corresponding to the line 2 are provided.
- each of the gas supply lines 2 gas (raw material gas, etching gas, etc.) from the gas source 1 is supplied to the process chamber 3 with the flow rate and pressure controlled by the fluid control device 10.
- a vacuum pump 4 is connected to the process chamber 3, and the inside of the process chamber 3 can be evacuated during the semiconductor manufacturing process.
- Each gas supply line 2 is provided with a downstream valve (open / close valve) Vn, and only the necessary gas is supplied to the process chamber 3 through the opened downstream valve Vn.
- each of the plurality of fluid control devices 10 includes the fluid control module FCn and the external control module En in a one-to-one relationship.
- the fluid control module FCn and the external control module En are arranged separately from each other, and are connected by a high-speed digital communication cable Cn.
- the cable Cn has a length of 0.5 m to 3 m, for example, so that the external control module En can be installed at a position away from the fluid control module FCn installed in the vicinity of the process chamber 3. It becomes possible.
- the external control modules E1 to En are connected to the information processing apparatus (external apparatus) 5 via the network by EtherCAT (registered trademark).
- the external control modules E1 to En are provided with an RJ45 connector 10a corresponding to EtherCAT, and can communicate with the information processing apparatus 5 via an EtherCAT cable connected thereto.
- the information processing device 5 may be, for example, a general-purpose computer equipped with a user input device.
- FIG. 2 is a diagram showing a pair of fluid control module FC and external control module E.
- the fluid control module FC and the external control module E are connected by a digital communication cable Cn. More specifically, the LVDS (Low voltage differential) provided in each of the fluid control module FC and the external control module E is provided. Signaling) Digital signals are communicated by the differential transmission method via the interface units 25 and 35.
- LVDS Low voltage differential
- LVDS has a feature that high-speed data transmission can be performed, and further has a feature that long-distance transmission can be performed while suppressing noise. For this reason, when LVDS is used, even when the fluid control module FC and the external control module E are provided apart from each other, it is possible to realize high-speed communication with high reliability between them.
- the fluid control module FC has the gas flow path 11, the throttle part 14 interposed in the gas flow path, the first pressure sensor P1 and the temperature sensor T provided on the upstream side of the throttle part 14. And a control valve 12 provided on the upstream side of the first pressure sensor P1, and a second pressure sensor P2 provided on the downstream side of the throttle portion.
- the first pressure sensor P1 can measure the pressure in the flow path between the control valve 12 and the throttle unit 14, and the second pressure sensor P2 is downstream of the throttle unit 14 (for example, the throttle unit 14 and the downstream valve).
- the pressure of the flow path between Vn (see FIG. 1) can be measured.
- the fluid control module FC has the same configuration as the pressure type flow rate control device, and includes a first pressure sensor P1 and a second pressure sensor P2 as fluid measuring devices provided in the flow path. Yes.
- the fluid control module FC is not limited to this, and the fluid control module FC may be replaced with the first and second pressure sensors P1 or in addition to the first and second pressure sensors P1, and may have other forms of fluid measuring devices (for example, It may have a configuration including a flow rate sensor.
- the illustrated fluid control module FC is provided with an orifice built-in valve 16 formed integrally with the throttle portion 14, and an electromagnetic valve 18 is connected to the orifice built-in valve 16.
- the orifice built-in valve 16 is typically an on-off valve composed of a fluid operation valve (AOV or the like), and controls the supply of operating (driving) fluid to the orifice built-in valve 16 using an electromagnetic valve 18.
- the orifice built-in valve 16 is opened and closed.
- the orifice built-in valve 16 can achieve, for example, an intermittent gas flow or a high-speed and reliable gas shut-off operation to the process chamber.
- the throttle unit 14 is realized by an orifice member included in the orifice built-in valve 16, but is not limited thereto, and a throttle unit such as an orifice plate or a critical nozzle is independent of the valve instead of the orifice built-in valve 16. It may be an aspect provided.
- the flow path may be formed as a hole provided in a metal block in addition to the one formed by piping.
- the first pressure sensor P1 and the second pressure sensor P2 may be, for example, pressure sensors that incorporate a silicon single crystal sensor chip and a diaphragm.
- the temperature sensor may be a thermistor, for example.
- the control valve 12 may be, for example, a piezo drive type valve composed of a metal diaphragm valve 12a and a piezo actuator 12b as a drive unit.
- the fluid control module FC has a circuit board.
- the circuit board includes an A / D converter (A / D conversion circuit) 22, a small processor (first processor) 20, and a memory (for example, an EEPROM). 24, an LVDS interface unit 25 is provided.
- a / D converter A / D conversion circuit
- first processor first processor
- memory for example, an EEPROM
- an LVDS interface unit 25 is provided.
- the outputs of the first pressure sensor P1, the second pressure sensor P2, and the temperature sensor T that is, the output of the fluid measuring device
- the small processor 20 can output the data signal SD to the external control module E via the LVDS interface unit 25 and the first cable L1.
- the output of the fluid measuring device includes not only a signal such as a digital signal but also a voltage and the like, and includes all output from the fluid measuring device.
- FIG. 2 shows a mode in which the A / D converter 22 and the small processor 20 are separated, but the A / D converter 22 may be built in the small processor 20. In this case, the output from the fluid measuring device is input to the processing unit as a digital signal via the A / D converter in the small processor.
- the circuit board of the fluid control module FC is provided with a valve driving circuit 26 for controlling the control valve 12 and an electromagnetic valve driving circuit 28 for controlling the electromagnetic valve 18.
- the valve drive circuit 26 and the electromagnetic valve drive circuit 28 are not connected to the small processor 20, and receive the digital valve control signals SV1 and SV2 directly from the external control module E as will be described later. It is configured as follows.
- the circuit board of the external control module E has a communication / control processor (second processor) 30 configured to receive a digital data signal SD from the small processor 20 of the fluid control module FC via the LVDS interface unit 35. And an EtherCAT communication circuit 32.
- the external control module E is also provided with a power supply circuit 34 connected to an external power supply (for example, DC 24V).
- FIG. 3 is a diagram showing a specific circuit configuration example on the substrate in the fluid control module FC and the external control module E shown in FIG.
- an A / D converter (A / D conversion circuit) 22 22
- a small processor (first processor) 20 20
- a memory 24 24
- an LVDS interface unit 25 25
- a communication / control processor 30 30
- an EtherCAT communication circuit 32 32
- an LVDS interface unit 35 35
- a power supply circuit 34 are provided.
- the fluid control module FC and the external control module E are connected by a plurality of digital communication cables L1 to L3 and a power cable L4.
- a first cable L1 for transmitting a data signal between the small processor 20 and the communication / control processor 30, and a valve drive circuit (here, a piezo drive circuit) 26 from the communication / control processor 30.
- a second cable L2 for transmitting a flow rate control signal to the power source, a third cable L3 for transmitting an open / close signal from the communication / control processor 30 to the solenoid valve drive circuit 28, and a fluid control module from the power circuit 34.
- the FC is connected by a power cable L4 for supplying power at a predetermined voltage.
- the communication / control processor 30 can receive a digital pressure signal or temperature signal from the small processor 20 via the first cable L1.
- the communication / control processor 30 can also receive the fluid control module individual information stored in the memory (here, the EEPROM) 24 of the fluid control module FC via the small processor 20 and the first cable L1.
- the first cable L1 for example, an appropriate cable having a length of 0.5 to 3 m can be used in order to perform bidirectional high-speed digital communication.
- the fluid control module individual information stored in the memory 24 and read from the communication / control processor 30 under the control of the processor 20 includes, for example, a serial number, a flow rate range, a flow rate correction, a temperature characteristic of the pressure sensor, and the like. included.
- the communication / control processor 30 can appropriately calculate the current flow rate using the read fluid control module individual information.
- the communication / control processor 30 generates a digital flow control signal based on the received pressure signal, temperature signal, and fluid control module individual information. More specifically, the communication / control processor 30 first calculates the current flow rate based on input data signals such as a pressure signal and a temperature signal. For example, the flow rate is determined based on the upstream pressure and the gas temperature when the critical expansion condition is satisfied, and based on the upstream pressure, the downstream pressure and the gas temperature when the critical expansion condition is not satisfied. Can be sought. By performing correction using the fluid control module individual information in this calculation process, the flow rate in the fluid control module can be calculated more accurately.
- the communication / control processor 30 receives a set flow rate signal from an external device via the EtherCAT communication circuit 32, compares the calculated current flow rate (calculated flow rate) with the set flow rate, and generates a valve control signal so as to eliminate the difference. To do.
- the communication / control processor 30 generates a PWM signal which is a pulse width modulated digital signal as a valve control signal.
- the PWM signal can be generated by adjusting the duty ratio of the PWM signal by feedback control such that the set flow rate and the calculated flow rate match based on the comparison between the set flow rate and the calculated flow rate.
- the generated PWM signal is transmitted to the fluid control module FC through the LVDS interface unit 35 by the second cable L2, and is input to the valve drive circuit 26 through the LVDS interface unit 25.
- the valve control signal (PWM signal) is directly input to the valve drive circuit 26 through the second cable L2 different from the first cable L1 without going through the small processor 25.
- the second cable L2 for example, an appropriate cable having a length of 0.5 to 3 m can be used.
- the valve drive circuit 26 performs step-up / step-down of the piezo actuator based on the received valve control signal.
- FIG. 4 is a circuit diagram showing a configuration example of the valve drive circuit 26.
- the valve drive circuit 26 is configured by a chopper type step-up / step-down converter.
- the boosting transistor (FET1) when the boosting transistor (FET1) is turned on while the power supply transistor (FET0) is maintained in the on state and the power is supplied, energy is stored in the reactor (L). Sometimes the stored energy is superimposed on the input voltage and output. Then, the capacitor of the piezo actuator is charged by the output voltage, and the drive voltage is set according to the amount of charge.
- a PWM signal as a valve control signal is input to the gate of the boosting transistor (FET1), and the amount of energy stored in the reactor increases as the duty ratio of the PWM signal increases.
- the boosting transistor (FET1) is repeatedly turned on and off, and the boosting according to the duty ratio is realized, and the driving voltage of the piezo actuator increases.
- the piezo actuator can be stepped down in accordance with the duty ratio by inputting a PWM signal having a small duty ratio to the gate of the step-down transistor (FET2) shown in the figure. it can.
- FIG. 5 is a graph showing the relationship between the duty ratio of the PWM signal output from the external control module E and received by the valve drive circuit 26, and the drive voltage applied to the piezo actuator.
- the drive voltage of the piezo actuator is set to be substantially proportional to the duty ratio of the PWM signal. Therefore, the external control module E directly controls the opening / closing operation of the control valve 12 by outputting a PWM signal having a duty ratio corresponding to the driving voltage of the desired piezoelectric actuator (that is, the degree of opening / closing of the piezoelectric driving valve). can do.
- the valve drive circuit 26 is an analog circuit, and the relationship between the duty ratio of the PWM signal and the valve drive voltage may be different depending on the individual fluid control module FC. For this reason, information indicating the above relationship may also be stored in the memory 24 as individual information and read by the external control module E as necessary.
- control / communication processor 30 of the external control module E of the present embodiment directly outputs the digital open / close signal SV2 to the solenoid valve drive circuit 28 via the third cable L3. Output to. That is, the opening / closing operation of the electromagnetic valve 18 is directly controlled by the external control module E without using the small processor 20 provided in the fluid control module FC.
- the small processor 25 of the fluid control module FC controls the transmission of outputs from the first and second pressure sensors and the temperature sensor, and transmits the individual information stored in the memory. Control is enough. For this reason, it is possible to reduce the size of the circuit board and thus the fluid control module FC. Further, since an analog circuit including individual differences is mounted on the fluid control module FC side and individual information is stored in the memory, for example, when the external control module E fails, it is replaced with a new external control module E. However, it is possible to easily perform highly accurate fluid control only by reading the individual information from the fluid control module FC.
- valve control is performed in the fluid control module FC
- the fluid control module FC side is designed so that control can be performed without permission, and therefore control may run out of control. is there.
- the fluid control device 10 of the present embodiment even if the fluid control module FC and the external control module E are disconnected, the control of the control valve and the electromagnetic valve is performed by the external control module E. Therefore, control is stopped and it is safe.
- the fluid control module FC can be reduced in size, for example, can be configured to have a width of 10 mm or less, and further, a hard wire that connects the fluid control module FC and the external control module E. Therefore, the installation space in the vicinity of the semiconductor manufacturing apparatus can be greatly reduced.
- the external control module E arranged separately from the fluid control module FC and the cable may have a larger size than the fluid control module FC, so that it is possible to provide an RJ45 connector for EtherCAT communication. It is possible to correspond to high-speed communication with an external device.
- FIG. 6 is a plan view showing a connector and the like provided on the exterior (end face) of the external control module E.
- the external control module E is provided with an RJ45 connector 10a, a display device 10b, a rotary switch 10c for address setting of the external control module E, a pilot lamp 10d indicating a normal / abnormal state, etc. as shown in the figure. Good.
- the external control module E may be provided at a position separated from the semiconductor manufacturing apparatus, and since there is no size limitation, the RJ45 connector 10a having a lateral width d of about 13.5 mm can be easily mounted.
- the flow rate is measured using the pressure sensor, but it is needless to say that the flow rate may be measured using the flow sensor.
- the fluid control device is preferably used for fluid control by being connected to a gas supply line for semiconductor manufacturing, for example.
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Abstract
Description
ここで、Sはオリフィス断面積、Cはガス物性によって決まる定数(フローファクタ)、T1は上流ガス温度である。上記式から、流量Qcは上流圧力P1に比例することがわかる。このため、オリフィス上流側に設けた制御弁の開閉調整等により上流圧力P1を制御するだけで、下流に流れるガスの流量を高精度に制御することができる。
2 ガス供給ライン
3 プロセスチャンバ
4 真空ポンプ
5 情報処理装置
10 流体制御装置
12 制御バルブ
12a ダイアフラム弁
12b ピエゾアクチュエータ
14 絞り部
16 オリフィス内蔵弁
18 電磁弁
FC 流体制御モジュール
E 外部制御モジュール
P1 上流圧力センサ
P2 下流圧力センサ
T 温度センサ
Claims (13)
- 流体制御モジュールと外部制御モジュールとを備える流体制御装置であって、
前記流体制御モジュールは、
流路と、
前記流路上の制御バルブと、
前記制御バルブを駆動するバルブ駆動回路と、
前記流路上に設けられる流体測定器と、
前記流体測定器から出力される信号を処理する第1のプロセッサと、を有し、
前記外部制御モジュールは、前記第1のプロセッサが出力した信号を処理する第2のプロセッサ、を有し、
前記第2のプロセッサは、前記第1のプロセッサから出力される前記流体測定器の信号に応じてバルブ制御信号を出力し、前記バルブ制御信号は前記第1のプロセッサを介することなく前記バルブ駆動回路に直接入力され、前記バルブ駆動回路は前記第2プロセッサからの前記バルブ制御信号に応じて前記制御バルブを駆動する駆動電圧を出力する、流体制御装置。 - 前記流体測定器からの信号は、前記外部制御モジュールへ出力される前にA/D変換されている、請求項1に記載の流体制御装置。
- 前記第2のプロセッサは、前記バルブ制御信号としてPWM信号を生成し、
前記バルブ駆動回路は、前記PWM信号のデューティー比に応じた駆動電圧を生成する、請求項1または2に記載の流体制御装置。 - 前記制御バルブはピエゾ素子駆動型バルブであり、前記バルブ駆動回路は前記バルブ制御信号に基づいてピエゾアクチュエータを昇圧または降圧させる、請求項3に記載の流体制御装置。
- 前記流体制御モジュールと、前記外部制御モジュールとは、それぞれ、差動伝送インターフェース部を備えており、複数のケーブルを介して差動伝送方式でデジタル通信される、請求項1から4のいずれかに記載の流体制御装置。
- 前記第2のプロセッサは、外部装置からの情報信号を受け取るように構成されており、前記外部制御モジュールと前記外部装置との通信はEtherCATによって行われ、前記外部制御モジュールにはRJ45コネクタが設けられている、請求項1から5のいずれかに記載の流体制御装置。
- 前記流体制御モジュールにはメモリが設けられており、前記メモリには前記流体制御モジュールに関連付けられた個体情報が格納されており、前記第2のプロセッサは、前記個体情報を読み出し可能である、請求項1から6のいずれかに記載の流体制御装置。
- 前記流体測定器は、流量センサ、または、圧力センサである、請求項1から7のいずれかに記載の流体制御装置。
- 前記流体測定器は、前記流路上に設けられた絞り部と、前記絞り部の上流側かつ前記制御バルブの下流側に設けられた第1圧力センサと、前記絞り部の下流側に設けられた第2圧力センサとを含む、請求項1から8のいずれかに記載の流体制御装置。
- 前記流体制御モジュールは、前記制御バルブと前記絞り部との間のガス温度を測定するための温度センサをさらに備える、請求項9に記載の流体制御装置。
- 前記流体制御モジュールは、前記絞り部としてのオリフィス部材を含むオリフィス内蔵弁と、前記オリフィス内蔵弁に接続された電磁弁および前記電磁弁の駆動回路とを含み、前記外部制御モジュールは、前記電磁弁の開閉を制御する信号を前記第1のプロセッサを介さずに直接的に前記電磁弁の駆動回路に出力する、請求項9または10に記載の流体制御装置。
- 1つの共通ガス供給ラインと、前記1つの共通ガス供給ラインに対して並列に配置された複数のガス供給ラインとを備え、前記複数のガス供給ラインのそれぞれに、請求項1から11のいずれかに記載の流体制御装置が、前記流体制御モジュールと前記外部制御モジュールとが1対1の関係をなすようにして設けられている、流体制御システム。
- 第1のプロセッサを有する流体制御モジュールと、第2のプロセッサを有する外部制御モジュールとを備える流体制御装置の制御方法であって、
前記流体制御モジュールに設けられた流量測定器から、流量の信号を出力するステップと、
前記流量測定器から出力された流量の信号を、前記第1のプロセッサを介して前記第2のプロセッサに出力するステップと、
前記出力された流量の信号に基づいて第2のプロセッサがバルブ制御信号を出力するステップと、
前記出力されたバルブ制御信号を前記第1のプロセッサを介さずに前記流体制御モジュールに配置されたバルブ駆動回路に出力するステップと、
前記バルブ制御信号に基づいて、前記バルブ駆動回路が駆動電圧を出力し、流路上に設置された制御バルブを駆動するステップと、を含む、流体制御装置の制御方法。
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CN112593216B (zh) * | 2020-11-24 | 2022-09-16 | 北京北方华创微电子装备有限公司 | 一种气体传输管路升温方法、半导体工艺设备 |
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