WO2017183450A1 - Structure de circuit, et boîtier de connexion électrique - Google Patents

Structure de circuit, et boîtier de connexion électrique Download PDF

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Publication number
WO2017183450A1
WO2017183450A1 PCT/JP2017/014185 JP2017014185W WO2017183450A1 WO 2017183450 A1 WO2017183450 A1 WO 2017183450A1 JP 2017014185 W JP2017014185 W JP 2017014185W WO 2017183450 A1 WO2017183450 A1 WO 2017183450A1
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WO
WIPO (PCT)
Prior art keywords
plate
bypass
insulating plate
bus bar
circuit structure
Prior art date
Application number
PCT/JP2017/014185
Other languages
English (en)
Japanese (ja)
Inventor
北　幸功
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2017183450A1 publication Critical patent/WO2017183450A1/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses

Definitions

  • the technology disclosed in this specification relates to a circuit structure and an electrical junction box.
  • circuit structure one described in JP-A-2003-164039 is known.
  • a plurality of bus bars are bonded to one surface of a circuit board.
  • the plurality of bus bars are arranged on the same surface along one surface of the circuit board. For this reason, when a structure (electronic parts, other bus bars, protrusions, etc.) provided on the circuit board is located in the wiring surface where the bus bar is routed, the bus bar is bypassed around the structure. Need to be routed.
  • the technology disclosed in the present specification has been completed based on the above circumstances, and aims to improve the degree of freedom in circuit design.
  • the technology disclosed in the present specification is a circuit structure, and includes an insulating plate having a first surface and a second surface, a bus bar disposed on the first surface of the insulating plate, and the insulating plate.
  • a bypass bus bar having a plurality of in-plate arrangement portions disposed on the first surface and having a bypass portion that protrudes outward from a side edge of the insulating plate and connects the plurality of in-plate arrangement portions. .
  • the plurality of in-plate arrangement portions can be connected by detouring from the outside of the insulating plate by the bypass portion.
  • a plurality of in-plate arrangement portions can be connected to each other by a bypass portion, so that circuit design freedom is achieved. The degree can be improved.
  • bypass portion bypasses at least one of the bus bar and the plurality of in-plate arrangement portions.
  • the degree of freedom in routing can be improved as compared with the case where the bus bar is routed only within the first surface of the insulating plate.
  • bypass portion has an intersecting portion arranged to intersect with the plate surface of the insulating plate.
  • the intersecting portion is arranged in a posture intersecting with the plate surface of the insulating plate, the wiring area of the bypass portion when viewed from the direction perpendicular to the plate surface of the insulating plate is reduced. Can be small.
  • an electronic component is disposed on the second surface side of the insulating plate.
  • the electronic component can be disposed on the second surface side of the insulating plate, the wiring density of the circuit configuration body can be improved.
  • the technology described in the present specification is an electrical junction box including the above-described circuit configuration body and a case that accommodates the circuit configuration body.
  • the degree of freedom in circuit design can be improved in the electrical junction box.
  • the bypass part has an intersecting part arranged to intersect with the plate surface of the insulating plate, and the case has an accommodating part for accommodating the intersecting part.
  • the case has a metal heat sink, and the housing portion is provided on the heat sink.
  • the degree of freedom in circuit design can be improved.
  • An electric junction box 10 includes a power source (not shown) such as a battery of a vehicle (not shown), a load (not shown) made of on-vehicle electrical components (not shown) such as a lamp and a wiper, and a motor. Is arranged in the power supply path between.
  • the X direction is set to the right
  • the Y direction is set to the front
  • the Z direction is set to the upper side.
  • symbol may be attached
  • the electrical junction box 10 is configured by housing a circuit structure 12 in a case 11.
  • the case 11 includes a heat sink 13 and a cover 14 attached above the heat sink 13.
  • the heat sink 13 is made of metal such as aluminum or aluminum alloy.
  • the heat sink 13 can be formed into a predetermined shape by an arbitrary method such as die casting or extrusion molding.
  • the heat sink 13 includes a plate-like substrate portion 15 and a plurality of fins 16 protruding downward from the lower surface of the substrate portion 15.
  • the fins 16 have a plate shape that protrudes downward from the lower surface of the substrate portion 15 and extends in the front-rear direction.
  • the plurality of fins 16 are provided side by side with a space in the left-right direction.
  • the shape of the fin 16 is not limited to the above, and includes a shape that protrudes downward from the lower surface of the substrate portion 15 into a hemispherical shape, a semicircular shape, or the like, and an arbitrary shape is appropriately selected as necessary. can do.
  • the upper surface of the substrate portion 15 on the heat sink 13 includes a bus bar 17, an in-plate arrangement portion 19 of the first bypass bus bar 18 ⁇ / b> A, an in-plate arrangement portion 19 of the second bypass bus bar 18 ⁇ / b> B, and an insulating first adhesive layer 20. Is glued through.
  • the cover 14 is attached to the upper surface of the substrate portion 15 of the heat sink 13.
  • the cover 14 may be made of metal or may be made of an insulating synthetic resin. When the cover 14 is made of metal, the circuit component 12 can be electromagnetically shielded by the heat sink 13 and the cover 14.
  • circuit structure 12 As shown in FIGS. 2 and 3, the circuit structure 12 includes an insulating plate 21 and a bus bar 17 disposed on the lower surface 22 (first surface) of the insulating plate 21.
  • a conductive path (not shown) is formed on the upper surface 23 (second surface) of the insulating plate 21 by a printed wiring technique.
  • the insulating plate 21 is formed with a plurality of through holes 24.
  • the bus bar 17 arranged on the lower surface 22 of the insulating plate 21 is exposed from the through hole 24.
  • An electronic component 25 is disposed in the through hole 24, and the electronic component 25 is electrically connected to the bus bar 17 exposed in the through hole 24.
  • an arbitrary electronic component 25 such as a FET (Field Effect Transistor), a coil, a capacitor, or the like can be appropriately selected as necessary.
  • the electronic component 25 and the bus bar 17 are connected by known soldering.
  • the electronic component 25 may be electrically connected to a conductive path formed on the upper surface 23 of the insulating plate 21.
  • the electronic component 25 and the conductive path are connected by known soldering.
  • the bus bar 17 is formed by pressing a metal plate material into a predetermined shape.
  • a metal which comprises the bus-bar 17 arbitrary metals, such as copper, copper alloy, aluminum, aluminum alloy, can be selected suitably as needed.
  • a plating layer may be formed on the surface of the bus bar 17.
  • any metal such as tin, nickel, zinc and the like can be selected as appropriate.
  • the insulating plate 21 and the bus bar 17 are bonded via an insulating second adhesive layer 26.
  • a plurality of bus bars 17 are disposed on the lower surface 22 of the insulating plate 21.
  • the plurality of bus bars 17 constitute a power circuit through which a relatively large current supplied from the power source flows.
  • the plurality of bus bars 17 are insulated from each other by being spaced apart from each other.
  • the second adhesive layer 26 may not have insulating properties.
  • bypass bus bar 18 As shown in FIG. 2, a bypass bus bar 18 is disposed on the lower surface 22 of the insulating plate 21.
  • the bypass bus bar 18 is formed by pressing a metal plate material into a predetermined shape.
  • a metal constituting the bypass bus bar 18 any metal such as copper, copper alloy, aluminum, aluminum alloy or the like can be appropriately selected as necessary.
  • a plating layer may be formed on the surface of the bypass bus bar 18.
  • any metal such as tin, nickel, zinc and the like can be selected as appropriate.
  • the bypass bus bar 18 has a plurality of in-plate arrangement portions 19 arranged in the plate surface of the insulating plate 21 and a bypass portion 27 protruding from the side edge of the insulating plate 21.
  • the in-plate arrangement portion 19 is bonded to the lower surface 22 of the insulating plate 21 via an insulating second adhesive layer 26.
  • the electronic component 25 may be connected to the in-plate arrangement portion 19 exposed from the through hole 24 of the insulating plate 21.
  • the plurality of in-plate arrangement portions 19 are connected by a bypass portion 27.
  • the bypass portion 27 protrudes outward from the side edge of the insulating plate 21.
  • the first bypass portion 27 ⁇ / b> A of the bypass portion 27 protrudes forward from the front edge of the insulating plate 21.
  • the second bypass portion 27 ⁇ / b> B of the bypass portion 27 protrudes leftward from the left edge of the insulating plate 21.
  • the bypass bus bar 18 includes a first bypass bus bar 18A having a first bypass part 27A and a second bypass bus bar 18B having a second bypass part 27B.
  • first bypass bus bar 18 ⁇ / b> A and the second bypass bus bar 18 ⁇ / b> B it may be collectively described as the bypass bus bar 18.
  • the first bypass portion 27A includes an in-plate arrangement portion 19A located on the right side and an in-plate arrangement portion located on the left side of the lower surface 22 of the insulating plate 21 in the first bypass bus bar 18A. 19B is connected. Three bus bars 17 are arranged between the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side.
  • the first bypass portion 27A bypasses the three bus bars 17 and electrically connects the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side.
  • the first bypass portion 27A has a first intersecting portion 28A (intersecting portion).
  • the plate surface of the first intersecting portion 28 ⁇ / b> A intersects the plate surface of the insulating plate 21.
  • the plate surface of the first intersecting portion 28 ⁇ / b> A is substantially orthogonal to the plate surface of the insulating plate 21.
  • “Substantially orthogonal” includes the case where the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal.
  • the first intersecting portion 28A extends upward.
  • the protruding height dimension of the first intersecting portion 28 ⁇ / b> A from the upper surface 23 of the insulating plate 21 is upward of the electronic component 25 disposed on the upper surface 23 of the insulating plate 21.
  • the protrusion height dimension is the largest but smaller than the protrusion height dimension.
  • the second bypass portion 27 ⁇ / b> B includes an in-plate arrangement portion 19 ⁇ / b> C located on the rear side and an in-plate arrangement located on the front side of the lower surface 22 of the insulating plate 21 in the second bypass bus bar 18 ⁇ / b> B.
  • the part 19D is connected.
  • Three bus bars 17 and one in-plate arrangement portion 19B are arranged between the in-plate arrangement portion 19C located on the rear side and the in-plate arrangement portion 19D located on the front side.
  • the in-plate arrangement portion 19B is an in-plate arrangement portion 19B located on the left side of the first bypass bus bar 18A.
  • the second bypass portion 27B bypasses these three bus bars 17 and one in-plate arrangement portion 19B, and the in-plate arrangement portion 19C located on the rear side, and the in-plate arrangement portion 19D located on the front side. Are electrically connected.
  • the second bypass unit 27B has a second intersection 28B (intersection).
  • the plate surface of the second intersecting portion 28 ⁇ / b> B intersects the plate surface of the insulating plate 21.
  • the plate surface of the second intersecting portion 28 ⁇ / b> B is substantially orthogonal to the plate surface of the insulating plate 21.
  • “Substantially orthogonal” includes the case where the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal.
  • the second intersecting portion 28B is formed extending downward.
  • the substrate portion 15 of the heat sink 13 has a housing portion 29 that is depressed downward and that houses the second intersecting portion 28B at a position corresponding to the second intersecting portion 28B.
  • a gap is formed between the second intersecting portion 28 ⁇ / b> B and the inner wall of the accommodating portion 29.
  • the 2nd crossing part 28B and storage part 29 are electrically insulated.
  • the circuit component 12 includes the insulating plate 21 having the upper surface 23 and the lower surface 22, the bus bar 17 disposed on the lower surface 22 of the insulating plate 21, and a plurality of disposed on the lower surface 22 of the insulating plate 21. And a bypass bus bar 18 having a bypass portion 27 that protrudes outward from the side edge of the insulating plate 21 and connects between the plurality of in-plate arrangement portions 19.
  • the plurality of in-plate arrangement portions 19 can be connected by detouring from the outside of the insulating plate 21 by the bypass portion 27. Thereby, even when it is difficult to connect the plurality of in-plate arrangement portions 19 within the first surface of the insulating plate 21, the plurality of in-plate arrangement portions 19 can be connected to each other by the bypass portion 27.
  • the degree of freedom in circuit design can be improved.
  • bypass portion 27 bypasses at least one of the bus bar 17 and the plurality of in-plate arrangement portions 19.
  • the degree of freedom of routing can be improved as compared with the case where the bus bar 17 is routed only within the first surface of the insulating plate 21.
  • the bypass portion 27 includes the first intersecting portion 28A and the second intersecting portion 28B arranged to intersect with the plate surface of the insulating plate 21.
  • the first intersecting portion 28A and the second intersecting portion 28B are arranged in a posture intersecting with the plate surface of the insulating plate 21, so that the direction is perpendicular to the plate surface of the insulating plate 21.
  • the wiring area of the bypass portion 27 can be reduced.
  • the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21.
  • the electronic component 25 can be disposed on the upper surface 23 side of the insulating plate 21, the wiring density of the circuit component 12 can be improved.
  • the electrical junction box 10 includes a circuit configuration body 12 and a case 11 that houses the circuit configuration body 12.
  • the degree of freedom in circuit design can be improved in the electrical junction box 10.
  • the second bypass portion 27B has the second intersecting portion 28B arranged so as to intersect with the plate surface of the insulating plate 21, and the heat sink 13 includes the second intersecting portion. It has the accommodating part 29 which accommodates 28B.
  • the conductive path is formed on the upper surface 23 of the insulating plate 21 by the printed wiring technique.
  • the present invention is not limited to this, and the conductive path is formed on the insulating plate 21 by the printed wiring technique. It is good also as a structure which is not performed.
  • the bypass portion 27 is configured to bypass the in-plate arrangement portion 19 of the bus bar 17 or the bypass bus bar 18, but is not limited thereto, and the bypass portion 27 is connected to the insulating plate 21. By-passing any formed structure (electronic parts, bolts, nuts, etc.) to connect the in-board arrangement parts 19 to each other, or by bypassing the electronic parts etc. arranged on the insulating plate 21 19 may be connected to each other.
  • the bypass portion 27 is configured to have the intersecting portions 28A and 28B.
  • the present invention is not limited to this, and the bypass portion 27 is disposed along the plate surface of the insulating plate 21 in parallel. It is good.
  • the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21.
  • the present invention is not limited to this, and the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21. It is good also as a structure which is not performed.
  • the housing portion 29 is provided in the heat sink 13.
  • the present invention is not limited thereto, and the housing portion is provided in an insulating member made of an insulating synthetic resin disposed in the case 11. It is good also as a structure. Thereby, since a crossing part can be insulated, it is good also as a structure which accommodates several crossing parts separately in a some accommodating part, and laminates
  • the number of bus bars bypassed by the bypass unit may be one, two, or four or more.
  • the number of in-plate arrangement parts that are bypassed by the bypass part may be two or more.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de circuit (12) comprenant : une carte d'isolation (21) qui comporte une surface supérieure (23) et une surface inférieure (22) ; des barres omnibus (17) qui sont disposées sur la surface inférieure (22) de la carte d'isolation (21) ; et des barres omnibus de dérivation (18) qui incluent une pluralité de parties montées dans la carte (19) disposées sur la surface inférieure (22) de la carte d'isolation (21), et qui incluent des parties de dérivation (27) se projetant vers l'extérieur depuis un bord latéral de la carte d'isolation (21) et interconnectant la pluralité de parties montées dans la carte (19).
PCT/JP2017/014185 2016-04-22 2017-04-05 Structure de circuit, et boîtier de connexion électrique WO2017183450A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016086056A JP2017195324A (ja) 2016-04-22 2016-04-22 回路構成体、及び電気接続箱
JP2016-086056 2016-04-22

Publications (1)

Publication Number Publication Date
WO2017183450A1 true WO2017183450A1 (fr) 2017-10-26

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Application Number Title Priority Date Filing Date
PCT/JP2017/014185 WO2017183450A1 (fr) 2016-04-22 2017-04-05 Structure de circuit, et boîtier de connexion électrique

Country Status (2)

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JP (1) JP2017195324A (fr)
WO (1) WO2017183450A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10243522A (ja) * 1997-02-21 1998-09-11 Yazaki Corp ブスバー配線板
JP2002093959A (ja) * 2000-09-20 2002-03-29 Fujitsu Ten Ltd 電子機器の放熱構造
JP2003164039A (ja) * 2001-11-26 2003-06-06 Auto Network Gijutsu Kenkyusho:Kk 回路構成体及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10243522A (ja) * 1997-02-21 1998-09-11 Yazaki Corp ブスバー配線板
JP2002093959A (ja) * 2000-09-20 2002-03-29 Fujitsu Ten Ltd 電子機器の放熱構造
JP2003164039A (ja) * 2001-11-26 2003-06-06 Auto Network Gijutsu Kenkyusho:Kk 回路構成体及びその製造方法

Also Published As

Publication number Publication date
JP2017195324A (ja) 2017-10-26

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