WO2017183450A1 - Circuit structure, and electrical connection box - Google Patents

Circuit structure, and electrical connection box Download PDF

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Publication number
WO2017183450A1
WO2017183450A1 PCT/JP2017/014185 JP2017014185W WO2017183450A1 WO 2017183450 A1 WO2017183450 A1 WO 2017183450A1 JP 2017014185 W JP2017014185 W JP 2017014185W WO 2017183450 A1 WO2017183450 A1 WO 2017183450A1
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WO
WIPO (PCT)
Prior art keywords
plate
bypass
insulating plate
bus bar
circuit structure
Prior art date
Application number
PCT/JP2017/014185
Other languages
French (fr)
Japanese (ja)
Inventor
北　幸功
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
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Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2017183450A1 publication Critical patent/WO2017183450A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses

Definitions

  • the technology disclosed in this specification relates to a circuit structure and an electrical junction box.
  • circuit structure one described in JP-A-2003-164039 is known.
  • a plurality of bus bars are bonded to one surface of a circuit board.
  • the plurality of bus bars are arranged on the same surface along one surface of the circuit board. For this reason, when a structure (electronic parts, other bus bars, protrusions, etc.) provided on the circuit board is located in the wiring surface where the bus bar is routed, the bus bar is bypassed around the structure. Need to be routed.
  • the technology disclosed in the present specification has been completed based on the above circumstances, and aims to improve the degree of freedom in circuit design.
  • the technology disclosed in the present specification is a circuit structure, and includes an insulating plate having a first surface and a second surface, a bus bar disposed on the first surface of the insulating plate, and the insulating plate.
  • a bypass bus bar having a plurality of in-plate arrangement portions disposed on the first surface and having a bypass portion that protrudes outward from a side edge of the insulating plate and connects the plurality of in-plate arrangement portions. .
  • the plurality of in-plate arrangement portions can be connected by detouring from the outside of the insulating plate by the bypass portion.
  • a plurality of in-plate arrangement portions can be connected to each other by a bypass portion, so that circuit design freedom is achieved. The degree can be improved.
  • bypass portion bypasses at least one of the bus bar and the plurality of in-plate arrangement portions.
  • the degree of freedom in routing can be improved as compared with the case where the bus bar is routed only within the first surface of the insulating plate.
  • bypass portion has an intersecting portion arranged to intersect with the plate surface of the insulating plate.
  • the intersecting portion is arranged in a posture intersecting with the plate surface of the insulating plate, the wiring area of the bypass portion when viewed from the direction perpendicular to the plate surface of the insulating plate is reduced. Can be small.
  • an electronic component is disposed on the second surface side of the insulating plate.
  • the electronic component can be disposed on the second surface side of the insulating plate, the wiring density of the circuit configuration body can be improved.
  • the technology described in the present specification is an electrical junction box including the above-described circuit configuration body and a case that accommodates the circuit configuration body.
  • the degree of freedom in circuit design can be improved in the electrical junction box.
  • the bypass part has an intersecting part arranged to intersect with the plate surface of the insulating plate, and the case has an accommodating part for accommodating the intersecting part.
  • the case has a metal heat sink, and the housing portion is provided on the heat sink.
  • the degree of freedom in circuit design can be improved.
  • An electric junction box 10 includes a power source (not shown) such as a battery of a vehicle (not shown), a load (not shown) made of on-vehicle electrical components (not shown) such as a lamp and a wiper, and a motor. Is arranged in the power supply path between.
  • the X direction is set to the right
  • the Y direction is set to the front
  • the Z direction is set to the upper side.
  • symbol may be attached
  • the electrical junction box 10 is configured by housing a circuit structure 12 in a case 11.
  • the case 11 includes a heat sink 13 and a cover 14 attached above the heat sink 13.
  • the heat sink 13 is made of metal such as aluminum or aluminum alloy.
  • the heat sink 13 can be formed into a predetermined shape by an arbitrary method such as die casting or extrusion molding.
  • the heat sink 13 includes a plate-like substrate portion 15 and a plurality of fins 16 protruding downward from the lower surface of the substrate portion 15.
  • the fins 16 have a plate shape that protrudes downward from the lower surface of the substrate portion 15 and extends in the front-rear direction.
  • the plurality of fins 16 are provided side by side with a space in the left-right direction.
  • the shape of the fin 16 is not limited to the above, and includes a shape that protrudes downward from the lower surface of the substrate portion 15 into a hemispherical shape, a semicircular shape, or the like, and an arbitrary shape is appropriately selected as necessary. can do.
  • the upper surface of the substrate portion 15 on the heat sink 13 includes a bus bar 17, an in-plate arrangement portion 19 of the first bypass bus bar 18 ⁇ / b> A, an in-plate arrangement portion 19 of the second bypass bus bar 18 ⁇ / b> B, and an insulating first adhesive layer 20. Is glued through.
  • the cover 14 is attached to the upper surface of the substrate portion 15 of the heat sink 13.
  • the cover 14 may be made of metal or may be made of an insulating synthetic resin. When the cover 14 is made of metal, the circuit component 12 can be electromagnetically shielded by the heat sink 13 and the cover 14.
  • circuit structure 12 As shown in FIGS. 2 and 3, the circuit structure 12 includes an insulating plate 21 and a bus bar 17 disposed on the lower surface 22 (first surface) of the insulating plate 21.
  • a conductive path (not shown) is formed on the upper surface 23 (second surface) of the insulating plate 21 by a printed wiring technique.
  • the insulating plate 21 is formed with a plurality of through holes 24.
  • the bus bar 17 arranged on the lower surface 22 of the insulating plate 21 is exposed from the through hole 24.
  • An electronic component 25 is disposed in the through hole 24, and the electronic component 25 is electrically connected to the bus bar 17 exposed in the through hole 24.
  • an arbitrary electronic component 25 such as a FET (Field Effect Transistor), a coil, a capacitor, or the like can be appropriately selected as necessary.
  • the electronic component 25 and the bus bar 17 are connected by known soldering.
  • the electronic component 25 may be electrically connected to a conductive path formed on the upper surface 23 of the insulating plate 21.
  • the electronic component 25 and the conductive path are connected by known soldering.
  • the bus bar 17 is formed by pressing a metal plate material into a predetermined shape.
  • a metal which comprises the bus-bar 17 arbitrary metals, such as copper, copper alloy, aluminum, aluminum alloy, can be selected suitably as needed.
  • a plating layer may be formed on the surface of the bus bar 17.
  • any metal such as tin, nickel, zinc and the like can be selected as appropriate.
  • the insulating plate 21 and the bus bar 17 are bonded via an insulating second adhesive layer 26.
  • a plurality of bus bars 17 are disposed on the lower surface 22 of the insulating plate 21.
  • the plurality of bus bars 17 constitute a power circuit through which a relatively large current supplied from the power source flows.
  • the plurality of bus bars 17 are insulated from each other by being spaced apart from each other.
  • the second adhesive layer 26 may not have insulating properties.
  • bypass bus bar 18 As shown in FIG. 2, a bypass bus bar 18 is disposed on the lower surface 22 of the insulating plate 21.
  • the bypass bus bar 18 is formed by pressing a metal plate material into a predetermined shape.
  • a metal constituting the bypass bus bar 18 any metal such as copper, copper alloy, aluminum, aluminum alloy or the like can be appropriately selected as necessary.
  • a plating layer may be formed on the surface of the bypass bus bar 18.
  • any metal such as tin, nickel, zinc and the like can be selected as appropriate.
  • the bypass bus bar 18 has a plurality of in-plate arrangement portions 19 arranged in the plate surface of the insulating plate 21 and a bypass portion 27 protruding from the side edge of the insulating plate 21.
  • the in-plate arrangement portion 19 is bonded to the lower surface 22 of the insulating plate 21 via an insulating second adhesive layer 26.
  • the electronic component 25 may be connected to the in-plate arrangement portion 19 exposed from the through hole 24 of the insulating plate 21.
  • the plurality of in-plate arrangement portions 19 are connected by a bypass portion 27.
  • the bypass portion 27 protrudes outward from the side edge of the insulating plate 21.
  • the first bypass portion 27 ⁇ / b> A of the bypass portion 27 protrudes forward from the front edge of the insulating plate 21.
  • the second bypass portion 27 ⁇ / b> B of the bypass portion 27 protrudes leftward from the left edge of the insulating plate 21.
  • the bypass bus bar 18 includes a first bypass bus bar 18A having a first bypass part 27A and a second bypass bus bar 18B having a second bypass part 27B.
  • first bypass bus bar 18 ⁇ / b> A and the second bypass bus bar 18 ⁇ / b> B it may be collectively described as the bypass bus bar 18.
  • the first bypass portion 27A includes an in-plate arrangement portion 19A located on the right side and an in-plate arrangement portion located on the left side of the lower surface 22 of the insulating plate 21 in the first bypass bus bar 18A. 19B is connected. Three bus bars 17 are arranged between the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side.
  • the first bypass portion 27A bypasses the three bus bars 17 and electrically connects the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side.
  • the first bypass portion 27A has a first intersecting portion 28A (intersecting portion).
  • the plate surface of the first intersecting portion 28 ⁇ / b> A intersects the plate surface of the insulating plate 21.
  • the plate surface of the first intersecting portion 28 ⁇ / b> A is substantially orthogonal to the plate surface of the insulating plate 21.
  • “Substantially orthogonal” includes the case where the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal.
  • the first intersecting portion 28A extends upward.
  • the protruding height dimension of the first intersecting portion 28 ⁇ / b> A from the upper surface 23 of the insulating plate 21 is upward of the electronic component 25 disposed on the upper surface 23 of the insulating plate 21.
  • the protrusion height dimension is the largest but smaller than the protrusion height dimension.
  • the second bypass portion 27 ⁇ / b> B includes an in-plate arrangement portion 19 ⁇ / b> C located on the rear side and an in-plate arrangement located on the front side of the lower surface 22 of the insulating plate 21 in the second bypass bus bar 18 ⁇ / b> B.
  • the part 19D is connected.
  • Three bus bars 17 and one in-plate arrangement portion 19B are arranged between the in-plate arrangement portion 19C located on the rear side and the in-plate arrangement portion 19D located on the front side.
  • the in-plate arrangement portion 19B is an in-plate arrangement portion 19B located on the left side of the first bypass bus bar 18A.
  • the second bypass portion 27B bypasses these three bus bars 17 and one in-plate arrangement portion 19B, and the in-plate arrangement portion 19C located on the rear side, and the in-plate arrangement portion 19D located on the front side. Are electrically connected.
  • the second bypass unit 27B has a second intersection 28B (intersection).
  • the plate surface of the second intersecting portion 28 ⁇ / b> B intersects the plate surface of the insulating plate 21.
  • the plate surface of the second intersecting portion 28 ⁇ / b> B is substantially orthogonal to the plate surface of the insulating plate 21.
  • “Substantially orthogonal” includes the case where the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal.
  • the second intersecting portion 28B is formed extending downward.
  • the substrate portion 15 of the heat sink 13 has a housing portion 29 that is depressed downward and that houses the second intersecting portion 28B at a position corresponding to the second intersecting portion 28B.
  • a gap is formed between the second intersecting portion 28 ⁇ / b> B and the inner wall of the accommodating portion 29.
  • the 2nd crossing part 28B and storage part 29 are electrically insulated.
  • the circuit component 12 includes the insulating plate 21 having the upper surface 23 and the lower surface 22, the bus bar 17 disposed on the lower surface 22 of the insulating plate 21, and a plurality of disposed on the lower surface 22 of the insulating plate 21. And a bypass bus bar 18 having a bypass portion 27 that protrudes outward from the side edge of the insulating plate 21 and connects between the plurality of in-plate arrangement portions 19.
  • the plurality of in-plate arrangement portions 19 can be connected by detouring from the outside of the insulating plate 21 by the bypass portion 27. Thereby, even when it is difficult to connect the plurality of in-plate arrangement portions 19 within the first surface of the insulating plate 21, the plurality of in-plate arrangement portions 19 can be connected to each other by the bypass portion 27.
  • the degree of freedom in circuit design can be improved.
  • bypass portion 27 bypasses at least one of the bus bar 17 and the plurality of in-plate arrangement portions 19.
  • the degree of freedom of routing can be improved as compared with the case where the bus bar 17 is routed only within the first surface of the insulating plate 21.
  • the bypass portion 27 includes the first intersecting portion 28A and the second intersecting portion 28B arranged to intersect with the plate surface of the insulating plate 21.
  • the first intersecting portion 28A and the second intersecting portion 28B are arranged in a posture intersecting with the plate surface of the insulating plate 21, so that the direction is perpendicular to the plate surface of the insulating plate 21.
  • the wiring area of the bypass portion 27 can be reduced.
  • the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21.
  • the electronic component 25 can be disposed on the upper surface 23 side of the insulating plate 21, the wiring density of the circuit component 12 can be improved.
  • the electrical junction box 10 includes a circuit configuration body 12 and a case 11 that houses the circuit configuration body 12.
  • the degree of freedom in circuit design can be improved in the electrical junction box 10.
  • the second bypass portion 27B has the second intersecting portion 28B arranged so as to intersect with the plate surface of the insulating plate 21, and the heat sink 13 includes the second intersecting portion. It has the accommodating part 29 which accommodates 28B.
  • the conductive path is formed on the upper surface 23 of the insulating plate 21 by the printed wiring technique.
  • the present invention is not limited to this, and the conductive path is formed on the insulating plate 21 by the printed wiring technique. It is good also as a structure which is not performed.
  • the bypass portion 27 is configured to bypass the in-plate arrangement portion 19 of the bus bar 17 or the bypass bus bar 18, but is not limited thereto, and the bypass portion 27 is connected to the insulating plate 21. By-passing any formed structure (electronic parts, bolts, nuts, etc.) to connect the in-board arrangement parts 19 to each other, or by bypassing the electronic parts etc. arranged on the insulating plate 21 19 may be connected to each other.
  • the bypass portion 27 is configured to have the intersecting portions 28A and 28B.
  • the present invention is not limited to this, and the bypass portion 27 is disposed along the plate surface of the insulating plate 21 in parallel. It is good.
  • the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21.
  • the present invention is not limited to this, and the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21. It is good also as a structure which is not performed.
  • the housing portion 29 is provided in the heat sink 13.
  • the present invention is not limited thereto, and the housing portion is provided in an insulating member made of an insulating synthetic resin disposed in the case 11. It is good also as a structure. Thereby, since a crossing part can be insulated, it is good also as a structure which accommodates several crossing parts separately in a some accommodating part, and laminates
  • the number of bus bars bypassed by the bypass unit may be one, two, or four or more.
  • the number of in-plate arrangement parts that are bypassed by the bypass part may be two or more.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A circuit structure 12 comprising: an insulation board 21 that has an upper surface 23 and a lower surface 22; busbars 17 that are disposed on the lower surface 22 of the insulation board 21; and bypass busbars 18 that include a plurality of in-board mounted parts 19 disposed on the lower surface 22 of the insulation board 21, and that include bypass parts 27 projecting outward from a side edge of the insulation board 21 and interconnecting the plurality of in-board mounted parts 19.

Description

回路構成体、及び電気接続箱Circuit structure and electrical junction box
　本明細書に開示された技術は、回路構成体及び電気接続箱に関する。 The technology disclosed in this specification relates to a circuit structure and an electrical junction box.
　従来、回路構成体として、特開２００３－１６４０３９号公報に記載のものが知られている。この回路構成体は、回路基板の一方の面に複数のバスバーが接着されている。 Conventionally, as a circuit structure, one described in JP-A-2003-164039 is known. In this circuit structure, a plurality of bus bars are bonded to one surface of a circuit board.
特開２００３－１６４０３９号公報JP 2003-164039 A
　上記の構成においては、回路基板の一方の面に複数のバスバーが接着されているので、複数のバスバーは、回路基板の一方の面に沿って、同一面上に配されている。このため、このバスバーの配索された配索面内に、回路基板に設けられた構造物（電子部品、他のバスバー、突起等）が位置する場合に、この構造物を迂回してバスバーを配索する必要がある。 In the above configuration, since a plurality of bus bars are bonded to one surface of the circuit board, the plurality of bus bars are arranged on the same surface along one surface of the circuit board. For this reason, when a structure (electronic parts, other bus bars, protrusions, etc.) provided on the circuit board is located in the wiring surface where the bus bar is routed, the bus bar is bypassed around the structure. Need to be routed.
　しかし、回路基板の板面内に、構造物を迂回させるためのスペースを確保することができない場合がある。このような場合には、バスバーによって回路を構成することができなくなるので、回路設計の自由度が制約されるという問題がある。 However, there may be a case where it is not possible to secure a space for detouring the structure in the circuit board. In such a case, the circuit cannot be configured by the bus bar, and there is a problem that the degree of freedom in circuit design is restricted.
　本明細書に開示された技術は上記のような事情に基づいて完成されたものであって、回路設計の自由度を向上させることを目的とする。 The technology disclosed in the present specification has been completed based on the above circumstances, and aims to improve the degree of freedom in circuit design.
　本明細書に開示された技術は、回路構成体であって、第１面及び第２面を有する絶縁板と、前記絶縁板の前記第１面に配されたバスバーと、前記絶縁板の前記第１面に配された複数の板内配置部を有すると共に、前記絶縁板の側縁から外方に突出して前記複数の板内配置部間を接続するバイパス部を有するバイパスバスバーと、を備える。 The technology disclosed in the present specification is a circuit structure, and includes an insulating plate having a first surface and a second surface, a bus bar disposed on the first surface of the insulating plate, and the insulating plate. A bypass bus bar having a plurality of in-plate arrangement portions disposed on the first surface and having a bypass portion that protrudes outward from a side edge of the insulating plate and connects the plurality of in-plate arrangement portions. .
　上記の構成によれば、複数の板内配置部同士を、バイパス部によって、絶縁板の外側から迂回して接続することができる。これにより、絶縁板の第１面内で複数の板内配置部同士を接続することが困難な場合でも、複数の板内配置部同士をバイパス部によって接続することができるので、回路設計の自由度を向上させることができる。 According to the above configuration, the plurality of in-plate arrangement portions can be connected by detouring from the outside of the insulating plate by the bypass portion. As a result, even when it is difficult to connect a plurality of in-plate arrangement portions within the first surface of the insulating plate, a plurality of in-plate arrangement portions can be connected to each other by a bypass portion, so that circuit design freedom is achieved. The degree can be improved.
　本明細書に開示された技術の実施態様としては以下の態様が好ましい。 The following embodiments are preferred as embodiments of the technology disclosed in this specification.
　前記バイパス部は、前記バスバー、及び前記複数の板内配置部の、少なくとも一つを迂回するようになっていることが好ましい。 It is preferable that the bypass portion bypasses at least one of the bus bar and the plurality of in-plate arrangement portions.
　上記の構成によれば、バスバーを絶縁板の第１面内だけで配索する場合に比べて、配索の自由度を向上させることができる。 According to the above configuration, the degree of freedom in routing can be improved as compared with the case where the bus bar is routed only within the first surface of the insulating plate.
　前記バイパス部は、前記絶縁板の板面に対して交差して配された交差部を有することが好ましい。 It is preferable that the bypass portion has an intersecting portion arranged to intersect with the plate surface of the insulating plate.
　上記の構成によれば、交差部は、絶縁板の板面に対して交差した姿勢で配されているので、絶縁板の板面に垂直な方向から見た場合におけるバイパス部の配索面積を小さくすることができる。 According to the above configuration, since the intersecting portion is arranged in a posture intersecting with the plate surface of the insulating plate, the wiring area of the bypass portion when viewed from the direction perpendicular to the plate surface of the insulating plate is reduced. Can be small.
　前記絶縁板の前記第２面側には電子部品が配設されていることが好ましい。 It is preferable that an electronic component is disposed on the second surface side of the insulating plate.
　上記の構成によれば、絶縁板の第２面側に電子部品を配設することができるので、回路構成体の配線密度を向上させることができる。 According to the above configuration, since the electronic component can be disposed on the second surface side of the insulating plate, the wiring density of the circuit configuration body can be improved.
　また、本明細書に記載された技術は、上記の回路構成体と、前記回路構成体を収容するケースと、を備えた電気接続箱である。 Also, the technology described in the present specification is an electrical junction box including the above-described circuit configuration body and a case that accommodates the circuit configuration body.
　上記の構成によれば、電気接続箱において、回路設計の自由度を向上させることができる。 According to the above configuration, the degree of freedom in circuit design can be improved in the electrical junction box.
　本明細書に開示された技術の実施態様としては以下の態様が好ましい。 The following embodiments are preferred as embodiments of the technology disclosed in this specification.
　前記バイパス部は、前記絶縁板の板面に対して交差して配された交差部を有しており、前記ケースは、前記交差部を収容する収容部を有することが好ましい。 It is preferable that the bypass part has an intersecting part arranged to intersect with the plate surface of the insulating plate, and the case has an accommodating part for accommodating the intersecting part.
　上記の構成によれば、交差部とケースとが干渉することを抑制することができるので、バイパス部を立体的に配索することが容易になる。 According to the above configuration, it is possible to suppress the interference between the intersecting portion and the case, so that the bypass portion can be easily arranged three-dimensionally.
　前記ケースは金属製のヒートシンクを有し、前記収容部は前記ヒートシンクに設けられていることが好ましい。 It is preferable that the case has a metal heat sink, and the housing portion is provided on the heat sink.
　上記の構成によれば、ヒートシンクとバイパス部とが干渉することを抑制することができる。 According to the above configuration, interference between the heat sink and the bypass portion can be suppressed.
　本明細書に開示された技術によれば、回路設計の自由度を向上させることができる。 According to the technique disclosed in this specification, the degree of freedom in circuit design can be improved.
実施形態１に係る電気接続箱を示す一部切欠側面図Partially cutaway side view showing the electrical junction box according to Embodiment 1 回路構成体を示す一部切欠斜視図Partially cutaway perspective view showing a circuit structure 図１におけるＩＩＩ－ＩＩＩ線断面図III-III sectional view in FIG.
　＜実施形態１＞
　本明細書に開示された技術の実施形態１を、図１から図３を参照しつつ説明する。本発明に係る電気接続箱１０は、図示しない車両のバッテリ等の電源（図示せず）と、ランプ、ワイパー等の車載電装品（図示せず）やモータ等からなる負荷（図示せず）との間の電力供給路に配される。以下の説明では、Ｘ方向を右方とし、Ｙ方向を前方とし、Ｚ方向を上方として説明する。また、複数の同一部材については、一の部品に符号を付し、他の部品には符号を省略する場合がある。なお、上記の方向は説明の便宜のためのものであって、電気接続箱１０は、車両に対して、任意の姿勢で取り付けることができる。 <Embodiment 1>
Embodiment 1 of the technique disclosed in this specification will be described with reference to FIGS. 1 to 3. An electric junction box 10 according to the present invention includes a power source (not shown) such as a battery of a vehicle (not shown), a load (not shown) made of on-vehicle electrical components (not shown) such as a lamp and a wiper, and a motor. Is arranged in the power supply path between. In the following description, the X direction is set to the right, the Y direction is set to the front, and the Z direction is set to the upper side. Moreover, about several identical member, a code | symbol may be attached | subjected to one component and a code | symbol may be abbreviate | omitted to another component. Note that the above directions are provided for convenience of explanation, and the electrical junction box 10 can be attached to the vehicle in an arbitrary posture.
（電気接続箱１０）
　電気接続箱１０は、ケース１１内に回路構成体１２が収容されてなる。ケース１１は、ヒートシンク１３と、このヒートシンク１３の上方に取り付けられるカバー１４と、を備える。 (Electric junction box 10)
The electrical junction box 10 is configured by housing a circuit structure 12 in a case 11. The case 11 includes a heat sink 13 and a cover 14 attached above the heat sink 13.
　ヒートシンク１３は、アルミニウム、アルミニウム合金等の金属製である。ヒートシンク１３はダイキャスト、押出成型等、必要に応じて任意の方法により、所定の形状に形成することができる。 The heat sink 13 is made of metal such as aluminum or aluminum alloy. The heat sink 13 can be formed into a predetermined shape by an arbitrary method such as die casting or extrusion molding.
　ヒートシンク１３は、板状をなす基板部１５と、基板部１５の下面から下方に突出する複数のフィン１６と、を備える。フィン１６は、基板部１５の下面から下方に突出すると共に前後方向に延びる板状をなしている。複数のフィン１６は、左右方向に間隔を空けて並んで設けられている。なお、フィン１６の形状は上記のものに限られず、基板部１５の下面から下方に半球状、半円形状等の丸形状に突出する形状を含み、必要に応じて任意の形状を適宜に選択することができる。 The heat sink 13 includes a plate-like substrate portion 15 and a plurality of fins 16 protruding downward from the lower surface of the substrate portion 15. The fins 16 have a plate shape that protrudes downward from the lower surface of the substrate portion 15 and extends in the front-rear direction. The plurality of fins 16 are provided side by side with a space in the left-right direction. Note that the shape of the fin 16 is not limited to the above, and includes a shape that protrudes downward from the lower surface of the substrate portion 15 into a hemispherical shape, a semicircular shape, or the like, and an arbitrary shape is appropriately selected as necessary. can do.
　ヒートシンク１３に基板部１５の上面は、後述するバスバー１７、第１バイパスバスバー１８Ａの板内配置部１９、及び第２バイパスバスバー１８Ｂの板内配置部１９と、絶縁性の第１接着層２０を介して接着されている。 The upper surface of the substrate portion 15 on the heat sink 13 includes a bus bar 17, an in-plate arrangement portion 19 of the first bypass bus bar 18 </ b> A, an in-plate arrangement portion 19 of the second bypass bus bar 18 </ b> B, and an insulating first adhesive layer 20. Is glued through.
　カバー１４はヒートシンク１３の基板部１５の上面に取り付けられている。カバー１４は、金属製であってもよいし、また、絶縁性の合成樹脂製であってもよい。カバー１４が金属製である場合には、ヒートシンク１３とカバー１４とによって、回路構成体１２を電磁的にシールドすることができる。 The cover 14 is attached to the upper surface of the substrate portion 15 of the heat sink 13. The cover 14 may be made of metal or may be made of an insulating synthetic resin. When the cover 14 is made of metal, the circuit component 12 can be electromagnetically shielded by the heat sink 13 and the cover 14.
（回路構成体１２）
　図２及び図３に示すように、回路構成体１２は、絶縁板２１と、絶縁板２１の下面２２（第１面）に配されたバスバー１７と、を備える。 (Circuit structure 12)
As shown in FIGS. 2 and 3, the circuit structure 12 includes an insulating plate 21 and a bus bar 17 disposed on the lower surface 22 (first surface) of the insulating plate 21.
　絶縁板２１の上面２３（第２面）には、プリント配線技術により導電路（図示せず）が形成されている。また、絶縁板２１には、複数の貫通孔２４が形成されている。この貫通孔２４から、絶縁板２１の下面２２に配されたバスバー１７が露出している。貫通孔２４内には電子部品２５が配されており、この電子部品２５は貫通孔２４内に露出したバスバー１７に電気的に接続されている。電子部品２５としては、ＦＥＴ（Field Effect Transistor）、コイル、コンデンサ等、必要に応じて任意の電子部品２５を適宜に選択することができる。電子部品２５とバスバー１７とは、公知の半田付けにより接続されている。また、電子部品２５は、絶縁板２１の上面２３に形成された導電路に電気的に接続されていてもよい。電子部品２５と、導電路とは公知の半田付けにより接続されている。 A conductive path (not shown) is formed on the upper surface 23 (second surface) of the insulating plate 21 by a printed wiring technique. The insulating plate 21 is formed with a plurality of through holes 24. The bus bar 17 arranged on the lower surface 22 of the insulating plate 21 is exposed from the through hole 24. An electronic component 25 is disposed in the through hole 24, and the electronic component 25 is electrically connected to the bus bar 17 exposed in the through hole 24. As the electronic component 25, an arbitrary electronic component 25 such as a FET (Field Effect Transistor), a coil, a capacitor, or the like can be appropriately selected as necessary. The electronic component 25 and the bus bar 17 are connected by known soldering. Further, the electronic component 25 may be electrically connected to a conductive path formed on the upper surface 23 of the insulating plate 21. The electronic component 25 and the conductive path are connected by known soldering.
　バスバー１７は、金属板材を所定の形状にプレス加工してなる。バスバー１７を構成する金属としては、銅、銅合金、アルミニウム、アルミニウム合金等、必要に応じて任意の金属を適宜に選択できる。また、バスバー１７の表面には、メッキ層が形成されていてもよい。メッキ層を構成する金属としては、スズ、ニッケル、亜鉛等必要に応じて任意の金属を適宜に選択することができる。 The bus bar 17 is formed by pressing a metal plate material into a predetermined shape. As a metal which comprises the bus-bar 17, arbitrary metals, such as copper, copper alloy, aluminum, aluminum alloy, can be selected suitably as needed. A plating layer may be formed on the surface of the bus bar 17. As the metal constituting the plating layer, any metal such as tin, nickel, zinc and the like can be selected as appropriate.
　絶縁板２１と、バスバー１７とは、絶縁性の第２接着層２６を介して接着されている。本実施形態においては、複数のバスバー１７が、絶縁板２１の下面２２に配設されている。複数のバスバー１７により、電源から供給される比較的に大きな電流が流れる電力回路が構成されている。複数のバスバー１７同士は間隔を空けて配されることにより、互いに絶縁されている。なお、第２接着層２６としては、例えば、公知の両面テープを使用してもよい。また、第２接着層２６は、絶縁性を有しないものであってもよい。 The insulating plate 21 and the bus bar 17 are bonded via an insulating second adhesive layer 26. In the present embodiment, a plurality of bus bars 17 are disposed on the lower surface 22 of the insulating plate 21. The plurality of bus bars 17 constitute a power circuit through which a relatively large current supplied from the power source flows. The plurality of bus bars 17 are insulated from each other by being spaced apart from each other. In addition, as the 2nd contact bonding layer 26, you may use a well-known double-sided tape, for example. Further, the second adhesive layer 26 may not have insulating properties.
（バイパスバスバー１８）
　図２に示すように、絶縁板２１の下面２２には、バイパスバスバー１８が配されている。バイパスバスバー１８は、金属板材を所定の形状にプレス加工してなる。バイパスバスバー１８を構成する金属としては、銅、銅合金、アルミニウム、アルミニウム合金等、必要に応じて任意の金属を適宜に選択できる。また、バイパスバスバー１８の表面には、メッキ層が形成されていてもよい。メッキ層を構成する金属としては、スズ、ニッケル、亜鉛等必要に応じて任意の金属を適宜に選択することができる。 (Bypass bus bar 18)
As shown in FIG. 2, a bypass bus bar 18 is disposed on the lower surface 22 of the insulating plate 21. The bypass bus bar 18 is formed by pressing a metal plate material into a predetermined shape. As a metal constituting the bypass bus bar 18, any metal such as copper, copper alloy, aluminum, aluminum alloy or the like can be appropriately selected as necessary. Further, a plating layer may be formed on the surface of the bypass bus bar 18. As the metal constituting the plating layer, any metal such as tin, nickel, zinc and the like can be selected as appropriate.
　バイパスバスバー１８は、絶縁板２１の板面内に配された複数の板内配置部１９と、絶縁板２１の側縁から突出したバイパス部２７と、を有する。板内配置部１９は、絶縁板２１の下面２２と、絶縁性の第２接着層２６を介して接着されている。詳細には図示しないが、絶縁板２１の貫通孔２４から露出した板内配置部１９に、電子部品２５が接続されている構成としてもよい。 The bypass bus bar 18 has a plurality of in-plate arrangement portions 19 arranged in the plate surface of the insulating plate 21 and a bypass portion 27 protruding from the side edge of the insulating plate 21. The in-plate arrangement portion 19 is bonded to the lower surface 22 of the insulating plate 21 via an insulating second adhesive layer 26. Although not shown in detail, the electronic component 25 may be connected to the in-plate arrangement portion 19 exposed from the through hole 24 of the insulating plate 21.
　複数の板内配置部１９は、バイパス部２７によって接続されている。バイパス部２７は、絶縁板２１の側縁から外方に突出している。本実施形態においては、バイパス部２７のうち第１バイパス部２７Ａが絶縁板２１の前端縁から前方に突出している。また、バイパス部２７のうち第２バイパス部２７Ｂが、絶縁板２１の左端縁から左方に突出している。 The plurality of in-plate arrangement portions 19 are connected by a bypass portion 27. The bypass portion 27 protrudes outward from the side edge of the insulating plate 21. In the present embodiment, the first bypass portion 27 </ b> A of the bypass portion 27 protrudes forward from the front edge of the insulating plate 21. Further, the second bypass portion 27 </ b> B of the bypass portion 27 protrudes leftward from the left edge of the insulating plate 21.
　本実施形態においては、バイパスバスバー１８は、第１バイパス部２７Ａを有する第１バイパスバスバー１８Ａと、第２バイパス部２７Ｂを有する第２バイパスバスバー１８Ｂと、を含む。なお、以下の説明において、第１バイパスバスバー１８Ａと第２バイパスバスバー１８Ｂに共通の説明を行う場合には、バイパスバスバー１８としてまとめて説明する場合がある。 In the present embodiment, the bypass bus bar 18 includes a first bypass bus bar 18A having a first bypass part 27A and a second bypass bus bar 18B having a second bypass part 27B. In the following description, when a description common to the first bypass bus bar 18 </ b> A and the second bypass bus bar 18 </ b> B is given, it may be collectively described as the bypass bus bar 18.
（第１バイパス部２７Ａ）
　図２に示すように、第１バイパス部２７Ａは、第１バイパスバスバー１８Ａのうち、絶縁板２１の下面２２のうち、右側に位置する板内配置部１９Ａと、左側に位置する板内配置部１９Ｂとの間を接続している。右側に位置する板内配置部１９Ａと、左側に位置する板内配置部１９Ｂとの間には、３つのバスバー１７が配されている。第１バイパス部２７Ａは、これら３つのバスバー１７を迂回して、右側に位置する板内配置部１９Ａと、左側に位置する板内配置部１９Ｂとを電気的に接続している。 (First bypass section 27A)
As shown in FIG. 2, the first bypass portion 27A includes an in-plate arrangement portion 19A located on the right side and an in-plate arrangement portion located on the left side of the lower surface 22 of the insulating plate 21 in the first bypass bus bar 18A. 19B is connected. Three bus bars 17 are arranged between the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side. The first bypass portion 27A bypasses the three bus bars 17 and electrically connects the in-plate arrangement portion 19A located on the right side and the in-plate arrangement portion 19B located on the left side.
　図３に示すように、第１バイパス部２７Ａは、第１交差部２８Ａ（交差部）を有する。第１交差部２８Ａの板面は、絶縁板２１の板面に対して交差している。本実施形態においては、第１交差部２８Ａの板面は、絶縁板２１の板面に対して実質的に直交している。実質的に直交しているとは、第１交差部２８Ａの板面と絶縁板２１の板面とが直交する場合を含むと共に、第１交差部２８Ａの板面と絶縁板２１の板面とが直交しない場合であっても実質的に直交していると認められる場合も含む。本実施形態においては、第１交差部２８Ａは、上方に延びて形成されている。 As shown in FIG. 3, the first bypass portion 27A has a first intersecting portion 28A (intersecting portion). The plate surface of the first intersecting portion 28 </ b> A intersects the plate surface of the insulating plate 21. In the present embodiment, the plate surface of the first intersecting portion 28 </ b> A is substantially orthogonal to the plate surface of the insulating plate 21. “Substantially orthogonal” includes the case where the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the first intersecting portion 28A and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal. In the present embodiment, the first intersecting portion 28A extends upward.
　図１に示すように、第１交差部２８Ａの、絶縁板２１の上面２３からの上方への突出高さ寸法は、絶縁板２１の上面２３に配された電子部品２５のうち、上方への突出高さ寸法が最も大きいものの突出高さ寸法よりも、小さい。 As shown in FIG. 1, the protruding height dimension of the first intersecting portion 28 </ b> A from the upper surface 23 of the insulating plate 21 is upward of the electronic component 25 disposed on the upper surface 23 of the insulating plate 21. The protrusion height dimension is the largest but smaller than the protrusion height dimension.
（第２バイパス部２７Ｂ）
　図２に示すように、第２バイパス部２７Ｂは、第２バイパスバスバー１８Ｂのうち、絶縁板２１の下面２２のうち、後側に位置する板内配置部１９Ｃと、前側に位置する板内配置部１９Ｄとの間を接続している。後側に位置する板内配置部１９Ｃと、前側に位置する板内配置部１９Ｄとの間には、３つのバスバー１７と、１つの板内配置部１９Ｂと、が配されている。板内配置部１９Ｂは、第１バイパスバスバー１８Ａのうち左側に位置する板内配置部１９Ｂである。第２バイパス部２７Ｂは、これら３つのバスバー１７と、１つの板内配置部１９Ｂと、を迂回して、後側に位置する板内配置部１９Ｃと、前側に位置する板内配置部１９Ｄとを電気的に接続している。 (Second bypass part 27B)
As shown in FIG. 2, the second bypass portion 27 </ b> B includes an in-plate arrangement portion 19 </ b> C located on the rear side and an in-plate arrangement located on the front side of the lower surface 22 of the insulating plate 21 in the second bypass bus bar 18 </ b> B. The part 19D is connected. Three bus bars 17 and one in-plate arrangement portion 19B are arranged between the in-plate arrangement portion 19C located on the rear side and the in-plate arrangement portion 19D located on the front side. The in-plate arrangement portion 19B is an in-plate arrangement portion 19B located on the left side of the first bypass bus bar 18A. The second bypass portion 27B bypasses these three bus bars 17 and one in-plate arrangement portion 19B, and the in-plate arrangement portion 19C located on the rear side, and the in-plate arrangement portion 19D located on the front side. Are electrically connected.
　第２バイパス部２７Ｂは、第２交差部２８Ｂ（交差部）を有する。第２交差部２８Ｂの板面は、絶縁板２１の板面に対して交差している。本実施形態においては、第２交差部２８Ｂの板面は、絶縁板２１の板面に対して実質的に直交している。実質的に直交しているとは、第２交差部２８Ｂの板面と絶縁板２１の板面とが直交する場合を含むと共に、第２交差部２８Ｂの板面と絶縁板２１の板面とが直交しない場合であっても実質的に直交していると認められる場合も含む。本実施形態においては、第２交差部２８Ｂは、下方に延びて形成されている。 The second bypass unit 27B has a second intersection 28B (intersection). The plate surface of the second intersecting portion 28 </ b> B intersects the plate surface of the insulating plate 21. In the present embodiment, the plate surface of the second intersecting portion 28 </ b> B is substantially orthogonal to the plate surface of the insulating plate 21. “Substantially orthogonal” includes the case where the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 are orthogonal to each other, and the plate surface of the second intersecting portion 28B and the plate surface of the insulating plate 21 This includes the case where even if they are not orthogonal, it is recognized that they are substantially orthogonal. In the present embodiment, the second intersecting portion 28B is formed extending downward.
　図１に示すように、ヒートシンク１３の基板部１５には、第２交差部２８Ｂに対応する位置に、下方に陥没すると共に、第２交差部２８Ｂを収容する収容部２９を有する。第２交差部２８Ｂと、収容部２９の内壁との間には隙間が形成されている。これにより、第２交差部２８Ｂと、収容部２９とは電気的に絶縁されている。 As shown in FIG. 1, the substrate portion 15 of the heat sink 13 has a housing portion 29 that is depressed downward and that houses the second intersecting portion 28B at a position corresponding to the second intersecting portion 28B. A gap is formed between the second intersecting portion 28 </ b> B and the inner wall of the accommodating portion 29. Thereby, the 2nd crossing part 28B and storage part 29 are electrically insulated.
（実施形態の作用、効果）
　続いて、本実施形態の作用、効果について説明する。本実施形態によれば、回路構成体１２は、上面２３及び下面２２を有する絶縁板２１と、絶縁板２１の下面２２に配されたバスバー１７と、絶縁板２１の下面２２に配された複数の板内配置部１９を有すると共に、絶縁板２１の側縁から外方に突出して複数の板内配置部１９間を接続するバイパス部２７を有するバイパスバスバー１８と、備える。 (Operation and effect of the embodiment)
Then, the effect | action and effect of this embodiment are demonstrated. According to the present embodiment, the circuit component 12 includes the insulating plate 21 having the upper surface 23 and the lower surface 22, the bus bar 17 disposed on the lower surface 22 of the insulating plate 21, and a plurality of disposed on the lower surface 22 of the insulating plate 21. And a bypass bus bar 18 having a bypass portion 27 that protrudes outward from the side edge of the insulating plate 21 and connects between the plurality of in-plate arrangement portions 19.
　上記の構成によれば、複数の板内配置部１９同士を、バイパス部２７によって、絶縁板２１の外側から迂回して接続することができる。これにより、絶縁板２１の第１面内で複数の板内配置部１９同士を接続することが困難な場合でも、複数の板内配置部１９同士をバイパス部２７によって接続することができるので、回路設計の自由度を向上させることができる。 According to the above configuration, the plurality of in-plate arrangement portions 19 can be connected by detouring from the outside of the insulating plate 21 by the bypass portion 27. Thereby, even when it is difficult to connect the plurality of in-plate arrangement portions 19 within the first surface of the insulating plate 21, the plurality of in-plate arrangement portions 19 can be connected to each other by the bypass portion 27. The degree of freedom in circuit design can be improved.
　また、本実施形態によれば、バイパス部２７は、バスバー１７、及び複数の板内配置部１９の、少なくとも一つを迂回するようになっている。 Further, according to the present embodiment, the bypass portion 27 bypasses at least one of the bus bar 17 and the plurality of in-plate arrangement portions 19.
　上記の構成によれば、バスバー１７を絶縁板２１の第１面内だけで配索する場合に比べて、配索の自由度を向上させることができる。 According to the above configuration, the degree of freedom of routing can be improved as compared with the case where the bus bar 17 is routed only within the first surface of the insulating plate 21.
　また、本実施形態によれば、バイパス部２７は、絶縁板２１の板面に対して交差して配された第１交差部２８Ａ、及び第２交差部２８Ｂを有する。 Further, according to the present embodiment, the bypass portion 27 includes the first intersecting portion 28A and the second intersecting portion 28B arranged to intersect with the plate surface of the insulating plate 21.
　上記の構成によれば、第１交差部２８Ａ、及び第２交差部２８Ｂを、絶縁板２１の板面に対して交差した姿勢で配されているので、絶縁板２１の板面に垂直な方向から見た場合におけるバイパス部２７の配索面積を小さくすることができる。 According to the above configuration, the first intersecting portion 28A and the second intersecting portion 28B are arranged in a posture intersecting with the plate surface of the insulating plate 21, so that the direction is perpendicular to the plate surface of the insulating plate 21. As a result, the wiring area of the bypass portion 27 can be reduced.
　また、本実施形態によれば、絶縁板２１の上面２３側には電子部品２５が配設されている。 Moreover, according to the present embodiment, the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21.
　上記の構成によれば、絶縁板２１の上面２３側に電子部品２５を配設することができるので、回路構成体１２の配線密度を向上させることができる。 According to the above configuration, since the electronic component 25 can be disposed on the upper surface 23 side of the insulating plate 21, the wiring density of the circuit component 12 can be improved.
　また、本実施形態に係る電気接続箱１０は、回路構成体１２と、回路構成体１２を収容するケース１１と、を備える。 Moreover, the electrical junction box 10 according to the present embodiment includes a circuit configuration body 12 and a case 11 that houses the circuit configuration body 12.
　上記の構成によれば、電気接続箱１０において、回路設計の自由度を向上させることができる。 According to the above configuration, the degree of freedom in circuit design can be improved in the electrical junction box 10.
　また、本実施形態によれば、第２バイパス部２７Ｂは、絶縁板２１の板面に対して交差して配された第２交差部２８Ｂを有しており、ヒートシンク１３は、第２交差部２８Ｂを収容する収容部２９を有する。 In addition, according to the present embodiment, the second bypass portion 27B has the second intersecting portion 28B arranged so as to intersect with the plate surface of the insulating plate 21, and the heat sink 13 includes the second intersecting portion. It has the accommodating part 29 which accommodates 28B.
　上記の構成によれば、第２交差部２８Ｂとヒートシンク１３とが干渉することを抑制することができるので、第２バイパス部２７Ｂを立体的に配索することが容易になる。 According to the above configuration, it is possible to suppress the interference between the second intersecting portion 28B and the heat sink 13, so that the second bypass portion 27B can be easily arranged three-dimensionally.
　＜他の実施形態＞
　本明細書に開示された技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本明細書に開示された技術の技術的範囲に含まれる。 <Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and for example, the following embodiments are also included in the technical scope of the technology disclosed in the present specification.
（１）本実施形態においては、絶縁板２１の上面２３にはプリント配線技術により導電路が形成される構成としたが、これに限られず、絶縁板２１にはプリント配線技術による導電路が形成されない構成としてもよい。 (1) In the present embodiment, the conductive path is formed on the upper surface 23 of the insulating plate 21 by the printed wiring technique. However, the present invention is not limited to this, and the conductive path is formed on the insulating plate 21 by the printed wiring technique. It is good also as a structure which is not performed.
（２）本実施形態においては、バイパス部２７は、バスバー１７、又は、バイパスバスバー１８の板内配置部１９を迂回する構成としたが、これに限られず、バイパス部２７は、絶縁板２１に形成された任意の構造物（電子部品、ボルト、ナット等）を迂回して板内配置部１９同士を接続したり、絶縁板２１に配設された電子部品等を迂回して板内配置部１９同士を接続したりする構成としてもよい。 (2) In the present embodiment, the bypass portion 27 is configured to bypass the in-plate arrangement portion 19 of the bus bar 17 or the bypass bus bar 18, but is not limited thereto, and the bypass portion 27 is connected to the insulating plate 21. By-passing any formed structure (electronic parts, bolts, nuts, etc.) to connect the in-board arrangement parts 19 to each other, or by bypassing the electronic parts etc. arranged on the insulating plate 21 19 may be connected to each other.
（３）本実施形態においては、バイパス部２７は交差部２８Ａ、２８Ｂを有する構成としたが、これに限られず、バイパス部２７は、絶縁板２１の板面に平行に沿って配される構成としてもよい。 (3) In the present embodiment, the bypass portion 27 is configured to have the intersecting portions 28A and 28B. However, the present invention is not limited to this, and the bypass portion 27 is disposed along the plate surface of the insulating plate 21 in parallel. It is good.
（４）本実施形態においては、絶縁板２１の上面２３側には電子部品２５が配設される構成としたが、これに限られず、絶縁板２１の上面２３側に電子部品２５が配設されない構成としてもよい。 (4) In the present embodiment, the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21. However, the present invention is not limited to this, and the electronic component 25 is disposed on the upper surface 23 side of the insulating plate 21. It is good also as a structure which is not performed.
（５）本実施形態においては、ヒートシンク１３に収容部２９が設けられる構成としたが、これに限られず、ケース１１内に配された絶縁性の合成樹脂からなる絶縁部材に収容部が設けられる構成としてもよい。これにより、交差部を絶縁することができるので、複数の交差部を複数の収容部に個別に収容し、複数の交差部同士を絶縁した状態で積層する構成としてもよい。 (5) In the present embodiment, the housing portion 29 is provided in the heat sink 13. However, the present invention is not limited thereto, and the housing portion is provided in an insulating member made of an insulating synthetic resin disposed in the case 11. It is good also as a structure. Thereby, since a crossing part can be insulated, it is good also as a structure which accommodates several crossing parts separately in a some accommodating part, and laminates | stacks in the state which insulated the several crossing parts.
（６）バイパス部によって迂回されるバスバーの個数は、１つ、２つ、又は４つ以上であってもよい。 (6) The number of bus bars bypassed by the bypass unit may be one, two, or four or more.
（７）バイパス部によって迂回される板内配置部の個数は、２つ以上であってもよい。 (7) The number of in-plate arrangement parts that are bypassed by the bypass part may be two or more.
　１０：電気接続箱
　１１：ケース
　１２：回路構成体
　１３：ヒートシンク（ケース）
　１４：カバー（ケース）
　１７：バスバー
　１８：バイパスバスバー
　１８Ａ：第１バイパスバスバー（バイパスバスバー）
　１８Ｂ：第２バイパスバスバー（バイパスバスバー）
　１９：板内配置部
　２１：絶縁板
　２２：下面（第１面）
　２３：上面（第２面）
　２５：電子部品
　２７：バイパス部
　２７Ａ：第１バイパス部（バイパス部）
　２７Ｂ：第２バイパス部（バイパス部）
　２８Ａ：第１交差部（交差部）
　２８Ｂ：第２交差部（交差部）
　２９：収容部 10: Electrical junction box 11: Case 12: Circuit component 13: Heat sink (case)
14: Cover (case)
17: Bus bar 18: Bypass bus bar 18A: First bypass bus bar (bypass bus bar)
18B: Second bypass bus bar (bypass bus bar)
19: In-plate arrangement portion 21: Insulating plate 22: Lower surface (first surface)
23: Upper surface (second surface)
25: Electronic component 27: Bypass section 27A: First bypass section (bypass section)
27B: 2nd bypass part (bypass part)
28A: 1st intersection (intersection)
28B: Second intersection (intersection)
29: Containment section

Claims (7)

  1. 　第１面及び第２面を有する絶縁板と、
    　前記絶縁板の前記第１面に配されたバスバーと、
    　前記絶縁板の前記第１面に配された複数の板内配置部を有すると共に、前記絶縁板の側縁から外方に突出して前記複数の板内配置部間を接続するバイパス部を有するバイパスバスバーと、
    　を備えた、回路構成体。     An insulating plate having a first surface and a second surface;
    A bus bar disposed on the first surface of the insulating plate;
    A bypass having a plurality of in-plate arrangement portions disposed on the first surface of the insulating plate, and having a bypass portion protruding outward from a side edge of the insulating plate to connect the plurality of in-plate arrangement portions. A bus bar,
    A circuit structure comprising:
  2. 　前記バイパス部は、前記バスバー、及び前記複数の板内配置部の、少なくとも一つを迂回するようになっている、請求項１に記載の回路構成体。 2. The circuit structure according to claim 1, wherein the bypass section bypasses at least one of the bus bar and the plurality of in-plate arrangement sections.
  3. 　前記バイパス部は、前記絶縁板の板面に対して交差して配された交差部を有する、請求項１または請求項２に記載の回路構成体。 The circuit structure according to claim 1 or 2, wherein the bypass portion has an intersecting portion arranged to intersect with a plate surface of the insulating plate.
  4. 　前記絶縁板の前記第２面側には電子部品が配設されている、請求項１から請求項３のいずれか一項に記載の回路構成体。 The circuit component according to any one of claims 1 to 3, wherein an electronic component is disposed on the second surface side of the insulating plate.
  5. 　請求項１から請求項４のいずれか一項に記載の回路構成体と、
    　前記回路構成体を収容するケースと、を備えた電気接続箱。     The circuit structure according to any one of claims 1 to 4,
    An electrical junction box comprising: a case for housing the circuit structure.
  6. 　前記ケースは、前記交差部を収容する収容部を有する、請求項５に記載の電気接続箱。 The electrical connection box according to claim 5, wherein the case has a housing portion that houses the intersecting portion.
  7. 　前記ケースは金属製のヒートシンクを有し、前記収容部は前記ヒートシンクに設けられている、請求項６に記載の電気接続箱。 The electrical junction box according to claim 6, wherein the case has a metal heat sink, and the housing portion is provided on the heat sink.
PCT/JP2017/014185 2016-04-22 2017-04-05 Circuit structure, and electrical connection box WO2017183450A1 (en)

Applications Claiming Priority (2)

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JP2016086056A JP2017195324A (en) 2016-04-22 2016-04-22 Circuit structure and electrical junction box
JP2016-086056 2016-04-22

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10243522A (en) * 1997-02-21 1998-09-11 Yazaki Corp Bus bar wiring board
JP2002093959A (en) * 2000-09-20 2002-03-29 Fujitsu Ten Ltd Radiation structure of electronic apparatus
JP2003164039A (en) * 2001-11-26 2003-06-06 Auto Network Gijutsu Kenkyusho:Kk Circuit constituent and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10243522A (en) * 1997-02-21 1998-09-11 Yazaki Corp Bus bar wiring board
JP2002093959A (en) * 2000-09-20 2002-03-29 Fujitsu Ten Ltd Radiation structure of electronic apparatus
JP2003164039A (en) * 2001-11-26 2003-06-06 Auto Network Gijutsu Kenkyusho:Kk Circuit constituent and method for manufacturing the same

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