WO2017177848A1 - 显示模组及显示设备 - Google Patents

显示模组及显示设备 Download PDF

Info

Publication number
WO2017177848A1
WO2017177848A1 PCT/CN2017/079442 CN2017079442W WO2017177848A1 WO 2017177848 A1 WO2017177848 A1 WO 2017177848A1 CN 2017079442 W CN2017079442 W CN 2017079442W WO 2017177848 A1 WO2017177848 A1 WO 2017177848A1
Authority
WO
WIPO (PCT)
Prior art keywords
display module
chip
printed circuit
circuit board
heat
Prior art date
Application number
PCT/CN2017/079442
Other languages
English (en)
French (fr)
Inventor
王子锋
任妍
胡楠楠
曹磊
林涉
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/743,180 priority Critical patent/US10444557B2/en
Publication of WO2017177848A1 publication Critical patent/WO2017177848A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display module and a display device.
  • TFT-LCD Thin Film Transistor Liquid Crystal Display
  • FIG. 1 and 2 are respectively a schematic diagram of a heat dissipation structure of a chip of a display module of the prior art and an enlarged cross-sectional view of a portion of FIG.
  • a chip on film COF
  • COF chip on film
  • the back side of the backboard is bent (the backlight module and the cover plate shown below), the chip 4 is packaged on the flip chip 1 , and the cover plate fixed to the back side of the back panel of the backlight module is printed circuit
  • the board 3 and the chip 4 are covered and protected.
  • the prior art generally adopts a heat dissipation patch 5 for covering the chip 4 on the flip chip 1 , so that the chip 4 is attached to the flip chip 1 . Cool down.
  • a disadvantage of the prior art is that since the flip chip 1 and the heat dissipating patch 5 have a certain flexibility, when the heat dissipating patch 5 and the flip chip 1 are bonded, the flip chip 1 and the heat dissipating patch 5 need to be maintained.
  • the flattening (shown by the dashed line in Fig. 2) is extremely inconvenient to operate, especially for a large-sized display module, and the number of the flip chip 1 is generally up to several tens, making the operation cumbersome, time consuming and laborious.
  • the soldering film 5 is easily pulled between the two, which causes the flip chip 1 and the liquid crystal panel to be pulled. 2 or the printed circuit board 3 is in poor contact, and if the flip chip 1 and the heat dissipating patch 5 are not firmly bonded, a gap is formed between the two, and the heat dissipation effect is greatly reduced.
  • the heat dissipation structure of the chip is similar to that described above, and therefore, similar technical problems as described above exist.
  • the invention provides a display module and a display device, the purpose of which is to improve the convenience of assembly of the display module, improve the heat dissipation effect of the chip, and further improve the product quality of the display device.
  • Embodiments of the present invention provide a display module including a display panel, at least one flip chip, a printed circuit board, and a cover, wherein:
  • the printed circuit board is located on a back side of the display panel
  • One end of the flip chip is connected to the display panel, and the other end is bent toward the back side of the display panel and connected to the printed circuit board.
  • the portion of the flip chip that is bent toward the back side of the display panel is packaged with a chip;
  • the cover plate is located on the back side of the printed circuit board and covers the printed circuit board.
  • the position of each cover film corresponding to each of the flip chip is provided with a heat conducting block in thermal contact with the chip.
  • a position of each flip chip of the cover plate is disposed with a heat conducting block in thermal contact with the chip, and the heat conducting block can transfer heat of the chip and disperse heat of the chip to the cover plate.
  • the heat conducting block can transfer heat of the chip and disperse heat of the chip to the cover plate.
  • the heat conducting block is not bonded to the chip, the assembly of the display module can be simplified, and the line contact failure caused by disassembling the heat sink patch in the prior art can be avoided, thereby improving the product quality of the display device.
  • the heat conducting block is a thermal block.
  • the thermal block has a certain elasticity and can be tightly pressed into contact with the chip, thereby achieving better heat conduction and heat dissipation effect on the chip.
  • the position of the cover plate corresponding to each of the flip chip is provided with a notch, and the heat conducting block is interference fit in the notch.
  • the structural design facilitates assembly and disassembly of the heat conducting block and the cover plate, and is convenient for replacing the heat conducting block of a suitable material according to the heat dissipation requirement of the chip.
  • the heat conducting block comprises: a first limiting portion and a second limiting portion positioned on two sides of the cover plate, and a connecting portion with the notched interference fit.
  • the heat conducting block is inserted into the notch and the interference fit, the heat conducting block and the cover plate are conveniently assembled and positioned, and the heat conducting block is not easily detached from the upper and lower sides of the cover plate, so that the assembly of the heat conducting block and the notch is relatively firm.
  • the inlet of the notch has a pair of limiting projections.
  • the display module further includes a front frame and a metal back shell connected to the front frame, wherein the display panel, the at least one flip chip, the printed circuit board and the cover are located in the front frame and the metal back shell
  • the thermally conductive block is in thermal contact with the metal back shell.
  • the display module further includes a front frame and a rear case connected to the front frame, the inner side of the rear case is provided with a heat sink, the display panel, at least one flip chip, a printed circuit board and a cover plate Located between the front frame and the rear case, the heat conducting block is in thermal contact with the heat sink.
  • the heat sink is bonded to the inner side surface of the rear case.
  • the heat sink is bonded to the back shell, so that the assembly and disassembly of the heat sink are convenient, so that Replace the heat sink of the appropriate material for heat dissipation.
  • the heat sink has a layer structure, and the layer structure comprises at least one of a graphite layer, a metal layer and a heat sink layer.
  • the embodiment of the invention further provides a display device, comprising the display module according to any of the foregoing technical solutions.
  • the display module of the display device is convenient to assemble, the heat dissipation effect of the chip is better, and the display device has better product quality.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of a chip of a display module of the prior art
  • Figure 2 is an enlarged cross-sectional view taken along line B of Figure 1;
  • FIG. 3 is an exploded perspective view of a display module according to an embodiment of the present invention.
  • Figure 4 is an exploded perspective view of the portion C of Figure 3;
  • FIG. 5 is a cross-sectional view showing a heat dissipation structure of a chip of a display module according to an embodiment of the present invention
  • Figure 6 is a schematic diagram of heat conduction at D of Figure 5.
  • 16-heat conducting block 17-notch; 161-first limiting portion; 162-second limiting portion; 163-connecting portion;
  • 171-limit projection 18-front frame; 19-back shell; 20-heat sink.
  • the embodiment of the invention provides a display module and a display device.
  • the present invention will be further described in detail below.
  • front can be understood as a display device including a display module, which is close to the side of the viewer when in normal use, and “back” can be understood as a side of the component away from the viewer.
  • the specific type of the display module is not limited, and may be, for example, a TFT-LCD display module, an OLED display module, or the like.
  • the display module of the TFT-LCD as an example, in addition to the above components, the display module generally includes a backlight module, a front frame, a rear case, and the like, and the printed circuit board is located on the back side of the back panel of the backlight module, and the cover plate passes The screws are attached to the backplane and cover the printed circuit board to protect the printed circuit board.
  • the display module provided by the embodiment of the present invention includes a display panel 11, at least one flip chip 12, a printed circuit board 13 and a cover plate 14, wherein:
  • the printed circuit board 13 is located on the back side of the display panel 11;
  • One end of the flip chip 12 is connected to the display panel 11, the other end is bent toward the back side of the display panel 11 and connected to the printed circuit board 13, the portion of the flip chip 12 bent toward the back side of the display panel 11 is packaged with a chip 15;
  • the cover plate 14 is located on the back side of the printed circuit board 13 and covers the printed circuit board 13. The position of the cover plate 14 corresponding to each of the flip chip 12 is provided with a heat conducting block 16 in thermal contact with the chip 15.
  • the cover plate 14 is generally made of a metal material having a good heat dissipation property, and is preferably made of an aluminum material having a low cost and a high thermal conductivity.
  • the shape of the cover plate 14 can be designed according to the shape of the printed circuit board 13 and the heat dissipation area requirement.
  • the position of the cover plate 14 corresponding to each of the flip chip 12 is provided with a heat conducting block 16 in thermal contact with the chip 15, and the heat conducting block 16 can transfer the heat of the chip 15 and disperse the heat of the chip 15.
  • the heat is applied to the cover plate 14 to gradually dissipate the heat of the chip 15, thereby improving the heat dissipation effect of the chip 15.
  • the specific material type of the heat conducting block 16 is not limited, and for example, an aluminum block, a copper block, a thermal conductive block, or the like can be used.
  • a thermal conductive rubber block such as a thermal conductive silicone block, a thermal conductive silicone rubber block, a thermal conductive rubber block, etc.
  • the thermal conductive rubber block has a certain elasticity, and can be closely pressed into contact with the chip 15, thereby achieving better heat conduction and heat dissipation for the chip 15. effect.
  • the heat conducting block 16 and the chip 15 are non-bonded Therefore, the assembly of the display module can be simplified, and the line contact failure caused by disassembling the heat dissipation patch in the prior art can be avoided, thereby improving the product quality of the display device.
  • the position of the cover plate 14 corresponding to each of the flip chip 12 is provided with a notch 17, and the heat conducting block 16 is interference fit in the notch 17.
  • the structural design facilitates assembly and disassembly of the heat conducting block 16 and the cover plate 14 to facilitate replacement of the heat conducting block 16 of a suitable material according to the heat dissipation requirements of the chip 15.
  • the heat conducting block 16 includes a first limiting portion 161 and a second limiting portion 162 which are positioned on both sides of the cover plate 14 and a connecting portion 163 which is assembled with the notch 17 .
  • the heat conducting block 16 is inserted into the notch 17 and is interference fit, the heat conducting block 16 and the cover plate 14 are conveniently assembled and positioned, and the heat conducting block 16 is not easily detached from the upper and lower sides of the cover plate 14, thereby making the heat conducting block 16 and the gap.
  • the assembly of 17 is relatively strong.
  • the inlet of the notch 17 has a pair of limiting projections 171.
  • the display module further includes a front frame 18 and a rear case 19 connected to the front frame 18.
  • the inner side of the rear case 19 is provided with a heat sink 20, a display panel 11, at least one flip chip 12,
  • the printed circuit board 13 and the cover 14 are located between the front frame 18 and the rear case 19, and the heat conducting block 16 is in thermal contact with the heat sink 20.
  • the fins 20 are bonded to the inner side surface of the rear case 19.
  • the heat sink 20 is bonded to the rear case 19, so that the assembly and disassembly of the heat sink 20 are relatively convenient, so that the heat sink 20 of a suitable material or area size can be replaced according to the heat dissipation requirement.
  • the heat of the chip 15 is dissipated through the heat conducting block 16 and further through the heat sink 20, and the heat dissipation efficiency is high.
  • the specific structure of the heat sink 20 is not limited, and may have a layer structure, and the layer structure may include at least one of a graphite layer, a metal layer, and a heat sink layer.
  • the rear case 19 is preferably made of a metal such as aluminum or aluminum alloy, so that the heat transferred from the heat sink is quickly dissipated to the outside.
  • the heat radiated by the chip 15 is led out through the heat conducting block 16, and further through the heat sink 20 and the metal back shell 19, while being parallel to the display panel 11,
  • the heat radiated from the chip 15 is dispersed through the heat transfer block 16 to the cover 14, the heat sink 20, and the gold
  • the heat of the chip 15 is gradually dissipated through a plurality of parts, and the heat dissipation efficiency is greatly improved compared with the prior art.
  • the notches 17 of the cover 14 are first inserted into the heat conducting block 16, and then the flip chip 12 and the printed circuit board 13 are bent toward the back side of the display panel 11. Then, the cover plate 14 is fixed on the back side of the display panel 11, at which time the cover plate 14 covers the printed circuit board 13, and each of the heat-conducting blocks 16 is tightly pressed with the corresponding chip 15, and finally the above components are attached with heat dissipation.
  • the rear case 19 of the sheet 20 and the front frame 18 are assembled. After the display module is assembled, the chip 15 is pressed tightly with the heat conducting block 16, and the heat conducting block 16 is in contact with the heat sink 20.
  • the display module further includes a front frame and a metal back shell connected to the front frame, the display panel, the at least one flip chip, the printed circuit board and the cover plate being located between the front frame and the metal back shell
  • the heat conducting block is in thermal contact with the metal back shell. The heat of the chip is radiated to the outside through the heat conducting block and then through the metal back shell, and the heat dissipation efficiency is also relatively high.
  • the embodiment of the invention further provides a display device, comprising the display module according to any of the foregoing technical solutions.
  • the display module of the display device is convenient to assemble, the heat dissipation effect of the chip is better, and the display device has better product quality.
  • the specific type of the display device is not limited, and may be, for example, a flat panel television, a flat panel display, a tablet computer, an electronic paper, or the like.

Abstract

一种显示模组及显示设备。显示模组包括显示面板（11）、至少一个覆晶薄膜（12）、印刷电路板（13）和盖板（14），其中：印刷电路板（13）位于显示面板（11）的背侧；覆晶薄膜（12）一端与显示面板（11）连接，另一端向显示面板（11）的背侧弯折并与印刷电路板（13）连接，覆晶薄膜（12）向显示面板（11）背侧弯折的部分封装有芯片（15）；盖板（14）位于印刷电路板（13）的背侧并遮盖印刷电路板（13），盖板（14）对应每个覆晶薄膜（12）设置有与芯片（15）导热接触的导热块（16）。该显示模组提高了显示模组组装的便利性，提高了芯片（15）的散热效果，进而提高了显示设备的产品品质。

Description

显示模组及显示设备
相关申请的交叉引用
本申请要求于2016年4月13日递交中国专利局的、申请号为201610228560.1的中国专利申请的权益，该申请的全部公开内容以引用方式并入本文。
技术领域
本发明涉及显示技术领域，特别涉及一种显示模组及显示设备。
背景技术
在平板显示装置中，薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display，简称TFT-LCD)具有体积小、功耗低、制造成本相对较低和无辐射等特点，在当前的平板显示器市场占据了主导地位。
图1和图2分别是为现有技术的显示模组的芯片的散热结构的示意图以及图1中B处的截面放大图。如图1和图2所示，现有的TFT-LCD中，覆晶薄膜1(Chip on Film，简称COF)连接液晶面板2和印刷电路板3并从液晶面板2的周边向背光模组的背板背侧弯折(背光模组以及下述的盖板图中未示出)，芯片4被封装在覆晶薄膜1上，背光模组的背板背侧所固定的盖板对印刷电路板3和芯片4进行遮盖保护。
随着消费者对显示设备画质要求的不断提高，芯片所处理的系统信号和电源讯息的量也越来越大，负载能力的提高必然会带来更多的发热量，因此，需要对芯片进行良好的散热。如图1和图2所示，现有技术针对芯片4散热较常采用的方案是：在覆晶薄膜1上贴附覆盖芯片4的散热贴片5，从而对芯片4 进行散热。
现有技术存在的缺陷在于，由于覆晶薄膜1和散热贴片5均具有一定柔性，因此在将散热贴片5与覆晶薄膜1粘接时，需要保持覆晶薄膜1和散热贴片5平整(如图2中的虚线所示)，操作极为不便，特别是大尺寸显示模组，其覆晶薄膜1的数量一般可达几十个，使得操作繁琐，费时费力。此外，覆晶薄膜1与散热贴片5粘接后，如果需要拆下散热贴片5，则两者之间极易因粘合力较大而产生拉扯，从而导致覆晶薄膜1与液晶面板2或印刷电路板3接触不良，而如若覆晶薄膜1与散热贴片5粘接不牢固，两者之间产生间隙，则散热效果又会大打折扣。
对于非TFT-LCD显示产品，例如OLED(Organic Light-Emitting Diode，有机电致发光二极管)产品，其芯片的散热结构与上述形式类似，因此，也存在上述类似的技术问题。
发明内容
本发明提供一种显示模组及显示设备，其目的在于提高显示模组组装的便利性，提升芯片的散热效果，进而提升显示设备的产品品质。
本发明实施例提供了一种显示模组，包括显示面板、至少一个覆晶薄膜、印刷电路板和盖板，其中：
所述印刷电路板位于显示面板的背侧；
所述覆晶薄膜一端与显示面板连接，另一端向显示面板的背侧弯折并与印刷电路板连接，所述覆晶薄膜向显示面板的背侧弯折的部分封装有芯片；
所述盖板位于印刷电路板的背侧并遮盖印刷电路板，所述盖板的对应每个覆晶薄膜的位置设置有与芯片导热接触的导热块。
在本发明实施例技术方案中，盖板的对应每个覆晶薄膜的位置设置有与芯片导热接触的导热块，导热块可以传递芯片的热量并将芯片的热量分散到盖板 上，从而使芯片的热量逐渐散发，提升芯片的散热效果。此外，由于导热块与芯片无粘接连接，因此可以简化显示模组的组装，避免现有技术中拆卸散热贴片时造成的线路接触不良，从而提升显示设备的产品品质。
优选地，所述导热块为导热胶块。
导热胶块具有一定的弹性，可以与芯片紧密压合接触，从而对芯片实现更佳的导热散热效果。
优选地，所述盖板的对应每个覆晶薄膜的位置设置有缺口，所述导热块过盈装配于缺口内。
该结构设计便于导热块与盖板组装和拆卸，便于根据芯片的散热需求而更换合适材质的导热块。
优选地，所述导热块包括：定位于盖板两侧的第一限位部和第二限位部，以及与缺口过盈装配的连接部。
采用该设计，导热块与缺口插接并且过盈配合，导热块与盖板组装定位方便，并且导热块不易从盖板的上下两侧脱出，从而使得导热块与缺口的装配较为牢固。
优选地，所述缺口的进口处具有一对限位凸起。
采用该设计，导热块与缺口装配后，不易从缺口的入口处脱出，使得导热块与缺口的装配更加牢固。
可选地，所述显示模组还包括前框以及与前框连接的金属后壳，所述显示面板、至少一个覆晶薄膜、印刷电路板和盖板位于所述前框和金属后壳之间，所述导热块与金属后壳导热接触。
可选地，所述显示模组还包括前框以及与前框连接的后壳，所述后壳的内侧设置有散热片，所述显示面板、至少一个覆晶薄膜、印刷电路板和盖板位于所述前框和后壳之间，所述导热块与散热片导热接触。
优选地，所述散热片与后壳的内侧表面粘接。
散热片与后壳粘接，使得散热片的组装和拆卸都比较方便，从而可以根据 散热需求更换合适材质的散热片。
可选地，所述散热片具有层结构，所述层结构包括石墨层、金属层和散热胶层中的至少一种。
本发明实施例还提供一种显示设备，包括根据前述任一技术方案所述的显示模组。
所述显示设备的显示模组组装便利，芯片散热效果较佳，显示设备具有较佳的产品品质。
附图说明
图1为现有技术的显示模组的芯片的散热结构的示意图；
图2为图1中B处的截面放大图；
图3为本发明的实施例的显示模组的分解示意图；
图4为图3的C处分解示意图；
图5为本发明的实施例的显示模组的芯片的散热结构截面图；
图6为图5的D处热传导示意图。
附图标记：
现有技术部分：
1-覆晶薄膜；2-液晶面板；3-印刷电路板；4-芯片；5-散热贴片。
本发明实施例部分：
11-显示面板；12-覆晶薄膜；13-印刷电路板；14-盖板；15-芯片；
16-导热块；17-缺口；161-第一限位部；162-第二限位部；163-连接部；
171-限位凸起；18-前框；19-后壳；20-散热片。
具体实施方式
为了提高显示模组组装的便利性，提升芯片的散热效果，进而提升显示设备的产品品质，本发明实施例提供了一种显示模组及显示设备。为使本发明的 目的、技术方案和优点更加清楚，以下举实施例对本发明作进一步详细说明。
在本发明实施例中，“前”可以理解为包含显示模组的显示设备在通常使用时，该部件靠近观看者的一侧，“后”则可以理解为该部件远离观看者的一侧。
显示模组的具体类型不加以限制，例如可以为TFT-LCD的显示模组、OLED显示模组等等。以TFT-LCD的显示模组为例，除上述部件外，显示模组一般还包括背光模组、前框、后壳等部件，印刷电路板位于背光模组的背板背侧，盖板通过螺钉固定于背板并遮盖印刷电路板，对印刷电路板进行保护。
如图3和图5所示，本发明的实施例提供的显示模组，包括显示面板11、至少一个覆晶薄膜12、印刷电路板13和盖板14，其中：
印刷电路板13位于显示面板11的背侧；
覆晶薄膜12的一端与显示面板11连接，另一端向显示面板11的背侧弯折并与印刷电路板13连接，覆晶薄膜12向显示面板11背侧弯折的部分封装有芯片15；
盖板14位于印刷电路板13的背侧并遮盖印刷电路板13，盖板14的对应每个覆晶薄膜12的位置设置有与芯片15导热接触的导热块16。
盖板14一般采用散热性较好的金属材质，优选采用成本低且导热系数较高的铝材，盖板14的形状可根据印刷电路板13的形状及散热面积需求进行设计。
在本发明实施例技术方案中，盖板14的对应每个覆晶薄膜12的位置设置有与芯片15导热接触的导热块16，导热块16可以传递芯片15的热量并将芯片15的热量分散到盖板14上，从而使芯片15的热量逐渐散发，提升芯片15的散热效果。导热块16的具体材质类型不限，例如可以采用铝块、铜块、导热胶块等等。优选采用导热胶块，例如导热硅胶块，导热硅橡胶块，导热矽胶块等等，导热胶块具有一定的弹性，可以与芯片15紧密压合接触，从而对芯片15实现更佳的导热散热效果。此外，由于导热块16与芯片15是无粘接连 接，因此可以简化显示模组的组装，避免现有技术中拆卸散热贴片时造成的线路接触不良，从而提升显示设备的产品品质。
如图3和图4所示，在该实施例中，盖板14的对应每个覆晶薄膜12的位置设置有缺口17，导热块16过盈装配于缺口17内。该结构设计便于导热块16与盖板14组装拆卸，方便根据芯片15的散热需求更换合适材质的导热块16。
进一步，导热块16包括：定位于盖板14两侧的第一限位部161和第二限位部162，以及与缺口17过盈装配的连接部163。采用该设计，导热块16与缺口17插接并且过盈配合，导热块16与盖板14组装定位方便，并且导热块16不易从盖板14的上下两侧脱出，从而使得导热块16与缺口17的装配较为牢固。
此外，缺口17的进口处具有一对限位凸起171。采用该设计，导热块16与缺口17装配后，不易从缺口17的入口处脱出，使得导热块16与缺口17的装配更加牢固。
如图3和图5所示，显示模组还包括前框18以及与前框18连接的后壳19，后壳19的内侧设置有散热片20，显示面板11、至少一个覆晶薄膜12、印刷电路板13和盖板14位于前框18和后壳19之间，导热块16与散热片20导热接触。优选地，散热片20与后壳19的内侧表面粘接。散热片20与后壳19粘接，使得散热片20的组装和拆卸都比较方便，从而可以根据散热需求更换合适材质或面积大小的散热片20。芯片15的热量通过导热块16、进而通过散热片20散发，散热效率较高。其中，散热片20的具体结构形式不限，可以具有层结构，所述层结构可以包括石墨层、金属层和散热胶层中的至少一种。后壳19优选采用铝或铝合金等金属材质，从而将散热片传递的热量快速散发到外界。
如图6所示，在显示模组的截面方向上，芯片15散发的热量通过导热块16、进而通过散热片20和金属材质的后壳19导出，同时在平行于显示面板11的方向上，芯片15散发的热量通过导热块16分散到盖板14、散热片20和金 属材质的后壳19上，芯片15的热量经过多个零部件逐级散发，散热效率较现有技术大大提高。
如图3和图4所示，显示模组在组装时，首先将盖板14的各个缺口17插入导热块16，然后将覆晶薄膜12和印刷电路板13向显示面板11的背侧弯折，之后将盖板14在显示面板11的背侧固定，此时盖板14遮盖住印刷电路板13，并且各个导热块16与对应的芯片15紧密压合，最后将上述组件与贴附有散热片20的后壳19和前框18组装。显示模组在组装完毕后，芯片15与导热块16紧密压合，导热块16与散热片20接触。
在本发明的其它实施例中，显示模组还包括前框以及与前框连接的金属后壳，显示面板、至少一个覆晶薄膜、印刷电路板和盖板位于前框和金属后壳之间，导热块与金属后壳导热接触。芯片的热量通过导热块、进而通过金属后壳散发到外界，散热效率也比较高。
本发明实施例还提供一种显示设备，包括根据前述任一技术方案的显示模组。该显示设备的显示模组组装便利，芯片散热效果较佳，显示设备具有较佳的产品品质。显示设备的具体类型不限，例如可以为平板电视、平板显示器、平板电脑、电子纸等等。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (10)

  1. 一种显示模组，其特征在于，包括显示面板、至少一个覆晶薄膜、印刷电路板和盖板，其中：
    所述印刷电路板位于显示面板的背侧；
    所述覆晶薄膜一端与显示面板连接，另一端向显示面板的背侧弯折并与印刷电路板连接，所述覆晶薄膜向显示面板背侧弯折的部分封装有芯片；
    所述盖板位于印刷电路板的背侧并遮盖印刷电路板，所述盖板的对应每个覆晶薄膜的位置设置有与芯片导热接触的导热块。
  2. 如权利要求1所述的显示模组，其特征在于，所述导热块为导热胶块。
  3. 如权利要求1所述的显示模组，其特征在于，所述盖板的对应每个覆晶薄膜的位置设置有缺口，所述导热块过盈装配于缺口内。
  4. 如权利要求3所述的显示模组，其特征在于，所述导热块包括：定位于盖板两侧的第一限位部和第二限位部，以及与缺口过盈装配的连接部。
  5. 如权利要求3所述的显示模组，其特征在于，所述缺口的进口处具有一对限位凸起。
  6. 如权利要求1所述的显示模组，其特征在于，所述显示模组还包括前框以及与前框连接的金属后壳，所述显示面板、至少一个覆晶薄膜、印刷电路板和盖板位于所述前框和金属后壳之间，所述导热块与金属后壳导热接触。
  7. 如权利要求1所述的显示模组，其特征在于，所述显示模组还包括前框以及与前框连接的后壳，所述后壳的内侧设置有散热片，所述显示面板、至少一个覆晶薄膜、印刷电路板和盖板位于所述前框和后壳之间，所述导热块与 散热片导热接触。
  8. 如权利要求7所述的显示模组，其特征在于，所述散热片与后壳的内侧表面粘接。
  9. 如权利要求7所述的显示模组，其特征在于，所述散热片具有层结构，所述层结构包括石墨层、金属层和散热胶层中的至少一种。
  10. 一种显示设备，其特征在于，包括如权利要求1～9任一项所述的显示模组。
PCT/CN2017/079442 2016-04-13 2017-04-05 显示模组及显示设备 WO2017177848A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/743,180 US10444557B2 (en) 2016-04-13 2017-04-05 Display module and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610228560.1 2016-04-13
CN201610228560.1A CN105676502B (zh) 2016-04-13 2016-04-13 一种显示模组及显示设备

Publications (1)

Publication Number Publication Date
WO2017177848A1 true WO2017177848A1 (zh) 2017-10-19

Family

ID=56308989

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/079442 WO2017177848A1 (zh) 2016-04-13 2017-04-05 显示模组及显示设备

Country Status (3)

Country Link
US (1) US10444557B2 (zh)
CN (1) CN105676502B (zh)
WO (1) WO2017177848A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105676502B (zh) * 2016-04-13 2019-11-29 京东方科技集团股份有限公司 一种显示模组及显示设备
CN106231836B (zh) * 2016-08-05 2023-05-26 京东方科技集团股份有限公司 封闭式显示装置及其组装方法
CN106409141A (zh) * 2016-10-26 2017-02-15 方迪勇 一种电子显示单元
CN106409142A (zh) * 2016-10-26 2017-02-15 方迪勇 一种电子显示单元模块
CN106959538B (zh) * 2017-05-26 2020-06-26 惠科股份有限公司 一种散热结构及显示装置
CN207099513U (zh) * 2017-09-05 2018-03-13 陈庆洪 一种散热功能良好的防护等级达65级及以上的电气机箱
TWI687799B (zh) 2018-11-09 2020-03-11 緯創資通股份有限公司 散熱模組與包含其之顯示裝置及其組裝方法
CN111837171B (zh) * 2019-02-20 2022-07-01 京东方科技集团股份有限公司 显示装置及其制备方法
KR20200112068A (ko) 2019-03-20 2020-10-05 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
CN110262105B (zh) * 2019-06-13 2020-10-16 武汉华星光电技术有限公司 显示装置
KR20210041143A (ko) * 2019-10-04 2021-04-15 삼성전자주식회사 필름 패키지 및 패키지 모듈의 제조 방법
KR20210081886A (ko) * 2019-12-24 2021-07-02 엘지디스플레이 주식회사 표시장치
CN111240069A (zh) * 2020-03-07 2020-06-05 张家刘 一种覆晶薄膜及显示面板
CN111477099B (zh) * 2020-04-20 2022-09-20 京东方科技集团股份有限公司 一种显示模组及显示装置
CN114842749B (zh) * 2022-04-29 2023-12-29 京东方科技集团股份有限公司 显示模组及显示装置
CN114822277B (zh) * 2022-06-29 2022-11-25 惠科股份有限公司 显示屏及拼接屏

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100730133B1 (ko) * 2005-06-01 2007-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈
CN101109857A (zh) * 2006-07-21 2008-01-23 三星电子株式会社 显示装置
CN102723315A (zh) * 2012-06-28 2012-10-10 深圳市华星光电技术有限公司 芯片散热结构及采用该芯片散热结构的液晶显示装置
CN103176303A (zh) * 2011-12-23 2013-06-26 三星电子株式会社 显示组件和具有该显示组件的显示设备
CN204269982U (zh) * 2014-11-14 2015-04-15 Tcl光电科技(惠州)有限公司 Lcd模组及其散热结构
CN205103518U (zh) * 2015-11-13 2016-03-23 乐视致新电子科技（天津）有限公司 一种液晶模组及显示装置
CN105676502A (zh) * 2016-04-13 2016-06-15 京东方科技集团股份有限公司 一种显示模组及显示设备
CN205539814U (zh) * 2016-04-13 2016-08-31 京东方科技集团股份有限公司 一种显示模组及显示设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983120B2 (ja) * 2001-07-30 2007-09-26 富士通日立プラズマディスプレイ株式会社 Ｉｃチップの実装構造及びディスプレイ装置
US7414204B2 (en) 2003-10-29 2008-08-19 Samsung Sdi Co., Ltd. Display device and heat dissipating means therefor
KR20050122958A (ko) * 2004-06-26 2005-12-29 삼성에스디아이 주식회사 열전도 와이어가 구비된 플라즈마 표시장치 조립체
JP4997584B2 (ja) 2006-01-26 2012-08-08 Ｎｌｔテクノロジー株式会社 液晶表示装置
KR101342652B1 (ko) * 2006-11-15 2013-12-16 삼성디스플레이 주식회사 액정 표시 장치
CN101373744A (zh) * 2007-08-24 2009-02-25 奇美电子股份有限公司 芯片模块以及具有此芯片模块的显示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100730133B1 (ko) * 2005-06-01 2007-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈
CN101109857A (zh) * 2006-07-21 2008-01-23 三星电子株式会社 显示装置
CN103176303A (zh) * 2011-12-23 2013-06-26 三星电子株式会社 显示组件和具有该显示组件的显示设备
CN102723315A (zh) * 2012-06-28 2012-10-10 深圳市华星光电技术有限公司 芯片散热结构及采用该芯片散热结构的液晶显示装置
CN204269982U (zh) * 2014-11-14 2015-04-15 Tcl光电科技(惠州)有限公司 Lcd模组及其散热结构
CN205103518U (zh) * 2015-11-13 2016-03-23 乐视致新电子科技（天津）有限公司 一种液晶模组及显示装置
CN105676502A (zh) * 2016-04-13 2016-06-15 京东方科技集团股份有限公司 一种显示模组及显示设备
CN205539814U (zh) * 2016-04-13 2016-08-31 京东方科技集团股份有限公司 一种显示模组及显示设备

Also Published As

Publication number Publication date
CN105676502A (zh) 2016-06-15
US10444557B2 (en) 2019-10-15
US20190011760A1 (en) 2019-01-10
CN105676502B (zh) 2019-11-29

Similar Documents

Publication Publication Date Title
WO2017177848A1 (zh) 显示模组及显示设备
US7903416B2 (en) Flat panel display
WO2017080150A1 (zh) 一种液晶模组及显示装置
JP5791984B2 (ja) ディスプレイ装置
US8120917B2 (en) Heat dissipation device
JP2013004783A (ja) 放熱構造および表示装置
TWI472833B (zh) 顯示裝置
CN110389474B (zh) 液晶显示装置
US20160018591A1 (en) Backlight Device
WO2017198090A1 (zh) 显示装置
CN103439831A (zh) 侧光式液晶模组、直下式液晶模组及电视机
US7427148B1 (en) Light modules
CN114078946A (zh) 一种显示模组和显示装置
US9772148B2 (en) Display device
EP3385782A1 (en) Lcd display device
JP2006005081A (ja) パワー部品冷却装置
CN100399137C (zh) 显示器的散热结构
CN205539814U (zh) 一种显示模组及显示设备
JP2016181624A (ja) 放熱モジュール、およびテレビジョン受像機
TWI414860B (zh) 背光模組
US20140247558A1 (en) Heat dissipation device of electronic apparatus
US7729120B2 (en) Heat sink apparatus
JP2008275803A (ja) 画像表示装置
TWI386719B (zh) 平面顯示器
KR20080005762A (ko) 발광소자 모듈

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17781824

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17781824

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 05/07/2019)

122 Ep: pct application non-entry in european phase

Ref document number: 17781824

Country of ref document: EP

Kind code of ref document: A1