WO2017169847A1 - ロードポート - Google Patents

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Publication number
WO2017169847A1
WO2017169847A1 PCT/JP2017/010657 JP2017010657W WO2017169847A1 WO 2017169847 A1 WO2017169847 A1 WO 2017169847A1 JP 2017010657 W JP2017010657 W JP 2017010657W WO 2017169847 A1 WO2017169847 A1 WO 2017169847A1
Authority
WO
WIPO (PCT)
Prior art keywords
door
container
foup
seal member
load port
Prior art date
Application number
PCT/JP2017/010657
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
辰弥 三浦
源五郎 小倉
貴司 重田
小笠原　幸雄
俊宏 河合
育志 谷山
Original Assignee
シンフォニアテクノロジー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シンフォニアテクノロジー株式会社 filed Critical シンフォニアテクノロジー株式会社
Priority to CN202311642085.9A priority Critical patent/CN117690841A/zh
Priority to KR1020227000190A priority patent/KR102477013B1/ko
Priority to CN202311642084.4A priority patent/CN117690840A/zh
Priority to KR1020187028448A priority patent/KR102350964B1/ko
Priority to CN202311642083.XA priority patent/CN117690839A/zh
Priority to KR1020227043091A priority patent/KR20230004889A/ko
Priority to CN201780021499.6A priority patent/CN108886012B/zh
Publication of WO2017169847A1 publication Critical patent/WO2017169847A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Definitions

  • the present invention relates to a load port capable of circulating a gas in a wafer transfer chamber so that a wafer being transferred is not exposed to the outside air.
  • semiconductors have been manufactured by performing various processing steps on a wafer as a substrate.
  • higher integration of devices and circuit miniaturization have been promoted, and it is required to maintain a high degree of cleanness around the wafer so that oxygen, moisture and particles do not adhere to the wafer surface. ing.
  • the periphery of the wafer is made an inert gas nitrogen atmosphere or a vacuum state.
  • the wafer In order to properly maintain the atmosphere around the wafer, the wafer is placed in a sealed storage pod called FOUP (Front-Opening Unified Pod) and managed, and this interior is filled with nitrogen. Furthermore, a processing apparatus for processing the wafer and a load port (Load (Port) for transferring the wafer to and from the FOUP are used.
  • the load port constitutes a part of a wall that isolates the wafer processing apparatus from the external space, and functions as an interface unit between the processing apparatus and the FOUP. While the processing device and the load port may be directly connected, an EFEM (Equipment Front End Module) may be arranged between the processing device and the load port.
  • EFEM Equipment Front End Module
  • the EFEM constitutes a wafer transfer chamber that is substantially closed inside the housing, and has a load port that functions as an interface unit with the FOUP on one of the opposing wall surfaces, and a processing apparatus and a transfer chamber on the other side.
  • a load lock chamber is connected to prevent direct communication.
  • a wafer transfer device for transferring wafers is provided in the wafer transfer chamber, and wafers are taken in and out between the FOUP connected to the load port and the load lock chamber using this wafer transfer device. .
  • a downflow which is clean air, is constantly flowing from a fan filter unit disposed in the upper portion of the transfer chamber.
  • An object of the present invention is to provide a load port that can prevent the seal with the door from being released.
  • the load port according to the first invention is: A base that forms part of a wall that isolates the transfer space from the external space; An opening provided in the base; Opening and closing of the opening, and a door capable of fixing and releasing the lid with respect to the container containing the contents; A first seal member for sealing between the base and the container; A second seal member for sealing between the base and the door; With After the container is mounted on the mounting table on which the container is mounted, the door comes into contact with the second seal member, and an end surface of the door on the container side is between the door and the second seal member. The door is retracted in an opposite direction to the container from an initial position on the container side of the contact surface.
  • the door contacts the second seal member, and the end surface of the door on the container side is closer to the container than the contact surface between the door and the second seal member. From the initial position, retract the door in the opposite direction to the container. Thereby, when a container is moved toward a door until it contacts with the 1st seal member, it can prevent that a container and a door contact. Therefore, it is possible to prevent the seal between the base and the container or the door from being released.
  • the load port according to the second invention is: The door is in contact with the second seal member at a door retracted position where the door is retracted.
  • the door is in contact with the second seal member at the door retracted position where the door is retracted. Accordingly, when the container is moved toward the door and the container contacts the first seal member, a sealed space can be formed by at least the base, the first seal member, the second seal member, the lid, and the door.
  • the load port according to the third invention is: The door is in the door retracted position; When the container is in contact with the opening through the first seal member, a sealed space is formed by at least the first seal member, the second seal member, the lid, and the door, After the sealed space is filled with gas, the door is advanced from the retracted position toward the container.
  • the door is advanced from the retracted position toward the container.
  • the container and the door are brought close to each other, and the door is released from the fixing of the lid body, so that the lid body can be removed from the container.
  • the load port according to the fourth invention is: The door is in contact with the lid at a door advance position where the door is advanced.
  • the door is in contact with the lid at the door advance position where the door is advanced.
  • the door reliably releases the lid from the container, and the lid can be removed from the container.
  • the sealed space is filled with gas, so air enters the transport space.
  • the load port according to the fifth invention is: The size of the second seal member in the direction in which the door advances and retreats is larger than the size of the first seal member in the direction in which the door advances and retreats.
  • the dimension of the second seal member in the direction in which the door advances and retracts is larger than the dimension of the first seal member in the direction in which the door advances and retracts.
  • the load port according to the sixth invention is: A base that forms part of a wall that isolates the transfer space from the external space; An opening provided in the base; Opening and closing of the opening, and a door capable of fixing and releasing the lid with respect to the container containing the contents; A first seal member for sealing between the base and the container; A second seal member for sealing between the base and the door; With After the container is placed on the placing table on which the container is placed, the container comes into contact with the first seal member and the container side of the door with which the second seal member comes into contact from the placement position. The container is advanced toward the door to a container retracting position in which the end surface of the container and the container are spaced apart from each other by a predetermined distance.
  • the container comes into contact with the first seal member and the end face on the container side of the door that comes into contact with the second seal member
  • the container is advanced toward the door to a container retracting position at a predetermined distance from the container.
  • the load port according to the seventh invention is: When the container is in the container retracted position, a sealed space is formed by at least the first seal member, the second seal member, the lid, and the door, After the sealed space is filled with gas, the container is advanced from the container retracted position toward the door.
  • the container is advanced from the container retreat position toward the door.
  • the container and the door are brought close to each other, and the door is released from the fixing of the lid body, so that the lid body can be removed from the container.
  • the load port according to the eighth invention is: The lid is in contact with the door at a container advance position where the container is advanced.
  • the lid is in contact with the door at the container advance position where the container has been advanced. Thereby, the door reliably releases the lid from the container, and the lid can be removed from the container. Also, even if the door is tilted and the seal between the door and the second seal member is released due to the door coming into contact with the lid, the sealed space is filled with gas, so air enters the transport space. None do.
  • the load port according to the ninth invention is: The dimension of the first seal member in the direction in which the container moves forward and retracts in the direction opposite to the forward direction is larger than the dimension of the second seal member in the direction in which the container advances and retracts.
  • the dimension of the first seal member in the direction in which the container advances and retracts in the direction opposite to the advance direction is larger than the dimension of the second seal member in the direction in which the container advances and retracts.
  • the door comes into contact with the second seal member, and the end surface of the door on the container side is closer to the container than the contact surface between the door and the second seal member.
  • the door is retracted from the initial position in the direction opposite to the container.
  • the door is in contact with the second seal member at the door retracted position where the door is retracted. Accordingly, when the container is moved toward the door and the container contacts the first seal member, a sealed space can be formed by at least the base, the first seal member, the second seal member, the lid, and the door.
  • the door is advanced from the retracted position toward the container.
  • the container and the door are brought close to each other, and the door is released from the fixing of the lid body, so that the lid body can be removed from the container.
  • the door is in contact with the lid at the door advance position where the door is advanced. Thereby, the door reliably releases the lid from the container, and the lid can be removed from the container. Also, even if the door is tilted and the seal between the door and the second seal member is released due to the door coming into contact with the lid, the sealed space is filled with gas, so air enters the transport space. None do.
  • the dimension of the second seal member in the direction in which the door advances and retracts is larger than the dimension of the first seal member in the direction in which the door advances and retracts.
  • the container comes into contact with the first seal member and the container side of the door that comes into contact with the second seal member from the placement position.
  • the container is advanced toward the door to a container retracting position where the end surface and the container are separated from each other by a predetermined distance.
  • the container is advanced from the container retreat position toward the door.
  • the container and the door are brought close to each other, and the door is released from the fixing of the lid body, so that the lid body can be removed from the container.
  • the lid is in contact with the door at the container advance position where the container has been advanced. Thereby, the door reliably releases the lid from the container, and the lid can be removed from the container. Also, even if the door is tilted and the seal between the door and the second seal member is released due to the door coming into contact with the lid, the sealed space is filled with gas, so air enters the transport space. None do.
  • the dimension of the first seal member in the direction in which the container advances and retracts in the direction opposite to the advance direction is larger than the dimension of the second seal member in the direction in which the container advances and retracts.
  • the side view which shows the state which removed the side wall of EFEM.
  • the perspective view of the load port shown in FIG. Side surface sectional drawing which shows FOUP and a load port.
  • the principal part expansion perspective view which expands and shows the window unit and door part which comprise EFEM.
  • the block diagram which shows the connection state of a control part, each sensor, and each drive part.
  • Sectional drawing which shows the state which mounted FOUP on the mounting base.
  • Sectional drawing which shows the state which advanced FOUP toward the load port from the state of FIG. 10, and retracted the door part. Sectional drawing which shows the state which advanced the door part toward FOUP from the state of FIG. Sectional drawing which shows the state which open
  • FIG. 18 is a cross-sectional view showing a state when the FOUP is further advanced from the state of FIG. 17 toward the door portion.
  • Sectional drawing of the 2nd O-ring of 3rd Embodiment. The flowchart of 3rd Embodiment when taking out and taking in the wafer in FOUP.
  • Sectional drawing which shows the state which advanced FOUP to the retracted position and retracted the door part to the retracted position.
  • FIG. 23 is a cross-sectional view showing a state in which the FOUP and the door portion are brought close to the state of FIG.
  • FIG. 1 is a side view in which the inside of the EFEM 1 is made visible by removing the side wall.
  • the EFEM 1 includes a wafer transfer device 2 that transfers a wafer W between predetermined delivery positions, a box-shaped case 3 provided so as to surround the wafer transfer device 2, and a case 3 is composed of a load port 4 connected to the outside of the front side wall 3 and a control means 5.
  • the direction on the side connected to the load port 4 when viewed from the housing 3 is defined as the front, and the direction opposite to the side connected to the load port 4 when viewed from the housing 3 is defined as the rear.
  • the control means 5 controls the operation of the wafer transfer device 2, whereby the wafer (contained item) W stored in the FOUP (container) 7 placed on the load port 4 is transferred to the transfer space 9 inside the housing 3. It is possible to transfer and to transfer the wafer W after each processing into the FOUP 7 again.
  • the load port 4 includes a door portion 51 (see FIG. 2).
  • the door portion 51 is connected to the lid 32 provided on the FOUP 7 and moves together, so that the FOUP 7 is opened to the transport space 9. It has become so.
  • a large number of mounting portions are provided in the FOUP 7 in the vertical direction, whereby a large number of wafers W can be accommodated.
  • the FOUP 7 is normally filled with nitrogen, and the atmosphere in the FOUP 7 can be replaced with nitrogen through the load port 4 under the control of the control means 5.
  • the control means 5 is configured as a controller unit provided in the upper space of the housing 3.
  • the control means 5 performs drive control of the wafer transfer device 2, nitrogen replacement control of the FOUP 7 by the load port 4, opening / closing control of the door part 51, nitrogen circulation control in the housing 3, and the like.
  • the control means 5 is constituted by a normal microprocessor or the like having a CPU, a memory, and an interface.
  • the memory stores a program necessary for processing in advance, and the CPU sequentially extracts and executes the necessary program.
  • the desired functions are realized in cooperation with peripheral hardware resources.
  • the nitrogen circulation control will be described later.
  • the internal space of the housing 3 is partitioned by a partition member 8 into a transport space 9 that is a space in which the wafer transport device 2 is driven and a gas return path 10.
  • the conveyance space 9 and the gas return path 10 are a gas outlet 11 provided extending in the width direction above the conveyance space 9 and a gas suction provided extending in the width direction below the conveyance space 9. It communicates only with the mouth 12. Then, the gas delivery port 11 and the gas suction port 12 generate a downward air flow in the transport space 9 and an upward air flow in the gas return path 10 so that the inert gas circulates.
  • nitrogen is used as the inert gas, but the gas to be circulated is not limited to this, and other gases can be used.
  • a gas supply means 16 for introducing nitrogen into the housing 3 is connected to the upper part on the back side of the return path 10.
  • the gas supply means 16 can control supply and stop of supply of nitrogen based on a command from the control means 5. Therefore, when a part of nitrogen flows out of the housing 3, the gas supply means 16 supplies nitrogen for the outflow, so that the nitrogen atmosphere in the housing 3 can be kept constant.
  • a gas discharge means 17 for discharging nitrogen gas in the housing 3 is connected to the lower part on the back side.
  • the gas discharge means 17 operates based on a command from the control means 5 and can open the shutter (not shown) to communicate the inside of the housing 3 with the nitrogen gas discharge destination provided outside. It has become.
  • the gas supply means 16 supplies nitrogen.
  • the gas supply means 16 supplies the circulated gas.
  • the gas outlet 11 is provided with a fan filter unit 13 (FFU 13) including a fan 13a and a filter 13b as a first blowing means.
  • the fan filter unit 13 removes particles contained in the nitrogen gas that circulates in the housing 3 and generates a downward air flow in the transport space 9 by blowing air downward into the transport space 9. .
  • the FFU 13 is supported by a support member 18 that is connected to the partition member 8 and extends in the horizontal direction.
  • the nitrogen gas in the housing 3 is lowered by the fan 13 a and the fan 15 of the FFU 13 described above, and circulates by rising in the gas return path 10. Since the gas outlet 11 is opened downward, nitrogen gas is sent downward by the FFU 13. Since the gas suction port 12 is opened upward, the nitrogen gas can be sucked downward as it is without disturbing the downward air flow generated by the FFU 13, and a smooth flow of the nitrogen gas can thereby be achieved. Can be produced. In addition, since the descending airflow is generated in the transfer space 9, the particles adhering to the upper portion of the wafer W and the gas released temporarily from the processed wafer are removed, and the wafer transfer device 2 in the transfer space 9 is removed. Such a device prevents the emission gas and particles from floating.
  • FIG. 2 is a perspective view of the load port 4.
  • the configuration of the load port 4 will be described.
  • the base 21 is erected vertically from the rear of the leg 25 to which the caster and the installation leg are attached, and the horizontal base 23 is provided forward from a height position of about 60% of the base 21. Yes. Further, a mounting table 24 for mounting the FOUP 7 is provided on the upper portion of the horizontal base 23.
  • the FOUP 7 is provided on one surface of the main body 31 as a main body 31 having an internal space Sf for accommodating the wafer W (see FIG. 1) and as a carry-in / out port for the wafer W. It is comprised from the cover body 32 which opens and closes the opening 31a. When the FOUP 7 is correctly placed on the placement table 24, the lid 32 faces the base 21.
  • positioning pins 24 a for positioning the FOUP 7 are provided on the mounting table 24, and lock claws 24 b for fixing the FOUP 7 to the mounting table 24 are provided.
  • the lock claw 24b can fix the FOUP 7 by performing a locking operation after the FOUP 7 is properly positioned on the mounting table 24, and can separate the FOUP 7 from the mounting table 24 by performing an unlocking operation. It can be.
  • the mounting table 24 can be moved in the front-rear direction by a mounting table driving unit (not shown) with the FOUP 7 mounted.
  • Whether or not the FOUP 7 is positioned at an appropriate position is detected by a positioning sensor 60 disposed in the vicinity of the positioning pin 24a.
  • the positioning sensor 60 is preferably arranged in the vicinity of each positioning pin 24a.
  • being appropriately positioned means that the height of the bottom surface of the FOUP 7 with respect to the mounting table 24 is within a predetermined range from the top surface of the mounting table 24.
  • the mounting table 24 is provided with gas injection portions 70 for supplying nitrogen gas into the FOUP 7 and gas exhaust portions 71 for discharging nitrogen gas from the FOUP 7 at two locations.
  • the gas injection part 70 and the gas exhaust part 71 are usually located below the bottom surface of the FOUP 7 in a properly positioned state, and are advanced upward during use to provide a gas supply valve 33 provided in the FOUP 7 (see FIG. 3). ) And the gas discharge valve 34, respectively.
  • the upper end of the gas injection unit 70 contacts the gas supply valve 33 of the FOUP 7, and similarly, the upper end of the gas exhaust unit 71 contacts the gas exhaust valve 34 of the FOUP 7. Then, a gas such as dry nitrogen gas is supplied from the gas injection unit 70 to the internal space Sf of the FOUP 7 through the gas supply valve 33, and the nitrogen gas in the internal space Sf is discharged from the gas exhaust unit 71 through the gas discharge valve 34. It is possible. Further, by setting the nitrogen gas supply amount to be larger than the nitrogen gas discharge amount, the positive pressure setting in which the pressure of the internal space Sf is increased with respect to the pressure of the outside or the transfer space 9 of the housing 3 can be achieved.
  • the base 21 constituting the load port 4 constitutes a part of the front wall that isolates the transfer space 9 from the external space. As shown in FIG. 2, the base 21 is attached to columns 21a and 21a erected on both sides, a base main body 21b supported by these, and a window portion 21c opened to the base main body 21b in a substantially rectangular shape. Window unit 40.
  • substantially rectangular refers to a shape in which four corners are smoothly connected by arcs while a rectangle having four sides is a basic shape.
  • the window unit 40 is provided at a position facing the lid body 32 (see FIG. 3) of the FOUP 7 described above. Since the window unit 40 is provided with a substantially rectangular opening 42 (see FIG. 4) as will be described in detail later, the conveyance space 9 of the housing 3 can be opened via the opening 42. it can.
  • the window unit 40 includes a window frame 41, a first O-ring (first seal member) 43, a second O-ring (second seal member) 44 as an elastic material attached to the window frame portion 41, and a FOUP 7 via the first O-ring 43.
  • a clamp unit 45 as a pull-in means for closely attaching to the window frame portion 41.
  • the window frame 41 has a frame shape in which a substantially rectangular opening 42 is formed inside. Since the window frame 41 constitutes a part of the base 21 (see FIG. 2) described above as a component of the window unit 40, the opening 42 opens the front wall of the housing 3. Can do.
  • a first O-ring 43 is disposed on the front surface of the window frame 41 so as to go around the periphery of the opening 42.
  • a second O-ring 44 is disposed on the rear surface of the window frame 41 so as to go around the periphery of the opening 42.
  • FIG. 5 is a sectional view of the first O-ring 43 along the length direction
  • FIG. 6 is a sectional view of the second O-ring 44 along the length direction.
  • the cross-sectional shapes of the first O-ring 43 and the second O-ring 44 are convex.
  • the arrows indicate the front-rear direction of the window unit 40, that is, the advancing / retreating direction of the FOUP 9 and the door portion 51, which will be described later.
  • the dimension L ⁇ b> 1 indicates the height dimension of the first O-ring 43 in the forward / backward direction of the door part 51.
  • the dimension L ⁇ b> 2 indicates the height dimension of the second O-ring 44 in the forward / backward direction of the door portion 51. That is, in this embodiment, the dimension L2 of the second O-ring 44 is larger than the dimension L1 of the first O-ring 43.
  • the opening 42 is slightly larger than the outer periphery of the cover body 32 of the FOUP 7, and the cover body 32 can be moved through the opening section 42. Further, in the state where the FOUP 7 is placed on the placing table 24, the front surface of the main body 31 that forms the periphery of the lid body 32 as a contact surface 31 b as shown in FIG. 7, and the window frame portion 41 through the first O-ring 43. Abuts on the front surface of (base 21). Thereby, when the FOUP 7 is attached to the window unit 40, the first O-ring 43 seals (closes) the periphery of the opening 42 (base 21) and the FOUP 7.
  • the above-described door portion 51 is in contact with the rear surface of the window frame portion 41 via the second O-ring 44. Thereby, the second O-ring 44 seals between the periphery of the opening 42 and the door portion 51.
  • the clamp units 45 are provided at a total of four locations that are spaced apart in the vertical direction on both sides of the window frame portion 41.
  • Each clamp unit 45 is generally composed of an engagement piece 46 and a cylinder 47 that operates the clamp piece 45, and presses the FOUP 7 toward the base 21 in a state where the FOUP 7 is attached to the window unit 40.
  • the tip When the engaging piece 46 jumps forward, the tip is directed upward, and when the engagement piece 46 is pulled backward, the tip is directed to the inner FOUP 7. With the clamping operation, the engagement piece 46 can be engaged with the flange projecting laterally from the FOUP 7 with the tip thereof facing inward.
  • the load port 4 includes an opening / closing mechanism 50 for opening / closing a window unit 40 configured to be attached with the FOUP 7.
  • the opening / closing mechanism 50 includes a door portion 51 for opening and closing the opening 42, a support frame 52 for supporting the door portion 51, and the support frame 52 in the front-rear direction via the slide support means 53.
  • a movable block 54 that is movably supported and a slide rail 55 that movably supports the movable block 54 with respect to the base main body 21b are provided.
  • the door unit 51 includes an adsorbing unit 56 (see FIG. 4) for adsorbing the lid body 32 of the FOUP 7, a latching operation for opening and closing the lid body 32 of the FOUP 7, and a connecting means 57 for holding the lid body 32. It has.
  • the door 51 can fix and release the lid 32 so that the lid 32 can be detached from the FOUP 7 and attached.
  • the connecting means 57 the lid 32 can be opened by performing an unlatching operation of the lid 32, and the lid 32 can be connected to the door portion 51 and integrated.
  • the connecting means 57 the lid 32 is latched by releasing the connection between the lid 32 and the door 51, and the lid 32 is attached to the main body 31 to be closed. You can also.
  • the door 51 when the FOUP 7 is attached to the window unit 40, the door 51 includes a gas injection nozzle 73 that injects nitrogen gas between the FOUP 7 and the door 51, and the FOUP 7 and the door 51. And a gas exhaust nozzle 74 for exhausting the nitrogen gas between them.
  • the upper end of the gas injection nozzle 73 extends to the outer surface of the door portion 51, and the lower end is connected to a gas supply device (not shown).
  • the upper end of the gas discharge nozzle 74 extends to the outer surface of the door portion 51, and the lower end is connected to a gas discharge device (not shown).
  • the gas injection nozzle 73 communicates with the sealed space Sd (see FIG. 7) to supply nitrogen, and the gas discharge nozzle 74 communicates with the sealed space Sd.
  • the sealed space Sd can be replaced and filled with nitrogen.
  • an actuator for causing the door portion 51 to move in the front-rear direction and the vertical direction is provided in each direction, and a drive command from the control unit Cp is given thereto. Thereby, the door part 51 can be moved now in the front-back direction and an up-down direction. As described above, the load port 4 is operated when a drive command is given to each unit by the control unit Cp.
  • the input side of the controller Cp is connected to a positioning sensor 60, a door position detection sensor 81, a mounting table detection sensor 82, and an atmosphere sensor 83.
  • the positioning sensor 60 detects whether the FOUP 7 is positioned at an appropriate position on the mounting table 24.
  • the door position detection sensor 81 detects the forward / backward position of the door part 51.
  • the mounting table detection sensor 82 detects the position of the mounting table 24 in the advance / retreat direction.
  • the atmosphere sensor 83 detects the humidity and oxygen concentration in the sealed space Sd and detects whether or not the sealed space Sd is replaced with nitrogen.
  • the output side of the control unit Cp is connected to the mounting table drive unit 85, the door drive unit 86, the clamp unit drive unit 87, the gas supply device 88, and the gas discharge device 89.
  • the gas supply device 88 is connected to the gas injection nozzle 73 and supplies nitrogen to the sealed space Sd.
  • the gas exhaust device 89 is connected to the gas exhaust nozzle 74 and exhausts nitrogen from the sealed space Sd.
  • an unillustrated overhead traveling unmanned transfer machine places the FOUP 7 on the container delivery position of the placement table 24.
  • the container delivery position refers to a position where the FOUP 7 can be placed on the placement table 24 within the movement range of the placement table 24.
  • the door portion 51 is arranged at the door closing position.
  • the door closing position means that the door portion 51 is in contact with the second seal member 44 and the end surface 51a of the door portion 51 on the FOUP 7 side is closer to the FOUP 7 side than the contact surface of the door portion 51 and the second seal member 44.
  • the end surface 51 a of the door portion 51 is located on the FOUP 7 side of the base 21 of the load port 4 and is in the range of the dimension in the front-rear direction of the first O-ring 43.
  • step S2 the positioning sensor 60 detects whether or not the FOUP 7 has been positioned at an appropriate position on the mounting table 24. If FOUP 7 is not properly positioned, an error is sent to the host controller and repeated.
  • the door retracting position refers to a position where the door 51 is retracted in the opposite direction to the FOUP 7 from the door closing position (initial position) and the door 51 is in contact with the second seal member 44.
  • the door 51 moves forward from the rear of the load port 4 toward the front, and retracts from the front of the load port 4 toward the rear. These forward and backward directions are horizontal directions.
  • the door position detection sensor 81 detects whether or not the door portion 51 has been retracted to the door retract position.
  • step S4 the mounting table driving unit 85 advances the mounting table 24 and the FOUP 7 from the container delivery position to the door opening / closing position (see FIG. 11).
  • the door opening / closing position refers to a position in the moving range of the door portion 51 where the connecting member 57 fixes or releases the lid 32 to the FOUP 7 and attaches / detaches the lid 32.
  • the amount of movement of the FOUP 7 from the container delivery position to the door opening / closing position is 71 mm.
  • the mounting table detection sensor 82 detects whether or not the mounting table 24 has moved to the door opening / closing position. When the mounting table detection sensor 82 detects that the mounting table 24 is in the door opening / closing position, the clamp unit 45 is operated by a signal from the clamp unit driving unit 87.
  • the FOUP 7 is pulled toward the load port 4, and the sealing performance between the FOUP 7, the base 21, and the first O-ring 43 is improved.
  • the FOUP 7 advances from the front of the load port 4 toward the rear, and retracts (retreats) from the rear of the load port 4 to the front. These forward and backward directions are horizontal directions.
  • the sealed space Sd is formed.
  • the sealed space Sd is formed by the base 21, the first seal member 43, the second seal member 44, the lid body 32, the FOUP 7, and the door portion 51.
  • the sealed space Sd is replaced with nitrogen gas from the atmosphere by the gas injection nozzle 73 and the gas discharge nozzle 74.
  • the atmosphere sensor 83 detects whether or not the sealed space Sd is replaced with nitrogen gas.
  • step S6 the door drive unit 86 advances the door unit 51 toward the FOUP 7 from the door retracted position to the door opening / closing position (door advance position) (see FIG. 12).
  • the door 51 and the lid 32 come into contact with each other, and the connecting means 57 releases the fixation of the lid 32 to the FOUP 7 and holds the lid 32.
  • the distance between the door retracting position and the door opening / closing position is set to 3 mm.
  • step S7 the door drive unit 86 moves the door 51 and the lid 32 held by the door 51 from the door opening / closing position to the door opening position, and opens the opening 42 of the load port 4 (see FIG. 13).
  • the door opening position refers to a position where the opening 42 is opened and the wafer transfer apparatus 2 can access the FOUP 7. In this state, the wafer transfer device 2 takes out and takes in the wafer W in the FOUP 7.
  • the door drive unit 86 moves the door unit 51 from the door opening position to the door opening / closing position in step S8.
  • the connecting means 57 attaches and fixes the lid 32 to the FOUP 7.
  • the fixing of the FOUP 7 and the load port 4 by the clamp unit 45 is released, and in step S9, the mounting table driving unit 85 retracts the mounting table 24 and the FOUP 7 to the container delivery position.
  • the load port 4 of this embodiment has the following features.
  • the door portion 51 comes into contact with the second seal member 44, and the end surface 51 a on the FOUP 7 side of the door portion 51 is connected to the door portion 51.
  • the door 51 is retracted in the opposite direction to the FOUP 7 from the initial position on the FOUP 7 side of the contact surface with the two seal members 43.
  • the door portion 51 is in contact with the second seal member 44 at the door retracted position where the door portion 51 is retracted. Accordingly, when the FOUP 7 is moved toward the door portion 51 and the FOUP 7 comes into contact with the first seal member 43, at least the base, the first seal member 43, the second seal member 44, the lid body 32, and the door portion. 51 can form a sealed space Sd.
  • the door 51 is advanced from the retracted position toward the FOUP 7.
  • the FOUP 7 and the door portion 51 are brought close to each other, and the connecting means 57 of the door portion 51 performs the release of the fixing of the lid body 32 to the FOUP 7 so that the lid body 32 can be removed from the FOUP 7.
  • the door 51 is in contact with the lid 32 at the door advance position where the door 51 is advanced.
  • the connection means 57 of the door part 51 reliably releases the fixing of the lid body 32 to the FOUP 7, and the lid body 32 can be detached from the FOUP 7.
  • the sealed space Sd is filled with nitrogen gas. Therefore, the atmosphere does not enter the transfer space 9.
  • the size of the second seal member 44 in the direction in which the door portion 51 advances and retracts is larger than the size of the first seal member 43 in the direction in which the door portion 51 advances and retracts.
  • each configuration of the second embodiment such as the load port 4 is the same as that of the first embodiment, and the description thereof is omitted.
  • the dimension L2 of the second O-ring 44 is larger than the dimension L1 of the first O-ring 43.
  • the second embodiment differs from the first embodiment in that the dimension L1 of the first O-ring 43 is larger than the dimension L2 of the second O-ring 44.
  • step S ⁇ b> 11 shown in FIG. 16 an unillustrated overhead traveling unmanned transporter places the FOUP 7 at the container delivery position of the placement table 24.
  • the door push-out mechanism 90 includes a cylinder 91, a rod 92 that can project and retract from the cylinder 91, and a roller 93 that is rotatably provided at the tip of the rod 92 as main components.
  • the cylinder 91 is attached to a pedestal 94 that can be arranged with an inclination from the base 21 so that the roller 93 can be appropriately pressed against the door portion 51.
  • step S12 the positioning sensor 60 detects whether or not the FOUP 7 is positioned at an appropriate position on the mounting table 24. Repeat if FOUP 7 is not properly positioned.
  • step S13 the mounting table 24 and the FOUP 7 advance toward the door 51 from the container delivery position to the container retracting position (see FIG. 17).
  • the container retracted position refers to a position where the FOUP 7 is in contact with the first O-ring 43 and the end surface on the FOUP 7 side of the door portion 51 in contact with the second O-ring 44 is separated from the FOUP 7 by a predetermined distance.
  • the container retraction position is located between a container opening / closing position and a container delivery position, which will be described later.
  • the sealed space Sd is replaced with nitrogen gas from the atmosphere by the gas injection nozzle 73 and the gas discharge nozzle 74 and is filled in step S14.
  • step S15 the mounting table driving unit 85 advances the mounting table 24 and the FOUP 7 toward the door 51 from the container retracting position to the container opening / closing position (container advance position) (see FIG. 18).
  • the container opening / closing position refers to a position in the movement range of the mounting table 24 where the wafer transfer device 2 can take out the wafer W in the FOUP 7 through the opening 42.
  • the FOUP 7 is in the container opening / closing position, the door 51 and the lid 32 come into contact with each other, and the connecting means 57 releases the fixation of the lid 32 to the FOUP 7 and holds the lid 32.
  • the amount of movement of the FOUP 7 from the container retracting position to the container opening / closing position is set to 8 mm.
  • step S16 the door 51 and the lid 32 are moved from the door opening / closing position to the door opening position.
  • the wafer transfer device 2 takes out and takes in the wafer W in the FOUP 7.
  • step S17 the door driving unit 86 moves the door unit 51 from the door opening position to the door opening / closing position.
  • the connecting means 57 attaches the lid 32 to the FOUP 7 and operates the door clamp.
  • step S18 the mounting table driving unit 85 moves the mounting table 24 and the FOUP 7 backward to the container delivery position.
  • the load port 4 of this embodiment has the following features.
  • the door from which the FOUP 7 contacts the first O-ring 43 and the second O-ring 44 from the mounting position is advanced toward the door portion 51 to the container retracting position where the end surface of the portion 51 on the FOUP 7 side and the FOUP 7 are separated from each other by a predetermined distance.
  • the FOUP 7 is advanced from the container retracted position toward the door portion 51. Thereby, the FOUP 7 and the door part 51 are brought close to each other, and the adhering part 56 of the door part 51 performs the release of the fixing of the lid body 32 to the FOUP 7 so that the lid body 32 can be detached from the ROUP 7.
  • the lid 32 is in contact with the door portion 51 at the container advance position where the FOUP 7 has been advanced.
  • suction part 56 of the door part 51 reliably cancels
  • the sealed space Sd is filled with nitrogen gas. Therefore, the atmosphere does not enter the transfer space 9.
  • each configuration of the third embodiment for example, the load port 4 is the same as that of the first embodiment, and the description thereof is omitted.
  • the dimension L2 of the second O-ring 44 is larger than the dimension L1 of the first O-ring 43.
  • the third embodiment shown in FIGS. 19 and 20 differs from the first embodiment in that the dimension L1 of the first O-ring 43 and the dimension L2 of the second O-ring 44 are substantially equal.
  • step S21 shown in FIG. 21 the overhead traveling unmanned transfer machine (not shown) places the FOUP 7 on the container delivery position of the mounting table 24.
  • step S22 the positioning sensor 60 detects whether or not the FOUP 7 is positioned at an appropriate position on the mounting table 24. Repeat if FOUP 7 is not properly positioned.
  • step S23 the process proceeds to step S23, and the door 51 is moved backward from the door closing position to the door retracting position (see FIG. 22).
  • step S24 the mounting table 24 and the FOUP 7 are advanced from the container delivery position to the container retracting position. Therefore, contact between the door 51 and the lid 32 can be reliably prevented in a state where the door 51 is in contact with the second O-ring 44 and the FOUP 7 is in contact with the first O-ring 43.
  • the distance between the door closing position and the door retracting position is preferably 4 mm or less.
  • the sealed space Sd is replaced with nitrogen gas from the atmosphere by the gas injection nozzle 73 and the gas discharge nozzle 74 in step S25 and filled.
  • step S26 the mounting table 24 and the FOUP 7 are moved closer to the door 51 from the container mounting position. In other words, the mounting table 24 and the FOUP 7 are moved forward toward the door portion 51.
  • step S27 the door 51 is moved closer to the FOUP 7 from the door retracted position. In other words, the door part 51 is moved forward toward the FOUP 7.
  • step S26 and step S27 as shown in FIG. 23, the cover body 32 and the door part 51 contact. At this time, even if the lid body 32 and the door portion 51 come into contact with each other by setting the driving force of the mounting table driving portion 85 and the closing force of the door portion 51 of the door driving portion 86 equal, the lid body 32. Further, it is possible to prevent any one of the door portion 51 from being inclined.
  • the connecting means 57 releases the fixation of the lid body 32 to the FOUP 7 and holds the lid body 32.
  • step S28 the door driving unit 86 moves the door 51 and the lid 32 to the door opening position.
  • the mounting table 24 is advanced toward the door portion 51 and moved to a predetermined position where the wafer W can be taken out. In this state, the wafer transfer device 2 takes out and takes in the wafer W in the FOUP 7.
  • step S29 the door driving unit 86 moves the door unit 51 from the door opening position to the door opening / closing position.
  • the connecting means 57 attaches the lid body 32 to the FOUP 7 and operates the door clamp.
  • step S30 the mounting table driving unit 85 moves the mounting table 24 and the FOUP 7 back to the container delivery position.
  • the load port 4 of the above embodiment is provided in the EFEM 1.
  • the present invention is not limited to these, and a sorter device that can be directly applied to a processing apparatus without passing through the EFEM 1, exchange or rearrange the wafers W in the FOUP 7, and a stocker apparatus that temporarily stores the wafers W in the FOUP 7. Can be applied to.
  • the FOUP 7 is exemplarily used as a container, but is not limited thereto.
  • a MAC (Multi Application Carrier) or FOSB (Front Opening Shipping Shipping Box) used for wafer transfer may be used as the container.
  • the present invention may be applied to a container for transferring an article for which a predetermined environment is desired to be maintained rather than outside air.
  • the wafer W is exemplified as the stored item stored in the container, but the present invention is not limited to this.
  • a substrate used for an electronic component or a flat panel display, a cell culture container for storing cells, and the like may be stored.
  • nitrogen is used as the gas, but the present invention is not limited to this.
  • a desired environmental gas such as dry gas or argon gas can be used.
  • the door position detection sensor 81 detects whether the door portion 51 has been retracted to the door retract position.
  • the present invention is not limited to this, and it may be detected from the driving state of the door driving unit 86, or may be detected based on whether a predetermined time has elapsed by a timer.
  • the mounting table detection sensor 82 detects whether or not the mounting table 24 has moved to the dock position.
  • the present invention is not limited to this, and it may be detected by a signal from the mounting table driving unit 85 or may be detected by whether a predetermined time has elapsed by a timer.
  • the atmosphere sensor 83 detects whether or not the sealed space Sd is replaced with nitrogen gas.
  • the present invention is not limited to this, and it may be detected by a timer whether a predetermined time has elapsed.
  • the nitrogen gas is ejected from the gas injection unit 70.
  • the present invention is not limited to this, and the atmosphere around the door portion 51 may be exhausted from the gas exhaust portion 71 at the same time.
  • the material of the first O-ring 43 and the second O-ring 44 is not particularly limited.
  • the sealing member may be an elastic member such as an O-ring made of fluorine rubber or silicon rubber, or a sponge made of ethylene propylene rubber such as EPDM (ethylene-propylene-diene-monomer).
  • an O-ring made of fluorine rubber or silicon rubber a hollow structure may be used in order to give elasticity.
  • the sealing performance and the contact position of other members can be adjusted by supplying or discharging gas into the hollow portion.
  • the first O-ring 43 and the second O-ring 44 having a convex section are employed.
  • the present invention is not limited to this, and as shown in FIG. 24, a sealing member having a thin plate-like cross section that gently curves may be used. As a result, the atmosphere in the sealed space Sd is less likely to enter the transfer space 9, and air outside the FOUP 7 can be prevented from entering the sealed space Sd.
  • the first O-ring 43 and the second O-ring 44 which are separate bodies are employed.
  • the integrated O-ring 43 that seals the sealed space Sd is mounted by being attached to the opening edge of the base 21 and having one end in contact with the FOUP 7 and the other end in contact with the door portion 51. It may be adopted.
  • a sealed space Sd is formed by the O-ring 43, the lid body 32, and the door portion 51, in which at least the first O-ring and the second O-ring are integrated.
  • the lid 32 protrudes from the contact surface 31b of the FOUP 7 toward the load port 4, and this protrusion amount is set to ⁇ 5 mm with respect to the designed dimension, for example. Further, the amount by which the lid 32 protrudes when nitrogen gas is injected into the FOUP 7 is set to about 3 mm.
  • attachment and detachment of the lid body 32 to the FOUP 7 are performed by moving the door portion 51 relative to the FOUP 7 with the door portion 51 holding the lid body 32.
  • the present invention is not limited thereto, and the lid 32 is attached to the FOUP 7 by moving the mounting table 24 and the FOUP 7 to the positions shown in FIG. 17 in a state in which the door portion 51 fixes the lid 32 (see FIG. 18). And may be removed. Further, both the mounting table 24 and the door portion 51 may be moved to attach and remove the lid 32 from the FOUP 7. In other words, the lid 32 may be attached and removed by changing the relative distance between the FOUP 7 and the lid 32.
  • the present invention can also be applied to a load port in which the first O-ring 43 and the second O-ring 44 are not provided.
  • this load port the configuration other than the first O-ring 43 and the second O-ring 44 is the same as that of the above-described embodiment, so that the description thereof is omitted.
  • Patent Document 1 exemplified as the prior document of the present application
  • the distance between the door and the FOUP can be relatively adjusted before the latch operation by moving at least one of the door and the FOUP to the retracted position.
  • this effect also occurs in the embodiment in which the first O-ring 43 and the second O-ring 44 are provided.
  • the present invention can also be applied to a load port provided with only one of the first O ring 43 and the second O ring 44.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Glass Compositions (AREA)
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PCT/JP2017/010657 2016-03-29 2017-03-16 ロードポート WO2017169847A1 (ja)

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CN202311642084.4A CN117690840A (zh) 2016-03-29 2017-03-16 装载端口
KR1020187028448A KR102350964B1 (ko) 2016-03-29 2017-03-16 로드 포트
CN202311642083.XA CN117690839A (zh) 2016-03-29 2017-03-16 装载端口
KR1020227043091A KR20230004889A (ko) 2016-03-29 2017-03-16 로드 포트
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CN111430264A (zh) * 2019-08-16 2020-07-17 合肥晶合集成电路有限公司 半导体加工设备及其装载晶圆盒的控制方法
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TWI790491B (zh) 2023-01-21
CN117690841A (zh) 2024-03-12
TWI710040B (zh) 2020-11-11
JP2017183408A (ja) 2017-10-05
KR20220005637A (ko) 2022-01-13
JP6687840B2 (ja) 2020-04-28
KR20180128922A (ko) 2018-12-04
TW202109707A (zh) 2021-03-01
KR102350964B1 (ko) 2022-01-14
CN108886012A (zh) 2018-11-23
KR102477013B1 (ko) 2022-12-14
CN108886012B (zh) 2023-12-19
KR20230004889A (ko) 2023-01-06
TW201735212A (zh) 2017-10-01
TW202316547A (zh) 2023-04-16
CN117690839A (zh) 2024-03-12

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