JP6687840B2 - ロードポート - Google Patents

ロードポート Download PDF

Info

Publication number
JP6687840B2
JP6687840B2 JP2016066084A JP2016066084A JP6687840B2 JP 6687840 B2 JP6687840 B2 JP 6687840B2 JP 2016066084 A JP2016066084 A JP 2016066084A JP 2016066084 A JP2016066084 A JP 2016066084A JP 6687840 B2 JP6687840 B2 JP 6687840B2
Authority
JP
Japan
Prior art keywords
door
container
foup
seal member
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016066084A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017183408A (ja
Inventor
辰弥 三浦
辰弥 三浦
源五郎 小倉
源五郎 小倉
貴司 重田
貴司 重田
小笠原　幸雄
幸雄 小笠原
俊宏 河合
俊宏 河合
育志 谷山
育志 谷山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Priority to JP2016066084A priority Critical patent/JP6687840B2/ja
Priority to TW105128477A priority patent/TWI710040B/zh
Priority to TW111149272A priority patent/TW202316547A/zh
Priority to TW109136418A priority patent/TWI790491B/zh
Priority to CN201780021499.6A priority patent/CN108886012B/zh
Priority to CN202311642083.XA priority patent/CN117690839A/zh
Priority to PCT/JP2017/010657 priority patent/WO2017169847A1/ja
Priority to KR1020187028448A priority patent/KR102350964B1/ko
Priority to CN202311642084.4A priority patent/CN117690840A/zh
Priority to KR1020227043091A priority patent/KR20230004889A/ko
Priority to KR1020227000190A priority patent/KR102477013B1/ko
Priority to CN202311642085.9A priority patent/CN117690841A/zh
Publication of JP2017183408A publication Critical patent/JP2017183408A/ja
Priority to JP2020057237A priority patent/JP6947993B2/ja
Application granted granted Critical
Publication of JP6687840B2 publication Critical patent/JP6687840B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Glass Compositions (AREA)
  • Paper (AREA)
JP2016066084A 2016-03-29 2016-03-29 ロードポート Active JP6687840B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2016066084A JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート
TW111149272A TW202316547A (zh) 2016-03-29 2016-09-02 裝載埠
TW109136418A TWI790491B (zh) 2016-03-29 2016-09-02 裝載埠
TW105128477A TWI710040B (zh) 2016-03-29 2016-09-02 裝載埠
CN202311642085.9A CN117690841A (zh) 2016-03-29 2017-03-16 装载端口
PCT/JP2017/010657 WO2017169847A1 (ja) 2016-03-29 2017-03-16 ロードポート
CN201780021499.6A CN108886012B (zh) 2016-03-29 2017-03-16 装载端口
CN202311642084.4A CN117690840A (zh) 2016-03-29 2017-03-16 装载端口
KR1020227043091A KR20230004889A (ko) 2016-03-29 2017-03-16 로드 포트
KR1020227000190A KR102477013B1 (ko) 2016-03-29 2017-03-16 로드 포트
CN202311642083.XA CN117690839A (zh) 2016-03-29 2017-03-16 装载端口
KR1020187028448A KR102350964B1 (ko) 2016-03-29 2017-03-16 로드 포트
JP2020057237A JP6947993B2 (ja) 2016-03-29 2020-03-27 ロードポート及び搬送室

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016066084A JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020057237A Division JP6947993B2 (ja) 2016-03-29 2020-03-27 ロードポート及び搬送室

Publications (2)

Publication Number Publication Date
JP2017183408A JP2017183408A (ja) 2017-10-05
JP6687840B2 true JP6687840B2 (ja) 2020-04-28

Family

ID=59964393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016066084A Active JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート

Country Status (5)

Country Link
JP (1) JP6687840B2 (zh)
KR (3) KR102477013B1 (zh)
CN (4) CN117690840A (zh)
TW (3) TWI790491B (zh)
WO (1) WO2017169847A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101831202B1 (ko) 2017-12-20 2018-02-22 주식회사 싸이맥스 로드포트의 포트도어 구동장치
JP7125591B2 (ja) * 2018-04-04 2022-08-25 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ
CN111430264A (zh) * 2019-08-16 2020-07-17 合肥晶合集成电路有限公司 半导体加工设备及其装载晶圆盒的控制方法
US20230054047A1 (en) * 2021-08-23 2023-02-23 Brillian Network & Automation Integrated System Co., Ltd. Purge controlling system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
JP3556185B2 (ja) * 2000-06-13 2004-08-18 信越ポリマー株式会社 シール部材、密封容器及びそのシール方法
JP3982395B2 (ja) * 2002-11-25 2007-09-26 株式会社安川電機 ロードポート
FR2874744B1 (fr) * 2004-08-30 2006-11-24 Cit Alcatel Interface sous vide entre une boite de mini-environnement et un equipement
JP2006216913A (ja) * 2005-02-07 2006-08-17 Seiko Epson Corp 基板収納容器、基板搬送装置、基板搬送方法及び半導体製造装置
US7758338B2 (en) * 2007-05-29 2010-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate carrier, port apparatus and facility interface and apparatus including same
JP2009088437A (ja) * 2007-10-03 2009-04-23 Tokyo Electron Ltd 被処理体の導入ポート機構及び処理システム
JP5263587B2 (ja) * 2008-08-07 2013-08-14 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び蓋開閉方法
JP5736686B2 (ja) * 2010-08-07 2015-06-17 シンフォニアテクノロジー株式会社 ロードポート
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
JP6024980B2 (ja) * 2012-10-31 2016-11-16 Tdk株式会社 ロードポートユニット及びｅｆｅｍシステム
JP6260109B2 (ja) * 2013-05-16 2018-01-17 シンフォニアテクノロジー株式会社 ロードポート装置
JP6291878B2 (ja) * 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ

Also Published As

Publication number Publication date
WO2017169847A1 (ja) 2017-10-05
JP2017183408A (ja) 2017-10-05
KR20220005637A (ko) 2022-01-13
CN108886012B (zh) 2023-12-19
CN108886012A (zh) 2018-11-23
KR20230004889A (ko) 2023-01-06
TW202109707A (zh) 2021-03-01
KR20180128922A (ko) 2018-12-04
TW202316547A (zh) 2023-04-16
TWI710040B (zh) 2020-11-11
TW201735212A (zh) 2017-10-01
KR102350964B1 (ko) 2022-01-14
KR102477013B1 (ko) 2022-12-14
CN117690840A (zh) 2024-03-12
CN117690841A (zh) 2024-03-12
CN117690839A (zh) 2024-03-12
TWI790491B (zh) 2023-01-21

Similar Documents

Publication Publication Date Title
JP7164824B2 (ja) ドア開閉システムおよびドア開閉システムを備えたロードポート
JP7193748B2 (ja) ロードポート
JP7100243B2 (ja) 排気ノズルユニット、ロードポート、及びｅｆｅｍ
TW201633436A (zh) 門開閉裝置、搬運裝置、分類裝置、收納容器之開放方法
TW201718108A (zh) 氣體注入裝置
JP6687840B2 (ja) ロードポート
TW201641387A (zh) 門開閉裝置、搬送裝置、分類裝置、及收納容器的連結方法
JP2020150091A (ja) Ｅｆｅｍ
TWI715624B (zh) 噴嘴單元
TWI803613B (zh) 裝載端口以及設備前端模組
JP6947993B2 (ja) ロードポート及び搬送室
KR102679603B1 (ko) 도어 개폐 시스템 및 도어 개폐 시스템을 구비한 로드 포트
KR20240104209A (ko) 도어 개폐 시스템 및 도어 개폐 시스템을 구비한 로드 포트

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200110

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200316

R150 Certificate of patent or registration of utility model

Ref document number: 6687840

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250