JP6687840B2 - ロードポート - Google Patents

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Publication number
JP6687840B2
JP6687840B2 JP2016066084A JP2016066084A JP6687840B2 JP 6687840 B2 JP6687840 B2 JP 6687840B2 JP 2016066084 A JP2016066084 A JP 2016066084A JP 2016066084 A JP2016066084 A JP 2016066084A JP 6687840 B2 JP6687840 B2 JP 6687840B2
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JP
Japan
Prior art keywords
door
container
foup
seal member
lid
Prior art date
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Active
Application number
JP2016066084A
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English (en)
Japanese (ja)
Other versions
JP2017183408A (ja
Inventor
辰弥 三浦
辰弥 三浦
源五郎 小倉
源五郎 小倉
貴司 重田
貴司 重田
小笠原 幸雄
幸雄 小笠原
俊宏 河合
俊宏 河合
育志 谷山
育志 谷山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Priority to JP2016066084A priority Critical patent/JP6687840B2/ja
Priority to TW105128477A priority patent/TWI710040B/zh
Priority to TW111149272A priority patent/TW202316547A/zh
Priority to TW109136418A priority patent/TWI790491B/zh
Priority to CN201780021499.6A priority patent/CN108886012B/zh
Priority to CN202311642083.XA priority patent/CN117690839A/zh
Priority to PCT/JP2017/010657 priority patent/WO2017169847A1/ja
Priority to KR1020187028448A priority patent/KR102350964B1/ko
Priority to CN202311642084.4A priority patent/CN117690840A/zh
Priority to KR1020227043091A priority patent/KR20230004889A/ko
Priority to KR1020227000190A priority patent/KR102477013B1/ko
Priority to CN202311642085.9A priority patent/CN117690841A/zh
Publication of JP2017183408A publication Critical patent/JP2017183408A/ja
Priority to JP2020057237A priority patent/JP6947993B2/ja
Application granted granted Critical
Publication of JP6687840B2 publication Critical patent/JP6687840B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Glass Compositions (AREA)
  • Paper (AREA)
JP2016066084A 2016-03-29 2016-03-29 ロードポート Active JP6687840B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2016066084A JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート
TW111149272A TW202316547A (zh) 2016-03-29 2016-09-02 裝載埠
TW109136418A TWI790491B (zh) 2016-03-29 2016-09-02 裝載埠
TW105128477A TWI710040B (zh) 2016-03-29 2016-09-02 裝載埠
CN202311642085.9A CN117690841A (zh) 2016-03-29 2017-03-16 装载端口
PCT/JP2017/010657 WO2017169847A1 (ja) 2016-03-29 2017-03-16 ロードポート
CN201780021499.6A CN108886012B (zh) 2016-03-29 2017-03-16 装载端口
CN202311642084.4A CN117690840A (zh) 2016-03-29 2017-03-16 装载端口
KR1020227043091A KR20230004889A (ko) 2016-03-29 2017-03-16 로드 포트
KR1020227000190A KR102477013B1 (ko) 2016-03-29 2017-03-16 로드 포트
CN202311642083.XA CN117690839A (zh) 2016-03-29 2017-03-16 装载端口
KR1020187028448A KR102350964B1 (ko) 2016-03-29 2017-03-16 로드 포트
JP2020057237A JP6947993B2 (ja) 2016-03-29 2020-03-27 ロードポート及び搬送室

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016066084A JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020057237A Division JP6947993B2 (ja) 2016-03-29 2020-03-27 ロードポート及び搬送室

Publications (2)

Publication Number Publication Date
JP2017183408A JP2017183408A (ja) 2017-10-05
JP6687840B2 true JP6687840B2 (ja) 2020-04-28

Family

ID=59964393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016066084A Active JP6687840B2 (ja) 2016-03-29 2016-03-29 ロードポート

Country Status (5)

Country Link
JP (1) JP6687840B2 (zh)
KR (3) KR102477013B1 (zh)
CN (4) CN117690840A (zh)
TW (3) TWI790491B (zh)
WO (1) WO2017169847A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101831202B1 (ko) 2017-12-20 2018-02-22 주식회사 싸이맥스 로드포트의 포트도어 구동장치
JP7125591B2 (ja) * 2018-04-04 2022-08-25 シンフォニアテクノロジー株式会社 ロードポート及びefem
CN111430264A (zh) * 2019-08-16 2020-07-17 合肥晶合集成电路有限公司 半导体加工设备及其装载晶圆盒的控制方法
US20230054047A1 (en) * 2021-08-23 2023-02-23 Brillian Network & Automation Integrated System Co., Ltd. Purge controlling system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
JP3556185B2 (ja) * 2000-06-13 2004-08-18 信越ポリマー株式会社 シール部材、密封容器及びそのシール方法
JP3982395B2 (ja) * 2002-11-25 2007-09-26 株式会社安川電機 ロードポート
FR2874744B1 (fr) * 2004-08-30 2006-11-24 Cit Alcatel Interface sous vide entre une boite de mini-environnement et un equipement
JP2006216913A (ja) * 2005-02-07 2006-08-17 Seiko Epson Corp 基板収納容器、基板搬送装置、基板搬送方法及び半導体製造装置
US7758338B2 (en) * 2007-05-29 2010-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate carrier, port apparatus and facility interface and apparatus including same
JP2009088437A (ja) * 2007-10-03 2009-04-23 Tokyo Electron Ltd 被処理体の導入ポート機構及び処理システム
JP5263587B2 (ja) * 2008-08-07 2013-08-14 Tdk株式会社 密閉容器の蓋開閉システム及び蓋開閉方法
JP5736686B2 (ja) * 2010-08-07 2015-06-17 シンフォニアテクノロジー株式会社 ロードポート
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
JP6024980B2 (ja) * 2012-10-31 2016-11-16 Tdk株式会社 ロードポートユニット及びefemシステム
JP6260109B2 (ja) * 2013-05-16 2018-01-17 シンフォニアテクノロジー株式会社 ロードポート装置
JP6291878B2 (ja) * 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びefem

Also Published As

Publication number Publication date
WO2017169847A1 (ja) 2017-10-05
JP2017183408A (ja) 2017-10-05
KR20220005637A (ko) 2022-01-13
CN108886012B (zh) 2023-12-19
CN108886012A (zh) 2018-11-23
KR20230004889A (ko) 2023-01-06
TW202109707A (zh) 2021-03-01
KR20180128922A (ko) 2018-12-04
TW202316547A (zh) 2023-04-16
TWI710040B (zh) 2020-11-11
TW201735212A (zh) 2017-10-01
KR102350964B1 (ko) 2022-01-14
KR102477013B1 (ko) 2022-12-14
CN117690840A (zh) 2024-03-12
CN117690841A (zh) 2024-03-12
CN117690839A (zh) 2024-03-12
TWI790491B (zh) 2023-01-21

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