JP6687840B2 - ロードポート - Google Patents
ロードポート Download PDFInfo
- Publication number
- JP6687840B2 JP6687840B2 JP2016066084A JP2016066084A JP6687840B2 JP 6687840 B2 JP6687840 B2 JP 6687840B2 JP 2016066084 A JP2016066084 A JP 2016066084A JP 2016066084 A JP2016066084 A JP 2016066084A JP 6687840 B2 JP6687840 B2 JP 6687840B2
- Authority
- JP
- Japan
- Prior art keywords
- door
- container
- foup
- seal member
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012546 transfer Methods 0.000 claims description 47
- 238000007789 sealing Methods 0.000 claims description 17
- 239000007789 gas Substances 0.000 description 80
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 66
- 235000012431 wafers Nutrition 0.000 description 56
- 229910001873 dinitrogen Inorganic materials 0.000 description 26
- 229910052757 nitrogen Inorganic materials 0.000 description 21
- 239000012298 atmosphere Substances 0.000 description 18
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000004113 cell culture Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exchange Systems With Centralized Control (AREA)
- Glass Compositions (AREA)
- Paper (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016066084A JP6687840B2 (ja) | 2016-03-29 | 2016-03-29 | ロードポート |
TW111149272A TW202316547A (zh) | 2016-03-29 | 2016-09-02 | 裝載埠 |
TW109136418A TWI790491B (zh) | 2016-03-29 | 2016-09-02 | 裝載埠 |
TW105128477A TWI710040B (zh) | 2016-03-29 | 2016-09-02 | 裝載埠 |
CN202311642085.9A CN117690841A (zh) | 2016-03-29 | 2017-03-16 | 装载端口 |
PCT/JP2017/010657 WO2017169847A1 (ja) | 2016-03-29 | 2017-03-16 | ロードポート |
CN201780021499.6A CN108886012B (zh) | 2016-03-29 | 2017-03-16 | 装载端口 |
CN202311642084.4A CN117690840A (zh) | 2016-03-29 | 2017-03-16 | 装载端口 |
KR1020227043091A KR20230004889A (ko) | 2016-03-29 | 2017-03-16 | 로드 포트 |
KR1020227000190A KR102477013B1 (ko) | 2016-03-29 | 2017-03-16 | 로드 포트 |
CN202311642083.XA CN117690839A (zh) | 2016-03-29 | 2017-03-16 | 装载端口 |
KR1020187028448A KR102350964B1 (ko) | 2016-03-29 | 2017-03-16 | 로드 포트 |
JP2020057237A JP6947993B2 (ja) | 2016-03-29 | 2020-03-27 | ロードポート及び搬送室 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016066084A JP6687840B2 (ja) | 2016-03-29 | 2016-03-29 | ロードポート |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020057237A Division JP6947993B2 (ja) | 2016-03-29 | 2020-03-27 | ロードポート及び搬送室 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017183408A JP2017183408A (ja) | 2017-10-05 |
JP6687840B2 true JP6687840B2 (ja) | 2020-04-28 |
Family
ID=59964393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016066084A Active JP6687840B2 (ja) | 2016-03-29 | 2016-03-29 | ロードポート |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6687840B2 (zh) |
KR (3) | KR102477013B1 (zh) |
CN (4) | CN117690840A (zh) |
TW (3) | TWI790491B (zh) |
WO (1) | WO2017169847A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101831202B1 (ko) | 2017-12-20 | 2018-02-22 | 주식회사 싸이맥스 | 로드포트의 포트도어 구동장치 |
JP7125591B2 (ja) * | 2018-04-04 | 2022-08-25 | シンフォニアテクノロジー株式会社 | ロードポート及びefem |
CN111430264A (zh) * | 2019-08-16 | 2020-07-17 | 合肥晶合集成电路有限公司 | 半导体加工设备及其装载晶圆盒的控制方法 |
US20230054047A1 (en) * | 2021-08-23 | 2023-02-23 | Brillian Network & Automation Integrated System Co., Ltd. | Purge controlling system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
JP3556185B2 (ja) * | 2000-06-13 | 2004-08-18 | 信越ポリマー株式会社 | シール部材、密封容器及びそのシール方法 |
JP3982395B2 (ja) * | 2002-11-25 | 2007-09-26 | 株式会社安川電機 | ロードポート |
FR2874744B1 (fr) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | Interface sous vide entre une boite de mini-environnement et un equipement |
JP2006216913A (ja) * | 2005-02-07 | 2006-08-17 | Seiko Epson Corp | 基板収納容器、基板搬送装置、基板搬送方法及び半導体製造装置 |
US7758338B2 (en) * | 2007-05-29 | 2010-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier, port apparatus and facility interface and apparatus including same |
JP2009088437A (ja) * | 2007-10-03 | 2009-04-23 | Tokyo Electron Ltd | 被処理体の導入ポート機構及び処理システム |
JP5263587B2 (ja) * | 2008-08-07 | 2013-08-14 | Tdk株式会社 | 密閉容器の蓋開閉システム及び蓋開閉方法 |
JP5736686B2 (ja) * | 2010-08-07 | 2015-06-17 | シンフォニアテクノロジー株式会社 | ロードポート |
JP5617708B2 (ja) * | 2011-03-16 | 2014-11-05 | 東京エレクトロン株式会社 | 蓋体開閉装置 |
JP5993252B2 (ja) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
JP6024980B2 (ja) * | 2012-10-31 | 2016-11-16 | Tdk株式会社 | ロードポートユニット及びefemシステム |
JP6260109B2 (ja) * | 2013-05-16 | 2018-01-17 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
JP6291878B2 (ja) * | 2014-01-31 | 2018-03-14 | シンフォニアテクノロジー株式会社 | ロードポート及びefem |
-
2016
- 2016-03-29 JP JP2016066084A patent/JP6687840B2/ja active Active
- 2016-09-02 TW TW109136418A patent/TWI790491B/zh active
- 2016-09-02 TW TW111149272A patent/TW202316547A/zh unknown
- 2016-09-02 TW TW105128477A patent/TWI710040B/zh active
-
2017
- 2017-03-16 CN CN202311642084.4A patent/CN117690840A/zh active Pending
- 2017-03-16 KR KR1020227000190A patent/KR102477013B1/ko active IP Right Grant
- 2017-03-16 WO PCT/JP2017/010657 patent/WO2017169847A1/ja active Application Filing
- 2017-03-16 CN CN202311642085.9A patent/CN117690841A/zh active Pending
- 2017-03-16 KR KR1020227043091A patent/KR20230004889A/ko active IP Right Grant
- 2017-03-16 CN CN201780021499.6A patent/CN108886012B/zh active Active
- 2017-03-16 CN CN202311642083.XA patent/CN117690839A/zh active Pending
- 2017-03-16 KR KR1020187028448A patent/KR102350964B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2017169847A1 (ja) | 2017-10-05 |
JP2017183408A (ja) | 2017-10-05 |
KR20220005637A (ko) | 2022-01-13 |
CN108886012B (zh) | 2023-12-19 |
CN108886012A (zh) | 2018-11-23 |
KR20230004889A (ko) | 2023-01-06 |
TW202109707A (zh) | 2021-03-01 |
KR20180128922A (ko) | 2018-12-04 |
TW202316547A (zh) | 2023-04-16 |
TWI710040B (zh) | 2020-11-11 |
TW201735212A (zh) | 2017-10-01 |
KR102350964B1 (ko) | 2022-01-14 |
KR102477013B1 (ko) | 2022-12-14 |
CN117690840A (zh) | 2024-03-12 |
CN117690841A (zh) | 2024-03-12 |
CN117690839A (zh) | 2024-03-12 |
TWI790491B (zh) | 2023-01-21 |
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