WO2017168581A1

WO2017168581A1 - Light-emitting device

Info

Publication number: WO2017168581A1
Application number: PCT/JP2016/060200
Authority: WO
Inventors: 真滋中嶋; 幸二藤田
Original assignee: パイオニア株式会社; 東北パイオニア株式会社
Priority date: 2016-03-29
Filing date: 2016-03-29
Publication date: 2017-10-05

Abstract

According to the present invention, each of light-emitting parts (140) has a first side (142), a second side (144), a third side (146), and a fourth side (148). The first side (142) is defined by an insulating layer (150). The second side (144) is opposite to the first side (142) and is defined by the insulating layer (150). The third side (146) extends in the direction (Y-direction in the drawing) crossing the first side (142) and the second side (144) and is exposed from the insulating layer (150). The fourth side (148) is opposite to the third side (146) and is exposed from the insulating layer (150).

Description

Light emitting device

The present invention relates to a light emitting device.

In recent years, light emitting devices having an organic layer have been developed. Such a light emitting device may be used for a display, for example. In this case, the light emitting device has a substrate and a plurality of light emitting units on the substrate. Each light emitting unit includes a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode. More specifically, the light emitting device has a first conductive layer extending in the first direction and a second conductive layer extending in a second direction orthogonal to the first direction. The first conductive layer has a portion overlapping the second conductive layer. The second conductive layer has a portion overlapping the first conductive layer. The above-described portion of the first conductive layer functions as the first electrode of the light emitting unit. The above-described portion of the second conductive layer functions as the second electrode of the light emitting unit.

Patent Document 1 describes an insulating layer for defining each side of a light emitting portion. The insulating layer is on the substrate and the first conductive layer. The insulating layer is made of polyimide, for example. The insulating layer has an opening that exposes a part of the first conductive layer (a portion that functions as the first electrode of the light emitting portion). The second conductive layer is located on the insulating layer and on the opening so that a part of the second conductive layer (a part functioning as the second electrode of the light emitting unit) overlaps with the opening. In this case, each side of the light emitting unit is defined by the edge of the opening.

JP-A-11-97182

As described above, in the light emitting device, an insulating layer having an opening may be formed in order to define an edge (side) of the light emitting portion. On the other hand, when the present inventor examined, it became clear that the substance which degrades a light emission part may propagate through the above-mentioned insulating layer.

As an example of the problem to be solved by the present invention, even if an insulating layer is used to demarcate the sides of the light emitting portion, it is an example to suppress a substance that deteriorates the light emitting portion from being widely propagated through the insulating layer. As mentioned.

The invention described in claim 1
A substrate,
An insulating layer on the substrate;
A plurality of light emitting portions exposed from the insulating layer on the substrate, each having a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode;
With
The light emitting unit intersects the first side defined by the insulating layer, the second side defined by the insulating layer on the side opposite to the first side, and the first side and the second side. The light emitting device has a third side extending in a direction and exposed from the insulating layer.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

It is a top view which shows the light-emitting device which concerns on embodiment. It is the figure which removed the coating layer from FIG. FIG. 3 is a view in which a second conductive layer and a partition wall are removed from FIG. 2. It is the figure which removed the insulating layer from FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 3 is a sectional view taken along line BB in FIG. FIG. 3 is a cross-sectional view taken along the line CC of FIG. FIG. 3 is a DD sectional view of FIG. 2. It is the figure which expanded the opening shown in FIG. It is a figure which shows the modification of FIG. It is a figure which shows the 1st modification of FIG. It is a figure which shows the 2nd modification of FIG. 1 is a plan view showing a light emitting device according to Example 1. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 is a plan view showing a light emitting device 10 according to the embodiment. FIG. 2 is a view in which the covering layer 200 is removed from FIG. FIG. 3 is a diagram in which the second conductive layer 130a and the partition 160 are removed from FIG. FIG. 4 is a diagram in which the insulating layer 150 is removed from FIG. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 6 is a cross-sectional view taken along the line BB in FIG. 7 is a cross-sectional view taken along the line CC of FIG. FIG. 8 is a sectional view taken along the line DD of FIG. FIG. 9 is an enlarged view of the opening 152 shown in FIG.

As shown in FIG. 2, the light emitting device 10 includes a substrate 100, an insulating layer 150, and a plurality of light emitting units 140. As shown in FIGS. 5 and 8, the insulating layer 150 is on the substrate 100. As shown in FIG. 3, the plurality of light emitting units 140 are exposed from the insulating layer 150 on the substrate 100. As shown in FIGS. 5 and 6, each light emitting unit 140 is on the substrate 100. Each light emitting unit 140 includes a first electrode 110, an organic layer 120, and a second electrode 130. The organic layer 120 is between the first electrode 110 and the second electrode 130. As shown in FIG. 9, each light emitting unit 140 has a first side 142, a second side 144, a third side 146, and a fourth side 148. The first side 142 is defined by the insulating layer 150. The second side 144 is on the side opposite to the first side 142 and is defined by the insulating layer 150. The third side 146 extends in the direction intersecting the first side 142 and the second side 144 (the Y direction in the drawing) and is exposed from the insulating layer 150. The fourth side 148 is on the side opposite to the third side 146 and is exposed from the insulating layer 150.

In the example shown in FIG. 9, the light emitting units 140 adjacent to each other are arranged such that the third side 146 of one light emitting unit 140 and the fourth side 148 of the other light emitting unit 140 face each other. The substrate 100 is exposed from the insulating layer 150 between the light emitting units 140 adjacent to each other. More specifically, in the example shown in FIG. 9, the insulating layer 150 includes a first region 150a and a second region 150b. The first region 150a has a first edge 152a. The second region 150b has a second edge 152b. The first edge 152a and the second edge 152b are opposed to each other. In the example shown in FIG. 9, the first edge 152 a is a part (third edge) of the edge of the opening 152 of the insulating layer 150, and the second edge 152 b is the other edge of the opening 152 of the insulating layer 150. Part (fourth edge). A first side 142 of each light emitting unit 140 in the opening 152 is defined by a first edge 152a. The second side 144 of each light emitting unit 140 in the opening 152 is defined by the second edge 152b. Details will be described below.

In the example shown in FIGS. 1 to 9, the light emitting device 10 is a display. The light emitting device 10 includes a substrate 100, a conductive layer 170, a conductive layer 180, an insulating layer 150, an organic layer 120a, a second conductive layer 130a, a partition wall 160, and a coating layer 200.

As shown in FIGS. 5 to 8, the substrate 100 has a first surface 102 and a second surface 104. The second surface 104 is on the opposite side of the first surface 102 and is the back surface of the substrate 100. In the example shown in FIGS. 1 to 4, the shape of the first surface 102 is a rectangle. However, the shape of the first surface 102 may be a polygon other than a rectangle, for example.

The light emitting device 10 may be either bottom emission or top emission. When the light emitting device 10 is bottom emission, light from the plurality of light emitting units 140 is emitted from the second surface 104 of the substrate 100. In this case, the substrate 100 is made of a translucent material (for example, glass or resin). On the other hand, when the light emitting device 10 is top emission, the light from the plurality of light emitting units 140 is emitted from above the first surface 102 of the substrate 100. In this case, the substrate 100 may be made of the above-described translucent material or may be made of a material that does not have translucency.

The substrate 100 may have flexibility or may not have flexibility. When the substrate 100 has flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. When the substrate 100 has flexibility and includes glass, the thickness of the substrate 100 is, for example, 200 μm or less. When the substrate 100 is flexible and includes a resin, the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. The first surface 102 (preferably both the first surface 102 and the second surface 104) of the substrate 100 may be covered with an inorganic barrier film (eg, SiN _x or SiON). In this case, even if the substrate 100 includes a material (for example, resin) having a high water vapor transmission rate, the water vapor is prevented from reaching the first surface 102 of the substrate 100.

As shown in FIGS. 1 to 4, the plurality of conductive layers 170 are on the first surface 102 of the substrate 100. The plurality of conductive layers 170 include a plurality of conductive layers 170a and a plurality of conductive layers 170b. Each conductive layer 170 a includes a first conductive layer 110 a and a first wiring 114. The first conductive layer 110a is a part of the conductive layer 170a. The first wiring 114 is another part of the conductive layer 170a. The first conductive layer 110a and the first wiring 114 are connected to each other. Each conductive layer 170 b includes a second wiring 134.

The first terminal 112 is located at one end of the first wiring 114. A potential is applied to the first terminal 112. Thereby, the potential of the first terminal 112 is applied to the first conductive layer 110a (first electrode 110) through the first wiring 114. The second terminal 132 is located at one end of the second wiring 134. A potential is applied to the second terminal 132. Thereby, the potential of the second terminal 132 is applied to the second conductive layer 130a (second electrode 130) through the second wiring 134.

There is a conductive layer 180 on the top surface of each conductive layer 170. The electric resistance of the conductive layer 180 is lower than the electric resistance of the conductive layer 170. Thereby, the voltage drop between the first terminal 112 and the first electrode 110 and the voltage drop between the second terminal 132 and the second electrode 130 can be suppressed. The conductive layer 180 is positioned so as not to overlap the light emitting unit 140. For this reason, the conductive layer 180 does not need to have translucency. Specifically, the conductive layer 180 is made of, for example, Al or Ag. As another example, the conductive layer 180 may include, for example, a Mo alloy layer on the top surface of the first conductive layer 110a, an Al alloy layer on the Mo alloy layer, and a Mo alloy layer on the Al alloy layer.

As shown in FIG. 4, the plurality of first conductive layers 110a are arranged in the first direction (X direction in the figure). Each first conductive layer 110a extends in a second direction (specifically, the Y direction in the figure) that intersects the first direction (specifically, orthogonal to the first direction).

As shown in FIGS. 5 and 8, the insulating layer 150 is on the first surface 102 of the substrate 100 and on the plurality of first conductive layers 110a. The insulating layer 150 includes a photosensitive resin (for example, polyimide). As shown in FIG. 3, the insulating layer 150 has a plurality of openings 152. The plurality of openings 152 are arranged in the second direction (Y direction in the figure). Each opening 152 extends in the first direction (X direction in the figure). The opening 152 exposes a part of the first conductive layer 110a. This part of the first conductive layer 110 a functions as the first electrode 110 of the light emitting unit 140.

More specifically, as shown in FIG. 9, the opening 152 has a first edge 152a and a second edge 152b. The first edge 152a and the second edge 152b face each other and extend in the first direction (X direction in the figure). The first edge 152a and the second edge 152b intersect with the plurality of first conductive layers 110a. The plurality of first electrodes 110 are exposed between the first edge 152a and the second edge 152b. In other words, the insulating layer 150 is not located between the light emitting units 140 adjacent to each other. For this reason, it is suppressed that the substance which degrades the light emission part 140 propagates via the light emission part 140 between the light emission parts 140 which mutually adjoin.

As shown in FIG. 5, the first edge 152 a and the second edge 152 b are defined by the lower end of the inner surface of the opening 152. Specifically, as shown in FIG. 5, in the cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4), the opening 152 has a first inner surface and a second inner surface. The second inner surface is on the opposite side of the first inner surface. The first inner side surface of the opening 152 is inclined so that the upper end of the first inner side surface is located outside the lower end of the first inner side surface. The second inner side surface of the opening 152 is inclined so that the upper end of the second inner side surface is located outside the lower end of the second inner side surface. The first edge 152a is the lower end of the first inner surface. The second edge 152b is the lower end of the second inner surface.

The insulating layer 150 has an opening 154. As shown in FIG. 7, the second conductive layer 130 a is connected to the second wiring 134 through the opening 154.

As shown in FIGS. 5, 7, and 8, the partition wall 160 is on the insulating layer 150. The partition 160 includes a photosensitive resin (for example, polyimide). As shown in FIG. 2, the plurality of partition walls 160 are arranged in the second direction (Y direction in the figure). Each partition wall 160 extends in the first direction (X direction in the figure). As shown in FIGS. 5 and 7, the width of the upper surface of the partition wall 160 is wider than the width of the lower surface of the partition wall 160 in a cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4). More specifically, in the cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4), the partition wall 160 has a first side surface and a second side surface. The second side surface is on the opposite side of the first inner surface. The first side surface of the partition wall 160 is inclined so that the upper end of the first side surface is located outside the lower end of the first side surface. The second side surface of the partition wall 160 is inclined so that the upper end of the second side surface is located outside the lower end of the second side surface.

In the example shown in FIG. 2, the lower surface of the partition wall 160 is in contact with the upper surface of the insulating layer 150 in any region. In other words, the first surface 102 of the substrate 100 is not exposed from the insulating layer 150 in any region below the lower surface of the partition wall 160. For example, in the case where the partition wall 160 includes polyimide, the insulating layer 150 includes polyimide, and the substrate 100 includes glass, the adhesion strength between the lower surface of the partition wall 160 and the upper surface of the insulating layer 150 is It becomes higher than the adhesion strength between the one surface 102. In such a case, in the example illustrated in FIG. 2, the entire lower surface of the partition wall 160 is firmly adhered to the upper surface of the insulating layer 150.

As shown in FIGS. 5 to 7, the organic layer 120a is on the first surface 102 of the substrate 100, on the plurality of first conductive layers 110a, and on the insulating layer 150. As shown in FIG. 5, the plurality of organic layers 120a are arranged in the second direction (Y direction in FIGS. 1 to 4). The organic layers 120a adjacent to each other face each other with the partition wall 160 interposed therebetween. As shown in FIGS. 5 and 6, a part of the organic layer 120a overlaps a part (first electrode 110) of the first conductive layer 110a. This part of the organic layer 120 a functions as the organic layer 120 of the light emitting unit 140.

Note that as shown in FIG. 5, the organic layer 120 a is not in contact with the partition wall 160. In this case, a substance that degrades the organic layer 120a can be prevented from propagating from the partition wall 160 to the organic layer 120a. In detail, the partition 160 may contain a substance (for example, water) that degrades the organic layer 120a. In this case, if the organic layer 120 a is in contact with the partition wall 160, this material may propagate from the organic layer 120 a to the partition wall 160. On the other hand, in the example shown in FIGS. 5 and 7, even if the partition 160 includes the above-described substance, it is possible to suppress the propagation of the substance to the organic layer 120a.

As shown in FIGS. 5 and 8, the organic layer 120 b is on the upper surface of the partition wall 160. The material included in the organic layer 120b is the same as the material included in the organic layer 120a. The organic layer 120 a and the organic layer 120 b are formed by depositing an organic layer on the first surface 102 of the substrate 100 and the partition 160. In this case, the organic layer is separated into the organic layer 120 a and the organic layer 120 b by the partition wall 160.

The organic layer 120a has, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. The total thickness of the organic layer 120a is, for example, not less than 50 nm and not more than 200 nm. Holes move in the hole injection layer and the hole transport layer. The thickness of the hole injection layer is, for example, not less than 50 nm and not more than 100 nm. The thickness of the hole transport layer is thinner than the thickness of the hole injection layer. The thickness of the hole transport layer is, for example, 20 nm or more and 50 nm or less. In the light emitting layer, electrons and holes are recombined. Thereby, light is emitted from the light emitting layer. The color of light from the light emitting layer is, for example, red, green, or blue. In the electron transport layer, electrons are transported. The thickness of the electron transport layer is, for example, 5 nm or more and 100 nm or less. The electron injection layer is made of an alkali metal compound (for example, LiF), a metal oxide (for example, aluminum oxide) or a metal complex (for example, lithium 8-hydroxyquinolate (Liq)). The thickness of the electron injection layer is, for example, not less than 0.1 nm and not more than 10 nm.

One of the hole injection layer and the hole transport layer may be omitted. One of the electron transport layer and the electron injection layer may be omitted.

The hole injection layer, hole transport layer, light emitting layer, electron transport layer, and electron injection layer are formed by, for example, a coating process. Specifically, for example, the hole injection layer, the hole transport layer, and the light emitting layer are formed by a coating process. The electron transport layer and the electron injection layer are formed by vapor deposition.

As shown in FIGS. 5 to 6, the second conductive layer 130a is on the organic layer 120a. As shown in FIG. 2, a plurality of second conductive layers 130a are arranged in the second direction (Y direction in the figure). Each second conductive layer 130a extends in the first direction (X direction in the figure). The second conductive layers 130a adjacent to each other are opposed to each other with the partition wall 160 interposed therebetween. As shown in FIGS. 5 and 6, a part of the second conductive layer 130a overlaps a part of the first conductive layer 110a (first electrode 110). This part of the second conductive layer 130 a functions as the second electrode 130 of the light emitting unit 140.

As shown in FIGS. 5, 7, and 8, the conductive layer 130 b is provided on the upper surface of the partition wall 160. The material included in the conductive layer 130b is the same as the material included in the second conductive layer 130a. The second conductive layer 130 a and the conductive layer 130 b are formed by depositing a conductive layer on the first surface 102 and the partition 160 of the substrate 100. In this case, the conductive layer is separated into the second conductive layer 130 a and the conductive layer 130 b by the partition 160.

When the light emitting device 10 is bottom emission, the first conductive layer 110a is a conductive layer having translucency. In this case, the second conductive layer 130a does not need to have translucency. On the other hand, when the light emitting device 10 is top emission, the second conductive layer 130a is a light-transmitting conductive layer. In this case, the first conductive layer 110a does not need to have translucency.

In the case where the first conductive layer 110a and the second conductive layer 130a are light-transmitting conductive layers, the first conductive layer 110a and the second conductive layer 130a include, for example, a metal oxide, and more specifically, for example, It contains ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide) or ZnO (Zinc Oxide).

In the case where the first conductive layer 110a and the second conductive layer 130a are conductive layers that do not have translucency, the first conductive layer 110a and the second conductive layer 130a include, for example, Al, Au, Ag, Pt, Mg, Sn, A metal selected from the first group consisting of Zn and In or an alloy of a metal selected from the first group is included.

As shown in FIGS. 5 to 8, the covering layer 200 covers the insulating layer 150, the plurality of light emitting portions 140, and the plurality of partition walls 160. Thereby, the coating layer 200 seals the insulating layer 150, the plurality of light emitting units 140, and the plurality of partition walls 160. More specifically, in the example shown in the figure, the covering layer 200 is formed by ALD (Atomic Layer Deposition). Accordingly, the covering layer 200 continuously covers the side surfaces and the upper surface of the insulating layer 150, the light emitting unit 140, and the partition wall 160. The covering layer 200 includes, for example, an insulating material, more specifically, for example, a metal oxide. The covering layer 200 includes, for example, a titanium oxide layer and an aluminum oxide layer. In this case, the aluminum oxide layer is on the titanium oxide layer or below the titanium oxide layer. The thickness of the coating layer 200 is, for example, not less than 50 nm and not more than 300 nm.

The covering layer 200 may be formed by, for example, CVD (Chemical Vapor Deposition) or sputtering. In this case, the covering layer 200 includes, for example, a SiO ₂ layer or a SiN layer. In this case, the film thickness of the coating layer 200 is, for example, not less than 10 nm and not more than 1000 nm.

The covering layer 200 may be covered with a resin layer. The resin layer is provided to protect the covering layer 200. The resin layer contains, for example, an epoxy resin or an acrylic resin.

Next, the layout of the plurality of light emitting units 140 will be described. As shown in FIG. 2, each light emitting unit 140 is located on an intersection of a plurality of first conductive layers 110 a arranged in the first direction and a plurality of second conductive layers 130 a arranged in the second direction. Accordingly, the plurality of light emitting units 140 includes an m × n matrix including m rows arranged in the second direction (Y direction in the drawing) and n columns arranged in the first direction (X direction in the drawing). (In the example shown in the figure, m = 4, n = 5).

As shown in FIG. 9, the planar shape of the light emitting unit 140 is a rectangle, and has a first side 142, a second side 144, a third side 146, and a fourth side 148. The second side 144 is on the opposite side of the first side 142. The third side 146 and the fourth side 148 are between the first side 142 and the second side 144. The fourth side 148 is on the opposite side of the third side 146.

As shown in FIGS. 5 and 9, the first side 142 and the second side 144 of the light emitting unit 140 are defined by the opening 152 of the insulating layer 150, and the third side of the light emitting unit 140 is shown in FIGS. 6 and 9. 146 and the fourth side 148 are defined by the first conductive layer 110a (first electrode 110). Specifically, as shown in FIG. 9, the first edge 152a of the insulating layer 150 includes a portion intersecting the first electrode 110 (first conductive layer 110a), and the second edge 152b of the insulating layer 150 is A portion intersecting with one electrode 110 (first conductive layer 110a) is included. The first side 142 is defined by the aforementioned portion of the first edge 152a. The second side 144 is defined by the above-described portion of the second edge 152b. As shown in FIG. 9, the first conductive layer 110a has an edge 116 (end) and an edge 118 (end). The edge 116 and the edge 118 extend in the second direction (Y direction in the figure). The edge 116 includes a portion that intersects the opening 152, and the edge 118 includes a portion that intersects the opening 152. Third side 146 is defined by the aforementioned portion of edge 116. The fourth side 148 is defined by the aforementioned portion of the edge 118.

In the example shown in FIG. 3, the first edge 152a and the second edge 152b of the opening 152 are all the first conductive layers 110a from the first row to the n-th row (n = 5 in the example shown in this figure). Crossed. Therefore, in any region on the first surface 102 of the substrate 100, the insulating layer 150 is not located between the light emitting units 140 adjacent to each other in the first direction (X direction in the drawing). For this reason, it can suppress that the substance which degrades the light emission part 140 propagates through the insulating layer 150 between the light emission parts 140 mutually adjacent in a 1st direction (X direction in a figure).

Next, a method for manufacturing the light emitting device 10 will be described. First, a conductive layer is formed on the first surface 102 of the substrate 100, and this conductive layer is patterned. Thus, a plurality of conductive layers 170 (first conductive layer 110a, first wiring 114, and second wiring 134) are formed. Next, a conductive layer 180 is formed on the upper surface of each conductive layer 170.

Next, the insulating layer 150 is formed on the first surface 102 of the substrate 100 and the plurality of conductive layers 170. Next, a plurality of openings 152 and a plurality of openings 154 are formed in the insulating layer 150.

Next, a plurality of partition walls 160 are formed on the insulating layer 150.

Next, an organic layer is formed on the insulating layer 150 and the plurality of partition walls 160. Accordingly, the organic layer is separated into the organic layer 120a and the organic layer 120b by the partition 160.

Next, a conductive layer is formed over the insulating layer 150 and the plurality of partition walls 160. Accordingly, the conductive layer is separated into the second conductive layer 130a and the conductive layer 130b by the partition 160.

Next, the coating layer 200 is formed by ALD on the first surface 102 of the substrate 100, the insulating layer 150, and the plurality of partition walls 160. As a result, the insulating layer 150, the plurality of light emitting units 140, and the plurality of partition walls 160 are sealed by the covering layer 200.

As mentioned above, according to this embodiment, it can suppress that the light emission area | region of the light emission part 140 becomes narrow. Specifically, as a result of examination by the present inventor, it has been found that a substance that degrades the light emitting unit 140 may propagate through the insulating layer 150. In the present embodiment, the insulating layer 150 is not positioned between the light emitting units 140 arranged in the first direction (X direction in the drawing). For this reason, it is suppressed that the substance which degrades the light emission part 140 which propagates the insulating layer 150 propagates to the 3rd edge | side 146 and the 4th edge | side 148 of the some light emission part 140 in the opening 152 through the organic layer 120. Can do. For this reason, in this embodiment, it can suppress that the light emission area | region of the light emission part 140 becomes narrow.

As a result of examination by the present inventor, the above-described substances that degrade the light emitting unit 140 may be generated outside the region including the plurality of light emitting units 140 arranged in a matrix, for example, due to ultraviolet rays. It became clear that there was sex. Further examination by the present inventors has revealed that the above-described substances tend to propagate widely in the insulating layer 150 when the insulating layer 150 contains a photosensitive resin (eg, polyimide). This is presumed to be because the photosensitive resin functions to propagate the above-described substances. Further examination by the present inventor has revealed that the above-described substances tend to propagate widely in the insulating layer 150 when the coating layer 200 is formed by ALD. This is presumably because the surface of the insulating layer 150 is sealed with high airtightness when the coating layer 200 is formed by ALD. In this case, the above substances are prevented from being discharged to the outside of the insulating layer 150. In the present embodiment, even when the insulating layer 150 includes polyimide and the covering layer 200 is formed by ALD, the above-described substances are prevented from propagating to the light emitting unit 140 through the insulating layer 150. it can.

FIG. 10 is a diagram showing a modification of FIG. As shown in this figure, an insulating layer 150 is formed between two light emitting units 140 adjacent to each other so that the third side 146 of one light emitting unit 140 and the fourth side 148 of the other light emitting unit 140 are exposed. May be. In this case, the width of the insulating layer 150 between the light emitting units 140 adjacent to each other is narrow. That is, the insulating layer 150 is formed between the light emitting units 140 so as to be separated from the third side 146 of one light emitting unit 140 and the fourth side 148 of the other light emitting unit 140. For this reason, it can suppress that the substance which degrades the light emission part 140 propagates to the light emission part 140 through the insulating layer 150 between the light emission parts 140 adjacent to each other.

FIG. 11 is a diagram showing a first modification of FIG. As shown in this figure, the opening 152 of the insulating layer 150 may be connected to a region outside the insulating layer 150. Also in this modified example, similarly to the embodiment, a substance that degrades the light emitting unit 140 is suppressed from propagating to the light emitting unit 140 through the insulating layer 150.

FIG. 12 is a diagram showing a second modification of FIG. In the example shown in the figure, the plurality of openings 152 are arranged in the first direction (X direction in the figure). Within each opening 152, a plurality of light emitting portions 140 are arranged in the first direction (X direction in the figure). In other words, in the example shown in this drawing, the opening 152 shown in FIG. 3 is separated into a plurality of openings 152 along the first direction (X direction in the drawing). Also in the example shown in this figure, in each opening 152, it is possible to suppress a substance that deteriorates the light emitting unit 140 from propagating through the insulating layer 150 between the light emitting units 140 adjacent to each other.

FIG. 13 is a plan view showing the light emitting device 10 according to the first embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

The light emitting device 10 includes a first potential supply unit 192 and a second potential supply unit 194. The first potential supply unit 192 provides a first potential. The second potential supply unit 194 provides a second potential. The first potential and the second potential are, for example, a power supply potential and a ground potential, respectively, or a ground potential and a power supply potential.

A part of the first conductive layer 110a (third first conductive layer) among the plurality of first conductive layers 110a is electrically connected to the first potential supply unit 192 through the first wiring 114. . On the other hand, some other first conductive layers 110a (the first first conductive layer and the second first conductive layer) of the plurality of first conductive layers 110a are connected to the first potential supply unit 192. It is not electrically connected to and is electrically floating. In the example shown in this figure, the first conductive layer 110a (first first conductive layer) at one end of the plurality of first conductive layers 110a and the first conductive layer 110a (first step) at the other end of the plurality of first conductive layers 110a. 2 first conductive layer) is electrically floating. On the other hand, a plurality of first conductive layers 110a (first first conductive layers) between the first conductive layer 110a at one end and the first conductive layer 110a at the other end are the first potential supply unit. 192 is electrically connected.

A part of the second conductive layer 130a (third second conductive layer) among the plurality of second conductive layers 130a is electrically connected to the second potential supply unit 194 through the second wiring 134. . On the other hand, the other second conductive layer 130a (the first second conductive layer and the second second conductive layer) of the plurality of second conductive layers 130a is connected to the second potential supply unit 194. It is not electrically connected to and is electrically floating. In the example shown in this figure, the second conductive layer 130a (first second conductive layer) at one end of the plurality of second conductive layers 130a and the second conductive layer 130a (first step) at the other end of the plurality of second conductive layers 130a. 2nd conductive layer) is electrically floating. On the other hand, a plurality of second conductive layers 130a (first second conductive layers) between the second conductive layer 130a at one end and the second conductive layer 130a at the other end described above are the second potential supply unit. 194 is electrically connected.

As shown in the figure, the first surface 102 of the substrate 100 includes a region 102a and a region 102b. The region 102b surrounds the region 102a. Over the region 102b, the first conductive layer 110a at one end of the plurality of first conductive layers 110a, the first conductive layer 110a at the other end of the plurality of first conductive layers 110a, and the first conductive layer 110a at one end of the plurality of second conductive layers 130a. The light emitting unit 140 that is electrically connected to one of the second conductive layer 130a and the second conductive layer 130a at one end of the plurality of second conductive layers 130a is located. A potential for causing the organic layer 120 to emit light is not applied to the light emitting unit 140 in the region 102b. In other words, the light emitting unit 140 in the region 102b functions as a dummy light emitting unit. In contrast, a potential for causing the organic layer 120 to emit light is applied to the light emitting unit 140 in the region 102a. In other words, the light-emitting portion 140 (first light-emitting portion) in the region 102a includes the first electrode 110 and the second conductive layer 130a (third second conductive layer) of the first conductive layer 110a (third first conductive layer). Layer) of the second electrode 130.

Note that, as a result of examination by the present inventor, it has been clarified that the deterioration of the light emitting units 140 located on the outer side among the plurality of light emitting units 140 arranged in a matrix is significant. That is, it became clear that there is a difference in the progress of deterioration between the light emitting units 140 located outside of the plurality of light emitting units 140 arranged in a matrix and the other light emitting units 140. The volume of the insulating layer 150 surrounding the light emitting portion 140 located in the region 102b is larger than the volume of the insulating layer 150 surrounding the light emitting portion 140 located in the region 102a, and thus contains a large amount of a substance that degrades the light emitting portion 140. Guessed.

In the example shown in the figure, the light emitting unit 140 located outside of the plurality of light emitting units 140 arranged in a matrix is a dummy. Therefore, it is possible to suppress a difference in the progress of deterioration between the light emitting units 140 located outside of the light emitting units 140 in the region 102a and the other light emitting units 140. This is because the light emitting portion 140 in the region 102a is separated from the insulating layer 150 located outside the region 102b by the light emitting portion 140 (dummy light emitting portion) in the region 102b.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

Claims

A substrate,
An insulating layer on the substrate;
A plurality of light emitting portions exposed from the insulating layer on the substrate, each having a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode;
With
The light emitting unit intersects the first side defined by the insulating layer, the second side defined by the insulating layer on the side opposite to the first side, and the first side and the second side. A light emitting device having a third side extending in a direction and exposed from the insulating layer.
The light-emitting device according to claim 1.
The light emitting unit is a light emitting device having a fourth side exposed on the side opposite to the third side and exposed from the insulating layer.
The light-emitting device according to claim 1 or 2,
A light emitting device in which a region located between adjacent light emitting units is exposed from the insulating layer.
The light emitting device according to claim 3.
The insulating layer includes a first region having a first edge and a second region having a second edge opposite to the first edge;
The first side is defined by the first edge;
The light emitting device, wherein the second side is defined by the second edge.
The light-emitting device according to claim 4.
The insulating layer has an opening exposing the light emitting part,
The opening has a third edge and a fourth edge opposite the third edge;
The first edge of the insulating layer is the third edge of the opening;
The light emitting device, wherein the second edge of the insulating layer is the fourth edge of the opening.
The light emitting device according to any one of claims 1 to 5,
A plurality of first conductive layers arranged in a first direction;
A plurality of second conductive layers arranged in a second direction orthogonal to the first direction on the substrate and the plurality of first conductive layers;
With
The insulating layer is on the substrate and the plurality of first conductive layers;
A first edge and a second edge of the insulating layer intersect the first conductive layer;
The plurality of second conductive layers are on the substrate, on the plurality of first conductive layers, and on the insulating layer,
The first conductive layer includes a portion overlapping the second conductive layer,
The second conductive layer includes a portion overlapping the first conductive layer,
The first electrode of the light emitting portion is the portion of the first conductive layer;
The light emitting device, wherein the second electrode of the light emitting unit is the portion of the second conductive layer.
The light-emitting device according to claim 6.
The light emitting device, wherein the third side and the fourth side are defined by an end of the first conductive layer.
The light-emitting device according to claim 6 or 7,
A plurality of partition walls on the insulating layer;
The plurality of partition walls are arranged in the second direction,
The second conductive layers adjacent to each other are opposed to each other with the partition interposed therebetween.
The light-emitting device according to claim 8.
A light emitting device comprising a covering layer covering the insulating layer, the plurality of light emitting portions, and the plurality of partition walls.
The light-emitting device according to claim 9.
The covering layer is a light emitting device including a titanium oxide layer and an aluminum oxide layer.
The light emitting device according to any one of claims 6 to 10,
A first potential supply section for applying a first potential;
A second potential supply section for applying a second potential;
With
The plurality of first conductive layers include a first first conductive layer, a second first conductive layer, and a third first between the first first conductive layer and the second first conductive layer. Including a conductive layer;
The plurality of second conductive layers include a first second conductive layer, a second second conductive layer, and a third second layer between the first second conductive layer and the second second conductive layer. Including a conductive layer;
The third first conductive layer is electrically connected to the first potential supply unit,
The first first conductive layer is electrically floating;
The second first conductive layer is electrically floating;
The third second conductive layer is electrically connected to the second potential supply unit,
The first second conductive layer is electrically floating;
The second second conductive layer is electrically floating;
The first light emitting unit of the plurality of light emitting units includes the first electrode of the third first conductive layer and the second electrode of the third second conductive layer.