WO2017163347A1

WO2017163347A1 - Light emitting device

Info

Publication number: WO2017163347A1
Application number: PCT/JP2016/059247
Authority: WO
Inventors: 田中　信介; 真滋中嶋; 範明和氣
Original assignee: パイオニア株式会社; 東北パイオニア株式会社
Priority date: 2016-03-23
Filing date: 2016-03-23
Publication date: 2017-09-28

Abstract

A light emitting device (10) is provided with a substrate (100), a light emitting section (140), a first insulating layer (150), and a second insulating layer (156). The light emitting section (140) is on the substrate (100). The light emitting section (140) has a first electrode (110), an organic layer (120), and a second electrode (130). The organic layer (120) is between the first electrode (110) and the second electrode (130). The first insulating layer (150) demarcates the light emitting section (140) on the substrate (100). The first insulating layer (150) is formed of an inorganic material. The second insulating layer (156) is outside of the light emitting section (140). The second insulating layer (156) is formed of an organic material, specifically, for instance, polyimide.

Description

Light emitting device

The present invention relates to a light emitting device.

In recent years, light emitting devices having an organic layer have been developed. Patent Document 1 describes an example of such a light emitting device. In Patent Document 1, a plurality of organic insulating layers are arranged on a substrate so as to be separated from each other. A light emitting portion is located on each organic insulating layer. The light emitting unit includes a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode. In Patent Document 1, an inorganic insulating layer is located across a groove between adjacent organic insulating layers.

JP 2011-138635 A

In a light emitting device, an insulating layer for defining a light emitting part may be formed on a substrate. Such an insulating layer may contain a photosensitive resin (for example, polyimide). On the other hand, when the inventor examined, when the insulating layer contained photosensitive resin, it became clear that the substance which degrades a light emission part may have propagated through the insulating layer. In order to suppress such a substance from propagating through the insulating layer, the present inventor has studied to form the insulating layer from an inorganic material. However, as a result of studies by the present inventor, it has been clarified that when the insulating layer is made of an inorganic material, the luminance of the light emitting portion may be lowered due to the inorganic material of the insulating layer.

An example of a problem to be solved by the present invention is to suppress a decrease in luminance of the light emitting part even when the insulating layer defining the light emitting part is made of an inorganic material.

The invention described in claim 1
A substrate,
A light emitting unit on the substrate and having a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode;
A first insulating layer that defines the light emitting portion on the substrate and is made of an inorganic material;
A second insulating layer outside the light emitting portion and made of an organic material;
It is a light-emitting device provided with.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

It is a top view which shows the light-emitting device which concerns on embodiment. It is the figure which removed the coating layer from FIG. FIG. 3 is a view in which a second conductive layer and a partition wall are removed from FIG. 2. It is the figure which removed the 1st insulating layer and the 2nd insulating layer from FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 3 is a sectional view taken along line BB in FIG. FIG. 3 is a cross-sectional view taken along the line CC of FIG. FIG. 3 is a DD sectional view of FIG. 2. FIG. 9 is a graph for explaining luminance characteristics of the light emitting device shown in FIGS. 1 to 8. FIG. (A) is a graph for explaining the chromaticity characteristics of the light emitting device shown in FIGS. 1 to 8, and (b) is a graph for explaining the chromaticity characteristics of the light emitting device shown in FIGS. It is a graph for. It is a top view which shows the light-emitting device which concerns on a modification. It is the figure which removed the 2nd conductive layer and the partition from FIG. FIG. 12 is a cross-sectional view taken along the line AA in FIG. FIG. 12 is a sectional view taken along line BB in FIG. FIG. 12 is a sectional view taken along the line CC of FIG. FIG. 12 is a DD cross-sectional view of FIG. 11.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 is a plan view showing a light emitting device 10 according to the embodiment. FIG. 2 is a view in which the covering layer 200 is removed from FIG. FIG. 3 is a diagram in which the second conductive layer 130a and the partition 160 are removed from FIG. FIG. 4 is a diagram in which the first insulating layer 150 and the second insulating layer 156 are removed from FIG. 3. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 6 is a cross-sectional view taken along the line BB in FIG. 7 is a cross-sectional view taken along the line CC of FIG. FIG. 8 is a sectional view taken along the line DD of FIG.

As shown in FIG. 2, the light emitting device 10 includes a substrate 100, a light emitting unit 140, a first insulating layer 150, and a second insulating layer 156. As shown in FIGS. 2, 5, and 6, the light emitting unit 140 is on the substrate 100. As shown in FIGS. 5 and 6, the light emitting unit 140 includes a first electrode 110, an organic layer 120, and a second electrode 130. The organic layer 120 is between the first electrode 110 and the second electrode 130. As shown in FIGS. 5 and 6, the first insulating layer 150 defines a light emitting unit 140 on the substrate 100. The first insulating layer 150 is made of an inorganic material. As shown in FIGS. 2 and 3, the second insulating layer 156 is outside the light emitting unit 140. The second insulating layer 156 is made of an organic material, specifically, for example, polyimide. Details will be described below.

In the example shown in FIGS. 1 to 8, the light emitting device 10 is a display. The light emitting device 10 includes a substrate 100, a conductive layer 170, a conductive layer 180, a first insulating layer 150, a second insulating layer 156, an organic layer 120 a, a second conductive layer 130 a, a partition wall 160, and a covering layer 200.

As shown in FIGS. 5 to 8, the substrate 100 has a first surface 102 and a second surface 104. The second surface 104 is on the opposite side of the first surface 102 and is the back surface of the substrate 100. In the example shown in FIGS. 1 to 4, the shape of the first surface 102 is a rectangle. However, the shape of the first surface 102 may be a polygon other than a rectangle, for example.

The light emitting device 10 may be either bottom emission or top emission. When the light emitting device 10 is bottom emission, light from the plurality of light emitting units 140 is emitted from the second surface 104 of the substrate 100. In this case, the substrate 100 is made of a translucent material (for example, glass or resin). On the other hand, when the light emitting device 10 is top emission, the light from the plurality of light emitting units 140 is emitted from above the first surface 102 of the substrate 100. In this case, the substrate 100 may be made of the above-described translucent material or may be made of a material that does not have translucency.

The substrate 100 may have flexibility or may not have flexibility. When the substrate 100 has flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. When the substrate 100 has flexibility and includes glass, the thickness of the substrate 100 is, for example, 200 μm or less. When the substrate 100 is flexible and includes a resin, the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. The first surface 102 (preferably both the first surface 102 and the second surface 104) of the substrate 100 may be covered with an inorganic barrier film (eg, SiN _x or SiON). In this case, even if the substrate 100 includes a material (for example, resin) having a high water vapor transmission rate, the water vapor is prevented from reaching the first surface 102 of the substrate 100.

As shown in FIGS. 1 to 4, the plurality of conductive layers 170 are on the first surface 102 of the substrate 100. The plurality of conductive layers 170 include a plurality of conductive layers 170a and a plurality of conductive layers 170b. Each conductive layer 170 a includes a first conductive layer 110 a and a first wiring 114. The first conductive layer 110a is a part of the conductive layer 170a. The first wiring 114 is another part of the conductive layer 170a. The first conductive layer 110a and the first wiring 114 are connected to each other. Each conductive layer 170 b includes a second wiring 134.

The first terminal 112 is located at one end of the first wiring 114. A potential is applied to the first terminal 112. Thereby, the potential of the first terminal 112 is applied to the first conductive layer 110a (first electrode 110) through the first wiring 114. The second terminal 132 is located at one end of the second wiring 134. A potential is applied to the second terminal 132. Thereby, the potential of the second terminal 132 is applied to the second conductive layer 130a (second electrode 130) through the second wiring 134.

There is a conductive layer 180 on the top surface of each conductive layer 170. The electric resistance of the conductive layer 180 is lower than the electric resistance of the conductive layer 170. Thereby, the voltage drop between the first terminal 112 and the first electrode 110 and the voltage drop between the second terminal 132 and the second electrode 130 can be suppressed. The conductive layer 180 is positioned so as not to overlap the light emitting unit 140. For this reason, the conductive layer 180 does not need to have translucency. Specifically, the conductive layer 180 is made of, for example, Al or Ag. As another example, the conductive layer 180 may include, for example, a Mo alloy layer on the top surface of the first conductive layer 110a, an Al alloy layer on the Mo alloy layer, and a Mo alloy layer on the Al alloy layer.

As shown in FIG. 4, the plurality of first conductive layers 110a are arranged in the first direction (X direction in the figure). Each first conductive layer 110a extends in a second direction (specifically, the Y direction in the figure) that intersects the first direction (specifically, orthogonal to the first direction).

As shown in FIGS. 5 and 6, the first insulating layer 150 is on the first surface 102 of the substrate 100 and on the plurality of first conductive layers 110a. The first insulating layer 150 is made of an inorganic material (for example, silicon oxide or silicon nitride). As shown in FIGS. 2 to 4, the first insulating layer 150 has a plurality of openings 152. The plurality of openings 152 is an m × n matrix (this figure) including m rows arranged in the second direction (Y direction in the drawing) and n columns arranged in the first direction (X direction in the drawing). In the example shown in FIG. 4, m = 4 and n = 5). The planar shape of each opening 152 is a rectangle. As shown in FIGS. 5 and 6, in each opening 152, a part of the first conductive layer 110a (first electrode 110) and a part of the second conductive layer 130a (second electrode 130) overlap each other. . Thereby, the region surrounded by the edge of the opening 152 functions as the light emitting unit 140. That is, the first insulating layer 150 defines the light emitting unit 140.

5 and 6, each side of the light emitting unit 140 is defined by the lower end of the inner surface of the opening 152. Specifically, as shown in FIG. 5, in the cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4), the opening 152 has a first inner surface and a second inner surface. The second inner surface is on the opposite side of the first inner surface. The first inner side surface of the opening 152 is inclined so that the upper end of the first inner side surface is located outside the lower end of the first inner side surface. The second inner side surface of the opening 152 is inclined so that the upper end of the second inner side surface is located outside the lower end of the second inner side surface. The first side of the light emitting unit 140 is defined by the lower end of the first inner side surface of the opening 152. The second side of the light emitting unit 140 is defined by the lower end of the second inner side surface of the opening 152. Similarly, as shown in FIG. 6, in the cross section perpendicular to the second direction (the Y direction in FIGS. 1 to 4), the opening 152 has a third inner surface and a fourth inner surface. The fourth inner surface is on the opposite side of the third inner surface. The third inner side surface of the opening 152 is inclined so that the upper end of the third inner side surface is located outside the lower end of the third inner side surface. The fourth inner side surface of the opening 152 is inclined so that the upper end of the fourth inner side surface is located outside the lower end of the fourth inner side surface. The third side of the light emitting unit 140 is defined by the lower end of the third inner side surface of the opening 152. The fourth side of the edge of the light emitting unit 140 is defined by the lower end of the fourth inner side surface of the opening 152.

The first insulating layer 150 has an opening 154. As shown in FIG. 7, the second conductive layer 130 a is connected to the second wiring 134 through the opening 154.

As shown in FIG. 5, the second insulating layer 156 is on the first insulating layer 150. The second insulating layer 156 is made of an organic material (for example, polyimide). As shown in FIG. 2, the second insulating layer 156 surrounds the light emitting region 141 of the first surface 102 of the substrate 100. In the light emitting region 141, the plurality of light emitting units 140 are arranged in a matrix as described above. Further, when the second insulating layer 156 contains a substance that deteriorates, the first insulating layer 150 is made of an inorganic material, and thus does not transmit to the organic layer 120a through the first insulating layer.

More specifically, in the example shown in FIG. 2, the shape of the light emitting region 141 is a rectangle having a first side, a second side, a third side, and a fourth side. The first side extends along the first direction (X direction in the figure). The second side is on the opposite side of the first side. The third side is between the first side and the second side. The fourth side is on the opposite side of the third side. The second insulating layer 156 is located along the first side, the second side, the third side, and the fourth side. Note that the second insulating layer 156 may not surround the light emitting region 141. For example, the second insulating layer 156 may be positioned along only one side of the first side to the fourth side of the light emitting region 141. As shown in FIG. 5, the second insulating layer 156 is separated from the partition wall 160.

As shown in FIGS. 5, 7, and 8, the partition wall 160 is on the first insulating layer 150. The partition 160 includes a photosensitive resin (for example, polyimide). As shown in FIG. 2, the plurality of partition walls 160 are arranged in the second direction (Y direction in the figure). Each partition wall 160 extends in the first direction (X direction in the figure). As shown in FIGS. 5 and 7, the width of the upper surface of the partition wall 160 is wider than the width of the lower surface of the partition wall 160 in a cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4). More specifically, in the cross section perpendicular to the first direction (the X direction in FIGS. 1 to 4), the partition wall 160 has a first side surface and a second side surface. The second side surface is on the opposite side of the first inner surface. The first side surface of the partition wall 160 is inclined so that the upper end of the first side surface is located outside the lower end of the first side surface. The second side surface of the partition wall 160 is inclined so that the upper end of the second side surface is located outside the lower end of the second side surface.

As shown in FIGS. 5 and 6, the organic layer 120 a is on the first surface 102 of the substrate 100, on the plurality of first conductive layers 110 a, and on the first insulating layer 150. As shown in FIG. 5, the plurality of organic layers 120a are arranged in the second direction (Y direction in FIGS. 1 to 4). The organic layers 120a adjacent to each other face each other with the partition wall 160 interposed therebetween. As shown in FIGS. 5 and 6, a part of the organic layer 120a overlaps a part (first electrode 110) of the first conductive layer 110a. This part of the organic layer 120 a functions as the organic layer 120 of the light emitting unit 140.

As shown in FIG. 5, the organic layer 120a is preferably not in contact with the partition wall 160. In this case, a substance that degrades the organic layer 120a can be prevented from propagating from the partition wall 160 to the organic layer 120a. In detail, the partition 160 may contain a substance (for example, water) that degrades the organic layer 120a. In this case, if the organic layer 120 a is in contact with the partition wall 160, this material may propagate from the organic layer 120 a to the partition wall 160. On the other hand, in the example shown in FIG. 5, even if the partition 160 includes the above-described substance, it is possible to suppress the propagation of the substance to the organic layer 120a. Further, since the partition wall 160 is on the first insulating layer 150 made of an inorganic material, even if the partition wall 160 contains the above-described substance, it is possible to suppress the propagation of this substance to the organic layer 120a. .

As shown in FIGS. 5 and 8, the organic layer 120 b is on the upper surface of the partition wall 160. The material included in the organic layer 120b is the same as the material included in the organic layer 120a. The organic layer 120 a and the organic layer 120 b are formed by depositing an organic layer on the first surface 102 of the substrate 100 and the partition 160. In this case, the organic layer is separated into the organic layer 120 a and the organic layer 120 b by the partition wall 160.

The organic layer 120a has, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. The total thickness of the organic layer 120a is, for example, not less than 50 nm and not more than 200 nm. Holes move in the hole injection layer and the hole transport layer. The thickness of the hole injection layer is, for example, not less than 50 nm and not more than 100 nm. The thickness of the hole transport layer is thinner than the thickness of the hole injection layer. The thickness of the hole transport layer is, for example, 20 nm or more and 50 nm or less. In the light emitting layer, electrons and holes are recombined. Thereby, light is emitted from the light emitting layer. The color of light from the light emitting layer is, for example, red, green, or blue. In the electron transport layer, electrons are transported. The thickness of the electron transport layer is, for example, 5 nm or more and 100 nm or less. The electron injection layer is made of an alkali metal compound (for example, LiF), a metal oxide (for example, aluminum oxide) or a metal complex (for example, lithium 8-hydroxyquinolate (Liq)). The thickness of the electron injection layer is, for example, not less than 0.1 nm and not more than 10 nm.

One of the hole injection layer and the hole transport layer may be omitted. One of the electron transport layer and the electron injection layer may be omitted.

The hole injection layer, hole transport layer, light emitting layer, electron transport layer, and electron injection layer are formed by, for example, a coating process. Specifically, for example, the hole injection layer, the hole transport layer, and the light emitting layer are formed by a coating process, and the electron transport layer and the electron injection layer are formed by vapor deposition.

As shown in FIGS. 5 and 6, the second conductive layer 130a is on the organic layer 120a. As shown in FIG. 2, a plurality of second conductive layers 130a are arranged in the second direction (Y direction in the figure). Each second conductive layer 130a extends in the first direction (X direction in the figure). The second conductive layers 130a adjacent to each other are opposed to each other with the partition wall 160 interposed therebetween. As shown in FIGS. 5 and 6, a part of the second conductive layer 130a overlaps a part of the first conductive layer 110a (first electrode 110). This part of the second conductive layer 130 a functions as the second electrode 130 of the light emitting unit 140.

As shown in FIGS. 5, 7, and 8, the conductive layer 130 b is provided on the upper surface of the partition wall 160. The material included in the conductive layer 130b is the same as the material included in the second conductive layer 130a. The second conductive layer 130 a and the conductive layer 130 b are formed by depositing a conductive layer on the first surface 102 and the partition 160 of the substrate 100. In this case, the conductive layer is separated into the second conductive layer 130 a and the conductive layer 130 b by the partition 160.

When the light emitting device 10 is bottom emission, the first conductive layer 110a is a conductive layer having translucency. In this case, the second conductive layer 130a does not need to have translucency. On the other hand, when the light emitting device 10 is top emission, the second conductive layer 130a is a light-transmitting conductive layer. In this case, the first conductive layer 110a does not need to have translucency.

In the case where the first conductive layer 110a and the second conductive layer 130a are light-transmitting conductive layers, the first conductive layer 110a and the second conductive layer 130a include, for example, a metal oxide, and more specifically, for example, It contains ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide) or ZnO (Zinc Oxide).

In the case where the first conductive layer 110a and the second conductive layer 130a are conductive layers that do not have translucency, the first conductive layer 110a and the second conductive layer 130a include, for example, Al, Au, Ag, Pt, Mg, Sn, A metal selected from the first group consisting of Zn and In or an alloy of a metal selected from the first group is included.

As shown in FIGS. 4 to 7, the covering layer 200 covers the first insulating layer 150, the plurality of light emitting portions 140, and the plurality of partition walls 160. Thereby, the coating layer 200 seals the first insulating layer 150, the plurality of light emitting units 140, and the plurality of partition walls 160. More specifically, in the example shown in the figure, the covering layer 200 is formed by ALD (Atomic Layer Deposition). Accordingly, the covering layer 200 continuously covers the side surfaces and the upper surface of the first insulating layer 150, the second insulating layer 156, the light emitting unit 140, and the partition 160. The covering layer 200 includes, for example, an insulating material, more specifically, for example, a metal oxide. The covering layer 200 includes, for example, a titanium oxide layer and an aluminum oxide layer. In this case, the aluminum oxide layer is on the titanium oxide layer or below the titanium oxide layer. The thickness of the coating layer 200 is, for example, not less than 50 nm and not more than 300 nm.

The covering layer 200 may be formed by, for example, CVD (Chemical Vapor Deposition) or sputtering. In this case, the covering layer 200 includes, for example, a SiO ₂ layer or a SiN layer. In this case, the film thickness of the coating layer 200 is, for example, not less than 10 nm and not more than 1000 nm.

The covering layer 200 may be covered with a resin layer. The resin layer is provided to protect the covering layer 200. The resin layer contains, for example, an epoxy resin or an acrylic resin.

Next, a method for manufacturing the light emitting device 10 will be described. First, a conductive layer is formed on the first surface 102 of the substrate 100, and this conductive layer is patterned. Thus, a plurality of conductive layers 170 (first conductive layer 110a, first wiring 114, and second wiring 134) are formed. Next, a conductive layer 180 is formed on the upper surface of each conductive layer 170.

Next, the first insulating layer 150 is formed on the first surface 102 of the substrate 100 and the plurality of conductive layers 170. Next, a plurality of openings 152 and a plurality of openings 154 are formed in the first insulating layer 150.

Next, a second insulating layer 156 is formed on the first insulating layer 150.

Next, a plurality of partition walls 160 are formed on the first insulating layer 150.

Next, an organic layer is formed on the first insulating layer 150 and the plurality of partition walls 160. Accordingly, the organic layer is separated into the organic layer 120a and the organic layer 120b by the partition 160.

Next, a conductive layer is formed on the first insulating layer 150 and the plurality of partition walls 160. Accordingly, the conductive layer is separated into the second conductive layer 130a and the conductive layer 130b by the partition 160.

Next, the coating layer 200 is formed by ALD on the first surface 102 of the substrate 100, the first insulating layer 150, and the plurality of partition walls 160. Accordingly, the first insulating layer 150, the plurality of light emitting units 140, and the plurality of partition walls 160 are sealed with the coating layer 200.

FIG. 9 is a graph for explaining the luminance characteristics of the light emitting device 10 shown in FIGS. FIGS. 10A and 10B are graphs for explaining the chromaticity characteristics of the light-emitting device 10 shown in FIGS. 9, 10 </ b> A, and 10 </ b> B, the “organic insulating layer area ratio” means (area of the second insulating layer 156) / (areas of the plurality of light emitting units 140 located in the light emitting region 141). ) × 100. The opening of the second insulating layer 156 is a region where the light emitting region 141 is exposed in the example shown in FIGS. As shown in FIGS. 2 and 3, the shape of the opening of the second insulating layer 156 is a rectangle. In other words, the opening of the second insulating layer 156 includes the first edge, the second edge, the third edge, and the fourth edge along the first side, the second side, the third side, and the fourth side of the light emitting region 141, respectively. have.

The inorganic material of the first insulating layer 150 was silicon oxide. The organic material of the second insulating layer 156 was polyimide.

In FIG. 9, FIG. 10 (a) and FIG. 10 (b), the organic insulating layer area ratio is 0%, 2%, 4%, 6%, 8%, 12%, 24%, 37% and 49%. Nine light emitting devices 10 were produced. Each of the nine light emitting devices 10 was placed in an environment at a temperature of 100 ° C. for 158 hours.

In FIG. 9, for each of the nine light emitting devices 10, the luminance L ₀ before being placed in an environment at a temperature of 100 ° C. for 158 hours and the luminance L ₁₅₈ after being placed in an environment at a temperature of 100 ° C. for 158 hours were measured. In this figure, the “initial luminance ratio” indicates (L ₁₅₈ / L ₀ ) × 100.

In FIG. 10, for each of the nine light emitting devices 10, the chromaticity (x ₀ , y ₀ ) before being placed in an environment at a temperature of 100 ° C. for 158 hours and the chromaticity after being placed in an environment at a temperature of 100 ° C. for 158 hours (x ₁₅₈ , y ₁₅₈ ). The chromaticity (x ₀ , y ₀ ) and the chromaticity (x ₁₅₈ , y ₁₅₈ ) indicate positions in the CIE 1931 chromaticity diagram. In FIG. 10A, “Δx” represents x ₁₅₈ −x ₀ . In FIG. 10B, “Δy” indicates y ₁₅₈ −y ₀ .

As shown in FIG. 9, the initial luminance ratio became high when the organic insulating layer area ratio was 8% or more. As shown in FIG. 10A, Δx was low when the organic insulating layer area ratio was 8% or more. As shown in FIG. 10B, Δy was low when the organic insulating layer area ratio was 8% or more. This result indicates that the luminance and chromaticity of the light emitting device 10 are maintained to some extent when the organic insulating layer area ratio is 8% or more even when the light emitting device 10 is left in a high temperature environment for a long time. .

In addition, in the evaluation in which each of the nine light emitting devices 10 described above is placed in an environment of a temperature of 100 ° C. for 158 hours, deterioration in luminance and deterioration in chromaticity tend to deteriorate as the distance from the second insulating layer 156 increases. Was confirmed. Specifically, it was mainly observed in the light emitting portion 140 that is more than 8 mm away from the second insulating layer 156. Therefore, the center of the light emitting region 141 is preferably within 8 mm from the second insulating layer 156. More specifically, the first edge, the second edge, the third edge, and the fourth edge of the opening of the second insulating layer 156 are the first distance, the second distance, the third distance, and the first distance from the center of the light emitting region 141, respectively. 4 distances away. The longest distance among the first distance, the second distance, the third distance, and the fourth distance is preferably 8 mm or less. Furthermore, the first edge, the second edge, the third edge, and the fourth edge of the opening of the second insulating layer 156 are the fifth distance, the sixth distance, the seventh distance, and the eighth distance from the center of each light emitting unit 140, respectively. Just away. In any of the plurality of light emitting units 140 in the light emitting region 141, the longest distance among the fifth distance, the sixth distance, the seventh distance, and the eighth distance is preferably 8 mm or less.

In the example shown in FIGS. 2 and 3, the light emitting region 141 is a region defined by the outermost light emitting unit 140 among the plurality of light emitting units 140. More specifically, as described above, the plurality of light emitting units 140 are arranged in a matrix. The first side of the light emitting unit 140 in the row farthest from the second side of the light emitting region 141 overlaps the first side of the light emitting region 141. The second side of the light emitting unit 140 in the row farthest from the first side of the light emitting region 141 overlaps the second side of the light emitting region 141. The third side of the light emitting unit 140 in the row farthest from the fourth side of the light emitting region 141 overlaps the third side of the light emitting region 141. The fourth side of the light emitting unit 140 in the row farthest from the third side of the light emitting region 141 overlaps the fourth side of the light emitting region 141.

As described above, according to the present embodiment, the second insulating layer 156 is provided around the light emitting unit 140. The second insulating layer 156 is made of an organic material. The second insulating layer 156 functions to improve the luminance of the light emitting unit 140. For this reason, even if the first insulating layer 150 (inorganic material) functions to deteriorate the luminance of the light emitting unit 140, the luminance deterioration due to the first insulating layer 150 (inorganic material) can be suppressed. it can.

As a result of examination by the present inventor, the above-described substances that degrade the light emitting unit 140 may be generated outside the region including the plurality of light emitting units 140 arranged in a matrix, for example, due to ultraviolet rays. It became clear that there was sex. Further examination by the present inventor reveals that the above substances tend to propagate widely in the first insulating layer 150 when the first insulating layer 150 contains a photosensitive resin (eg, polyimide). became. This is presumed to be because the photosensitive resin functions to propagate the above-described substances. Further examination by the present inventor has revealed that the above-described substances tend to propagate widely in the first insulating layer 150 when the covering layer 200 is formed by ALD. This is presumably because the surface of the first insulating layer 150 is sealed with high airtightness when the covering layer 200 is formed by ALD. In this case, the above substances are prevented from being discharged to the outside of the first insulating layer 150. On the other hand, in the present embodiment, the first insulating layer 150 is made of an inorganic material. For this reason, even if the coating layer 200 is formed by ALD, the above-described substances can be prevented from being widely propagated in the first insulating layer 150.

(Modification)
FIG. 11 is a plan view showing a light emitting device 10 according to a modification, and corresponds to FIG. 2 of the embodiment. FIG. 12 is a diagram in which the second conductive layer 130a and the partition 160 are removed from FIG. 11, and corresponds to FIG. 3 of the embodiment. FIG. 13 is a cross-sectional view taken along the line AA in FIG. 11, and corresponds to FIG. 5 of the embodiment. FIG. 14 is a cross-sectional view taken along the line BB of FIG. 11 and corresponds to FIG. 6 of the embodiment. 15 is a cross-sectional view taken along the line CC of FIG. 11 and corresponds to FIG. 7 of the embodiment. 16 is a cross-sectional view taken along the line DD of FIG. 11, and corresponds to FIG. 8 of the embodiment. The light emitting device 10 according to this modification is the same as the light emitting device 10 according to the embodiment except for the following points.

As shown in FIGS. 11 and 12, the second insulating layer 156 is formed so as to surround each of the plurality of light emitting units 140. Specifically, the shape of each light emitting unit 140 is a rectangle having a first side, a second side, a third side, and a fourth side. The first side extends in the first direction (X direction in the figure). The second side is on the opposite side of the first side. The third side is between the first side and the second side. The fourth side is on the opposite side of the third side. The second insulating layer 156 is located along the first side, the second side, the third side, and the fourth side. Note that the second insulating layer 156 may not surround the light emitting unit 140. For example, the second insulating layer 156 may be located along only one side of the first side to the fourth side of the light emitting unit 140.

As shown in FIG. 13, the second insulating layer 156 is not in contact with the partition wall 160 or the organic layer 120a. For this reason, it can suppress that the substance (for example, water) which degrades the organic layer 120a propagates to the organic layer 120a from the partition 160 via the 2nd insulating layer 156 (for example, polyimide). Specifically, as shown in FIG. 13, a part (first portion 156 a) of the second insulating layer 156 is between the light emitting unit 140 and the partition 160. The organic layer 120 a includes an organic layer 120 (first region) located in the light emitting unit 140 and a portion outside the organic layer 120 (second region). The first portion 156 a of the second insulating layer 156 is separated from the partition wall 160. The second region of the organic layer 120 (the portion between the light emitting unit 140 and the partition 160) faces the partition 160 with the first portion 156a of the second insulating layer 156 interposed therebetween, and the first portion of the second insulating layer 156. It is spaced from 156a.

According to this modification, the second insulating layer 156 is provided around the light emitting unit 140. The second insulating layer 156 is made of an organic material. The second insulating layer 156 functions to improve the luminance of the light emitting unit 140. For this reason, even if the first insulating layer 150 (inorganic material) functions to deteriorate the luminance of the light emitting unit 140, the luminance deterioration due to the first insulating layer 150 (inorganic material) can be suppressed. it can.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

Claims

A substrate,
A light emitting unit on the substrate and having a first electrode, a second electrode, and an organic layer between the first electrode and the second electrode;
A first insulating layer that defines the light emitting portion on the substrate and is made of an inorganic material;
A second insulating layer outside the light emitting portion and made of an organic material;
A light emitting device comprising:
The light-emitting device according to claim 1.
The light emitting unit has a first side, a second side opposite to the first side, a third side between the first side and the second side, and a fourth side opposite to the third side. And
The second insulating layer is a light emitting device that is positioned along at least one of the first side, the second side, the third side, and the fourth side of the light emitting unit.
The light-emitting device according to claim 2.
The second insulating layer is a light emitting device located along the first side, the second side, the third side, and the fourth side.
The light emitting device according to claim 2 or 3,
A partition on the first insulating layer;
The second insulating layer has a first portion between the partition and the light emitting unit,
The organic layer includes a first region located in the light emitting unit and a second region on the first insulating layer,
The light emitting device, wherein the second region is opposed to the partition wall with the first portion interposed therebetween and is separated from the first portion.
The light-emitting device according to claim 4.
The light emitting device, wherein the first portion is separated from the partition wall.
The light-emitting device according to claim 1.
The substrate includes a light emitting region in which a plurality of the light emitting units are arranged,
The light emitting device wherein the second insulating layer is outside the light emitting region.
The light-emitting device according to claim 6.
The light emitting region has a first side, a second side opposite to the first side, a third side between the first side and the second side, and a fourth side opposite to the third side. And
The second insulating layer is a light emitting device that is located along at least one of the first side, the second side, the third side, and the fourth side of the light emitting region.
The light-emitting device according to claim 7.
The second insulating layer is a light emitting device located along the first side, the second side, the third side, and the fourth side.
The light emitting device according to any one of claims 6 to 8,
A partition on the first insulating layer;
The organic layer includes a first region located in the light emitting unit and a second region on the first insulating layer,
The light emitting device, wherein the second region of the organic layer is separated from the partition.
The light emitting device according to any one of claims 6 to 9,
The area of the second insulating layer is 8% or more with respect to the total area of the light emitting portions located in the light emitting region.
The light-emitting device according to claim 10.
The second insulating layer includes a first edge, a second edge, a third edge, and a fourth edge along the first side, the second side, the third side, and the fourth side of the light emitting region, respectively. Including an opening having
The first edge, the second edge, the third edge, and the fourth edge of the second insulating layer are respectively a first distance, a second distance, a third distance, and a fourth distance from the center of the light emitting region. Just away and
The longest distance among the first distance, the second distance, the third distance, and the fourth distance is 8 mm or less.
The light-emitting device according to claim 10.
The first edge, the second edge, the third edge, and the fourth edge of the second insulating layer are respectively a fifth distance, a sixth distance, a seventh distance, and an eighth distance from the center of the light emitting unit. Just away and
In any of the plurality of light emitting units, the longest distance among the fifth distance, the sixth distance, the seventh distance, and the eighth distance is 8 mm or less.
The light-emitting device according to claim 1 or 12,
The plurality of light emitting units in the light emitting region include a plurality of rows arranged in a first direction along the first side of the light emitting region and a plurality of rows arranged in a second direction along the third side of the light emitting region. Lined up in a matrix containing rows,
Each light emitting unit includes a first side extending in the first direction, a second side opposite to the first side, and extending in the second direction and extending between the first side and the second side. 3 sides and a fourth side opposite to the third side,
The first side of the light emitting unit in the row farthest from the second side of the light emitting region overlaps the first side of the light emitting region,
A second side of the light emitting unit in a row farthest from the first side of the light emitting region overlaps the second side of the light emitting region;
The third side of the light emitting part in the row farthest from the fourth side of the light emitting region overlaps the third side of the light emitting region;
A light emitting device in which a fourth side of a light emitting unit in a row farthest from the third side of the light emitting region overlaps with the fourth side of the light emitting region.
The light emitting device according to any one of claims 1 to 8,
The light emitting device, wherein the second insulating layer is on the first insulating layer.
The light-emitting device according to any one of claims 4, 5, 9 to 14,
A light emitting device comprising: a covering layer that continuously covers the first insulating layer, the second insulating layer, the light emitting unit, the side surfaces and the upper surface of the partition wall.
The light emitting device according to any one of claims 1 to 14,
The second insulating layer is a light emitting device made of polyimide.