WO2018062273A1

WO2018062273A1 - Light-emitting device

Info

Publication number: WO2018062273A1
Application number: PCT/JP2017/034959
Authority: WO
Inventors: 吉田　綾子
Original assignee: パイオニア株式会社
Priority date: 2016-09-28
Filing date: 2017-09-27
Publication date: 2018-04-05

Abstract

A plurality of sealing portions (160) respectively seal a plurality of light-emitting portions (152). A first sealing portion (161) and a second sealing portion (163) among the plurality of sealing portions (160) respectively seal a first light-emitting portion (151) and a second light-emitting portion (153) among the plurality of light-emitting portions (152). The first sealing portion (161) and the second sealing portion (163) are adjacent to one another, and the first light-emitting portion (151) and the second light-emitting portion (153) are adjacent to one another. The first sealing portion (161) and the second sealing portion (163) respectively have a first end portion (161a) and a second end portion (163b). The first end portion (161a) and the second end portion (163b) overlap with a non-light-emitting portion (154) between the first light-emitting portion (151) and the second light-emitting portion (153).

Description

Light emitting device

The present invention relates to a light emitting device.

Recently, organic light emitting diodes (OLEDs) have been developed as light emitting devices. The light emitting part of the OLED has an organic layer, and emits light by electroluminescence of the organic layer.

In OLED, the organic layer may be deteriorated by water. Patent Document 1 describes a structure for preventing moisture from entering an organic layer with respect to an OLED. The OLED described in Patent Document 1 includes a first electrode, an insulating layer, an organic layer, and a second electrode. The insulating layer has an opening exposing a part of the first electrode. The organic layer overlaps the opening of the insulating layer. The second electrode overlaps the opening of the insulating layer and covers the entire organic layer. This prevents moisture from entering the organic layer. The end of the second electrode is on the insulating layer and is not in contact with the first electrode. Thereby, the short circuit of the 1st electrode and the 2nd electrode is prevented.

Furthermore, in the OLED, the light emitting part may be sealed with a sealing part. Patent Document 2 describes an example of a method for sealing a light emitting unit. The OLED of Patent Document 2 includes a first substrate, a plurality of light emitting units, a second substrate, and a plurality of sealing materials. The plurality of light emitting units are on the first substrate. The second substrate overlaps the first substrate such that the plurality of light emitting units are located between the first substrate and the second substrate. Each of the plurality of sealing materials is between the first substrate and the second substrate and surrounds each of the plurality of light emitting units. In this way, the second substrate and the plurality of sealing materials function as a sealing portion.

JP 2014-154666 A JP 2006-172895 A

As described above, in the OLED, a sealing portion may be provided on the substrate. On the other hand, when such a sealing portion is provided, when the substrate is bent, bending stress is generated in the sealing portion. Such bending stress may act on the sealing portion so that the sealing portion is peeled off from the substrate or the sealing portion is damaged, for example.

An example of a problem to be solved by the present invention is to reduce bending stress generated in a sealing portion when a substrate is bent in an OLED.

The invention described in claim 1
A substrate having a first surface;
A plurality of light emitting units located on the first surface side of the substrate and each including a stacked structure of a first electrode, an organic layer, and a second electrode;
A non-light emitting part located between the first light emitting part and the second light emitting part adjacent to each other among the plurality of light emitting parts;
A first sealing portion for sealing the first light emitting portion;
A second sealing portion for sealing the second light emitting portion;
With
The first sealing portion has a first end overlapping the non-light emitting portion,
The second sealing portion is a light emitting device having a second end overlapping the non-light emitting portion.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

It is a top view which shows the light-emitting device which concerns on embodiment. It is the figure which removed the organic layer and the 2nd electrode from FIG. It is the figure which removed the insulating layer from FIG. It is the figure which expanded the area | region (alpha) shown in FIG. FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 5 is a sectional view taken along line BB in FIG. 4. FIG. 5 is a cross-sectional view taken along the line CC of FIG. FIG. 5 is a DD cross-sectional view of FIG. 4. It is a figure which shows the 1st modification of FIG. It is a figure which shows the 2nd modification of FIG. 1 is a cross-sectional view illustrating a light emitting device according to Example 1. FIG. It is a figure which shows the modification of FIG. 6 is a cross-sectional view showing a light emitting device according to Example 2. FIG. 6 is a cross-sectional view illustrating a light emitting device according to Example 3. FIG. 6 is a plan view showing a light emitting device according to Example 4. FIG. FIG. 16 is a sectional view taken along line BB in FIG. 6 is a plan view showing a light emitting device according to Example 5. FIG. FIG. 18 is a sectional view taken along line BB in FIG. 6 is a plan view showing a light emitting device according to Example 6. FIG. FIG. 20 is a sectional view taken along line BB in FIG. 12 is a plan view showing a light emitting device according to Example 7. FIG. FIG. 22 is a cross-sectional view taken along line EE in FIG. 21. 10 is a cross-sectional view showing a light emitting device according to Example 8. FIG. 10 is a cross-sectional view showing a light emitting device according to Example 9. FIG. FIG. 12 is a cross-sectional view illustrating a light emitting device according to Example 10.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 is a plan view showing a light emitting device 10 according to the embodiment. FIG. 2 is a diagram in which the organic layer 120 and the second electrode 130 are removed from FIG. FIG. 3 is a diagram in which the insulating layer 140 is removed from FIG. FIG. 4 is an enlarged view of the region α shown in FIG. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 6 is a cross-sectional view taken along the line BB of FIG. 7 is a cross-sectional view taken along the line CC of FIG. 8 is a cross-sectional view taken along the line DD of FIG. For the sake of explanation, the sealing member 200 (FIG. 5) is not shown in FIGS. 1 to 4 and FIGS.

The outline of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a plurality of light emitting units 152, a plurality of non-light emitting units 154, and a plurality of sealing units 160. The substrate 100 has a first surface 102. The plurality of light emitting units 152 are located on the first surface 102 side of the substrate 100. Each of the light emitting units 152 includes a stacked structure of the first electrode 110, the organic layer 120, and the second electrode 130. The plurality of light emitting units 152 and the plurality of non-light emitting units 154 are alternately arranged. Each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. As shown in the drawing, the first sealing portion 161 and the second sealing portion 163 of the plurality of sealing portions 160 are the first light emitting portion 151 and the second light emitting portion 153 of the plurality of light emitting portions 152. Each is sealed. The first sealing portion 161 and the second sealing portion 163 are adjacent to each other, and the first light emitting portion 151 and the second light emitting portion 153 are adjacent to each other. The 1st sealing part 161 and the 2nd sealing part 163 have the 1st end part 161a and the 2nd end part 163b, respectively. The first end portion 161 a and the second end portion 163 b overlap the non-light emitting portion 154 between the first light emitting portion 151 and the second light emitting portion 153. More specifically, the first end portion 161a is located between the first light emitting portion 151 and the second end portion 163b, and the second end portion 163b is the second sealing portion 163 and the first end. It is located between the part 161a. Further, the second end 163b is separated from the first end 161a.

In the example shown in this drawing, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. For this reason, even if the substrate 100 is curved along the arrangement direction of the plurality of light emitting portions 152, the bending stress generated in each of the plurality of sealing portions 160 is small.

Furthermore, in the example shown in this drawing, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, even if any of the plurality of sealing portions 160 is damaged, the light emitting portion 152 sealed by the other sealing portions 160 is not affected.

Further, in the example shown in this drawing, the first surface 102 of the substrate 100 is the first between the first end 161a and the second end 163b (the region 102c in this drawing) of the non-light emitting portion 154. None of the electrode 110, the organic layer 120, and the second electrode 130 overlaps. In other words, the light emitting device 10 has a region (translucent region) that transmits light in a direction perpendicular to the substrate 100 between the first end 161a and the second end 163b. For this reason, the light transmittance in the region 102c is high.

Furthermore, in the example shown in this drawing, the entire substrate 100 is made of an inorganic material, specifically glass, and the sealing portion 160 contains an inorganic material. For this reason, the water vapor transmission rate of the substrate 100 and the water vapor transmission rate of the inorganic layer 160 are both low. In this way, the substrate 100 and the inorganic layer 160 function as a barrier layer for blocking water vapor. For this reason, water vapor is prevented from entering the organic layer 120 from the substrate 100 or the inorganic layer 160.

Furthermore, in the example shown in this drawing, the sealing portion 160 is in contact with the first surface 102 of the substrate 100. For this reason, water vapor is prevented from entering between the sealing portion 160 and the substrate 100.

In the example shown in the figure, the second electrode 130 functions as the sealing portion 160. The second electrode 130 covers the organic layer 120 and includes a conductive material. Thereby, the second electrode 130 functions as a conductive layer for applying a voltage to the organic layer 120. Furthermore, as described above, the water vapor permeability of the second electrode 130 (sealing part 160) is low. In this way, the second electrode 130 functions as a barrier layer for blocking water vapor.

Next, the details of the planar layout of the light emitting device 10 will be described with reference to FIGS. The light emitting device 10 includes a substrate 100, a plurality of first electrodes 110, a plurality of first connection portions 112, a plurality of first terminals 114, a first wiring 116, a plurality of second electrodes 130 (a plurality of sealing portions 160), A plurality of second connection portions 132, a plurality of second terminals 134, a second wiring 136, and a plurality of insulating layers 140 are provided.

The shape of the substrate 100 is a rectangle having a pair of long sides and a pair of short sides when viewed from a direction perpendicular to the first surface 102. However, the shape of the substrate 100 is not limited to the example shown in this figure. The shape of the substrate 100 may be, for example, a circle or a polygon other than a rectangle when viewed from a direction perpendicular to the first surface 102.

The plurality of first electrodes 110 are spaced apart from each other, and are specifically arranged in a line along the long side of the substrate 100. Each of the plurality of first electrodes 110 extends along the short side of the substrate 100.

Each of the plurality of first electrodes 110 is connected to each of the plurality of first terminals 114 via each of the plurality of first connection portions 112. The plurality of first terminals 114 are connected to each other by the first wiring 116. The first wiring 116 extends along one of the pair of long sides of the substrate 100. An external voltage is supplied to the first electrode 110 via the first wiring 116, the first terminal 114, and the first connection portion 112. In the example shown in the figure, the first electrode 110, the first connection portion 112, and the first terminal 114 are integrated with each other. In other words, the light emitting device 10 includes a conductive layer having a region functioning as the first electrode 110, a region functioning as the first connection portion 112, and a region functioning as the first terminal 114.

Each of the plurality of second electrodes 130 overlaps each of the plurality of first electrodes 110. The plurality of second electrodes 130 are spaced apart from each other, specifically, aligned in a line along the long side of the substrate 100. Each of the plurality of second electrodes 130 extends along the short side of the substrate 100, specifically, along a pair of long sides extending along the short side of the substrate 100 and a long side of the substrate 100. And a pair of short sides extending.

Each of the plurality of second electrodes 130 is connected to each of the plurality of second terminals 134 via each of the plurality of second connection portions 132. The plurality of second terminals 134 are connected to each other by the second wiring 136. The second wiring 136 is opposed to the first wiring 116 across the plurality of first electrodes 110 and the plurality of second electrodes 130, and extends along the other of the pair of long sides of the substrate 100. An external voltage is supplied to the second electrode 130 via the second wiring 136, the second terminal 134, and the second connection part 132. In the example shown in the figure, the second connection portion 132 and the second terminal 134 are integrated with each other. In other words, the light emitting device 10 includes a conductive layer having a region functioning as the second connection portion 132 and a region functioning as the second terminal 134.

Each of the plurality of insulating layers 140 overlaps each of the plurality of first electrodes 110. The plurality of insulating layers 140 are spaced apart from each other, and specifically are arranged in a line along the long side of the substrate 100. Each of the plurality of insulating layers 140 extends along the short side of the substrate 100, specifically, along the pair of long sides extending along the short side of the substrate 100 and the long side of the substrate 100. It has a pair of short sides that extend.

Each of the plurality of insulating layers 140 has an opening 142. As will be described later with reference to FIG. 6, in the opening 142, the first electrode 110, the organic layer 120, and the second electrode 130 are regions that function as the light emitting unit 150 (the first electrode 110, the organic layer 120, and the second electrode). 130 laminated structures). In other words, the insulating layer 140 defines the light emitting unit 150. The light emitting unit 150 (opening 142) extends along the short side of the substrate 100. Specifically, the light emitting unit 150 (opening 142) extends along the pair of long sides extending along the short side of the substrate 100 and the long side of the substrate 100. It has a pair of short sides that extend.

Next, an example of the sealing member 200 will be described with reference to FIG. In the example shown in this drawing, the light emitting device 10 includes a sealing member 200. The sealing member 200 seals the first surface 102 of the substrate 100, the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140. Specifically, the sealing member 200 has an adhesive layer 210 and a covering layer 220. The adhesive layer 210 covers the first surface 102 of the substrate 100, the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140. The adhesive layer 210 includes, for example, an organic material. The covering layer 220 is attached to the first surface 102 of the substrate 100 via the adhesive layer 210. The coating layer 220 has translucency and is, for example, a glass substrate.

The covering layer 220 covers at least one of the plurality of sealing portions 160, and covers all of the plurality of sealing portions 160 in the example shown in the drawing. Note that each of the plurality of coating layers 220 may cover each of the plurality of sealing portions 160. The covering layer 220 functions as a protective member for protecting the sealing portion 160 from external impacts.

In the example shown in the figure, the outgas from the interface between the adhesive layer 210 and the coating layer 220 or from the adhesive layer 210 may contain water vapor. Such water vapor can cause deterioration of the organic layer 120. In the example shown in this figure, even if such water vapor exists, the substrate 100 and the second electrode 130 (sealing portion 160) function as a barrier layer for blocking water vapor. For this reason, water vapor is prevented from entering the organic layer 120.

Next, details of a cross section perpendicular to the length direction of the light emitting unit 150 (the direction along the long side of the light emitting unit 150) of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a first electrode 110, an organic layer 120, a second electrode 130 (sealing portion 160), and an insulating layer 140. The substrate 100 has a first surface 102 and a second surface 104. The second surface 104 is on the opposite side of the first surface 102. The first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140 are on the first surface 102 of the substrate 100. In the opening 142 of the insulating layer 140, the first electrode 110, the organic layer 120, and the second electrode 130 have a region that functions as the light emitting unit 150. In this region, the first electrode 110, the organic layer 120, and The second electrodes 130 overlap each other.

The substrate 100 has translucency. Specifically, in the example shown in the figure, the substrate 100 is a glass substrate, in other words, includes an inorganic material (that is, glass). The water vapor transmission rate of glass is low. In this way, the substrate 100 functions as a barrier layer for blocking water vapor. In the example shown in this drawing, a part of the surface of the glass substrate described above functions as the first surface 102 of the substrate 100. Thus, the 1st surface 102 of the board | substrate 100 contains the inorganic material (namely, glass).

The substrate 100 may have flexibility. In this case, in the example shown in this drawing, the flexibility of the light emitting device 10 is suppressed from being hindered by the sealing portion 160. Specifically, in the example shown in this drawing, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. In this case, when the substrate 100 is bent, the stress acting on the substrate 100 from the sealing portion 160 is small. For this reason, in the example shown to this figure, it is suppressed that the flexibility of the light-emitting device 10 is inhibited by the sealing part 160. FIG.

The first electrode 110 has translucency and conductivity. Specifically, the first electrode 110 includes a material having translucency and conductivity, for example, a metal oxide, for example, ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide), In ₂ O ₃ , ZnO, AZO (Aluminum-doped Zinc Oxide), GZO (Gallium-doped Zinc Oxide), ATO (Antimony-doped Tin Oxide), and IGZO (Indium Galium Zinc Oxide). Accordingly, light from the organic layer 120 can pass through the first electrode 110.

The organic layer 120 includes, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. The hole injection layer and the hole transport layer are connected to the first electrode 110. The electron transport layer and the electron injection layer are connected to the second electrode 130. The light emitting layer emits light by a voltage between the first electrode 110 and the second electrode 130.

The second electrode 130 (sealing portion 160) has light reflectivity, conductivity, and water vapor barrier properties. Specifically, the second electrode 130 includes an inorganic material having light reflectivity, conductivity, and water vapor barrier properties, such as metal, specifically, for example, Al, Ag, MgAg, Cr, Au, Cu. , Pt, and Pd. In particular, the second electrode 130 preferably contains Al. Thereby, the light from the organic layer 120 is reflected by the second electrode 130 with hardly passing through the second electrode 130. In other words, in the example shown in this drawing, the light emitting device 10 is bottom emission, and most of the light from the organic layer 120 is emitted from the second surface 104 side. Furthermore, the second electrode 130 functions as a barrier layer for blocking water vapor.

In addition, due to the light reflectivity of the second electrode 130 (sealing portion 160), the second electrode 130 (sealing portion 160) has a light shielding property. For this reason, in the example shown to this figure, it is suppressed that the light from the organic layer 120 leaks from the 2nd electrode 130 (sealing part 160).

The insulating layer 140 has translucency. In one example, the insulating layer 140 includes an organic insulating material, specifically, for example, polyimide. In another example, the insulating layer 140 may include an inorganic insulating material, specifically, for example, silicon oxide (SiO _x ), silicon oxynitride (SiON), or silicon nitride (SiN _x ).

The first electrode 110 has an end portion 110a and an end portion 110b, the organic layer 120 has an end portion 120a and an end portion 120b, the second electrode 130 has an end portion 130a and an end portion 130b, and the insulating layer 140. Has an end portion 140a and an end portion 140b, and the opening 142 has an end portion 142a and an end portion 142b. The end part 110a, the end part 120a, the end part 130a, the end part 140a, and the end part 142a are oriented in the same direction. The end part 110b, the end part 120b, the end part 130b, the end part 140b, and the end part 142b face the same direction, and the end part 110a, the end part 120a, the end part 130a, the end part 140a, and the end part 142a, respectively. On the other side. As shown in FIG. 5, the end portion 130a functions as the first end portion 161a, and the end portion 130b functions as the second end portion 163b.

The insulating layer 140 has a side surface 144a, a side surface 144b, a side surface 146a, and a side surface 146b. The side surface 144a and the side surface 144b face the outside of the light emitting unit 150, and are on the end portion 110a side and the end portion 110b side of the first electrode 110, respectively. The side surface 146a and the side surface 146b face the inside of the light emitting unit 150, and are respectively on the end portion 110a side and the end portion 110b side of the first electrode 110.

The insulating layer 140 covers the end 110a and the end 110b of the first electrode 110. In other words, in the width direction of the light emitting unit 150, the end 110a and the end 110b are respectively the end 140a and the end. 142a and between end 140b and end 142b. The insulating layer 140 is covered with the second electrode 130. In this way, the insulating layer 140 prevents the first electrode 110 and the second electrode 130 from contacting each other, i.e., the first electrode 110 and the second electrode 130 are not short-circuited to each other.

The end portion 120a and the end portion 120b of the organic layer 120 are respectively outside the end portion 142a and the end portion 142b of the opening 142, and specifically, both are on the upper surface of the insulating layer 140. Thereby, a part of the organic layer 120 covers the side surface 146a of the insulating layer 140, and another part of the organic layer 120 covers the side surface 146b of the insulating layer 140. Both the side surface 146a and the side surface 146b of the insulating layer 140 are inclined outward from the upper surface of the insulating layer 140 toward the lower surface. Thereby, the organic layer 120 becomes easy to follow along the side surface 146a and the side surface 146b. In this manner, a gap is prevented from being formed between the organic layer 120 and the side surface 146a and between the organic layer 120 and the side surface 146b.

The end portion 130 a and the end portion 130 b of the second electrode 130 are respectively outside the side surface 144 a and the side surface 144 b of the insulating layer 140, and specifically, both are in contact with the first surface 102 of the substrate 100. . Accordingly, a part of the second electrode 130 covers the side surface 144 a of the insulating layer 140, and another part of the organic layer 120 covers the side surface 144 b of the insulating layer 140. Both the side surface 144 a and the side surface 144 b of the insulating layer 140 are inclined to the outside of the insulating layer 140 from the upper surface to the lower surface of the insulating layer 140. Accordingly, the second electrode 130 is easily along the side surface 144a and the side surface 144b. In this way, the formation of gaps between the second electrode 130 and the side surface 144a and between the second electrode 130 and the side surface 144b is suppressed.

The first surface 102 of the substrate 100 has a plurality of regions 102a and a plurality of regions 102c. Each of the plurality of regions 102a overlaps with each of the plurality of first electrodes 110, and in the example illustrated in this drawing, extends from the end portion 130a to the end portion 130b of the second electrode 130. Each of the plurality of regions 102c does not overlap with the plurality of first electrodes 110, and in the example illustrated in the drawing, the end portion 130a of one second electrode 130 of the light emitting units 150 adjacent to each other is connected to the other first electrode 110a. The two electrodes 130 extend to the end portion 130b. Thus, the light emitting device 10 is perpendicular to the substrate 100 between the end portion 130a of one second electrode 130 and the end portion 130b of the other second electrode 130 of the light emitting portions 150 adjacent to each other. Has a region that transmits light (translucent region). The plurality of regions 102a and the plurality of regions 102c are arranged alternately.

It is preferable that the pitch ratio d3 / (d1 + d3) of the light emitting units 150 adjacent to each other is, for example, 0.3 or more and 0.9 or less (0.3 ≦ d3 / (d1 + d3) ≦ 0.9). When the ratio d3 / (d1 + d3) is 0.9 or less, the pitch of the light emitting units 150 adjacent to each other is narrowed to some extent. Therefore, in human vision, light appears to be emitted over the entire surface including the plurality of regions 102a and the plurality of regions 102c. When the ratio d3 / (d1 + d3) is 0.3 or more, the width of the region 102c (that is, the region where light can pass through the light emitting device 10) is increased to some extent. For this reason, in human vision, an object can be seen through the light emitting device 10 over the entire surface including the plurality of regions 102a and the plurality of regions 102c.

Next, details of a cross section perpendicular to the width direction of the light emitting unit 150 (the direction along the short side of the light emitting unit 150) of the light emitting device 10 will be described with reference to FIGS.

The first electrode 110 has an end portion 110d, the organic layer 120 has an end portion 120c and an end portion 120d, the second electrode 130 has an end portion 130c and an end portion 130d, and the insulating layer 140 has an end portion 140c. In addition, the opening 142 has an end 142c and an end 142d. The end portion 120c, the end portion 130c, the end portion 140c, and the end portion 142c face each other in the same direction. The end part 110d, the end part 120d, the end part 130d, the end part 140d, and the end part 142d face each other in the same direction. The end portion 120d, the end portion 130d, the end portion 140d, and the end portion 142d are on opposite sides of the end portion 120c, the end portion 130c, the end portion 140c, and the end portion 142c, respectively.

The insulating layer 140 has a side surface 144c, a side surface 144d, a side surface 146c, and a side surface 146d. The side surface 144c and the side surface 144d face the outside of the light emitting unit 150, and are on the first terminal 114 side and the second terminal 134 side, respectively. The side surface 146c and the side surface 146d face the inside of the light emitting unit 150, and are on the first terminal 114 side and the second terminal 134 side, respectively.

The insulating layer 140 covers the end 110d of the first electrode 110. In other words, the end 110d is between the end 140d and the end 142d in the length direction of the light emitting unit 150. The insulating layer 140 is covered with the second electrode 130. In this way, the insulating layer 140 prevents the first electrode 110 and the second electrode 130 from contacting each other, i.e., the first electrode 110 and the second electrode 130 are not short-circuited to each other.

The edge part 120c and the edge part 120d of the organic layer 120 are respectively outside the edge part 142c and the edge part 142d of the opening 142, and specifically, both are on the upper surface of the insulating layer 140. Accordingly, a part of the organic layer 120 covers the side surface 146c of the insulating layer 140, and another part of the organic layer 120 covers the side surface 146d of the insulating layer 140. Both the side surface 146c and the side surface 146d of the insulating layer 140 are inclined outward from the upper surface of the insulating layer 140 toward the lower surface. Thereby, the organic layer 120 becomes easy to follow along the side surface 146c and the side surface 146d. In this way, gaps are prevented from being formed between the organic layer 120 and the side surface 146c and between the organic layer 120 and the side surface 146d.

The end portion 130c of the second electrode 130 is inside the end portion 140c of the insulating layer 140. In the example shown in the drawing, the end portion 130c is inside the end portion 120c of the organic layer 120 on the upper surface of the insulating layer 140. This prevents the second electrode 130 from coming into contact with the first connection part 112 and the first terminal 114, that is, the second electrode 130 is prevented from being short-circuited with the first connection part 112 and the first terminal 114. In the example shown in this drawing, the side surface 144c of the insulating layer 140 is inclined outward from the upper surface of the insulating layer 140 toward the lower surface.

The end portion 130d of the second electrode 130 is located outside the side surface 144d of the insulating layer 140, and specifically, is in contact with the upper surfaces of the second connection portion 132 and the second terminal 134. Thus, a part of the second electrode 130 covers the side surface 144d of the insulating layer 140. The side surface 144d of the insulating layer 140 is inclined outward from the upper surface of the insulating layer 140 toward the lower surface. Thereby, the 2nd electrode 130 becomes easy to follow along side 144d. In this way, a gap is prevented from being formed between the second electrode 130 and the side surface 144d.

Furthermore, in the example shown in this drawing, the second electrode 130 is located outside the end portion 110d of the first electrode 110, more specifically, between the second connection portion 132 and the insulating layer 140. It is in contact with the surface 102. Thereby, the organic layer 120 is surrounded by the barrier layer (that is, the substrate 100 and the sealing portion 160) from the side surface 144 d of the insulating layer 140 to the first surface 102 of the substrate 100. In this way, water vapor is prevented from entering the organic layer 120.

Next, a method for manufacturing the light emitting device 10 shown in FIGS. 1 to 8 will be described.

First, the first electrode 110, the first connection part 112, the first terminal 114, the second connection part 132, and the second terminal 134 are formed on the first surface 102 of the substrate 100. In one example, the first electrode 110, the first connection part 112, the first terminal 114, the second connection part 132, and the second terminal 134 are formed by patterning a conductive layer formed by sputtering.

Next, the insulating layer 140 is formed on the first electrode 110. In one example, the insulating layer 140 is formed by patterning a photosensitive resin applied on the first surface 102 of the substrate 100.

Next, the organic layer 120 is formed on the first electrode 110 and the insulating layer 140. In one example, the organic layer 120 is formed by vapor deposition. In this case, the organic layer 120 may be formed by abutting a metal mask against the insulating layer 140. In another example, the organic layer 120 may be formed by application. In this case, the material of the organic layer 120 is applied in the opening 142 of the insulating layer 140.

Next, the second electrode 130 is formed on the organic layer 120. In one example, the second electrode 130 is formed by vacuum deposition using a mask.

In this way, the light emitting device 10 shown in FIGS. 1 to 8 is manufactured.

FIG. 9 is a diagram showing a first modification of FIG. As shown in the figure, the sealing member 200 may be a sealing can 230. The sealing can 230 is bonded to the first surface 102 of the substrate 100 via an adhesive (not shown). A region between the second electrode 130 and the sealing can 230 is hollow. Further, a desiccant 232 is attached to the sealing can 230.

In the example shown in the figure, the interface between the sealing can 230 and the substrate 100 may contain water vapor. Such water vapor can cause deterioration of the organic layer 120. In the example shown in this figure, even if such water vapor exists, such water vapor is absorbed by the desiccant 232. Further, the substrate 100 and the second electrode 130 (sealing portion 160) function as a barrier layer for blocking water vapor. For this reason, water vapor is prevented from entering the organic layer 120.

Part of the sealing can 230 covers the sealing part 160 from the first surface 102 side of the substrate 100, and this part of the sealing can 230 functions as the covering layer 220 (FIG. 5). Yes. In other words, the coating layer 220 (sealing can 230) functions as a protective member for protecting the sealing portion 160 from external impacts.

FIG. 10 is a diagram showing a second modification of FIG. As shown in the figure, the sealing member 200 may be a sealing film 240. The sealing film 240 covers the first surface 102 of the substrate 100, the first electrode 110, the organic layer 120, and the second electrode 130 along the surface of the second electrode 130 and the first surface 102 of the substrate 100. More specifically, the sealing film 240 extends from one of the two light emitting units 150 adjacent to each other to the other, and in the example illustrated in this drawing, covers the entire surface of the first surface 102 of the substrate 100. It has spread.

The sealing film 240 is made of an inorganic material such as silicon nitride (SiN _x ), silicon oxynitride (SiON), silicon oxide (SiO _x ), aluminum oxide (Al _x O _y ), or titanium oxide (TiO 2). _x ), and is formed, for example, by sputtering, CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition).

In the example shown in the figure, the organic layer 120 is not exposed from the second electrode 130. Therefore, the sealing film 240 comes into contact with the inorganic member (that is, the first surface 102 of the substrate 100 or the surface of the sealing portion 160) in any region on the first surface 102 of the substrate 100. The adhesion of the sealing film 240 to the inorganic member (that is, the first surface 102 of the substrate 100 or the surface of the sealing portion 160) is higher than the adhesion of the sealing film 240 to the organic layer 120. Thus, in the example shown in this drawing, the sealing film 240 is firmly adhered to the first surface 102 of the substrate 100.

As described above, according to the present embodiment, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. Thereby, even if the board | substrate 100 is curved along the sequence direction of the some light emission part 152, the bending stress which generate | occur | produces in each of the some sealing part 160 becomes a small thing.

(Example 1)
FIG. 11 is a cross-sectional view illustrating the light emitting device 10 according to Example 1, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

In the example shown in the figure, the substrate 100 includes a resin substrate 100a and an inorganic layer 100b. The inorganic layer 100b is coated on the surface on the first surface 102 side of the resin substrate 100a. In other words, the resin substrate 100a functions as a first layer including a resin material, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide, and the inorganic layer 100b. Functions as a second layer comprising an inorganic material, for example, silicon nitride (SiN _x ), silicon oxynitride (SiON), silicon oxide (SiO _x ) or aluminum oxide (Al _x O _y ) . The inorganic layer 100 b has a surface opposite to the resin substrate 100 a, and this surface of the inorganic layer 100 b functions as the first surface 102 of the substrate 100. Thus, the 1st surface 102 of the board | substrate 100 contains the inorganic material.

The inorganic layer 100b has a water vapor barrier property. In this case, even if the water vapor transmission rate of the resin substrate 100a is high, the water vapor from the resin substrate 100a can be prevented from entering the organic layer 120.

In the example shown in this figure, the end part 130a and the end part 130b of the second electrode 130 (sealing part 160) overlap the non-light emitting part 154 on the outside of the end part 140a and the end part 140b of the insulating layer 140, respectively. ing. In this way, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. Thereby, even if the board | substrate 100 is curved along the sequence direction of the several light emission part 152, the bending stress which generate | occur | produces in each of the some sealing part 160 will become small.

Furthermore, the substrate 100 (resin substrate 100a) has flexibility. In the example shown in the drawing, the flexibility of the light emitting device 10 is suppressed from being hindered by the sealing portion 160. Specifically, in the example shown in this drawing, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. In this case, when the substrate 100 is bent, the stress acting on the substrate 100 from the sealing portion 160 is small. For this reason, in the example shown to this figure, it is suppressed that the flexibility of the light-emitting device 10 is inhibited by the sealing part 160. FIG.

FIG. 12 is a diagram showing a modification of FIG. As shown in this figure, the substrate 100 may have an inorganic layer 100c. The inorganic layer 100c is coated on the surface of the resin substrate 100a on the second surface 104 side. The inorganic layer 100c includes an inorganic material, for example, silicon nitride (SiN _x ), silicon oxynitride (SiON), silicon oxide (SiO _x ), or aluminum oxide (Al _x O _y ). The inorganic layer 100c has a water vapor barrier property. Thereby, it is possible to prevent the water vapor on the second surface 104 side from entering the resin substrate 100a.

(Example 2)
FIG. 13 is a cross-sectional view illustrating the light emitting device 10 according to Example 2, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

In the example shown in this drawing, the light emitting device 10 includes a second electrode 130 and a sealing portion 160. The sealing portion 160 covers the second electrode 130, and is disposed on the first surface 102 of the substrate 100 outside the end portions of the first electrode 110 (the end portion 110 a and the end portion 110 b in the example shown in the figure). It touches. The sealing part 160 is an inorganic layer. Specifically, the sealing part 160 is a barrier material such as silicon nitride (SiN _x ), silicon oxynitride (SiON), or silicon oxide (SiO _x ). , At least one of aluminum oxide (Al _x O _y ) and titanium oxide (TiO _x ).

The sealing part 160 has a water vapor barrier property. For this reason, it is suppressed that water vapor | steam penetrate | invades into the organic layer 120 from the sealing part 160. FIG.

Furthermore, in the example shown in this drawing, the organic layer 120 can be covered with the barrier layer (that is, the sealing portion 160) without increasing the width of the second electrode 130. For this reason, it is possible to prevent the width of the light shielding region (that is, the region overlapping with the second electrode 130) from increasing. Specifically, the end portion 130a and the end portion 130b of the second electrode 130 are inside the end portion 140a and the end portion 140b of the insulating layer 140, respectively. In the example shown in the drawing, the upper surface of the insulating layer 140 is provided. Above, they are inside the end 120a and the end 120b of the organic layer 120, respectively.

The sealing part 160 has an end part 160a and an end part 160b. The end part 160a and the end part 160b of the sealing part 160 are on the end part 110a side and the end part 110b side of the first electrode 110, respectively. More specifically, the end portion 160a and the end portion 160b of the sealing portion 160 overlap the non-light emitting portion 154 on the outside of the end portion 140a and the end portion 140b of the insulating layer 140, respectively. In this way, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. Thereby, even if the board | substrate 100 is curved along the sequence direction of the some light emission part 152, the bending stress which generate | occur | produces in each of the some sealing part 160 becomes a small thing.

Furthermore, in the example shown in this figure, the sealing part 160 has translucency. For this reason, it is suppressed that the light transmittance of the light-emitting device 10 is inhibited by the sealing portion 160.

The first surface 102 of the substrate 100 has a plurality of regions 102a, a plurality of regions 102b, and a plurality of regions 102c. Each of the plurality of regions 102a overlaps the light shielding member (second electrode 130 in the example shown in the figure), and in the example shown in the figure, extends from the end part 130a to the end part 130b of the second electrode 130. Yes. Each of the plurality of regions 102b does not overlap with the light shielding member (the second electrode 130 in the example shown in this figure), and the light transmitting member (the insulating layer 140 and the sealing portion 160 in the example shown in this figure). In the example shown in this figure, from the end portion 130a of the second electrode 130 to the end portion 160a of the sealing portion 160 (or from the end portion 130b of the second electrode 130 to the end portion 160b of the sealing portion 160). It has spread. Each of the plurality of regions 102c does not overlap with the light shielding member (second electrode 130 in the example shown in this figure) and the light transmitting member (in the example shown in this figure, the insulating layer 140 and the sealing portion 160). In the example shown in this figure, the two light emitting units 150 adjacent to each other extend from the end 160a of one sealing unit 160 to the end 160b of the other sealing unit 160.

Each of the plurality of regions 102 a overlaps each of the plurality of first electrodes 110. Each of the plurality of regions 102 c does not overlap with the plurality of first electrodes 110. When only the plurality of regions 102a and the plurality of regions 102c are viewed among the plurality of regions 102a, the plurality of regions 102b, and the plurality of regions 102c, the plurality of regions 102a and the plurality of regions 102c are alternately arranged.

In the example shown in the figure, the width d2 of the region 102b is shorter than the width d3 of the region 102c. For this reason, the light transmittance of the light emitting device 10 is high. Specifically, as described above, the region 102b overlaps with the translucent member (the insulating layer 140 and the sealing portion 160), whereas the region 102c does not overlap with such a translucent member. For this reason, the light transmittance of the region 102c is higher than the light transmittance of the region 102b. Thereby, the light transmittance of the light-emitting device 10 is high.

Furthermore, in the example shown in this figure, the light emitting device 10 is suppressed from functioning as a filter that blocks light of a specific wavelength. Specifically, the light transmittance of the insulating layer 140 and the light transmittance of the sealing portion 160 may differ depending on the wavelength. For this reason, the insulating layer 140 and the sealing portion 160 can function as a filter that blocks light of a specific wavelength. In the example shown in this figure, as described above, the width d2 of the region 102b (the region overlapping with the insulating layer 140 and the sealing portion 160) is narrow, specifically, narrower than the width d3 of the region 102c. For this reason, it is suppressed that the light-emitting device 10 functions as a filter which interrupts | blocks the light of a specific wavelength.

In the example shown in the figure, the width d2 of the region 102b is, for example, 0 to 0.3 times (0 ≦ d2 / d1 ≦ 0.3) the width d1 of the region 102a. The width d3 of the region 102c is, for example, not less than 0.3 times and not more than 3 times the width d1 of the region 102a (0.3 ≦ d3 / d1 ≦ 3). The width d1 of the region 102a is, for example, not less than 50 μm and not more than 500 μm. The width d2 of the region 102b is, for example, not less than 0 μm and not more than 100 μm. The width d3 of the region 102c is 15 μm or more and 1000 μm or less.

(Example 3)
FIG. 14 is a cross-sectional view illustrating the light emitting device 10 according to Example 3, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

The first electrode 110 has light reflectivity and conductivity. Specifically, the first electrode 110 includes a material having light reflectivity and conductivity, and includes, for example, metal, specifically, for example, at least one of Al, Ag, and MgAg. Thereby, the light from the organic layer 120 is reflected by the first electrode 110 with almost no transmission through the first electrode 110. In other words, in the example shown in the drawing, the light emitting device 10 is top emission, and most of the light from the organic layer 120 is emitted from the first surface 102 side.

The second electrode 130 (sealing portion 160) has translucency, conductivity, and water vapor barrier properties. Specifically, the second electrode 130 includes an inorganic material having translucency, conductivity, and water vapor barrier properties, such as a metal oxide, specifically, for example, ITO, IZO, In ₂ O ₃ , It contains at least one of ZnO, AZO, GZO, ATO and IGZO. Thereby, the light from the organic layer 120 can pass through the second electrode 130 (sealing part 160). Furthermore, the second electrode 130 functions as a barrier layer for blocking water vapor.

The first surface 102 of the substrate 100 has a plurality of regions 102a, a plurality of regions 102b, and a plurality of regions 102c. Each of the plurality of regions 102a overlaps the light shielding member (first electrode 110 in the example shown in the figure), and in the example shown in the figure, extends from the end 110a to the end 110b of the first electrode 110. Yes. Each of the plurality of regions 102b does not overlap with the light shielding member (the first electrode 110 in the example shown in the figure), and the light transmitting member (the second electrode 130 and the insulating layer 140 in the example shown in the figure). In the example shown in this figure, from the end 110a of the first electrode 110 to the end 130a of the second electrode 130 (or from the end 110b of the first electrode 110 to the end 130b of the second electrode 130). It has spread. Each of the plurality of regions 102c does not overlap with the light shielding member (the first electrode 110 in the example shown in this figure) and the light transmitting member (the second electrode 130 and the insulating layer 140 in the example shown in this figure). In the example shown in this drawing, the two light emitting units 150 adjacent to each other extend from the end 130a of one second electrode 130 to the end 130b of the other second electrode 130.

Each of the plurality of regions 102 a overlaps each of the plurality of first electrodes 110. Each of the plurality of regions 102 c does not overlap with the plurality of first electrodes 110. The plurality of regions 102a and the plurality of regions 102c are arranged alternately.

In the example shown in the figure, the width d2 of the region 102b is shorter than the width d3 of the region 102c. For this reason, the light transmittance of the light emitting device 10 is high for the same reason as described with reference to FIG. Furthermore, it is suppressed that the light emitting device 10 functions as a filter that blocks light of a specific wavelength.

In the example shown in this figure, the end part 130a and the end part 130b of the second electrode 130 (sealing part 160) overlap the non-light emitting part 154 on the outside of the end part 140a and the end part 140b of the insulating layer 140, respectively. ing. In this way, each of the plurality of sealing portions 160 seals each of the plurality of light emitting portions 152. For this reason, the length of each of the plurality of sealing portions 160 is shortened in the arrangement direction of the plurality of light emitting portions 152. Thereby, even if the board | substrate 100 is curved along the sequence direction of the some light emission part 152, the bending stress which generate | occur | produces in each of the some sealing part 160 becomes a small thing.

Example 4
FIG. 15 is a plan view showing the light emitting device 10 according to Example 4, and corresponds to FIG. 4 of the embodiment. 16 is a cross-sectional view taken along the line BB of FIG. 15, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

In the example shown in the figure, the light emitting device 10 includes a plurality of conductive portions 170 (conductive portions 172 and conductive portions 174). The conductive part 172 and the conductive part 174 extend along the length direction of the first electrode 110. The conductive portion 172 is on the upper surface of the first electrode 110 in the vicinity of the end portion 110 a of the first electrode 110 and is covered with the insulating layer 140. The conductive portion 174 is on the upper surface of the first electrode 110 in the vicinity of the end portion 110 b of the first electrode 110 and is covered with the insulating layer 140.

The conductive portion 172 and the conductive portion 174 function as auxiliary electrodes for the first electrode 110 and are electrically connected to the first electrode 110. Specifically, the conductivity of the conductive part 172 and the conductivity of the conductive part 174 are higher than the conductivity of the first electrode 110. The conductive part 172 and the conductive part 174 include, for example, Al, Ag, an Al alloy, or an Ag alloy. In this way, a voltage drop due to the first electrode 110 can be suppressed.

(Example 5)
FIG. 17 is a plan view illustrating the light emitting device 10 according to Example 5, and corresponds to FIG. 4 of the embodiment. FIG. 18 is a cross-sectional view taken along the line BB of FIG. 17 and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

As shown in FIG. 17, the light emitting device 10 includes a plurality of insulating layers 180 (insulating layers 182 and 184). The plurality of insulating layers 180 extend along the length direction of the light emitting unit 150. The insulating layer 182 and the insulating layer 184 face each other with the insulating layer 140 interposed therebetween.

As shown in FIG. 18, the insulating layer 182 has an end 182a, an end 182b, a side 182c, and a side 184d. The end portion 182a faces the outside of the light emitting unit 150. The end 182b is on the opposite side of the end 182a and faces the inside of the light emitting unit 150. The side surface 182c faces the outside of the light emitting unit 150. The side surface 182d is on the opposite side of the side surface 182c and faces the inside of the light emitting unit 150. The insulating layer 184 includes an end portion 184a, an end portion 184b, a side surface 184c, and a side surface 184d. The end portion 184a faces the outside of the light emitting unit 150. The end 184 b is on the opposite side of the end 184 a and faces the inside of the light emitting unit 150. The side surface 184 c faces the outside of the light emitting unit 150. The side surface 184d is on the opposite side of the side surface 184c and faces the inside of the light emitting unit 150.

In one example, the insulating layer 182 and the insulating layer 184 include an organic insulating material, specifically, for example, polyimide. In other examples, the insulating layer 182 and the insulating layer 184 include an inorganic insulating material, specifically, for example, silicon oxide (SiO _x ), silicon oxynitride (SiON), or silicon nitride (SiN _x ). You may go out.

The insulating layer 182 and the insulating layer 184 are on the first surface 102 of the substrate 100. The insulating layer 182 and the insulating layer 184 are located outside the end portion 110a and the end portion 110b of the first electrode 110, respectively, and are separated from the end portion 140a and the end portion 140b of the insulating layer 140, respectively. The second electrode 130 is in contact with the first surface 102 of the substrate 100 between the end portion 140 a of the insulating layer 140 and the end portion 182 b of the insulating layer 182, and the end portion 140 b of the insulating layer 140 and the end portion of the insulating layer 184. It is in contact with the first surface 102 of the substrate 100 between 184b.

In the example shown in this drawing, when the second electrode 130 is formed, the second electrode 130 can be deposited by abutting a metal mask against the upper surface of the insulating layer 182 and the upper surface of the insulating layer 184. For this reason, the width of the second electrode 130 can be precisely controlled. Furthermore, in the example shown in this drawing, the thickness of the insulating layer 182 and the thickness of the insulating layer 184 are substantially equal to each other. Therefore, when the second electrode 130 is deposited using a metal mask, the metal mask is placed on the upper surface of the insulating layer 182 and the upper surface of the insulating layer 184 so that the metal mask is substantially parallel to the first surface 102 of the substrate 100. You can hit it. Furthermore, in the example shown in this drawing, since the metal mask is abutted against the upper surface of the insulating layer 182 and the upper surface of the insulating layer 184, it is not necessary to abut the metal mask against the upper surface of the insulating layer 140. If the metal mask is abutted against the upper surface of the insulating layer 140, the insulating layer 140 and the light emitting unit 150 may be damaged. In the example shown in the figure, the possibility of such damage can be reduced as much as possible.

The end portion 130a of the second electrode 130 is between the end portion 182a and the end portion 182b of the insulating layer 184 in the width direction of the light emitting unit 150, and is on the upper surface of the insulating layer 182 in the example shown in this drawing. In this way, the second electrode 130 covers at least a part of the insulating layer 182. Accordingly, the second electrode 130 covers the first surface 102 of the substrate 100 between the end portion 140 a of the insulating layer 140 and the end portion 182 b of the insulating layer 182. It comes in contact with the surface 102 reliably.

The end portion 130b of the second electrode 130 is between the end portion 184a and the end portion 184b of the insulating layer 184 in the width direction of the light emitting unit 150, and is on the upper surface of the insulating layer 184 in the example shown in this drawing. In this way, the second electrode 130 covers at least a part of the insulating layer 184. Accordingly, the second electrode 130 covers the first surface 102 of the substrate 100 between the end portion 140b of the insulating layer 140 and the end portion 184b of the insulating layer 184. It comes in contact with the surface 102 reliably.

The side surface 182 d of the insulating layer 182 is covered with a part of the second electrode 130. The side surface 182d is inclined to the outside of the insulating layer 182 as it goes from the upper surface to the lower surface of the insulating layer 182. Thereby, the 2nd electrode 130 becomes easy to follow along side 182d. For this reason, the formation of a gap between the second electrode 130 and the side surface 182d is suppressed. In the example shown in this figure, the side surface 182c is also inclined to the outside of the insulating layer 182 from the upper surface to the lower surface of the insulating layer 182.

The side surface 184 d of the insulating layer 184 is covered with a part of the second electrode 130. The side surface 184d is inclined to the outside of the insulating layer 184 as it goes from the upper surface to the lower surface of the insulating layer 184. Thereby, the 2nd electrode 130 becomes easy to follow along side 184d. For this reason, the formation of a gap between the second electrode 130 and the side surface 184d is suppressed. In the example shown in this figure, the side surface 184c is also inclined to the outside of the insulating layer 184 as it goes from the upper surface to the lower surface of the insulating layer 184.

The first surface 102 of the substrate 100 has a plurality of regions 102a, a plurality of regions 102b, and a plurality of regions 102c. Each of the plurality of regions 102a overlaps the light shielding member (second electrode 130 in the example shown in the figure), and in the example shown in the figure, extends from the end part 130a to the end part 130b of the second electrode 130. Yes. Each of the plurality of regions 102b does not overlap with the light shielding member (second electrode 130 in the example shown in this figure) but overlaps with the light transmitting member (insulating layer 180 in the example shown in this figure). In the example shown in the figure, it extends from the end 130a of the second electrode 130 to the end 182a of the insulating layer 182 (or from the end 130b of the second electrode 130 to the end 184a of the insulating layer 184). Each of the plurality of regions 102c does not overlap with the light shielding member (second electrode 130 in the example shown in this figure) and the light transmitting member (insulating layer 180 in the example shown in this figure), and the example shown in this figure. Then, it extends from the end 182 a of one insulating layer 182 of the two light emitting units 150 adjacent to each other to the end 184 a of the other insulating layer 184.

(Example 6)
FIG. 19 is a plan view illustrating the light emitting device 10 according to the sixth embodiment, which corresponds to FIG. 17 of the fifth embodiment. 20 is a cross-sectional view taken along the line BB in FIG. 19 and corresponds to FIG. 18 in the fifth embodiment. The light emitting device 10 according to the present example is the same as the light emitting device 10 according to the example 5 except for the following points.

As shown in FIG. 19, the light emitting device 10 includes a plurality of dummy electrodes 190 (a dummy electrode 191, a dummy electrode 192, a dummy electrode 193, a dummy electrode 194, a dummy electrode 195, and a dummy electrode 196). The plurality of dummy electrodes 190 extend along the length direction of the light emitting unit 150.

As shown in FIG. 20, the plurality of dummy electrodes 190 are on the first surface 102 of the substrate 100. The dummy electrode 191 and the dummy electrode 192 are covered with the insulating layer 140. Specifically, the end portion 140a and the end portion 140b of the insulating layer 140 are on the upper surface of the dummy electrode 191 and the upper surface of the dummy electrode 192, respectively. is there. The dummy electrode 193 and the dummy electrode 194 are covered with an insulating layer 182. Specifically, the end portion 182a and the end portion 182b of the insulating layer 182 are on the upper surface of the dummy electrode 193 and the upper surface of the dummy electrode 194, respectively. is there. The dummy electrode 195 and the dummy electrode 196 are covered with an insulating layer 184. Specifically, the end 184a and the end 184b of the insulating layer 184 are on the upper surface of the dummy electrode 195 and the upper surface of the dummy electrode 196, respectively. is there.

The dummy electrode 190 has translucency and conductivity. Specifically, the dummy electrode 190 includes a material having translucency and conductivity, for example, a metal oxide, specifically, for example, ITO, IZO, In ₂ O ₃ , ZnO, AZO, GZO, At least one of ATO and IGZO is included. The dummy electrode 190 includes the same material as that of the first electrode 110, for example.

The adhesion of the insulating layer 140 to the dummy electrode 191 and the dummy electrode 192 is higher than the adhesion of the insulating layer 140 to the first surface 102 of the substrate 100. Further, the adhesion of the dummy electrode 191 and the dummy electrode 192 to the first surface 102 of the substrate 100 is higher than the adhesion of the insulating layer 140 to the first surface 102 of the substrate 100. In this manner, the dummy electrode 191 functions as an adhesive layer for preventing the end portion 140 a of the insulating layer 140 from peeling from the first surface 102 of the substrate 100, and the dummy electrode 192 is the insulating layer 140. This end portion 140 b functions as an adhesive layer for preventing the end portion 140 b from peeling from the first surface 102 of the substrate 100.

The adhesion of the insulating layer 182 to the dummy electrode 193 and the dummy electrode 194 is higher than the adhesion of the insulating layer 182 to the first surface 102 of the substrate 100. Further, the adhesion of the dummy electrode 193 and the dummy electrode 194 to the first surface 102 of the substrate 100 is higher than the adhesion of the insulating layer 182 to the first surface 102 of the substrate 100. In this manner, the dummy electrode 193 functions as an adhesive layer for preventing the end portion 182a of the insulating layer 182 from peeling from the first surface 102 of the substrate 100, and the dummy electrode 194 includes the insulating layer 182. This end portion 182b functions as an adhesive layer for preventing the first surface 102 of the substrate 100 from peeling off.

The adhesion of the insulating layer 184 to the dummy electrode 195 and the dummy electrode 196 is higher than the adhesion of the insulating layer 184 to the first surface 102 of the substrate 100. Further, the adhesion of the dummy electrode 195 and the dummy electrode 196 to the first surface 102 of the substrate 100 is higher than the adhesion of the insulating layer 184 to the first surface 102 of the substrate 100. In this manner, the dummy electrode 195 functions as an adhesive layer for preventing the end portion 184a of the insulating layer 184 from peeling from the first surface 102 of the substrate 100, and the dummy electrode 196 includes the insulating layer 184. This end portion 184 b functions as an adhesive layer for preventing the end portion 184 b from peeling from the first surface 102 of the substrate 100.

(Example 7)
FIG. 21 is a plan view showing the light emitting device 10 according to Example 7, and corresponds to FIG. 4 of the embodiment. 22 is a cross-sectional view taken along the line EE of FIG. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

As shown in FIG. 21, the first electrode 110 has an end portion 110a, an end portion 110b, an end portion 110c, and an end portion 110d. The end part 110 a and the end part 110 b extend along the length direction of the first electrode 110. The end portion 110 c and the end portion 110 d extend along the width direction of the first electrode 110. The end portion 110 c is connected to the first terminal 114 via the first connection portion 112. The width of the first connection part 112 is narrower than the width of the first electrode 110. The end portion 110d is on the opposite side of the end portion 110c and faces the second terminal 134.

As shown in FIG. 22, the second electrode 130 is formed on the first surface 102 of the substrate 100 outside the end portion 110 c of the first electrode 110, more specifically, between the insulating layer 140 and the first terminal 114. It touches. Thus, the organic layer 120 is surrounded by the barrier layer (that is, the substrate 100 and the second electrode 130) from the side surface 144c of the insulating layer 140 to the first surface 102 of the substrate 100. In this way, water vapor is prevented from entering the organic layer 120.

Further, the second electrode 130 is not in contact with the first connection part 112 and the first terminal 114. For this reason, the second electrode 130 is prevented from being short-circuited with the first connection portion 112 and the first terminal 114.

(Example 8)
FIG. 23 is a cross-sectional view illustrating the light emitting device 10 according to Example 8, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

As shown in the drawing, the sealing portion 160 may include an adhesive layer 162 and a covering layer 164. The adhesive layer 162 covers the first surface 102 of the substrate 100, the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140. The adhesive layer 162 includes, for example, an organic material. The covering layer 164 is attached to the first surface 102 of the substrate 100 via the adhesive layer 162. The covering layer 164 has translucency, and is a glass substrate, for example.

Example 9
FIG. 24 is a cross-sectional view illustrating the light emitting device 10 according to Example 9, and corresponds to FIG. 6 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

As shown in the drawing, the sealing portion 160 may include a sealing can 166 and an adhesive layer 168. The sealing can 166 is bonded to the first surface 102 of the substrate 100 through the adhesive layer 168. The sealing can 166 covers the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140 with a hollow region interposed therebetween.

(Example 10)
25 is a cross-sectional view illustrating the light emitting device 10 according to Example 10, and corresponds to FIG. 5 of the embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment except for the following points.

In the example shown in the figure, the first electrode 110 extends planarly on the first surface 102 of the substrate 100. The plurality of insulating layers 140 are on the first electrode 110. Each of the plurality of insulating layers 140 has an opening 142. Each of the plurality of organic layers 120 and each of the plurality of second electrodes 130 overlap with each of the plurality of openings 142. In this way, the plurality of light emitting units 152 are positioned on the first surface 102 of the substrate 100. In other words, the plurality of light emitting units 152 are configured by the common first electrode 110.

The sealing part 160 covers the second electrode 130 and is in contact with the first electrode 110 outside the insulating layer 140. Thereby, the sealing part 160 has sealed the light emission part 152 (especially organic layer 120). The sealing part 160 is an insulating layer, more specifically, for example, an inorganic insulating layer. For this reason, in the example shown in this drawing, the second electrode 130 is prevented from being short-circuited to the first electrode 110. Furthermore, the sealing part 160 may have translucency. In this case, it is suppressed that the light transmittance of the light emitting device 10 is inhibited by the sealing portion 160.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

This application claims priority based on Japanese Patent Application No. 2016-189317 filed on September 28, 2016, the entire disclosure of which is incorporated herein.

Claims

A substrate having a first surface;
A plurality of light emitting units located on the first surface side of the substrate and each including a stacked structure of a first electrode, an organic layer, and a second electrode;
A non-light emitting part located between the first light emitting part and the second light emitting part adjacent to each other among the plurality of light emitting parts;
A first sealing portion for sealing the first light emitting portion;
A second sealing portion for sealing the second light emitting portion;
With
The first sealing portion has a first end overlapping the non-light emitting portion,
The second sealing portion is a light emitting device having a second end portion overlapping the non-light emitting portion.
The light-emitting device according to claim 1.
The first end portion is located between the first light emitting portion and the second end portion,
The second end portion is located between the second light emitting portion and the first end portion,
The light emitting device, wherein the second end is separated from the first end.
The light-emitting device according to claim 2.
The first surface of the substrate does not overlap any of the first electrode, the organic layer, and the second electrode between the first end and the second end of the non-light emitting portion. Light emitting device.
The light-emitting device according to claim 2.
A light emitting device further comprising a region that transmits light in a direction perpendicular to the substrate between the first end and the second end.
The light emitting device according to any one of claims 1 to 4,
The first electrode has translucency,
The second electrode has a light shielding property,
In each of the plurality of light emitting units,
The first electrode is located between the substrate and the organic layer;
The light emitting device, wherein the second electrode is located on the opposite side of the first electrode with the organic layer interposed therebetween.
The light emitting device according to any one of claims 1 to 5,
The substrate is a light emitting device having flexibility.
The light emitting device according to any one of claims 1 to 6,
The first sealing portion has a light shielding property,
The second sealing portion is a light emitting device having a light shielding property.
The light emitting device according to any one of claims 1 to 6,
The first sealing portion has translucency,
The second sealing portion is a light emitting device having translucency.
The light emitting device according to any one of claims 1 to 8,
A light-emitting device provided with the coating layer which covers at least one of the said 1st sealing part and the said 2nd sealing part.