JP2022183367A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the light from a light emitting part, from leaking from the first surface side of a substrate, when the light emitting part is provided on the first surface of the substrate, in an OLED having the light emitting part and a translucent part.

SOLUTION: Each of multiple light-shielding layers 220 includes a region located on the opposite side to a substrate 100 for multiple light emitting parts 152. More specifically, a first electrode 110 has an end directing outward from the light emitting part 152 toward a translucent part 154. The light-shielding layer 220 covers the light emitting part 152, and spreads from the inside of the light emitting part 152 toward the outside thereof. In this way, the light-shielding layer 220 is in contact with the first surface 102 of the substrate 100, on the outside of the end of the first electrode 110.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to light emitting devices.

In recent years, organic light emitting diodes (OLEDs) have been developed as light emitting devices. An OLED has organic layers, including a light-emitting layer that emits light by organic electroluminescence. The OLED further has a first electrode (eg, anode electrode) and a second electrode (eg, cathode electrode), and the first electrode and the second electrode are opposed to each other with the organic layer interposed therebetween. In an OLED, light is emitted by applying a voltage across the organic layers using first and second electrodes.

Patent Literature 1 describes an example of an OLED. In this OLED, the second electrode extends in a grid on the organic layer. Thus, in this OLED, the light-emitting portion (the laminated structure of the first electrode, the organic layer, and the second electrode) spreads in a grid pattern, and the plurality of light-transmitting portions (the laminated structure of the first electrode and the organic layer) are divided into light-emitting units and arranged in a matrix. This OLED further has a sealing substrate, and the sealing substrate covers the light-emitting portion and the plurality of light-transmitting portions. The sealing substrate has a first surface on the side of the light emitting section and a second surface opposite to the first surface. A moisture-proof part is attached to the first surface of the sealing substrate. A light-shielding part is attached to the second surface of the sealing substrate, and the light-shielding part is located on the opposite side of the moisture-proof part. Therefore, when viewed from the second surface side of the sealing substrate, the moisture-proof portion is hidden by the light-shielding portion. In this way, the light-shielding portion prevents the moisture-proof portion from deteriorating the design of the OLED.

Patent Literature 2 describes an example of an OLED. This OLED has a colored layer. Specifically, in this OLED, the first electrode has a light-transmitting property, the second electrode has a light-shielding property, and the colored layer extends from the opposite side of the first electrode to the second electrode so as to be in contact with the second electrode. covering the electrodes. The colored layer is provided to prevent glare from sunlight reaching the second electrode.

JP 2016-1665 A JP 2011-134707 A

In recent years, an OLED having a light-emitting portion and a light-transmitting portion has been developed, for example, as described in Patent Document 1. In such an OLED, when the light-emitting portion is provided on the first surface side of the substrate, it may be required to prevent the light from the light-emitting portion from leaking from the first surface side of the substrate.

A problem to be solved by the present invention is that, in an OLED having a light-emitting portion and a light-transmitting portion, when the light-emitting portion is provided on the first surface side of the substrate, light from the light-emitting portion leaks from the first surface side of the substrate. One example is to prevent

An example of the invention is
a plurality of light emitting units located on the first surface side of the substrate;
a plurality of translucent parts;
a plurality of light shielding layers positioned on the first surface side of the substrate;
with
each of the plurality of light-emitting portions is positioned between adjacent light-transmitting portions;
In the light-emitting device, each of the plurality of light-shielding layers includes a region located on the opposite side of the substrate to each of the plurality of light-emitting portions.

1 is a plan view showing a light emitting device according to Embodiment 1. FIG. FIG. 2 is a view of FIG. 1 with a plurality of second electrodes removed; FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1; FIG. 4 is a diagram for explaining a first example of a method for manufacturing the light emitting device shown in FIGS. 1 to 3; FIG. FIG. 4 is a diagram for explaining a second example of a method for manufacturing the light emitting device shown in FIGS. 1 to 3; FIG. FIG. 3 is a diagram showing a modification of FIG. 2; It is a figure which shows the modification of FIG. FIG. 10 is a plan view for explaining a light emitting device according to Embodiment 2; FIG. 5 is a cross-sectional view showing a light emitting device according to Embodiment 2; FIG. 9 is a diagram showing a modification of FIG. 8; FIG. 10 is a diagram showing a first modification of FIG. 9; FIG. 10 is a diagram showing a second modification of FIG. 9; FIG. 10 is a cross-sectional view showing a light emitting device according to Embodiment 3; FIG. 14 is a diagram showing a modification of FIG. 13; FIG. 12 is a cross-sectional view showing a light emitting device according to Embodiment 4; It is a cross-sectional view showing a light emitting device according to a modification. FIG. 17 is a diagram showing a modification of FIG. 16; 1 is a cross-sectional view showing a light emitting device according to an example; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

(Embodiment 1)
FIG. 1 is a plan view showing a light emitting device 10 according to Embodiment 1. FIG. FIG. 2 is a diagram of FIG. 1 with the plurality of second electrodes 130 removed. FIG. 3 is a cross-sectional view taken along line AA of FIG. 1 and 2 do not show the organic layer 120 (FIG. 3) and the light shielding layer 220 (FIG. 3) for the sake of explanation.

An overview of the light emitting device 10 will be described with reference to FIG. The light-emitting device 10 includes a plurality of light-emitting portions 152 , a plurality of light-transmitting portions 154 and a plurality of light-shielding layers 220 . The plurality of light emitting units 152 are positioned on the first surface 102 side of the substrate 100 . In the example shown in this figure, each of the plurality of light emitting units 152 has a laminated structure of a first electrode 110, an organic layer 120 and a second electrode . The first electrode 110 has translucency. Organic layer 120 includes a light-emitting layer. The second electrode 130 may have light shielding properties (specifically, light reflectivity) or may not have light shielding properties (specifically, light reflectivity). Each of the plurality of light-emitting portions 152 is positioned between the light-transmitting portions 154 adjacent to each other, in other words, the plurality of light-emitting portions 152 and the plurality of light-transmitting portions 154 are arranged alternately. A plurality of light shielding layers 220 are positioned on the first surface 102 side of the substrate 100 .

Each of the plurality of light shielding layers 220 includes a region located on the side opposite to the substrate 100 with respect to the plurality of light emitting portions 152 . More specifically, the first electrode 110 has an end facing the outside of the light emitting section 152 from the light emitting section 152 toward the translucent section 154 . The light shielding layer 220 covers the light emitting section 152 and extends from the inside to the outside of the light emitting section 152 . Thus, the light blocking layer 220 is in contact with the first surface 102 of the substrate 100 outside the edge of the first electrode 110 .

In the example shown in this figure, the light from the light emitting section 152 is prevented from leaking from the first surface 102 side of the substrate 100 . Specifically, each of the plurality of light shielding layers 220 covers each of the plurality of light emitting portions 152 from the first surface 102 side of the substrate 100 . Therefore, the light from the light emitting section 152 is blocked by the light blocking layer 220 . In this way, in the example shown in this figure, light from the light emitting section 152 is prevented from leaking from the first surface 102 side of the substrate 100 .

Furthermore, in the example shown in this figure, light leaking from the end of the first electrode 110 is prevented from leaking to the outside of the light shielding layer 220 . Specifically, the light from the light emitting unit 152 may leak from the end of the first electrode 110 due to reflection at the interface between the substrate 100 and the first electrode 110. Light enters the insulating layer 140 (details of which will be described later). This light passes through the insulating layer 140 when the insulating layer 140 has translucency. In this way, even if light passes through the insulating layer 140 , the light shielding layer 220 is in contact with the first surface 102 of the substrate 100 outside the edge of the first electrode 110 in the example shown in this figure. Therefore, the light from the insulating layer 140 (end portion of the first electrode 110) is blocked by the light shielding layer 220. FIG. In this way, in the example shown in this figure, the light leaking from the end of the first electrode 110 is prevented from leaking to the outside of the light shielding layer 220 .

Next, details of the planar layout of the light emitting device 10 will be described with reference to FIGS. 1 and 2. FIG. The light emitting device 10 includes a substrate 100, a plurality of first electrodes 110, a plurality of first connection portions 112, a first wiring 114, a plurality of conductive portions 116, a plurality of second electrodes 130, a plurality of second connection portions 132, a plurality of 2 wirings 134 , a plurality of insulating layers 140 and a plurality of barrier rib layers 210 .

The shape of the substrate 100 is a rectangle having a pair of long sides and a pair of short sides when viewed in a direction perpendicular to the first surface 102 . However, the shape of the substrate 100 is not limited to the example shown in this drawing. The shape of the substrate 100 may be, for example, a circle when viewed from a direction perpendicular to the first surface 102, or may be a polygon other than a rectangle.

The plurality of first electrodes 110 are spaced apart from each other, and more specifically, are arranged in a row along the long side of the substrate 100 . Each of the multiple first electrodes 110 extends along the short side of the substrate 100 .

Each of the plurality of first electrodes 110 is connected to a first wiring 114 via each of the plurality of first connection portions 112 . The plurality of first connection portions 112 are connected to each other by first wirings 114 . The first wiring 114 extends along one of the pair of long sides of the substrate 100 . A voltage from the outside is supplied to the first electrode 110 via the first wiring 114 and the first connection portion 112 . In addition, in the example shown in this figure, the first electrode 110 and the first connection portion 112 are integrated with each other. In other words, the light emitting device 10 includes a conductive layer having a region functioning as the first electrode 110 and a region functioning as the first connection portion 112 .

Each of the plurality of conductive portions 116 is connected to each of the plurality of first electrodes 110 and each of the plurality of first connection portions 112 . The conductive portion 116 extends along the longitudinal direction of the first electrode 110 .

Each of the multiple second electrodes 130 overlaps with each of the multiple first electrodes 110 . The plurality of second electrodes 130 are spaced apart from each other, and more specifically, are arranged in a line along the long side of the substrate 100 . Each of the plurality of second electrodes 130 extends along the short sides of the substrate 100. Specifically, the pair of long sides extending along the short sides of the substrate 100 and the long sides of the substrate 100 extend along the long sides of the substrate 100. It has a pair of short sides that extend in parallel.

Each of the plurality of second electrodes 130 is connected to a second wiring 134 via each of the plurality of second connection portions 132 . The plurality of second connection portions 132 are connected to each other by second wirings 134 . The second wiring 134 extends along the other of the pair of long sides of the substrate 100 . A voltage from the outside is supplied to the second electrode 130 via the second wiring 134 and the second connection portion 132 .

Each of the multiple insulating layers 140 overlaps with each of the multiple first electrodes 110 . The plurality of insulating layers 140 are spaced apart from each other, and more specifically, are arranged in a line along the long side of the substrate 100 . Each of the plurality of insulating layers 140 extends along the short sides of the substrate 100. Specifically, the pair of long sides extending along the short sides of the substrate 100 and the long sides of the substrate 100 extend along the long sides of the substrate 100. It has a pair of short sides that extend.

Each of the multiple insulating layers 140 has an opening 142 . As will be described later with reference to FIG. 3 , in the opening 142 , the first electrode 110 , the organic layer 120 and the second electrode 130 form a region functioning as the light emitting section 152 (the first electrode 110 , the organic layer 120 and the second electrode 130 laminated structure). In other words, the insulating layer 140 defines the light emitting section 152 . The light emitting portion 152 (opening 142) extends along the short sides of the substrate 100. Specifically, the light emitting portions 152 (openings 142) extend along the pair of long sides extending along the short sides of the substrate 100 and along the long sides of the substrate 100. It has a pair of short sides that extend.

Each of the multiple partition layers 210 surrounds each of the multiple insulating layers 140 . In the example shown in this figure, the partition layer 210 is not in contact with the insulating layer 140 and is spaced apart from the insulating layer 140 in any region.

Next, details of the cross section of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100 , a first electrode 110 , an organic layer 120 , a second electrode 130 , an insulating layer 140 , a partition wall layer 210 and a light shielding layer 220 . Substrate 100 has a first side 102 and a second side 104 . The second side 104 is opposite the first side 102 . A first electrode 110 , an organic layer 120 , a second electrode 130 , an insulating layer 140 , a barrier layer 210 and a light shielding layer 220 are on the first surface 102 of the substrate 100 .

The substrate 100 has translucency. In one example, substrate 100 includes glass. In another example, the substrate 100 may contain resin.

The first surface 102 of the substrate 100 has a plurality of regions 102a and a plurality of regions 102b. The plurality of regions 102a and the plurality of regions 102b are arranged alternately. The first electrode 110 , the conductive part 116 , the organic layer 120 , the second electrode 130 , the insulating layer 140 , the light shielding layer 220 and the partition layer 210 are on the region 102 a of the substrate 100 . In the example shown in this figure, the region 102a extends from the lower end of one outer surface of the partition layer 210 to the lower end of the other outer surface of the partition layer 210 . The region 102b extends from the lower end of the outer surface of one of the adjacent partition layers 210 to the lower end of the outer surface of the other partition layer 210 .

The first electrode 110 has translucency and conductivity. Specifically, the first electrode 110 includes a translucent and conductive material, such as a metal oxide, specifically, for example, ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide). contains at least one This allows light from the organic layer 120 to pass through the first electrode 110 .

The conductive portion 116 has conductivity. Specifically, the conductivity of the conductive portion 116 is higher than the conductivity of the first electrode 110 , so the conductive portion 116 functions as an auxiliary electrode for the first electrode 110 . The conductive portion 116 includes, for example, metal, specifically, at least one of Al and Mn, for example. In one example, the conductive part 116 is a laminated film of Mo/Al/Mo.

The organic layer 120 includes, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer. The hole injection layer and the hole transport layer are connected to the first electrode 110 . The electron transport layer and electron injection layer are connected to the second electrode 130 . The light emitting layer emits light according to the voltage between the first electrode 110 and the second electrode 130 .

In the example shown in this figure, the organic layer 120 extends outside the opening 142 of the insulating layer 140 and also extends outside the edge of the insulating layer 140 . Thus, organic layer 120 covers insulating layer 140 . In other examples, organic layer 120 may not extend outside the edge of insulating layer 140 .

The second electrode 130 has light reflectivity and conductivity. Specifically, the second electrode 130 contains a light-reflective material, such as metal, specifically at least one of Al, Ag, and MgAg. Accordingly, the light from the organic layer 120 is reflected by the second electrode 130 without being transmitted through the second electrode 130 .

It should be noted that the second electrode 130 has a light-shielding property due to the light reflectivity of the second electrode 130 . Therefore, in the example shown in this figure, light from the organic layer 120 is suppressed from leaking from the second electrode 130 .

The insulating layer 140 has translucency. In one example, insulating layer 140 comprises an organic insulating material, specifically polyimide, for example. In other examples, insulating layer 140 may comprise an inorganic insulating material, specifically, for example, silicon oxide (SiO _x ), silicon oxynitride (SiON), or silicon nitride (SiN _x ).

The insulating layer 140 has openings 142 . The insulating layer 140 exposes a portion of the first electrode 110 through the opening 142 and covers the end of the first electrode 110 and the conductive portion 116 . In this manner, the insulating layer 140 defines the light emitting portion 152 and prevents the end portion of the first electrode 110 and the conductive portion 116 from contacting the second electrode 130 .

In the example shown in this figure, the side surface of the insulating layer 140 is slanted. More specifically, the side surfaces of the insulating layer 140 are inclined inward from the insulating layer 140 from the lower end to the upper end of the insulating layer 140 .

The partition layer 210 has translucency. In one example, barrier layer 210 comprises an organic insulating material, specifically polyimide, for example. The material of the partition layer 210 may be the same as the material of the insulating layer 140 or different from the material of the insulating layer 140 .

The barrier layer 210 includes regions that function as first barriers 212 and regions that function as second barriers 214 . The second partition 214 is located on the opposite side of the first partition 212 with the light emitting section 152 interposed therebetween. Especially in the example shown in this figure, the first partition 212 and the second partition 214 are spaced apart from the insulating layer 140 toward the outside of the light emitting section 152 .

In the example shown in this figure, the side surfaces of the partition layer 210 (the first partition 212 and the second partition 214) are inclined. More specifically, the side surfaces of the partition layer 210 are inclined inward from the partition layer 210 from the lower end to the upper end of the partition layer 210 .

The light-shielding layer 220 has a light-shielding property, and specifically has a light-absorbing property. As a result, when the light from the light emitting section 152 is incident on the light shielding layer 220 , this light is absorbed by the light shielding layer 220 . The light-shielding layer 220 contains a light-absorbing material, specifically, in one example, an organic material containing a black pigment or an organic material containing a black dye. When such an organic material is used, the light shielding layer 220 can be formed on the first surface 102 of the substrate 100 by a coating process.

The light emitting section 152 has a laminated structure of the first electrode 110 , the organic layer 120 and the second electrode 130 . Specifically, in the opening 142 of the insulating layer 140, the first electrode 110, the organic layer 120, and the second electrode 130 have a region functioning as the light emitting portion 152. In this region, the first electrode 110, The organic layer 120 and the second electrode 130 overlap each other.

The translucent part 154 has a part of the substrate 100, and particularly in the example shown in this drawing, the first electrode 110, the conductive part 116, the organic layer 120, the second electrode 130, the insulating layer 140, and the partition layer 210. and the light shielding layer 220 . Therefore, in the translucent portion 154, the first electrode 110, the conductive portion 116, the organic layer 120, the second electrode 130, the insulating layer 140, the partition layer 210, or the light shielding layer 220 do not block light. Therefore, the translucent portion 154 has a high light transmittance. In another example, the translucent part 154 may have a part of the organic layer 120 as will be described later with reference to FIG. 16 .

In one region 102a of the plurality of regions 102a, one light shielding layer 220 (first light shielding layer) of the plurality of light shielding layers 220 is located between the first partition wall 212 and the second partition wall 214. 212 and the second partition 214 . Similarly, in the other region 102 a , the light shielding layer 220 is between the first partition 212 and the second partition 214 and is in contact with the first partition 212 and the second partition 214 .

In the example shown in this figure, the position where the light shielding layer 220 is provided can be determined by the partition layer 210 (the first partition 212 and the second partition 214). In particular, when the light shielding layer 220 is formed using a liquid or gel material, the light shielding layer 220 may extend beyond a desired position without the partition layer 210 . In contrast, in the example shown in this figure, the partition layer 210 prevents the material for forming the light shielding layer 220 from spreading beyond the desired position. Thus, in the example shown in this figure, the position where the light shielding layer 220 is provided can be determined by the partition layer 210 (the first partition 212 and the second partition 214).

In the example shown in this figure, the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the first partition wall 212 is the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the organic layer 120. and higher than the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the second electrode 130 . Similarly, the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the second partition 214 is higher than the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the organic layer 120, Furthermore, it is higher than the height from the first surface 102 of the substrate 100 to the upper end (upper surface) of the second electrode 130 .

The height from the first surface 102 of the substrate 100 to the top of the first partition 212 and the height from the first surface 102 of the substrate 100 to the top of the second partition 214 are the heights from the first surface 102 of the substrate 100 to the organic layer 120 . If the height is higher than the top (upper surface), a mask for forming the organic layer 120 can be applied to the partition layer 210 (the first partition 212 and the second partition 214). Specifically, a mask may be used when the organic layer 120 is formed by vapor deposition, for example. In the example shown in this figure, such a mask can be applied to the barrier rib layer 210 (the first barrier rib 212 and the second barrier rib 214) when the organic layer 120 is formed by vapor deposition.

The height from the first surface 102 of the substrate 100 to the upper ends of the first barrier ribs 212 and the height from the first surface 102 of the substrate 100 to the upper ends of the second barrier ribs 214 are the same as the height from the first surface 102 of the substrate 100 to the second electrodes 130 . , a mask for forming the second electrode 130 can be applied to the barrier rib layer 210 (the first barrier rib 212 and the second barrier rib 214). Specifically, when forming the second electrode 130 by, for example, vapor deposition, a mask may be used. In the example shown in this figure, such a mask can be applied to the barrier rib layer 210 (the first barrier rib 212 and the second barrier rib 214) when the second electrode 130 is formed by vapor deposition.

In the example shown in this figure, the first partition 212 and the second partition 214 are separated from the insulating layer 140 . Therefore, part of the light shielding layer 220 enters between the outer surface of the insulating layer 140 and the inner surface of the first partition wall 212, and the other part of the light shielding layer 220 extends between the outer surface of the insulating layer 140 and the second partition wall. 214, and is embedded between the inner surfaces. In this case, even if light leaks from the edge of the first electrode 110 in a direction substantially along the first surface 102 of the substrate 100, the light blocking layer 220 can block the light.

In the example shown in this figure, the light emitting device 10 functions as a transflective OLED. Specifically, when light is not emitted from the plurality of light emitting units 152, an object on the side of the first surface 102 can be seen through from the side of the second surface 104, and an object on the side of the second surface 104 can be seen through by human vision. It can be seen through from the first surface 102 side. Furthermore, light from the plurality of light emitting units 152 is mainly output from the second surface 104 side, and is hardly output from the first surface 102 side. When light is emitted from a plurality of light emitting units 152, an object on the second surface 104 side can be seen through from the first surface 102 side with human vision.

From the viewpoint of increasing the light transmittance of the light emitting device 10, the width of the translucent portion 154 (corresponding to the width d2 of the region 102b) is preferably large. 0.5 times or more the width d1 of the region 102a (d2/d1≧0.5), preferably 1.0 times or more the width d1 of the region 102a (d2/d1≧1.0). In this example, the light transmittance of the light emitting device 10 can be made high.

In one example, the light emitting device 10 can be used as a high mount stop lamp for an automobile. In this case, the light emitting device 10 can be attached to the rear window of the automobile. Furthermore, in this case, the light emitting device 10 emits red light, for example.

FIG. 4 is a diagram for explaining a first example of a method for manufacturing the light emitting device 10 shown in FIGS. 1 to 3. FIG. In this first example, the light emitting device 10 is manufactured as follows.

First, the first electrode 110 , the first connection portion 112 and the second connection portion 132 are formed on the first surface 102 of the substrate 100 . In one example, the first electrode 110, the first connection portion 112 and the second connection portion 132 are formed by patterning a conductive layer formed by sputtering. Next, a conductive portion 116 is formed. In one example, conductive portion 116 is formed by sputtering.

An insulating layer 140 is then formed. In one example, the insulating layer 140 is formed by patterning a photosensitive resin applied on the first surface 102 of the substrate 100 .

Next, as shown in FIG. 4, a barrier layer 210 is formed. In one example, the barrier rib layer 210 is formed by firing a pattern formed by photolithography. In another example, barrier layer 210 is formed by curing a pattern applied by an inkjet or dispenser.

An organic layer 120 is then formed. If the organic layer 120 is formed by evaporation using a mask, the mask can be applied to the barrier layer 210 as described above.

Next, a second electrode 130 is formed. If the second electrode 130 is formed by vapor deposition using a mask, the mask can be applied to the barrier rib layer 210 as described above.

Next, a light shielding layer 220 is formed. In one example, the light shielding layer 220 can be formed on the first surface 102 of the substrate 100 by a coating process.

Thus, the light emitting device 10 shown in FIGS. 1 to 3 is manufactured.

FIG. 5 is a diagram for explaining a second example of the method for manufacturing the light emitting device 10 shown in FIGS. 1 to 3. FIG. This second example is the same as the first example described using FIG. 4, except for the following points.

First, the first electrode 110, the first connection portion 112, the conductive portion 116, the second connection portion 132, and the insulating layer 140 are formed in the same manner as in the first example described with reference to FIG.

Next, as shown in FIG. 5, an organic layer 120 is formed. In other words, in the example shown in FIG. 5, the organic layer 120 is formed before forming the partition layer 210 (FIG. 4).

Next, a partition layer 210 is formed. In one example, barrier layer 210 is formed by curing a pattern applied by an inkjet or dispenser.

Next, the second electrode 130 and the light shielding layer 220 are formed in the same manner as in the first example described using FIG.

FIG. 6 is a diagram showing a modification of FIG. As shown in this figure, the partition layer 210 does not have to surround the insulating layer 140 . Specifically, in the example shown in this figure, the first partition 212 and the second partition 214 are positioned opposite to each other with the insulating layer 140 interposed therebetween and extend along the insulating layer 140 . The first partition 212 and the second partition 214 are not connected to each other, in other words, they are separated from each other. In the example shown in this figure, the position where the light blocking layer 220 (FIG. 3) is provided in the width direction of the light emitting section 152 can be determined by the partition layer 210 (the first partition 212 and the second partition 214).

FIG. 7 is a diagram showing a modification of FIG. In the example shown in this figure, the partition layer 210 (the first partition 212 and the second partition 214) has a light shielding property. In other words, the partition layer 210 contains a light shielding material. More specifically, in one example, the barrier layer 210 includes an organic material containing a black pigment or an organic material containing a black dye. In this example, a black pigment or black dye functions as a light shielding material.

In the example shown in this figure, the light leaking from the light emitting section 152 can be blocked not only by the light blocking layer 220 but also by the partition layer 210 . Therefore, it is possible to prevent the light from the light emitting section 152 from leaking from the first surface 102 side of the substrate 100 with high reliability.

As described above, according to the present embodiment, each of the plurality of light shielding layers 220 covers each of the plurality of light emitting portions 152 from the first surface 102 side of the substrate 100 . Therefore, the light from the light emitting section 152 is blocked by the light blocking layer 220 . Therefore, it is possible to prevent the light from the light emitting section 152 from leaking from the first surface 102 side of the substrate 100 .

(Embodiment 2)
FIG. 8 is a plan view for explaining the light emitting device 10 according to Embodiment 2, and corresponds to FIG. 2 of Embodiment 1. FIG. FIG. 9 is a cross-sectional view showing the light emitting device 10 according to this embodiment, and corresponds to FIG. 3 of the first embodiment. The light emitting device 10 according to this embodiment is the same as the light emitting device 10 according to Embodiment 1 except for the following points.

In this embodiment, the first partition 212 and the second partition 214 overlap the insulating layer 140 . More specifically, the first partition 212 and the second partition 214 cover the ends of the insulating layer 140 and are in contact with the insulating layer 140 particularly in the example shown in this figure. The first partition 212 and the second partition 214 may contain the same material as the insulating layer 140 or may contain a different material from the insulating layer 140 . Furthermore, as shown in FIG. 9, one end of the organic layer 120 may be in contact with the inner surface of the first partition wall 212, and similarly, the other end of the organic layer 120 may be in contact with the second wall. It may be in contact with the inner surface of the partition wall 214 . In other words, in this embodiment, the organic layer 120 is formed after forming the partition layer 210 (the first partition 212 and the second partition 214) in the same manner as in the example described with reference to FIG. In this case, the edges of the organic layer 120 can contact the first partition 212 and the second partition 214 .

In this embodiment, the light transmittance of the light emitting device 10 can be made high. Specifically, in this embodiment, as shown in FIG. 9, the first partition 212 and the second partition 214 are not so far from the light emitting section 152 . Therefore, the width of the region 102b (corresponding to the width of the translucent portion 154) is widened. Therefore, in this embodiment, the light transmittance of the light emitting device 10 can be made high.

Furthermore, in this embodiment, the ratio of the width of the opening 142 to the width of the region 102a (that is, the width from one end of the partition layer 210 to the other end), in other words, the aperture ratio is increased. be able to. In the example shown in this figure, the first partition 212 and the second partition 214 are not so far from the light emitting section 152 . Therefore, the distance between the first partition 212 and the second partition 214 can be shortened. Therefore, in this embodiment, the aperture ratio can be increased.

FIG. 10 is a diagram showing a modification of FIG. In the example shown in this figure, the partition layer 210 does not surround the insulating layer 140 in the same manner as in the example shown in FIG. Specifically, in the example shown in this figure, the first partition 212 and the second partition 214 are positioned opposite to each other with the insulating layer 140 interposed therebetween and extend along the insulating layer 140 . The first partition 212 and the second partition 214 are not connected to each other, in other words, they are separated from each other. In the example shown in this figure, the position where the light blocking layer 220 (eg, FIG. 9) is provided in the width direction of the light emitting section 152 can be determined by the partition layer 210 (the first partition 212 and the second partition 214). .

FIG. 11 is a diagram showing a first modification of FIG. In the example shown in this figure, one end and the other end of the organic layer 120 are covered with the first partition 212 and the second partition 214, respectively. In other words, in the example shown in this figure, after forming the organic layer 120, the partition layer 210 (the first partition 212 and the second partition 214) is formed in the same manner as in the example described with reference to FIG. . In this case, one end and the other end of the organic layer 120 can be covered with the first partition 212 and the second partition 214 .

FIG. 12 is a diagram showing a second modification of FIG. In the example shown in this figure, the partition layer 210 (the first partition 212 and the second partition 214) contains a light shielding material, as in the example shown in FIG. This prevents light leaking from the end of the first electrode 110 from leaking to the outside of the partition layer 210 . In particular, in the example shown in this figure, the light shielding layer 220 is not in contact with the first surface 102 of the substrate 100 outside the edge of the first electrode 110 . Therefore, it is difficult for the light shielding layer 220 to block the light leaking from the edge of the first electrode 110 in the direction substantially along the first surface 102 of the substrate 100 . In the example shown in this figure, even such light can be blocked by the partition layer 210 .

(Embodiment 3)
13 is a cross-sectional view showing the light emitting device 10 according to Embodiment 3, and corresponds to FIG. 3 of Embodiment 1. FIG. The light emitting device 10 according to this embodiment is the same as the light emitting device 10 according to Embodiment 1 except for the following points.

In the example shown in this figure, the insulating layer 140 functions as the partition layer 210 (the first partition 212 and the second partition 214). Similar to the example shown in FIG. 3, the insulating layer 140 covers the end of the first electrode 110 and the conductive portion 116 . The light shielding layer 220 is located between the first partition 212 and the second partition 214 , that is, in the opening 142 of the insulating layer 140 and is in contact with the first partition 212 and the second partition 214 . In the example shown in this figure, both the upper end of the organic layer 120 and the upper end of the second electrode 130 are positioned lower than the upper end of the insulating layer 140. In other words, the organic layer 120 and the second electrode 130 are insulated It does not extend outside the opening 142 of the layer 140 .

In the example shown in this figure, the light transmittance of the light emitting device 10 can be made high. Specifically, in this embodiment, as shown in FIG. 13, the first partition 212 and the second partition 214 are not so far from the light emitting section 152 . Therefore, the width of the region 102b (corresponding to the width of the translucent portion 154) is widened. Therefore, in this embodiment, the light transmittance of the light emitting device 10 can be made high.

Furthermore, in the example shown in this figure, the ratio of the width of the opening 142 to the width of the region 102a (that is, the width from one end of the insulating layer 140 to the other end), in other words, the aperture ratio is high. can be In the example shown in this figure, it is not necessary to provide the partition layer 210 separately from the insulating layer 140 . Therefore, the distance between the first partition 212 and the second partition 214 can be shortened. Therefore, in the example shown in this figure, the aperture ratio can be made high.

Furthermore, in the example shown in the figure, the manufacturing process of the light emitting device 10 can be simplified. Specifically, in the example shown in this figure, there is no need to provide a step of forming the partition layer 210 separately from the step of forming the insulating layer 140 . Therefore, the number of steps in the manufacturing process of the light emitting device 10 is reduced. Therefore, in the example shown in this figure, the manufacturing process of the light emitting device 10 can be simplified.

14 is a diagram showing a modification of FIG. 13. FIG. In the example shown in this figure, the insulating layer 140 (the first partition 212 and the second partition 214) contains a light-shielding material, similarly to the example shown in FIG. This prevents light leaking from the edge of the first electrode 110 from leaking to the outside of the insulating layer 140 . Especially in the example shown in this figure, the light shielding layer 220 does not contact the first surface 102 of the substrate 100 outside the edge of the first electrode 110 . Therefore, it is difficult for the light shielding layer 220 to block the light leaking from the edge of the first electrode 110 in the direction substantially along the first surface 102 of the substrate 100 . In the example shown in this figure, even such light can be blocked by the insulating layer 140 .

(Embodiment 4)
FIG. 15 is a cross-sectional view showing the light emitting device 10 according to Embodiment 4, and corresponds to FIG. 3 of Embodiment 1. FIG. The light emitting device 10 according to this embodiment is the same as the light emitting device 10 according to Embodiment 1 except for the following points.

In the example shown in this figure, the light-emitting device 10 does not include the partition layer 210 (FIG. 3), but includes a plurality of light shielding layers 220 . Each of the plurality of light shielding layers 220 includes a region located on the side opposite to the substrate 100 with respect to the plurality of light emitting portions 152 . More specifically, the first electrode 110 has an end facing the outside of the light emitting section 152 from the light emitting section 152 toward the translucent section 154 . The light shielding layer 220 covers the light emitting section 152 and extends from the inside to the outside of the light emitting section 152 . Thus, the light blocking layer 220 is in contact with the first surface 102 of the substrate 100 outside the edge of the first electrode 110 .

In one example, the plurality of light shielding layers 220 can be formed by etching a light shielding layer formed over the plurality of light emitting units 152 . Examples of such light shielding layers are chromium layers or chromium oxide layers. In another example, the light blocking layer 220 may be formed by curing a pattern applied by an inkjet or dispenser.

In the example shown in this figure, similarly to the example shown in FIG. 3, leakage of light from the light emitting section 152 from the first surface 102 side of the substrate 100 is prevented. Furthermore, in the example shown in this figure, similarly to the example shown in FIG. 3, the light leaking from the end portion of the first electrode 110 is prevented from leaking to the outside of the light shielding layer 220 .

(Modification)
FIG. 16 is a cross-sectional view showing the light emitting device 10 according to the modification, and corresponds to FIG. 3 of the first embodiment. The light emitting device 10 according to this modification is the same as the light emitting device 10 according to Embodiment 1, except for the following points.

In the example shown in this figure, the organic layer 120 extends over multiple light-emitting portions 152 and multiple light-transmitting portions 154 . In this way, the organic layer 120 covers the first surface 102 of the substrate 100 between the adjacent light-emitting portions 152, in other words, the light-transmitting portion 154 comprises a portion of the organic layer 120. there is The organic layer 120 has a relatively high light transmittance. Therefore, even if the organic layer 120 covers the first surface 102 of the substrate 100 in the light transmitting portion 154, the light transmitting portion 154 can maintain high light transmittance.

In addition, in the example shown in this figure, the partition layer 210 is positioned on the organic layer 120 . In other words, in the example shown in this figure, after forming the organic layer 120, the partition layer 210 (the first partition 212 and the second partition 214) is formed in the same manner as in the example described with reference to FIG. . In this case, the barrier layer 210 is positioned on the organic layer 120 .

FIG. 17 is a diagram showing a modification of FIG. 16. FIG. In the example shown in this figure, the organic layer 120 extends over the plurality of light-emitting portions 152 and the plurality of light-transmitting portions 154 and further covers the plurality of partition layers 210 . In other words, in the example shown in this figure, the organic layer 120 is formed after forming the partition layer 210 (the first partition 212 and the second partition 214) in the same manner as in the example described with reference to FIG. . Therefore, the organic layer 120 covers the plurality of partition layers 210 .

In the example shown in this figure, the process of forming the organic layer 120 can be simplified. Specifically, in the example shown in this figure, it is not necessary for each of the plurality of organic layers 120 to overlap each of the plurality of first electrodes 110 . Therefore, it is not necessary to use a mask when forming the organic layer 120 . Therefore, the process of forming the organic layer 120 can be simplified. In addition, in the step of forming the second electrode 130, a mask for forming the second electrode 130 can be applied to the partition layer 210 (the first partition 212 and the second partition 214).

FIG. 18 is a cross-sectional view showing the light emitting device 10 according to the example, and corresponds to FIG. 3 of the first embodiment. The light emitting device 10 according to this example is the same as the light emitting device 10 according to Embodiment 1, except for the following points.

The light emitting device 10 has a sealing substrate 230 . The sealing substrate 230 has translucency. In one example, the encapsulation substrate 230 includes glass. In another example, the encapsulation substrate 230 may contain resin. The sealing substrate 230 covers the plurality of light-emitting portions 152 and the plurality of light-transmitting portions 154 . More specifically, the sealing substrate 230 faces the first surface 102 of the substrate 100 with the partition layer 210 interposed therebetween. Thus, between the first partition 212 and the second partition 214, the light emitting section 152 is sealed between the substrate 100 and the sealing substrate 230. As shown in FIG.

More specifically, the light emitting device 10 includes multiple sealing portions 200 . Each of the plurality of sealing portions 200 covers each of the plurality of light emitting portions 152 and is positioned between the light transmitting portions 154 adjacent to each other. Specifically, the partition layer 210 functions as part of the sealing section 200, the light blocking layer 220 functions as part of the sealing section 200, and a portion (region 232) of the sealing substrate 230 functions as the sealing section. It functions as part of 200. A region 232 of the sealing substrate 230 extends from the first partition 212 to the second partition 214 and contacts the first partition 212 and the second partition 214 . A region between the light emitting portion 152 and the sealing substrate 230 is filled with the light shielding layer 220 . In this manner, each of the plurality of sealing sections 200 seals each of the plurality of light emitting sections 152 .

Also in this embodiment, the light from the light emitting section 152 is blocked by the light blocking layer 220 . Therefore, it is possible to prevent the light from the light emitting section 152 from leaking from the first surface 102 side of the substrate 100 .

Although the embodiments and examples have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than those described above can be adopted.

10 Light emitting device 100 Substrate 102 First surface 102a Region 102b Region 104 Second surface 110 First electrode 112 First connection portion 114 First wiring 116 Conductive portion 120 Organic layer 130 Second electrode 132 Second connection portion 134 Second wiring 140 Insulating layer 142 Opening 152 Light-emitting portion 154 Translucent portion 200 Sealing portion 210 Partition wall layer 212 First partition wall 214 Second partition wall 220 Light-shielding layer 230 Sealing substrate 232 Region

Claims (8)

a plurality of light emitting units located on the first surface side of the substrate;
a plurality of translucent parts;
a first light shielding layer located on the first surface side of the substrate;
a first partition, a second partition,
with
each of the plurality of light-emitting portions is positioned between adjacent light-transmitting portions;
each of the plurality of light-emitting units has a laminated structure of a translucent first electrode, an organic layer including a light-emitting layer, and a second electrode;
The second partition is located on the opposite side of the first partition across the first light emitting portion of the plurality of light emitting portions,
The light emitting device, wherein the first light shielding layer is located between the first partition wall and the second partition wall and covers the second electrode of the first light emitting section. The light emitting device according to claim 1,
the first electrode has an end portion facing the outside of the light emitting portion from the light emitting portion toward the transparent portion;
The light emitting device, wherein the first light shielding layer is in contact with the first surface of the substrate outside the edge of the first electrode. The light emitting device according to claim 1 or 2,
Both the height from the first surface of the substrate to the upper end of the first partition and the height from the first surface of the substrate to the upper end of the second partition are from the first surface of the substrate. A light-emitting device that is higher than the height of the organic layer of the first light-emitting portion. The light emitting device according to claim 3,
Both the height from the first surface of the substrate to the upper end of the first partition and the height from the first surface of the substrate to the upper end of the second partition are from the first surface of the substrate. A light-emitting device that is higher than the height of the first light-emitting portion to the upper end of the second electrode. In the light emitting device according to any one of claims 1 to 4,
An insulating layer covering an end of the first electrode of the first light emitting unit,
The light emitting device, wherein the insulating layer is spaced apart from the first partition. In the light emitting device according to any one of claims 1 to 4,
An insulating layer covering an end of the first electrode of the first light emitting unit,
The light emitting device, wherein the first partition overlaps with the insulating layer. In the light emitting device according to any one of claims 1 to 4,
An insulating layer covering an end of the first electrode of the first light emitting unit,
The light-emitting device, wherein the insulating layer functions as the first partition wall. In the light emitting device according to any one of claims 1 to 7,
The light emitting device, wherein each of the first partition and the second partition includes a light shielding material.

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