WO2017145409A1 - Matériau de moulage à base de résine époxy, produit moulé, produit moulé durci et procédé de fabrication d'un produit moulé - Google Patents

Matériau de moulage à base de résine époxy, produit moulé, produit moulé durci et procédé de fabrication d'un produit moulé Download PDF

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WO2017145409A1
WO2017145409A1 PCT/JP2016/074878 JP2016074878W WO2017145409A1 WO 2017145409 A1 WO2017145409 A1 WO 2017145409A1 JP 2016074878 W JP2016074878 W JP 2016074878W WO 2017145409 A1 WO2017145409 A1 WO 2017145409A1
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epoxy resin
molding material
resin molding
group
general formula
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PCT/JP2016/074878
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English (en)
Japanese (ja)
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田中　賢治
優香 吉田
慎一 小杉
片木　秀行
陶　晴昭
竹澤　由高
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日立化成株式会社
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Priority to TW106106054A priority Critical patent/TW201800468A/zh
Publication of WO2017145409A1 publication Critical patent/WO2017145409A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • the present invention relates to an epoxy resin molding material, a molded product, a molded cured product, and a method for manufacturing the molded product.
  • Thermosetting resins such as epoxy resins are widely used as insulating materials used in industrial and automotive motors, inverters, and other devices from the standpoints of high insulation performance, ease of molding, heat resistance, etc. ing.
  • the high output and miniaturization of these devices have rapidly progressed, and the level of characteristics required for insulating materials has become considerably high.
  • the amount of heat generated from a high-density conductor tends to increase with downsizing, and how to dissipate heat is an important issue. Accordingly, various attempts have been made to improve the thermal conductivity after molding of the thermosetting resin.
  • thermosetting resin having high thermal conductivity an epoxy resin having a mesogen skeleton is used, and a cured product of a resin composition including the epoxy resin has been proposed (for example, see Patent Document 1).
  • Epoxy resins having a mesogenic skeleton are disclosed in Patent Documents 2 to 4, for example.
  • thermosetting resin having high thermal conductivity and a low softening point (melting point) an epoxy resin having a specific structure as described in Patent Document 5 has been proposed.
  • thermosetting resin As one of the techniques for improving the thermal conductivity after molding of the thermosetting resin, there is a method of mixing a high thermal conductivity inorganic filler with the thermosetting resin to form a composite material (for example, Patent Documents). 6).
  • the viscosity of the resin composition increases as the amount of the inorganic filler increases, and workability tends to deteriorate, or the dispersibility of the inorganic filler tends to decrease. It is in.
  • there is often a problem with the affinity between the organic thermosetting resin and the inorganic filler and voids may occur at the interface between the thermosetting resin and the inorganic filler. For this reason, the thermal conductivity of the composite material may be lowered and the long-term reliability may be deteriorated.
  • an epoxy resin having a mesogenic skeleton tends to have a high melting point due to the characteristics of the skeleton, which may cause a problem that fluidity is lowered and molding becomes difficult.
  • a technique for increasing fluidity by adding a dispersant is generally known.
  • high thermal conductivity may not be exhibited after curing.
  • An object of the present invention is to provide an epoxy resin molding material that exhibits high thermal conductivity after curing, a molded product and a molded cured product using the epoxy resin molding material, and a method for producing the molded product.
  • Epoxy resin A having a mesogenic skeleton and having a phase transition temperature of 140 ° C. or lower for transition from a crystal phase to a liquid crystal phase; A curing agent; An inorganic filler; Epoxy resin molding material containing.
  • the epoxy resin A is a reaction between a divalent phenol compound having two hydroxyl groups in one benzene ring and an epoxy resin B having a mesogenic skeleton and a phase transition from a crystal phase to a liquid crystal phase.
  • the epoxy resin molding material as described in ⁇ 1> containing a thing.
  • the epoxy resin A is a ratio of the number of equivalents of the phenolic hydroxyl group of the divalent phenol compound to the number of equivalents of the epoxy group of the epoxy resin B (the number of equivalents of epoxy group / the number of equivalents of phenolic hydroxyl group).
  • R 1 to R 4 each independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.
  • ⁇ 6> The epoxy resin molding material according to any one of ⁇ 2> to ⁇ 5>, wherein the divalent phenol compound contains hydroquinone.
  • ⁇ 7> The epoxy resin molding material according to any one of ⁇ 1> to ⁇ 6>, wherein the curing agent includes a phenol-based curing agent.
  • the phenolic curing agent includes a compound having a structural unit represented by at least one selected from the group consisting of the following general formula (II-1) and the following general formula (II-2) ⁇ 7 > Epoxy resin molding material.
  • each R 1 independently represents an alkyl group, an aryl group, or an aralkyl group, and the alkyl group, aryl group, and aralkyl group each have a substituent. You may have.
  • R 2 and R 3 each independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group, and the alkyl group, aryl group, and aralkyl group may have a substituent.
  • Each m independently represents an integer of 0 to 2.
  • Each n independently represents an integer of 1 to 7.
  • the phenolic curing agent includes a compound having a structural unit represented by at least one selected from the group consisting of the following general formula (III-1) to general formula (III-4) ⁇ 7 > Or ⁇ 8>
  • the epoxy resin molding material includes a compound having a structural unit represented by at least one selected from the group consisting of the following general formula (III-1) to general formula (III-4) ⁇ 7 > Or ⁇ 8>
  • the epoxy resin molding material includes a compound having a structural unit represented by at least one selected from the group consisting of the following general formula (III-1) to general formula (III-4)
  • n each independently represent a positive integer.
  • Ar independently represents a group represented by the following general formula (III-a) or the following general formula (III-b).
  • R 11 and R 14 each independently represents a hydrogen atom or a hydroxyl group.
  • R 12 and R 13 each independently represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
  • the adhesion amount of silicon atoms derived from the silane coupling agent per specific surface area of the inorganic filler is 5.0 ⁇ 10 ⁇ 6 mol / m 2 to 10.0 ⁇ 10 ⁇ 6 mol / m 2 .
  • the epoxy resin molding material according to any one of ⁇ 10> to ⁇ 12>.
  • ⁇ 14> The epoxy resin molding material according to any one of ⁇ 1> to ⁇ 13>, wherein the inorganic filler includes at least one selected from the group consisting of magnesium oxide and alumina.
  • ⁇ 18> A molded product obtained by molding the epoxy resin molding material according to any one of ⁇ 1> to ⁇ 17>.
  • ⁇ 20> A molded cured product obtained by curing the molded product according to ⁇ 18> or ⁇ 19>.
  • the diffraction angle 2 ⁇ has a diffraction peak in the range of 3.0 ° to 3.5 °, described in ⁇ 20> or ⁇ 21> Molded and cured product.
  • the epoxy resin molding material containing the epoxy resin A according to any one of ⁇ 1> to ⁇ 17> is molded in a temperature range of not less than the phase transition temperature of the epoxy resin A and not more than 150 ° C. Manufacturing method of a molded product.
  • an epoxy resin molding material that exhibits high thermal conductivity after curing, a molded product and a molded cured product using the epoxy resin molding material, and a method for producing the molded product.
  • a numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
  • the amount of each component in the composition is the total amount of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. means.
  • the term “process” is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, the term “process” is used if the intended purpose of the process is achieved. included.
  • the epoxy resin molding material of the present embodiment includes an epoxy resin A having a mesogenic skeleton and having a phase transition temperature of 140 ° C. or lower that causes a phase transition from a crystal phase to a liquid crystal phase, a curing agent, and an inorganic filler. .
  • the epoxy resin molding material of this embodiment may further contain other components as necessary.
  • the epoxy resin molding material of this embodiment it becomes possible to exhibit high thermal conductivity after curing.
  • the reason for this is not clear, but when the epoxy resin has a phase transition temperature of 140 ° C. or lower, the epoxy resin is likely to melt when the epoxy resin molding material is produced. This is considered to be because the bias is suppressed as a result of the generation of the liquid crystal phase.
  • each component contained in the epoxy resin molding material of this embodiment will be described in detail.
  • Epoxy resin molding material contains an epoxy resin A having a mesogenic skeleton and a phase transition temperature of 140 ° C. or lower. Epoxy resins having a mesogenic skeleton are liable to form a higher order structure upon curing and tend to achieve higher thermal conductivity when a cured product of the epoxy resin molding material is produced.
  • the “mesogen skeleton” indicates a molecular structure that may exhibit liquid crystallinity. Specific examples include a biphenyl skeleton, a phenylbenzoate skeleton, an azobenzene skeleton, a stilbene skeleton, and derivatives thereof. Epoxy resins having a mesogenic skeleton tend to form a higher order structure at the time of curing, and tend to achieve higher thermal conductivity when a cured product is produced.
  • the higher order structure is a state in which the constituent elements are arranged microscopically, and corresponds to, for example, a crystal phase and a liquid crystal phase. Whether or not such a higher-order structure exists can be easily determined by observation with a polarizing microscope. That is, when an interference pattern due to depolarization is observed in the observation in the crossed Nicol state, it can be determined that a higher order structure exists.
  • the higher order structure usually exists in an island shape in the resin, and forms a domain structure. Each island forming the domain structure is called a higher-order structure.
  • the structural units constituting the higher order structure are generally bonded by a covalent bond.
  • the phase transition temperature of the epoxy resin A is 140 ° C. or lower, and preferably 135 ° C. or lower.
  • the phase transition temperature can be measured using a differential scanning calorimetry (DSC) measuring device (for example, Pyris 1 manufactured by PerkinElmer). Specifically, the differential scanning calorific value of a sample of 3 mg to 5 mg sealed in an aluminum pan under the conditions of a temperature rise rate of 20 ° C./min, a measurement temperature range of 25 ° C. to 350 ° C., and a flow rate of 20 ⁇ 5 ml / min in a nitrogen atmosphere. It is measured as a temperature at which an energy change (endothermic reaction) occurs with a phase transition. An example of a graph obtained by this measurement is shown in FIG. The temperature of the endothermic reaction peak appearing in FIG. 1 is defined as a phase transition temperature.
  • DSC differential scanning calorimetry
  • the epoxy resin A is not particularly limited as long as it has a mesogenic skeleton and a phase transition temperature of 140 ° C. or lower.
  • the epoxy resin A may be an epoxy compound or an oligomer of an epoxy compound.
  • the oligomer may be a reaction product of epoxy compounds, or may be in a prepolymer state in which a part of the epoxy compound is partially reacted with a curing agent or the like.
  • the curing agent used for prepolymerization may be the same as or different from the curing agent contained in the epoxy resin composition. When a part of an epoxy compound having a mesogenic skeleton is polymerized, the moldability may be improved.
  • the epoxy compound used for prepolymerization is preferably an epoxy resin B having a mesogenic skeleton and a property of phase transition from a crystal phase to a liquid crystal phase.
  • Epoxy resin B may have a phase transition temperature of 140 ° C. or lower or may exceed 140 ° C.
  • the epoxy resin B when the phase transition temperature of the epoxy resin B exceeds 140 ° C., the epoxy resin B is a reaction product prepolymerized by reacting with a dihydric phenol compound having two hydroxyl groups as substituents on one benzene ring. It is preferable to use it. It is preferable to use such a dihydric phenol compound from the viewpoint of controlling the molecular weight, thermal conductivity, and glass transition temperature (Tg) of the epoxy resin. Moreover, when the epoxy resin B and the dihydric phenol compound are partially reacted to form a prepolymer, the phase transition temperature can be lowered. Therefore, even if the phase transition temperature of the epoxy resin B exceeds 140 ° C., it can be used. In general, since an epoxy resin having a mesogenic skeleton has a high phase transition temperature, a prepolymerization technique is useful.
  • the phenol compound used for prepolymerization is a monohydric phenol compound having one hydroxyl group in one molecule, the crosslink density after curing is lowered, so that the thermal conductivity may be lowered.
  • the phenol compound used for prepolymerization has three or more hydroxyl groups in one molecule, the reaction is difficult to control during prepolymerization, which may cause gelation.
  • a dihydric phenol compound having two or more benzene rings is used, the structure of the epoxy resin becomes rigid, which is advantageous for increasing the thermal conductivity, but the softening point tends to increase and the handling property tends to decrease. (For example, see Japanese Patent No. 5019272)
  • an amine compound may be used in addition to the divalent phenol compound.
  • an amine compound when an amine compound is used, secondary amine or tertiary amine is produced in the prepolymerized epoxy resin, so that the storage stability of the epoxy resin itself and the epoxy resin after blending the epoxy resin with a curing agent The storage stability of the molding material may be reduced.
  • Epoxy resin B may be used alone or in combination of two or more. Specific examples of the epoxy resin B are described in, for example, Japanese Patent No. 4118691. Although the specific example of the epoxy resin B is shown below, this invention is not limited to these.
  • the epoxy resin B forms a nematic structure with low ordering alone when undergoing a phase transition from the crystal phase to the liquid crystal phase.
  • An epoxy resin that forms a smectic structure is preferred. Examples of such a resin include compounds represented by the following general formula (I).
  • R 1 to R 4 each independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.
  • Examples of the divalent phenol compound having two hydroxyl groups in one benzene ring include catechol, resorcinol, hydroquinone, and derivatives thereof.
  • Examples of the derivatives include compounds in which a benzene ring is substituted with an alkyl group having 1 to 8 carbon atoms.
  • hydroquinone it is preferable to use hydroquinone from the viewpoint of improving thermal conductivity. Since hydroquinone has a structure in which two hydroxyl groups are substituted so as to have a para-position, the prepolymerized epoxy resin obtained by reacting with epoxy resin B has a linear structure. For this reason, it is considered that the stacking property of the molecule is high and a higher order structure is easily formed.
  • a divalent phenol compound may be used individually by 1 type, and may use 2 or more types together.
  • the epoxy resin A When the epoxy resin A is a reaction product of the epoxy resin B and the dihydric phenol compound, the epoxy resin A dissolves, for example, the epoxy resin B, the dihydric phenol compound, and the reaction catalyst in a synthetic solvent and applies heat. It can be synthesized by stirring while stirring. It is possible to synthesize the epoxy resin A by melting and reacting the epoxy resin B and the dihydric phenol compound without using a synthesis solvent, but it must be heated to a temperature at which the epoxy resin melts. For this reason, from the viewpoint of safety, a synthesis method using a synthesis solvent is preferable.
  • the ratio of the number of equivalents of phenolic hydroxyl group of dihydric phenol compound to the number of equivalents of epoxy group of epoxy resin B (equivalent number of epoxy groups / phenol)
  • the equivalent number of the functional hydroxyl group is preferably from 100/10 to 100/30, more preferably from 100/10 to 100/20, and even more preferably from 100/10 to 100/15.
  • the synthetic solvent is not particularly limited as long as the solvent can be heated to a temperature necessary for the reaction between the epoxy resin B and the dihydric phenol compound to proceed.
  • Specific examples include cyclohexanone, cyclopentanone, ethyl lactate, propylene glycol monomethyl ether, N-methylpyrrolidone and the like.
  • the amount of the synthesis solvent is preferably an amount capable of dissolving all of the epoxy resin B, the dihydric phenol compound, and the curing catalyst at the reaction temperature.
  • the solubility varies depending on the raw material type, solvent type, etc. before the reaction, the charged solid content concentration is preferably 20% by mass to 60% by mass.
  • the viscosity of the resin solution after synthesis tends to be in a preferable range.
  • the type of reaction catalyst is not particularly limited, and an appropriate one can be selected from the viewpoint of reaction rate, reaction temperature, storage stability, and the like.
  • Specific examples of the reaction catalyst include imidazole compounds, organophosphorus compounds, tertiary amines, and quaternary ammonium salts. These may be used alone or in combination of two or more.
  • an organic phosphine compound an organic phosphine compound with maleic anhydride, a quinone compound (1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, etc.), diazophenylmethane, phenol resin, etc.
  • a quinone compound (1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone
  • organic phosphine compounds include triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, tris (dialkylphenyl) phosphine, tris (tri Alkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, etc. Can be mentioned.
  • the amount of the reaction catalyst is not particularly limited. From the viewpoint of reaction rate and storage stability, it is preferably 0.1% by mass to 1.5% by mass, and preferably 0.2% by mass to 1% by mass with respect to the total mass of the epoxy resin B and the dihydric phenol compound. It is more preferable that
  • the reaction product of epoxy resin B and dihydric phenol can be synthesized using a glass flask if it is a small scale, and using a stainless steel synthesis pot if it is a large scale.
  • a specific synthesis method is as follows, for example. First, the epoxy resin B is put into a flask or a synthesis kettle, a synthesis solvent is added, and the mixture is heated to the reaction temperature with an oil bath or a heating medium, and the epoxy resin B is dissolved. A dihydric phenol compound is added thereto, and after confirming that the compound is sufficiently dissolved in the synthesis solvent, a reaction catalyst is added to start the reaction.
  • reaction solution is taken out after a predetermined time, a reaction product solution of epoxy resin B and dihydric phenol can be obtained. Further, if the synthesis solvent is distilled off under reduced pressure under a heating condition in a flask or a synthesis kettle, the reaction product of epoxy resin B and dihydric phenol becomes a solid at room temperature (for example, 25 ° C.). can get.
  • the reaction temperature is not limited as long as the reaction between the epoxy group and the phenolic hydroxyl group proceeds in the presence of the reaction catalyst, and is preferably in the range of 100 ° C. to 180 ° C., for example, in the range of 120 ° C. to 170 ° C. More preferred.
  • the reaction temperature is 100 ° C. or higher, the time until the reaction is completed tends to be shortened.
  • the reaction temperature is 180 ° C. or lower, gelation tends to be suppressed.
  • the epoxy equivalent of the epoxy resin A is preferably 130 g / eq to 500 g / eq, more preferably 135 g / eq to 400 g / eq, and still more preferably 140 g / eq to 300 g / eq.
  • the epoxy equivalent is measured by a perchloric acid titration method according to JIS K7236: 2009.
  • the epoxy resin molding material contains a curing agent.
  • curing agent As a hardening
  • the curing agent include acid anhydride curing agents, amine curing agents, phenol curing agents, polyaddition curing agents such as mercaptan curing agents, and other latent curing agents such as imidazole. From the viewpoint of heat resistance and adhesion, an amine-based curing agent or a phenol-based curing agent is preferable. Furthermore, from the viewpoint of storage stability, a phenolic curing agent is more preferable.
  • phenolic curing agent those usually used can be used without particular limitation.
  • a phenol compound and a phenol resin obtained by novolacizing a phenol compound can be used.
  • the phenol compound examples include monofunctional phenol compounds such as phenol, o-cresol, m-cresol, and p-cresol; bifunctional phenol compounds such as catechol, resorcinol, and hydroquinone; 1,2,3-trihydroxybenzene, 1 , 2,4-trihydroxybenzene, 1,3,5-trihydroxybenzene and other trifunctional phenol compounds; Moreover, as a phenol resin, the phenol novolak resin which connected these phenol compounds with the methylene chain etc. and was novolak-ized is mentioned.
  • the phenolic curing agent is preferably a bifunctional phenolic compound such as catechol, resorcinol, hydroquinone, or the like, or a phenol novolac resin in which a bifunctional phenolic compound is linked by a methylene chain, From this point of view, a phenol novolac resin in which a bifunctional phenol compound is linked by a methylene chain is more preferable.
  • phenol novolak resin a resin obtained by novolacizing one kind of phenol compound such as cresol novolak resin, catechol novolak resin, resorcinol novolak resin, hydroquinone novolak resin, or the like; A resin obtained by converting the compound into a novolak form.
  • each R 1 independently represents an alkyl group, an aryl group, or an aralkyl group.
  • the alkyl group, aryl group and aralkyl group represented by R 1 may further have a substituent.
  • the substituent include an alkyl group (except when R 1 is an alkyl group), an aryl group, a halogen atom, and a hydroxyl group.
  • m independently represents an integer of 0 to 2, and when m is 2, two R 1 s may be the same or different.
  • Each m is independently preferably 0 or 1, and more preferably 0.
  • Each n independently represents an integer of 1 to 7.
  • R 2 and R 3 each independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group.
  • the alkyl group, aryl group, and aralkyl group represented by R 2 and R 3 may further have a substituent. Examples of the substituent include an alkyl group (except when R 2 or R 3 is an alkyl group), an aryl group, a halogen atom, a hydroxyl group and the like.
  • R 2 and R 3 in the general formulas (II-1) and (II-2) are preferably a hydrogen atom, an alkyl group, or an aryl group from the viewpoint of storage stability and thermal conductivity.
  • An atom, an alkyl group having 1 to 4 carbon atoms, or an aryl group having 6 to 12 carbon atoms is more preferable, and a hydrogen atom is still more preferable.
  • the partial structure derived from a phenol compound other than resorcinol includes phenol, cresol, catechol, hydroquinone, 1 from the viewpoint of thermal conductivity and adhesiveness. , 2,3-trihydroxybenzene, 1,2,4-trihydroxybenzene and 1,3,5-trihydroxybenzene, preferably a partial structure derived from at least one selected from the group consisting of catechol and It is more preferably a partial structure derived from at least one selected from hydroquinone.
  • the partial structure derived from a phenol compound other than catechol includes phenol, cresol, resorcinol, hydroquinone, 1 from the viewpoint of thermal conductivity and adhesiveness. , 2,3-trihydroxybenzene, 1,2,4-trihydroxybenzene and 1,3,5-trihydroxybenzene, preferably a partial structure derived from at least one selected from the group consisting of resorcinol and It is more preferably a partial structure derived from at least one selected from hydroquinone.
  • the partial structure derived from the phenol compound means a monovalent or divalent group constituted by removing one or two hydrogen atoms from the benzene ring portion of the phenol compound.
  • the position where the hydrogen atom is removed is not particularly limited.
  • the content ratio of the partial structure derived from resorcinol is not particularly limited. From the viewpoint of elastic modulus, the content ratio of the partial structure derived from resorcinol to the total mass of the compound having the structural unit represented by the general formula (II-1) is preferably 55% by mass or more. From the viewpoint of the transition temperature (Tg) and the linear expansion coefficient, it is more preferably 60% by mass or more, further preferably 80% by mass or more, and from the viewpoint of thermal conductivity, it is 90% by mass or more. Particularly preferred.
  • the content ratio of the partial structure derived from catechol is not particularly limited. From the viewpoint of elastic modulus, the content ratio of the partial structure derived from catechol to the total mass of the compound having the structural unit represented by the general formula (II-2) is preferably 55% by mass or more. From the viewpoint of the transition temperature (Tg) and the linear expansion coefficient, it is more preferably 60% by mass or more, further preferably 80% by mass or more, and from the viewpoint of thermal conductivity, it is 90% by mass or more. Particularly preferred.
  • the molecular weight of the compound having a structural unit represented by at least one selected from the group consisting of general formula (II-1) and general formula (II-2) is not particularly limited.
  • the number average molecular weight (Mn) is preferably 2000 or less, more preferably 1500 or less, and even more preferably 350 to 1500.
  • the weight average molecular weight (Mw) is preferably 2000 or less, more preferably 1500 or less, and further preferably 400 to 1500. These Mn and Mw are measured by a usual method using gel permeation chromatography (GPC).
  • the hydroxyl equivalent of the compound having a structural unit represented by at least one selected from the group consisting of general formula (II-1) and general formula (II-2) is not particularly limited. From the viewpoint of the crosslinking density involved in heat resistance, the hydroxyl group equivalent is preferably 50 g / eq to 150 g / eq on average, more preferably 50 g / eq to 120 g / eq, and 55 g / eq to 120 g / eq. More preferably, it is eq.
  • the hydroxyl equivalent is a value measured according to JIS K0070: 1992.
  • the proportion of the compound having a structural unit represented by at least one selected from the group consisting of general formula (II-1) and general formula (II-2) is preferably 50% by mass or more, and more preferably 80% by mass or more. More preferably, 90 mass% or more is still more preferable.
  • the phenol novolak resin is represented by at least one selected from the group consisting of the following general formula (III-1) to the following general formula (III-4) It is also preferable to include a compound having
  • n each independently represents a positive integer, and represents the number of each structural unit to which m or n is attached.
  • Ar independently represents a group represented by the following general formula (III-a) or the following general formula (III-b).
  • R 11 and R 14 each independently represents a hydrogen atom or a hydroxyl group.
  • R 12 and R 13 each independently represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
  • a compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is produced as a by-product by a production method in which a divalent phenol compound is novolakized. Can be generated.
  • the structure represented by at least one selected from the group consisting of the general formula (III-1) to the general formula (III-4) may be included as the main chain skeleton of the phenol novolak resin, or the phenol novolak It may be contained as part of the side chain of the resin. Furthermore, each structural unit constituting the partial structure represented by any one of the general formulas (III-1) to (III-4) may be included randomly or regularly. It may be included or may be included in a block shape. Further, in the general formulas (III-1) to (III-4), the substitution position of the hydroxyl group is not particularly limited as long as it is on the aromatic ring.
  • a plurality of Ars may all be the same atomic group or may contain two or more types of atomic groups.
  • Ar independently represents a group represented by general formula (III-a) or general formula (III-b).
  • R 11 and R 14 in formulas (III-a) and (III-b) each independently represent a hydrogen atom or a hydroxyl group, and are preferably a hydroxyl group from the viewpoint of thermal conductivity. Further, the substitution positions of R 11 and R 14 are not particularly limited.
  • R 12 and R 13 each independently represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.
  • alkyl group having 1 to 8 carbon atoms in R 12 and R 13 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, pentyl group, hexyl. Groups, heptyl groups, and octyl groups.
  • substitution positions of R 12 and R 13 in the general formula (III-a) are not particularly limited.
  • Ar in the general formulas (III-1) to (III-4) is a group derived from dihydroxybenzene (in the general formula (III-a), R 11 is a hydroxyl group) from the viewpoint of achieving better thermal conductivity.
  • a is, R 12 and R 13 is a hydrogen atom group), and at least one of R 14 in group (general formula (III-b) derived from a dihydroxy naphthalene is selected from the group consisting of group) a hydroxyl group It is preferable that
  • group derived from dihydroxybenzene means a divalent group formed by removing two hydrogen atoms from the aromatic ring portion of dihydroxybenzene, and the position at which the hydrogen atom is removed is not particularly limited. Further, the “group derived from dihydroxynaphthalene” has the same meaning.
  • Ar is more preferably a group derived from dihydroxybenzene, and a group derived from 1,2-dihydroxybenzene (catechol) and 1,3- More preferably, it is at least one selected from the group consisting of groups derived from dihydroxybenzene (resorcinol).
  • resorcinol groups derived from dihydroxybenzene
  • Ar contains at least a group derived from resorcinol.
  • the structural unit represented by the structural unit n preferably contains a group derived from resorcinol.
  • the compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) includes a structural unit derived from resorcinol
  • the structural unit derived from resorcinol The content of is 55 in the total weight of the compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) from the viewpoint of elastic modulus.
  • the viewpoint of Tg and linear expansion coefficient of the cured product more preferably 60% by weight or more, still more preferably 80% by weight or more, from the viewpoint of thermal conductivity, It is particularly preferably 90% by mass or more.
  • (m + n) is preferably 20 or less, more preferably 15 or less, and still more preferably 10 or less from the viewpoint of fluidity.
  • the lower limit of (m + n) is not particularly limited.
  • the compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is particularly a group derived from dihydroxybenzene in which Ar is substituted or unsubstituted, and When it is at least one kind of a group derived from substituted or unsubstituted dihydroxynaphthalene, compared with a phenolic resin or the like obtained by simply novolacizing these, a curing agent having a low softening point is easily synthesized. It tends to be obtained. Therefore, by including such a phenol resin as a curing agent, there are advantages such as easy manufacture and handling of the epoxy resin molding material.
  • Whether the phenol novolac resin has a partial structure represented by any one of the above general formulas (III-1) to (III-4) is determined by field desorption ionization mass spectrometry (FD-MS). Thus, it can be determined by whether or not the fragment component includes a component corresponding to the partial structure represented by any one of the above general formulas (III-1) to (III-4).
  • FD-MS field desorption ionization mass spectrometry
  • the molecular weight of the compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is not particularly limited.
  • the number average molecular weight (Mn) is preferably 2000 or less, more preferably 1500 or less, and even more preferably 350 to 1500.
  • the weight average molecular weight (Mw) is preferably 2000 or less, more preferably 1500 or less, and further preferably 400 to 1500. These Mn and Mw are measured by a normal method using GPC.
  • the hydroxyl equivalent of the compound having a structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is not particularly limited.
  • the hydroxyl group equivalent is preferably 50 g / eq to 150 g / eq on average, more preferably 50 g / eq to 120 g / eq, and 55 g / eq to 120 g / eq. More preferably, it is eq.
  • the proportion of the compound having a structure represented by at least one selected from the group consisting of formula (III-1) to general formula (III-4) is preferably 50% by mass or more, more preferably 80% by mass or more. 90 mass% or more is more preferable.
  • the phenolic curing agent is selected from the general formula (II-1) and the general formula (II-2).
  • the monomer which is a phenol compound which comprises the compound to have may be included.
  • the content ratio of the monomer that is a phenol compound is not particularly limited.
  • the content in the phenolic curing agent is preferably 5% by mass to 80% by mass, more preferably 15% by mass to 60% by mass, and 20% by mass to 50% by mass. More preferably.
  • the monomer content is 80% by mass or less, the amount of monomers that do not contribute to crosslinking during the curing reaction is reduced, and the number of crosslinked high molecular weight substances is increased, so that a higher density crosslinked structure is formed and the thermal conductivity is increased. Tend to improve. Moreover, since it is easy to flow at the time of shaping
  • the content of the curing agent is not particularly limited.
  • the equivalent number of active hydrogens of the phenolic hydroxyl group contained in the phenolic curing agent (equivalent number of phenolic hydroxyl groups) and the equivalent of the epoxy group contained in the epoxy resin
  • the number ratio is preferably 0.5 to 2, more preferably 0.8 to 1.2.
  • the epoxy resin molding material contains at least one kind of inorganic filler.
  • the cured product of the epoxy resin molding material has improved thermal conductivity.
  • the inorganic filler is preferably insulating.
  • the “insulating property” of the inorganic filler means the property that the inorganic filler itself does not flow current even when a voltage of several hundred volts to several thousand volts is applied, and is the most occupied by electrons. This is because the valence band having a high energy level is separated from the next band (conduction band) above it by a large energy gap.
  • the material for the inorganic filler include boron nitride, alumina, silica, aluminum nitride, magnesium oxide, silicon oxide, aluminum hydroxide, and barium sulfate.
  • at least one selected from the group consisting of magnesium oxide and alumina is preferable from the viewpoints of fluidity, thermal conductivity, and electrical insulation.
  • boron nitride, silica, aluminum nitride or the like may be further contained within a range not impeding fluidity.
  • the total proportion of at least one inorganic filler selected from the group consisting of magnesium oxide and alumina in the inorganic filler is preferably 50% by mass or more, more preferably 80% by mass or more, More preferably, it is 90 mass% or more.
  • the inorganic filler may have a single peak or a plurality of peaks when a particle size distribution curve is drawn with the particle diameter on the horizontal axis and the frequency on the vertical axis.
  • the average particle size (D50) corresponding to 50% cumulative from the small particle size side of the weight cumulative particle size distribution of the inorganic filler is From the viewpoint of conductivity, the thickness is preferably 0.1 ⁇ m to 100 ⁇ m, more preferably 0.1 ⁇ m to 70 ⁇ m.
  • the average particle size of the inorganic filler is measured using a laser diffraction method, and can be measured using a laser diffraction scattering particle size distribution measuring device (for example, LS230 manufactured by Beckman Coulter).
  • the inorganic filler having a plurality of peaks in the particle size distribution curve can be constituted by combining two or more kinds of inorganic fillers having different average particle diameters, for example.
  • the content of the inorganic filler in the epoxy resin molding material is not particularly limited. From the viewpoint of thermal conductivity and moldability, when the total solid content of the epoxy resin molding material is 100% by volume, the content of the inorganic filler is preferably 60% by volume to 90% by volume, More preferably, it is 70 volume% to 85 volume%. Higher thermal conductivity can be achieved when the content of the inorganic filler is 60% by volume or more. On the other hand, when the content of the inorganic filler is 90% by volume or less, an epoxy resin molding material having excellent moldability can be obtained.
  • the solid content of the epoxy resin molding material means the remaining components obtained by removing volatile components from the epoxy resin molding material.
  • Inorganic filler content (volume%) ⁇ (Cw / Cd) / ((Aw / Ad) + (Bw / Bd) + (Cw / Cd) + (Dw / Dd) + (Ew / Ed) + (Fw / Fd)) ⁇ ⁇ 100
  • each variable is as follows.
  • Aw mass composition ratio of epoxy resin A (mass%)
  • Bw mass composition ratio (% by mass) of curing agent
  • Cw mass composition ratio of inorganic filler (mass%)
  • Dw Mass composition ratio (% by mass) of a curing accelerator used as necessary
  • Ew Mass composition ratio (% by mass) of a silane coupling agent used as necessary
  • Fw mass composition ratio (% by mass) of other components used as necessary
  • Ad Specific gravity of epoxy resin A Bd: Specific gravity of curing agent Cd: Specific gravity of inorganic filler
  • Ed Specific gravity of silane coupling agent used as needed
  • Fd Necessary Specific gravity of other components used depending on
  • the epoxy resin molding material may contain a curing accelerator as necessary. By using a curing accelerator together with the curing agent, the epoxy resin molding material can be further sufficiently cured.
  • the type and blending amount of the curing accelerator are not particularly limited, and an appropriate one can be selected from the viewpoint of reaction rate, reaction temperature, storage property, and the like.
  • the curing accelerator include imidazole compounds, organophosphorus compounds, tertiary amines, and quaternary ammonium salts. These may be used alone or in combination of two or more.
  • an organic phosphine compound an organic phosphine compound with maleic anhydride, a quinone compound (1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, etc.), diazophenylmethane, phenol resin, etc.
  • organic phosphine compound examples include triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, and tris (dialkylphenyl).
  • Phosphine tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, Examples thereof include alkyl diaryl phosphine.
  • the content of the curing accelerator in the epoxy resin molding material is not particularly limited.
  • the content of the curing accelerator is preferably 0.1% by mass to 1.5% by mass with respect to the total mass of the epoxy resin and the curing agent, and is 0.2% by mass. More preferably, it is ⁇ 1% by mass.
  • the epoxy resin molding material may contain a silane coupling agent as required.
  • a silane coupling agent By including a silane coupling agent, an interaction occurs between the surface of the inorganic filler and the epoxy resin surrounding it, improving fluidity, achieving high thermal conductivity, and further intruding moisture. Insulating reliability tends to improve insulation reliability.
  • the type of the silane coupling agent is not particularly limited, and one type may be used alone or two or more types may be used in combination. Among these, a silane coupling agent having a phenyl group is preferable.
  • a silane coupling agent containing a phenyl group is likely to interact with an epoxy resin having a mesogenic skeleton. For this reason, when an epoxy resin molding material contains the silane coupling agent containing a phenyl group, when it is set as hardened
  • silane coupling agent containing a phenyl group is not particularly limited.
  • Specific examples of the silane coupling agent having a phenyl group include 3-phenylaminopropyltrimethoxysilane, 3-phenylaminopropyltriethoxysilane, N-methylanilinopropyltrimethoxysilane, and N-methylanilinopropyltriethoxy.
  • the silane coupling agent containing a phenyl group may be used individually by 1 type, or may use 2 or more types together.
  • a commercial product may be used as the silane coupling agent containing a phenyl group.
  • the proportion of the silane coupling agent having a phenyl group in the entire silane coupling agent is preferably 50% by mass or more, more preferably 80% by mass or more, and further preferably 90% by mass or more. .
  • the inorganic filler may contain a silane coupling agent in which a phenyl group is directly bonded to a silicon atom (Si). More preferred.
  • the proportion of the silane coupling agent in which the phenyl group is directly bonded to the silicon atom (Si) in the silane coupling agent having a phenyl group is preferably 30% by mass or more, and 50% by mass or more. Is more preferable, and it is still more preferable that it is 80 mass% or more.
  • the silane coupling agent may be present in a state of adhering to the surface of the inorganic filler or in a state of not adhering to the surface of the inorganic filler. , Both may be mixed.
  • the adhesion amount of silicon atoms derived from the silane coupling agent per specific surface area of the inorganic filler is 5.0 ⁇ 10 ⁇ 6 mol. / M 2 to 10.0 ⁇ 10 ⁇ 6 mol / m 2 is preferable, and 5.5 ⁇ 10 ⁇ 6 mol / m 2 to 9.5 ⁇ 10 ⁇ 6 mol / m 2 is more preferable, and 6.0 ⁇ 10. It is more preferably ⁇ 6 mol / m 2 to 9.0 ⁇ 10 ⁇ 6 mol / m 2 .
  • the method for measuring the coating amount of silicon atoms derived from the silane coupling agent per specific surface area of the inorganic filler is as follows.
  • the BET method is mainly applied as a method for measuring the specific surface area of the inorganic filler.
  • the BET method is a gas adsorption method in which inert gas molecules such as nitrogen (N 2 ), argon (Ar), and krypton (Kr) are adsorbed on solid particles, and the specific surface area of the solid particles is measured from the amount of adsorbed gas molecules. Is the law.
  • the specific surface area can be measured using a specific surface area pore distribution measuring apparatus (for example, SA3100, manufactured by Beckman Coulter, Inc.).
  • silicon atoms derived from the silane coupling agent present on the surface of the inorganic filler are quantified.
  • Examples of the quantitative method include 29 Si CP / MAS (Cross-Polarization / Magic angle spinning) solid-state NMR (nuclear magnetic resonance). Since the nuclear magnetic resonance apparatus (for example, JNM-ECA700, manufactured by JEOL Ltd.) has high resolution, even when the epoxy resin molding material contains silica as an inorganic filler, the silicon atoms derived from silica as the inorganic filler and It is possible to distinguish from silicon atoms derived from silane coupling agents.
  • the silicon atoms derived from the silane coupling agent are also quantified using a fluorescent X-ray analyzer (for example, Supermini 200, manufactured by Rigaku Corporation). can do.
  • a fluorescent X-ray analyzer for example, Supermini 200, manufactured by Rigaku Corporation.
  • the silane coupling agent per specific surface area of the inorganic filler The coating amount of the derived silicon atoms is calculated.
  • the inorganic filler contained in the epoxy resin molding material can be taken out of the epoxy resin molding material by, for example, the following method.
  • An epoxy resin molding material is put in a magnetic crucible and heated in a muffle furnace or the like (for example, 600 ° C.) to burn the resin component.
  • the resin component of the epoxy resin molding material is dissolved in an appropriate solvent, and the inorganic filler is recovered by filtration and dried.
  • the method for adding the silane coupling agent to the epoxy resin molding material is not particularly limited. Specifically, an integral method in which a silane coupling agent is also added when mixing other materials such as epoxy resin and inorganic filler, after mixing a certain amount of silane coupling agent with a small amount of resin, Master batch method to mix with other materials such as inorganic filler, before mixing with other materials such as epoxy resin, mix inorganic filler and silane coupling agent in advance on the surface of inorganic filler There is a pretreatment method for treating a ring agent.
  • a dry method in which a stock solution or a solution of a silane coupling agent is dispersed together with an inorganic filler by high-speed stirring, the inorganic filler is slurried with a dilute solution of the silane coupling agent, or an inorganic filler is used.
  • examples include a wet method in which the surface of the inorganic filler is treated with a silane coupling agent by immersing the silane coupling agent.
  • the epoxy resin molding material may contain other components in addition to the components described above.
  • Other ingredients include oxidized and non-oxidized polyolefins, carnauba wax, montanic acid esters, montanic acid, stearic acid and other mold release agents, silicone oil, silicone rubber powder and other stress relieving agents, glass fiber and other reinforcements Materials.
  • the other components may be used alone or in combination of two or more.
  • the method for preparing the epoxy resin molding material is not particularly limited.
  • As a general method there is a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, then melt-kneaded, cooled, and pulverized.
  • the melt kneading can be performed with a kneader, a roll, an extruder or the like that has been heated to 70 ° C. to 140 ° C. in advance.
  • Epoxy resin molding materials are easy to use if they are tableted with dimensions and masses that meet the molding conditions.
  • the epoxy resin molding material is preferably in an A-stage state.
  • the epoxy resin molding material is in the A-stage state, when the epoxy resin molding material is cured by heat treatment, the epoxy resin molding material is between the epoxy resin and the curing agent as compared with the case where the epoxy resin molding material is in the B-stage state.
  • the amount of reaction heat generated during the curing reaction increases, and the curing reaction easily proceeds.
  • the definitions of the terms A-stage and B-stage are based on JIS K 6800: 1985.
  • Whether or not the epoxy resin molding material is in the A-stage state is determined according to the following criteria.
  • a certain amount of the epoxy resin molding material is put into an organic solvent (tetrahydrofuran, acetone, etc.) in which the epoxy resin contained in the epoxy resin molding material is soluble, and the inorganic filler remaining after a certain period of time is filtered off. To do. If the difference between the mass after drying of the residue obtained by filtration and the mass of ash after high-temperature treatment is within ⁇ 0.5% by mass, it is judged that the epoxy resin molding material was in the A-stage state. Is done. The mass of ash is measured and calculated in accordance with JIS K 7250-1: 2006.
  • reaction heat per fixed mass of the epoxy resin molding material that has been previously determined to be in the A-stage state is measured by a differential scanning calorimeter (DSC, for example, Pyris 1 manufactured by PerkinElmer) and used as a reference value. Thereafter, if the difference between the measured value of the reaction heat per fixed mass of the prepared epoxy resin molding material and the reference value is within ⁇ 5%, it is determined that the A-stage state has been reached.
  • DSC differential scanning calorimeter
  • the mass reduction rate after heating the A-stage epoxy resin molding material at 180 ° C. for 1 hour is preferably 0.1% by mass or less.
  • the mass reduction rate after heating the A-stage epoxy resin molding material at 180 ° C. for 1 hour is 0.1% by mass or less, which means that the A-stage epoxy resin molding material is a so-called “solventless type”.
  • the molded product of the present embodiment is produced by molding the epoxy resin molding material of the present embodiment.
  • the molded cured product of the present embodiment is produced by heat-treating (post-curing) the molded product of the present embodiment.
  • the method for molding the epoxy resin molding material is not particularly limited, and can be selected from known press molding methods or the like according to the application.
  • the transfer molding method is the most common, but a compression molding method or the like may be used.
  • the mold temperature during molding is preferably not less than the phase transition temperature of epoxy resin A and not more than 150 ° C., more preferably not more than 140 ° C. When the temperature is higher than the phase transition temperature of the epoxy resin A, the epoxy resin A is sufficiently melted during molding to facilitate molding, and when the temperature is 150 ° C. or lower, the thermal conductivity of the molded product tends to be excellent.
  • Mold temperature during press molding is generally 150 ° C to 180 ° C from the viewpoint of fluidity, and at temperatures below 150 ° C, general epoxy resins are difficult to melt, so molding tends to be difficult There is. However, the epoxy resin molding material of this embodiment can be molded even at 150 ° C. or lower.
  • the molded product preferably has a diffraction peak in the range of diffraction angle 2 ⁇ of 3.0 ° to 3.5 ° in an X-ray diffraction spectrum obtained by an X-ray diffraction method using CuK ⁇ rays.
  • a molded product having such a diffraction peak has a highly ordered smectic structure among higher order structures, and is excellent in thermal conductivity.
  • the molded product removed from the mold after molding may be used as it is, or may be used after being cured by heating in an oven or the like, if necessary.
  • the molded cured product is obtained by post-curing the molded product by heating.
  • the heating conditions for the molded product can be appropriately selected according to the type and amount of the epoxy resin A, the curing agent and the like contained in the epoxy resin molding material.
  • the heating temperature of the molded product is preferably 130 ° C. to 200 ° C., more preferably 150 ° C. to 180 ° C.
  • the heating time of the molded product is preferably 1 hour to 10 hours, more preferably 2 hours to 6 hours.
  • the molded cured product is diffracted in the X-ray diffraction spectrum obtained by the X-ray diffraction method using CuK ⁇ rays in a diffraction angle 2 ⁇ of 3.0 ° to 3.5 °. Has a peak. This indicates that the highly ordered smectic structure formed in the molded product is maintained after post-curing by heating, and a molded cured product having excellent thermal conductivity can be obtained.
  • the molded product and molded cured product of the epoxy resin molding material of the present embodiment can be used in fields such as a printed wiring board and a semiconductor element sealing material in addition to industrial and automotive motors and inverters.
  • the epoxy resin molding materials of Examples 1 to 10 and Comparative Examples 1 to 10 were all in the A-stage state. Further, when the epoxy resin molding materials of Examples 1 to 10 and Comparative Examples 1 to 10 were heated at 180 ° C. for 1 hour, the mass reduction ratios were all 0.1% by mass or less.
  • Epoxy resin 2-6 A compound obtained by reacting the epoxy resin 1 represented by the above structure with hydroquinone in the amount shown below and partially prepolymerizing it.
  • Ep is the number of equivalents of the epoxy group of the epoxy resin 1
  • Ph is the number of equivalents of the phenolic hydroxyl group of hydroquinone.
  • Epoxy resin 7 YSLV-80XY without mesogen skeleton bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., epoxy equivalent: 195 g / eq, liquid crystal phase is not shown and isotropically cured
  • CRN (catechol resorcinol novolak resin, catechol (C) and resorcinol (R) charge mass ratio (C / R): 5/95)
  • CRN catechol resorcinol novolak resin, catechol (C) and resorcinol (R) charge mass ratio (C / R): 5/95)
  • KBM-202SS diphenyldimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., molecular weight 244
  • KBM-573 3-phenylaminopropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., molecular weight 255)
  • TPP Triphenylphosphine, manufactured by Hokuko Chemical Co., Ltd.
  • the solid content of the epoxy resins 1 to 6 was measured by the heat loss method.
  • the solid content is measured by measuring 1.0 g to 1.1 g of the sample in an aluminum cup and leaving it in a dryer set at a temperature of 180 ° C. for 30 minutes, and the measured amount before heating. Based on the following formula:
  • Solid content (%) (Measured amount after standing for 30 minutes / Measured amount before heating) ⁇ 100
  • the number average molecular weights of the epoxy resins 1 to 6 were measured by gel permeation chromatography (GPC). The measurement was performed using a high performance liquid chromatography L6000 manufactured by Hitachi, Ltd. and a data analyzer C-R4A manufactured by Shimadzu Corporation. As analytical GPC columns, Tosoh Corporation G2000HXL and 3000HXL were used. The measurement was performed at a sample concentration of 0.2% by mass, tetrahydrofuran as the mobile phase, and a flow rate of 1.0 ml / min. A calibration curve was prepared using a polystyrene standard sample, and the number average molecular weight was calculated using the polystyrene conversion value.
  • the epoxy equivalents of epoxy resins 1 to 6 were measured by the perchloric acid titration method.
  • the phase transition temperatures of the epoxy resins 1 to 6 were measured using a differential scanning calorimetry (DSC) measuring device (Pyris 1 manufactured by PerkinElmer). DSC measurement of a 3 mg to 5 mg sample sealed in an aluminum pan was performed under the conditions of a nitrogen atmosphere with a temperature increase rate of 20 ° C./min, a measurement temperature range of 25 ° C. to 350 ° C., and a flow rate of 20 ⁇ 5 ml / min. The temperature at which the accompanying energy change occurs (endothermic reaction peak temperature) was defined as the phase transition temperature.
  • FIG. 1 the graph obtained by the DSC measurement of the epoxy resins 1 and 3 is shown.
  • the number average molecular weight and the weight average molecular weight of the obtained CRN were measured by GPC.
  • the measurement was performed using a high performance liquid chromatography L6000 manufactured by Hitachi, Ltd. and a data analyzer C-R4A manufactured by Shimadzu Corporation.
  • As analytical GPC columns Tosoh Corporation G2000HXL and 3000HXL were used.
  • the measurement was performed at a sample concentration of 0.2% by mass, tetrahydrofuran as the mobile phase, and a flow rate of 1.0 ml / min.
  • a calibration curve was prepared using a polystyrene standard sample, and the number average molecular weight and the weight average molecular weight were calculated using the polystyrene conversion value.
  • the hydroxyl equivalent was measured as follows.
  • the hydroxyl equivalent was measured by acetyl chloride-potassium hydroxide titration method.
  • the determination of the titration end point was performed by potentiometric titration instead of the coloring method using an indicator because the solution color was dark.
  • the hydroxyl group of the measurement resin was acetylated in a pyridine solution, the excess reagent was decomposed with water, and the resulting acetic acid was titrated with a potassium hydroxide / methanol solution.
  • the obtained CRN is a mixture of compounds having a partial structure represented by at least one of the general formulas (III-1) to (III-4), and Ar is represented by the general formula (III-a)
  • R 11 is a hydroxyl group
  • R 12 and R 13 are hydrogen atoms, a group derived from 1,2-dihydroxybenzene (catechol) and a group derived from 1,3-dihydroxybenzene (resorcinol), respectively.
  • the adhesion amount of silicon atoms derived from the silane coupling agent per specific surface area of the inorganic filler was measured by the following method. First, the specific surface area of the inorganic filler was measured by the BET method using a specific surface area pore distribution measuring apparatus (SA3100, manufactured by Beckman Coulter).
  • the molded product or molded cured product is cut to produce a 5 mm ⁇ 50 mm ⁇ 3 mm rectangular parallelepiped, and using a three-point bending vibration test jig with a dynamic viscoelasticity measuring apparatus (RSA-G2 manufactured by TA Instruments), frequency: The dynamic viscoelasticity was measured in the temperature range of 40 ° C. to 300 ° C. under the conditions of 1 Hz and temperature rising rate: 5 ° C./min.
  • the glass transition temperature (Tg) was defined as the temperature at the peak top portion in tan ⁇ obtained from the ratio of the storage elastic modulus and loss elastic modulus obtained by the above method.
  • the molded product or the molded cured product was cut to produce a 10 mm square cube, and the density (g / cm 3 ) was measured by Archimedes method.
  • the molded product or the molded cured product was cut to produce a 10 mm square cube and blackened with a graphite spray. Thereafter, the thermal diffusivity was evaluated by a xenon flash method (LFA447 nanoflash manufactured by NETZSCH). From the product of this value, the density measured by the Archimedes method, and the specific heat measured by DSC (Pyris 1 manufactured by Perkin Elmer), the thermal conductivity of the molded product or molded cured product was determined.
  • Examples 1 to 5 and Comparative Examples 1 to 5 magnesium oxide was used as the inorganic filler, and in Examples 6 to 10 and Comparative Examples 6 to 10, alumina was used. Comparative Examples 1, 2, 6, and 7 using the epoxy resin 1 or 2 having a phase transition temperature of 140 ° C. or higher could not be molded.
  • Examples 1 to 10 having a phase transition temperature of 140 ° C. or lower are comparative examples using an epoxy resin 7 having no mesogenic skeleton. Compared with 3 to 5 and 8 to 10, the thermal conductivity increased by 2 W / (m ⁇ K) to 3 W / (m ⁇ K).

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Abstract

L'invention concerne un matériau de moulage à base de résine époxy comprenant : une résine époxy A présentant un squelette mésogène et ayant une température de transition de phase inférieure à 140 °C ; un agent de durcissement ; et une charge inorganique.
PCT/JP2016/074878 2016-02-25 2016-08-25 Matériau de moulage à base de résine époxy, produit moulé, produit moulé durci et procédé de fabrication d'un produit moulé WO2017145409A1 (fr)

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Citations (8)

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