WO2017143721A1 - 封装结构、电子设备以及封装结构的制备方法 - Google Patents

封装结构、电子设备以及封装结构的制备方法 Download PDF

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Publication number
WO2017143721A1
WO2017143721A1 PCT/CN2016/089356 CN2016089356W WO2017143721A1 WO 2017143721 A1 WO2017143721 A1 WO 2017143721A1 CN 2016089356 W CN2016089356 W CN 2016089356W WO 2017143721 A1 WO2017143721 A1 WO 2017143721A1
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Prior art keywords
substrate
encapsulant
package structure
optical sensor
sensing component
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PCT/CN2016/089356
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English (en)
French (fr)
Inventor
董昊翔
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深圳市汇顶科技股份有限公司
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Priority to EP16843220.1A priority Critical patent/EP3235425B1/en
Priority to KR1020177006218A priority patent/KR101934497B1/ko
Priority to US15/477,084 priority patent/US9934419B2/en
Publication of WO2017143721A1 publication Critical patent/WO2017143721A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/024—Detecting, measuring or recording pulse rate or heart rate
    • A61B5/02416—Detecting, measuring or recording pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A61B5/02427—Details of sensor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/05—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves 
    • A61B5/053—Measuring electrical impedance or conductance of a portion of the body
    • A61B5/0531—Measuring skin impedance
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/06—Arrangements of multiple sensors of different types
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board

Definitions

  • the present invention relates to the field of electronic technology, and in particular, to a package structure, an electronic device, and a method of fabricating a package structure.
  • the chip or package structure with fingerprint recognition function and heartbeat, blood oxygen and other health monitoring functions generally have the disadvantages of large occupied space and high packaging cost.
  • the inventor has conducted in-depth research and a large number of experiments and found that this is because the fingerprint recognition function is mainly realized by a capacitive sensor.
  • the capacitance is formed by the human hand and the capacitive sensor, and the fingerprint information is obtained according to the change information of the capacitance at the peak of the fingerprint and the position of the valley.
  • the capacitive sensor needs to be disposed on the outer layer of the electronic device to be in contact with the human hand; and the chip for health monitoring functions such as heartbeat and blood oxygen is usually realized by an optical sensor, and the optical sensor contacts the object to be tested (such as the finger of the human body) by detecting light. After the refraction or reflected light signal, according to the change of the intensity of the refracted or reflected light signal, the health parameters such as heartbeat and blood oxygen of the human body are detected. Therefore, the above optical sensor also needs to be disposed on the outer layer of the electronic device, and it is necessary to ensure that it can receive scattered or refracted light having sufficient intensity.
  • the use of the above-mentioned two kinds of sensing elements of the electronic device is generally packaged separately after the capacitive sensor and the optical sensor, and then placed in the appropriate position in the electronic device. Therefore, the chip or the package structure of the electronic device including the fingerprint recognition and the health information monitoring function takes up a large space and has a high packaging cost.
  • the present invention provides a package structure comprising: a substrate; a sensing component disposed on an upper surface of the substrate, and The substrate is electrically connected; and an encapsulant disposed on an upper surface of the substrate and covering at least a portion of the sensing component, wherein the sensing component comprises a capacitive sensor and an optical sensor,
  • the encapsulant includes at least a portion of a light transmissive region disposed corresponding to the optical sensor. Therefore, the capacitive sensor and the optical sensor can be packaged in one package structure, thereby improving the integration degree of the package structure and saving the package space.
  • the light transmissive region is formed of a transparent material.
  • the light outside the package structure can be incident into the inside of the package structure through the light transmitting region, so that the optical sensor can be used to sense the response of the portion of the light to realize the function of using the optical sensor.
  • the encapsulant is formed from a transparent material.
  • the entire encapsulant can be formed simply by using a transparent material in order to realize the function of using the optical sensor.
  • the sensing component is electrically connected to the substrate by a metal wire.
  • the sensing signal sent by the sensing component can be outputted to the substrate, thereby realizing the function of using the packaging structure.
  • the package structure further includes: an LED assembly disposed on an upper surface of the substrate.
  • the LED component can be used to provide backlighting for the optical sensor, thereby improving the effect of the optical sensor for sensing.
  • the invention provides an electronic device.
  • the electronic device comprises the package structure described above. Therefore, some functions of the electronic device can be realized by using the package structure with simple preparation and high integration described above, thereby saving space in the electronic device and reducing the volume of the electronic device.
  • the invention provides a method of making the package structure previously described.
  • the method comprises: (1) providing a sensing component on an upper surface of the substrate, electrically connecting the sensing component to the substrate, the sensing component comprising a capacitive sensor and an optical sensor; (2) providing an encapsulant on the upper surface of the substrate to make the encapsulant package At least a portion of the sensing component is covered, and the encapsulant comprises a light transmissive region, at least a portion of the light transmissive region being disposed corresponding to the optical sensor.
  • the encapsulant is integrally formed on an upper surface of the substrate, and the encapsulant is formed of a transparent material.
  • the light transmitting region is provided by stencil printing.
  • the light transmitting region is provided by spin coating.
  • the light transmitting region is provided by photolithography. Therefore, it is possible to realize the setting of the light transmitting region by means of the above-described simple operation, low cost, and easy mass production.
  • the light transmitting region is formed by a profiled mold.
  • the light transmitting region is provided by dispensing.
  • the light transmitting region is provided by a patch.
  • an opaque encapsulant is disposed on the upper surface of the substrate except the light transmitting region by an overmolding process.
  • an opaque encapsulant is disposed on the upper surface of the substrate by a plastic sealing process to cover the sensing component;
  • the surface of the opaque encapsulant is polished to expose the light transmissive region.
  • the method further comprises: (1-1) disposing an LED component on an upper surface of the substrate.
  • the LED component can be used to provide backlighting for the optical sensor, so that the use effect of the optical sensor in the package structure prepared by the method can be improved.
  • FIG. 1 shows a schematic structural view of a package structure according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a package structure according to another embodiment of the present invention.
  • FIG. 3 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 4 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 5 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 6 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 7 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 8 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 9 is a partial structural view showing a package structure according to still another embodiment of the present invention.
  • FIG. 10 shows a partial structural view of a package structure in accordance with still another embodiment of the present invention.
  • the package structure includes a substrate 100, a sensing assembly 200, and an encapsulant 300.
  • the sensing component 200 is disposed on an upper surface of the substrate 100, and the sensing component 200 is electrically connected to the substrate 100.
  • the encapsulant 300 is disposed on an upper surface of the substrate 100 and covers at least a portion of the sensing assembly 200.
  • the sensing component 200 includes a capacitive sensor 210 and an optical sensor 220.
  • the encapsulant 300 includes at least a portion of the transparent region 310 disposed corresponding to the optical sensor 220. That is, the transparent region 310 is disposed above or around the optical sensor 220. At least a portion of the light transmissive region 310 is located above or around the optical sensor 220 such that the optical sensor 220 can Receiving a refracted or scattered light signal for optical sensing.
  • the unified packaging of the capacitive sensor 210 and the optical sensor 220 can be implemented in the same package structure, the integration degree of the package structure is improved, the preparation of the package structure including the optical sensing and the capacitive sensing function is simplified, space is saved, and cost is reduced. .
  • the substrate 100 may be a printed circuit board, and the substrate 100 includes a circuit, and the sensing component 200 and the circuit in the substrate 100 may be connected by a bonding wire or the like to guide the sensing signal to the substrate.
  • the substrate is interconnected with external signals through terminals or solder balls, so that the function of the package structure can be realized.
  • the specific implementation manner of the electrical connection between the sensing component 200 and the substrate 100 is not particularly limited, and those skilled in the art can perform specific implementations of the electrical connection according to the specific structure and positional relationship of each component in the package structure.
  • the design is as long as the capacitive sensing signal and the optical sensing signal in the sensing component 200 can be output through the substrate 100.
  • the electrical connection of the sensing assembly 200 to the substrate 100 can be accomplished using metal wires.
  • the substrate finger may be disposed on the lower surface of the substrate 100.
  • the substrate finger may be formed of gold-plated copper, one end of the substrate finger is connected to the circuit inside the substrate, and the other end is connected with the reflow pad signal. Interconnecting, thereby connecting the internal signals of the package structure to the outside through the terminals formed by the substrate fingers.
  • the sensing assembly 200 includes a capacitive sensor 210 and an optical sensor 220. Specifically, the optical signal is reflected and refracted after contacting the object to be measured (such as a user's finger), and the optical signal that is partially reflected or refracted is received by the optical sensor. Since the human body's heartbeat, blood oxygen and other changes will change the intensity of the reflected or refracted light signal, the optical sensor 220 can capture the heartbeat of the human body by capturing a series of calculations. , blood oxygen and other data. At the same time, when the object to be measured (finger) is pressed over the package structure, a capacitance is formed with the capacitor sensor below.
  • the capacitance formed by the finger and the capacitance sensor is different in the capacitance of the peak and the valley of the fingerprint, and the capacitance sensor can obtain the fingerprint information of the finger by detecting the difference in the capacitance.
  • the inventors have found through intensive research that many optical sensors are currently used for finger area pressing because the capillary of the finger is dense and the optical sensor is convenient to collect signals. Since the fingerprint recognition is also in the finger area, the positions of the two are overlapped. When the two sensors are integrated together, the pressing of the multiple areas of the finger can be changed to press the single area, and two kinds of information, that is, the fingerprint information are collected at the same time. And optical information, Helps improve the user experience.
  • the integrated package of the capacitive sensor 210 and the optical sensor 220 can effectively improve the integration degree of the package structure, occupy a smaller volume to achieve the same function, and at the same time, adopting a package structure instead of multiple package structures, is beneficial to reducing Raw material costs and packaging costs.
  • the sensing component 200 can be a chip that integrates a capacitive sensing function with an optical sensing function.
  • the sensing component 200 can also be two single function chips each having a capacitive sensing function and an optical sensing function.
  • the processing of the capacitive sensing signal and the optical sensing signal can be realized by using two chips having a single function.
  • the sensing component 200 can also have a metal pad and electrically connect the metal pad to the substrate 100 by using a bonding wire, thereby realizing the sensing component. Communication between 200 and substrate 100.
  • the encapsulant 300 is disposed on an upper surface of the substrate 100 and overlies at least a portion of the sensing assembly 200.
  • the encapsulant 300 may be formed of an encapsulant and molded by injection molding or the like to enable various components in the package structure to be moved as a whole or to perform various types of connection operations.
  • the encapsulant 300 can also function to protect the sensing component 200 and the bonding wires connecting the sensing component 200 and the bonding wires of the substrate 100 from being damaged during use.
  • the encapsulant 300 can provide an excellent electrical and optical sensing environment for the capacitive sensor and the optical sensor, and can dissipate heat, thereby improving the practical use of the sensing assembly 200.
  • the encapsulant 300 includes a light transmissive region 310 disposed corresponding to the optical sensor 220.
  • the optical sensor 220 needs to receive refracted light or scattered light during actual use to implement the sensing function, and thus is disposed at a position corresponding to the optical sensor 220, that is, a position where light is received above and around the optical sensor 220.
  • the light transmitting region 310 is such that the refracted or scattered light can pass through the light transmitting region 310 and be received by the optical sensor 220.
  • the light transmissive region 310 is formed of a transparent material. Those skilled in the art will appreciate that in the present invention, the term "transparent material" should be understood broadly.
  • the transparent region 310 formed by the transparent material may have sufficient intensity of light to pass through, and is received by the optical sensor 220 disposed under the light transmitting region 310 to implement the sensing function of the optical sensor 220.
  • the above "transparent material” may be a material having a transmittance of not less than 20%.
  • the light transmissive region 310 can be formed using a transparent glue or glass.
  • the specific composition and arrangement manner of the above-mentioned encapsulant 300 are not particularly limited as long as the capacitive sensor 210 and the optical sensor 220 can be normally operated and the package structure is implemented, and the sensing component 200 and The structure such as the bonding wire can be protected.
  • the encapsulant 300 may be formed of a transparent material, whereby the encapsulant 300 can be formed simply by integral molding.
  • the specific arrangement manner of the light transmitting region 310 is not particularly limited, and those skilled in the art can design according to the specific conditions of the package structure.
  • the transparent material 310 may be disposed at a position corresponding to the optical sensor 220 by a liquid material such as transparent glue, but not limited to stencil printing or spin-on lithography, and then opaque.
  • the material ie, a material having a light transmission rate of less than 20%
  • the light transmitting region 310 may also be disposed at a position corresponding to the optical sensor 220 by means of dispensing or the like.
  • a light-transmissive region 310 at a position corresponding to the optical sensor 220 by using a special-shaped mold, and then form another portion of the encapsulant 300 by using a mold matched thereto.
  • the package structure may further include an LED assembly 400.
  • the LED component can provide a stable backlight source for the optical sensor 220, so that the optical sensor 220 analyzes and calculates the optical signal refracted or reflected by the human hand based on parameters such as the light intensity of the light source, so that the above-mentioned refraction can be determined more accurately. Or human health parameters (heartbeat, blood pressure, blood oxygen concentration, etc.) obtained from reflected light signals.
  • LED assembly 400 can emit green, red, or infrared light as a backlight source for optical sensor 220.
  • the package structure according to the embodiment of the present invention is simple in preparation, low in cost, and high in chip integration. Thereby, it is possible to obtain the optical sensing signal and the capacitive sensing signal by pressing the user's finger at the same position, thereby obtaining the fingerprint information of the user and realizing health monitoring. With the package structure according to the embodiment of the present invention, space can be saved, and the volume of the package structure can be reduced.
  • the invention provides an electronic device.
  • the electronic device includes the package structure described above. Thereby, it is possible to obtain the optical sensing signal and the capacitive sensing signal by pressing the user's finger at the same position, thereby obtaining the fingerprint information of the user and realizing health monitoring.
  • the partial function of the electronic device is realized by using the package structure which is simple in preparation, low in cost and high in integration described above, thereby saving space in the electronic device and reducing the volume of the electronic device.
  • the electronic device may further include a soft board and a main board.
  • the flexible board is electrically connected to the package structure
  • the main board is electrically connected to the flexible board, and is adapted to control the electronic device based on the sensing signal of the sensing component in the package structure.
  • the specific manner of electrically connecting the package structure and the soft board and the soft board to the main board is not particularly limited.
  • the ball grid array (Ball Grid Array, BGA) can be used. A solder ball is placed on the lower surface of the substrate, and the substrate is connected to the flexible board by reflow soldering.
  • the electrical connection between the substrate and the flexible board can be achieved by a Land Grid Array (LGA).
  • LGA Land Grid Array
  • the flexible board is also electrically connected to the main board, whereby the sensing signal received in the package structure can be output to the main board, and the main board realizes control of the electronic device based on the above signal.
  • the sensing signal sent by the sensing element in the package structure can be easily controlled to perform related control on the electronic device, thereby expanding the use function of the electronic device.
  • the invention proposes a method of making the package structure previously described. According to an embodiment of the invention, the method comprises:
  • a sensing assembly is provided on the upper surface of the substrate.
  • the substrate includes a circuit
  • the sensing component can be connected to the circuit in the substrate, and the sensing signal is led to the substrate, and the substrate is interconnected with an external signal through a terminal or a solder ball, thereby implementing the package.
  • the sensing component includes a capacitive sensor and an optical sensor, and in this step, the sensing component including the above-described component is disposed on the upper surface of the substrate and electrically connects the sensing component to the substrate.
  • the specific composition of the sensing component has been described in detail above and will not be described herein.
  • the sensor assembly 200 can be fixed to the upper surface of the substrate by using a DAF film, an epoxy resin or other thermosetting polymer, and a substance having an adhesive function such as glue.
  • a DAF film an epoxy resin or other thermosetting polymer
  • a substance having an adhesive function such as glue
  • the method may further include:
  • an LED assembly is disposed on an upper surface of the substrate.
  • the LED component is disposed on the upper surface of the substrate, so that the LED component can be used to provide a stable backlight source for the optical sensor, so that the optical sensor analyzes and calculates the optical signal refracted or reflected by the human hand based on parameters such as the light intensity of the light source.
  • human health parameters heartbeat, blood pressure, blood oxygen concentration, etc.
  • the packaged LED component can be disposed on the upper surface of the substrate by surface mount technology; the LED chip can be attached to the substrate and the electrical connection between the LED chip and the substrate can be realized by using the bonding wire. Then, using, but not limited to, dispensing, a transparent molding compound is used and dispensed only on and around the LED chip to form an LED assembly.
  • the corresponding area of the upper surface of the LED component should be transparent to light, so that the light emitted by the LED component can penetrate the partial area, thereby ensuring light can be ensured. After being reflected or refracted, it is received by the optical sensor.
  • the corresponding area of the upper surface of the LED component can also be polished to make a thin encapsulation colloid, which is advantageous for the backlight to be emitted.
  • an encapsulant is disposed on the upper surface of the substrate, so that the encapsulant covers at least a portion of the sensing component, and the encapsulant comprises a light transmissive region, and the light transmissive region is disposed corresponding to the optical sensor.
  • the capacitance sensor and the optical sensor can be easily packaged into the same package structure, so that the degree of integration of the package structure prepared by the method can be improved.
  • the method may further include, but is not limited to, related processing steps in a conventional packaging process, such as wafer thinning, dicing, patching, setting pads, wire bonding, before setting the encapsulant. Ball and other steps.
  • the optical sensor needs to receive the refracted light or the scattered light to realize the sensing function during actual use, so the light transmitting area is disposed at a position corresponding to the optical sensor, that is, a position setting above the optical sensor that needs to receive light.
  • the light transmitting area is such that the refracted light or the scattered light can pass through the light transmitting area and be received by the optical sensor.
  • composition and arrangement manner of the above-mentioned encapsulant and the transparent region are not particularly limited as long as the capacitive sensor and the optical sensor can be normally operated, and the package structure is implemented, and the sensing component and the sensing component are The structure such as the bonding wire can be protected.
  • the light transmissive region may be provided by stencil printing, spin-on lithography, profiled molding, dispensing or patching.
  • the encapsulant may be formed of a transparent material and formed integrally on the upper surface of the substrate.
  • a transparent material may be disposed at a position corresponding to the optical sensor by a liquid material such as transparent glue, but not limited to stencil printing or spin-on lithography, and then an opaque material is used ( That is, the material having a light transmittance of less than 20%) forms other portions of the encapsulant to protect the package structure.
  • the light transmitting region may be disposed at a position corresponding to the optical sensor by means of dispensing or the like.
  • a special-shaped mold it is also possible to first form a light-transmissive area at a position corresponding to the optical sensor by using a special-shaped mold, and then form a part of the encapsulant by using a mold matched thereto.
  • a special-shaped mold it is also possible to first use a special-shaped mold to be disposed at a portion other than the corresponding position of the optical sensor, and to provide other portions of the encapsulant by using an opaque material, and then use the supporting mold to form a light-transmitting region.
  • the setting of the encapsulation colloid can be realized by integral molding by using the transparent encapsulant, and then the light transmissive area of the corresponding area of the optical sensor is thinned by grinding or the like, so that the light is favorable for passing through the transparent light. Zone, thereby enabling the preparation of the package structure.
  • the material in order to reduce the signal-to-noise ratio of the optical sensor and discharge the external light source, the material may be optically etched by means of stencil printing, spin-on lithography, profiled injection molding, dispensing, etc.
  • the upper surface of the sensor is provided with a light transmitting area, and a film formed by transparent glass or transparent glue may be disposed on the upper surface of the optical sensor by using a patching technique to form a light transmitting region. That is to say, the light transmitting area is only provided corresponding to the optical sensor.
  • the region other than the light-transmitting region may be completely covered by the opaque material, but not limited to the overmolding process, and the preparation of the package structure may be completed.
  • an opaque encapsulant is disposed on the upper surface of the substrate by a plastic sealing process to cover the sensing component, and then the surface of the opaque encapsulant is polished to expose the light-transmitting region.
  • a portion of the encapsulant may be formed on the upper surface of the substrate with an opaque material by means of, but not limited to, a profiled injection molding, and then a light transmissive region may be disposed on the upper surface of the optical sensor.
  • the optical sensor and the upper surface of the capacitive sensor may be packaged by using a transparent material, and then the opaque material is used for packaging on other areas on the upper surface of the substrate, thereby finally obtaining an embodiment according to the present invention.
  • Package structure is not particularly limited as long as the prepared package structure can realize the use function described above.
  • the steps are simple, the cost is low, and the prepared package structure is highly integrated. Thereby, it is possible to obtain the optical sensing signal and the capacitive sensing signal by pressing the user's finger at the same position, thereby obtaining the fingerprint information of the user and realizing health monitoring.
  • the package structure prepared according to the method of the embodiment of the invention space can be saved, and the volume of the package structure can be reduced.
  • Embodiment 1 LED external package
  • the transparent chip is used to mold the entire chip, so that the package gel above the optical sensor has good light transmission, thereby ensuring the function of the optical sensor.
  • the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is shown in Figure 3.
  • Embodiment 2 LED external package
  • a wafer-level processing method is used to pre-form a transparent plastic protective layer on the surface of the optical sensor by stencil printing, and then through a series of processes such as wafer thinning, dicing, patching, and bonding, and then An opaque plastic encapsulant is used in the Exposed Die Molding package to ensure that the resulting transparent plastic protective layer is exposed to ensure that the optical sensor functions.
  • the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is shown in Figure 1.
  • Embodiment 3 LED external package
  • Embodiment 4 LED external package
  • a wafer-level processing method is used to pre-form a transparent plastic protective layer on the surface of the sensing component by spin-coating lithography, and then through a series of processes such as wafer thinning, dicing, patching, and wire bonding. Then, use an opaque plastic encapsulant for the Exposed Die Molding package to ensure that the resulting transparent plastic protective layer is exposed to ensure that the optical sensor functions. At the same time, the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is shown in FIG. 5.
  • Embodiment 5 LED external package
  • a wafer-level processing method is used to pre-form a transparent plastic protective layer on the surface of the sensing component by stencil printing, and then through a series of processes such as wafer thinning, dicing, patching, and wire bonding.
  • An opaque plastic encapsulant is then used in the Exposed Die Molding package to ensure that the resulting transparent plastic protective layer is exposed to ensure that the optical sensor functions.
  • the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is shown in FIG. 5.
  • Embodiment 6 LED external package
  • first, wafer thinning, dicing, patching, and wire bonding are performed.
  • a special-shaped injection mold is used, and only the plastic molding compound is used for the first molding on and around the optical sensor; then the matching injection mold and opacity are used.
  • the plastic sealant is secondly molded in other parts, and the other parts are plastically sealed to ensure that the first plastic encapsulated plastic is exposed to ensure the function of the optical sensor.
  • the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the first plastic seal can be done after the wire bond or before the wire bond.
  • the prepared package structure is shown in FIG.
  • Embodiment 7 LED external package
  • Embodiment 8 LED external package
  • the wafer is thinned, diced, patched, and soldered. Then, a piece of transparent thin glass is pasted on the optical sensor in the form of a patch using a transparent glue or a transparent film. The glass needs to completely cover the optical sensor. Finally, the opaque molding compound is used to mold the opaque molding compound in other parts. At the same time, the thickness of the structure such as the encapsulated colloid or glass above the sensing component is controlled to ensure the function of the capacitive sensor. Paste the transparent glass either after the wire or before the wire.
  • the prepared package structure is shown in Figure 1.
  • Embodiment 9 LED external package
  • the molding method of Embodiment 8 and Embodiment 9 may also be that the whole is molded by using an opaque molding compound, and finally, the thin glass is exposed by, but not limited to, sanding the surface of the molding body. Thin the thin glass above the sensing assembly to ensure that the optical sensor functions.
  • Embodiment 10 LED external package
  • a wafer-level processing method is used to remove the surface of the sensing component or the surface of the sensing component except the optical sensor in the package structure, and an opaque plastic protective layer is pre-formed by stencil printing or spin-on lithography. Then, through a series of packaging processes such as wafer thinning, dicing, patching, wire bonding, and overmolding, the other parts are molded with a transparent plastic sealant. At the same time, the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is as shown in FIG. 1 or FIG. 5.
  • the plastic sealing method of Embodiments 2 to 5 and 10 may further mold the whole with an opaque molding compound, and finally, expose the transparent portion above the sensing component or the optical sensor by means of, but not limited to, grinding the surface of the molding body. At the same time, the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • Embodiment 11 LED external package
  • the wafer is thinned, diced, patched, and soldered. Then, by means of dispensing, the transparent plastic sealant is used and the glue is applied only on and around the optical sensor, and then the opaque plastic sealant is used for the whole. Plastic seal. Finally, the transparent dispensing area above the optical sensor is exposed by, but not limited to, the surface of the molded body. The encapsulation gel above the sensing component is made thin to ensure that the capacitive sensor performs its function.
  • the prepared package structure is shown in FIG.
  • Embodiment 12 LED external package
  • wafer thinning, dicing, patching, and wire bonding are performed according to the conventional packaging process. Then, using a special-shaped injection mold, the first plastic molding is performed on the surface of the sensing component where the metal pad is removed; then, the plastic molding is used for the first molding; Then use the matching injection mold and opaque plastic sealant to make a second plastic seal in other parts, and protect other parts from plastic sealing, and ensure that the first plastic sealing plastic is exposed to ensure the function of the optical sensor. At the same time, the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor. The first plastic seal can be done after the wire bond or before the wire bond.
  • the prepared package structure is shown in FIG.
  • the packaged LEDs are first placed on the substrate using surface mount technology, and then packaged in accordance with the package schemes of Embodiments 1 through 12. At the same time, the thickness of the encapsulant above the sensing component is controlled to ensure the function of the capacitive sensor.
  • the prepared package structure is shown in Figure 4.
  • Embodiment 14 LED built-in package
  • the LED bare chip is attached to the substrate and soldered, and then the dispensing is performed by using a transparent plastic encapsulant and only on and around the LED bare chip, and then combined with the packaging schemes of Embodiments 1 to 12. Subsequent packaging, and finally the surface of the package is polished to expose the transparent areas above the LEDs and optical sensors to ensure that the LEDs and optical sensors perform their functions.
  • the encapsulation gel above the sensing component is made thin to ensure that the capacitive sensor performs its function.
  • the prepared package structure is shown in FIG.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. , Or integrated; they may be mechanically connected, or they may be electrically connected or communicate with each other; they may be directly connected or indirectly connected through an intermediate medium, and may be internal communication of two elements or an interaction of two elements unless There are also clear limits. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

Abstract

提供一种封装结构、电子设备以及封装结构的制备方法。封装结构包括：基板（100）；传感组件（200），该传感组件（200）设置在基板（100）的上表面，并与该基板（100）电连接；封装胶体（300），该封装胶体（300）设置在基板（100）的上表面并包覆该传感组件（200）的至少一部分，其中，该传感组件（200）包括电容传感器（210）和光学传感器（220），该封装胶体（300）包括至少一部分与该光学传感器（220）对应设置的透光区（310）。由此，将电容传感器与光学传感器封装在一个封装结构中，从而提高封装结构的集成程度，节省封装空间。

Description

封装结构、电子设备以及封装结构的制备方法
本申请要求于2016年2月23日提交中国专利局、申请号为201610100363.1、发明名称为“封装结构、电子设备以及封装结构的制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子技术领域，具体地，本发明涉及封装结构、电子设备以及封装结构的制备方法。
背景技术
随着科技的日益发展，人们对手机以及新型可穿戴电子设备的需求越来越高，上述电子设备也逐渐向多功能化、小型化发展。指纹识别技术、心跳检测、血样检测等健康指标检测功能也将逐渐成为手机和可穿戴电子产品的标准配置。由于质轻、纤薄、微型化是目前消费类电子发展的一大趋势。因此如何在越来越小的芯片体积内实现更多的功能，是目前芯片设计以及封装技术需要解决的主要问题之一。
然而，目前的封装结构以及封装方法仍有待改进。
发明内容
本申请是基于发明人对以下事实和问题的发现和认识作出的：
目前具有指纹识别功能以及心跳、血氧等健康监测功能的芯片或封装结构，普遍存在占用空间大、封装费用高等缺点。发明人经过深入研究以及大量实验发现，这是由于指纹识别功能目前主要通过电容传感器实现，通过人手与电容传感器形成电容，根据指纹的波峰和波谷位置处电容量的变化信息获得指纹信息，因此上述电容传感器需要设置在电子设备的外层以便与人手互相接触；而心跳、血氧等健康监测功能的芯片通常是通过光学传感器实现的，光学传感器通过检测光线接触到待测物(如人体的手指)后的折射或反射光信号，根据折射或反射光信号强弱的变化，检测人体的心跳、血氧等健康参数。因此，上述光学传感器也需要设置在电子设备的外层，并需要保证能够接收的具有有足够强度的散射或者折射光。为了分别实现上述传感元件 的使用功能，目前涉及上述两种传感元件的电子设备一般采用对电容传感器以及光学传感器分别封装后，再设置在电子设备中的适当位置。因此导致包含指纹识别以及健康信息监测功能的电子设备的芯片或封装结构占用空间大、封装费用高。
在本发明的一个方面，本发明提出了一种封装结构，根据本发明的实施例，该封装结构包括：基板；传感组件，所述传感组件设置在所述基板的上表面，并且与所述基板电连接；以及封装胶体，所述封装胶体设置在所述基板的上表面，并且包覆所述传感组件的至少一部分，其中，所述传感组件包括电容传感器和光学传感器，所述封装胶体包括至少一部分与所述光学传感器对应设置的透光区。由此，可以将电容传感器与光学传感器封装在一个封装结构中，从而可以提高该封装结构的集成程度，节省封装空间。
根据本发明的实施例，所述透光区是由透明材料形成的。由此，可以使封装结构外部的光线通过透光区入射到封装结构内部，从而可以利用光学传感器对这一部分光线进行传感响应，以便实现光学传感器的使用功能。
根据本发明的实施例，所述封装胶体是由透明材料形成的。由此，可以简便地利用透明的材料形成整个封装胶体，以便实现光学传感器的使用功能。
根据本发明的实施例，所述传感组件与所述基板通过金属线电连接。由此，可以将传感组件发出的传感信号输出到基板上，进而可以实现该封装结构的使用功能。
根据本发明的实施例，该封装结构进一步包括：LED组件，所述LED组件设置在所述基板的上表面。由此，可以利用LED组件为光学传感器提供背光，从而可以提高光学传感器进行传感的效果。
在本发明的另一方面，本发明提出了一种电子设备。根据本发明的实施例，该电子设备包括前面所述的封装结构。由此，可以利用前面描述的制备简便、集成程度高的封装结构实现该电子设备的部分功能，从而可以节省电子设备中的空间，有利于减小该电子设备的体积。
在本发明的另一方面，本发明提出了一种制备前面所述的封装结构的方法。根据本发明的实施例，该方法包括：(1)在基板的上表面设置传感组件，使所述传感组件与所述基板电连接，所述传感组件包括电容传感器以及光学传感器；以及(2)在所述基板的上表面设置封装胶体，使所述封装胶体包 覆所述传感组件的至少一部分，且所述封装胶体包括透光区，所述透光区的至少一部分与所述光学传感器对应设置。由此，可以简便地将电容传感器以及光学传感器封装到同一个封装结构中，从而可以提高利用该方法制备的封装结构的集成程度。
根据本发明的实施例，步骤(2)中，所述封装胶体一体化形成在所述基板的上表面，且所述封装胶体是由透明材料形成的。由此，可以简便地通过一体化封装，实现光学传感器的使用功能。
根据本发明的实施例，步骤(2)中，所述透光区是通过钢网印刷设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，步骤(2)中，所述透光区是通过旋涂设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，步骤(2)中，所述透光区是通过光刻设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，步骤(2)中，所述透光区是通过异型模具成型设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，步骤(2)中，所述透光区是通过点胶设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，步骤(2)中，所述透光区是通过贴片设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。
根据本发明的实施例，在步骤(2)中，设置所述透光区之后，通过露模注塑工艺在所述基板的上表面除透光区以外的位置设置不透明的封装胶体。由此，可以简便地完成该封装结构除透光区以外区域的封装。
根据本发明的实施例，在步骤(2)中，设置所述透光区之后，通过塑封工艺在所述基板的上表面设置不透明的封装胶体，使其包覆所述传感组件；对所述不透明的封装胶体表面进行打磨使所述透光区露出。由此，可以 降低对于不透明封装胶体封装区域精度控制的要求，降低生产成本。
根据本发明的实施例，在步骤(1)中，设置所述传感组件之前，进一步包括：(1-1)在所述基板的上表面设置LED组件。由此，可以利用LED组件为光学传感器提供背光，从而可以提高利用该方法制备的封装结构中光学传感器的使用效果。
附图说明
图1显示了根据本发明一个实施例的封装结构的结构示意图；
图2显示了根据本发明另一个实施例的封装结构的结构示意图；
图3显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图4显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图5显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图6显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图7显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图8显示了根据本发明又一个实施例的封装结构的部分结构示意图；
图9显示了根据本发明又一个实施例的封装结构的部分结构示意图；以及
图10显示了根据本发明又一个实施例的封装结构的部分结构示意图。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
根据本发明的实施例，参考图1，该封装结构包括：基板100、传感组件200以及封装胶体300。
具体地，传感组件200设置在基板100的上表面，且传感组件200与基板100电连接。封装胶体300设置在基板100的上表面，且包覆传感组件200的至少一部分。其中，传感组件200包括电容传感器210以及光学传感器220，封装胶体300包括至少一部分与光学传感器220对应设置的透光区310，也就是说，在光学传感器220的上方或周围设置透光区310，透光区310的至少一部分位于与光学传感器220的上方或者周围，以便光学传感器220可以 接收到折射或者散射光信号，实现光学传感功能。由此，可以在同一封装结构中实现电容传感器210以及光学传感器220的统一封装，提高该封装结构的集成程度，简化包含光学传感以及电容传感功能的封装结构的制备，节省空间并降低成本。
下面对该封装结构的各个部分进行详细描述。
根据本发明的实施例，基板100可以为印刷电路板，基板100中包含有电路，进而可以通过焊线等将传感组件200与基板100中的电路进行连接，将传感信号引至基板，基板再通过端子或者锡球等方式实现与外界信号互联，从而可以实现该封装结构的使用功能。需要说明的是，传感组件200与基板100之间电连接的具体实现方式不受特别限制，本领域技术人员可以根据封装结构中各个部件的具体结构以及位置关系对电连接的具体实现方式进行设计，只要能够将传感组件200中的电容传感信号以及光学传感信号通过基板100输出即可。例如，根据本发明的一个实施例，参考图3，可以利用金属线实现传感组件200与基板100的电连接。根据本发明的另一个实施例，可以通过在基板100下表面设置基板手指，例如，该基板手指可以由镀金铜形成，该基板手指一端与基板内部的电路连接，另一端与回流焊焊盘信号互联，从而通过基板手指构成的端子，实现将封装结构的内部信号连接到外部。
传感组件200包括电容传感器210以及光学传感器220。具体地，光信号在接触到被测物体(如用户的手指)后会发生反射和折射，这一部分被反射或折射的光信号被光学传感器接收。由于人体的心跳、血氧等一系列变化都会使反射或折射光信号的强度发生改变，故光学传感器220通过捕捉光信号的强弱变化，后续再通过一系列的计算就能够得出人体的心跳、血氧等一系列数据。而同时，当被测物体(手指)按压在封装结构上方，会与下方的电容传感器形成一个电容。由于人的手指指纹存在沟壑，故手指与电容传感器形成的电容，在指纹的波峰和波谷处的电容容量不同，而电容传感器通过检测这一电容量的不同，可以得到手指的指纹信息。发明人经过深入研究发现，由于手指的毛细血管密集，便于光学传感器采集信号，因此目前许多光学传感器都针对手指区域按压使用。而指纹识别由于所采集的指纹也在手指区域，所以二者位置有重叠，将两种传感器集成到一起可以变手指多重区域的按压为单一区域按压，且同时收集了两种信息，即指纹信息和光学信息， 有助于提升用户体验。因此，本发明通过将电容传感器210以及光学传感器220集成封装，可以有效提升封装结构的集成度，占用更小的体积实现相同的功能；同时，采用一个封装结构代替多个封装结构，有利于降低原材料成本及封装成本。
根据本发明的实施例，参考图1，传感组件200可以是将电容传感功能与光学传感功能集成在一起的一颗芯片。根据本发明的另一个实施例，参考图2，传感组件200也可以是两颗分别具有电容传感功能与光学传感功能的单一功能芯片。由此，可以利用两颗具有单一功能的芯片，分别实现电容传感信号以及光学传感信号的处理。
本领域技术人员可以理解的是，为了实现传感信号的处理以及输出，传感组件200还可以具有金属焊盘，并利用焊线将金属焊盘与基板100电连接，从而可以实现传感组件200与基板100之间的通信。
根据本发明的实施例，封装胶体300设置在基板100的上表面，并且包覆传感组件200的至少一部分。具体地，封装胶体300可以由封装胶形成，并通过注塑等方式成型，使封装结构中的各个部件能够作为一个整体被移动或进行各类连接操作。并且，封装胶体300还可以起到保护传感组件200以及连接传感组件200以及基板100的焊线等连接线在使用过程中不受破坏的作用。并且，封装胶体300能够为电容传感器以及光学传感器提供优良的电学以及光学传感环境，同时能够散热，从而可以提高传感组件200的实际使用效果。
具体地，封装胶体300包括与光学传感器220对应设置的透光区310。如前所述，光学传感器220在实际使用过程中需要接收折射光或散射光来实现传感功能，因此在与光学传感器220相对应的位置，即光学传感器220上方以及周围需要接收光线的位置设置透光区310，以便折射光或散射光可以透过透光区310，被光学传感器220接收。根据本发明的实施例，透光区310由透明材料形成。本领域技术人员能够理解的是，在本发明中，术语“透明材料”应作广义理解。即该透明材料形成的透光区310可以具有足够强度的光线透过，被设置在透光区310下方的光学传感器220接收，以实现光学传感器220的传感功能。具体地，根据本发明的实施例，上述“透明材料”可以为透过率不低于20％的材料。例如，可以利用透明胶水或者玻璃形成透光区310。
需要说明的是，上述封装胶体300的具体组成、设置方式不受特别限制，只要能够满足可以使电容传感器210以及光学传感器220正常工作，并实现对该封装结构的封装，对传感组件200以及焊线等结构进行保护即可。例如，根据本发明的实施例，封装胶体300可以是由透明材料形成的，由此，可以简便地通过一体化成型形成封装胶体300。
根据本发明的实施例，透光区310的具体设置方式不受特别限制，本领域技术人员可以根据封装结构的具体情况进行设计。例如，根据本发明的一些实施例，可以由透明胶水等液态材料，采用但不限于钢网印刷或者旋涂光刻的方式，在光学传感器220对应的位置设置透光区310，然后再用不透明材料(即光线透过率低于20％的材料)形成封装胶体300的其他部分，以便对该封装结构进行保护。根据本发明的另一些实施例，也可以通过点胶等方式，在光学传感器220对应的位置设置透光区310。此外，还可以首先利用异型模具成型，在光学传感器220对应的位置设置透光区310，再利用与之配套的模具形成封装胶体300的其他部分。或者，还可以首先利用异型模具在除光学传感器220对应位置以外的部位设置利用不透明材料设置封装胶体300的其他部分，再利用配套模具形成透光区310。
根据本发明的实施例，为了提高光学传感器的传感效果，进一步增加根据本发明实施例的封装结构的集成程度，参考图4，该封装结构还可以进一步包括LED组件400。具体地，LED组件可以为光学传感器220提供稳定的背光光源，以便光学传感器220基于光源的光强等参数，对经过人手折射或者反射的光信号进行分析计算，从而可以更准确地确定基于上述折射或者反射的光信号得到的人体健康参数(心跳、血压、血氧浓度等等)。LED组件400的具体组成以及背光光源的具体发光参数不受特别限定，本领域技术人员可以根据实际情况对上述参数进行设计。例如，LED组件400可以发射绿光、红光或者红外光作为光学传感器220的背光光源。
综上所述，根据本发明实施例的封装结构，制备简便，成本低廉，芯片集成程度高。由此，可以实现通过用户手指在同一位置进行按压，同时获得光学传感信号和电容传感信号，进而可以获得用户的指纹信息并实现健康监测。利用根据本发明实施例的封装结构，可以节省空间，有利于减小封装结构的体积。
在本发明的另一方面，本发明提出了一种电子设备。具体地，根据本发 明的实施例，该电子设备包括前面描述的封装结构。由此，可以实现通过用户手指在同一位置进行按压，同时获得光学传感信号和电容传感信号，进而可以获得用户的指纹信息并实现健康监测。利用前面描述的制备简便、成本低廉、集成程度高的封装结构实现该电子设备的部分功能，从而可以节省电子设备中的空间，有利于减小该电子设备的体积。
具体地，根据本发明的实施例，该电子设备还可以包括软板以及主板。软板与封装结构电连接，主板与软板电连接，且适于基于封装结构中传感组件的传感信号对电子设备进行控制。需要说明的是，封装结构与软板、软板与主板之间电连接的具体方式不受特别限制，例如，根据本发明的具体实施例，可以通过焊球阵列封装方式(Ball Grid Array,BGA)，在基板的下表面设置焊球，通过回流焊将基板与软板相连接。根据本发明的另一个实施例，可以通过栅格阵封装方式(Land Grid Array,LGA)实现基板与软板的电连接。软板还与主板电连接，由此，可以将封装结构中接收到的传感信号输出到主板，主板再基于上述信号实现对该电子设备的控制。由此，可以简便地实现利用封装结构中的传感元件发出的传感信号对该电子设备进行相关控制，从而可以扩展该电子设备的使用功能。
在本发明的又一方面，本发明提出了一种制备前面描述的封装结构的方法。根据本发明的实施例，该方法包括：
S100设置传感组件
根据本发明的实施例，在该步骤中，在基板的上表面设置传感组件。关于基板的具体类型，前面已经进行了详细的描述，在此不再赘述。例如，基板中包含有电路，进而可以将传感组件与基板中的电路进行连接，将传感信号引至基板，基板再通过端子或者锡球等方式实现与外界信号互联，从而可以实现该封装结构的使用功能。具体地，传感组件包括电容传感器以及光学传感器，在该步骤中，将含有上述元件的传感组件设置在基板上表面并使传感组件与基板电连接。关于传感组件的具体组成，前面已经进行了详细的描述，在此不再赘述。
具体地，根据本发明的实施例，可以利用DAF薄膜(Die Attach Film)、环氧树脂或其他热固性聚合物以及胶水等具有粘合功能的物质，将传感组件200固定在基板的上表面。由此，可以简便地将电容传感器以及光学传感器固定在基板上，从而可以实现该封装结构的实际使用功能。
此外，为了进一步提高利用该方法制备的封装结构的集成程度，提高光学传感器的使用效果，在设置传感组件之前，该方法还可以进一步包括：
S10设置LED组件
根据本发明的实施例，在该步骤中，在基板的上表面设置LED组件。具体地，将LED组件设置在基板的上表面，从而可以利用LED组件为光学传感器提供稳定的背光光源，以便光学传感器基于光源的光强等参数，对经过人手折射或者反射的光信号进行分析计算，从而可以更准确地确定基于上述折射或者反射的光信号得到的人体健康参数(心跳、血压、血氧浓度等等)。关于LED组件的具体结构，前面已经进行了详尽的描述，在此不再赘述。具体地，在该步骤中，可以将封装好的LED组件通过表面贴装技术设置在基板的上表面上；还可以将LED芯片贴合到基板上并利用焊线实现LED芯片与基板的电连接，之后采用但不限于点胶的方式，使用透明塑封胶在且仅在LED芯片上方和周围进行点胶，形成LED组件。本领域技术人员能够理解的是，在根据本发明实施例的封装结构中，LED组件上表面对应的区域应可透过光线，以便LED组件发出的光线可以穿透该部分区域，进而保证光线可以经过反射或者折射后被光学传感器接收。为了进一步提高LED组件提供背光的效果，在该步骤中，还可以对LED组件上表面对应的区域进行打磨，以做薄封装胶体，利于背光的射出。
S200设置封装胶体
根据本发明的实施例，在该步骤中，在基板的上表面设置封装胶体，使封装胶体包覆传感组件的至少一部分，且封装胶体包括透光区，透光区与光学传感器对应设置。由此，可以简便地将电容传感器以及光学传感器封装到同一个封装结构中，从而可以提高利用该方法制备的封装结构的集成程度。本领域技术人员能够理解，在设置封装胶体之前，该方法还可以包括但不限于传统封装流程中的相关处理步骤，例如，晶圆减薄、划片、贴片、设置焊盘、焊线焊球等步骤。
如前所述，光学传感器在实际使用过程中需要接收折射光或散射光来实现传感功能，因此透光区设置在与光学传感器相对应的位置，即在光学传感器上方需要接收光线的位置设置透光区，以便折射光或散射光可以透过透光区，被光学传感器接收。关于形成透光区的材料，前面已经进行了详细的描述，在此不再赘述。
需要说明的是，上述封装胶体以及透光区的具体组成、设置方式不受特别限制，只要能够满足可以使电容传感器以及光学传感器正常工作，并实现对该封装结构的封装，对传感组件以及焊线等结构进行保护即可。
根据本发明的实施例，透光区可以是通过钢网印刷、旋涂光刻、异型模具成型、点胶或者贴片设置的。由此，可以利用上述操作简便、成本低廉、易于大规模生产的方式实现透光区的设置。根据本发明的另一个实施例，封装胶体可以由透明材料形成，通过一体化形成在基板的上表面。由此，可以简便地通过一体化封装，实现光学传感器的使用功能。
需要说明的是，透光区或者封装胶体的具体设置方式不受特别限制，本领域技术人员可以根据封装结构的具体情况进行设计。例如，根据本发明的一些实施例，可以由透明胶水等液态材料，采用但不限于钢网印刷或者旋涂光刻的方式，在光学传感器对应的位置设置透光区，然后再用不透明材料(即光线透过率低于20％的材料)形成封装胶体的其他部分，以便对该封装结构进行保护。根据本发明的另一些实施例，也可以通过点胶等方式，在光学传感器对应的位置设置透光区。此外，还可以首先利用异型模具成型，在光学传感器对应的位置设置透光区，再利用与之配套的模具形成封装胶体的其他部分。或者，还可以首先利用异型模具在除光学传感器对应位置以外的部位设置，利用不透明材料设置封装胶体的其他部分，再利用配套模具形成透光区。
具体地，根据本发明的实施例，可以利用透明封装胶体通过一体化成型实现封装胶体的设置，然后采用打磨等方式，将光学传感器对应区域的透光区做薄，使光线利于穿过透光区，从而实现该封装结构的制备。根据本发明的实施例，为了降低光学传感器的信噪比，排出外界光源干扰，也可以通过钢网印刷、旋涂光刻、异形注塑模具成型、点胶等方式，利用透明胶水等材料在光学传感器的上表面设置透光区，也可以利用贴片技术，将透明玻璃或者透明胶水形成的薄膜设置在光学传感器的上表面，形成透光区。也就是说，透光区仅与光学传感器对应设置。根据本发明的实施例，还可以在形成透光区之后，利用不透明材料，采用但不限于露模注塑工艺将透光区之外的区域全部覆盖，完成该封装结构的制备，也可以在设置透光区之后，通过塑封工艺在基板的上表面设置不透明的封装胶体，使其包覆传感组件，然后再对不透明的封装胶体表面进行打磨使透光区露出。
本领域技术人员能够理解的是，只要能够使制备的封装结构实现前面描述的使用功能，上述制备步骤的先后顺序不受特别限定。例如，根据本发明的一个实施例，可以先通过但不限于异形注塑模具成型的方式，在基板上表面利用不透明材料形成封装胶体的一部分，然后再在光学传感器的上表面设置透光区。或者，根据本发明的另一个实施例，也可以利用透明材料，在光学传感器以及电容传感器的上表面进行封装，然后再利用不透明材料在基板上表面其他区域进行封装，最终获得根据本发明实施例的封装结构。
综上所述，根据本发明实施例的制备方法，步骤简便，成本低廉，制备的封装结构集成程度高。由此，可以实现通过用户手指在同一位置进行按压，同时获得光学传感信号和电容传感信号，进而可以获得用户的指纹信息并实现健康监测。利用根据本发明实施例的方法制备的封装结构，可以节省空间，有利于减小封装结构的体积。
下面将结合实施例对本发明的方案进行解释。本领域技术人员将会理解，下面的实施例仅用于说明本发明，而不应视为限定本发明的范围。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。所用试剂或仪器未注明生产厂商者，均为可以通过市购获得的常规产品。
实施例1 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线之后，采用透明塑封胶进行整颗芯片的塑封，以实现光学传感器上方的封装胶体透光性良好，从而保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图3所示。
实施例2 LED外置封装
首先使用晶圆级加工方法，在光学传感器表面采用钢网印刷方式预先生成一层透明的塑封保护层，之后再通过晶圆减薄、划片、贴片、焊线等一系列工艺处理，然后使用不透明的塑封胶进行露模注塑(Exposed Die Molding)封装，确保生成的透明的塑封保护层裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图1所示。
实施例3 LED外置封装
首先使用晶圆级加工方法，在光学传感器表面采用旋涂光刻方式预先生 成一层透明的塑封保护层，之后再通过晶圆减薄、划片、贴片、焊线等一系列工艺处理，然后使用不透明的塑封胶将进行露模注塑(Exposed Die Molding)封装，确保生成的透明的塑封保护层裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图1所示。
实施例4 LED外置封装
首先使用晶圆级加工方法，在传感组件表面采用旋涂光刻方式预先生成一层透明的塑封保护层，之后再通过晶圆减薄、划片、贴片、焊线等一系列工艺处理，然后使用不透明的塑封胶进行露模注塑(Exposed Die Molding)封装，确保生成的透明的塑封保护层裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图5所示。
实施例5 LED外置封装
首先使用晶圆级加工方法，在传感组件表面采用钢网印刷方式预先生成一层透明的塑封保护层，之后再通过晶圆减薄、划片、贴片、焊线等一系列工艺处理，然后使用不透明的塑封胶进行露模注塑(Exposed Die Molding)封装，确保生成的透明的塑封保护层裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图5所示。
实施例6 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线，之后使用异形注塑模具，在且仅在光学传感器上方及周围使用透明塑封胶进行第一次塑封；然后再使用配套的注塑模具和不透明塑封胶在其他部位做第二次塑封，将其他部位塑封保护起来，确保第一次塑封的塑封胶裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。第一次塑封可以在焊线后进行，也可以在焊线前进行。制备的封装结构如图8所示。
实施例7 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线，之后使用异形注塑模具，在除去光学传感器上方之外的所有空间以不透明塑封胶进行第一次塑封，之后再使用配套的注塑模具和透明塑封胶对光学传感器上方进行第二次塑封或者 直接不塑封保持光学传感器上方裸露，以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图6所示。
实施例8 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线，之后再将一片透明的薄玻璃使用透明胶水或者透明薄膜以贴片的形式粘贴在光学传感器上方，玻璃需要完全覆盖住光学传感器。最后再使用露模注塑工艺以不透明塑封胶在其他部位进行塑封。同时，控制传感组件上方封装胶体或者玻璃等结构的厚度，以保证电容传感器实现功能。粘贴透明玻璃可以在焊线后进行，也可以在焊线前进行。制备的封装结构如图1所示。
实施例9 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线，之后再将一片透明的薄玻璃使用透明胶水以贴片的形式粘贴在传感组件上方。最后再使用露模注塑工艺以不透明塑封胶在其他部位进行塑封。同时，控制传感组件上方封装胶体或者玻璃等结构的厚度，以保证电容传感器实现功能。粘贴透明玻璃可以在焊线后进行，也可以在焊线前进行。制备的封装结构如图5所示。
实施例8和实施例9的塑封方式还可以是使用不透明塑封胶对整体进行塑封，最后，采用但不限于塑封体表面打磨的方式将薄玻璃露出。将传感组件上方的薄玻璃做薄，以保证光学传感器实现功能。
实施例10 LED外置封装
首先使用晶圆级加工方法，在封装结构中除去传感组件表面或者传感组件表面除光学传感器之外的部分，采用钢网印刷或旋涂光刻的方式预先生成一层不透明的塑封保护层，之后再通过晶圆减薄、划片、贴片、焊线、露模注塑等一系列封装工序，使用透明的塑封胶将其他部位塑封起来。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图1或者图5所示。
实施例2～5、10的塑封方式还可以是使用不透明塑封胶对整体进行塑封，最后，采用但不限于塑封体表面打磨的方式，将传感组件或者光学传感器上方的透明区域露出。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。
实施例11 LED外置封装
首先进行晶圆减薄、划片、贴片、焊线，之后采用点胶的方式，使用透明塑封胶在且仅在光学传感器上方及周围进行点胶，之后再使用不透明的塑封胶对整体进行塑封。最后，采用但不限于塑封体表面打磨的方式，将光学传感器上方的透明点胶区域露出来。将传感组件上方的封装胶体做薄，以保证电容传感器实现功能。制备的封装结构如图7所示。
实施例12 LED外置封装
首先按照传统封装的流程进行晶圆减薄、划片、贴片、焊线，之后使用异形注塑模具，在除去金属焊盘位置的传感组件表面上使用透明塑封胶进行第一次塑封；然后再使用配套的注塑模具和不透明塑封胶在其他部位做第二次塑封，将其他部位塑封保护起来，同时确保第一次塑封的塑封胶裸露在外以保证光学传感器实现功能。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。第一次塑封可以在焊线后进行，也可以在焊线前进行。制备的封装结构如图9所示。
实施例13 LED内置封装
首先将封装好的LED利用表面贴装技术设置到基板上，然后结合实施例1至12的封装方案进行后续封装。同时，控制传感组件上方封装胶体的厚度，以保证电容传感器实现功能。制备的封装结构如图4所示。
实施例14 LED内置封装
首先将LED裸芯片贴合到基板上并焊线，之后采用点胶的方式，使用透明塑封胶在且仅在LED裸芯片上方及周围进行点胶，然后结合实施例1至12的封装方案进行后续封装，最后进行封装体表面打磨工序，将LED和光学传感器上方的透明区域露出，以保证LED和光学传感器实现功能。将传感组件上方的封装胶体做薄，以保证电容传感器实现功能。制备的封装结构如图10所示。
在本发明的描述中，需要理解的是，术语“上”、“下”、“竖直”、“水平”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接， 或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (17)

  1. 一种封装结构，其特征在于，包括：
    基板；
    传感组件，所述传感组件设置在所述基板的上表面，并且与所述基板电连接；以及
    封装胶体，所述封装胶体设置在所述基板的上表面，并且包覆所述传感组件的至少一部分，
    其中，
    所述传感组件包括电容传感器和光学传感器，
    所述封装胶体包括至少一部分与所述光学传感器对应设置的透光区。
  2. 根据权利要求1所述的封装结构，其特征在于，所述透光区是由透明材料形成的。
  3. 根据权利要求1所述的封装结构，其特征在于，所述封装胶体是由透明材料形成的。
  4. 根据权利要求1所述的封装结构，其特征在于，所述传感组件与所述基板通过金属线电连接。
  5. 根据权利要求1所述的封装结构，其特征在于，进一步包括：LED组件，所述LED组件设置在所述基板的上表面。
  6. 一种电子设备，其特征在于，包括权利要求1～5任一项所述的封装结构。
  7. 一种制备权利要求1～5任一项所述的封装组件的方法，其特征在于，包括：
    (1)在基板的上表面设置传感组件，使所述传感组件与所述基板电连接，所述传感组件包括电容传感器以及光学传感器；以及
    (2)在所述基板的上表面设置封装胶体，使所述封装胶体包覆所述传感组件的至少一部分，且所述封装胶体包括透光区，所述透光区的至少一部分与所述光学传感器对应设置。
  8. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述封装胶体一体化形成在所述基板的上表面，且所述封装胶体是由透明材料形成的。
  9. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光 区是通过钢网印刷设置的。
  10. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光区是通过旋涂设置的。
  11. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光区是通过光刻设置的。
  12. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光区是通过异型模具成型设置的。
  13. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光区是通过点胶设置的。
  14. 根据权利要求7所述的方法，其特征在于，步骤(2)中，所述透光区是通过贴片设置的。
  15. 根据权利要求8至14任一项所述的方法，其特征在于，在步骤(2)中，设置所述透光区之后，
    通过露模注塑工艺在所述基板的上表面除透光区以外的位置设置不透明的封装胶体。
  16. 根据权利要求8至14任一项所述的方法，其特征在于，在步骤(2)中，设置所述透光区之后，
    通过塑封工艺在所述基板的上表面设置不透明的封装胶体，使其包覆所述传感组件；
    对所述不透明的封装胶体表面进行打磨使所述透光区露出。
  17. 根据权利要求7所述的方法，其特征在于，在步骤(1)中，设置所述传感组件之前，进一步包括：
    (1-1)在所述基板的上表面设置LED组件。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112420913A (zh) * 2020-10-10 2021-02-26 杭州敏和光电子技术有限公司 应用于红外传感器的封装结构及红外传感器封装方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109460694A (zh) * 2017-09-06 2019-03-12 蓝思科技（长沙）有限公司 指纹传感器、智能终端及指纹传感器封装方法
KR102069660B1 (ko) * 2018-04-05 2020-01-23 해성디에스 주식회사 근접 센서
KR102079659B1 (ko) * 2018-04-05 2020-02-20 해성디에스 주식회사 광 센서 소자 및 이를 포함하는 광 센서 패키지
TWI681564B (zh) * 2019-01-10 2020-01-01 茂達電子股份有限公司 行動通訊裝置及其光學封裝結構
CN111973167A (zh) * 2020-08-19 2020-11-24 青岛歌尔智能传感器有限公司 可穿戴设备、光学装置、光学模组及其封装方法
CN113511628A (zh) * 2021-08-10 2021-10-19 华天科技（西安）有限公司 一种基于研磨工艺mems产品的制作方法
CN116613622B (zh) * 2023-07-19 2024-04-05 青岛泰睿思微电子有限公司 双凹槽光传感器封装结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101587400A (zh) * 2008-05-22 2009-11-25 三星电子株式会社 触摸传感器及含触摸传感器的液晶显示面板
CN203858644U (zh) * 2014-03-26 2014-10-01 映智科技股份有限公司 具有防伪功能的指纹感测装置
CN203982403U (zh) * 2014-07-03 2014-12-03 力传扬股份有限公司 活体指纹检测的感测器
TW201607013A (zh) * 2014-08-06 2016-02-16 原相科技（檳城）有限公司 影像模組封裝及其製作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3005733A1 (de) * 1980-02-15 1981-08-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung einer halbleiteranordnung und nach diesem verfahren hergestellte halbleiteranordnung
JP4845333B2 (ja) * 2003-04-11 2011-12-28 株式会社リコー 光電変換素子パッケージ、その作製方法及び光コネクタ
JP4486005B2 (ja) 2005-08-03 2010-06-23 パナソニック株式会社 半導体撮像装置およびその製造方法
KR101307212B1 (ko) * 2009-04-30 2013-09-11 가부시키가이샤 무라타 세이사쿠쇼 생체 센서 장치
CN102403323B (zh) * 2010-09-16 2014-01-29 胜开科技股份有限公司 晶圆级影像感测器构装结构及其制造方法
EP2710582A4 (en) * 2011-05-17 2014-12-31 Cross Match Technologies Inc DIGITAL FOOTPRINT SENSORS
TW201320266A (zh) * 2011-11-11 2013-05-16 Xintec Inc 半導體封裝件及其製法
PL2931121T3 (pl) * 2012-12-14 2017-08-31 Koninklijke Philips N.V. Urządzenie do pomiaru parametru fizjologicznego użytkownika
WO2016007444A1 (en) * 2014-07-07 2016-01-14 Goodix Technology Inc. Integration of touch screen and fingerprint sensor assembly
CN105046239B (zh) * 2015-08-19 2018-09-28 南昌欧菲生物识别技术有限公司 指纹识别装置及其终端设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101587400A (zh) * 2008-05-22 2009-11-25 三星电子株式会社 触摸传感器及含触摸传感器的液晶显示面板
CN203858644U (zh) * 2014-03-26 2014-10-01 映智科技股份有限公司 具有防伪功能的指纹感测装置
CN203982403U (zh) * 2014-07-03 2014-12-03 力传扬股份有限公司 活体指纹检测的感测器
TW201607013A (zh) * 2014-08-06 2016-02-16 原相科技（檳城）有限公司 影像模組封裝及其製作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112420913A (zh) * 2020-10-10 2021-02-26 杭州敏和光电子技术有限公司 应用于红外传感器的封装结构及红外传感器封装方法

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