WO2017142138A1 - Procédé de perforation de feuille de silicone par refroidissement à l'azote - Google Patents

Procédé de perforation de feuille de silicone par refroidissement à l'azote Download PDF

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Publication number
WO2017142138A1
WO2017142138A1 PCT/KR2016/007016 KR2016007016W WO2017142138A1 WO 2017142138 A1 WO2017142138 A1 WO 2017142138A1 KR 2016007016 W KR2016007016 W KR 2016007016W WO 2017142138 A1 WO2017142138 A1 WO 2017142138A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon sheet
cooling
cooling device
sheet
perforation
Prior art date
Application number
PCT/KR2016/007016
Other languages
English (en)
Korean (ko)
Inventor
신정욱
김정구
신지원
이준재
Original Assignee
(주) 영케미칼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 영케미칼 filed Critical (주) 영케미칼
Publication of WO2017142138A1 publication Critical patent/WO2017142138A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/24—Perforating by needles or pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet

Definitions

  • the present invention relates to a perforation method of a silicon sheet, and more particularly, to a perforation method for preventing the silicon sheet from being deformed during perforation by introducing a sheet cooling step before perforating the silicon sheet.
  • Silicone is a high molecular material having a siloxane bond (Si-O-Si) composed of silicon and oxygen. It is a non-oxidizing compound with a stable chemical structure that cannot be compared with any other type of elastomer material.
  • Nontoxic in that it is also an inert material ii) heat resistance due to high Si-O bond energy compared to C-C bond energy of general synthetic rubber; iii) cold resistance which can maintain elasticity even at low temperature compared with general synthetic rubber; iv) weather resistance with little change in physical properties even after long-term outdoor due to no double bonds that react with oxygen, ozone and ultraviolet rays to cause cracking; v) permanent strain that maintains elasticity and resilience over a wide temperature range; vi) chemical resistance against polar organic compounds such as inorganic alcohols such as acids, bases, salts, and animal and vegetable oils; vii) hot water resistance, which hardly changes in physical properties even after prolonged precipitation or contact with steam; viii) Its low carbon ratio makes it widely used as an insulating material, and ix) it has various characteristics including gas permeability, which is 30 ⁇ 40 times higher than general synthetic rubber.Since in modern civilization, silicon is used in office equipment, home appliance industry and automobile industry.
  • silicon has a problem that the cross section is not made clean as it is pushed during processing, and in order to overcome this problem, the method of using the elongation or fixing with a clamp is limited.
  • the present invention seeks to provide a method for preventing the silicon sheet from being deformed during punching by introducing a sheet cooling step before perforation of the silicon sheet.
  • the step a) may be performed by a cooling air jet cooling device, a refrigerant impregnating cooling device, or a refrigerant dispersion cooling device, but is not limited thereto.
  • the cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
  • the step b) may be performed as a punching member for drilling holes in the silicon sheet.
  • the perforation member may include a perforator composed of a water nozzle injector, an air jet nozzle injector, a laser beam irradiator, or a plurality of needle combinations, but is not limited thereto.
  • the silicon sheet may be used in medical, industrial, home or office equipment, but is not limited thereto.
  • the silicon sheet punching method of the present invention the silicon sheet is deformed while being deformed when punching the existing silicon sheet using a perforator, and the silicon sheet can be processed without deformation of the perforated surface. Do.
  • a silicon sheet perforation device comprising a.
  • the conveying unit may include a belt conveyor, a pneumatic conveyor or a transport vehicle, but is not limited thereto.
  • the cooling unit may include a cooling air injection type cooling device, a refrigerant impregnating type cooling device, or a refrigerant dispersion type cooling device, but is not limited thereto.
  • the cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
  • the silicon sheet punching device of the present invention the silicon sheet is deformed while being deformed when the punching is performed by using a puncher on the existing silicon sheet, and the processing is possible without deformation of the perforated surface during the silicon sheet drilling Do.
  • Example 1 shows (A) a silicon sheet cooled before perforation and (B) a silicon sheet perforated without cooling according to Example 1 of the present invention.
  • Cica-Care a medical silicone gel sheet used as a wound coating material, is cooled by using a liquid nitrogen spray and then perforated, and is shown in FIG. It was.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Abstract

La présente invention concerne un procédé de perforation de feuille de silicone et, plus particulièrement, un procédé de perforation, qui met en œuvre une étape de refroidissement d'une feuille de silicone avant la perforation de la feuille, de manière à éviter que la feuille ne soit déformée tout en étant déplacée pendant sa perforation.
PCT/KR2016/007016 2016-02-16 2016-06-30 Procédé de perforation de feuille de silicone par refroidissement à l'azote WO2017142138A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160017685A KR20170096375A (ko) 2016-02-16 2016-02-16 질소 냉각을 이용한 실리콘 시트의 타공 방법
KR10-2016-0017685 2016-02-16

Publications (1)

Publication Number Publication Date
WO2017142138A1 true WO2017142138A1 (fr) 2017-08-24

Family

ID=59626127

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/007016 WO2017142138A1 (fr) 2016-02-16 2016-06-30 Procédé de perforation de feuille de silicone par refroidissement à l'azote

Country Status (2)

Country Link
KR (1) KR20170096375A (fr)
WO (1) WO2017142138A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06238642A (ja) * 1993-02-19 1994-08-30 Fujitsu General Ltd グリーンシートの加工方法
JP2001079677A (ja) * 1999-09-13 2001-03-27 Akoo Kiko:Kk 合成樹脂弾性体シートの穿孔方法及び微小孔を穿設した合成樹脂弾性体シート
KR100809561B1 (ko) * 2005-10-19 2008-03-18 디케이유테크 주식회사 키패드의 제조방법
JP2008238368A (ja) * 2007-03-28 2008-10-09 Nippon Steel Chem Co Ltd シリコーン樹脂シートの打ち抜き加工方法
WO2013190643A1 (fr) * 2012-06-19 2013-12-27 株式会社アクト Dispositif de poinçonnage et procédé pour fabriquer des éléments de feuille poinçonnés à l'aide de ce dispositif

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06238642A (ja) * 1993-02-19 1994-08-30 Fujitsu General Ltd グリーンシートの加工方法
JP2001079677A (ja) * 1999-09-13 2001-03-27 Akoo Kiko:Kk 合成樹脂弾性体シートの穿孔方法及び微小孔を穿設した合成樹脂弾性体シート
KR100809561B1 (ko) * 2005-10-19 2008-03-18 디케이유테크 주식회사 키패드의 제조방법
JP2008238368A (ja) * 2007-03-28 2008-10-09 Nippon Steel Chem Co Ltd シリコーン樹脂シートの打ち抜き加工方法
WO2013190643A1 (fr) * 2012-06-19 2013-12-27 株式会社アクト Dispositif de poinçonnage et procédé pour fabriquer des éléments de feuille poinçonnés à l'aide de ce dispositif

Also Published As

Publication number Publication date
KR20170096375A (ko) 2017-08-24

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