WO2017142138A1 - Silicone sheet punching method using nitrogen cooling - Google Patents

Silicone sheet punching method using nitrogen cooling Download PDF

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Publication number
WO2017142138A1
WO2017142138A1 PCT/KR2016/007016 KR2016007016W WO2017142138A1 WO 2017142138 A1 WO2017142138 A1 WO 2017142138A1 KR 2016007016 W KR2016007016 W KR 2016007016W WO 2017142138 A1 WO2017142138 A1 WO 2017142138A1
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silicon sheet
cooling
cooling device
sheet
perforation
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PCT/KR2016/007016
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French (fr)
Korean (ko)
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신정욱
김정구
신지원
이준재
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(주) 영케미칼
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Publication of WO2017142138A1 publication Critical patent/WO2017142138A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/24—Perforating by needles or pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet

Definitions

  • the present invention relates to a perforation method of a silicon sheet, and more particularly, to a perforation method for preventing the silicon sheet from being deformed during perforation by introducing a sheet cooling step before perforating the silicon sheet.
  • Silicone is a high molecular material having a siloxane bond (Si-O-Si) composed of silicon and oxygen. It is a non-oxidizing compound with a stable chemical structure that cannot be compared with any other type of elastomer material.
  • Nontoxic in that it is also an inert material ii) heat resistance due to high Si-O bond energy compared to C-C bond energy of general synthetic rubber; iii) cold resistance which can maintain elasticity even at low temperature compared with general synthetic rubber; iv) weather resistance with little change in physical properties even after long-term outdoor due to no double bonds that react with oxygen, ozone and ultraviolet rays to cause cracking; v) permanent strain that maintains elasticity and resilience over a wide temperature range; vi) chemical resistance against polar organic compounds such as inorganic alcohols such as acids, bases, salts, and animal and vegetable oils; vii) hot water resistance, which hardly changes in physical properties even after prolonged precipitation or contact with steam; viii) Its low carbon ratio makes it widely used as an insulating material, and ix) it has various characteristics including gas permeability, which is 30 ⁇ 40 times higher than general synthetic rubber.Since in modern civilization, silicon is used in office equipment, home appliance industry and automobile industry.
  • silicon has a problem that the cross section is not made clean as it is pushed during processing, and in order to overcome this problem, the method of using the elongation or fixing with a clamp is limited.
  • the present invention seeks to provide a method for preventing the silicon sheet from being deformed during punching by introducing a sheet cooling step before perforation of the silicon sheet.
  • the step a) may be performed by a cooling air jet cooling device, a refrigerant impregnating cooling device, or a refrigerant dispersion cooling device, but is not limited thereto.
  • the cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
  • the step b) may be performed as a punching member for drilling holes in the silicon sheet.
  • the perforation member may include a perforator composed of a water nozzle injector, an air jet nozzle injector, a laser beam irradiator, or a plurality of needle combinations, but is not limited thereto.
  • the silicon sheet may be used in medical, industrial, home or office equipment, but is not limited thereto.
  • the silicon sheet punching method of the present invention the silicon sheet is deformed while being deformed when punching the existing silicon sheet using a perforator, and the silicon sheet can be processed without deformation of the perforated surface. Do.
  • a silicon sheet perforation device comprising a.
  • the conveying unit may include a belt conveyor, a pneumatic conveyor or a transport vehicle, but is not limited thereto.
  • the cooling unit may include a cooling air injection type cooling device, a refrigerant impregnating type cooling device, or a refrigerant dispersion type cooling device, but is not limited thereto.
  • the cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
  • the silicon sheet punching device of the present invention the silicon sheet is deformed while being deformed when the punching is performed by using a puncher on the existing silicon sheet, and the processing is possible without deformation of the perforated surface during the silicon sheet drilling Do.
  • Example 1 shows (A) a silicon sheet cooled before perforation and (B) a silicon sheet perforated without cooling according to Example 1 of the present invention.
  • Cica-Care a medical silicone gel sheet used as a wound coating material, is cooled by using a liquid nitrogen spray and then perforated, and is shown in FIG. It was.

Abstract

The present invention relates to a silicone sheet punching method and, more particularly, to a punching method, which employs a step of cooling a silicone sheet before punching the sheet, so as to prevent the sheet from being deformed while being displaced during the punching thereof.

Description

질소 냉각을 이용한 실리콘 시트의 타공 방법Punching Method of Silicon Sheet Using Nitrogen Cooling
본 발명은 실리콘 시트의 타공 방법, 보다 구체적으로 실리콘 시트의 타공 전 시트 냉각 단계를 도입함으로써, 타공시 실리콘 시트가 밀리면서 변형되는 것을 방지하기 위한 타공 방법에 관한 것이다.The present invention relates to a perforation method of a silicon sheet, and more particularly, to a perforation method for preventing the silicon sheet from being deformed during perforation by introducing a sheet cooling step before perforating the silicon sheet.
실리콘(silicone)은 규소와 산소로 이루어진 실록산 결합(Si-O-Si)을 갖는 고분자물질로 다른 어떠한 형태의 탄성체 소재와도 비교 할 수 없는 안정된 화학구조를 갖는 산화되지 않는 화합물로서 i) 생리적으로도 불활성 물질이라는 점에서의 무독성; ii) 일반합성고무의 C-C 결합에너지에 비해 높은 Si-O 결합에너지로 인한 내열성; iii) 일반 합성고무에 비해 저온에서도 탄성을 유지할 수 있는 내한성; iv) 산소, 오존, 자외선등과 반응하여 균열을 일으키는 이중결합이 없어 장기간 옥외에 방치하여도 물성 변화가 거의 없는 내후성; v) 넓은 온도범위에서 탄성 및 복원력이 유지되는 영구 줄음률; vi) 일반의 산, 염기, 염류 등의 무기약품 알코올, 동식물성 기름와 같은 극성 유기화합물에 강한 내약품성; vii) 장시간 물에 침전되거나 스팀에 접촉하여도 거의 물성변화가 일어나지 않는 내열수성; viii) 탄소비율이 낮아서 절연재료로 광범위하게 사용 가능한 절연성 및 ix) 일반합성고무의 30~40배 정도로 높은 기체 투과성 을 비롯해 여러 가지 특성을 갖추고 있어 현대문명에서 실리콘은 사무기기, 가전산업, 자동차 산업, 의료를 비롯한 다양한 방면에 적용이 가능하다. 그러나 실리콘은 그 탄성과 유연성으로 인해 가공시 밀려들어가면서 단면이 깨끗하게 만들어지지 않는 문제를 갖고 있으며, 이의 극복을 위해 최대한 신장시키거나 고정쇠로 고정하는 방법을 이용하고 있으나 이에도 한계가 있다.Silicone is a high molecular material having a siloxane bond (Si-O-Si) composed of silicon and oxygen. It is a non-oxidizing compound with a stable chemical structure that cannot be compared with any other type of elastomer material. Nontoxic in that it is also an inert material; ii) heat resistance due to high Si-O bond energy compared to C-C bond energy of general synthetic rubber; iii) cold resistance which can maintain elasticity even at low temperature compared with general synthetic rubber; iv) weather resistance with little change in physical properties even after long-term outdoor due to no double bonds that react with oxygen, ozone and ultraviolet rays to cause cracking; v) permanent strain that maintains elasticity and resilience over a wide temperature range; vi) chemical resistance against polar organic compounds such as inorganic alcohols such as acids, bases, salts, and animal and vegetable oils; vii) hot water resistance, which hardly changes in physical properties even after prolonged precipitation or contact with steam; viii) Its low carbon ratio makes it widely used as an insulating material, and ix) it has various characteristics including gas permeability, which is 30 ~ 40 times higher than general synthetic rubber.Since in modern civilization, silicon is used in office equipment, home appliance industry and automobile industry. It can be applied to various fields including medical care and medical care. However, due to its elasticity and flexibility, silicon has a problem that the cross section is not made clean as it is pushed during processing, and in order to overcome this problem, the method of using the elongation or fixing with a clamp is limited.
선행특허문헌Prior Patent Documents
1. 대한민국등록특허 제10-0764132호1. Republic of Korea Patent No. 10-0764132
2. 대한민국등록특허 제10-2006-0052543호2. Korea Patent Registration No. 10-2006-0052543
본 발명은 실리콘 시트의 타공 전 시트 냉각 단계를 도입함으로써, 타공시 실리콘 시트가 밀리면서 변형되는 것을 방지하기 위한 방법을 제공하고자 한다. The present invention seeks to provide a method for preventing the silicon sheet from being deformed during punching by introducing a sheet cooling step before perforation of the silicon sheet.
일 구현예에 따르면, According to one embodiment,
a) 실리콘 시트를 냉각시키는 단계; 및a) cooling the silicon sheet; And
b) 실리콘 시트를 타공하는 단계를 포함하는 실리콘 시트의 타공 방법이 개시된다.Disclosed is a method of perforating a silicon sheet, comprising the step of perforating the silicon sheet.
본 발명에 따른 실리콘 시트의 타공 방법에 있어서, 상기 단계 a)는 냉각 공기분사식 냉각장치, 냉매 함침식 냉각장치 또는 냉매 분산식 냉각장치로 수행될 수 있으나, 이에 한정되는 것은 아니다. 상기 냉각장치는 냉매로서 액체 질소, 액체 헬륨, HCFC 또는 드라이아이스를 사용할 수 있으나, 이에 한정되는 것은 아니다. In the perforating method of the silicon sheet according to the present invention, the step a) may be performed by a cooling air jet cooling device, a refrigerant impregnating cooling device, or a refrigerant dispersion cooling device, but is not limited thereto. The cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
본 발명에 따른 실리콘 시트의 타공 방법에 있어서, 상기 단계 b)는 실리콘 시트에 구멍을 천공하기 위한 타공부재로 수행될 수 있다. 상기 타공부재는 워터노즐 분사체, 에어제트 노즐 분사체, 레이저 빔 조사체 또는 다수개의 바늘 조합체로 구성된 타공기를 포함할 수 있으나, 이에 한정되는 것은 아니다. In the punching method of the silicon sheet according to the present invention, the step b) may be performed as a punching member for drilling holes in the silicon sheet. The perforation member may include a perforator composed of a water nozzle injector, an air jet nozzle injector, a laser beam irradiator, or a plurality of needle combinations, but is not limited thereto.
본 발명에 따른 실리콘 시트의 타공 방법에 있어서, 상기 실리콘 시트는 의료용, 산업용, 가정용 또는 사무용 장비에 사용되는 것일 수 있으나, 이에 한정되는 것은 아니다.In the punching method of the silicon sheet according to the present invention, the silicon sheet may be used in medical, industrial, home or office equipment, but is not limited thereto.
본 발명의 실리콘 시트 타공 방법에 따르면, 기존의 실리콘 시트에 타공기를 이용하여 타공을 하고자 할 때 실리콘 시트가 밀리면서 변형되는 것을 개선시킨 것으로, 실리콘 시트 타공시에 타공면의 변형 없이 가공이 가능하다.According to the silicon sheet punching method of the present invention, the silicon sheet is deformed while being deformed when punching the existing silicon sheet using a perforator, and the silicon sheet can be processed without deformation of the perforated surface. Do.
다른 구현예에 따르면, According to another embodiment,
a) 실리콘 시트 이송부;a) silicon sheet conveying portion;
b) 실리콘 시트 냉각부; 및b) silicon sheet cooling; And
c) 실리콘 시트 타공부c) perforated silicone sheet
를 포함하는 실리콘 시트 타공 장치가 개시된다. Disclosed is a silicon sheet perforation device comprising a.
본 발명에 따른 실리콘 시트 타공 장치에 있어서, 상기 이송부는 벨트 컨베이어, 뉴매틱 컨베이어(pneumatic conveyer) 또는 운반차를 포함할 수 있으나, 이에 한정되는 것은 아니다. In the silicon sheet drilling apparatus according to the present invention, the conveying unit may include a belt conveyor, a pneumatic conveyor or a transport vehicle, but is not limited thereto.
본 발명에 따른 실리콘 시트 타공 장치에 있어서, 상기 냉각부는 냉각 공기분사식 냉각장치, 냉매 함침식 냉각장치 또는 냉매 분산식 냉각장치를 포함할 수 있으나, 이에 한정되는 것은 아니다. 상기 냉각장치는 냉매로서 액체 질소, 액체 헬륨, HCFC 또는 드라이아이스를 사용할 수 있으나, 이에 한정되는 것은 아니다. In the silicon sheet drilling apparatus according to the present invention, the cooling unit may include a cooling air injection type cooling device, a refrigerant impregnating type cooling device, or a refrigerant dispersion type cooling device, but is not limited thereto. The cooling device may use liquid nitrogen, liquid helium, HCFC or dry ice as a refrigerant, but is not limited thereto.
본 발명의 실리콘 시트 타공 장치에 따르면, 기존의 실리콘 시트에 타공기를 이용하여 타공을 하고자 할 때 실리콘 시트가 밀리면서 변형되는 것을 개선시킨 것으로, 실리콘 시트 타공시에 타공면의 변형 없이 가공이 가능하다.According to the silicon sheet punching device of the present invention, the silicon sheet is deformed while being deformed when the punching is performed by using a puncher on the existing silicon sheet, and the processing is possible without deformation of the perforated surface during the silicon sheet drilling Do.
도 1은 본 발명의 실시예 1에 따른 (A) 타공 전 냉각 처리된 실리콘 시트 및 (B) 냉각 처리 없이 타공된 실리콘 시트를 나타낸다. 1 shows (A) a silicon sheet cooled before perforation and (B) a silicon sheet perforated without cooling according to Example 1 of the present invention.
이하, 발명의 이해를 돕기 위해 다양한 실시예를 제시한다. 하기 실시예는 발명을 보다 쉽게 이해하기 위하여 제공되는 것일 뿐 발명의 보호범위가 하기 실시예에 한정되는 것은 아니다.Hereinafter, various examples are presented to help understand the invention. The following examples are merely provided to more easily understand the invention, but the protection scope of the invention is not limited to the following examples.
실시예 1. 냉각된 실리콘 시트의 타공Example 1 Perforation of Cooled Silicon Sheet
창상 피복재로 이용되는 의료용 실리콘 젤 시트인 시카-케어(Cica-Care)를 액체 질소 스프레이를 이용하여 냉각시킨 후 타공을 수행하고, 냉각 단계를 거치지 않고 타공된 실리콘 젤 시트와 비교하여 도 1에 나타내었다. Cica-Care, a medical silicone gel sheet used as a wound coating material, is cooled by using a liquid nitrogen spray and then perforated, and is shown in FIG. It was.
도 1에 나타낸 바와 같이, 본 발명에 따라 타공 전 냉각 단계를 거친 (A)는 타공 면이 깔끔하게 원형으로 형성되었으나, 냉각 단계를 거치지 않는 (B)는 타공 면 아랫부분과 같이 실리콘 시트가 밀려나는 것이 관찰되었다.As shown in Figure 1, according to the present invention (A) is subjected to the cooling step before the perforation, the perforated surface is neatly formed in a circular shape, (B) does not go through the cooling step, the silicon sheet is pushed out like the lower part of the perforated surface Was observed.
이제까지 본 발명에 대하여 그 바람직한 실시예들을 중심으로 살펴보았다. 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 본 발명이 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 변형된 형태로 구현될 수 있음을 이해할 수 있을 것이다. 그러므로 개시된 실시예들은 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 한다. 본 발명의 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.So far I looked at the center of the preferred embodiment for the present invention. Those skilled in the art will appreciate that the present invention can be implemented in a modified form without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

Claims (10)

  1. a) 실리콘 시트를 냉각시키는 단계; 및a) cooling the silicon sheet; And
    b) 실리콘 시트를 타공하는 단계를 포함하는 실리콘 시트의 타공 방법.b) perforating the silicon sheet comprising the step of perforating the silicon sheet.
  2. 제1항에 있어서,The method of claim 1,
    상기 단계 a)는 냉각 공기분사식 냉각장치, 냉매 함침식 냉각장치 또는 냉매 분산식 냉각장치로 수행되는 것인, 실리콘 시트의 타공 방법.Wherein step a) is performed by a cooling air jet cooling device, a coolant impregnated cooling device or a coolant dispersion type cooling device.
  3. 제1항에 있어서,The method of claim 1,
    상기 단계 a)는 액체 질소, 액체 헬륨, HCFC 또는 드라이아이스를 이용하는 것인, 실리콘 시트의 타공 방법. Wherein step a) is using a liquid nitrogen, liquid helium, HCFC or dry ice, a method for drilling a silicon sheet.
  4. 제1항에 있어서, The method of claim 1,
    상기 단계 b)는 워터노즐 분사체, 에어제트 노즐 분사체, 레이저 빔 조사체 또는 다수개의 바늘 조합체로 구성된 타공기로 수행되는 것인, 실리콘 시트의 타공 방법. Wherein step b) is performed by a perforator consisting of a water nozzle injector, an air jet nozzle injector, a laser beam irradiator or a plurality of needle combinations, the perforation method of the silicon sheet.
  5. 제1항에 있어서,The method of claim 1,
    상기 실리콘 시트는 의료용, 산업용, 가정용, 사무용 장비에 사용되는 것인, 실리콘 시트의 타공 방법.The silicon sheet is used for medical, industrial, home, office equipment, the method of perforating the silicon sheet.
  6. a) 실리콘 시트 이송부;a) silicon sheet conveying portion;
    b) 실리콘 시트 냉각부; 및b) silicon sheet cooling; And
    c) 실리콘 시트 타공부c) perforated silicone sheet
    를 포함하는 실리콘 시트 타공 장치.Silicon sheet perforation device comprising a.
  7. 제6항에 있어서, The method of claim 6,
    상기 이송부는 벨트 컨베이어, 뉴매틱 컨베이어(pneumatic conveyer) 또는 운반차를 포함하는 것인, 실리콘 시트 타공 장치. And said conveying portion comprises a belt conveyor, a pneumatic conveyer or a transport vehicle.
  8. 제6항에 있어서, The method of claim 6,
    상기 냉각부는 냉각 공기분사식 냉각장치, 냉매 함침식 냉각장치 또는 냉매 분산식 냉각장치를 포함하는 것인, 실리콘 시트 타공 장치. Wherein the cooling unit comprises a cooling air jet cooling device, a refrigerant impregnated cooling device or a refrigerant dispersion type cooling device, silicon sheet perforation device.
  9. 제6항에 있어서, The method of claim 6,
    상기 냉각장치는 냉매로서 액체 질소, 액체 헬륨, HCFC 또는 드라이아이스를 이용하는 것인, 실리콘 시트 타공 장치.And the cooling device uses liquid nitrogen, liquid helium, HCFC, or dry ice as the refrigerant.
  10. 제6항에 있어서,The method of claim 6,
    상기 실리콘 시트는 의료용, 산업용, 가정용, 사무용 장비에 사용되는 것인, 실리콘 시트 타공 장치. The silicon sheet perforation device, which is used in medical, industrial, home, office equipment.
PCT/KR2016/007016 2016-02-16 2016-06-30 Silicone sheet punching method using nitrogen cooling WO2017142138A1 (en)

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KR10-2016-0017685 2016-02-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06238642A (en) * 1993-02-19 1994-08-30 Fujitsu General Ltd Processing method for green sheet
JP2001079677A (en) * 1999-09-13 2001-03-27 Akoo Kiko:Kk Synthetic resin elastic sheet punching method, and synthetic resin elastic sheet with small holes punched therein
KR100809561B1 (en) * 2005-10-19 2008-03-18 디케이유테크 주식회사 Key pad production method
JP2008238368A (en) * 2007-03-28 2008-10-09 Nippon Steel Chem Co Ltd Method for punching silicone resin sheet
WO2013190643A1 (en) * 2012-06-19 2013-12-27 株式会社アクト Punching device and method for manufacturing punched sheet members using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06238642A (en) * 1993-02-19 1994-08-30 Fujitsu General Ltd Processing method for green sheet
JP2001079677A (en) * 1999-09-13 2001-03-27 Akoo Kiko:Kk Synthetic resin elastic sheet punching method, and synthetic resin elastic sheet with small holes punched therein
KR100809561B1 (en) * 2005-10-19 2008-03-18 디케이유테크 주식회사 Key pad production method
JP2008238368A (en) * 2007-03-28 2008-10-09 Nippon Steel Chem Co Ltd Method for punching silicone resin sheet
WO2013190643A1 (en) * 2012-06-19 2013-12-27 株式会社アクト Punching device and method for manufacturing punched sheet members using same

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