WO2017121321A1 - 用于发热设备的辐射式空调系统 - Google Patents

用于发热设备的辐射式空调系统 Download PDF

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Publication number
WO2017121321A1
WO2017121321A1 PCT/CN2017/070820 CN2017070820W WO2017121321A1 WO 2017121321 A1 WO2017121321 A1 WO 2017121321A1 CN 2017070820 W CN2017070820 W CN 2017070820W WO 2017121321 A1 WO2017121321 A1 WO 2017121321A1
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WIPO (PCT)
Prior art keywords
radiant
heat transfer
heat
radiant panel
conditioning system
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PCT/CN2017/070820
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English (en)
French (fr)
Inventor
严继光
Original Assignee
严继光
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Filing date
Publication date
Application filed by 严继光 filed Critical 严继光
Priority to EP17738135.7A priority Critical patent/EP3404337A4/en
Priority to JP2018536244A priority patent/JP2019503465A/ja
Priority to SG11201806006WA priority patent/SG11201806006WA/en
Priority to US16/069,128 priority patent/US20190024914A1/en
Priority to AU2017207663A priority patent/AU2017207663A1/en
Publication of WO2017121321A1 publication Critical patent/WO2017121321A1/zh
Priority to IL260506A priority patent/IL260506B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0089—Systems using radiation from walls or panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/22—Means for preventing condensation or evacuating condensate
    • F24F2013/221—Means for preventing condensation or evacuating condensate to avoid the formation of condensate, e.g. dew
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2513—Expansion valves

Definitions

  • the invention relates to a radiant air conditioning system for cooling a plate evaporator, which is mainly used for cooling of an electronic heating device. It can be used to cool down various heat-generating devices such as servers, base stations, etc., and is particularly suitable for cooling a plurality of densely-distributed heat-generating devices.
  • Chinese patent CN200810029359.6 discloses an air conditioner having a radiant heat exchange ceiling, comprising a heat pump system and a water circulation system, wherein the water circulation system comprises a water circulation including a pump, an air heat exchange device, a water heat exchange device and a plurality of radiant heat exchange ceilings.
  • the circuit exchanges heat with the outside air through the air heat exchange device, and exchanges heat with the heat pump system through the water heat exchange device;
  • the radiant heat exchange ceiling includes a metal ceiling, a heat exchange coil connected to the water circulation loop, and is covered above the heat exchange coil The layer of insulation material; the heat exchange coil is placed above the metal ceiling, close to the metal ceiling but not to the metal ceiling.
  • Chinese invention patent CN201010158876.0 discloses a base station-dedicated air conditioner having a separate radiant panel evaporator, which comprises an outdoor unit, a radiant panel evaporator installed in the machine room, and a condensate draining device, wherein the outdoor unit includes a compressor a condenser and an expansion valve, the radiant panel evaporator forms a recyclable closed circuit connection with the compressor, the condenser and the expansion valve through the connecting pipe; the radiant panel evaporator is composed of a plurality of plate evaporators, and the plate evaporator comprises a refrigerant pipe and a radiant plate The inner radiating fin plate and the heat insulating material, the refrigerant tube is connected with the inner radiating fin plate, the refrigerant tube and the inner radiating fin plate are disposed between the radiation plate and the heat insulating material, and the refrigerant tubes of the plurality of plate evaporators communicate with each other through the connecting pipe.
  • the heat generated by the base station device is directly transmitted to the radiant panel by radiation, and the radiant panel transfers heat to the inner radiating fin plate, and the inner radiating fin plate transfers heat to the liquid in the refrigerant tube.
  • the refrigerant is such that the refrigerant evaporates and absorbs heat and vaporizes back to the compressor to complete the refrigeration cycle.
  • the disadvantage of this technical solution is that the area of radiation heat transfer between the base station equipment and the radiation board is limited, resulting in poor radiation heat transfer between the two, and the base station equipment still emits a large amount of heat to the surrounding air, due to air convection. The heat effect is poor and the speed is slow.
  • the air conditioner needs more energy to make the temperature of the base station equipment meet the requirements.
  • the object of the present invention is to provide a radiant air conditioning system for a heat generating device capable of improving the heat transfer effect between the radiant panel and the heat generating device, and is particularly suitable for performing a plurality of densely distributed heat generating devices. Cooling treatment.
  • the present invention provides a radiant air conditioning system for a heat generating apparatus comprising a compressor, a condenser, an expansion valve and at least one plate evaporator which are connected via a connecting pipe to form a recyclable refrigerant circuit;
  • Each of the plate evaporators includes a refrigerant pipe and a heat transfer core plate covering the refrigerant pipe.
  • the radiant air conditioner further includes at least one metal heat transfer plate mounted on a frame between the two heat generating devices. The metal heat transfer plate radiates heat transfer with the heat generating device and transfers the absorbed heat to the plate evaporator.
  • the plate evaporator in the case where the plate evaporator directly faces the heat generating device, the plate evaporator exchanges heat directly with the heat generating device, and further indirectly exchanges heat with the heat generating device via the metal heat transfer plate; even in the plate evaporator and It is difficult to directly exchange heat between heating devices.
  • the heat-generating device due to the blockage of the cabinet or the dense or stacked distribution of multiple heat-generating devices, the heat-generating device can not directly radiate heat transfer with the radiation plate, and the heat-generating device can still pass through the metal heat transfer plate. Achieve heat transfer with the plate evaporator.
  • the present invention increases the heat transfer path between the radiant panel and the heat generating device by providing the metal heat transfer plate, so that the plate evaporator and the heat generating device have better heat transfer effect, and is particularly suitable for multiple dense Or The stacked heat generating devices are cooled.
  • the selection of the compressor may be not limited, but it is preferable to use an inverter compressor to adapt to changes in the load of the heat generating device and to reduce power consumption.
  • the condenser may adopt various cooling methods such as air cooling or water cooling; preferably, the water cooling method using artificial cooling, the advantage is that both the rapid cooling and the condenser heat recovery device can be used to recover the hot water. The recovered hot water is utilized.
  • the heat transfer surface of the radiant panel and the heat transfer surface of the heat transfer plate may be formed as a flat surface, or may be formed as a undulating undulation or other form of non-flat surface (for example, a corrugated surface).
  • the metal heat transfer plates and the radiant panels are interconnected such that rapid heat transfer between the two can be achieved by heat transfer and radiant heat transfer.
  • the metal heat transfer plates are separated from the radiant panels and the metal heat transfer plates are arranged obliquely with respect to the plate evaporator.
  • the advantage of separating the metal heat transfer plate from the plate evaporator is that the position of the metal heat transfer plate and the radiant plate evaporator can be flexibly set according to the heat generating device, and the installation of the metal heat transfer plate and the radiant plate evaporator can be facilitated.
  • the metal heat transfer plate is disposed to be inclined with respect to the radiation plate, so that the heat transfer plate and the heat generating device and the radiation plate have better radiation heat transfer effects.
  • the plate evaporator can be made into a door that can be opened by the frame, and the refrigerant connection pipe can be softly connected for easy maintenance.
  • the metal heat transfer plate is disposed to radiate heat transfer with the main heat dissipating surface of the heat generating device to better transfer the heat generated by the heat generating device to the radiant panel to achieve rapid temperature drop.
  • the main heat dissipating surface of the heat generating device refers to a surface having a relatively large heat dissipating area or a relatively large amount of heat dissipating in each surface.
  • the metal heat transfer plate can be separated from the heat generating device such that the two heat exchange is performed mainly by radiation heat transfer.
  • the metal heat transfer plate may also be partially in contact with the heat generating device, and at the same time, the two heat exchanges are performed by heat conduction and radiation heat transfer.
  • the radiant air conditioner of the present invention can be used for cooling treatment of a plurality of heat generating devices, at this time, heat transfer
  • the number of the plates is plural, the plurality of heat generating devices and the plurality of metal heat transfer plates are arranged in an array, and the plurality of heat generating devices and the plurality of metal heat transfer plates are alternately arranged in sequence in at least one array direction.
  • the plurality of metal heat transfer plates may have the same or different shapes, structures and/or sizes; each of the metal heat transfer plates may be integrated or may be combined by a plurality of heat transfer sub-boards connected or separated from each other. to make.
  • the heat transfer plates disposed between the heat generating devices may include two heat transfer sub-plates formed with an angle therebetween, or may be formed in a V-shaped structure to achieve a better heat transfer effect.
  • the plurality of heat generating devices and the plurality of metal heat transfer plates are alternately arranged in at least one array direction, it is ensured that the radiant panel can simultaneously exchange heat with all the heat generating devices through the heat transfer plate, so as to be fast and balanced. Cool down all heating equipment.
  • this arrangement can also reduce the space occupied by the air conditioner and simplify its structure.
  • any two adjacent heat generating devices are isolated by a metal heat transfer plate disposed therebetween, so that the two cannot be performed between the two Radiation heat transfer.
  • the core plate covering the refrigerant tube contacts the panel, this may cause the partial temperature of the panel of the plate evaporator to be lower than the dew point temperature, so that the radiant panel is dew condensation. Therefore, it is preferred that the refrigerant die plate be disposed to be spaced apart from the radiation plate.
  • the radiant panel evaporator further includes an insulated mesh bracket for separating the refrigerant core plate from the radiant panel to prevent or reduce condensation.
  • the advantage of using a mesh bracket is that even if the refrigerant tube and/or the radiant panel are deformed during transportation or use, it is ensured that the refrigerant tube does not contact the radiant panel.
  • the temperature at which the core plate structure and the refrigerant tube are in contact with each other is the lowest, that is, the surface temperature of the refrigerant core plate is not very uniform.
  • the radiation heat exchange is performed, and the low temperature line of the low temperature refrigerant tube has an angular coefficient when radiating heat to the panel. The diffusion, so the temperature field on the panel will be more uniform. It does not form condensation on the panel to form a cold line.
  • the expansion valve may be a thermal expansion valve or an electronic expansion valve; preferably, an electronic expansion valve is used, which not only can reduce energy consumption, but also enables precise and wide range of expansion valve opening and refrigerant flow through the control device. control.
  • a temperature sensor is disposed on the radiation plate, and the control device controls or adjusts the opening degree of the electronic expansion valve based on the temperature and the set temperature detected by the temperature sensor.
  • the heat transfer surface of the radiant panel and the heat transfer surface of the heat transfer plate are both coated with a black coating to increase their radiant heat transfer efficiency.
  • the radiant panel evaporator further includes an inner radiant core plate connected to the refrigerant tube but separated from the radiant panel, and the inner radiant core plate is capable of radiating heat transfer with the radiant panel, and The absorbed heat is quickly conducted to the refrigerant tube to improve the heat transfer efficiency between the radiant panel and the refrigerant tube.
  • the radiant panel evaporator further comprises a layer of insulating material, the tempering layer and the radiant panel together define a sealed receiving space in which the refrigerant tube and the inner radiating fin are disposed.
  • the refrigerant tube can only directly and indirectly exchange heat with the radiant panel to improve the heat exchange efficiency between the two, and to facilitate the control of the air conditioner.
  • Figure 1 is a schematic diagram of an embodiment of a radiant air conditioner of the present invention
  • FIG. 2 is a schematic structural view of a radiant panel evaporator in an embodiment of a radiant air conditioner of the present invention
  • Figure 3 is a schematic view showing the piping connection of the embodiment of the radiant air conditioner of the present invention.
  • FIG. 4 is a schematic view showing the mounting structure of the embodiment of the radiant air conditioner of the present invention.
  • 1 is a heating device (such as a server), 2 is a plate evaporator, 3 is a metal heat transfer plate, 4 is a compressor, 5 is a condenser, 6 is an expansion valve, 7 is a refrigerant supply pipe, and 8 is a refrigerant.
  • the return air pipe, 9 is a temperature sensor, 10 air supply ports, 11 is a return air port, and 12 is a water drain.
  • FIG. 1 is a schematic diagram of an embodiment of a radiant air conditioner of the present invention
  • FIG. 2 is a schematic structural view of a radiant panel evaporator in an embodiment of the radiant air conditioner of the present invention
  • FIG. 3 is a schematic diagram of a pipeline connection of an embodiment of the radiant air conditioner of the present invention.
  • the radiant air conditioner includes a plurality of radiant panel evaporators 2, a compressor 4, a condenser 5, and an expansion valve 6 arranged side by side; a radiant panel evaporator 2, a compressor 4
  • the condenser 5 and the expansion valve 6 are sequentially connected via a connecting pipe to form a recyclable refrigerant circuit.
  • the compressor 4 is an inverter compressor
  • the condenser 5 is a water-cooled or air-cooled condenser
  • the expansion valve 6 is an electronic expansion valve.
  • the plate evaporator 2 includes an aluminum radiant core plate 21 defining a receiving space, a core plate disposed in the accommodating space fixedly covering the meandering refrigerant copper tube 22, and thermally conductive with the refrigerant copper tube 22.
  • An aluminum inner radiating core plate 23 connected and disposed substantially parallel to the plate evaporator panel 21, and a mesh bracket 24 made of a heat insulating material is disposed between the refrigerant copper tube 22 and the aluminum radiating core plate 21, so that the refrigerant copper
  • the tube 22 and the aluminum inner radiating core plate 23 are separated from each other by the aluminum radiation panel 21.
  • the plate evaporator 2 further includes a heat insulating material layer 25 for covering the refrigerant copper tube 22 and the inner radiation fin plate 23 and sealing the accommodation space, and the opposite surfaces of the heat insulating material layer 25 are covered with the aluminum foil 26 and the protective case 27, respectively.
  • the heat absorbed by the panel evaporator panel 21 is mainly transmitted to the inner radiation core plate 23 and the refrigerant copper tube 22 by means of radiation heat transfer, and the heat absorbed by the inner radiation core plate 23 is further transmitted to the refrigerant copper tube 22,
  • the liquid refrigerant flowing through the refrigerant copper tube 22 absorbs the heat of the refrigerant copper tube 23 to form refrigerant vapor, and the refrigerant vapor enters the compressor 4, and the compressed high-temperature refrigerant vapor enters the condenser 5, and the high-pressure high-temperature refrigerant vapor is condensed to become a liquid refrigerant.
  • the liquid refrigerant passes through the expansion valve 6 to re-enter the refrigerant copper tube 22 to absorb heat, and thus circulates to complete the heat transfer.
  • the refrigerant supply pipe 7 is for conveying the liquid refrigerant to the plurality of radiant panel evaporators 2 arranged in parallel, and the refrigerant vapor generated by the heat absorption of the radiant panel evaporator 2 is output through the refrigerant return pipe 8.
  • Each of the radiant panel evaporators 2 has an expansion valve 6 and a temperature sensor 9 for detecting the temperature of the radiant panel is provided on the upper portion of the radiant panel 21 of each radiant panel evaporator 2, and the control device detects the temperature sensor 9 according to the temperature sensor 9
  • the radiant panel temperature and the set temperature automatically control or adjust the valve opening of each expansion valve 6, thereby regulating the flow rate of the refrigerant delivered to each radiant panel evaporator 2.
  • each radiant panel evaporator 2 The adjustment of the refrigerant flow rate in each radiant panel evaporator 2 is performed independently, so that the refrigerant in the lower portion of each radiant panel evaporator 2 is in a liquid state, the middle is in a two-phase boiling state, the upper middle portion is saturated steam, and the upper portion is overheated, avoiding Causes wet compression.
  • each radiant panel evaporator 2 is vertically disposed, and each radiant panel evaporator 2 corresponds to a plurality of metal heat transfer plates 3, and the metal heat transfer plates 3 are close to but not in contact with the radiant panel 21. And is disposed obliquely with respect to the radiation plate 21.
  • the opposite surfaces of the heat transfer plate 3 are also coated with a black matt coating such that the blackness of the radiation heat transfer is close to one.
  • a plurality of heat generating devices (for example, the server 1) are placed in the machine room 100, and the server 1 is formed into a flat box body, and is placed in such a manner that the largest surface is horizontal.
  • a plurality of servers 1 and a plurality of metal heat transfer plates 3 are distributed in an array and alternately arranged in the vertical array direction such that radiation heat transfer is performed between the largest surface of each server 1 and the corresponding metal heat transfer plate 3.
  • the metal heat transfer plates 3 are configured to completely overlap the adjacent servers 1 in the vertical array direction to isolate any two adjacent servers 1 in the vertical array direction.
  • the heat generated inside the server 1 is transmitted to the outer casing by radiation or the like; the temperature difference between the server casing and the heat transfer plate 3 is such that the heat in the server casing is mainly transmitted by radiation heat transfer.
  • the metal heat transfer plate 3 is delivered; the metal heat transfer plate 3 and the radiation plate 21 also have a temperature difference, so that the heat in the metal heat transfer plate 3 is mainly transmitted to the radiation panel 21 by means of radiation heat transfer.
  • a plurality of air supply ports 10 are disposed at a lower portion of the machine room 100, and a plurality of air return ports 11 are disposed at an upper portion thereof.
  • the air supply ports 10 and the air return ports 11 are respectively provided with electric control valves (not shown), and electric control valves are respectively provided. It is connected to the humidity sensor and the automatic control device circuit.
  • the radiant air conditioner further includes a dehumidifier (not shown), and the dry air is sent from the air supply port 10 into the machine room 100, and the air in the machine room 100 is returned to the dehumidifier via the air return port 11 to control the relative humidity in the machine room 100.
  • a sump 12 is provided at the lower portion of the radiant panel evaporator 2.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

一种用于发热设备（1）的辐射式空调系统，其包括经由连接管连接而形成可循环的冷媒回路的压缩机（4）、冷凝器（5）、膨胀阀（6）和至少一个辐射板蒸发器（2）；每一辐射板蒸发器（2）均包括冷媒铜管（22）和与冷媒铜管（22）进行换热的辐射板（21）；其中，该辐射式空调进一步包括至少一个金属传热板（3），其用于与发热设备（1）进行辐射传热，并将所吸收的热量传输至辐射板（21）。该结构能够改进辐射板（21）和发热设备（1）之间的传热效果，尤其适合于对多个密集分布的发热设备（1）进行降温处理。

Description

用于发热设备的辐射式空调系统 技术领域
本发明涉及本发明提供了一种板式蒸发器降温的辐射式空调系统，主要用于电子发热设备的降温。其可以用于对例如服务器、基站等的各种发热设备进行降温处理，尤其是适合于对多个密集分布的发热设备进行降温处理。
背景技术
中国专利CN200810029359.6公开了一种具有辐射换热天花板的空调，包括热泵系统和水循环系统，其中，水循环系统包括含有泵、空气换热装置、水换热装置和多块辐射换热天花板的水循环回路，通过空气换热装置与外界空气换热，通过水换热装置与热泵系统换热；辐射换热天花板包括金属天花板、接入水循环回路中的换热盘管以及覆盖在换热盘管上方的保温材料层；换热盘管设置于金属天花板上方，贴近金属天花板但不接触金属天花板。
中国发明专利CN201010158876.0公开了一种具有分离式辐射板蒸发器的基站专用空调机，其包括室外机、设在机房内的辐射板蒸发器以及冷凝水排除装置，其中，室外机包括压缩机、冷凝器和膨胀阀，辐射板蒸发器通过连接管与压缩机、冷凝器和膨胀阀形成可循环的闭路连接；辐射板蒸发器由若干板式蒸发器组成，板式蒸发器包括冷媒管、辐射板、内辐射翅板和绝热材料，冷媒管与内辐射翅板连接，冷媒管和内辐射翅板设在辐射板和绝热材料之间，若干板式蒸发器的冷媒管通过连接管相互连通。
在上述技术方案中，基站设备所产生的热量通过辐射方式直接传递给辐射板，辐射板将热量传递给内辐射翅板，内辐射翅板将热量传递给冷媒管里的液 态冷媒，使得冷媒蒸发吸热并气化回到压缩机，完成制冷循环。该技术方案的缺点在于，基站设备和辐射板之间辐射传热的面积较为有限，导致二者之间的辐射传热效果较差，基站设备仍然会向周围空气散发大量热量，由于空气对流传热的效果差、速度慢，空调机需要较多的能耗才能使得基站设备的温度达到要求。当机房内设置多个基站设备，尤其是当多个基站设备密集分布时，基站设备之间在其与辐射板的辐射传热路径上相互阻挡，导致这种缺点尤其明显。
发明内容
针对现有技术的不足，本发明的目的在于提供一种能够改进辐射板和发热设备之间传热效果的用于发热设备的辐射式空调系统，尤其适合于对多个密集分布的发热设备进行降温处理。
为了实现上述发明目的，本发明提供了一种用于发热设备的辐射式空调系统，包括经由连接管连接而形成可循环的冷媒回路的压缩机、冷凝器、膨胀阀和至少一个板蒸发器；每一板蒸发器均包括冷媒管和包覆该冷媒管的传热芯板。该辐射式空调进一步包括至少一个金属传热板，该金属传热板安装在两个发热设备之间的机架上。金属传热板与发热设备进行辐射传热，并将所吸收的热量传输至板式蒸发器。
上述技术方案中，在板式蒸发器直接面对发热设备的情况下，板式蒸发器在与发热设备直接换热的同时，进一步经由金属传热板与发热设备间接换热；即使在板式蒸发器与发热设备之间难以直接换热，例如由于机柜的阻挡或多个发热设备密集或层叠分布，使得发热设备不能与辐射板直接进行辐射传热的情况下，发热设备仍然可以通过金属传热板来实现与板式蒸发器的传热。由此可见，本发明通过设置金属传热板而在辐射板和发热设备之间增加传热路径，使得板式蒸发器和发热设备之间具有更佳的传热效果，尤其适合于对多个密集或 层叠分布的发热设备进行降温处理。
本发明中，对压缩机的选择可以不作限制，但优选采用变频压缩机，适应发热设备负荷的变化，并降低电能消耗。另外，冷凝器可以采用风冷或水冷等各种冷却方式；优选地，采用人工制冷的水冷方式，这样的好处是既可以实现快速冷却，又可以采用冷凝器热回收装置回收热水，以对所回收的热水进行利用。
本发明中，辐射板的传热表面和传热板的传热表面既可以形成为平面，也可以形成为凹凸起伏状或其他形式的非平整面(例如波纹面)。
可选择地，金属传热板与辐射板之间相互连接，使得二者之间能够通过热传导和辐射传热的方式进行快速传热。
根据本发明的一种优选实施方式，金属传热板与辐射板相互分离，且金属传热板相对于板式蒸发器倾斜设置。其中，金属传热板与板式蒸发器相互分离的好处在于可以根据发热设备灵活地设置金属传热板和辐射板蒸发器的位置，便于金属传热板和辐射板蒸发器的安装。此时，金属传热板设置为相对于辐射板倾斜，使得传热板与发热设备和辐射板之间均具有较好的辐射传热效果。板式蒸发器可以做成机架可开启的门，冷媒连接管可以软连接便于检修。
根据本发明的另一优选实施方式，金属传热板设置为与发热设备的主要散热表面进行辐射传热，以更好地将发热设备所产生的热量传输至辐射板，实现快速降温。其中，发热设备的主要散热表面是指其各个表面中散热面积或者散热量相对较大的表面。
本发明中，金属传热板可以与发热设备相分离，使得二者主要通过辐射传热的方式进行换热。可选择地，金属传热板也可以局部与发热设备相接触，此时二者以热传导和辐射传热的方式同时进行换热。
本发明的辐射式空调可以用于对多个发热设备进行降温处理，此时，传热 板的数量为多个，多个发热设备和多个金属传热板呈阵列分布，且多个发热设备和多个金属传热板在至少一个阵列方向上依次交替排列。其中，多个金属传热板可以具有相同或者不同的形状、结构和/或尺寸；每个金属传热板可以是一体式的，也可以由多个相互连接或分离的传热子板组合而成。例如，设置在发热设备之间的传热板可以包括两个相互之间形成有夹角的传热子板，也可以形成为V形结构，从而实现更佳的传热效果。
上述技术方案中，由于多个发热设备和多个金属传热板在至少一个阵列方向上依次交替排列，因此可以保证辐射板能够通过传热板与所有发热设备同时进行换热，以快速、均衡地对所有发热设备进行降温处理。另外，这种设置方式还可以减少空调所占用的空间，并简化其结构。
根据本发明的一种具体实施方式，在上述的至少一个阵列方向上，任意两个相邻的发热设备被设置在二者之间的金属传热板所隔离，使得二者之间不能够进行辐射传热。这样的好处在于不仅可以避免或减少相邻发热设备之间产生热干扰，而且能够增大传热板与发热设备之间的辐射传热面积，进一步提高辐射传热效果。
本发明中，虽然包覆冷媒管的芯板接触面板，但这可能导致板式蒸发器的面板局部温度低于露点温度，使得辐射板出现结露现象。因此，优选地是，冷媒管芯板设置为与辐射板相分隔。
作为本发明的一种实施方式，上述辐射板蒸发器进一步包括用于将冷媒芯板和辐射面板分隔开的绝热网状支架，从而防止或减少结露现象。使用网状支架的好处还在于，即使在运输或者使用的过程中，冷媒管和/或辐射板发生变形，也可以保证冷媒管不会接触辐射板。此芯板结构和冷媒管接触固定的地方温度是最低的，也就是说冷媒芯板表面温度并不很均匀。但是用于冷媒芯板和面板隔开后之间是辐射换热，低温的冷媒管的低温线向面板辐射换热时具有角系数 的扩散，所以面板上的温度场会比较均匀。不至于在面板形成低温冷线而结露。
本发明中，膨胀阀可以是热力膨胀阀或者电子膨胀阀；优选地，采用电子膨胀阀，其不仅能够降低能耗，而且使得可以通过控制装置对膨胀阀开度和冷媒流量进行精确、大范围的控制。相应地，辐射板上设置有温度传感器，控制装置基于该温度传感器所检测到的温度和设定温度对电子膨胀阀的开度进行控制或调节。
根据本发明的另一具体实施方式，辐射板的传热表面和传热板的传热表面均覆有黑色涂层，以提高其辐射传热效率。
根据本发明的另一具体实施方式，上述辐射板蒸发器进一步包括与冷媒管相连接但与辐射板相分离的内辐射芯板，内辐射芯板能够与辐射板进行辐射传热，并将所吸收的热量快速地传导至冷媒管，以改善辐射板与冷媒管之间的传热效率。
优选地，上述辐射板蒸发器进一步包括保温材料层，该保温材料层和辐射板共同限定出密封的容纳空间，冷媒管和内辐射翅板设置在该容纳空间内。这样的好处在于冷媒管基本上仅能直接和间接地与辐射板进行换热，以提高二者之间的换热效率，并便于对空调进行控制。
为了更清楚地阐述本发明的目的、技术方案及优点，下面结合附图和具体实施方式对本发明做进一步的详细说明。
附图说明
图1是本发明辐射式空调实施例的原理图；
图2是本发明辐射式空调实施例中辐射板蒸发器的结构示意图；
图3是本发明辐射式空调实施例的管路连接示意图；
图4是本发明辐射式空调实施例的安装结构示意图。
图中：1为发热设备(例如服务器)、2为板式蒸发器、3为金属传热板、4为压缩机、5为冷凝器、6为膨胀阀、7为冷媒供液管、8为冷媒回气管、9为温度传感器、10送风口、11为回风口、12为泄水槽。
具体实施方式
图1是本发明辐射式空调实施例的原理图，图2是本发明辐射式空调实施例中辐射板蒸发器的结构示意图，图3是本发明辐射式空调实施例的管路连接示意图。如图1至3所示，在该实施例中，辐射式空调包括多个并列设置的辐射板蒸发器2、压缩机4、冷凝器5和膨胀阀6；辐射板蒸发器2、压缩机4、冷凝器5和膨胀阀6经由连接管依次连接，形成可循环的冷媒回路。其中，压缩机4为变频压缩机，冷凝器5为水冷式或风冷式冷凝器，膨胀阀6为电子膨胀阀。
如图2所示，板式蒸发器2包括限定有一容纳空间的铝辐射芯板21、设置在该容纳空间内的的芯板固定包覆着曲折状冷媒铜管22、以及与冷媒铜管22导热连接并设置为与板式蒸发器面板21大致平行的铝制内辐射芯板23，冷媒铜管22和铝辐射芯板21之间设置有由热绝缘材料制成的网状支架24，使得冷媒铜管22和铝制内辐射芯板23与铝辐射面板21之间相互分隔。其中，铝辐射面板21的内表面以及内辐射翅板23面对铝辐射板21的表面均涂覆有黑色的亚光涂料，以使其辐射传热的黑度接近1。板式蒸发器2还包括用于覆盖冷媒铜管22和内辐射翅板23并密封该容纳空间的保温材料层25，保温材料层25的两相对表面分别覆盖有铝箔26和保护壳27。
板式蒸发器面板21所吸收的热量主要通过辐射传热的方式传输至内辐射芯板23和冷媒铜管22，内辐射芯板23所吸收的热量进一步传导至冷媒铜管22， 流经冷媒铜管22的液态冷媒吸收冷媒铜管23的热量形成冷媒蒸汽，冷媒蒸汽进入压缩机4，经过压缩后的高温冷媒蒸汽进入冷凝器5，高压高温的冷媒蒸汽经过冷凝后成为液态冷媒，液态冷媒经过膨胀阀6节流再次进入冷媒铜管22吸热，如此循环，以完成热量的传输。
如图3所示，冷媒供液管7用于向多个并列设置的辐射板蒸发器2输送液态冷媒，辐射板蒸发器2吸热所产生的冷媒蒸汽经由冷媒回气管8输出。每个辐射板蒸发器2均对应有一个膨胀阀6，且每个辐射板蒸发器2的辐射板21上部均设有用于检测辐射板温度的温度传感器9，控制装置依据温度传感器9所检测到的辐射板温度和设定温度来自动控制或调节各个膨胀阀6的阀门开度，从而调节输送至各个辐射板蒸发器2的冷媒流量。每个辐射板蒸发器2中冷媒流量的调节是独立进行地，使得每个辐射板蒸发器2下部的冷媒是液态，中间是两相沸腾状态，中上部是饱和蒸汽，上部是过热状态，避免造成湿压缩。
图4是本发明辐射式空调实施例的安装结构示意图。如图4所示，本实施例中，辐射板蒸发器2竖直设置，每个辐射板蒸发器2均对应有多个金属传热板3，金属传热板3靠近但不接触辐射板21，且相对于辐射板21倾斜设置。传热板3的两相对表面同样涂覆有黑色的亚光涂料，使其辐射传热的黑度接近1。
机房100内放置有多个发热设备(例如服务器1)，服务器1形成为扁平的箱型体，且其以最大表面处于水平的方式放置。多个服务器1和多个金属传热板3阵列分布，且在竖直阵列方向上依次交替排列，使得每个服务器1的最大表面与相应金属传热板3之间进行辐射传热。其中，金属传热板3构造为在竖直阵列方向上与相邻的服务器1完全重叠，以在竖直阵列方向上将任意两个相邻的服务器1隔离。
服务器1内部所产生的热量通过辐射等方式传输至其外壳；服务器外壳和传热板3之间具有温差，使得服务器外壳内的热量主要通过辐射传热的方式传 递给金属传热板3；金属传热板3和辐射板21之间同样具有温差，使得金属传热板3内的热量主要通过辐射传热的方式传递给辐射面板21。控制辐射板蒸发器2内的冷媒流量，可以依次控制辐射板21表面、传热板3表面、服务器外壳表面和服务器内部的温度。通常，随着服务器1工作状态的改变，其发热量的变化也很大，为了保持其稳定工作状态，需要依据温度传感器9所检测到的辐射板温度来自动调节进入辐射板蒸发器2的冷媒流量。
再次参见图4，机房100的下部设置有多个送风口10，上部设置有多个回风口11，送风口10和回风口11分别设有电动控制阀(图中未示出)，电动控制阀与湿度传感器及自动控制装置电路相连接。辐射式空调进一步包括除湿机(图中未示出)，干风从送风口10送进机房100内，机房100内的空气经由回风口11回到除湿机，以控制机房100内的相对湿度。为了应对在可能的湿度失控时辐射板21结露，在辐射板蒸发器2的下部设置有泄水槽12。
虽然以上通过实施例描绘了本发明，但应当理解的是，本领域技术人员在不脱离本发明的发明范围内，可对本发明作各种修饰、变化及应用，凡此仍应为本发明的发明范围所涵盖。

Claims (10)

  1. 一种用于发热设备的辐射式空调系统，包括经由连接管连接而形成可循环的冷媒回路的压缩机、冷凝器、膨胀阀和至少一个辐射板蒸发器；每一所述辐射板蒸发器均包括冷媒管和与所述冷媒管进行换热的辐射板；其中，所述辐射式空调进一步包括至少一个传热板，所述传热板与发热设备进行辐射传热，并将所吸收的热量传输至所述辐射板。
  2. 如权利要求1所述的辐射式空调系统，其中，所述传热板与所述辐射板相互分离，且所述传热板相对于所述辐射板倾斜设置。
  3. 如权利要求1所述的辐射式空调系统，其中，所述传热板设置为与所述发热设备的主要散热表面进行辐射传热。
  4. 如权利要求1所述的辐射式空调，其用于对多个发热设备进行降温处理，其中，所述传热板的数量为多个，所述多个发热设备和所述多个传热板呈阵列分布，且所述多个发热设备和所述多个传热板在至少一个阵列方向上依次交替排列。
  5. 如权利要求4所述的辐射式空调系统，其中，在所述的至少一个阵列方向上，任意两个相邻的发热设备被设置在二者之间的传热板所隔离。
  6. 如权利要求1所述的辐射式空调系统，其中，所述辐射板蒸发器还包括用于将所述冷媒管和所述辐射板分隔开的绝热网状支架。
  7. 如权利要求1所述的辐射式空调系统，其中，所述膨胀阀为电子膨胀阀，所述辐射板上设置有温度传感器，控制装置基于所述温度传感器所检测到的温度和设定温度对所述电子膨胀阀的开度进行控制或调节。
  8. 如权利要求1所述的辐射式空调系统，其中，所述辐射板的传热表面和 所述传热板的传热表面均覆有黑色涂层。
  9. 如权利要求1所述的辐射式空调系统，其中，所述辐射板蒸发器进一步包括与所述冷媒管相连接但与所述辐射板相分离的内辐射翅板。
  10. 如权利要求9所述的辐射式空调系统，其中，所述辐射板蒸发器进一步包括保温材料层，所述保温材料层和所述辐射板共同限定出密封的容纳空间，所述冷媒管和所述内辐射翅板设置在所述容纳空间内。
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