SG11201402746TA - Electronic substrate housing equipment and electric apparatus - Google Patents

Electronic substrate housing equipment and electric apparatus

Info

Publication number
SG11201402746TA
SG11201402746TA SG11201402746TA SG11201402746TA SG11201402746TA SG 11201402746T A SG11201402746T A SG 11201402746TA SG 11201402746T A SG11201402746T A SG 11201402746TA SG 11201402746T A SG11201402746T A SG 11201402746TA SG 11201402746T A SG11201402746T A SG 11201402746TA
Authority
SG
Singapore
Prior art keywords
unit
tokyo
lllll
heat
electronic board
Prior art date
Application number
SG11201402746TA
Inventor
Minoru Yoshikawa
Hitoshi Sakamoto
Masaki Chiba
Kenichi Inaba
Arihiro Matsunaga
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of SG11201402746TA publication Critical patent/SG11201402746TA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20354—Refrigerating circuit comprising a compressor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ (43) 2013 ^6^ 6 0 (06.06.2013) I P O I P C T (10) WO 2013/080897 A1 (51) HOSK 7/20 (2006.01) (21) (22) (25) (26) 4>§fl(£> s In: HOSK 7/18 (2006.01) PCT/JP2012/080402 2012 ^ 11 M 16 0(16.11.2012) 0*ig (30) fiBfeltx — $: 2011-263753 2011 ^ 12 .E 1 0(01.12.2011) JP (71) ttllA ^TCDJI^IIICOI^T): 0* HI §1 3S ft (NEC CORPORATION) [JP/JP]; T 1088001 |7S1^ Tokyo (JP). (72) (71) ttllA (^lllCO^TCD^): H(YOSHI- KAWA, Minora) [JP/JP]; T 1088001 T g 7 # 1 0 Tokyo (JP). tM (SAKAMOTO, Hitoshi) [JP/JP]; T 1088001 M 7f1 Tokyo (JP). IE lit (CHIBA, Masaki) [JP/JP]; T 1088001 7f 1 ^0$lt Tokyo (JP). fiaH S — (INABA, Keni- chi) [JP/JP]; T 1088001 SET g 7 # 1 0 sstt l*l Tokyo (JP). |i»^C (MATSUNAGA, Arihiro) [JP/JP]; T 1088001 iE2iTg7Si Tokyo (JP). (74) ft H A : ~F W. H lit (SHIMOSAKA, Naoki); T 1088001 K«f|5;SESETg 7f 1 ^0^1f Tokyo (JP). (8i) II^H (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (54) Title: ELECTRONIC BOARD CONTAINING DEVICE AND ELECTRONIC APPARATUS (54) i mv&m : (57) Abstract: An electronic board (200A) incorporates heat generating a element (220). A housing (300A) hermetically contains the electronic board (200). A cooling unit (400) cools the electronic board (200). The cooling unit (400) comprises heat receiving a unit (410) and heat radiating a unit (420). The heat receiving unit (410) receives a heat from the electronic board (200). The heat ra - t diating unit (420), which is coupled to the heat receiving unit (410), radiates the heat that has been received by the heat receiving ^ unit (410) the from electronic board (200). The heat receiving unit (410) is hermetically disposed inside the housing (300A), while ^ the heat radiating unit (420) is disposed outside the housing (300). In this way, an efficient cooling can be achieved, and further, 00 maintenance and replacement can be done for each individual electronic board containing device. § (57)®$: 0 0 A 14, 2 2 0 tt1*3 0 0AI4, *15 2 0 0 L £3 TJRJg-fSo JfrSlSMOOIA, 1^*152 0 0^;tSP\"T-So Jfrsiauooii, S8&SP4 1 Ot, WL © S&SP4 2 0<t£ii*.Tl^o S8&SM10I4, 1^*152 0 -So SJS&SP4 2 014, S c* mUA- 1 odiiftSU SS&SP4 1 1^*152 o ofrbomZMt&o £& n nP4 1 0 14, ttf*3 0 0 ArtlcffifflSftTiSltbftTfcy, &8&SM2 0I4, ttf*3 0 onicfSltbtlT WO 2013/080897 Al I lllll llllllll II llllll III lllll lllll III III III lllll lllll lllll lllll llll lllll llll lllllll llll llll (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). - (&&£ 21 &(3))
SG11201402746TA 2011-12-01 2012-11-16 Electronic substrate housing equipment and electric apparatus SG11201402746TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011263753 2011-12-01
PCT/JP2012/080402 WO2013080897A1 (en) 2011-12-01 2012-11-16 Electronic board containing device and electronic apparatus

Publications (1)

Publication Number Publication Date
SG11201402746TA true SG11201402746TA (en) 2014-12-30

Family

ID=48535355

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402746TA SG11201402746TA (en) 2011-12-01 2012-11-16 Electronic substrate housing equipment and electric apparatus

Country Status (6)

Country Link
US (1) US20140321056A1 (en)
EP (1) EP2787802A4 (en)
JP (1) JP6070569B2 (en)
CN (1) CN103959926A (en)
SG (1) SG11201402746TA (en)
WO (1) WO2013080897A1 (en)

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FR2973897B1 (en) * 2011-04-05 2013-03-29 Sagem Defense Securite ELECTRONIC DATA PROCESSING ASSEMBLY WITH MUTUALIZED RESOURCES
US9820407B2 (en) * 2013-02-26 2017-11-14 Nec Corporation Electronic device and cooling system
JPWO2016047099A1 (en) * 2014-09-26 2017-07-13 日本電気株式会社 Cooling device and manufacturing method thereof
US10156873B2 (en) 2015-12-21 2018-12-18 Dell Products, L.P. Information handling system having fluid manifold with embedded heat exchanger system
US10146231B2 (en) 2015-12-21 2018-12-04 Dell Products, L.P. Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature
US10010013B2 (en) 2015-12-21 2018-06-26 Dell Products, L.P. Scalable rack-mount air-to-liquid heat exchanger
US10064314B2 (en) 2015-12-21 2018-08-28 Dell Products, L.P. Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance
US9795065B2 (en) 2015-12-21 2017-10-17 Dell Products, L.P. Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem
US10206312B2 (en) 2015-12-21 2019-02-12 Dell Products, L.P. Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
CN106941768A (en) * 2016-01-05 2017-07-11 中兴通讯股份有限公司 Single plate cooling device
CN105744802B (en) * 2016-01-12 2018-05-11 严继光 Radiation-type air conditioner system for heat-producing device
JP6860004B2 (en) * 2016-03-31 2021-04-14 日本電気株式会社 Cooling system
JP2018010500A (en) * 2016-07-14 2018-01-18 富士通株式会社 Information processor
JP6777912B2 (en) 2016-10-07 2020-10-28 株式会社マキタ Battery pack and electric work machine
KR101934847B1 (en) * 2017-02-16 2019-01-03 연세대학교 산학협력단 Cooling module using liquid phase change for electronic device
KR200494468Y1 (en) * 2017-02-23 2021-10-18 엘에스일렉트릭(주) Cooling system using modular cooling apparatus
CN107765795A (en) 2017-11-08 2018-03-06 北京图森未来科技有限公司 A kind of computer server
CN107885295A (en) * 2017-11-08 2018-04-06 北京图森未来科技有限公司 A kind of cooling system
US10375863B2 (en) * 2017-11-28 2019-08-06 Dell Products, L.P. Liquid cooled chassis
TWI652981B (en) * 2018-03-19 2019-03-01 緯穎科技服務股份有限公司 Host system and its heat sink and separation mechanism
US10588240B1 (en) * 2019-04-17 2020-03-10 Pacific Star Communications, Inc. Air cooling system for modular electronic equipment
JP6787604B1 (en) * 2019-06-03 2020-11-18 Ｎｅｃプラットフォームズ株式会社 Cooling system
CN110362173B (en) * 2019-06-20 2020-08-25 杭州美创科技有限公司 Intelligent heat dissipation system of server

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Also Published As

Publication number Publication date
EP2787802A1 (en) 2014-10-08
CN103959926A (en) 2014-07-30
JPWO2013080897A1 (en) 2015-04-27
JP6070569B2 (en) 2017-02-01
US20140321056A1 (en) 2014-10-30
EP2787802A4 (en) 2015-09-30
WO2013080897A1 (en) 2013-06-06

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