WO2017113788A1 - 防水防潮的温度传感器的制作方法及其制得的温度传感器 - Google Patents

防水防潮的温度传感器的制作方法及其制得的温度传感器 Download PDF

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WO2017113788A1
WO2017113788A1 PCT/CN2016/093046 CN2016093046W WO2017113788A1 WO 2017113788 A1 WO2017113788 A1 WO 2017113788A1 CN 2016093046 W CN2016093046 W CN 2016093046W WO 2017113788 A1 WO2017113788 A1 WO 2017113788A1
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tpu
temperature sensor
moisture
waterproof
layer
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PCT/CN2016/093046
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English (en)
French (fr)
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段兆祥
叶建开
杨俊�
唐黎明
柏琪星
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段兆祥
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements

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  • the invention relates to a method for manufacturing an electronic component, in particular to a method for manufacturing a waterproof and moisture-proof temperature sensor and a temperature sensor thereof.
  • temperature sensors constructed in different package forms are widely used in various temperature detecting and temperature control circuits, which play a central role in converting the temperature variables into the required electronic signals.
  • FIG. 1 is a structural schematic diagram of a prior art temperature sensor. Existing temperature sensors are made by following these steps:
  • the temperature sensor packaged according to the above steps has the following drawbacks:
  • the present invention provides a method for manufacturing a temperature sensor that is simple in manufacturing method, high in production efficiency, low in cost, and easy to realize mass production.
  • a method for manufacturing a waterproof and moisture-proof temperature sensor includes the following steps:
  • Cutting line cutting the TPU electronic wire with the same length according to the set line length
  • Chip soldering soldering a chip with temperature measuring function at one end of the TPU (Thermoplastic polyurethane) electronic wire;
  • epoxy resin encapsulation the prepared epoxy resin encapsulant encapsulates the chip and the exposed wire, and is heated and cured; the epoxy resin encapsulant and the existing epoxy resin encapsulation Same material;
  • TPU encapsulation preparing a liquid TPU encapsulant, and encapsulating a layer of liquid TPU encapsulant in the epoxy layer formed in step 3), and curing to form an inner encapsulation layer of TPU; and then encapsulating the layer in the TPU Outsourcing a layer of liquid TPU package The material is sealed and cured to form a TPU outer encapsulation layer.
  • the method for manufacturing the waterproof and moisture-proof temperature sensor of the present invention through the TPU package, makes the obtained temperature sensor have the properties of resistance to cold, heat, moisture, moisture, abrasion, oil and aging. And it has high shear strength and impact toughness, and the electrical performance is reliable and stable.
  • liquid TPU encapsulant in the step (4) consists of the following components:
  • the TPU main agent is prepared by dissolving the one-component TPU particles in THF (tetrahydrofuran), and the mass ratio of the TPU particles to THF is 1:2 to 1:1.
  • the diluent is selected from an environmentally friendly organic compound solvent. Adding a curing agent to the TPU main agent enables the TPU encapsulating layer formed by the liquid TOU encapsulant to have solvent resistance, high adhesion, water washing resistance, corrosion resistance, fast reaction and high hardness; adding dilution in the TPU main agent
  • the agent can increase the fluidity of the liquid encapsulating material, facilitate the control of the thickness and uniformity of the coating, and the use of the environmentally friendly organic composite solvent also makes the product more environmentally friendly.
  • the one-component TPU particles are dried at 80 to 110 ° C for about 3 hours before being dissolved in THF.
  • the TPU inner encapsulation layer and the TPU outer encapsulation layer are formed by curing at room temperature for 6 to 8 hours.
  • the TPU inner encapsulation layer and the TPU outer encapsulation layer are formed by baking and curing at 80 to 90 ° C for 2 to 3 hours.
  • the method for manufacturing the waterproof and moisture-proof temperature sensor further includes the following steps:
  • the temperature sensor can be firmly enclosed in the package shell and is not easy to fall off.
  • the composite potting compound in the step (7) is prepared by mixing the following mass percentage components:
  • the liquid TPU potting compound consists of the following parts:
  • the TPU main agent is prepared by dissolving the one-component TPU particles in THF, and the mass ratio of the TPU particles to THF is 1:2 to 1:1.
  • the liquid epoxy potting compound is a conventionally used potting compound, which is usually mixed with 100 parts of epoxy resin main agent, 20-22 parts of medium temperature curing agent and 6-8 parts of diluent. Stirring and vacuum defoaming are obtained.
  • the composite potting material is prepared by mixing the liquid TPU potting compound and the liquid epoxy potting compound after sufficient agitation and vacuum defoaming.
  • the composite potting material has a certain hardness and can be firmly combined with the insulating layer of the TPU electronic wire, effectively preventing moisture from immersing and causing a variation in the performance of the temperature sensor.
  • the temperature sensor finished product is obtained by baking and curing at 80 to 90 ° C for 2 to 3 hours.
  • the encapsulating shell protrudes outward from the opening to form a plurality of convex grooves.
  • the arrangement enables the composite potting compound to be firmly embedded in the convex groove after solidification, thereby ensuring that the temperature sensor is firmly packaged in the package casing and is not easily peeled off.
  • the invention also provides a waterproof and moisture-proof temperature sensor which is manufactured according to the above-mentioned method for manufacturing a waterproof and moisture-proof temperature sensor.
  • the waterproof and moisture-proof temperature sensor of the invention has the properties of resistance to cold, heat, water, moisture, abrasion, oil and aging, and has high shear strength and impact toughness. Electrical performance is reliable and stable.
  • FIG. 1 is a schematic structural view of a prior art temperature sensor
  • FIG. 2 is a schematic structural view of a temperature sensor according to Embodiment 1 of the present invention.
  • Fig. 3 is a schematic structural view of a temperature sensor according to a second embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a temperature sensor according to the embodiment.
  • the waterproof and moisture-proof temperature sensor of this embodiment is obtained by the following steps:
  • Cutting line cutting the TPU electronic line 40 with the same length according to the set line length
  • Chip soldering soldering a chip 10 with a temperature measuring function at one end of the TPU electronic line 40;
  • epoxy resin encapsulation the prepared epoxy resin encapsulant encapsulates the chip and the exposed wire, and is heated and cured to form an epoxy resin encapsulation layer 20; the epoxy resin encapsulant and The existing epoxy resin encapsulant is the same;
  • TPU encapsulation preparing a liquid TPU encapsulant, and encapsulating a layer of liquid TPU encapsulant in the epoxy layer formed in step 3), and curing to form a TPU inner encapsulation layer 30; and then encapsulating in the TPU Layer outsourcing a layer of liquid TPU
  • the encapsulant is encapsulated and cured to form a TPU outer encapsulation layer 50.
  • the TPU inner encapsulation layer 30 and the TPU outer encapsulation layer 50 are formed by curing at room temperature for 6 to 8 hours or at 80 to 90 ° C for 2 to 3 hours.
  • the liquid TPU encapsulant consists of the following parts:
  • the TPU main agent is prepared by dissolving the one-component TPU particles in THF (tetrahydrofuran), and the mass ratio of the TPU particles to THF is 1:2 to 1:1.
  • the one-component TPU pellets were dried at 80-110 ° C for about 3 hours before being dissolved in THF.
  • the diluent is selected from an environmentally friendly organic compound solvent.
  • Adding a curing agent to the TPU main agent enables the TPU encapsulating layer formed by the liquid TOU encapsulant to have solvent resistance, high adhesion, water washing resistance, corrosion resistance, fast reaction and high hardness; adding dilution in the TPU main agent
  • the agent can increase the fluidity of the liquid encapsulating material, facilitate the control of the thickness and uniformity of the coating, and the use of the environmentally friendly organic composite solvent also makes the product more environmentally friendly.
  • the waterproof and moisture-proof temperature sensor of the present invention is formed by sequentially forming a TPU inner encapsulation layer and a TPU outer encapsulation layer on the outer surface of the epoxy resin encapsulation layer 20 by using a TPU package, so that the obtained temperature sensor is obtained. It has the properties of cold resistance, heat resistance, water resistance, moisture resistance, abrasion resistance, oil resistance and aging resistance, and it has high shear strength and impact toughness, and its electrical performance is reliable and stable.
  • the temperature sensor obtained by the above steps comprises a chip 10, a TPU electronic wire 40 soldered to the chip 10 at one end, an epoxy resin encapsulation layer 20 encapsulating the chip 10 and the exposed lead wire, and an epoxy encapsulation layer 20
  • FIG. 3 is a structural schematic diagram of a waterproof and moisture-proof temperature sensor according to the embodiment.
  • the waterproof and moisture-proof temperature sensor of this embodiment is obtained by the following steps:
  • Cutting line cutting the TPU electronic line 40 with the same length according to the set line length
  • Chip soldering soldering a chip 10 with a temperature measuring function at one end of the TPU electronic line 40;
  • epoxy resin encapsulation the prepared epoxy resin encapsulant encapsulates the chip and the exposed wire, and is heated and cured to form an epoxy resin encapsulation layer 20; the epoxy resin encapsulant and The existing epoxy resin encapsulant is the same;
  • TPU encapsulation preparing a liquid TPU encapsulant, and encapsulating a layer of liquid TPU encapsulant in the epoxy layer formed in step 3), and curing to form a TPU inner encapsulation layer 30; and then encapsulating in the TPU The layer is overlaid with a layer of liquid TPU encapsulant and cured to form a TPU outer encapsulation layer 50.
  • the TPU inner encapsulation layer 30 and the TPU outer encapsulation layer 50 are formed by curing at room temperature for 6 to 8 hours or at 80 to 90 ° C for 2 to 3 hours.
  • the liquid TPU encapsulant consists of the following parts:
  • the TPU main agent is prepared by dissolving the one-component TPU particles in THF (tetrahydrofuran), and the mass ratio of the TPU particles to THF is 1:2 to 1:1.
  • the one-component TPU pellets were dried at 80-110 ° C for about 3 hours before being dissolved in THF.
  • the diluent is selected from an environmentally friendly organic compound solvent.
  • Adding a curing agent to the TPU main agent enables the TPU encapsulating layer formed by the liquid TOU encapsulant to have solvent resistance, high adhesion, water washing resistance, corrosion resistance, fast reaction and high hardness; adding dilution in the TPU main agent
  • the agent can increase the fluidity of the liquid encapsulating material, facilitate the control of the thickness and uniformity of the coating, and the use of the environmentally friendly organic composite solvent also makes the product more environmentally friendly.
  • the heat conductive resin 71 is injected into the bottom of the package case 60; the package case 60 is convexly outwardly formed near the opening to form a plurality of convex grooves 61.
  • the arrangement of the convex groove 61 enables the composite potting material to be firmly embedded in the convex groove 61 after solidification, thereby ensuring that the temperature sensor is firmly packaged in the package casing and is not easily peeled off.
  • the composite potting compound is composed of the following mass percentage components:
  • the liquid TPU potting compound consists of the following parts:
  • the TPU main agent is prepared by dissolving the one-component TPU particles in THF, and the mass ratio of the TPU particles to THF is 1:2 to 1:1.
  • the liquid epoxy potting compound is a conventionally used potting compound, which usually consists of 100 parts of epoxy resin main agent, 20-22
  • the mixture of medium temperature curing agent and 6-8 parts of diluent is prepared by thorough stirring and vacuum defoaming.
  • the composite potting material is prepared by mixing the liquid TPU potting compound and the liquid epoxy potting compound after sufficient agitation and vacuum defoaming.
  • the composite potting material has a certain hardness and can be firmly combined with the insulating layer of the TPU electronic wire, effectively preventing moisture from immersing and causing a variation in the performance of the temperature sensor.
  • the temperature sensor obtained by the above steps is formed by externally encapsulating the package case 60 on one end with the chip, and sequentially injecting the thermal grease 71 and the composite potting material 72 into the package case 60.
  • the sealing material 72 securely encapsulates the temperature sensor prepared in the first embodiment in the package casing 60. Therefore, the temperature sensor of the embodiment has higher shear strength and impact toughness than the temperature sensor of the embodiment 1, and The compactness is better, and the performance of cold resistance, heat resistance and moisture resistance is further improved.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
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Abstract

一种防水防潮的温度传感器的制作方法，包括步骤：1）裁线：按设定线长尺寸裁剪长度一致的TPU电子线（40）；2）芯片焊接：在TPU电子线（40）的一端焊接一带有测温功能的芯片（10）；3）环氧树脂包封：将调配好的环氧树脂包封料包封芯片（10）和外露的导线，并加热固化；4）TPU包封：配置液态TPU包封料，在步骤3）形成的环氧树脂层（20）外包封一层液态TPU包封料，并固化形成TPU内封装层（30），然后再在TPU内封装层（30）外包封一层液态TPU包封料并固化形成TPU外封装层（50）。通过TPU封装使制得的温度传感器具有抗寒耐热、防水防潮、耐磨耐油、耐老化的性能，并具有较高的剪切强度和冲击韧性，电性能可靠稳定。

Description

防水防潮的温度传感器的制作方法及其制得的温度传感器 技术领域
本发明涉及一种电子元器件的制作方法，尤其涉及一种防水防潮的温度传感器的制作方法及其制得的温度传感器。
背景技术
采用测温元件作为核心部件，采取不同封装形式构成的温度传感器广泛应用于各种温度探测、温度控制电路，其在电路中起到将温度的变量转化成所需的电子信号的核心作用。
请参阅图1，其为现有技术的温度传感器的结构示意图。现有的温度传感器通过按照以下步骤制得：
(1)将具有测温功能的芯片1焊接在电子线4上；
(2)用调配好的环氧树脂将焊接在电子线4上的芯片1先包封一次并加热固化，环氧树脂封装层2，然后再包封一次并加热固化，形成环氧树脂外封装层3。
按照上述步骤封装而成的温度传感器，具有以下缺陷：
1)环氧树脂和电子线4的附着力不好，当产品长久受到冷热冲击时，环氧树脂和电子线4间会产生缝隙导致浸水，使产品电性能不稳定，甚至损坏；
2)抗撕裂性不好，屈拢强度差；
3)电子线4的绝缘层致密性不好；
4)环氧树脂的致密性也较差。
发明内容
为了解决上述技术问题，本发明提供了一种制作方法简单、生产效率高、成本低、易于实现大批量生产的防水防潮的温度传感器的制作方法。
本发明所采用的技术方案是：
一种防水防潮的温度传感器的制作方法，包括以下步骤：
(1)裁线：按设定线长尺寸裁剪长度一致的TPU电子线；
(2)芯片焊接：在TPU(Thermoplastic polyurethane:热塑性聚氨酯)电子线一端焊接一带有测温功能的芯片；
(3)环氧树脂包封：将调配好的环氧树脂包封料包封所述芯片和外露的导线，并加热固化；所述环氧树脂包封料与现有的环氧树脂包封料相同；
(4)TPU包封：配制液态TPU包封料，并在步骤3)形成的环氧树脂层外包封一层液态TPU包封料，并固化形成TPU内封装层；然后再在TPU内封装层外包封一层液态TPU包 封料，并固化形成TPU外封装层。
相比于现有技术，本发明所述的防水防潮的温度传感器的制作方法，通过TPU封装，使制得的温度传感器具有抗寒耐热、防水防潮、耐磨、耐油、耐老化的性能，且其具有较高的剪切强度和冲击韧性，电性能可靠稳定。
进一步地，所述步骤(4)中的液态TPU包封料由以下份数的各组分组成：
TPU主剂      100份
固化剂       15～46份
稀释剂       0～20份
所述TPU主剂由单组份TPU颗粒溶于THF(四氢呋喃)中制得，所述TPU颗粒与THF的质量比为1:2～1:1。优选地，所述稀释剂选用环保有机复合溶剂。在TPU主剂中添加固化剂，可使液态TOU包封料形成的TPU封装层具有耐溶剂、高附着力、耐水洗、耐腐蚀、反应快、硬度高的性能；在TPU主剂中添加稀释剂，可增加液态包封料的流动性，便于控制涂层的厚薄和均匀，且环保有机复合溶剂的使用也使产品更为环保。
进一步地，所述单组份TPU颗粒在溶于THF前在80～110℃下干燥约3小时。
进一步地，所述步骤(4)中通过在室温下固化6～8小时形成TPU内封装层和TPU外封装层。
进一步地，作为另一可选的固化方式，所述步骤(4)中通过在80～90℃下烘烤固化2～3小时形成TPU内封装层和TPU外封装层。
进一步地，所述防水防潮的温度传感器的制作方法还包括以下步骤：
(5)在封装壳内底部注入导热树脂；使温度传感器和封装壳能够高效地传导热量；
(6)将步骤(4)制得的温度传感器放入封装壳内；
(7)配制复合灌封料；
(8)将复合灌封料注入封装壳内；
(9)烘烤固化。
通过复合灌封料的灌封，可使温度传感器被牢固地封装于封装壳内，不易脱落。
进一步地，所述步骤(7)中的复合灌封料由以下质量百分比的各组分混合而成：
液态TPU灌封料           30％～70％
液态环氧树脂灌封料      30％～70％
所述液态TPU灌封料由以下份数的各组分组成：
TPU主剂      100份
固化剂       15～46份
稀释剂       0～20份
所述TPU主剂由单组份TPU颗粒溶于THF中制得，所述TPU颗粒与THF的质量比为1:2～1:1。
所述液态环氧树脂灌封料为常规使用的灌封料，其通常由100份的环氧树脂主剂、20～22份的中温固化剂和6～8份的稀释剂混合后经过充分的搅拌和真空消泡制得。所述复合灌封料由所述液态TPU灌封料和液态环氧树脂灌封料混合后经过充分的搅拌和真空消泡制得。所述复合灌封料具有一定的硬度，且能与TPU电子线的绝缘层牢固地结合，有效地防止水分浸入而导致温度传感器的性能的异变。
进一步地，所述步骤(9)中通过在80～90℃下烘烤固化2～3小时制得温度传感器成品。
进一步地，所述封装壳靠近开口处向外凸起形成多个凸槽。该设置使复合灌封料固化后能够牢固地嵌入凸槽内，从而保证温度传感器在封装壳内被牢固封装、不易脱落。
本发明还提供一种防水防潮的温度传感器，其根据上述的防水防潮的温度传感器的制作方法制作而成。
相比于现有技术，本发明所述的防水防潮的温度传感器，具有抗寒耐热、防水防潮、耐磨、耐油、耐老化的性能，且其具有较高的剪切强度和冲击韧性，电性能可靠稳定。
为了更好地理解和实施，下面结合附图详细说明本发明。
附图说明
图1是现有技术的温度传感器的结构示意图；
图2是本发明的实施例1所述的温度传感器的结构示意图；
图3是本发明的实施例2所述的温度传感器的结构示意图。
具体实施方式
实施例1
请参阅图2，其为本实施例所述的温度传感器的结构示意图。本实施例的防水防潮的温度传感器按照以下步骤制得：
(1)裁线：按设定线长尺寸裁剪长度一致的TPU电子线40；
(2)芯片焊接：在TPU电子线40一端焊接一带有测温功能的芯片10；
(3)环氧树脂包封：将调配好的环氧树脂包封料包封所述芯片和外露的导线，并加热固化，形成环氧树脂封装层20；所述环氧树脂包封料与现有的环氧树脂包封料相同；
(4)TPU包封：配制液态TPU包封料，并在步骤3)形成的环氧树脂层外包封一层液态TPU包封料，并固化形成TPU内封装层30；然后再在TPU内封装层外包封一层液态TPU 包封料，并固化形成TPU外封装层50。所述TPU内封装层30和TPU外封装层50通过在室温下固化6～8小时或在80～90℃下烘烤固化2～3小时形成。
所述液态TPU包封料由以下份数的各组分组成：
TPU主剂      100份
固化剂       15～46份
稀释剂       0～20份
所述TPU主剂由单组份TPU颗粒溶于THF(四氢呋喃)中制得，所述TPU颗粒与THF的质量比为1:2～1:1。所述单组份TPU颗粒在溶于THF前在80～110℃下干燥约3小时。优选地，所述稀释剂选用环保有机复合溶剂。在TPU主剂中添加固化剂，可使液态TOU包封料形成的TPU封装层具有耐溶剂、高附着力、耐水洗、耐腐蚀、反应快、硬度高的性能；在TPU主剂中添加稀释剂，可增加液态包封料的流动性，便于控制涂层的厚薄和均匀，且环保有机复合溶剂的使用也使产品更为环保。
相比于现有技术，本发明所述的防水防潮的温度传感器的制作方法，通过TPU封装在环氧树脂封装层20外依次形成TPU内封装层和TPU外封装层，使制得的温度传感器具有抗寒耐热、防水防潮、耐磨、耐油、耐老化的性能，且其具有较高的剪切强度和冲击韧性，电性能可靠稳定。
通过上述步骤制得的温度传感器，包括芯片10、一端与芯片10焊接的TPU电子线40、包封于芯片10及外露导线外的环氧树脂封装层20、包封于环氧树脂封装层20外的TPU内封装层30，以及包封于TPU内封装层30外的TPU外封装层50。
对本实施例制得的温度传感器进行一系列测试，结果如下：
1)电子线40与TPU外封装层50结合部弯折实验后过镜检测，无剥离现象；
2)冷热冲击实验后过镜检测也无剥离现象，电性能检测显示其性能变化率也在正常的范围内；
3)抗摔打实验过镜检测，电性能检测显示其性能变化率也在正常的范围内；
4)浸水和加压0.5Mpa后检测，温度传感器内部无潮湿和浸水现象。
实施例2
请参阅图3，其为本实施例所述的防水防潮的温度传感器的结构示意图。本实施例的防水防潮的温度传感器按照以下步骤制得：
(1)裁线：按设定线长尺寸裁剪长度一致的TPU电子线40；
(2)芯片焊接：在TPU电子线40一端焊接一带有测温功能的芯片10；
(3)环氧树脂包封：将调配好的环氧树脂包封料包封所述芯片和外露的导线，并加热固化，形成环氧树脂封装层20；所述环氧树脂包封料与现有的环氧树脂包封料相同；
(4)TPU包封：配制液态TPU包封料，并在步骤3)形成的环氧树脂层外包封一层液态TPU包封料，并固化形成TPU内封装层30；然后再在TPU内封装层外包封一层液态TPU包封料，并固化形成TPU外封装层50。所述TPU内封装层30和TPU外封装层50通过在室温下固化6～8小时或在80～90℃下烘烤固化2～3小时形成。
所述液态TPU包封料由以下份数的各组分组成：
TPU主剂      100份
固化剂       15～46份
稀释剂       0～20份
所述TPU主剂由单组份TPU颗粒溶于THF(四氢呋喃)中制得，所述TPU颗粒与THF的质量比为1:2～1:1。所述单组份TPU颗粒在溶于THF前在80～110℃下干燥约3小时。优选地，所述稀释剂选用环保有机复合溶剂。在TPU主剂中添加固化剂，可使液态TOU包封料形成的TPU封装层具有耐溶剂、高附着力、耐水洗、耐腐蚀、反应快、硬度高的性能；在TPU主剂中添加稀释剂，可增加液态包封料的流动性，便于控制涂层的厚薄和均匀，且环保有机复合溶剂的使用也使产品更为环保。
(5)在封装壳60内底部注入导热树脂71；所述封装壳60靠近开口处向外凸起形成多个凸槽61。该凸槽61的设置使复合灌封料固化后能够牢固地嵌入凸槽61内，从而保证温度传感器在封装壳内被牢固封装、不易脱落。
(6)将步骤(4)制得的温度传感器放入封装壳60内；
(7)配制复合灌封料；
所述复合灌封料由以下质量百分比的各组分混合而成：
液态TPU灌封料           30％～70％
液态环氧树脂灌封料      30％～70％
所述液态TPU灌封料由以下份数的各组分组成：
TPU主剂      100份
固化剂       15～46份
稀释剂       0～20份
所述TPU主剂由单组份TPU颗粒溶于THF中制得，所述TPU颗粒与THF的质量比为1:2～1:1。
所述液态环氧树脂灌封料为常规使用的灌封料，其通常由100份的环氧树脂主剂、20～22 份的中温固化剂和6～8份的稀释剂混合后经过充分的搅拌和真空消泡制得。所述复合灌封料由所述液态TPU灌封料和液态环氧树脂灌封料混合后经过充分的搅拌和真空消泡制得。所述复合灌封料具有一定的硬度，且能与TPU电子线的绝缘层牢固地结合，有效地防止水分浸入而导致温度传感器的性能的异变。
(8)将复合灌封料72注入封装壳内；
(9)在80～90℃下烘烤固化2～3小时。
通过上述步骤所制得的温度传感器，由于在带有芯片一端外部封装了所述封装壳60，并在封装壳60内依次注入导热硅脂71和复合灌封料72，经过固化后，复合灌封料72将实施例1制得的温度传感器牢固封装于封装壳60内，因此本实施例所述的温度传感器相比实施例1的温度传感器具有更高的剪切强度和冲击韧性，且其致密性更佳，抗寒耐热及防水防潮的性能得到进一步提高。
对本实施例制得的温度传感器进行一系列测试，结果如下：
1)电子线40与复合灌封料72结合部弯折实验后过镜检测，无剥离现象；
2)冷热冲击实验后过镜检测也无剥离现象，电性能检测显示其性能变化率也在正常的范围内；
3)抗摔打实验过镜检测，电性能检测显示其性能变化率也在正常的范围内；
4)浸水和加压0.5Mpa后检测，温度传感器内部无潮湿和浸水现象。
本发明并不局限于上述实施方式，如果对本发明的各种改动或变形不脱离本发明的精神和范围，倘若这些改动和变形属于本发明的权利要求和等同技术范围之内，则本发明也意图包含这些改动和变形。

Claims (10)

  1. 一种防水防潮的温度传感器的制作方法，其特征在于包括以下步骤：
    (1)裁线：按设定线长尺寸裁剪长度一致的TPU电子线；
    (2)芯片焊接：在TPU电子线一端焊接一带有测温功能的芯片；
    (3)环氧树脂包封：将调配好的环氧树脂包封料包封所述芯片和外露的导线，并加热固化；
    (4)TPU包封：配制液态TPU包封料，并在步骤3)形成的环氧树脂层外包封一层液态TPU包封料，并固化形成TPU内封装层；然后再在TPU内封装层外包封一层液态TPU包封料，并固化形成TPU外封装层。
  2. 根据权利要求1所述的防水防潮的温度传感器的制作方法，其特征在于：所述步骤(4)中的液态TPU包封料由以下份数的各组分组成：
    TPU主剂      100份
    固化剂       15～46份
    稀释剂       0～20份
    所述TPU主剂由单组份TPU颗粒溶于THF中制得，所述TPU颗粒与THF的质量比为1:2～1:1。
  3. 根据权利要求2所述的防水防潮的温度传感器的制作方法，其特征在于：所述单组份TPU颗粒在溶于THF前在80～110℃下干燥约3小时。
  4. 根据权利要求1所述的防水防潮的温度传感器的制作方法，其特征在于：所述步骤(4)中通过在室温下固化6～8小时形成TPU内封装层和TPU外封装层。
  5. 根据权利要求1所述的防水防潮的温度传感器的制作方法，其特征在于：所述步骤(4)中通过在80～90℃下烘烤固化2～3小时形成TPU内封装层和TPU外封装层。
  6. 根据权利要求1～5任一项所述的防水防潮的温度传感器的制作方法，其特征在于：还包括以下步骤：
    (5)在封装壳内底部注入导热树脂；
    (6)将步骤(4)制得的温度传感器放入封装壳内；
    (7)配制复合灌封料；
    (8)将复合灌封料注入封装壳内；
    (9)烘烤固化。
  7. 根据权利要求6所述的防水防潮的温度传感器的制作方法，其特征在于：所述步骤(7) 中的复合灌封料由以下质量百分比的各组分混合而成：
    液态TPU灌封料         30％～70％
    液态环氧树脂灌封料    30％～70％
    所述液态TPU灌封料由以下份数的各组分组成：
    TPU主剂    100份
    固化剂     15～46份
    稀释剂     0～20份
    所述TPU主剂由单组份TPU颗粒溶于THF中制得，所述TPU颗粒与THF的质量比为1:2～1:1。
  8. 根据权利要求6所述的防水防潮的温度传感器的制作方法，其特征在于：所述步骤(9)中通过在80～90℃下烘烤固化2～3小时制得温度传感器成品。
  9. 根据权利要求6～8任一项所述的防水防潮的温度传感器的制作方法，其特征在于：所述封装壳靠近开口处向外凸起形成多个凸槽。
  10. 一种防水防潮的温度传感器，其特征在于：根据权利要求1～9任一项所述的防水防潮的温度传感器的制作方法制作而成。
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