WO2017110755A1 - Composition de matériau réfléchissant la lumière comprenant de l'amméline - Google Patents

Composition de matériau réfléchissant la lumière comprenant de l'amméline Download PDF

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Publication number
WO2017110755A1
WO2017110755A1 PCT/JP2016/087831 JP2016087831W WO2017110755A1 WO 2017110755 A1 WO2017110755 A1 WO 2017110755A1 JP 2016087831 W JP2016087831 W JP 2016087831W WO 2017110755 A1 WO2017110755 A1 WO 2017110755A1
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Prior art keywords
resin
light
material composition
reflecting material
reflector
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PCT/JP2016/087831
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English (en)
Japanese (ja)
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憲明 長濱
雅人 齊藤
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日産化学工業株式会社
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Priority to JP2017558127A priority Critical patent/JPWO2017110755A1/ja
Publication of WO2017110755A1 publication Critical patent/WO2017110755A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to a light reflector composition containing ammeline.
  • An LED element which is one of semiconductor light emitting devices, is beginning to be used as a light source such as an indicator lamp because it is small in size, has a long life, and is excellent in power saving.
  • LED elements having higher luminance have been manufactured at a relatively low cost, and therefore, LED elements have been widely studied for use as light sources to replace fluorescent lamps and incandescent lamps.
  • a plurality of LED elements are arranged on a surface-mounted LED package, that is, a metal substrate (LED mounting substrate) such as aluminum.
  • a method of arranging a reflector (reflector) that reflects light in a predetermined direction around each LED element is often used.
  • a white pigment having a high hiding power so as not to transmit light and having a uniform light reflectivity in all visible light regions is used for the reflector.
  • Such white pigments generally include titanium dioxide (also simply referred to as titanium oxide), zinc oxide, magnesium oxide, alumina, etc., but from the viewpoint of light reflection characteristics, chemical resistance, processability, and cost. Titanium oxide is often used.
  • the reflector comprised with the white thermosetting resin composition containing an olefin resin, a white pigment, and alkoxysilane, for example is proposed (patent document 1).
  • the present invention takes this situation into consideration, and is a light reflection capable of producing a light reflector having high reflection characteristics not only for light in the visible light region but also for ultraviolet light having a wavelength of 400 nm or less.
  • An object is to provide a material composition.
  • the present inventors have added ammelin to a composition containing a resin, and the resulting light reflector is capable of producing ultraviolet light having a wavelength of 400 nm or less.
  • the present inventors have found that it has high reflection characteristics and have completed the present invention.
  • this invention relates to the light reflection material composition containing ammeline and resin as a 1st viewpoint.
  • the present invention relates to the light reflecting material composition according to the first aspect, wherein the resin is a heat-resistant resin having a 5% weight loss temperature of 200 ° C. or higher.
  • the heat-resistant resin is at least one selected from the group consisting of a polyolefin resin, a cyclic olefin resin, a polyamide resin, a polyester resin, a liquid crystal polymer, a silicone resin, an epoxy resin, and a curable acrylic resin. It is related with the light-reflecting material composition as described in a viewpoint.
  • the said heat resistant resin is related with the light-reflecting material composition as described in a 3rd viewpoint which is at least 1 type chosen from the group which consists of polyolefin resin, a polyamide resin, and an epoxy resin.
  • the heat resistant resin is polyethylene, polypropylene, poly (4-methyl-1-pentene), polyamide 46, polyamide 6T, polyamide 9T, bisphenol type epoxy resin, alicyclic epoxy resin, and isocyanurate. It is related with the light-reflecting material composition as described in a 4th viewpoint which is at least 1 type chosen from the group which consists of a type
  • the light reflecting material according to any one of the first to fifth aspects wherein the ammelin is in the form of particles and the average particle diameter of the particles is 0.1 to 100 ⁇ m. Relates to the composition.
  • the light reflecting material composition according to any one of the first to sixth aspects wherein the content of the ammelin particles is 1 to 300 parts by mass with respect to 100 parts by mass of the resin.
  • the light reflector which consists of a reflecting material composition as described in any one among a 1st viewpoint thru
  • a 9th viewpoint it is related with the light reflector as described in an 8th viewpoint whose light reflectance of wavelength 380nm is 80% or more.
  • an optical semiconductor element and a light reflector that reflects light from the optical semiconductor element provided around the optical semiconductor element in a predetermined direction are provided on a substrate, and the light reflector
  • the present invention relates to a semiconductor light emitting device in which at least a part of the light reflecting surface is formed of the light reflector according to the eighth aspect or the ninth aspect.
  • a light-reflecting material composition capable of producing a light reflector having high reflection characteristics not only for light in the visible light region but also for ultraviolet light having a wavelength of 400 nm or less. it can.
  • a light reflector having high reflection characteristics not only for light in the visible light region but also for ultraviolet light having a wavelength of 400 nm or less, and a semiconductor light emitting device including the light reflector. Can do.
  • FIG. 6 is a graph showing the reflectance in the wavelength region of 300 to 800 nm of the light reflecting material compositions of Examples 2 and 3 and Comparative Example 3.
  • the light reflecting material composition of the present invention contains ammeline and a resin.
  • ammelin as a white pigment that produces light reflection performance, it is possible to obtain a light reflecting material composition capable of producing a light reflector having high reflection characteristics even for ultraviolet light having a wavelength of 400 nm or less.
  • the heat resistant resin used in the present invention refers to a resin having a 5% weight loss temperature of 200 ° C. or higher.
  • heat resistant resins examples include epoxy resins, acrylic resins, curable acrylic resins, urethane resins, silicone resins, polysiloxane-organic block copolymers, polysiloxane-organic graft copolymers, and carbon-carbon double bonds that are reactive with SiH groups.
  • organic-inorganic hybrid resin cyanate ester resin, phenol resin, bismaleimide resin, polycarbonate resin, polyolefin resin, olefin-maleimide resin, cyclic olefin resin, polyester resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, poly Ether resin, polyoxybenzylene resin, polyphenylene ether resin, polyetheretherketone resin, polyetherketoneketone resin, polyetherimide resin, polyamide Fat, polyimide resin, polyimide amide resin, polyarylate resin, polyvinyl acetal resin, polystyrene resin, fluorine resin, rubber resin, liquid crystal polymer, and the like.
  • polyolefin resin, cyclic olefin resin, polyamide resin, polyester resin, liquid crystal polymer, silicone resin, epoxy resin, and curable acrylic resin are preferable, and polyolefin resin, polyamide resin, and epoxy resin are more preferable.
  • polystyrene resin examples include polyethylene (PE), high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), very low density polyethylene (VLDPE), Examples thereof include ultra high molecular weight polyethylene (UHMWPE), cross-linked polyethylene (PEX), polypropylene (PP), and poly (4-methyl-1-pentene).
  • PE polyethylene
  • HDPE high density polyethylene
  • MDPE medium density polyethylene
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • VLDPE very low density polyethylene
  • UHMWPE ultra high molecular weight polyethylene
  • PEX cross-linked polyethylene
  • PP polypropylene
  • poly (4-methyl-1-pentene examples include poly (4-methyl-1-pentene).
  • ethylene and other comonomers copolymerizable with ethylene for example, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl
  • Polymers, propylene, and other comonomers copolymerizable with propylene eg, ethylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4- ⁇ -O, such as methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-octadecene, 1-eicosene Block copolymer or random copolymer with olefin, vinyl acetate, vinyl alcohol, etc.), 4-methyl-1-pentene, and other comonomers copolymerizable with 4-methyl-1-pentene (for example, ethylene, Propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-o
  • Examples of the cyclic olefin resin include a ring-opening polymer of a monomer having a norbornene structure, a ring-opening polymer of a monomer having a norbornene structure and another monomer, and a monomer having a norbornene structure.
  • Examples thereof include addition polymers, addition polymers of monomers having a norbornene structure and other monomers, hydrides of these ring-opening polymers or addition polymers, and the like.
  • the polyamide resin for example, a polymer of a structural unit whose main chain is an amide bond, for example, by polymerizing lactam, or by polycondensing a salt of aminocarboxylic acid or diamine and dicarboxylic acid, Alternatively, it can be obtained by polycondensation of a diamine and a dicarboxylic acid derivative.
  • aliphatic polyamides such as polyamide 6, polyamide 66, and polyamide 46
  • semi-aromatic polyamides such as polyamide 4T, polyamide 6T, polyamide 6I, polyamide 9T, polyamide 10T, and polyamide M5T
  • polyamide 66, polyamide 46, polyamide 6T, and polyamide 9T are preferable from the viewpoint of heat resistance.
  • polyester resin examples include polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), and the like.
  • PET polyethylene terephthalate
  • PBT polytrimethylene terephthalate
  • PBT polybutylene terephthalate
  • PEN polyethylene naphthalate
  • PBN polybutylene naphthalate
  • polyethylene terephthalate and polyethylene naphthalate are preferable from the viewpoint of durability and the like.
  • liquid crystal polymers examples include polycondensates of p-hydroxybenzoic acid and ethylene terephthalate, polycondensates of p-hydroxybenzoic acid and 4,4-dihydroxybiphenol terephthalate, p-hydroxybenzoic acid and 2,6-hydroxynaphthoate. Examples thereof include polycondensates with acids.
  • the silicone resin is not particularly limited as long as the main chain is a polymer having a structural unit composed of a siloxane bond, and examples thereof include dimethyl silicone and methylphenyl silicone.
  • the epoxy resin is not particularly limited as long as it is a compound having two or more epoxy groups in the molecule.
  • bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin and the like.
  • examples thereof include an epoxy resin, a xylene-phenol resin type epoxy resin, a naphthalene type epoxy resin, and an isocyanurate type epoxy resin.
  • bisphenol type epoxy resins, alicyclic epoxy resins, and isocyanurate type epoxy resins are preferable.
  • curable acrylic resin examples include epoxy-modified acrylic resins obtained by adding acrylic acid to epoxy groups such as bisphenol A-type epoxy resins and novolak-type epoxy resins, epoxy acrylate resins such as epoxy-modified acrylic oligomers having alkylene oxide groups, and urethane. Examples thereof include acrylate and polyester acrylate.
  • These heat resistant resins may be used alone or in combination of two or more.
  • ammelin is used in order for the light reflector obtained from the light reflecting material composition to exhibit high reflection characteristics even for ultraviolet light having a wavelength of 400 nm or less.
  • Ammeline also acts as a flame retardant and can be expected to improve the flame retardancy of the light reflector.
  • the production method of ammelin (4,6-diamino-2-hydroxy-1,3,5-triazine) used in the present invention includes a method of thermally decomposing urea, a method of reacting dicyandiamide (DICY) with biuret, trichloro
  • a method of reacting ammonia and water with triazine, a method of hydrolyzing melamine, a method of aminating cyanuric acid and the like are known, but are not particularly limited, and any method obtained by any method may be used. Moreover, what is marketed can also be used. In any of the ammelins, it is desirable to remove components that cause coloring in advance.
  • Ammeline used in the present invention may contain impurities such as unreacted products and by-products when producing ammeline as long as the light reflection performance is not impaired.
  • the purity of ammelin is preferably as high as possible, usually 80% or more, preferably 90% or more, and more preferably 95% or more.
  • Ammeline used in the present invention is preferably used in the form of particles from the viewpoint of more uniformly dispersing in the resin.
  • the average particle diameter of the ammelin particles is desirably 100 ⁇ m or less, preferably 0.1 to 50 ⁇ m, more preferably 0.5 to 20 ⁇ m from the viewpoint of dispersibility in the resin. By setting it as the said range, ammelin particle
  • the average particle diameter ( ⁇ m) is a 50% volume diameter (median diameter) obtained by measurement by a laser diffraction / scattering method based on the Mie theory.
  • Ammelin is desirably blended in an amount of 1 to 300 parts by weight, preferably 1 to 100 parts by weight, more preferably 1 to 50 parts by weight, based on 100 parts by weight of the resin.
  • a light reflection effect can be obtained if it is 1 part by mass or more, and by setting it to 300 parts by mass or less, the original properties of the resin (for example, moldability, heat resistance, impact resistance) Property, adhesiveness).
  • Ammelin may be hydrophobized from the viewpoint of improving dispersibility.
  • Representative examples of the hydrophobizing agent include silane, silane coupling agent, silicone oil, fatty acid, fatty acid metal salt, and the like.
  • a silane coupling agent and silicone oil are preferably used because they have a high effect of improving dispersibility.
  • silane examples include chlorosilanes such as chlorotrimethylsilane, dichlorodimethylsilane, trichloro (methyl) silane, and benzyl (chloro) dimethylsilane; methoxytrimethylsilane, dimethoxydimethylsilane, diethoxydimethylsilane, trimethoxy (methyl) silane, and triethoxy.
  • chlorosilanes such as chlorotrimethylsilane, dichlorodimethylsilane, trichloro (methyl) silane, and benzyl (chloro) dimethylsilane
  • methoxytrimethylsilane dimethoxydimethylsilane
  • diethoxydimethylsilane diethoxydimethylsilane
  • trimethoxy (methyl) silane examples include triethoxy.
  • (Methyl) silane n-butyltrimethoxysilane, isobutyltrimethoxysilane, n-hexadecyltrimethoxysilane, trimethoxy (n-octadecyl) silane, alkoxysilane such as trimethoxy (phenyl) silane; disilazane such as hexamethyldisilazane A cyclic silazane and the like.
  • silane coupling agents include allyl (chloro) dimethylsilane, trimethoxy (vinyl) silane, triethoxy (vinyl) silane, triacetoxy (vinyl) silane, hydroxypropyltrimethoxysilane, 3- (meth) acryloyloxypropyltri Methoxysilane, N- (2-aminoethyl) -3-aminopropyl (methyl) dimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, trimethoxy (N -Phenyl-3-aminopropyl) silane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane and the like.
  • silicone oil include dimethylpolysiloxane, methylhydrogenpolys
  • hydrophobizing agents may be used alone or in combination of two or more.
  • the method for hydrophobizing ammelin is not particularly limited as long as it is a conventionally known method, and examples thereof include a dry method and a wet method. Specifically, a dry method in which a hydrophobizing agent is dropped or sprayed while stirring ammelin at high speed; a wet method in which the hydrophobizing agent is dissolved in an organic solvent, and ammeline is added while stirring the organic solvent. The method is mentioned.
  • additives generally added as necessary, for example, other pigments, dyes, glass fibers, inorganic additives (unless the effects of the present invention are impaired)
  • flame retardant, flame retardant aid smoke reducing agent, heat resistant agent, weathering agent, antioxidant, wetting agent,
  • a dispersant, a lubricant, a release agent, a thickener, a plasticizer, a nucleating agent, a crosslinking agent, a foaming agent, an antifoaming agent, a conductive material, an antistatic agent, an antifungal / antibacterial agent, and the like may be appropriately blended.
  • the method of adding the ammelin to the resin is not particularly limited as long as it is a method that can be uniformly dispersed in the resin, and is performed by various known methods at any stage up to immediately before the final molded product is formed. Can do.
  • the simplest method is a method of mixing resin and ammelin, but this mixture may be melt-kneaded and extruded to form pellets. It is also possible to prepare a master pellet in which ammeline at a predetermined concentration or more is kneaded and to mix this with a dilution resin.
  • the mixture and pellets are variously molded by injection molding, extrusion molding, blow molding, compression molding, cast molding, transfer molding, vacuum molding, and the like. It may be supplied to a molding machine and molded according to a conventional method. However, in some cases, addition of ammelin to the resin can be performed by the molding machine.
  • the preferable aspect of the light reflector of this invention is a light reflector whose light reflectance of wavelength 380nm is 80% or more.
  • ⁇ Semiconductor light emitting device> An optical semiconductor element, and a light reflector that reflects light from the optical semiconductor element provided around the optical semiconductor element in a predetermined direction on a base material, and at least a light reflecting surface of the light reflector
  • a semiconductor light-emitting device partially composed of the light reflector of the present invention is also an object of the present invention.
  • Resin kneading apparatus Twin screw extruder HK-25D (Screw diameter; ⁇ 25 mm, L / D; 41, rotating in the same direction) manufactured by Parker Corporation Rotation speed: 200rpm Kneading temperature: 230 ° C
  • Injection molding equipment SE18DUZ manufactured by Sumitomo Heavy Industries, Ltd. Cylinder temperature: 280 ° C Mold temperature: 60 °C
  • Oven Device Advantech Toyo Co., Ltd. Vacuum constant temperature dryer DRV422DC (4) Heat resistance and light resistance test Device: Sigma Koki Co., Ltd. light irradiation system LED light source: Ushio Opto Semiconductor Co., Ltd.
  • EPITEX registered trademark
  • L420-66-60-110 peak wavelength 420 nm
  • Average particle diameter Apparatus Laser diffraction type particle size distribution measuring instrument Mastersizer 2000 manufactured by Malvern Instruments (6)
  • Light reflectance Device UV-Vis Near-Infrared Spectrophotometer UV-3600 manufactured by Shimadzu Corporation Measurement wavelength: 300-800nm (7)
  • Color measuring device Konica Minolta Japan Co., Ltd. spectrophotometer CM-3700A
  • PMP Polymethylpentene [TPX (registered trademark) RT-18 manufactured by Mitsui Chemicals, Inc.]
  • CEL 3,4-epoxycyclohexanecarboxylic acid (3,4-epoxycyclohexyl) methyl
  • MH700 4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride mixture (molar ratio 70:30)
  • PX4ET Tetrabutylphosphonium O, O-diethyl phosphorodithioate
  • Example 1 Comparative Examples 1 and 2
  • PMP 4.0 kg of PMP, which was preheated and dried at 100 ° C. for 12 hours from a main hopper of a twin screw extruder, and fillers listed in Table 1 from the C3 side feeder (ammelin and titanium oxide produced in Reference Example 1 [TIPAQUE manufactured by Ishihara Sangyo Co., Ltd.) (Registered trademark CR-90] or barium sulfate [manufactured by Kokusan Chemical Co., Ltd.] 1.8 kg was added and kneaded to prepare a light reflecting material composition (torque 42 to 52 N ⁇ m). Each composition was injection-molded to produce a light reflector test piece of 40 mm ⁇ 40 mm ⁇ thickness 2 mm. The light reflectance of each obtained test piece was measured. The results are shown in Table 1 and FIG.
  • Examples 2 and 3, Comparative Example 3 In 100 parts by mass of CEL, 131 parts by mass of MH700 as a curing agent (equal molar amount to the epoxy group of CEL), 1 part by mass of PX4ET as a curing accelerator, and the filler described in Table 1 (ammelin produced in Reference Example 1 or titanium oxide) [Ishihara Sangyo Co., Ltd. TIPAQUE (registered trademark) CR-90]) was added in the amount shown in Table 1. The mixture was defoamed by stirring at room temperature (approximately 23 ° C.) for 1 hour under reduced pressure to prepare a light reflecting material composition.
  • Table 1 ammelin produced in Reference Example 1 or titanium oxide
  • TIPAQUE registered trademark
  • Each composition was sandwiched between two glass substrates that had been subjected to release treatment with Optool (registered trademark) DSX (manufactured by Daikin Industries, Ltd.) together with a U-shaped silicone rubber spacer having a thickness of 3 mm. This was heated in an oven at 100 ° C. for 2 hours (preliminary curing), then heated to 150 ° C. and heated for 5 hours (main curing). After slow cooling, the glass substrate was removed to obtain each cured product having a thickness of 3 mm. This cured product was cut into a 40 mm ⁇ 20 mm rectangle to produce a 40 mm ⁇ 20 mm ⁇ 3 mm thick light reflector test piece. The light reflectance of each obtained test piece was measured. The results are shown in Table 1 and FIG.
  • the light reflectors (Examples 1 to 3) obtained from the light reflector composition containing ammeline of the present invention are light reflectors (comparative) Compared with Examples 1 and 3) and a light reflector (Comparative Example 2) containing barium sulfate, it was confirmed that the light reflectance at a wavelength of 400 nm or less was extremely high.
  • the light reflectors (Examples 4 and 5) obtained from the light reflecting material composition of the present invention are stable to light having a short wavelength of 420 nm at a high temperature, and L * , a It was confirmed that both * and b * hardly changed.
  • the light reflector (Comparative Example 4) containing titanium oxide it was confirmed that b * increased by light irradiation, that is, yellowishness increased and discolored.
  • the light reflecting material composition of the present invention can be suitably used as a light reflecting material for a semiconductor light-emitting device that reflects not only the visible light region but also the ultraviolet light region.

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Abstract

Le problème décrit par l'invention est de pourvoir à une composition de matériau réfléchissant la lumière avec lequel il est possible de produire un corps réfléchissant la lumière ayant des caractéristiques de réflexion élevées non seulement pour la lumière dans la région de lumière visible, mais également pour la lumière ultraviolette ayant une longueur d'onde inférieure ou égale à 400 nm. La solution de l'invention porte sur une composition de matériau réfléchissant la lumière comprenant de l'amméline et une résine.
PCT/JP2016/087831 2015-12-25 2016-12-19 Composition de matériau réfléchissant la lumière comprenant de l'amméline WO2017110755A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268810A (ja) * 1985-09-20 1987-03-28 Dainichi Color & Chem Mfg Co Ltd 紫外線反射性樹脂粒子およびその製造方法
JPS62169814A (ja) * 1986-01-22 1987-07-27 Dainichi Color & Chem Mfg Co Ltd 紫外線反射材料
WO2013008680A1 (fr) * 2011-07-13 2013-01-17 株式会社ダイセル Composition de résine époxy durcissable
JP2013166926A (ja) * 2012-01-17 2013-08-29 Dainippon Printing Co Ltd 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法
JP2015023101A (ja) * 2013-07-17 2015-02-02 大日本印刷株式会社 半導体発光装置、半導体発光装置用部品及びそれらの製造方法、並びに反射体、その製造方法及び反射体形成用組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268810A (ja) * 1985-09-20 1987-03-28 Dainichi Color & Chem Mfg Co Ltd 紫外線反射性樹脂粒子およびその製造方法
JPS62169814A (ja) * 1986-01-22 1987-07-27 Dainichi Color & Chem Mfg Co Ltd 紫外線反射材料
WO2013008680A1 (fr) * 2011-07-13 2013-01-17 株式会社ダイセル Composition de résine époxy durcissable
JP2013166926A (ja) * 2012-01-17 2013-08-29 Dainippon Printing Co Ltd 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法
JP2015023101A (ja) * 2013-07-17 2015-02-02 大日本印刷株式会社 半導体発光装置、半導体発光装置用部品及びそれらの製造方法、並びに反射体、その製造方法及び反射体形成用組成物

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