Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/293—Organic, e.g. plastic
  • H01L23/295—Organic, e.g. plastic containing a filler
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

• the present invention relates to an electrical device with a
• From DE102013112267A1 is a semiconductor module with a a
• the enveloping composition in this case has an additive which has a high thermal conductivity.
• Enveloping compound is at least partially enveloped, wherein the enveloping mass further comprises heat buffer particles, which are arranged in the cement paste and a Have particulate material or consist of a particulate material having a higher heat capacity than the cement of the cement paste.
• the present invention is further a method for producing an electrical device with an electrical component, which of a one
• Cement mass comprising encasing material is at least partially enveloped, comprising the following steps:
• Heat buffer particles have a particulate material or consist of a particulate material having a higher heat capacity than the cement paste of the cement paste;
• the subject of the present invention is also the use of a mass comprising a cement paste and heat buffer particles as encasing material for an electrical component of an electrical device, the heat buffer particles being arranged in the cement mass and having a particulate material or consisting of a particulate material having a higher heat capacity than the cement having the cement mass.
• the electrical component may, for example, a semiconductor component, a sensor element, an inductance, a capacitance, a battery cell, a battery module or a
• Circuitry be. Under an electrical component, however, in the context of the present invention, any active and passive component or
• the electrical device may in this case have a carrier substrate on which the electrical component is arranged.
• an inorganic, metal-free, hydraulic binder Under a cement can be understood in the context of the present invention, an inorganic, metal-free, hydraulic binder.
• the cement hardens in this case hydraulically, ie it takes a chemical reaction with water instead of formation stable, insoluble compounds.
• the cement may be formed at the beginning of the process or prior to hydration as finely ground powder, which reacts with water or addition of water with the formation of hydrates, solidifies and hardens.
• the hydrates can form needles and / or platelets, which interlock and thus lead to a high strength of the cement.
• a phosphate cement does not harden hydraulically.
• An acid-base reaction takes place to form a salt gel, which later solidifies to a mostly amorphous mass.
• H + hydrogen ions
• the cement may consist predominantly of calcium aluminates and form calcium aluminate hydrates during hydration. It is advantageous if the
• Cement composition has alumina cement, in particular consists of alumina cement.
• Alumina cement (abbreviated CAC) is regulated in accordance with DIN EN 14647 European.
• Alumina cement consists mainly of monocalcium aluminate (CaO * Al 2 O 3).
• the alumina cement may, for example, have the following composition:
• AI203 greater than or equal to 67.8% by weight
• SiO 2 less than or equal to 0.8% by weight
• Fe203 less than or equal to 0.4% by weight
• heat-buffer particles can be understood as meaning a particulate additive.
• the heat buffer particles are in this case designed to withstand the requirements of the heat treatment and stable in operation.
• the heat buffer particles may be powdered before the step of mixing into the cement paste.
• heat buffer particles can also have a liquid fraction. Accordingly, the heat buffer particles may be in the form of a solution or dispersion or suspension, for example with a water content.
• the heat buffer particles can be mixed in a dry cement paste or cement powder mixture, ie, if necessary, before the addition of water is added.
• the heat buffer particles can also be mixed into the wet cement paste or cement powder mixture, ie if necessary, the addition of water was added.
• the heat buffer particles can have a Have particle diameter d50 in the range of greater than or equal to 1 ⁇ to less than or equal to 600 ⁇ .
• an encapsulation compound can be understood as any type of encapsulation (packaging).
• the Umhüllmasse can as
• cement composite be formed. That is, in other words, that the encapsulant may comprise a cement matrix with a filler as well as the heat buffer particles.
• the coating composition may have the following composition:
• Binder alumina cement greater than or equal to 8% by weight to less than or equal to 47
• Reagent Water greater than or equal to 10 wt% to less than or equal to 28 wt%
• Heat buffer particles greater than or equal to 1 wt% to less than or equal to 13 wt%
• Filler greater than or equal to 25% by weight to less than or equal to 82% by weight
• the filler may be selected from the group consisting of:
• - AIN fine about 1 ⁇ or up to about 100 ⁇
• the heat-treating step may in the context of the present invention comprise a hydration step and / or setting step and / or drying step and / or curing step.
• the heat treatment may comprise a tempering step in a tempering furnace. The heat treatment can be done in one
• Umhüllmasse To tailor Umhüllmasse depending on the requirements and in particular to significantly increase the total thermal capacity of Umhüllmasse. That is, with others Words that not the thermal conductivity of Umhüllmasse should be increased to deliver the heat from the electrical component as quickly as possible to the environment, but rather by increasing the heat capacity a high
• Capacity can be made lower, depending on curing or load during operation, to achieve a specific optimum between the thermal conductivity and the heat capacity for the particular application and thus the
• an electrical device can be provided which is particularly robust at high
• the thermal capacity of alumina cement is 750-900 J / kgK.
• the particulate material is selected from the group consisting of: forsterite, cordierite, mullite. These materials or material groups have a very high heat capacity. In addition, they are stable at the desired application temperature. However, other ceramic materials and metallic or polymeric materials are conceivable, without departing from the scope of the invention.
• the proportion of the heat buffer particles is in a range from greater than or equal to 1% by weight to less than or equal to 13% by weight, based on the total weight of the coating compound.
• the heat buffer particles are arranged in the cement paste. Accordingly, the heat buffer particles are enveloped by the cement paste. in this connection the heat buffer particles are preferably distributed homogeneously in the cement paste. As a result of this measure, the amount of heat emitted by the electrical component can be released very well via the cement paste to the heat buffer particles or absorbed by the heat buffer particles.
• Fig. 1 is an illustration of an electrical device according to a
• Fig. 1 an electrical device according to the invention is shown, which is provided in its entirety by the reference numeral 10.
• the electrical device 10 has an electrical component 12.
• electrical component 12 is formed as a semiconductor device 12.
• the electrical component 12 is arranged on a carrier substrate 14. Between the electrical component 12 and the carrier substrate 14, a copper layer 16 is arranged.
• the copper layer 16 in this case has several functions, namely to improve the heat connection and removal, an electrical
• the electrical component 12 is connected via bonding wires 18 with him
• the carrier substrate 14 may, for example, as a plate
• Contacting the electrical component 12 may be integrated.
• Conductor tracks can also be on a surface of the carrier substrate 14
• the carrier substrate 14 may be formed into a chip.
• the electrical device 10 also has an encasing compound 20, which has a cement compound 22.
• the wrapping compound 20 or the cement compound 22 is formed as a glob top.
• the wrapping compound 20 or the cement compound 22 is arranged on the carrier substrate 14.
• the cement compound 22 in this case encloses the electrical component 12 on the surfaces which are uncovered by the carrier substrate 14. Accordingly, the electrical component 12 is completely enveloped by the carrier substrate 14 and the encasing compound 20.
• the cement compound 22 also also covers a part of the carrier substrate 14, via which it is firmly connected to the carrier substrate 14.
• the wrapping compound 20 or the cement paste 22 has a plurality of
• the heat buffer particles 24 are arranged distributed in the interior of the cement mass 22. Accordingly, the heat buffer particles 24 are enveloped by the cement paste 22. According to the invention
• Heat buffer particles 24 a particulate material, which has a higher
• Amount of heat 26 can thus be taken up particularly efficiently by the heat buffer particles 24.
• the heat buffer particles 24 can after recording slowly release the absorbed amount of heat 26 to the environment of the electrical device 10, so that prevents the
• Envelope 20 and the electrical component 12 to reach a critical temperature and thereby damaged. Accordingly, it is possible according to the invention to achieve a very high thermal overload capacity and thereby to ensure safe operation and protection of the electrical component 12 from overheating, in particular during power loss peaks.
• cement material 22 for example, provided in powder form.
• the heat buffer particles 24 which may, for example, also be present in powder form, then mixed.
• a liquid component for example. Water is mixed with possibly the flux Melflux.
• the wet encapsulant 20 comprising the cement paste 22, the heat buffer particles 24 and the water is then evacuated, applied to the electrical component 12 and brought into shape, eg. By injection molding or casting into molds.
• the Umhüllmasse 20 is heat treated or tempered, for example. At 60 ° C and 90% relative humidity, whereby a
• the wrapping compound 20 is optionally treated with the heat buffer particles 24, then removed from the mold and removed, for example at 300 ° C.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Powder Metallurgy (AREA)
• Adhesives Or Adhesive Processes (AREA)

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Citations (8)

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• 2015
  • 2015-11-26 DE DE102015223467.3A patent/DE102015223467A1/de active Pending
• 2016
  • 2016-11-17 CN CN201680069309.3A patent/CN108292633B/zh active Active
  • 2016-11-17 WO PCT/EP2016/077922 patent/WO2017089209A1/de active Application Filing
  • 2016-11-17 KR KR1020187014849A patent/KR102578323B1/ko active IP Right Grant

Patent Citations (8)

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