KR102578323B1 - 피복 재료를 구비한 전기 장치 - Google Patents

피복 재료를 구비한 전기 장치 Download PDF

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Publication number
KR102578323B1
KR102578323B1 KR1020187014849A KR20187014849A KR102578323B1 KR 102578323 B1 KR102578323 B1 KR 102578323B1 KR 1020187014849 A KR1020187014849 A KR 1020187014849A KR 20187014849 A KR20187014849 A KR 20187014849A KR 102578323 B1 KR102578323 B1 KR 102578323B1
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KR
South Korea
Prior art keywords
weight
heat
covering material
cement
buffering particles
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KR1020187014849A
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English (en)
Korean (ko)
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KR20180088816A (ko
Inventor
턀프 피르크
??프 피르크
펠릭스 슈테빙
페트라 슈테딜레
Original Assignee
로베르트 보쉬 게엠베하
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Publication of KR20180088816A publication Critical patent/KR20180088816A/ko
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Publication of KR102578323B1 publication Critical patent/KR102578323B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020187014849A 2015-11-26 2016-11-17 피복 재료를 구비한 전기 장치 KR102578323B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015223467.3 2015-11-26
DE102015223467.3A DE102015223467A1 (de) 2015-11-26 2015-11-26 Elektrische Vorrichtung mit einer Umhüllmasse
PCT/EP2016/077922 WO2017089209A1 (de) 2015-11-26 2016-11-17 Elektrische vorrichtung mit einer umhüllmasse

Publications (2)

Publication Number Publication Date
KR20180088816A KR20180088816A (ko) 2018-08-07
KR102578323B1 true KR102578323B1 (ko) 2023-09-15

Family

ID=57348661

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014849A KR102578323B1 (ko) 2015-11-26 2016-11-17 피복 재료를 구비한 전기 장치

Country Status (4)

Country Link
KR (1) KR102578323B1 (zh)
CN (1) CN108292633B (zh)
DE (1) DE102015223467A1 (zh)
WO (1) WO2017089209A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018214641B4 (de) * 2018-08-29 2022-09-22 Robert Bosch Gmbh Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse
DE102018215694A1 (de) 2018-09-14 2020-03-19 Robert Bosch Gmbh Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030157342A1 (en) 2002-02-15 2003-08-21 Myers Bruce A. Thermally-capacitive phase change encapsulant for electronic devices
US20130277867A1 (en) 2011-01-28 2013-10-24 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for sealing, and electronic component device
DE102013112267A1 (de) 2013-11-07 2015-05-07 Heraeus Deutschland GmbH & Co. KG Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514413A1 (de) * 1965-03-11 1969-06-12 Siemens Ag Verfahren zum Herstellen von vorzugsweise temperaturbestaendigen Halbleiterbauelementen
US4358552A (en) * 1981-09-10 1982-11-09 Morton-Norwich Products, Inc. Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity
US5945217A (en) * 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes
US7187019B2 (en) * 2003-09-26 2007-03-06 Sony Corporation Solid state image pickup device and method of fabricating the same
DE102006007781B4 (de) * 2006-02-20 2008-09-25 Refratechnik Holding Gmbh Grobkeramischer feuerfester Versatz sowie feuerfestes Erzeugnis daraus
CN101925657B (zh) * 2008-01-25 2013-06-26 富士通株式会社 热容量控制材料和部件安装方法
US8035226B1 (en) * 2008-06-05 2011-10-11 Maxim Integrated Products, Inc. Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core
EP2699631A4 (en) * 2011-04-14 2015-01-21 Ada Technologies Inc THERMAL INTERFACE MATERIALS AND SYSTEMS AND DEVICES CONTAINING SAME
JP2012136022A (ja) * 2012-01-04 2012-07-19 Jnc Corp 放熱部材、電子デバイスおよびバッテリー
CN103650238A (zh) * 2013-03-22 2014-03-19 深圳首创光伏有限公司 太阳能电池正面电极导电浆料及其制备方法
KR20150085384A (ko) * 2014-01-15 2015-07-23 삼성전자주식회사 반도체 패키지 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030157342A1 (en) 2002-02-15 2003-08-21 Myers Bruce A. Thermally-capacitive phase change encapsulant for electronic devices
US20130277867A1 (en) 2011-01-28 2013-10-24 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for sealing, and electronic component device
DE102013112267A1 (de) 2013-11-07 2015-05-07 Heraeus Deutschland GmbH & Co. KG Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse

Also Published As

Publication number Publication date
CN108292633B (zh) 2020-12-22
DE102015223467A1 (de) 2017-06-01
KR20180088816A (ko) 2018-08-07
WO2017089209A1 (de) 2017-06-01
CN108292633A (zh) 2018-07-17

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