WO2017082559A1 - 자가변형 플렉서블 필름 및 이의 제조 방법 - Google Patents
자가변형 플렉서블 필름 및 이의 제조 방법 Download PDFInfo
- Publication number
- WO2017082559A1 WO2017082559A1 PCT/KR2016/012243 KR2016012243W WO2017082559A1 WO 2017082559 A1 WO2017082559 A1 WO 2017082559A1 KR 2016012243 W KR2016012243 W KR 2016012243W WO 2017082559 A1 WO2017082559 A1 WO 2017082559A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shape memory
- substrate
- memory alloy
- self
- photosensitive agent
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0308—Shape memory alloy [SMA]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Definitions
- the present invention relates to a self-deformable flexible film and a method of manufacturing the same, and more particularly, a self-deformation that can improve the deformation characteristics of the flexible electronic device while being coupled to a flexible electronic device such as a flexible display, a flexible solar cell, a flexible touch panel, and the like.
- the present invention relates to a flexible film and a method of manufacturing the same.
- flexible electronic devices are one of the technologies that can lead the electronics industry in line with the socio-cultural demand for new forms of technologies and services that can improve the quality of human life in the future, such as medical health, safety, energy, and environmental problems. It is recognized.
- the flexible electronic device is a future-oriented technology, which can be regarded as a human-friendly technology that can change and develop a straight line technology into a curve technology and a two-dimensional technology into a three-dimensional technology.
- the self-deforming flexible film which constitutes a flexible electronic device capable of self-deformation, is manufactured in a form in which a flexible substrate and a shape memory alloy are combined.
- the shape memory alloy is also bent.
- the shape memory alloy also bends and at the same time creates tension.
- the shape memory alloy has a property of restoring to a stored shape at a specific temperature even after deformation occurs.
- the present embodiment aims to provide a self-deforming flexible electronic device having excellent self-deforming flexible characteristics through the structure of a self-deforming flexible film that can increase the strain of the shape memory alloy.
- the self-deforming flexible film according to the embodiment is a flexible electronic device is bonded, a substrate having a flexible property; A shape memory alloy provided on one side of the substrate; And a photosensitizer for fixing the shape memory alloy to the substrate, wherein the shape memory alloy is arranged on the substrate in the form of a plurality of lines, and a plurality of the photosensitizers are disposed along an extension direction of each shape memory alloy;
- the shape memory alloy may be fixed inside the photosensitive agent while being spaced apart from the substrate by a predetermined distance.
- the photoresist may have a hexahedral shape, and may be patterned to form a matrix on the substrate.
- Each of the photoresists may have the same width, length, and height, and may have the same distance from each other in the width and length directions.
- the shape memory alloy may be fixed in a form partially inserted into the photosensitive agent.
- Method for producing a self-deforming flexible film comprises the steps of preparing a substrate having a flexible property; Applying and patterning a first photoresist on the substrate; Arranging the shape memory alloy on the patterned first photoresist; Applying a second photosensitive agent on a substrate to cover the shape memory alloy; And patterning the second photoresist to the same shape as the first photoresist below.
- the shape memory alloy may be fixed by a single photosensitive agent in a line shape, and a plurality of shape memory alloys may be disposed along a row direction or a column direction of the patterned first photosensitive agent.
- the self-deformable flexible film according to the present invention is formed in a structure in which deformation of the shape memory alloy can be larger than in the related art, the force restored to its original shape can be further improved.
- the self-deformable flexible electronic device including the self-deformable flexible film of the present invention is more deformed (bended) by external force, it can be more easily unfolded (restored) when restored to its original shape. ) Can be designed as a structure.
- the photosensitive agent which can be used semi-permanently is patterned through the photolithography process, the flexible film having improved strain can be manufactured in a relatively simple process.
- FIG. 1 is a view showing a self-deforming flexible film according to the embodiment
- FIG. 2 is a view showing the deformation and restoration of the self-deforming flexible film according to the embodiment
- FIG. 4 is a view showing a self-deforming flexible film according to the embodiment
- FIG. 5 illustrates a self-deforming flexible electronic device according to an embodiment.
- FIG. 6 is a view showing a method of manufacturing a self-deforming flexible film according to the embodiment
- FIG. 1 is a view showing a self-deforming flexible film according to the embodiment.
- the self-deforming flexible film 10 has a shape in which a substrate 11 and a shape memory alloy 13 are combined, and a photosensitive agent 13 for fixing the shape memory alloy 13 is provided. It can be provided on the substrate.
- the shape memory alloy for deformation and restoration may be arranged and fixed on the substrate provided in the self-deforming flexible film 10 of the embodiment.
- the shape memory alloy may be arranged in a plurality of lines on a substrate, and FIG. 1 illustrates a positional relationship with respect to one of the shape memory alloys.
- a plurality of the photosensitive agents 12 are disposed along the extending direction of the shape memory alloy 13, and the shape memory alloys are fixed to the inside of the photosensitive agent while being spaced apart from the substrate by a predetermined distance d.
- the photosensitive agent 12 is divided into a length sufficient to fix the shape memory alloy 13 and is disposed on the substrate, whereby a portion of the shape memory alloy 13 is exposed between the photosensitive agent 12. Can be.
- the self-deforming flexible film 10 is manufactured so that a specific portion is folded or bent by an external force.
- the members constituting the self-deforming flexible film may be made of materials having flexibility.
- the substrate 11 may be made of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or the like, which may be elastically deformed and restored by an external force.
- PI polyimide
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- Table 1 shows.
- Young's Modulus is an intrinsic property of a material that indicates the degree of stretching of the material. It is an elastic modulus that indicates the degree of stretching and deformation of an object when it is stretched on both sides.
- the Young's modulus of PI, PET, and PEN is about 2 to 5 GPa, which is suitable for use as a substrate of a flexible electronic device as in the embodiment.
- the photosensitive agent 12 is a material that can be used semi-permanently, and SU-8, INTERVIA, or the like is preferably used.
- the Young's modulus of SU-8 and INTERVIA is shown in Table 2.
- the Young's modulus of SU-8 and INTERVIA is 2 to 4 GPa, which is suitable for use as a material for bonding a substrate in a flexible electronic device as in the embodiment.
- the shape memory alloy may be Nitinol, which is an alloy of nickel and titanium, and the physical properties of Nitinol are shown in Table 3.
- the Young's modulus of the shape memory alloy (Martensite) at room temperature where deformation occurs is 28 GPa
- the Young's modulus of the shape memory alloy (Austenite) in the heated state is 81GPa has a rather high value. Young's modulus is a material-specific property and does not change depending on the shape of the material, but the shape memory alloy manufactured in the form of a thin wire as in the embodiment can be more easily deformed under the same conditions.
- FIG. 2 is a view showing the deformation and restoration of the self-deforming flexible film according to the embodiment.
- FIG. 2 a state in which deformation occurs when the self-deformable flexible film is bent by applying an external force and a state in which the self-deformable flexible film is restored to its original shape at a specific temperature by the characteristics of the shape memory alloy are illustrated.
- the shape memory alloy When an external force is applied to the self-deforming flexible film so that the substrate is bent in a direction in which the substrate is located inward from the shape memory alloy, the shape memory alloy is also bent and stretched. Assuming that the shape memory alloy is stored in a flat shape, the deformed shape memory alloy is restored to the stored shape at a specific temperature, and thus the entire self-deformable flexible film may be restored to the original flat shape.
- the degree of deformation may be greater in a portion of the shape memory alloy exposed between the photosensitive agents, and the shape memory alloy is formed in a structure spaced apart from the substrate by a predetermined distance. As a result, it can be expected that the strain in the exposed portion becomes larger.
- the photosensitive agent used in the embodiment is a structure which partially fixes the shape memory alloy, it is necessary to consider the adhesive property between the photosensitive agent and the shape memory alloy.
- the photosensitizer used in the Example is SU-8, the adhesion to nickel, titanium, chromium, copper, and gold was tested and shown in Table 4.
- the adhesion strength to nickel, titanium, chromium, copper, and gold was found to have a range of 44.86 to 77.83 kPa.
- the adhesive force in the above range is a range in which the shape memory alloy can be fixed without deviating from the photoresist even by repeated deformation and restoration of the self-deforming flexible film, and through several operations in the manufacturing process of the self-deforming flexible film. This is the confirmed result.
- Nitinol an alloy of nickel and titanium
- Table 4 since the adhesive force of the nickel and titanium to the photoresist shows an adhesive force that does not deviate upon deformation and restoration of the flexible element, the self-deforming flexible of the embodiment It can be determined that the shape memory alloy provided in the film can be stably fixed with the photosensitive agent.
- FIG 3 is a view comparing the strain of the self-deformable flexible film according to the prior art and the embodiment.
- the conventional self-deformable flexible film 20 has a structure in which the substrate and the shape memory alloy are in direct contact and fixation.
- the self-deformable flexible film 10 of the embodiment has the substrate and the shape memory alloy in the photosensitive agent. It is formed in a structure fixed at regular intervals.
- the self-deforming flexible film of the embodiment Comparing the strains of the shape memory alloy with the two structures at an angle, assuming that the substrates are in the same position, the self-deforming flexible film of the embodiment will have the shape memory alloys located on the upper side. When bent at an angle, it can be seen that the strain of the shape memory alloy provided in the self-deforming flexible film of the embodiment becomes larger.
- the structure of the self-deformable flexible film of the embodiment is a structure for maximizing the strain of the shape memory alloy, and as shown in FIG. This means that it can be used as an excellent self-deformable flexible device with higher resilience later.
- FIG. 4 is a perspective view of a self-deforming flexible film according to the embodiment.
- each shape memory alloy in the form of lines (wires) are disposed on the substrate 11 at predetermined intervals, and four photoresists are extended by a predetermined distance along the extension direction of each shape memory alloy. It is placed fixed to the substrate while being spaced apart.
- Each of the photosensitizers surrounds the shape memory alloy at a constant height, and the shape memory alloy is fixedly spaced apart from the substrate by a predetermined distance. In particular, it can be seen that the shape memory alloy and the substrate are spaced apart from each other through a region located between each photosensitive agent.
- the structure of the above-described self-deformable flexible film is one example, and the number of the shape memory alloy and the photosensitive agent, the distance between the shape memory alloy, and the distance between the photoresist may vary depending on the structure of the display applied.
- FIG. 5 is a diagram illustrating a self-deforming flexible electronic device according to an embodiment.
- the self-straining flexible electronic device is manufactured by bonding the device layer to the above-described self-straining flexible film.
- the self-deforming flexible film as in the embodiment is attached to one surface of the substrate with the substrate 11 as a boundary, and a flexible electronic device such as a flexible display may be coupled to the other surface of the substrate.
- FIG. 6 is a view showing a method of manufacturing a self-deforming flexible film according to the embodiment.
- a substrate 11 having a flexibility that may be stably bent when the flexible film is subjected to an external force is prepared.
- the first photosensitive agent in a liquid state is applied to the upper surface of the substrate through spin coating, and a photolithography process is performed to pattern the first photosensitive agent into a plurality of hexahedral shapes having a constant height in a solid state as shown in (b).
- Each first photoresist is equal in width, length, and height to each other, and may be patterned to have a predetermined number of rows and columns on the substrate.
- the first photoresist may be patterned to be spaced apart by a predetermined interval to partially fix the shape memory alloy.
- the shape-memory alloy in the form of a line is disposed on the photosensitizers arranged as described above, wherein the shape-memory alloy includes all rows or columns of photosensitizers and is positioned to pass through the center of each photoresist. can do. After arranging the shape memory alloy, both ends are fixed by adhesive means for temporary fixing.
- the second photosensitive agent is applied onto the substrate by spin coating so as to cover all of the currently exposed shape memory alloy.
- the second photosensitive agent may be the same photosensitive agent used in the process (b). And it is patterned in the same manner as the first photosensitive agent of the hexahedral form formed in the process of (b) through the photolithography process to leave a solid state. At this time, the heights of the first photosensitive agent and the second photosensitive agent may be different.
- the line-shaped shape memory alloy is partially included in the photosensitive agent, and a fixed flexible film may be formed while being spaced apart from the shape memory alloy and the substrate by a predetermined distance.
- Comparative Example 1 in which the shape memory alloy was placed on the substrate, and the photosensitive agent was applied and fixed on the substrate
- Comparative Example 2 in which the shape memory alloy was placed on the substrate and the photosensitive agent was applied on the top, and then partially patterned, was applied to the substrate. After the partial patterning, a shape memory alloy was placed on the upper side, and the photoresist of the same shape was patterned again.
- Comparative Example 1 As a result of attempting bending deformation with the same radius of curvature (3 mm), in Comparative Example 1, the flexible film was stiff as a whole, so that it was stretched again by a predetermined angle. Comparative Example 2 showed a greater degree of bending than Comparative Example 1, which partially fixed the shape memory alloy due to the patterning of the photoresist, indicating that more deformation occurred in the portion where the shape memory alloy was exposed. Can be.
- the degree of bending is greater than that of Comparative Example 2, which indicates that the structure of the flexible film according to the embodiment can more effectively maintain the deformation of the substrate and the photosensitive agent, that is, the more bent state than the Comparative Examples. It can be judged. That is, the flexible film of the embodiment can maintain a larger deformation for the same external force than the comparative example, which means that the shape memory alloy of the internal deformation is larger, and the restoring force corresponding to the strain is also increased, so as to restore to the original shape It can also be seen that it is an easy structure.
- the self-deforming flexible film and the self-deforming flexible electronic device using the same have a greater degree of deformation (bending) of the shape memory alloy provided therein by external force, and thus, the original shape.
- the self-deforming flexible film and the self-deforming flexible electronic device using the same have a greater degree of deformation (bending) of the shape memory alloy provided therein by external force, and thus, the original shape.
- it is designed as a structure that can be more extended (restored) when restored, it can be applied to a device in which a solar cell or a flexible shape is to be implemented.
- the photosensitive agent which is semipermanently used can be patterned through a photolithography process, the flexible film having improved strain can be manufactured in a relatively simple process, thereby providing industrial applicability.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
Abstract
Description
PI | PET | PEN | |
영률(Young's Modulus) | 2.5GPa | 2~4GPa | 5.0~5.5GPa |
SU-8 | INTERVIA | |
Young's Modulus | 2 GPa | 4 GPa |
Maximum Recovery Force (MPa) | 600 |
Maximum Deformation Ratio (%) | 8 |
Young's Modulus (GPa) | 28 (Martensite), 81 (Austenite) |
Ti | Cr | Ni | Cu | Au | |
Adhesion strength | 77.83 kPa | 76.79 kPa | 44.86 kPa | 46.97 kPa | 70.99 kPa |
Claims (12)
- 플렉서블 전자소자가 접합되며, 플렉서블한 성질을 갖는 기판;상기 기판의 일측면에 마련되는 형상 기억 합금; 및상기 형상 기억 합금을 상기 기판에 고정시키는 감광제를 포함하고,상기 형상 기억 합금은 복수개의 라인 형태로 상기 기판 상에 배열되고,상기 감광제는 각각의 형상 기억 합금의 연장 방향을 따라 복수개가 배치되며, 상기 형상 기억 합금은 상기 기판과 소정의 거리만큼 이격된 채로 상기 감광제 내부에 고정되는 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 감광제는 육면체 형상이며, 상기 기판 상에서 행렬을 이루도록 패터닝되는 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 감광제 각각은 가로, 세로 및 높이가 서로 동일하며, 가로 및 세로 방향으로 이격된 거리가 동일한 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 형상 기억 합금은 부분적으로 상기 감광제 내부에 삽입된 형태로 고정되는 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 기판은 PI (Polyimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate) 중에서 어느 하나로 선택되는 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 감광제는 SU-8 또는 INTERVIA인 자가변형 플렉서블 필름.
- 제 1항에 있어서,상기 형상 기억 합금은 니켈과 티타늄의 합금인 니티놀인 자가변형 플렉서블 필름.
- 플렉서블한 성질을 가지는 기판을 준비하는 단계;상기 기판 상에 제1 감광제를 도포하고 패터닝 하는 단계;패터닝된 제1 감광제 상에 형상 기억 합금을 배열하는 단계;상기 형상 기억 합금을 덮도록 기판 상에 제2 감광제를 도포하는 단계; 및상기 제2 감광제를 하부의 제1 감광제와 동일한 형상으로 패터닝하는 단계;를 포함하는 자가변형 플렉서블 필름의 제조 방법.
- 제 8항에 있어서,상기 제1 감광제는 상기 기판 상에 일정한 높이를 갖는 육면체 형상이며, 소정 개수의 행과 열로 이루어지도록 복수개로 패터닝되는 자가변형 플렉서블 필름의 제조 방법.
- 제 8항에 있어서,상기 제1 감광제는 상기 형상 기억 합금을 부분적으로 고정시키도록 소정의 간격만큼 이격되도록 패터닝되는 자가변형 플렉서블 필름의 제조 방법.
- 제 8항에 있어서,상기 제1 감광제와 제2 감광제는 동일한 물질로 이루어지는 자가변형 플렉서블 필름의 제조 방법.
- 제 9항에 있어서,상기 형상 기억 합금은 라인 형태로 하나의 감광제에 의해 고정되며, 패터닝된 상기 제1 감광제의 행 방향 또는 열 방향을 따라 복수개가 배치되는 자가변형 플렉서블 필름의 제조 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/775,293 US10939549B2 (en) | 2015-11-10 | 2016-10-28 | Self-transforming flexible film and method for preparing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150157417A KR101738421B1 (ko) | 2015-11-10 | 2015-11-10 | 자가변형 플렉서블 필름 및 이의 제조 방법 |
KR10-2015-0157417 | 2015-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017082559A1 true WO2017082559A1 (ko) | 2017-05-18 |
Family
ID=58695783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2016/012243 WO2017082559A1 (ko) | 2015-11-10 | 2016-10-28 | 자가변형 플렉서블 필름 및 이의 제조 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10939549B2 (ko) |
KR (1) | KR101738421B1 (ko) |
WO (1) | WO2017082559A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102201184B1 (ko) * | 2019-08-06 | 2021-01-12 | 광주과학기술원 | 자가변형 플렉서블 기기, 및 자가변형 플렉서블 기기의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799332A (ja) * | 1993-06-29 | 1995-04-11 | Sanyo Electric Co Ltd | 3次元形状光起電力素子の製造方法 |
KR100801353B1 (ko) * | 2000-04-12 | 2008-02-05 | 폼팩터, 인크. | 성형 스프링 및 성형 스프링을 제조 및 이용하는 방법 |
KR20080073617A (ko) * | 2007-02-06 | 2008-08-11 | 성균관대학교산학협력단 | 선택적 무전해 도금을 이용한 플렉서블 기판의 미세 금속배선 형성 방법 |
JP2009267286A (ja) * | 2008-04-30 | 2009-11-12 | Epson Imaging Devices Corp | フレキシブルプリント基板、電子デバイス及び電子デバイスの製造方法 |
KR101241679B1 (ko) * | 2011-01-19 | 2013-03-11 | 엘지이노텍 주식회사 | 태양전지 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5538902A (en) | 1993-06-29 | 1996-07-23 | Sanyo Electric Co., Ltd. | Method of fabricating a photovoltaic device having a three-dimensional shape |
US7458816B1 (en) | 2000-04-12 | 2008-12-02 | Formfactor, Inc. | Shaped spring |
US6640432B1 (en) * | 2000-04-12 | 2003-11-04 | Formfactor, Inc. | Method of fabricating shaped springs |
-
2015
- 2015-11-10 KR KR1020150157417A patent/KR101738421B1/ko active IP Right Grant
-
2016
- 2016-10-28 WO PCT/KR2016/012243 patent/WO2017082559A1/ko active Application Filing
- 2016-10-28 US US15/775,293 patent/US10939549B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799332A (ja) * | 1993-06-29 | 1995-04-11 | Sanyo Electric Co Ltd | 3次元形状光起電力素子の製造方法 |
KR100801353B1 (ko) * | 2000-04-12 | 2008-02-05 | 폼팩터, 인크. | 성형 스프링 및 성형 스프링을 제조 및 이용하는 방법 |
KR20080073617A (ko) * | 2007-02-06 | 2008-08-11 | 성균관대학교산학협력단 | 선택적 무전해 도금을 이용한 플렉서블 기판의 미세 금속배선 형성 방법 |
JP2009267286A (ja) * | 2008-04-30 | 2009-11-12 | Epson Imaging Devices Corp | フレキシブルプリント基板、電子デバイス及び電子デバイスの製造方法 |
KR101241679B1 (ko) * | 2011-01-19 | 2013-03-11 | 엘지이노텍 주식회사 | 태양전지 |
Also Published As
Publication number | Publication date |
---|---|
KR101738421B1 (ko) | 2017-05-23 |
US10939549B2 (en) | 2021-03-02 |
KR20170054807A (ko) | 2017-05-18 |
US20180332703A1 (en) | 2018-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10199323B2 (en) | Flexible circuit substrate with temporary supports and equalized lateral expansion | |
JP6300156B2 (ja) | 伸縮性フレキシブル基板およびその製造方法 | |
EP3120381B1 (en) | Flexible electronics apparatus and associated methods | |
JP6331130B2 (ja) | 伸縮性フレキシブル基板およびその製造方法 | |
US8895864B2 (en) | Deformable apparatus and method | |
CN106952937A (zh) | 走线结构、显示基板及显示装置 | |
WO2014137113A1 (ko) | 플렉시블 디스플레이 소자 | |
CN108391373B (zh) | 一种电路基板及显示设备 | |
JP7154508B2 (ja) | 配線基板及び配線基板の製造方法 | |
JP2020010052A5 (ko) | ||
CN110557887A (zh) | 电路对位组件及显示装置 | |
WO2017082559A1 (ko) | 자가변형 플렉서블 필름 및 이의 제조 방법 | |
JP2019075491A (ja) | 伸縮性基板 | |
JP6774657B1 (ja) | 配線基板及び配線基板の製造方法 | |
KR20180116116A (ko) | 칩 온 필름, 이를 갖는 플렉시블 디스플레이 장치, 및 그 제조 방법 | |
JP7067011B2 (ja) | 配線基板及び配線基板の製造方法 | |
JP2020112496A (ja) | ディフォーマブルセンサ | |
KR102167733B1 (ko) | 스트레처블 기판 | |
KR102042052B1 (ko) | 자가변형 플렉서블 필름 및 이의 제조 방법 | |
TW202318927A (zh) | 電路裝置及其製造方法以及電路系統 | |
JP6975422B2 (ja) | 配線基板 | |
KR102590649B1 (ko) | 전사필름 및 이를 이용한 전사방법 | |
KR102678182B1 (ko) | 배선 기판 및 배선 기판의 제조 방법 | |
CN219246301U (zh) | 一种led装置及可拉伸及曲面电子产品 | |
JP7216912B2 (ja) | 配線基板及び配線基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16864485 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15775293 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 11.09.2018) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16864485 Country of ref document: EP Kind code of ref document: A1 |