WO2017067031A1 - 用于使两个基板相结合的方法、结构及装置 - Google Patents

用于使两个基板相结合的方法、结构及装置 Download PDF

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WO2017067031A1
WO2017067031A1 PCT/CN2015/094500 CN2015094500W WO2017067031A1 WO 2017067031 A1 WO2017067031 A1 WO 2017067031A1 CN 2015094500 W CN2015094500 W CN 2015094500W WO 2017067031 A1 WO2017067031 A1 WO 2017067031A1
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substrate
dam
adhesive
substrates
storage space
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PCT/CN2015/094500
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French (fr)
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赵春玲
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苏州工业园区宇速电子有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

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  • the present invention relates to a method, structure and apparatus for joining two substrates, and more particularly to a method and apparatus for injecting an adhesive into two substrates to join the two substrates.
  • the invention patent application with the application number CN201310573093.2 discloses a method for combining two substrates, the method comprising the steps of: applying a bonding agent to a first substrate, the bonding agent portion Hardening, applying a second substrate to the bonding agent, wherein a second substrate is applied to the bonding agent before the bonding agent is completely cured.
  • the disadvantage of this method is the complexity of the process.
  • the technical solution adopted by the present invention is: a method for combining two substrates, comprising a first substrate and a second substrate, the bonding method comprising first forming a closure on one surface of the first substrate a dam, the dam is provided with an exhaust passage and a liquid injection passage; then the second substrate is superposed on the dam and the first substrate to form an adhesive storage space with a dam as a frame; Next, the adhesive is injected into the adhesive storage space through the liquid injection channel.
  • a preferred technical solution is to apply a strip of double-sided tape on one surface of the first substrate to form a closed dam.
  • a preferred technical solution is to apply a strip of adhesive on one surface of the first substrate, curing or semi-curing to form a closed dam.
  • a preferred technical solution is that a positioning block is sandwiched between the first substrate and the second substrate.
  • a preferred technical solution is to apply a uniform clamping force to the first substrate and the second substrate when the adhesive is injected into the adhesive storage space.
  • a preferred technical solution is that a liquid injection pipe is arranged on the dam to constitute a liquid injection channel.
  • a preferred technical solution is that an exhaust pipe is disposed on the dam to constitute an exhaust passage.
  • the technical solution adopted by the present invention is: a device for combining two substrates, comprising a first connecting member, a conducting tube, a second connecting member, a dispensing needle and an injection tube; One end of the first connecting member is connected to the liquid inlet end of the conducting pipe, the liquid discharging end of the conducting pipe is connected to one end of the second connecting member, and the other end of the second connecting member is opposite to the The liquid inlet of the dispensing needle is connected, and the injection tube is sleeved on the dispensing needle.
  • the technical solution adopted by the present invention is: a structure for combining two substrates, comprising a first substrate and a second substrate, a surface of the first substrate forming a closed dam, The dam is provided with an exhaust passage and a liquid injection passage; the second substrate is superposed on the dam and the first substrate to form an adhesive storage space with a dam as a frame; the adhesive storage The space is filled with an adhesive that is in contact with the dam.
  • a preferred technical solution is that the injection tube is telescopically sleeved on the dispensing needle.
  • the present invention has the following advantages and effects compared with the prior art:
  • the invention forms a dam between two substrates to form an adhesive storage space, and then fills the adhesive between the two substrates by using an injection method, which has the advantages of convenient operation and high efficiency.
  • the liquid injection channel of the present invention while injecting the adhesive, simultaneously removes the air originally stored in the adhesive storage space to the outside, so that a flat adhesive layer can be formed between the two substrates.
  • 1 is a schematic view showing the relative positions of two substrates in the first embodiment.
  • FIG. 2 is a schematic view showing the relative positions of the two substrates in the second embodiment.
  • 3 is a schematic view showing the relative positions of two substrates in the third embodiment.
  • FIG. 4 is a schematic plan view of a first substrate of Embodiment 2.
  • Figure 5 is a schematic view of the apparatus.
  • Figure 6 is a schematic view showing the relationship between the injection tube and the dispensing needle.
  • Figure 7 is a schematic view showing the injection of an adhesive between two substrates.
  • Embodiment 1 Method, structure and device for combining two substrates
  • a method, structure and apparatus for combining two substrates comprising a first substrate 1 and a second substrate 2, the method of bonding comprising first on the first substrate
  • One surface of 1 forms a closed dam 3, which is provided with an exhaust passage 4 and a liquid injection passage 5; then the second substrate 2 is superposed on the dam 3 and the first substrate 1
  • An adhesive storage space is formed which is framed by the dam 3; then the adhesive is injected into the adhesive storage space through the liquid injection channel 5.
  • the dam is formed by attaching a strip of double-sided tape on one surface of the first substrate 1 to form a closed dam.
  • the method of injecting an adhesive injection adhesive into the adhesive storage space may employ a prior art, such as a medical injection needle.
  • the apparatus used in the present embodiment includes the first connecting member 8, the conducting tube 9, the second connecting member 10, the dispensing needle 11 and the injection tube 12.
  • One end of the first connecting member 8 is connected to the liquid inlet end of the conducting pipe 9, and the liquid discharging end of the conducting pipe 9 is connected to one end of the second connecting member 10, the second connection
  • the other end of the member 10 is connected to the liquid inlet of the dispensing needle 11, and the injection tube 12 is sleeved on the dispensing needle.
  • the formed structure includes a first substrate and a second substrate, a surface of the first substrate forms a closed dam, the dam is provided with an exhaust passage and a liquid injection passage; and the second substrate faces the The dam is overlapped with the first substrate to form an adhesive storage space with a dam as a frame; the adhesive storage space is filled with an adhesive, and the adhesive is in contact with the dam.
  • Embodiment 2 Method, structure and device for combining two substrates
  • the embodiment is different from the first embodiment in that a strip of adhesive is coated on one surface of the first substrate 1 and solidified to form a closed.
  • the dam 3 Then, the liquid injection pipe 6 and the exhaust pipe 7 are pre-buried on the dam 3.
  • Embodiment 3 Method, structure and device for combining two substrates
  • the embodiment differs from the first embodiment in that a positioning block 13 is sandwiched between the first substrate 1 and the second substrate 2 .

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

用于使两个基板相结合的方法、结构及装置，包括第一基板和第二基板，结合的方法包括首先在第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；然后将第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；接下来通过所述注液通道向胶黏剂储存空间内注射胶黏剂。本发明在两基板之间形成一围坝以构成胶黏剂储存空间，然后采用注射方法在两基板之间填充胶黏剂，具有操作方便、效率高的优点。

Description

用于使两个基板相结合的方法、结构及装置 技术领域
本发明涉及一种用于使两个基板相结合的方法、结构及装置，特别涉及一种向两个基板中间注射粘结剂以使两个基板结合的方法及装置。
背景技术
在电子产品制造时，通常需要用粘结的方法将两个基板结合在一起。申请号为CN201310573093.2的发明专利申请，公开了一种用于使两个底基相结合的方法，该方法包括以下步骤：将结合剂施加到第一底基上，使所述结合剂部分硬化，将第二底基施加到结合剂上，其中，在所述结合剂完全硬化之前将第二底基施加到所述结合剂上。该方法的缺点是工艺流程复杂。
发明内容
本发明目的是提供一种用于使两个基板相结合的方法、结构及装置。
为达到上述目的，本发明采用的技术方案是：一种用于使两个基板相结合的方法，包括第一基板和第二基板，结合的方法包括首先在第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；然后将第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；接下来通过所述注液通道向胶黏剂储存空间内注射胶黏剂。
优选的技术方案为：在所述第一基板的一个表面粘贴一圈条形的双面胶带以形成一闭合的围坝。
优选的技术方案为：在所述第一基板的一个表面涂覆一圈条形的胶黏剂，固化或者半固化以形成一闭合的围坝。
优选的技术方案为：所述第一基板和第二基板之间夹持一定位块。
优选的技术方案为：在向所述胶黏剂储存空间内注射胶黏剂时，对所述第一基板和第二基板施加均匀的夹持力。
优选的技术方案为：所述围坝上设置注液管以构成注液通道。
优选的技术方案为：所述围坝上设置排气管以构成排气通道。
为达到上述目的，本发明采用的技术方案是：一种用于使两个基板相结合的装置，包括第一连接件、导通管、第二连接件、点胶针头和注入管；所述第一连接件的一端与所述导通管的进液端连接，所述导通管的出液端与所述第二连接件的一端连接，所述第二连接件的另一端与所述点胶针头的进液口连接，所述注入管套设在所述点胶针头上。
为达到上述目的，本发明采用的技术方案是：一种用于使两个基板相结合的结构，包括第一基板和第二基板，所述第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；所述胶黏剂储存空间内填充有胶黏剂，所述胶黏剂与所述围坝接触。
优选的技术方案为：所述注入管可伸缩地套设在所述点胶针头上。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
1、本发明在两基板之间形成一围坝以构成胶黏剂储存空间，然后采用注射方法在两基板之间填充胶黏剂，具有操作方便、效率高的优点。
2、本发明的注液通道在注入胶黏剂的同时，排气通道同时向外界排除原存于胶黏剂储存空间内的空气，因此可以在两基板之间形成平整的胶黏剂层。
附图说明
附图1为实施方式一的两基板相对位置示意图。
附图2为实施方式二的两基板相对位置示意图。
附图3为实施方式三的两基板相对位置示意图。
附图4为实施方式二的第一基板的俯视示意图。
附图5为装置示意图。
附图6为注入管和点胶针头组合关系示意图。
附图7为向两基板间注射胶黏剂示意图。
以上附图中，1、第一基板；2、第二基板；3、围坝；4、排气通道；5、注液通道；6、注液管；7、排气管；8、第一连接件；9、导通管；10、第二连接件；11、点胶针头；12、注入管；13、定位块。
具体实施方式
下面结合附图及实施例对本发明作进一步描述：
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技术的人士了解与阅读，并非用以限定本实用新型可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本实用新型所能产生的功效及所能达成的目的下，均应仍落在本实用新型所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语，亦仅为便于叙述的明了，而非用以限定本实用新型可实施的范围， 其相对关系的改变或调整，在无实质变更技术内容下，当亦视为本实用新型可实施的范畴。
实施例一：用于使两个基板相结合的方法、结构及装置
参见附图1、附图4～7所示，一种用于使两个基板相结合的方法、结构及装置，包括第一基板1和第二基板2，结合的方法包括首先在第一基板1的一个表面形成一闭合的围坝3，该围坝3上设有排气通道4和注液通道5；然后将第二基板2朝向所述围坝3与所述第一基板1叠合构成一以围坝3为边框的胶黏剂储存空间；接下来通过所述注液通道5向胶黏剂储存空间内注射胶黏剂。围坝的形成方式为在所述第一基板1的一个表面粘贴一圈条形的双面胶带以形成一闭合的围坝。向胶黏剂储存空间内注射胶黏剂注射胶黏剂的方法可以采用现有技术，例如医疗用的注射针具。由于第一基板1和第二基板2之间的间距很小，因此本实施方式采用的装置包括第一连接件8、导通管9、第二连接件10、点胶针头11和注入管12；所述第一连接件8的一端与所述导通管9的进液端连接，所述导通管9的出液端与所述第二连接件10的一端连接，所述第二连接件10的另一端与所述点胶针头11的进液口连接，所述注入管12套设在所述点胶针头上。在向胶黏剂储存空间内注射胶黏剂注射胶黏剂时，以注入管12插入注液通道5。所述注入管可伸缩地套设在所述点胶针头上。：在向所述胶黏剂储存空间内注射胶黏剂时，对所述第一基板和第二基板施加均匀的夹持力。最终，形成的结构，包括第一基板和第二基板，所述第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；所述胶黏剂储存空间内填充有胶黏剂，所述胶黏剂与所述围坝接触。
实施例二：用于使两个基板相结合的方法、结构及装置
参见附图2、附图4～7所示，该实施方式与实施方式一的区别在于，在所述第一基板1的一个表面涂覆一圈条形的胶黏剂，固化以形成一闭合的围坝3。然后再围坝3上预埋注液管6和排气管7。
实施例三：用于使两个基板相结合的方法、结构及装置
参见附图3、附图4～7所示，该实施方式与实施方式一的区别在于：第一基板1和第二基板2之间夹持一定位块13。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保 护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (10)

  1. 一种用于使两个基板相结合的方法，其特征在于：包括第一基板和第二基板，结合的方法包括首先在第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；然后将第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；接下来通过所述注液通道向胶黏剂储存空间内注射胶黏剂。
  2. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：在所述第一基板的一个表面粘贴一圈条形的双面胶带以形成一闭合的围坝。
  3. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：在所述第一基板的一个表面涂覆一圈条形的胶黏剂，固化或者半固化以形成一闭合的围坝。
  4. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：所述第一基板和第二基板之间夹持一定位块。
  5. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：在向所述胶黏剂储存空间内注射胶黏剂时，对所述第一基板和第二基板施加均匀的夹持力。
  6. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：所述围坝上设置注液管以构成注液通道。
  7. 根据权利要求1所述的用于使两个基板相结合的方法，其特征在于：所述围坝上设置排气管以构成排气通道。
  8. 一种用于使两个基板相结合的装置，其特征在于：包括第一连接件、导通管、第二连接件、点胶针头和注入管；所述第一连接件的一端与所述导通管的进液端连接，所述导通管的出液端与所述第二连接件的一端连接，所述第二连接件的另一端与所述点胶针头的进液口连接，所述注入管套设在所述点胶针头上。
  9. 根据权利要求8所述的用于使两个基板相结合的装置，其特征在于：所述注入管可伸缩地套设在所述点胶针头上。
  10. 一种用于使两个基板相结合的结构，其特征在于：包括第一基板和第二基板，所述第一基板的一个表面形成一闭合的围坝，该围坝上设有排气通道和注液通道；第二基板朝向所述围坝与所述第一基板叠合构成一以围坝为边框的胶黏剂储存空间；所述胶黏剂储存空间内填充有胶黏剂，所述胶黏剂与所述围坝接触。
PCT/CN2015/094500 2015-10-22 2015-11-13 用于使两个基板相结合的方法、结构及装置 WO2017067031A1 (zh)

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
CN111161631A (zh) * 2020-01-14 2020-05-15 重庆烯宇新材料科技有限公司 一种显示器围坝水胶全贴合工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102153954A (zh) * 2011-04-11 2011-08-17 福州华映视讯有限公司 多对象的黏合方法及黏合机台
CN102469730A (zh) * 2010-11-16 2012-05-23 富泰华工业（深圳）有限公司 粘接组件及其粘接方法
CN102527580A (zh) * 2012-03-09 2012-07-04 深圳市轴心自控技术有限公司 一种全自动高速在线式非接触底部填充机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101418985B (zh) * 2008-12-02 2011-04-06 上海海立特种制冷设备有限公司 一种地铁空调钣金件的连接密封工艺
GB201104675D0 (en) * 2011-03-18 2011-05-04 Aston Martin Lagonda Ltd Methods of forming bonded structures and bonded structures formed thereby
CN202570485U (zh) * 2012-05-29 2012-12-05 张建宇 一种气囊压力注胶器
CN203659924U (zh) * 2013-12-31 2014-06-18 广州市鸿利光电股份有限公司 一种led封装基板
CN204536265U (zh) * 2015-04-17 2015-08-05 杨利平 一次性凝胶板
CN205115359U (zh) * 2015-10-22 2016-03-30 苏州工业园区宇速电子有限公司 用于使两个基板相结合的结构及装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469730A (zh) * 2010-11-16 2012-05-23 富泰华工业（深圳）有限公司 粘接组件及其粘接方法
CN102153954A (zh) * 2011-04-11 2011-08-17 福州华映视讯有限公司 多对象的黏合方法及黏合机台
CN102527580A (zh) * 2012-03-09 2012-07-04 深圳市轴心自控技术有限公司 一种全自动高速在线式非接触底部填充机

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