WO2017067018A1 - 一种柔性板 - Google Patents

一种柔性板 Download PDF

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Publication number
WO2017067018A1
WO2017067018A1 PCT/CN2015/093199 CN2015093199W WO2017067018A1 WO 2017067018 A1 WO2017067018 A1 WO 2017067018A1 CN 2015093199 W CN2015093199 W CN 2015093199W WO 2017067018 A1 WO2017067018 A1 WO 2017067018A1
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WO
WIPO (PCT)
Prior art keywords
scattering
flexible substrate
flexible
flexible board
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/093199
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English (en)
French (fr)
Inventor
余赟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd, Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/897,889 priority Critical patent/US20170338141A1/en
Publication of WO2017067018A1 publication Critical patent/WO2017067018A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • G02B5/0231—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having microprismatic or micropyramidal shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0273—Diffusing elements; Afocal elements characterized by the use
    • G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7426—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible board.
  • Laser Lift-Off refers to a technique of separating the flexible substrate from the glass substrate by decomposing the connecting layer at the interface between the glass substrate and the flexible substrate using laser energy.
  • the laser is incident from one side of the glass substrate, which in turn penetrates the flexible substrate, passes through the buffer layer, and finally reaches the edge layer.
  • the energy of the laser is absorbed by the edge layer, and the energy of the laser destroys the structure of the edge layer, causing damage to the characteristics of the element to be processed.
  • the present invention proposes a flexible board.
  • the flexible board of the present invention comprises: a flexible substrate; a scattering structure disposed on at least one surface of the flexible substrate; a buffer layer on a side of the scattering structure remote from the flexible substrate; An edge layer of the buffer layer away from the side of the flexible substrate.
  • a bundled large-beam laser having a large intensity is injected from the other side of the glass substrate.
  • the large beam of laser light penetrates the glass substrate and the flexible substrate to achieve the peeling function, while the remaining laser light is scattered by the scattering structure disposed on the surface of the flexible substrate away from the glass substrate after penetrating the flexible substrate, and the scattering structure will be stronger Big bundle
  • the beam laser is scattered into a small beam of weaker beams.
  • the beamlet laser enters the buffer layer on the side of the scattering structure that is remote from the flexible substrate and gradually decays in the buffer layer.
  • the beamlet laser gradually decays to disappear in the buffer layer, so no laser energy reaches the edge layer on the side of the buffer layer that is remote from the flexible substrate and causes damage to the latter.
  • the edge layer located on the side of the buffer layer away from the flexible substrate, it is not enough to cause damage because the laser energy here has been dispersed. And attenuation.
  • the scattering structure comprises more than two scattering elements, the scattering elements being of the order of nanometers to micrometers. Scattering elements on the order of nanometers to micrometers have an efficient scattering effect on the laser.
  • the scattering elements are arranged without gaps between each other. In this way, the scattering elements can be arranged in a compact manner, reinforcing the scattering effect of the plurality of scattering elements as a whole on the laser light from the direction of the glass substrate.
  • a large beam of laser light having a high overall beam intensity is effectively scattered into a plurality of scattered weak beamlets of small beams after passing through the scattering element.
  • a gap is disposed between the scattering elements on a surface of the flexible substrate on which the scattering element is disposed. In this way, the arrangement of the scattering elements can be flexibly adjusted to achieve the laser energy dispersing the direction from the glass substrate, while also saving material, reducing product weight and reducing process difficulty.
  • the width of the gap is 1/4-1/2 of the dimension of the scattering element adjacent thereto in a corresponding direction in any direction of the surface of the flexible substrate. In this way, it is possible to optimize the dispersion effect of the laser energy from the direction of the glass substrate while effectively reducing the number of scattering elements, saving processes and materials.
  • the cross-section of the scattering element is triangular, rectangular, square, semi-elliptical, semi-circular or trapezoidal in a direction perpendicular to the surface of the flexible substrate.
  • the different cross-sectional shapes of the scattering elements have different effects on the optical path of the laser and can therefore be adapted to different specific situations, which will be discussed in detail below in connection with different embodiments.
  • the scattering element is formed on the surface of the flexible substrate by an imprint process, a yellow light process, a dry engraving process, or a wet engraving process. It can be seen that the solution of the present invention is very flexible in selecting a specific process.
  • the buffer layer covers all of the scattering elements and fills into the space between adjacent scattering elements. This plays a very effective role in the attenuation and buffering of laser energy. Because laser light exiting from any surface of the scattering element at any angle can enter the buffer layer for attenuation.
  • the thickness of the buffer layer is equivalent to several to thousands of times the size of the scattering element in the respective direction in a direction perpendicular to the surface of the flexible substrate.
  • the scattering element is also capable of reflecting or absorbing light. This can more effectively prevent the energy of the laser from being absorbed by the edge layer, thereby damaging the structure of the edge layer.
  • Figure 1 is a schematic view showing the structure of a flexible board according to the present invention.
  • FIG. 2 is a partial structural view showing a first embodiment of a flexible board according to the present invention.
  • Figure 3 is a partial structural view showing a second embodiment of the flexible board of the present invention.
  • Figure 4 is a partial structural view showing a third embodiment of the flexible board of the present invention.
  • Figure 5 is a partial structural view showing a fourth embodiment of the flexible board of the present invention.
  • Figure 6 is a schematic view showing the laser transmission of the first embodiment of the flexible board proposed by the present invention.
  • Figure 7 shows a schematic diagram of laser transmission of a flexible sheet of the designed comparative example.
  • Fig. 1 is a schematic view showing the structure of a flexible board according to the present invention.
  • the present invention proposes a flexible board 100.
  • the flexible board 100 according to the present invention includes: a flexible substrate 2; a scattering structure 3 disposed on at least one surface of the flexible substrate 2 (in the schematic view shown in FIG. 1, the scattering structure 3 is located away from the glass of the flexible substrate 2 a buffer layer 4 on a side of the scattering structure 3 remote from the flexible substrate 2; and a rim layer 5 on a side of the buffer layer 4 remote from the flexible substrate 2.
  • the flexible substrate 2 is attached to the glass substrate 1.
  • the flexible board 100 according to the present invention is particularly suitable for use in Laser Lift-Off (LLO), that is, the use of laser energy to decompose the connection layer at the interface of the glass substrate 1 and the flexible substrate 2, thereby realizing the flexible substrate 2 from The glass substrate 1 is separated.
  • LLO Laser Lift-Off
  • the scattering structure 3 can be constructed as two or more scattering elements, the size of which is on the order of nanometers to micrometers. Scattering elements on the order of nanometers to micrometers have an efficient scattering effect on the laser.
  • Fig. 2 is a partial structural view showing the first embodiment of the flexible board proposed by the present invention.
  • the scattering elements 3.1 on the surface of the flexible substrate 2 provided with the scattering element 3.1 (i.e., on the surface of the flexible substrate 2 remote from the glass substrate 1), the scattering elements 3.1 have no gap with each other. Ground setting. In this way, the scattering elements 3.1 can be arranged in a compact manner, reinforcing the scattering effect of the plurality of scattering elements 3.1 as a whole on the laser light 6 from the direction of the glass substrate 1. It is clearly shown in Fig. 2 that the large beam laser 6 having a higher overall intensity is scattered as a plurality of dispersed weaker beam lasers 6.1 after passing through the scattering element 3.1.
  • the cross section of the scattering element 3.1 is triangular in a direction perpendicular to the surface of the flexible substrate 2.
  • the bottom edge of the triangle is bonded to the surface of the flexible substrate 2, and the laser light is incident from the bottom edge of the triangle, and is scattered by the scattering element 3.1 to be emitted at the two sides thereof. In this way, the direction of exit of the light can be controlled by adjusting the angle of the angle of the triangle.
  • the arrangement of the scattering elements can be flexibly adjusted to achieve the laser energy dispersing the direction from the glass substrate 1, while also saving material, reducing the weight of the product, and reducing the process difficulty.
  • Fig. 3 is a partial structural view showing a second embodiment of the flexible board proposed by the present invention.
  • the second embodiment shown in FIG. 3 on the surface of the flexible substrate 2 on which the scattering element 3.2 is disposed (ie, on the surface of the flexible substrate 2 remote from the glass substrate 1), between the scattering elements 3.2 is provided Clearance 8.
  • Clearance 8 In this way, the arrangement of the scattering elements 3.2 can be flexibly adjusted to achieve the laser energy dispersing the direction from the glass substrate 1, while also saving material, reducing product weight and reducing process complexity.
  • the large beam laser 6 having a higher overall intensity is scattered after passing through the scattering element 3.2 into a plurality of dispersed weaker beam lasers 6.1.
  • the cross section of the scattering element 3.2 may be rectangular or square in a direction perpendicular to the surface of the flexible substrate 2 (the illustration is only illustrative, Its side length ratio is not to be understood as a precise definition for the present embodiment). Rectangle or square is the easiest to process The shape can greatly simplify the process difficulty of the solution of the present invention, and the rectangular or square has the highest utilization rate of materials, which can effectively reduce waste materials and save costs.
  • the width of the gap 8 in any direction of the surface of the flexible substrate 2 (for example, in the horizontal direction of FIG. 3), the width of the gap 8 may be, for example, 1/ of the size of the scattering element 3.2 adjacent thereto in the corresponding direction. 4-1/2. In this way, the dispersion effect of the laser energy from the direction of the glass substrate 1 can be optimized without excessively increasing the weight or process complexity of the entire flexible board 100.
  • the scattering elements 3.2 are arranged without gaps with each other. In this way, the scattering elements 3.2 can be arranged in a compact manner, which enhances the scattering of the laser light 6 from the direction of the glass substrate 1 by the plurality of scattering elements 3.2 as a whole.
  • Fig. 4 is a partial structural view showing a third embodiment of the flexible board proposed by the present invention.
  • the third embodiment shown in FIG. 4 on the surface of the flexible substrate 2 on which the scattering element 3.3 is disposed (i.e., on the surface of the flexible substrate 2 remote from the glass substrate 1), between the scattering elements 3.3 is disposed Clearance 8.
  • Clearance 8 In this way, the arrangement of the scattering elements 3.3 can be flexibly adjusted, and while realizing the laser energy dispersing the direction from the glass substrate 1, the material can be saved as much as possible, the weight of the product can be reduced, and the process difficulty can be reduced.
  • the large beam laser 6 having a higher overall intensity is scattered as a plurality of dispersed weaker beam lasers 6.1 after passing through the scattering element 3.3.
  • the cross section of the scattering element 3.3 may be semi-elliptical or semi-circular in a direction perpendicular to the surface of the flexible substrate 2 (only shown in the figure)
  • its side length ratio is not to be understood as a precise definition for the present embodiment.
  • one side of the semi-elliptical or semi-circular straight side is attached to the surface of the flexible substrate 2.
  • the laser is incident perpendicular to the plane side and is scattered into a space containing a three-dimensional solid angle of a particular size, the size of which is determined by the optical properties of the material of the scattering element 3.3.
  • the width of the gap 8 in any direction of the surface of the flexible substrate 2 (for example, in the horizontal direction of FIG. 4), the width of the gap 8 may be, for example, 1/ of the size of the scattering element 3.3 adjacent thereto in the corresponding direction. 4-1/2. In this way, the dispersion effect of the laser energy from the direction of the glass substrate 1 can be optimized without excessively increasing the weight or process complexity of the entire flexible board 100.
  • the scattering elements 3.3 are arranged without a gap therebetween. In this way, the scattering elements 3.3 can be arranged in a compact manner, which enhances the scattering of the laser light 6 from the direction of the glass substrate 1 by the plurality of scattering elements 3.3 as a whole.
  • Fig. 5 is a partial structural view showing a fourth embodiment of the flexible board proposed by the present invention.
  • a gap 8 is provided between the scattering elements 3.4.
  • the arrangement of the scattering elements 3.4 can be flexibly adjusted, and while realizing the laser energy dispersing the direction from the glass substrate 1, the material can be saved as much as possible, the weight of the product can be reduced, and the process difficulty can be reduced.
  • the large beam laser 6 having a higher overall intensity is scattered after passing through the scattering element 3.4 into a plurality of dispersed weaker beam lasers 6.1.
  • the cross section of the scattering element 3.4 may be trapezoidal in a direction perpendicular to the surface of the flexible substrate 2.
  • the long bottom side of the trapezoid is attached to the surface of the flexible substrate 2.
  • the scattering element 3.4 can be attached more firmly to the flexible substrate 2, while the laser is incident vertically through the long bottom into the scattering element 3.4, which in turn is scattered into a space of a certain size, the size of the space It is determined by the optical properties of the material of the scattering element 3.4 and the angles of the four corners of the trapezoid.
  • the width of the gap 8 in any direction of the surface of the flexible substrate 2 (for example, in the horizontal direction of FIG. 4), the width of the gap 8 may be, for example, 1/ of the size of the scattering element 3.4 adjacent thereto in the corresponding direction. 4-1/2. In this way, the dispersion effect of the laser energy from the direction of the glass substrate 1 can be optimized without excessively increasing the weight or process complexity of the entire flexible board 100.
  • the scattering elements 3.4 are arranged without gaps with each other. In this way, the scattering elements 3.4 can be arranged in a compact manner, which enhances the scattering of the laser light 6 from the direction of the glass substrate 1 by the plurality of scattering elements 3.4 as a whole.
  • Fig. 6 is a view showing the laser transmission of the first embodiment of the flexible board proposed by the present invention.
  • a large bundle of large-beam laser light having a large intensity is incident from the bottom side of the glass substrate 1. 6.
  • the large laser beam 6 penetrates the glass substrate 1 and the flexible substrate 2 to achieve a peeling function, while the remaining laser light penetrates the flexible substrate 2 and is disposed on the upper surface of the flexible substrate 2 with a scattering structure - a plurality of closely arranged
  • the cross section is a triangular scattering of scattering elements 3.1 on the order of nanometers to micrometers.
  • the scattering element 3.1 scatters the intensive bundled large beam laser 6 into a plurality of weaker beamlet lasers 6.1.
  • the beamlet laser 6.1 enters the buffer layer 4 on the side of the scattering structure 3.1 remote from the flexible substrate 2 and is gradually attenuated in the buffer layer 4.
  • the buffer layer 4 covers all of the scattering elements 3.1 and is filled into the space between adjacent scattering elements 3.1. This plays a very effective role in the attenuation and buffering of the laser energy, since the laser light emitted from any surface of the scattering element 3.1 at any angle can enter the buffer layer 4.
  • the thickness of the buffer layer 4 corresponds to several to thousands of times the size of the scattering element 3.1 in the corresponding direction. Such a size setting ensures that the dispersed laser energy is effectively attenuated without excessively increasing the thickness and weight of the flexible board 100.
  • Fig. 6 it can be seen that the beamlet laser 6.1 gradually decays to disappear in the buffer layer 4, so that no laser energy reaches the edge layer 5 located on the side of the buffer layer 4 away from the flexible substrate 2 and causes the latter hurt.
  • the beamlet laser 6.1 gradually decays to disappear in the buffer layer 4, so that no laser energy reaches the edge layer 5 located on the side of the buffer layer 4 away from the flexible substrate 2 and causes the latter hurt.
  • the technical solution proposed by the present invention even if a small amount of laser energy reaches the edge layer 5 located on the side of the buffer layer 4 away from the flexible substrate 2, it is not enough to cause damage because of the laser energy here. Has been dispersed and attenuated.
  • the scattering element may be formed on the surface of the flexible substrate 2 by an imprint process, a yellow light process, a dry engraving process, or a wet engraving process. It can be seen that in the technical solution of the present invention, the selection of the manufacturing process is very flexible.
  • the scattering element can also be arranged to reflect or absorb light.
  • Fig. 7 shows a schematic diagram of laser transmission of the designed flexible sheet 200 of the comparative example.
  • the flexible board 200 includes: a flexible substrate 12; a buffer layer 14 on one side of the flexible substrate 12; and an edge layer 15 on the side of the buffer layer 14 away from the flexible substrate 12. It is apparent that a scattering structure for the laser beam 16 is not provided in the flexible board 200.
  • a bundle of laser beams 16 having a large intensity is first incident from the bottom side of the glass substrate 11.
  • the laser light 16 penetrates the glass substrate 11 and the flexible substrate 12 to achieve a peeling function, while the remaining laser light penetrates the flexible substrate 12 and enters the buffer layer 14 on one side of the flexible substrate 12, and is carried out in the buffer layer 14
  • the attenuation of the limit due to the overall process, size, etc. of the flexible board 200, the thickness of the buffer layer 14 is limited, and may not be infinitely thick.
  • the buffer layer 14 of the flexible board 200 of the comparative example has the same thickness as the buffer layer 4 of the flexible board 100 according to the present invention, since the bundled laser light 16 has a high strength, it is in the buffer layer 14. Not fully attenuated to disappear or low enough, part of the energy still enters the edge layer 15, and considering the special properties of the laser, the bundled laser can easily cause substantial damage to the structure of the edge layer 15, resulting in a product having "Organic" defects.
  • the flexible board 100 proposed by the present invention has significant advantages in protecting the edge layer.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

柔性板（100,200）包括：柔性基材(2,12)；设置于所述柔性基材(2,12)的至少一个表面上的散射结构（3）；位于所述散射结构（3）的远离所述柔性基材(2,12)的一侧的缓冲层(4,14)；以及位于所述缓冲层(4,14)的远离所述柔性基材(2,12)的一侧的有缘层(5,15)。柔性板（100,200）在保护有缘层(5,15)方面具有明显的优势。

Description

一种柔性板
相关申请的交叉引用
本申请要求享有于2015年10月23日提交的名称为“一种柔性板”的中国专利申请CN201510695337.3的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本发明涉及显示技术领域，尤其涉及一种柔性板。
背景技术
激光剥离技术(Laser Lift-Off,LLO)是指利用激光能量分解玻璃基板和柔性基材接口处的连接层，从而实现将柔性基材从玻璃基板上分离的技术。
然而，使用激光剥离工艺将柔性基材从玻璃基板上取下时，激光从玻璃基板的一侧射入，继而穿透柔性基材、经过缓冲层，并最终到达有缘层。这样，激光的能量会被有缘层吸收，激光的能量会破坏有缘层的结构，对被处理的柔性板导致元件特性的损坏。
发明内容
针对上述现有技术中的问题，即使用激光剥离工艺将柔性基材从玻璃基板取下时，激光的能量会破坏有缘层的结构，本发明提出了一种柔性板。
本发明所提出的柔性板包括：柔性基材；设置于所述柔性基材的至少一个表面上的散射结构；位于所述散射结构的远离所述柔性基材的一侧的缓冲层；以及位于所述缓冲层的远离所述柔性基材的一侧的有缘层。
以此方式，为了实施激光剥离工艺以将柔性基材从玻璃基板的表面上分离，首先从玻璃基板的另一侧射入强度较大的成束的大束激光。大束激光穿透玻璃基板和柔性基材以实现剥离功能，同时剩余的激光在穿透柔性基材后被设置在柔性基材的远离玻璃基板的表面上的散射结构散射，散射结构将强度较大的成束的大 束激光散射为多束强度较弱的小束激光。小束激光进入位于散射结构的远离柔性基材的一侧的缓冲层中，在缓冲层中逐渐衰减。小束激光在缓冲层中逐渐衰减至消失，因此没有激光能量到达位于缓冲层的远离柔性基材的一侧的有缘层并对后者造成伤害。当然，在本发明所提出的技术方案中，即使少量的激光能量到达位于缓冲层的远离柔性基材的一侧的有缘层，也不足以对其造成伤害，因为此处的激光能量已经经过分散和衰减。
在一个实施方式中，所述散射结构包括两个以上散射元件，所述散射元件的尺寸为纳米至微米量级。纳米至微米量级的散射元件针对激光有高效的散射作用。
在一个实施方式中，在所述柔性基材的设置有所述散射元件的表面上，所述散射元件相互之间无间隙地设置。以此方式，散射元件可以紧密的方式排布，加强了作为整体的多个散射元件对来自玻璃基板的方向的激光的散射作用。整束强度较高的大束激光在经过散射元件后被有效散射为多束分散的强度较弱的小束激光。
在一个实施方式中，在所述柔性基材的设置有所述散射元件的表面上，所述散射元件之间设置有间隙。以此方式，可以灵活地调节散射元件的布置，实现分散来自玻璃基板的方向的激光能量的同时，还可以尽可能节省材料、减轻产品重量和降低工艺难度。
在一个实施方式中，在所述柔性基材的表面的任意方向上，所述间隙的宽度为与其相邻的所述散射元件在相应方向上的尺寸的1/4-1/2。以此方式，能够使得对来自玻璃基板的方向的激光能量的分散效果最佳化，同时有效降低了散射元件的数量，节省了工序和材料。
在一个实施方式中，在垂直于所述柔性基材的表面的方向上，所述散射元件的截面为三角形、矩形、正方形、半椭圆形、半圆形或梯形。散射元件的不同的截面形状针对激光的光路有不同的影响，因此可以适应于不同的具体情况，这在下文中将结合不同的实施例详细讨论。
在一个实施方式中，所述散射元件通过压印工艺、黄光工艺、干刻工艺或湿刻工艺形成在所述柔性基材的表面上。由此可见，本发明的方案对具体工艺的选择十分灵活。
在一个实施方式中，所述缓冲层包覆住全部的所述散射元件，并且填充到相邻的所述散射元件之间的空间中。这对激光能量的衰减和缓冲起到很有效的作用， 因为从散射元件的任何表面以任意角度出射的激光都能够进入到缓冲层中以进行衰减。
在一个实施方式中，在垂直于所述柔性基材的表面的方向上，所述缓冲层的厚度相当于所述散射元件在相应方向上的尺寸的数倍至数千倍。这样的尺寸设置，既能够保证使得分散开的激光能量得到有效衰减，又不会过度增加柔性板的厚度和重量。
在一个实施方式中，所述散射元件还能够反射或吸收光线。这样可以更有效地阻止激光的能量被有缘层吸收，进而伤害到有缘层的结构。
上述技术特征可以各种适合的方式组合或由等效的技术特征来替代，只要能够达到本发明的目的。
附图说明
在下文中将基于实施例并参考附图来对本发明进行更详细的描述。其中：
图1显示了本发明所提出的柔性板的结构示意图；
图2显示了本发明所提出的柔性板的第一实施例的部分结构示意图；
图3显示了本发明所提出的柔性板的第二实施例的部分结构示意图；
图4显示了本发明所提出的柔性板的第三实施例的部分结构示意图；
图5显示了本发明所提出的柔性板的第四实施例的部分结构示意图；
图6显示了本发明所提出的柔性板的第一实施例的激光透射示意图；以及
图7显示了所设计的对比例的柔性板的激光透射示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例。
具体实施方式
下面将结合附图对本发明作进一步说明。
图1显示了本发明所提出的柔性板的结构示意图。本发明提出了一种柔性板100。根据本发明的柔性板100包括：柔性基材2；设置于柔性基材2的至少一个表面上的散射结构3(在图1所示的示意图中，散射结构3位于柔性基材2的远离玻璃基板1的表面上)；位于散射结构3的远离柔性基材2的一侧的缓冲层4；以及位于缓冲层4的远离柔性基材2的一侧的有缘层5。从图1中可看出，柔性基材2附着在玻璃基板1上。
根据本发明的柔性板100尤其适合用于激光剥离技术(Laser Lift-Off,LLO)，即利用激光能量分解玻璃基板1和柔性基材2接口处的连接层，从而实现将柔性基材2从玻璃基板1上分离。
具体地，散射结构3可以构造为两个以上的散射元件，该散射元件的尺寸为纳米至微米量级。纳米至微米量级的散射元件针对激光有高效的散射作用。
图2显示了本发明所提出的柔性板的第一实施例的部分结构示意图。在图2所示的第一实施例中，在柔性基材2的设置有散射元件3.1的表面上(即柔性基材2的远离玻璃基板1的表面上)，散射元件3.1相互之间无间隙地设置。以此方式，散射元件3.1可以紧密的方式排布，加强了作为整体的多个散射元件3.1对来自玻璃基板1的方向的激光6的散射作用。图2中清楚地显示了，整束强度较高的大束激光6在经过散射元件3.1后被散射为多束分散的强度较弱的小束激光6.1。
关于散射元件3.1的形状，在图2中可清楚地看出，在垂直于柔性基材2的表面的方向上，散射元件3.1的截面为三角形。其中三角形的底边与柔性基材2的表面贴合，激光从三角形的底边入射，经散射元件3.1的散射后在其两条侧边处出射。以此方式，可通过调节三角形的角的角度来控制光线的出射方向。
当然，这并非限定性的，也可以是这样的情况：在柔性基材的设置有散射元件的表面上，在散射元件之间设置有间隙。以此方式，可以灵活地调节散射元件的布置，实现分散来自玻璃基板1的方向的激光能量的同时，还可以尽可能节省材料、减轻产品重量和降低工艺难度。
图3显示了本发明所提出的柔性板的第二实施例的部分结构示意图。在图3所示的第二实施例中，在柔性基材2的设置有散射元件3.2的表面上(即柔性基材2的远离玻璃基板1的表面上)，在散射元件3.2之间设置有间隙8。以此方式，可以灵活地调节散射元件3.2的布置，实现分散来自玻璃基板1的方向的激光能量的同时，还可以尽可能节省材料、减轻产品重量和降低工艺复杂度。图3中清楚地显示了，整束强度较高的大束激光6在经过散射元件3.2后被散射为多束分散的强度较弱的小束激光6.1。
关于散射元件3.2的形状，在图3中可清楚地看出，在垂直于柔性基材2的表面的方向上，散射元件3.2的截面可为矩形或正方形(图中所示仅为示意性，其边长比例不能理解为针对本实施例的精确限定)。矩形或正方形是最容易加工 的形状，可以大大简化本发明的方案的工艺难度，同时矩形或正方形对材料的利用率也最高，可有效减少废材、节约成本。
关于间隙8的宽度，在柔性基材2的表面的任意方向上(例如图3的水平方向上)，间隙8的宽度例如可以为与其相邻的散射元件3.2在相应方向上的尺寸的1/4-1/2。以此方式，能够使得对来自玻璃基板1的方向的激光能量的分散效果最佳化，同时不必过度地增加整个柔性板100的重量或工艺复杂度。
当然，这并非限定性的，也可以是这样的情况：散射元件3.2相互之间无间隙地设置。以此方式，散射元件3.2可以紧密的方式排布，这加强了作为整体的多个散射元件3.2对来自玻璃基板1的方向的激光6的散射作用。
图4显示了本发明所提出的柔性板的第三实施例的部分结构示意图。在图4所示的第三实施例中，在柔性基材2的设置有散射元件3.3的表面上(即柔性基材2的远离玻璃基板1的表面上)，在散射元件3.3之间设置有间隙8。以此方式，可以灵活地调节散射元件3.3的布置，在实现分散来自玻璃基板1的方向的激光能量的同时，还可以尽可能节省材料、减轻产品重量和降低工艺难度。图4中清楚地显示了，整束强度较高的大束激光6在经过散射元件3.3后被散射为多束分散的强度较弱的小束激光6.1。
关于散射元件3.3的形状，在图4中可清楚地看出，在垂直于柔性基材2的表面的方向上，散射元件3.3的截面可为半椭圆形或半圆形(图中所示仅为示意性，其边长比例不能理解为针对本实施例的精确限定)。其中，半椭圆形或半圆形的直边的一侧附着到柔性基材2的表面上。以此方式，激光垂直入射平面侧，并被散射至包含特定大小的三维立体角的空间中，该三维立体角的大小由散射元件3.3的材料的光学性质决定。
关于间隙8的宽度，在柔性基材2的表面的任意方向上(例如图4的水平方向上)，间隙8的宽度例如可以为与其相邻的散射元件3.3在相应方向上的尺寸的1/4-1/2。以此方式，能够使得对来自玻璃基板1的方向的激光能量的分散效果最佳化，同时不必过度地增加整个柔性板100的重量或工艺复杂度。
当然，这并非限定性的，也可以是这样的情况：散射元件3.3相互之间无间隙地设置。以此方式，散射元件3.3可以紧密的方式排布，这加强了作为整体的多个散射元件3.3对来自玻璃基板1的方向的激光6的散射作用。
图5显示了本发明所提出的柔性板的第四实施例的部分结构示意图。在图5 所示的第四实施例中，在柔性基材2的设置有散射元件3.4的表面上(即柔性基材2的远离玻璃基板1的表面上)，在散射元件3.4之间设置有间隙8。以此方式，可以灵活地调节散射元件3.4的布置，在实现分散来自玻璃基板1的方向的激光能量的同时，还可以尽可能节省材料、减轻产品重量和降低工艺难度。图5中清楚地显示了，整束强度较高的大束激光6在经过散射元件3.4后被散射为多束分散的强度较弱的小束激光6.1。
关于散射元件3.4的形状，在图5中可清楚地看出，在垂直于柔性基材2的表面的方向上，散射元件3.4的截面可为梯形。梯形的长底一侧附着到柔性基材2的表面上。以此方式，首先使得散射元件3.4能够更稳固地附着在柔性基材2上，同时激光垂直地经过长底射入到散射元件3.4中，继而被散射至特定大小的空间中，该空间的大小由散射元件3.4的材料的光学性质以及梯形的四个角的角度决定。
关于间隙8的宽度，在柔性基材2的表面的任意方向上(例如图4的水平方向上)，间隙8的宽度例如可以为与其相邻的散射元件3.4在相应方向上的尺寸的1/4-1/2。以此方式，能够使得对来自玻璃基板1的方向的激光能量的分散效果最佳化，同时不必过度地增加整个柔性板100的重量或工艺复杂度。
当然，这并非限定性的，也可以是这样的情况：散射元件3.4相互之间无间隙地设置。以此方式，散射元件3.4可以紧密的方式排布，这加强了作为整体的多个散射元件3.4对来自玻璃基板1的方向的激光6的散射作用。
图6显示了本发明所提出的柔性板的第一实施例的激光透射示意图。在图6中，可清楚地看出，为了实施激光剥离工艺以将柔性基材2从玻璃基板1的上表面分离，首先从玻璃基板1的底侧射入强度较大的成束的大束激光6。大束激光6穿透玻璃基板1和柔性基材2以实现剥离功能，同时剩余的激光穿透柔性基材2后被设置在柔性基材2的上表面上的散射结构——多个紧密排布的截面为三角形的纳米至微米量级的散射元件3.1散射。散射元件3.1将强度较大的成束的大束激光6散射为多束能量较弱的小束激光6.1。小束激光6.1进入位于散射结构3.1的远离柔性基材2的一侧的缓冲层4中，并在缓冲层4中逐渐衰减。
在图6所示的情况中，缓冲层4包覆住全部的散射元件3.1，并且填充到相邻的散射元件3.1之间的空间中。这对激光能量的衰减和缓冲起到很有效的作用，因为从散射元件3.1的任何表面以任意角度出射的激光都能够进入到缓冲层4中 以进行衰减。在垂直于所述柔性基材2的表面的方向上，缓冲层4的厚度相当于散射元件3.1在相应方向上的尺寸的数倍至数千倍。这样的尺寸设置，既能够保证使得分散开的激光能量得到有效衰减，又不会过度增加柔性板100的厚度和重量。
在图6中，可以看到，小束激光6.1在缓冲层4中逐渐衰减至消失，因此没有激光能量到达位于缓冲层4的远离柔性基材2的一侧的有缘层5并对后者造成伤害。当然，在本发明所提出的技术方案中，即使少量的激光能量到达位于缓冲层4的远离柔性基材2的一侧的有缘层5，也不足以对其造成伤害，因为此处的激光能量已经经过分散和衰减。
在制造工艺方面，散射元件可以通过压印工艺、黄光工艺、干刻工艺或湿刻工艺来形成在柔性基材2的表面上。可见在本发明的技术方案中，制造工艺的选择十分灵活。
为了更有效地阻止激光能量伤害到有缘层5，散射元件还可以设置成能够反射或吸收光线。
图7显示了所设计的对比例的柔性板200的激光透射示意图。在设计的对比例中，柔性板200包括：柔性基材12；位于柔性基材12的一侧的缓冲层14；以及位于缓冲层14的远离柔性基材12的一侧的有缘层15。可明显看出，在柔性板200中未设置有针对激光束16的散射结构。
为了实施激光剥离工艺以将柔性基材12从玻璃基板11的上表面分离，首先从玻璃基板11的底侧射入强度较大的成束的激光16。激光16穿透玻璃基板11和柔性基材12以实现剥离功能，同时剩余的激光穿透柔性基材12后进入位于柔性基材12的一侧的缓冲层14中，在缓冲层14中进行有限度的衰减。然而，由于柔性板200的整体工艺、尺寸等限制，缓冲层14的厚度毕竟有限，不可能是无限度厚的。因此，在对比例的柔性板200的缓冲层14与根据本发明的柔性板100的缓冲层4具有相同厚度的条件下，由于成束的激光16具有很高的强度，其在缓冲层14中未能完全衰减至消失或足够低，部分能量仍然进入了有缘层15，且考虑到激光的特殊性质，成束的激光很容易对有缘层15的结构造成实质性破坏，导致所产生的产品具有“器质性的”缺陷。
两相对比，本发明所提出的柔性板100在保护有缘层方面具有明显的优势。
虽然在本文中参照了特定的实施方式来描述本发明，但是应该理解的是，这 些实施例仅仅是本发明的原理和应用的示例。因此应该理解的是，可以对示例性的实施例进行许多修改，并且可以设计出其他的布置，只要不偏离所附权利要求所限定的本发明的精神和范围。应该理解的是，可以通过不同于原始权利要求所描述的方式来结合不同的从属权利要求和本文中所述的特征。还可以理解的是，结合单独实施例所描述的特征可以使用在其他所述实施例中。

Claims (10)

  1. 一种柔性板，其中，包括：
    柔性基材；
    设置于所述柔性基材的至少一个表面上的散射结构；
    位于所述散射结构的远离所述柔性基材的一侧的缓冲层；以及
    位于所述缓冲层的远离所述柔性基材的一侧的有缘层。
  2. 根据权利要求1所述的柔性板，其中，所述散射结构包括两个以上散射元件，所述散射元件的尺寸为纳米至微米量级。
  3. 根据权利要求2所述的柔性板，其中，在所述柔性基材的设置有所述散射元件的表面上，所述散射元件相互之间无间隙地设置。
  4. 根据权利要求2所述的柔性板，其中，在所述柔性基材的设置有所述散射元件的表面上，所述散射元件之间设置有间隙。
  5. 根据权利要求4所述的柔性板，其中，在所述柔性基材的表面的任意方向上，所述间隙的宽度为与其相邻的所述散射元件在相应方向上的尺寸的1/4-1/2。
  6. 根据权利要求2所述的柔性板，其中，在垂直于所述柔性基材的表面的方向上，所述散射元件的截面为三角形、矩形、正方形、半椭圆形、半圆形或梯形。
  7. 根据权利要求2所述的柔性板，其中，所述散射元件通过压印工艺、黄光工艺、干刻工艺或湿刻工艺形成在所述柔性基材的表面上。
  8. 根据权利要求2所述的柔性板，其中，所述缓冲层包覆住全部的所述散射元件，并且填充到相邻的所述散射元件之间的空间中。
  9. 根据权利要求2所述的柔性板，其中，在垂直于所述柔性基材的表面的方向上，所述缓冲层的厚度相当于所述散射元件在相应方向上的尺寸的数倍至数千倍。
  10. 根据权利要求2所述的柔性板，其中，所述散射元件还能够反射或吸收光线。
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