WO2017047073A1 - Appareil d'impression et procédé de fabrication d'un article - Google Patents

Appareil d'impression et procédé de fabrication d'un article Download PDF

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Publication number
WO2017047073A1
WO2017047073A1 PCT/JP2016/004156 JP2016004156W WO2017047073A1 WO 2017047073 A1 WO2017047073 A1 WO 2017047073A1 JP 2016004156 W JP2016004156 W JP 2016004156W WO 2017047073 A1 WO2017047073 A1 WO 2017047073A1
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WO
WIPO (PCT)
Prior art keywords
substrate
mold
light
mark
measurement device
Prior art date
Application number
PCT/JP2016/004156
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English (en)
Inventor
Yukihiro Yokota
Original Assignee
Canon Kabushiki Kaisha
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Filing date
Publication date
Application filed by Canon Kabushiki Kaisha filed Critical Canon Kabushiki Kaisha
Priority to KR1020187009957A priority Critical patent/KR102059758B1/ko
Publication of WO2017047073A1 publication Critical patent/WO2017047073A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting

Definitions

  • the present invention relates to an imprint apparatus and a method of manufacturing an article.
  • An imprint technique has received attention as one of lithography techniques replacing a photolithography technique.
  • an optical imprint technique is considered to be nearing practical use.
  • the optical imprint technique supplies an imprint material onto a substrate, and cures the imprint material by bringing a mold into contact with the imprint material and irradiating the imprint material with light, thereby transferring a pattern of the mold to the imprint material.
  • a big challenge in the optical imprint technique is to increase throughput.
  • the throughput can be improved by increasing a shot region and ultimately, by forming a pattern at once in an entire pattern formation region of the substrate (that is, making the pattern formation region be one shot region).
  • an increase in the shot region brings about a decrease in the energy density of light with which irradiates the imprint material on the substrate, and this brings about an increase in a time required for curing (to be referred to as a curing time hereinafter). If the curing time increases, pattern transfer precision may be decreased by a relative vibration and positional shift between the substrate and the mold while curing the imprint material.
  • Japanese Patent Laid-Open No. 5-80530 describes a technique of forming a thin-film pattern on a substrate having a large area. More specifically, Japanese Patent Laid-Open No. 5-80530 describes a technique of forming a thin film on the substrate, forming an organic resin layer on the thin film, pressing a stamper against the organic resin layer, and curing, in this state, the organic resin layer by a method such as heating. In Japanese Patent Laid-Open No. 5-80530, however, no consideration is given to pattern transfer precision by a relative vibration and positional shift between the substrate and the stamper (mold) while curing the organic resin layer.
  • the present invention provides an optical imprint technique advantageous in suppressing a decrease in pattern transfer precision even if the area of a region to which a pattern of a mold to be transferred at once increases.
  • One of aspects of the present invention provides an imprint apparatus which cures an imprint material supplied onto a substrate, by bringing a mold into contact with the imprint material and irradiating the imprint material with light
  • the apparatus comprising: a measurement device configured to measure a relative position between the substrate and the mold; a driver configured to drive at least one of the substrate and the mold so as to perform alignment between the substrate and the mold; a light irradiator configured to irradiate the imprint material with light so as to cure the imprint material; and a controller configured to control the driver so as to control the relative position based on information output from the measurement device, in a state in which the light irradiator irradiates the imprint material with the light.
  • Fig. 1 is a view schematically showing the arrangement of an imprint apparatus according to the first embodiment of the present invention
  • Fig. 2 is a view schematically showing the arrangement of an imprint apparatus according to the second embodiment of the present invention
  • Fig. 3A is a view schematically showing the positional relationship among a substrate, a substrate stage, and marks arranged on the substrate stage
  • Fig. 3B is a view schematically showing the positional relationship among a mold, a pattern region, and marks arranged on the mold
  • Fig. 3C is a view schematically showing a state in which the substrate and the mold are overlapped with each other
  • Fig. 4A is a view for explaining an imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 4A is a view for explaining an imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 4A is a view for explaining an imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 4B is a view for explaining the imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 4C is a view for explaining the imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 5A is a view for explaining the imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 5B is a view for explaining the imprint sequence in the imprint apparatus according to the first embodiment of the present invention
  • Fig. 5C is a view for explaining the imprint sequence in the imprint apparatus according to the first embodiment of the present invention.
  • Fig. 1 schematically shows the arrangement of an imprint apparatus 100 according to the first embodiment of the present invention.
  • the imprint apparatus 100 is configured as an optical imprint apparatus which cures an imprint material IM supplied onto a substrate 8 by irradiating the imprint material IM with light in a state in which a mold is in contact with the imprint material IM.
  • directions are shown in an X-Y-Z coordinate system in which directions parallel to the surface of the substrate 8 form an X-Y plane. Let the X direction, the Y direction, and the Z direction be the directions parallel to the X-axis, the Y-axis, and the Z-axis, respectively, in the X-Y-Z coordinate system.
  • ⁇ X, ⁇ Y, and ⁇ Z respectively, be rotation about the X-axis, rotation about the Y-axis, and rotation about the Z-axis.
  • Control or driving regarding the X-axis, the Y-axis, and the Z-axis means control or driving regarding the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis, respectively.
  • control or driving regarding the ⁇ X-axis, the ⁇ Y-axis, and the ⁇ Z-axis means control or driving regarding rotation about an axis parallel to the X-axis, rotation about an axis parallel to the Y-axis, and rotation about an axis parallel to the Z-axis, respectively.
  • the imprint apparatus 100 can include a substrate stage 9, a mold holder 4, a measurement device 1, a driver DRVU, a light irradiator 2, an imprint material supply 6 (dispenser), and a controller 10.
  • the substrate stage 9 holds the substrate 8.
  • the substrate stage 9 can include, for example, a substrate chuck (not shown) which chucks the substrate 8.
  • the mold holder 4 holds a mold 5.
  • the mold holder 4 can include, for example, a mold chuck (not shown) which chucks the mold 5.
  • the mold holder 4 may include a deformation mechanism which deforms the mold 5 in accordance with the shape of the substrate 8.
  • the measurement device 1 measures the relative position between the substrate 8 and the mold 5.
  • the measurement device 1 can include, for example, an image sensor 21 and TTM (Through The Mold) scopes 22 which observe the substrate 8 via the mold 5.
  • the measurement device 1 can also include a light source which illuminates marks M1, M2, M3, and M4 to be described later with illumination light (for example, visible light or infrared light).
  • the illumination light is light having a wavelength which does not cure the imprint material IM.
  • the imprint apparatus 100 can further include a moving mechanism 23 which moves the measurement device 1.
  • the driver DRVU drives at least one of the substrate 8 and the mold 5 so as to adjust the relative position between the substrate 8 and the mold 5.
  • the driver DRVU can include, for example, a substrate driver 42 configured to position the substrate 8 and a mold driver 51 configured to position the mold 5.
  • the substrate driver 42 drives the substrate stage 9 so as to drive the substrate 8 with respect to a plurality of axes (for example, three axes of the X-axis, the Y-axis, and the ⁇ Z-axis), and the mold driver 51 drives the mold holder 4 so as to drive the mold 5 with respect to a plurality of axes (for example, six axes of the X-axis, the Y-axis, the Z-axis, the ⁇ X-axis, the ⁇ Y-axis, and the ⁇ Z-axis).
  • the substrate stage 9 is supported by a stage base 41 and driven by the substrate driver 42.
  • the driver DRVU In addition to adjusting the relative position between the substrate 8 and the mold 5 with respect to the X-axis, the Y-axis, the ⁇ X-axis, the ⁇ Y-axis, and the ⁇ Z-axis, the driver DRVU also adjusts the relative position between the substrate 8 and the mold 5 with respect to the Z-axis. Adjusting the relative position between the substrate 8 and the mold 5 with respect to the Z-axis includes operations of bringing the mold 5 and the imprint material IM on the substrate 8 into contact with each other, and separating them from each other.
  • the imprint material supply 6 supplies the imprint material IM onto the substrate 8.
  • the imprint material supply 6 may form a part of the imprint apparatus 100 or may be configured as an apparatus other than the imprint apparatus 100. That is, the imprint material supply 6 is an optional component of the imprint apparatus 100.
  • the imprint material IM includes a material (for example, an ultraviolet-curing resin) to be cured by being irradiated with light.
  • the imprint material supply 6 can have a plurality of orifices and be configured to discharge imprint materials from the plurality of orifices.
  • the light irradiator 2 irradiates the imprint material IM supplied onto the substrate 8 with light (for example, ultraviolet light) 3 so as to cure the imprint material IM.
  • the light irradiator 2 irradiates the entire pattern formation region of the substrate 8 with the light 3.
  • the pattern formation region is a region where a pattern to be formed on the substrate 8 and includes all chip regions. Each chip region is the minimum region cut by dicing.
  • the substrate 8 is a wafer having 300 mm in diameter, and the size of conventional one shot region is 26 mm ⁇ 33 mm, a region larger than the conventional region by about 82 times needs to be irradiated with light at once in order to irradiate the entire pattern formation region of the substrate 8 with light. That is, when the entire pattern formation region is irradiated with the light at once, a light irradiation time needs to be about 82 times longer in order to ensure a necessary exposure amount if the intensity of the light 3 generated by the light source of the light irradiator 2 remains unchanged. It is therefore necessary to reduce a relative vibration and positional shift between the substrate 8 and the mold 5 within this irradiation time.
  • the entire pattern formation region is irradiated with the light at once.
  • the present invention is not limited to this. The present invention is advantageous in increasing a region irradiated with light at once by the light irradiator 2.
  • the controller 10 controls the measurement device 1, the driver DRVU, the light irradiator 2, and the imprint material supply 6.
  • the controller 10 also controls the driver DRVU so as to adjust or maintain, based on information output from the measurement device 1, the relative position between the substrate 8 and the mold 5 in a state in which the light irradiator 2 irradiates the imprint material IM on the substrate 8 with the light. This reduces the relative vibration and positional shift between the substrate 8 and the mold 5 within the irradiation time of the light 3, improving pattern transfer precision.
  • the moving mechanism 23 which moves the measurement device 1 as described above.
  • the measurement device 1 In an arrangement in which the measurement device 1 is fixed, the measurement device 1 needs to be configured so as not to block the light 3 from the light irradiator 2.
  • the measurement device 1 can typically be arranged outside an optical path of the light 3.
  • the arrangement of the measurement device 1 can be bulky in order to allow the measurement device 1 to observe a pattern region of the mold 5, and in particular the central mark in the pattern region.
  • the measurement device 1 can be moved, by the moving mechanism 23, to a position between the light irradiator 2 and the pattern region of the mold 5 when observing the mark (fourth mark) M4 arranged in the pattern region of the mold 5 and the mark (third mark) M3 arranged in the pattern formation region of the substrate 8.
  • the moving mechanism 23 can evacuate the measurement device 1 outside the optical path of the light 3 from the light irradiator 2 before the light irradiator 2 irradiates the imprint material IM with the light.
  • the measurement device 1 observes the mark (first mark) M1 provided in a reference plate 19 on the substrate stage 9 and the mark (second mark) M2 arranged on the mold 5.
  • An optical axis MAX of the measurement device 1 between the measurement device 1 and the substrate 8 can be parallel to an optical axis CAX of the light 3 from the light irradiator 2.
  • the optical axis of each scope 22 may be bent as exemplified in Fig. 1 or may not be bent.
  • the controller 10 can recognize, based on information output from the measurement device 1 observing the marks M3 and M4 on the substrate 8 and the mold 5, the relative position between the marks M3 and M4, that is, the relative position between the substrate 8 and the mold 5 when bringing the mold 5 into contact with the imprint material on the substrate 8. Based on these relative positions, the controller 10 controls the driver DRVU so as to perform alignment between the substrate 8 and the mold 5. The controller 10 also controls the light irradiator 2 so as to irradiate the imprint material IM with the light after the completion of contact between the mold 5 and the imprint material on the substrate 8, and alignment between the substrate 8 and the mold 5.
  • the controller 10 also recognizes, based on information output from the measurement device 1 observing the marks M1 and M2 on the substrate 8 and the mold 5, the relative position between the marks M1 and M2, that is, the relative position between the substrate 8 and the mold 5 in the period during which the light irradiator 2 irradiates the imprint material IM with the light. Then, based on the relative position, the controller 10 controls the driver DRVU so as to perform alignment between the substrate 8 and the mold 5. As described above, in the first embodiment, alignment between the substrate 8 and the mold 5 is also performed based on the relative position between the marks M1 and M2 in a state in which the imprint material IM is irradiated with the light 3 from the light irradiator 2.
  • Fig. 3A schematically shows the positional relationship among the substrate 8, the substrate stage 9, and the marks M1 arranged on the substrate stage 9.
  • Fig. 3B schematically shows the positional relationship among the mold 5, a pattern region 17, and the marks M2 arranged on the mold 5.
  • the pattern region 17 is a region of the mold 5 where the pattern to be transferred to the imprint material IM on the substrate 8 is formed. Further, the pattern region 17 contacts the imprint material IM on the pattern formation region (the region where the pattern will be formed) of the substrate 8.
  • Fig. 3C schematically shows a state in which the substrate 8 and the mold 5 are overlapped with each other. At least one mark M1 and at least one mark M2 fall within the field of view of the measurement device 1.
  • the plurality of marks M3 are arranged on the substrate 8, though not shown in Fig. 3A.
  • the plurality of marks M4 are also arranged on the mold 5, though not shown in Fig. 3B.
  • the marks M3 and M4 can be arranged, for example, on scribe lines between the chip regions.
  • the imprint material supply 6 supplies the imprint material IM onto the substrate 8.
  • the moving mechanism 23 positions the measurement device 1 at a position capable of observing the mark M3 on the substrate 8 and the mark M4 on the mold 5.
  • the driver DRVU performs alignment between the substrate 8 and the mold 5 while the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M3 and M4.
  • the driver DRVU brings the substrate 8 and the mold 5 closer to each other such that the imprint material IM on the substrate 8 and the pattern region of the mold 5 contact each other. Also at this time, the moving mechanism 23 positions the measurement device 1 at the position capable of observing the mark M3 on the substrate 8 and the mark M4 on the mold 5. Then, the driver DRVU can perform alignment between the substrate 8 and the mold 5 while the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M3 and M4.
  • the mold 5 is deformed so as to form a convex shape toward the substrate 8, the central portion of the mold 5 first contacts the imprint material IM on the substrate 8, and then a contact region between the imprint material IM and the mold 5 gradually increases from the central portions toward the peripheral portions of the substrate 8 and the mold 5.
  • the plurality of marks M3 can be arranged on the substrate 8, and the plurality of marks M4 can also be arranged on the mold 5 so as to correspond to the marks M3. Therefore, the measurement device 1 can measure the relative position between the substrate 8 and the mold 5 at a plurality of points by using the plurality of marks M3 and M4. At this time, the moving mechanism 23 can move the measurement device 1 from the central portions toward the peripheral portions of the substrate 8 and the mold 5 so as to change a pair of the marks M3 and M4 to be measured as the contact region increases.
  • the moving mechanism 23 evacuates the measurement device 1 outside the optical path between the light irradiator 2 and the imprint material IM. After that, the moving mechanism 23 positions the measurement device 1 at a position capable of observing the mark M1 on the substrate 8 and the mark M2 on the mold 5. Then, the driver DRVU can adjust or maintain the relative position between the substrate 8 and the mold 5 while the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M1 and M2.
  • the light irradiator 2 irradiates the imprint material IM with the light 3 via the mold 5.
  • the imprint material IM is cured by irradiation with the light 3.
  • the driver DRVU maintains the relative position between the substrate 8 and the mold 5 while the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M1 and M2. This reduces the relative vibration and positional shift between the substrate 8 and the mold 5 within the irradiation time of the light 3, improving the pattern transfer precision.
  • the mark M1 and the mark M2 are not preferably irradiated with the light from the light irradiator 2 but may be irradiated with it.
  • the driver DRVU separates the substrate 8 and the mold 5 from each other so as to release the mold 5 from the cured imprint material IM on the substrate 8. Also at this time, the driver DRVU can maintain the relative position between the substrate 8 and the mold 5 while the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M1 and M2.
  • the number of measurement devices 1 may be one or a plurality of measurement devices. However, providing the plurality of measurement devices 1 is superior in that a plurality of mark pairs can be observed simultaneously.
  • Fig. 2 schematically shows an imprint apparatus 100 according to the second embodiment of the present invention. Matters that are not mentioned in the second embodiment can comply with the first embodiment.
  • the imprint apparatus 100 of the second embodiment includes a second measurement device 60 which measures the relative position between a substrate 8 and a mold 5 by using marks M3 and M4 in a state in which a light irradiator 2 does not irradiate an imprint material IM on the substrate 8 with light.
  • the second measurement device 60 can have the same arrangement as a measurement device 1.
  • the second measurement device 60 can include, for example, an image sensor 61 and TTM (Through The Mold) scopes 62 which observe the substrate 8 via the mold 5.
  • the second measurement device 60 can also include a light source which illuminates the marks M3 and M4 with illumination light (for example, visible light or infrared light).
  • the illumination light is light having a wavelength which does not cure the imprint material IM.
  • the imprint apparatus 100 can also include a moving mechanism 63 which moves the second measurement device 60.
  • the moving mechanism 63 can evacuate the second measurement device 60 outside the optical path of light 3 from the light irradiator 2 before the light irradiator 2 irradiates the imprint material IM with the light.
  • the measurement device 1 By providing the second measurement device 60 in addition to the measurement device 1, it is possible to cause the measurement device 1 to measure the relative position between the substrate 8 and the mold 5 continuously by using marks M1 and M2.
  • the measurement device 1 cannot measure the relative position between the substrate 8 and the mold 5 by using the marks M1 and M2 in a period during which the measurement device 1 measures the relative position between the substrate 8 and the mold 5 by using the marks M3 and M4.
  • the measurement device 1 can measure the relative position between the substrate 8 and the mold 5 by using the marks M1 and M2 even in a period during which the second measurement device 60 measures the relative position between the substrate 8 and the mold 5 by using the marks M3 and M4.
  • the method of manufacturing the article of manufacturing a device includes a step of forming a pattern on a substrate (a wafer, a glass plate, or a film-like substrate) by using the above-described imprint apparatus.
  • the manufacturing method can further include a step of processing (for example, etching) the substrate onto which the pattern has been formed. Note that when manufacturing another article such as a patterned media (storage medium) or an optical element, the manufacturing method can include, instead of etching, another process of processing the substrate onto which the pattern has been formed.
  • the method of manufacturing the article according to this embodiment is superior to a conventional method in at least one of the performance, quality, productivity, and production cost of the article.
  • Embodiment(s) of the present invention can also be realized by a computer of a system or apparatus that reads out and executes computer executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be referred to more fully as a 'non-transitory computer-readable storage medium') to perform the functions of one or more of the above-described embodiment(s) and/or that includes one or more circuits (e.g., application specific integrated circuit (ASIC)) for performing the functions of one or more of the above-described embodiment(s), and by a method performed by the computer of the system or apparatus by, for example, reading out and executing the computer executable instructions from the storage medium to perform the functions of one or more of the above-described embodiment(s) and/or controlling the one or more circuits to perform the functions of one or more of the above-described embodiment(s).
  • computer executable instructions e.g., one or more programs
  • a storage medium which may also be referred to more fully as
  • the computer may comprise one or more processors (e.g., central processing unit (CPU), micro processing unit (MPU)) and may include a network of separate computers or separate processors to read out and execute the computer executable instructions.
  • the computer executable instructions may be provided to the computer, for example, from a network or the storage medium.
  • the storage medium may include, for example, one or more of a hard disk, a random-access memory (RAM), a read only memory (ROM), a storage of distributed computing systems, an optical disk (such as a compact disc (CD), digital versatile disc (DVD), or Blu-ray Disc (BD) TM ), a flash memory device, a memory card, and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'appareil d'impression de l'invention durcit un matériau d'impression disposé sur un substrat en amenant un moule au contact du matériau d'impression et en irradiant ce dernier avec de la lumière. L'appareil comprend: un dispositif de mesure conçu pour mesurer une position relative entre le substrat et le moule; un dispositif d'entraînement conçu pour entraîner le substrat et/ou le moule de manière à réaliser un alignement entre eux; un irradiateur de lumière conçu pour irradier le matériau d'impression avec de la lumière et le durcir; et un dispositif de commande conçu pour amener le dispositif d'entraînement à contrôler la position relative, sur la base d'informations fournies par le dispositif de mesure, dans un état tel que le dispositif de rayonnement de lumière irradie le matériau d'impression avec la lumière.
PCT/JP2016/004156 2015-09-17 2016-09-13 Appareil d'impression et procédé de fabrication d'un article WO2017047073A1 (fr)

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KR1020187009957A KR102059758B1 (ko) 2015-09-17 2016-09-13 임프린트 장치 및 물품 제조 방법

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JP2015184318A JP6604793B2 (ja) 2015-09-17 2015-09-17 インプリント装置および物品製造方法
JP2015-184318 2015-09-17

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WO2017047073A1 true WO2017047073A1 (fr) 2017-03-23

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JP7089348B2 (ja) * 2017-07-28 2022-06-22 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7116552B2 (ja) * 2018-02-13 2022-08-10 キヤノン株式会社 インプリント装置、および、物品製造方法
TWI728489B (zh) * 2019-10-04 2021-05-21 永嘉光電股份有限公司 利用可溶解性模仁的壓印方法及相關壓印系統

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