WO2017043025A1 - 光電変換素子用基板 - Google Patents
光電変換素子用基板 Download PDFInfo
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- WO2017043025A1 WO2017043025A1 PCT/JP2016/003792 JP2016003792W WO2017043025A1 WO 2017043025 A1 WO2017043025 A1 WO 2017043025A1 JP 2016003792 W JP2016003792 W JP 2016003792W WO 2017043025 A1 WO2017043025 A1 WO 2017043025A1
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- Prior art keywords
- substrate
- photoelectric conversion
- stainless steel
- power generation
- layer
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- 239000000758 substrate Substances 0.000 title claims abstract description 108
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 43
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 53
- 239000010935 stainless steel Substances 0.000 claims abstract description 52
- 238000010248 power generation Methods 0.000 abstract description 44
- 239000011521 glass Substances 0.000 abstract description 25
- 238000002161 passivation Methods 0.000 abstract 2
- 239000010409 thin film Substances 0.000 description 41
- 239000010408 film Substances 0.000 description 38
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 34
- 239000000463 material Substances 0.000 description 25
- 239000011787 zinc oxide Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- MAGFQRLKWCCTQJ-UHFFFAOYSA-N 4-ethenylbenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=C(C=C)C=C1 MAGFQRLKWCCTQJ-UHFFFAOYSA-N 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000010893 electron trap Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- -1 PolyEthylene Terephthalate Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004502 linear sweep voltammetry Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/06—Electrolytic coating other than with metals with inorganic materials by anodic processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
- C25D9/10—Electrolytic coating other than with metals with inorganic materials by cathodic processes on iron or steel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L2031/0344—Organic materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/50—Photovoltaic [PV] devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present invention relates to a substrate used for a photoelectric conversion element, particularly an organic thin film solar cell.
- the organic thin film solar cell has an advantage that the material cost and the manufacturing cost are low as compared with other prominent solar cells such as a silicon-based solar cell, and is expected as a solar cell bearing the future.
- the organic thin-film solar cell has a problem that the power generation efficiency is lower than that of other types of solar cells already in practical use. Therefore, improvement in power generation efficiency is required for practical use of organic thin film solar cells. In addition, in order to widely put organic thin-film solar cells into practical use, it is necessary to further reduce material costs and manufacturing costs from the viewpoint of covering low power generation efficiency.
- a glass substrate is usually used as a base material for organic thin film solar cells.
- the ratio of the glass substrate to the material cost of the organic thin film solar cell is not small.
- glass substrates need to be handled with care because they may break during manufacture, transportation, and installation.
- the cost for that is also required.
- a transparent electrode is formed on the surface of the glass substrate, but ITO (Indium Tin Oxide), which is mainly used as the material of the transparent electrode, is expensive and unstable because it contains indium, which is a rare metal. . For these reasons, it is difficult to reduce the manufacturing cost of an organic thin film solar cell using a glass substrate.
- Patent Document 1 discloses a technique using an aluminum substrate instead of the conventional ITO / glass substrate.
- the present invention has been made in view of the above circumstances, is low in cost as compared with the case of using a conventional ITO / glass substrate, is easy to handle, and reduces the power generation performance of a solar cell. It aims at providing the board
- the inventors of the present invention have made extensive studies on substrate materials that can replace conventional glass substrates and transparent electrodes. As a result, the following knowledge was obtained. (1) If a stainless steel plate is used as a base material, the cost can be reduced as compared with the case of using a conventional ITO / glass substrate, and handling is easy. (2) By increasing the Cr ratio on the surface of the passive film of the stainless steel plate, excellent power generation characteristics can be obtained.
- the gist configuration of the present invention is as follows. 1. It consists of a stainless steel plate with a passive film on the surface, The substrate for photoelectric conversion elements whose atomic ratio Cr / (Fe + Cr) in the surface of the said passive film is 0.08 or more.
- This invention while being low-cost compared with the conventional ITO / glass board
- This substrate for a photoelectric conversion element can be suitably used for a photoelectric conversion element such as an organic thin film solar cell and a solar power generation module using the element.
- the substrate for photoelectric conversion elements of the present invention (hereinafter sometimes simply referred to as “substrate”) is made of a stainless steel plate having a passive film on the surface, and the atomic ratio Cr / (Fe + Cr) on the surface of the passive film is 0.08 or more.
- the photoelectric conversion element substrate will be specifically described.
- the substrate for photoelectric conversion elements of the present invention is composed of a stainless steel plate. Since a stainless steel plate that is a metal material is used, the substrate of the present invention has both a role as a structural material that mechanically supports the photoelectric conversion element and a role as a collector that is a component of the photoelectric conversion element. Can bear.
- a glass substrate used as a base material in conventional organic thin-film solar cells generally has strength but lacks toughness, and care must be taken during manufacture, transportation, and installation. Further, the glass substrate is difficult to handle as a support itself, and is used while being held by a metal frame or casing. In addition, when a plastic substrate such as a PET substrate is used instead of the glass substrate, the substrate itself has a low strength, so that some support is required at the time of installation.
- stainless steel which is a metal material, has both strength and toughness, and also has excellent corrosion resistance. Therefore, when used as a base material for a photoelectric conversion element, it is particularly advantageous in terms of function as a structural material. is there. In addition, it is advantageous in terms of raw material costs and manufacturing costs compared to glass, plastic, and other metal materials such as aluminum and titanium.
- the thickness of the stainless steel plate is not particularly limited and can be selected according to required characteristics. When a thin stainless steel plate (stainless steel foil) is used, there is an advantage that lightness and flexibility are excellent although the strength is reduced. On the other hand, when a thick stainless steel plate is used, the weight increases, but depending on the application, it can be used without any problem. From the viewpoint of ease of handling, the thickness of the stainless steel plate is preferably 0.1 mm or more and 2.0 mm or less. The thickness is more preferably 0.2 mm or more. The thickness is more preferably 1.5 mm or less, and further preferably 1.0 mm or less.
- the Cr content of the stainless steel sheet is preferably 13% by mass or more, and more preferably 16% by mass or more. .
- the Cr content is preferably 20% by mass or less.
- the C content of the stainless steel plate is preferably as small as possible from the viewpoint of corrosion resistance, and is preferably 0.12% by mass or less, and more preferably 0.08% by mass or less.
- the C content is preferably 0.002% by mass or more, and more preferably 0.005% by mass or more. More preferred.
- the stainless steel plate can optionally further contain at least one selected from the group consisting of Ti, Nb, and Mo.
- Ti it is preferable that Ti content shall be 1.0 mass% or less.
- Nb it is preferable that Nb content shall be 1.0 mass% or less.
- Mo it is preferable that Mo content shall be 3.0 mass% or less.
- Ti, Nb, and Mo are elements that can be added arbitrarily, the lower limit of their content may be 0, but from the viewpoint of improving corrosion resistance, the Ti content is 0.01% by mass or more.
- the Nb content is preferably 0.01% by mass or more, and the Mo content is preferably 0.1% by mass or more.
- ferritic stainless steel As the stainless steel.
- the surface of stainless steel is usually covered with a passive film made of a stable oxide or the like. As a result, stainless steel has excellent corrosion resistance.
- the stainless steel plate used for the photoelectric conversion element substrate not only has a passive film, but the atomic ratio Cr / (Fe + Cr) on the surface of the passive film may be 0.08 or more. is important.
- a passive film is also formed on the surfaces of as-manufactured stainless steel plates and stainless steel plates polished in an atmospheric environment.
- the surface of such a passive film is mainly composed of Fe-based oxides or hydroxides, and has a low Cr content, and therefore has low electrical conductivity. Therefore, when such a normal stainless steel plate is used as the photoelectric conversion element substrate, good power generation characteristics cannot be obtained.
- the substrate of the present invention by increasing the atomic ratio Cr / (Fe + Cr) on the outermost surface of the passive film to 0.08 or higher, the electrical conductivity on the substrate surface is improved, The characteristics of the used photoelectric conversion element can be improved.
- the atomic ratio Cr / (Fe + Cr) is preferably 0.10 or more, more preferably 0.15 or more, further preferably 0.18 or more, and 0.20 or more. Is most preferred.
- Cr / (Fe + Cr) is increased, a new Cr-rich oxidation phase is generated, which may reduce electrical conductivity. Therefore, Cr / (Fe + Cr) is preferably 0.90 or less, and more preferably 0.70 or less.
- the value of the atomic ratio Cr / (Fe + Cr) can be measured by the method described in the examples.
- the thickness of the passive film is not particularly limited and may be any thickness, but is preferably less than 2.3 nm.
- the thickness of the passive film varies depending on the manufacturing history of the stainless steel sheet, but the thickness of the passive film is 3 in the case of a stainless steel sheet that has been manufactured under general conditions or a stainless steel sheet that has been polished in an atmospheric environment. .0 nm may be exceeded. Therefore, if the thickness of the passive film is less than 2.3 nm, the electrical conductivity on the substrate surface can be further improved, and the characteristics of the photoelectric conversion element using the substrate can be further improved.
- the thickness of the passive film is more preferably 2.2 nm or less, and further preferably 2.1 nm or less.
- the lower limit of the thickness of the passive film is not particularly limited, but is preferably 0.8 nm or more, and more preferably 1.0 nm or more in order to provide sufficient protection as a passive film.
- the thickness of the said passive film can be measured by the method as described in an Example.
- the method for obtaining the passive film is not particularly limited, and any method can be used.
- surface treatment under an acidic environment can be used.
- the passive film formed in the atmosphere on the surface of the stainless steel plate is modified by immersion in an acidic solution, cathodic electrolytic treatment in an acidic solution, anodic dissolution treatment, or the like. A method is mentioned.
- the arithmetic average roughness Ra of the surface of the photoelectric conversion element substrate is less than 10 nm.
- the arithmetic average roughness Ra of the surface of the photoelectric conversion element substrate is less than 10 nm.
- Ra is preferably less than 10 nm, more preferably 9.5 nm or less, and even more preferably 9.0 nm or less.
- Examples of a method for obtaining a substrate for a photoelectric conversion element having an Ra of less than 10 nm include a method of polishing a surface of a stainless steel plate and rolling a stainless steel plate using a low-roughness roll. From the viewpoint of productivity, it is preferable to use rolling using a roll having a low roughness.
- the lower limit is not particularly limited. However, if Ra is excessively reduced, the effect of reducing Ra is saturated and the manufacturing cost increases. Therefore, Ra is preferably 1 nm or more, and more preferably 2 nm or more.
- arithmetic mean roughness Ra in the said substrate surface for photoelectric conversion elements can be measured by the method as described in an Example.
- substrate of this invention can be used as a board
- one embodiment of the present invention will be described by taking the case where the substrate of the present invention is used for an organic thin film solar cell as an example. However, the present invention is not limited to the following description, and the substrate of the present invention is organic.
- the present invention can be used not only for thin-film solar cells but also for general photoelectric conversion elements having similar forms such as dye-sensitized solar cells and photodiodes, and the effects of the present invention can be obtained.
- the structure of the organic thin-film solar cell produced using the substrate of the present invention is not particularly limited and can be any structure, but at least the first electrode A stainless steel substrate, an organic power generation layer including an organic semiconductor, and a second electrode.
- the organic thin film solar cell preferably further includes at least one set of an electron collection layer and a hole collection layer.
- the order of laminating these layers is not particularly limited.
- the layers can be laminated in the order of the electron collection layer, the organic power generation layer, the hole collection layer, and the second electrode from the stainless steel substrate side.
- the stainless steel substrate functions as a positive electrode and the second electrode functions as a negative electrode.
- the organic thin film solar cell may have a structure in which one set (each layer) of an electron collection layer, an organic power generation layer, and a hole collection layer is laminated.
- a structure called a tandem type stacked as described above can also be used.
- the electron collection layer is usually a layer provided between the negative electrode and the organic power generation layer, and has a function of efficiently guiding electrons from the organic power generation layer to the negative electrode. If the electron collection layer does not exist and the negative electrode and the organic power generation layer are directly laminated, electrons cannot be effectively extracted from the organic power generation layer, and the power that can be extracted out of the system is the power that is originally generated. Compared to a significant decrease. Therefore, it is preferable to provide an electron collection layer.
- the material which comprises the said electron collection layer is not specifically limited, It is preferable to use an n-type semiconductor.
- the n-type semiconductor include titanium oxide and zinc oxide.
- the n-type semiconductor can be used alone or in combination of two or more.
- zinc oxide refers to both ZnO and ZnO 1-X having some O deficiency.
- the electron collection layer can be formed by any method including a sol-gel method.
- a sol-gel method it is preferable to perform heat treatment at a temperature of about 130 to 300 ° C. so that no solvent or moisture remains after the film formation.
- the thickness of the electron collection layer is preferably in the range of 30 to 100 nm.
- the electron trapping layer may contain other substances other than zinc oxide as long as the effects of the present invention are not impaired, and usually contains other substances as long as it is less than 5% by mass. .
- the reason why zinc oxide is suitable as the material for the electron collection layer is considered to be related to ultraviolet rays contained in sunlight as described below.
- a transparent material such as glass is used as a substrate, and sunlight is irradiated from the substrate side.
- substrate of this invention does not permeate
- substrate of this invention sunlight is irradiated from the opposite side to a board
- the power generation characteristics may be deteriorated if the ultraviolet ray component contained in the sunlight reaching the electron collection layer is small.
- zinc oxide used as the material for the electron collection layer, good power generation characteristics can be obtained even when the ultraviolet component is small.
- any type of organic power generation layer including an organic semiconductor can be used.
- a bulk heterojunction type organic power generation layer using an electron acceptor and an electron donor is used. Is preferably used.
- the bulk heterojunction type organic power generation layer include P3HT (polythiophene derivative: poly (3-hexylthiophene)) which is a p-type organic semiconductor and PCBM (fullerene derivative: [6,6]- A layer in which phenyl-C61-butyric acid methyl ester) is mixed can be used.
- the thickness of the organic power generation layer is preferably in the range of 70 to 300 nm.
- the hole collection layer is usually a layer provided between the organic power generation layer and the electrode serving as the positive electrode, and has a function of efficiently guiding holes from the organic power generation layer to the positive electrode.
- the material which comprises the said hole collection layer is not specifically limited, PEDOT: PSS (poly (3,4-ethylenedioxythiophene): poly (4-styrene sulfonic acid)) which is a conductive polymer can be used.
- the configurations of the electron collection layer, the organic power generation layer, and the hole collection layer are not limited to the above description. That is, even if the above-described configuration is replaced by a configuration with higher photoelectric conversion efficiency, the effect of the present invention is not impaired. By substituting with a material having higher photoelectric conversion efficiency in the future, the effect of the present invention will be greater.
- the present invention does not impair the effect.
- a photoelectric conversion element substrate made of a stainless steel plate and an organic thin film solar cell using the photoelectric conversion element substrate were prepared, and the characteristics thereof were evaluated.
- an organic thin-film solar cell using a conventional glass substrate was prepared and evaluated together. The production procedure and evaluation method of the photoelectric conversion element substrate and the organic thin film solar cell will be described below.
- a substrate for an organic thin-film solar cell was prepared using the stainless steel plates A to C shown in Table 1 (SUS430) as the original plate.
- the original plate A is a steel plate manufactured by low-roughness rolling
- the original plate B is a steel plate having a mirror-finished surface by electrolytic abrasive polishing
- the original plate C is a steel plate manufactured under general rolling conditions.
- the thickness and arithmetic average roughness Ra of each original plate are as shown in Table 1.
- Two substrates each having a size of 2.5 cm ⁇ 4.0 cm are prepared from each of the original plates A to C, and one substrate of each set is used as it is, and the other substrate is Cr on the surface of the passive film.
- a zinc oxide precursor is prepared by dissolving 0.35 mol / l of bisacetylacetonato zinc in a 2-methoxyethanol mixed solvent containing 10.6% by mass of acetylacetone, and the zinc oxide precursor is spun onto a stainless steel substrate. Coated. Immediately thereafter, the substrate was heated at 250 ° C. for 1 hour to form a zinc oxide layer on the stainless steel substrate. The thickness of the zinc oxide layer was about 60 nm.
- aqueous dispersion containing 1.3% by mass in total of commercially available PEDOT (poly (3,4-ethylenedioxythiophene)) and PSS (poly (4-styrene sulfonic acid)) at a mass ratio of 1: 2.5 was prepared.
- the hole dispersion layer was formed by spin-coating the aqueous dispersion on the organic power generation layer and drying it. The spin coating conditions were set such that the thickness of the hole collection layer after drying was about 190 nm.
- a slit-shaped Au electrode having one end connected was prepared as a collection electrode.
- the hole collection layer is covered with a stainless steel mask in which slit-shaped openings having a width of about 0.5 mm are arranged at intervals of about 0.5 mm, and after Au is evaporated in a vacuum bell jar, By additionally depositing Au in a band shape so as to cross the slit row in the vicinity of one end of the formed slit row, each slit is electrically connected to produce a slit-like Au deposited film as shown in FIG. did.
- the thickness of the Au vapor deposition film was about 100 nm.
- a polymer film (Kelha Extec Co., Ltd., Serer R1150 gas barrier sheet, film thickness: 100 ⁇ m) was pressure-bonded as a protective film to the surface on which the collector electrode was formed, thereby obtaining an organic thin film solar cell.
- the glass plate is cut into a size of 2.5 cm ⁇ 4.0 cm, washed with 2-propanol, and then subjected to the same conditions as those of the organic thin film solar cell using the stainless steel substrate described above, and the electron collection layer, the organic power generation
- Each layer of a layer, a hole collection layer, and a collection electrode, and a protective film were formed to obtain an organic thin film solar cell.
- the value of the effective area is calculated by multiplying the area 3.6 cm 2 of the 1.5 cm ⁇ 2.4 cm region having the element structure by 1/2 in consideration of shielding by the Au slit electrode side. . Furthermore, for each of the organic thin-film solar cells using a stainless steel plate as a substrate, the energy conversion efficiency ⁇ is 2.0% or more when “ ⁇ ” and 2.5% or more is “ ⁇ ”. Evaluated. The evaluation results are as shown in Table 2.
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Abstract
Description
(1)ステンレス鋼板を基材として用いれば、従来のITO/ガラス基板を用いる場合と比べてコストを削減できるとともに、取り扱いが容易である。
(2)前記ステンレス鋼板の不動態皮膜表面におけるCr比率を高くすることにより、優れた発電特性が得られる。
1.表面に不動態皮膜を有するステンレス鋼板からなり、
前記不動態皮膜の表面における原子数比Cr/(Fe+Cr)が0.08以上である、光電変換素子用基板。
本発明の光電変換素子用基板は、ステンレス鋼板で構成されている。金属材料であるステンレス鋼板を用いているため、本発明の基板は、光電変換素子を機械的に支える構造材としての役割と、光電変換素子の一構成要素である集電極としての役割の、両者を担うことができる。
ステンレス鋼の表面は、通常、安定な酸化物等からなる不動態皮膜に覆われており、その結果、ステンレス鋼は優れた耐食性を有している。本発明においては、光電変換素子用基板に用いられるステンレス鋼板が単に不動態皮膜を有するだけでなく、該不動態皮膜の表面における原子数比Cr/(Fe+Cr)を0.08以上とすることが重要である。
さらに、本発明の光電変換素子用基板においては、前記光電変換素子用基板表面の算術平均粗さRaを10nm未満とすることが好ましい。光電変換素子を形成する際には、基板の表面に各種の機能を有する層が形成されるが、基板表面の粗度が大きいと、該基板上に形成される層の厚さに不均一が生じやすく、その結果、光電変換素子の特性が不安定となる場合がある。また、基板表面の粗度が大きいと、基板表面の凸部を介して短絡が発生するリスクが高くなる。そこで、Raを10nm未満とすることが好ましく、9.5nm以下とすることがより好ましく、9.0nm以下とすることがさらに好ましい。Raが10nm未満である光電変換素子用基板を得る方法としては、例えば、ステンレス鋼板を表面研磨する、低粗度のロールを用いてステンレス鋼板を圧延するといった方法が挙げられるが、工業的には、低粗度のロールを使用した圧延を用いることが生産性の観点から好ましい。一方、Raは低ければ低いほど好ましいため、その下限は特に限定されない。しかし、過度にRaを低下させると、Raを低減することによる効果が飽和することに加えて製造コストが増加するため、Raは1nm以上とすることが好ましく、2nm以上とすることがより好ましい。なお、前記光電変換素子用基板表面における算術平均粗さRaは、実施例に記載の方法で測定することができる。
本発明の基板は、各種任意の光電変換素子用の基板として用いることができる。なかでも、有機系太陽電池用の基板として用いることが好ましく、有機薄膜太陽電池用の基板として用いることがより好ましい。以下、本発明の基板を有機薄膜太陽電池に使用する場合を例に、本発明の一実施態様を説明するが、本発明は以下の説明に限定されることなく、本発明の基板は、有機薄膜太陽電池のみならず、例えば、色素増感太陽電池やフォトダイオードなど、類似の形態を有する光電変換素子全般に使用可能であり、本発明の効果を得ることが出来る。
本発明の基板(以下、「ステンレス基板」という場合がある)を用いて作製される有機薄膜太陽電池の構造は特に限定されず、任意の構造とすることができるが、少なくとも、第1の電極として機能するステンレス基板と、有機半導体を備える有機発電層と、第2の電極とを備えている。また、前記有機薄膜太陽電池は、さらに電子捕集層および正孔捕集層を少なくとも一組備えることが好ましい。これらの層の積層順は特に限定されないが、例えば、前記ステンレス基板側から、電子捕集層、有機発電層、正孔捕集層、および第2の電極の順で積層することができる。この順序で積層された有機薄膜太陽電池においては、前記ステンレス基板が正極、前記第2の電極が負極として機能する。
前記電子捕集層は、通常、負極と有機発電層との間に設けられる層であり、電子を効率的に有機発電層から負極に導く機能を有している。電子捕集層が存在せず、負極と有機発電層とが直接積層されていると、有機発電層から有効に電子を取り出すことができず、系外に取り出せる電力が本来発電されている電力と比較して大幅に減少する。そのため、電子捕集層を設けることが好ましい。
上記有機発電層としては、有機半導体を備える有機発電層であれば任意のタイプものを用いることができるが、発電効率の観点から、電子受容体と電子供与体とによるバルクヘテロジャンクション型の有機発電層を用いることが好ましい。前記バルクヘテロジャンクション型の有機発電層としては、例えば、p型有機半導体であるP3HT(ポリチオフェン誘導体:poly(3-hexylthiophene))と、n型有機半導体であるPCBM(フラーレン誘導体: [6,6]-phenyl-C61-butyric acid methyl ester)とが混合された層を用いることができる。その場合、良好な発電効率を得るという観点から、前記有機発電層の厚さを70~300nmの範囲内にすることが好ましい。
正孔捕集層は、通常、有機発電層と正極として働く電極との間に設けられる層であり、正孔を効率的に有機発電層から正極に導く機能を有している。前記正孔捕集層を構成する材料は特に限定されないが、導電性ポリマーであるPEDOT:PSS(poly(3,4-ethylenedioxythiophene) : poly(4-styrene sulfonic acid) )を用いることができる。
上述したように、第1の電極としてステンレス基板を用いた有機薄膜太陽電池においては、該ステンレス基板側から光を入射できないため、第2の電極側から光が入射される。したがって、第2の電極は、有機発電層への光の入射を著しく阻害するものであってはならない。そのため、前記第2の電極としては、ITO等の一般に透明電極として用いられるものを使用できる。また、極めて薄い層、またはメッシュやスリットのような開口部を有する構造として設けられた金属電極を、第2の電極として用いることもできる。これにより、金属電極が有機発電層への光の入射を著しく阻害することを防止できる。また、有機発電層への光の入射を著しく阻害するものでない限りにおいては、有機薄膜太陽電池の表面、側面、及び裏面に、例えば保護等を目的として被覆や塗装がなされていても、本発明の効果を損なうものではない。
表1に示すA~Cのステンレス鋼板(SUS430)を原板として使用し、有機薄膜太陽電池用の基板を作製した。原板Aは低粗度圧延により製造した鋼板、原板Bは電解砥粒研磨により表面を鏡面に仕上げた鋼板、原板Cは、一般的な圧延条件で製造された鋼板である。各原板の板厚と算術平均粗さRaは、表1に示した通りである。前記原板A~Cのそれぞれから、2.5cm×4.0cmの大きさの基板を2枚ずつ作製し、各組の一方の基板はそのまま使用し、他方の基板は、不動態皮膜表面におけるCrの原子数比を制御するための表面処理を施した後、使用した。前記表面処理としては、3%硫酸中で、-5A/dm2で1秒間の電解処理を行った。各基板は、2-プロパノールで洗浄した後、有機薄膜太陽電池の作製に供された。得られた基板のRaは、使用した原板のRaと同じであることを確認した。
[[電子捕集層]]
ビスアセチルアセトナト亜鉛を、10.6質量%のアセチルアセトンを含む2-メトキシエタノール混合溶媒に、0.35mol/l溶解させて酸化亜鉛前駆体を調製し、酸化亜鉛前駆体をステンレス基板上にスピンコートした。その後直ちに基板を250℃で1時間加熱することによってステンレス基板上に亜鉛酸化物層を形成した。亜鉛酸化物層の厚さは約60nmであった。
P3HT(ポリチオフェン誘導体:poly(3-hexylthiophene) )とPCBM(フラーレン誘導体: [6,6]-phenyl-C61-butyric acid methyl ester )とを質量比5:4で混合し、得られた混合物を、濃度が3.9質量%となるようにクロロベンゼンに溶解して溶液を得た。前記溶液を、電子捕集層としての亜鉛酸化物層の上にスピンコートした後、室温で30分以上乾燥させることによって有機発電層を形成した。スピンコートの条件は、乾燥後の有機発電層の厚さが約200nmとなるように設定した。
市販のPEDOT(poly(3,4-ethylenedioxythiophene))とPSS(poly(4-styrene sulfonic acid) )とを質量比1:2.5で、合計で1.3質量%含む水分散液を調製した。前記水分散液を有機発電層の上にスピンコートし、乾燥させることによって正孔捕集層を形成した。スピンコートの条件は、乾燥後の正孔捕集層の厚さが約190nmとなるように設定した。
前記正孔捕集層の上に、集電極として、一端が接続されたスリット状のAu電極を作製した。具体的には、幅約0.5mmのスリット状の開口が約0.5mm間隔で配列されたステンレス製のマスクで正孔捕集層を覆い、真空ベルジャー中でAuを蒸着した後、Auで形成されたスリット列の一端付近にスリット列を横断するようにバンド状にAuを追加蒸着することで、各スリットを電気的に接続し、図1に示すようなスリット状のAu蒸着膜を作製した。Au蒸着膜の厚さは約100nmであった。その後、前記集電極が形成された面に保護膜としてポリマーフィルム(クレハエクステック株式会社製、セレールR1150 ガスバリヤーシート、膜厚100μm)を圧着することで、有機薄膜太陽電池とした。
比較のために、上記のステンレス基板に代えて、片面にITO膜が成膜された市販のガラス板(株式会社倉元製作所製、ガラス板厚さ1mm、ITO厚さ約200nm、シート抵抗約5Ω/sq)を基板として、有機薄膜太陽電池を作製した。すなわち、前記ガラス板を2.5cm×4.0cmの大きさに切り出し、2-プロパノールで洗浄した後、上述のステンレス基板を用いた有機薄膜太陽電池と同じ条件で、電子捕集層、有機発電層、正孔捕集層、及び集電極の各層と保護膜とを形成し、有機薄膜太陽電池とした。
原板として用いたステンレス鋼板A~Cのそれぞれについて、表面の算術平均粗さRaを測定した。測定は、触針式の表面粗さ計を用い、JIS B0601に準じて行った。カットオフ値λcは0.25mmとし、ステンレス鋼板の圧延方向に垂直な方向を評価方向として、ステンレス鋼板それぞれにつき5回測定した平均を評価値とした。測定結果は、表1に示した通りである。なお、先に述べたように、Crの原子数比を制御するための表面処理を施した後の基板のRaは、原板のRaと同一であった。
No.1~6の各例において基板として用いたステンレス鋼板のそれぞれについて、不動態皮膜の表面における原子数比Cr/(Fe+Cr)を測定した。測定は、AES(オージェ電子分光法)による深さ方向分析によって行い、得られた結果から、不動態皮膜の最表面における原子数比Cr/(Fe+Cr)を算出した。また、AESによって測定された深さ方向における酸素濃度プロファイルにおいて、酸素濃度が最表面における値の1/2となる深さを不動態皮膜の厚さとした。厚さの値は、スパッタレートを用いて算出した。原子数比Cr/(Fe+Cr)および不動態皮膜の厚さは、各サンプル5点ずつ測定し、その平均値を用いた。測定結果は、使用した原板の種類および表面処理の有無とともに、表2に示す。
最後に、上述のようにして作製された有機薄膜太陽電池のそれぞれについて、以下の手順で電池特性の評価を行った。まず、有機薄膜太陽電池のAuスリット電極側から光を照射した状態で、リニアスイープボルタンメトリー(LSV)により、該有機薄膜太陽電池の光電流-電圧特性を測定した。前記光としては、AM1.5Gのスペクトル分布を示し、100mW/cm2の光強度を有する擬似太陽光を使用した。測定された光電流-電圧特性から、エネルギー変換効率η(%)、短絡電流ISC(mA)、曲線因子FFを算出した。その際、太陽電池としての有効面積は1.8cm2とした。前記有効面積の値は、Auスリット電極側による遮蔽を考慮して、素子構造を有する1.5cm×2.4cmの領域の面積3.6cm2に、1/2を乗じて算出したものである。さらに、ステンレス鋼板を基板として用いた有機薄膜太陽電池のそれぞれについては、エネルギー変換効率ηが2.0%以上のものを「○」、2.5%以上のものを「◎」として、発電特性を評価した。評価結果は、表2に示した通りである。
2 正孔捕集層
3 Au電極(集電極)
Claims (3)
- 表面に不動態皮膜を有するステンレス鋼板からなり、
前記不動態皮膜の表面における原子数比Cr/(Fe+Cr)が0.08以上である、光電変換素子用基板。 - 前記不動態皮膜の厚さが、2.3nm未満である、請求項1に記載の光電変換素子用基板。
- 前記光電変換素子用基板表面の算術平均粗さRaが10nm未満である、請求項1または2に記載の光電変換素子用基板。
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