WO2017041490A1 - 基板卡匣 - Google Patents

基板卡匣 Download PDF

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Publication number
WO2017041490A1
WO2017041490A1 PCT/CN2016/079889 CN2016079889W WO2017041490A1 WO 2017041490 A1 WO2017041490 A1 WO 2017041490A1 CN 2016079889 W CN2016079889 W CN 2016079889W WO 2017041490 A1 WO2017041490 A1 WO 2017041490A1
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WO
WIPO (PCT)
Prior art keywords
substrate
substrate cassette
sensing
processor
elements
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PCT/CN2016/079889
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English (en)
French (fr)
Inventor
李小宝
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/509,457 priority Critical patent/US20170275083A1/en
Publication of WO2017041490A1 publication Critical patent/WO2017041490A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Definitions

  • Embodiments of the invention relate to a substrate cassette.
  • TFT-LCD Thin Film Transistor Liquid Crystal Display
  • Known thin film transistor liquid crystal displays generally include a backlight module and a liquid crystal panel.
  • the liquid crystal panel includes an array substrate and a color filter substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate.
  • the substrate needs to be shuttled multiple times between relatively independent production facilities.
  • a substrate chuck that can carry a plurality of substrates is generally used as a carrier device for storing and transporting the substrate, and the substrate chuck is placed on the mechanical handling device to and from the production equipment.
  • the substrate cassette generally includes a cassette housing and a plurality of carrier layers disposed inside the cassette housing.
  • the cassette housing is in the form of a single-sided opening, and the opening is used for the robot to pick up and place the substrate, and the carrier layer
  • Each includes a plurality of support plates disposed on the inner wall of the cassette housing for placing the substrate, and the substrate is placed on the support plate.
  • the substrate cassette is a multi-layer design, and the robot removes the substrate from the substrate cassette according to the computer system control, or inserts the substrate into the substrate cassette, or transfers the substrate cassette by the transfer device.
  • the robot removes the substrate from the substrate cassette according to the computer system control, or inserts the substrate into the substrate cassette, or transfers the substrate cassette by the transfer device.
  • an offline operation mode that is, the worker manually controls the robot and does not pass the computer system
  • the offline operation mode the worker, the robot, and the transmission device cannot sense the presence or absence of the substrate or the number of substrates in the substrate cassette. Therefore, when the substrate cassette is handled or picked up, the substrate that has been placed in the substrate cassette may appear. Collision and fragmentation.
  • At least one embodiment of the present invention provides a substrate cassette to solve the collision of a substrate that has been placed in a substrate cassette when the substrate cassette is not handled or picked up by a computer system in the prior art. Problems such as fragmentation.
  • Embodiments of the present invention provide a substrate cassette having a plurality of carrier layers configured to carry a substrate, each of which is provided with an inductive component, and the substrate cartridge is externally disposed with each of the sensing components One-to-one corresponding warning component; among them,
  • the sensing element is configured to sense a substrate within the carrier layer
  • the alerting element is configured to issue an alert signal when the sensing component senses the substrate.
  • the plurality of carrier layers includes at least one sidewall and at least one support plate secured to the sidewall.
  • the sidewall of the carrier layer is defined by at least one inner sidewall of the substrate cassette.
  • At least one of the support plates is provided with the sensing element in each of the carrier layers, and the sensing device is a pressure sensor or a photoelectric sensor.
  • the at least one sidewall of each of the carrier layers is provided with the inductive element and the inductive device is a photosensor.
  • the photosensor is a diffuse reflectance type photosensor.
  • a groove is provided on an upper surface of the support plate, and the sensing element is disposed within the groove.
  • the at least one side wall is provided with a recess and the inductive element is disposed within the recess.
  • the alerting element is an indicator light or an infrared light emitting device.
  • the substrate cassette further includes:
  • a processor electrically coupled to each of the inductive elements and configured to process an inductive signal of each of the inductive elements
  • a display coupled to the processor and configured to display processing results of the processor.
  • the substrate cassette further includes a wireless transceiver component electrically coupled to the processor and configured to transmit alert information to the target receiver based on processing results of the processor.
  • the substrate cassette further includes a power supply element connectable to at least one of the processor, the display, each of the sensing elements, each of the wireless transceiver elements, and each of the warning elements Power it.
  • the substrate cassette further includes a charging element connectable to the power supply element to charge it.
  • the substrate cassette provided by the embodiment of the present invention can detect whether the substrate is carried in the carrying layer by providing the sensing element in the carrying layer, and carries a base in the carrying layer.
  • the warning component sends a warning signal, so that the worker or the carrying device can perform corresponding processing according to the warning signal sent by the warning component, thereby avoiding improper operation of the substrate cassette on which the substrate has been placed.
  • the substrate in the cassette has problems such as collision and breakage.
  • FIG. 1 is a schematic structural diagram of a substrate cassette according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional structural view of a first substrate cassette according to an embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional structural view of a second type of substrate cassette according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional structural view of a third substrate cassette according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a frame of a substrate cassette according to an embodiment of the present invention.
  • an embodiment of the present invention provides a substrate cassette 100 including a plurality of carrier layers 1 disposed inside a substrate cassette 100 to carry a substrate.
  • Each carrier layer 1 is provided with an inductive component 13 and a substrate card.
  • the ⁇ 100 is externally provided with a warning element 14 in one-to-one correspondence with each of the sensing elements 13; wherein the sensing element 13 is configured to sense whether a substrate is placed in the carrier layer 1, and the warning element 14 is configured to sense the carrier layer 1 at the sensing element 13. Send a warning letter when the substrate is carried inside number.
  • the sensing element 13 in the carrier layer 1, it is possible to detect whether the substrate is carried in the carrier layer 1, and the warning component 14 corresponding to the sensing component 13 is disposed when the substrate is carried in the carrier layer 1.
  • a warning signal is issued, so that the worker or the carrying device can perform corresponding processing according to the warning signal sent by the warning component 14 to avoid the substrate in the substrate cassette 100 caused by improper operation of the substrate cartridge 100 on which the substrate has been placed. Problems with collisions, crushing, etc.
  • the plurality of carrier layers 1 includes at least one sidewall 12' defined by the inner sidewall 12 of the substrate cassette 100 and at least one support panel 11 secured to the sidewall 12'.
  • each carrier layer 1 includes at least one side wall 12' and at least one support plate 11 fixed to the side wall 12'.
  • the carrier layer 1 may include left and right side walls 12' and are respectively fixed to the left, Two support plates 11 on the right side wall 12'. It should be noted here that, for the sake of simplicity, each of the carrier layers 1 shown in Fig. 1 includes only one side wall 12' and one support plate 11.
  • the material of the inner side wall of the substrate cassette in the embodiment of the present application is well-known in the art, and is not described herein; and the support plate 11 may be formed by, for example, coating the outer surface of the steel plate with an anti-aging rubber, but the embodiment of the present invention Not limited to this.
  • the position of the sensing element 13 can be flexibly set based on different types of sensing elements 13, for example at least one of the support plates 1 is provided with sensing elements 13; for example, at least one side wall 12 of each carrier layer 1 The sensing element 13 is provided on the '.
  • the sensing element 13 can be a pressure sensor 131 or a photosensor 132.
  • the pressure sensor 131 and the photosensor 132 there may be different position settings, which will be exemplified below.
  • the pressure sensor 131 can be disposed on the upper surface of the support plate 11, whereby the pressure sensor 131 will be pressed when the substrate 2 is placed on the support plate 11.
  • This embodiment adopts a structure in which the pressure sensor 131 is disposed on the surface of the support plate 11, which is easier to implement and maintain.
  • the photosensor 132 when the sensing element 13 is the photosensor 132, the photosensor 132 can be disposed in the recess 110 of the upper surface of the support plate 11. Alternatively, as shown in Fig. 4, when the sensing element 13 is the photosensor 132, the photosensor 132 may also be disposed in the recess 120 of at least one of the side walls 12'. In one example, assuming that the thickness of the support plate 11 is T and the depth of the groove 11 is D, then D ⁇ 4/5T.
  • the photosensor 132 in the groove 110 on the upper surface of the support plate 11 or in the groove 120 on the side wall 12'; moreover, since the photosensor 132 is disposed in the above-mentioned groove 110 or 120, the photoelectric sensor can be avoided 132 hinders operation of the substrate.
  • a diffuse reflection type photosensor can be employed as the photosensor 132.
  • the alert element 14 is an indicator light or an infrared light emitting device.
  • the light emitted by the indicator light can be recognized by the corresponding identification device provided on the robot, thereby notifying the robot that the substrate 2 has been placed in the carrier layer 1 corresponding to the indicator light; The lights can also be observed directly by the staff.
  • the signal emitted by the infrared illuminating device can be recognized by the corresponding identification device provided on the robot, thereby informing the robot that the substrate 2 has been placed in the carrier layer 1 corresponding to the indicator light.
  • the above identification device may be an infrared receiving head, the internal circuit of which includes an infrared monitoring diode, an amplifier, a limiter, a band pass filter, an integrating circuit, a comparator, etc.; its structure and working principle are well known in the art. Technology is not described here.
  • the substrate cassette 100 may further include a processor 21 and a display. twenty two.
  • the processor 21 is electrically coupled to the respective sensing elements 13 and configured to process the sensing signals of the respective sensing elements 13; the processor 21 is also coupled to the display 22, which is configured to display the processing results of the processor 21.
  • the processed signal from processor 21 can be transmitted over a wireless network to a target receiver.
  • the substrate cassette 100 may further include a plurality of wireless transmitting elements 23 respectively electrically coupled to the processor 21; the wireless transceiver elements 23 are configured to transmit alert information to the target receiver based on the processing results of the processor 21.
  • the processing structure of the processor 21 can be transmitted by the wireless transceiver component 23 from the wireless network to the handheld electronic device or computer of the worker to facilitate recording, viewing or verification.
  • the substrate cassette 100 further includes a power supply component 24 configured to power the processor 21, the display 22, the various sensing components 13, the respective wireless transceiver components 23, and the respective alerting components 14.
  • the power supply element may be, for example, a lithium battery pack, but embodiments of the present invention are not limited thereto.
  • the substrate cassette 100 further includes a charging element 25 that charges the power supply element 24.
  • the charging member may be, for example, a power transformer, but embodiments of the present invention are not limited thereto.
  • the processor 21, the wireless transceiver component 23, the power supply component 24, and the charging component 25 may be disposed in the casing of the substrate cassette 100.
  • substrate card The 100 has at least an opening configured to insert or take out the substrate 2, which will not be described herein, and the display 22 may be disposed on any non-open surface of the substrate cassette 100 for easy viewing.
  • the substrate card provided by the embodiment of the invention can detect whether the substrate is carried in the carrier layer by providing the sensing component in the carrier layer, and the warning component sends a warning signal when the substrate is carried in the carrier layer, thereby enabling the staff to Or the handling device can perform corresponding processing according to the warning signal sent by the warning component, thereby avoiding the problem that the substrate in the substrate cassette is collided or broken due to improper operation of the substrate cassette on which the substrate has been placed.

Abstract

一种基板卡匣（100），可以解决现有技术中不通过计算机系统操作机械手对基板卡匣进行搬运或取放时可能使已经放入基板卡匣内的基板出现碰撞、破碎等现象的问题。所述基板卡匣（100）内限定有配置以承载基板的多个承载层（1），每个所述承载层（1）内设置有感应元件（13），并且所述基板卡匣（100）外部设置有与各个所述感应元件（13）一一对应的警示元件（14）；其中，所述感应元件（14）用于感应所述承载层（1）内是否放置有基板；并且所述警示元件（14）配置以在所述感应元件（13）感应到所述承载层（1）内承载有基板时发出警示信号。

Description

基板卡匣 技术领域
本发明的实施例涉及一种基板卡匣。
背景技术
薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display，TFT-LCD)具有体积小、功耗低、无辐射、分辨率高等优点，在当前的显示领域中占据了主导地位，并且己经广泛应用于各种数字信息化设备。
已知的薄膜晶体管液晶显示器一般包括背光模组和液晶面板两大部分。液晶面板包括阵列基板和彩膜基板，以及设置于阵列基板和彩膜基板间的液晶层。在液晶显示器制造过程中，基板需要多次往返于各相对独立的生产设备之间。实际生产中一般使用可承载多张基板的基板卡闸作为基板存储和搬送的承载装置，再将该基板卡闸放置在机械搬运装置上往返于各生产设备之间。
已知技术中，基板卡匣一般包括卡匣壳体和设置在卡匣壳体内部的多个承载层，卡匣壳体为单面开口形式，所述开口用于机械手取放基板，承载层均包括设置在卡匣壳体内壁上的数个用于放置基板的支撑板，基板放置于支撑板上。
基板卡匣为多层设计，机械手根据计算机系统控制由基板卡匣取出基板，或将基板放入基板卡匣，或以传送设备对基板卡匣进行转移。实际应用过程中，经常出现线下操作方式(即工作人员手工控制机械手，不通过计算机系统)处理临时事务。线下操作方式时，工作人员、机械手及传送设备无法感知基板卡匣内有无基板或基板数量，所以在进行搬运或取放基板卡匣时，可能使已经放入基板卡匣内的基板出现碰撞、破碎的现象。
发明内容
本发明的至少一个实施例提供一种基板卡匣，以解决已知技术中不通过计算机系统操作机械手对基板卡匣进行搬运或取放时、可能使已经放入基板卡匣内的基板出现碰撞、破碎等现象的问题。
本发明实施例提供一种基板卡匣，其内限定有配置以承载基板的多个承载层，每个承载层内设置有感应元件，并且所述基板卡匣外部设置有与各个所述感应元件一一对应的警示元件；其中，
所述感应元件配置以感应所述承载层内的基板；并且
所述警示元件配置以在所述感应元件感应到所述基板时发出警示信号。
在一个示例中，所述多个承载层包括至少一个侧壁及固定于侧壁的至少一个支撑板。在一个示例中，所述承载层的侧壁由所述基板卡匣的至少一个内侧壁限定。
在一个示例中，每个所述承载层中至少一个所述支撑板上设置有所述感应元件，并且所述感应器件为压力传感器或光电传感器。
在一个示例中，每个所述承载层的所述至少一个侧壁上设置有所述感应元件，并且所述感应器件为光电传感器。
在一个示例中，所述光电传感器为扩散反射型光电传感器。
在一个示例中，所述支撑板的上表面上设置有凹槽，并且所述感应元件设置在凹槽内。
在一个示例中，所述至少一个侧壁上设置有凹槽，并且所述感应元件设置在凹槽内。
在一个示例中，所述警示元件为指示灯或红外发光器件。
在一个示例中，所述基板卡匣还包括：
处理器，与各个所述感应元件电连接并且配置以处理各个所述感应元件的感应信号；以及
显示器，与所述处理器连接并且配置以显示所述处理器的处理结果。
在一个示例中，所述基板卡匣还包括无线收发元件，与所述处理器电连接并且配置以根据所述处理器的处理结果向目标接收器发射警示信息。
在一个示例中，所述基板卡匣还包括供电元件，可与所述处理器、所述显示器、各个所述感应元件、各个所述无线收发元件和各个所述警示元件中的至少一个连接以对其供电。
在一个示例中，所述基板卡匣还包括充电元件，可与所述供电元件连接以对其充电。
本发明实施例提供的基板卡匣通过在所述承载层内设置所述感应元件，能够对所述承载层内是否承载有基板进行检测，并在所述承载层内承载有基 板时由所述警示元件发出警示信号，从而使工作人员或搬运装置能够根据所述警示元件发出的警示信号进行相应的处理，避免对已经放置有基板的基板卡匣进行不当操作从而导致的基板卡匣内的基板出现碰撞、破碎等现象的问题。
附图说明
以下将结合附图对本发明的实施例进行更详细的说明，以使本领域普通技术人员更加清楚地理解本发明，其中：
图1为本发明实施例提供的基板卡匣的结构示意图；
图2为本发明实施例提供的第一种基板卡匣的剖面结构示意图；
图3为本发明实施例提供的第二种基板卡匣的剖面结构示意图；
图4为本发明实施例提供的第三种基板卡匣的剖面结构示意图；
图5为本发明实施例提供的基板卡匣的框架示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
参见图1，本发明实施例提供一种基板卡匣100，包括基板卡匣100内部限定的多个配置以承载基板的承载层1，每个承载层1内设置有感应元件13，并且基板卡匣100外部设置有与各个感应元件13一一对应的警示元件14；其中，感应元件13配置以感应承载层1内是否放置有基板，并且警示元件14配置以在感应元件13感应到承载层1内承载有基板时发出警示信 号。
本实施例中，通过在承载层1内设置感应元件13，能够对承载层1内是否承载有基板进行检测，并在承载层1内承载有基板时由与感应元件13对应设置的警示元件14发出警示信号，从而使工作人员或搬运装置能够根据警示元件14发出的警示信号进行相应的处理，避免对已经放置有基板的基板卡匣100进行不当操作从而导致的基板卡匣100内的基板出现碰撞、破碎等现象的问题。
在一个示例中，多个承载层1包括由基板卡匣100的内侧壁12限定的至少一个侧壁12’和固定于侧壁12’的至少一个支撑板11。换言之，每个承载层1包括至少一个侧壁12’及固定于侧壁12’的至少一个支撑板11，例如，承载层1可包括左、右两个侧壁12’以及分别固定在左、右侧壁12’上的两个支撑板11。在此需要说明的是，为了简化的目的，图1示出的每个承载层1仅包括一侧的侧壁12’和一个支撑板11。在此需要说明的是，本申请实施例中基板卡匣内侧壁的材质属于本领域熟知技术，在此不作赘述；而支撑板11例如可由钢板外包覆耐老化橡胶形成，但本发明实施例不限于此。
基于不同类型的感应元件13，可以灵活设置感应元件13的位置，例如每个承载层1中至少一个支撑板11上设置有感应元件13；又例如，每个承载层1的至少一个侧壁12’上设置有感应元件13。
在不同示例中，感应元件13可以为压力传感器131或光电传感器132。对于压力传感器131和光电传感器132，可以有不同的位置设置，下面将对其进行举例描述。
如图2所示，感应元件13为压力传感器131时，可以将压力传感器131设置于支撑板11的上表面，由此，当基板2放置于支撑板11之上时将压覆压力传感器131。本实施例采用压力传感器131设置于支撑板11的表面的结构，较容易实现和维护。
如图3所示，感应元件13为光电传感器132时，可以将光电传感器132设置于支撑板11的上表面的凹槽110内。可替换地，如图4所示，感应元件13为光电传感器132时，还可以将光电传感器132设置于至少其中一个侧壁12’的凹槽120内。在一个示例中，假设支撑板11的厚度为T，凹槽11的深度为D，则D≤4/5T。
如图3和图4所示的结构中，当基板2放置于支撑板11之上时，其能 够被支撑板11上表面的凹槽110内或者侧壁12’上的凹槽120内的光电传感器132所感应；而且，由于光电传感器132设置于上述凹槽110或120内，可以避免光电传感器132阻碍对基板的操作。本实施例中可以采用扩散反射型光电传感器作为光电传感器132。
在一个示例中，警示元件14为指示灯或红外发光器件。在以机械手对基板卡匣100进行操作时，指示灯发出的光可以被机械手上设置的相应识别装置所识别，从而告知机械手该指示灯所对应的承载层1内已经放置有基板2；当然指示灯也可以直接被工作人员观察到。类似地，红外发光器件所发出的信号可以被机械手上设置的相应识别装置所识别，从而告知机械手该指示灯所对应的承载层1内已经放置有基板2。在一个示例中，上述识别装置可为红外接收头，其内部电路包括红外监测二极管、放大器、限幅器、带通滤波器、积分电路、比较器等等；其结构和工作原理属于本领域熟知技术，在此不作赘述。
在一个示例中，如图5所示，为了实现对感应元件13(例如压力传感器131和光电传感器132)感应基板2后的信号进行处理并显示，基板卡匣100还可以包括处理器21和显示器22。处理器21与各个感应元件13电连接，配置以处理各个感应元件13的感应信号；处理器21还与显示器22连接，显示器22配置以显示处理器21的处理结果。
在一个示例中，可以将处理器21处理后的信号通过无线网络发送给目标接收器。例如，基板卡匣100还可包括多个无线发送元件23，分别与处理器21电连接；无线收发元件23配置以根据处理器21的处理结果向目标接收器发射警示信息。例如：可以通过无线收发元件23将处理器21的处理结构由无线网络发送给工作人员的手持电子设备或计算机，以利于记录、查看或检验。
在一个示例中，基板卡匣100还包括供电元件24，配置以为处理器21、显示器22、各个感应元件13、各个无线收发元件23和各个警示元件14供电。供电元件例如可为锂电池组，但本发明的实施例不限于此。
在一个示例中，基板卡匣100还包括为供电元件24充电的充电元件25。充电元件例如可为电源变压器，但本发明的实施例不限于此。
需要说明的是，本发明的实施例中，处理器21、无线收发元件23、供电元件24和充电元件25可以设置于基板卡匣100的壳体内。通常基板卡匣 100至少具有配置以放入或取出基板2的开口，在此不再赘述，而显示器22可以设置于基板卡匣100的非开任意表面，以便于观察。
本发明实施例提供的基板卡匣通过在承载层内设置感应元件，能够对承载层内是否承载有基板进行检测，并在承载层内承载有基板时由警示元件发出警示信号，从而使工作人员或搬运装置能够根据警示元件发出的警示信号进行相应的处理，避免对已经放置有基板的基板卡匣进行不当操作从而导致的基板卡匣内的基板出现碰撞、破碎等现象的问题。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。
本申请要求于2015年9月10日提交的名称为“一种基板卡匣”的中国专利申请No.201520704730.X的优先权，该申请全文以引用方式合并于本文。

Claims (13)

  1. 一种基板卡匣，其内限定有配置以承载基板的多个承载层，每个所述承载层内设置有感应元件，并且所述基板卡匣外部设置有与各个所述感应元件一一对应的警示元件；其中，
    所述感应元件配置以感应所述承载层内的基板；并且
    所述警示元件配置以在所述感应元件感应到所述基板时发出警示信号。
  2. 如权利要求1所述的基板卡匣，其中，每个所述承载层包括至少一个侧壁及固定于侧壁的至少一个支撑板。
  3. 如权利要求2所述的基板卡匣，其中，所述承载层的侧壁由所述基板卡匣的至少一个内侧壁限定。
  4. 如权利要求2或3所述的基板卡匣，其中，每个所述承载层中至少一个所述支撑板上设置有所述感应元件，并且所述感应器件为压力传感器或光电传感器。
  5. 如权利要求2-4中任一项所述的基板卡匣，其中，每个所述承载层的所述至少一个侧壁上设置有所述感应元件，并且所述感应元件为光电传感器。
  6. 如权利要求4或5所述的基板卡匣，其中，所述光电传感器为扩散反射型光电传感器。
  7. 如权利要求4所述的基板卡匣，其中，所述支撑板的上表面上设置有凹槽，并且所述感应元件设置在凹槽内。
  8. 如权利要求5所述的基板卡匣，其中，所述至少一个侧壁上设置有凹槽，并且所述感应元件设置在凹槽内。
  9. 如权利要求1所述的基板卡匣，其中，所述警示元件为指示灯或红外发光器件。
  10. 如权利要求1所述的基板卡匣，还包括：
    处理器，与各个所述感应元件电连接并且配置以处理各个所述感应元件 的感应信号；以及
    显示器，与所述处理器连接并且配置以显示所述处理器的处理结果。
  11. 如权利要求10所述的基板卡匣，还包括无线收发元件，与所述处理器电连接并且配置以根据所述处理器的处理结果向目标接收器发射警示信息。
  12. 如权利要求11所述的基板卡匣，还包括供电元件，可与所述处理器、所述显示器、各个所述感应元件、各个所述无线收发元件和各个所述警示元件中的至少一个连接以对其供电。
  13. 如权利要求12所述的基板卡匣，还包括充电元件，可与所述供电元件连接以对其充电。
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