WO2017041449A1 - 测试装置及采用该测试装置的测试方法 - Google Patents

测试装置及采用该测试装置的测试方法 Download PDF

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Publication number
WO2017041449A1
WO2017041449A1 PCT/CN2016/074508 CN2016074508W WO2017041449A1 WO 2017041449 A1 WO2017041449 A1 WO 2017041449A1 CN 2016074508 W CN2016074508 W CN 2016074508W WO 2017041449 A1 WO2017041449 A1 WO 2017041449A1
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Prior art keywords
substrate
test
touch
tested
fixing
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PCT/CN2016/074508
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English (en)
French (fr)
Inventor
王贵云
李学锋
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京东方科技集团股份有限公司
京东方（河北）移动显示技术有限公司
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Priority to US15/308,108 priority Critical patent/US9958475B2/en
Publication of WO2017041449A1 publication Critical patent/WO2017041449A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2829—Testing of circuits in sensor or actuator systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Definitions

  • the present disclosure relates to the field of display manufacturing technology, and more particularly to a test device and a test method using the test device.
  • the touch sensing Touch Sensor structure is designed on the touch screen cover (such as OGS products) and the color film surface of the display panel (such as On-Cell products), and the corresponding touch sensing Tx (capacitance emission) The end) and the Rx (capacitor receiving end) are connected to the touch IC by the same flexible circuit board FPC line, so the touch function detection and the product display signal are not coupled, and the touch sensing can be directly detected by the common fixture. .
  • the surface of the color film CF substrate 1 of the display panel is provided with touch-sensing Rx, and Tx is a display line with the array TFT substrate 2.
  • the Vcom signal line is multiplexed.
  • the purpose of the technical solution of the present disclosure is to provide a testing device and a testing method using the testing device, which can realize touch sensing detection of the touch line before the display product is not completed.
  • the present disclosure provides a testing device comprising:
  • a first fixing structure for fixing the substrate to be tested, wherein the first touch line is disposed on the substrate to be tested;
  • a second fixing structure for fixing a test mating panel, wherein the test mating panel is provided with a second touch line; and the first fixing structure and the second fixing structure, the substrate to be tested The first touch line and the second touch line form a touch module;
  • a signal input structure configured to electrically connect one of the circuit board of the test mating panel and the first touch line through the transit flexible circuit board, and input a trigger data signal
  • An inductive signal acquisition structure configured to electrically connect the circuit board of the test mating panel and the other of the first touch lines through the transit flexible circuit board to obtain the first touch of the electrical connection
  • the line or the test cooperates with the touch sensing signal on the second touch line on the panel.
  • the testing device described above wherein the first fixing structure comprises a horizontal bearing surface, and the horizontal bearing surface is provided with a plurality of positioning points for horizontally positioning the substrate to be tested.
  • the testing device described above wherein the second fixing structure is reversibly connected to the first fixing structure, and the second fixing structure comprises flipping open relative to the first fixing structure,
  • the test cooperates with a state in which the panel and the substrate to be tested are away from each other and a state in which the substrate to be tested is engaged with the test and the panel is engaged with the first fixing structure.
  • the test apparatus described above, wherein the transit flexible circuit board comprises a fixed board portion and a movably first joint, the first joint being capable of being opposite to the first touch line The action between the connected state and the disconnected state.
  • the testing device described above wherein the board body portion of the transit flexible circuit board is further provided with: a touch chip, and a second connection for connecting with the circuit board of the test mating panel a connector, a third connector for connecting to the signal input structure, a fourth connector for connecting to the sensing signal acquisition structure, wherein the touch chip is respectively connected to the first connector and the second connector Connected to the fourth joint, the second joint is connected to the third joint.
  • the testing device described above wherein the third fixing structure comprises a fixing structure a portion and a moving structure portion disposed on the fixed structure portion and capable of relatively moving relative to the fixed structure portion; wherein the plate body portion of the transfer flexible circuit board is horizontally disposed on the fixed structure portion
  • the moving structure portion is provided with the first joint, and the moving structure portion is moved relative to the fixed structure portion, so that the first joint is connected or disconnected from the first touch wire.
  • the testing apparatus described above wherein the third fixing structure further comprises a driving structure portion disposed on the fixing structure portion and connected to the moving structure portion for driving the moving structure Partially moving to cause the first connector to operate between a state of being connected to the first touch wire and a state of being disconnected.
  • the testing device described above wherein the fixing structure portion is provided with a vertical sliding rail, and the moving structure portion is provided with a sliding slot that cooperates with the sliding rail, through the sliding slot In cooperation with the slide rail, the moving structure portion is movable up and down with respect to the fixed structure portion.
  • the testing device wherein the driving structure portion comprises a pressing rod and a transmission structure connected to the pressing rod, the transmission structure is connected to the moving structure portion, and is driven by the pressing rod
  • the transmission structure acts such that the moving structure portion moves relative to the fixed structure portion.
  • the testing device described above wherein the substrate to be tested is a first color film substrate, the first color touch film is disposed on the first color film substrate; and the test matching panel includes An array of substrates, the common electrode lines on the array substrate being formed as the second touch lines.
  • test mating panel further comprises a second color filter substrate combined with the array substrate.
  • test mating panel further comprises a circuit board connected to the array substrate and a display chip disposed on the circuit board.
  • test method using the test apparatus of any of the above, wherein the test method comprises:
  • the sensing signal acquisition structure collects a touch sensing signal on the other of the test mating panel and the substrate to be tested under the action of the triggering data signal.
  • the substrate to be tested includes only the touch line for signal transmission or only the touch line for signal reception, by using the conversion flexible circuit board in combination with the test mating panel, it can be used on the substrate to be tested.
  • the line detection of the touch line enables effective detection of poor touch line lines.
  • FIG. 1 is a schematic structural diagram of a display module of a Hybrid In-cell in the related art
  • FIG. 2 is a schematic view showing the structure of a test apparatus according to an embodiment of the present disclosure.
  • FIG. 3 is a schematic diagram showing a circuit connection structure of a transit flexible circuit board in a test apparatus according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram showing one embodiment of the test mating panel in the testing device according to the embodiment of the present disclosure.
  • a first fixing structure for fixing the substrate to be tested, wherein the first touch line is disposed on the substrate to be tested;
  • a second fixing structure for fixing a test mating panel, wherein the test mating panel is cloth a second touch line is disposed; the substrate to be tested is opposite to the test matching panel by the first fixing structure and the second fixing structure, and the first touch line and the second touch
  • the control line forms a touch module
  • a signal input structure configured to electrically connect one of the circuit board of the test mating panel and the first touch line through the transit flexible circuit board, and input a trigger data signal
  • An inductive signal acquisition structure configured to electrically connect the circuit board of the test mating panel and the other of the first touch lines through the transit flexible circuit board to obtain the first touch of the electrical connection
  • the line or the test cooperates with the touch sensing signal on the second touch line on the panel.
  • the test device of the above-mentioned structure of the present disclosure combines the test mating panel with the substrate to be tested, so that the combined test mating panel and the first touch line and the second touch line on the substrate to be tested form a touch for touch sensing.
  • the control module further utilizes the transfer function of the transfer flexible circuit board to realize the input of the test signal of the touch film group and the collection of the touch signal. Therefore, when the circuit to be tested includes only the touch line for signal transmission or only the touch line for signal reception, the switchable flexible circuit board can be used for the substrate to be tested by combining with the test mating panel.
  • the line detection of the touch line realizes effective detection of the bad line of the touch line, thereby avoiding the problem that the defective substrate flows to the subsequent process, thereby reducing the loss of additional materials and reducing the production cost.
  • test device described above can be used for testing the touch signal receiving line on the CF substrate, and can also be used for testing the touch signal transmitting line on the TFT substrate (that is, the common signal line in the display line).
  • the substrate to be tested may be a CF substrate or a TFT substrate.
  • testing device of the present disclosure The specific structure of the testing device of the present disclosure is described in detail below by taking the test device of the present disclosure for testing the touch signal receiving line on the CF substrate as an example.
  • test device comprises:
  • the first fixing structure 10 includes a horizontal bearing surface 11 on which a plurality of positioning points 12 for horizontally positioning the CF substrate 100 to be tested are disposed;
  • the second fixing structure 20 for fixing a test mating panel 200 The second fixing structure 20 for fixing a test mating panel 200.
  • the second fixing structure 20 and the first fixing structure 10 are connected by flipping, including flipping open relative to the first fixing structure 10, and testing The state in which the panel 200 and the CF substrate 100 to be tested are separated from each other and the CF substrate 100 to be tested are engaged with each other, and the CF substrate 100 to be tested is brought into contact with the test mating panel 200.
  • the second fixing structure 20 also includes a bearing surface 21 for positioning and placing the test mating panel 200, and the bearing surface 21 is provided with a positioning structure for positioning and fixing the test mating panel 200.
  • the CF substrate 100 to be tested is placed on the first fixing structure 10 and passed.
  • the positioning point 12 is positioned; the test mating panel 200 is further placed on the bearing surface 21 of the second fixing structure 20, and the second fixing structure 20 is flipped to the side close to the first fixing structure 10 by the positioning structure.
  • the CF substrate 100 to be tested and the test mating panel 20 are just in a state of being assembled when assembled into a display panel.
  • testing device of the specific embodiment of the present disclosure as shown in FIG. 2, further includes:
  • the third fixing structure 30 is configured to carry a transit flexible circuit board.
  • first fixing structure 10 the second fixing structure 20 and the third fixing structure 30 are all disposed on a carrying base 40 for assembling the three-part structure together, and the third fixing structure 30 is fixed relative to the first fixing structure.
  • Structure 10 maintains a predetermined separation distance.
  • the transit flexible circuit board includes a board portion 41 and a first joint 42 movably relative to the board portion, and the first joint 42 is disposed on the board portion 41 to switch the flexible circuit board to be close to the first One side of a fixed structure 10.
  • the first connector 42 can be connected to the connection end of the first touch line on the CF substrate 100 to be tested, and can be disconnected from the connection end of the first touch line, and the first touch The action is made between the state in which the connection ends of the wires are connected and the state in which the wires are disconnected.
  • the third fixed structure 30 Specifically include:
  • the fixed structure portion 32 and the moving structure portion 33 disposed on the fixed structure portion 32 and capable of relatively moving relative to the fixed structure portion 32; wherein the plate body portion 41 of the transfer flexible circuit board is horizontally disposed on the fixed structure portion 32, moving The first joint 42 is disposed on the structural portion 33, and the first joint 42 is connected or disconnected from the connection end of the first touch line on the CF substrate 100 to be tested by moving the structural portion 33 relative to the fixed structure portion 32.
  • the third fixing structure 30 further includes a driving structure portion, is disposed on the fixing structure portion 32, and is connected to the moving structure portion 33 for driving the moving structure portion 33 to move, so that the first joint 42 is in the first touch
  • the action is made between the state in which the connection ends of the wires are connected and the state in which the wires are disconnected.
  • the fixed structure portion 32 is provided with a vertical sliding rail
  • the moving structural portion 33 is provided with a sliding groove that cooperates with the sliding rail.
  • the movable structural portion 33 can be matched by the cooperation of the sliding slot and the sliding rail. Moving up and down with respect to the fixed structure portion 32.
  • the drive structure portion includes a pressing rod 51 and a transmission structure coupled to the pressing rod 51, wherein the transmission structure is disposed inside the fixed structure portion 32, and the transmission structure is coupled to the moving structure portion 33.
  • the pressing rod 51 is rotatable relative to the fixing structure portion 32 at a connection point connected to the fixing structure portion 32, and the driving structure is driven by the rotation of the pressing rod 51, and the transmission structure drives the moving structure portion 33 to move, and the moving structure portion is moved.
  • the 33 can be moved up and down with respect to the fixed structure portion 32, thereby moving the first joint 42 provided on the moving structure portion 33 up and down.
  • the pressing rod 51 drives the moving structure portion 33 to move, when the pressing rod 51 is rotated from the vertical state shown in FIG.
  • the moving structure portion 33 is moved downward; when the pressing rod is pressed
  • the transmission structure may include a drive shaft and a gear set disposed on the drive shaft. The transmission between the drive shaft and the gear set realizes the up and down movement of the moving structural portion 33 by the rotation of the pressure rod 51.
  • the transit flexible circuit board further includes:
  • a touch chip 43 for connecting to the circuit board of the test mating panel 200 , a third connector 45 for connecting to a signal input structure, and for connecting to an inductive signal acquisition structure
  • the fourth connector 46 wherein the touch chip 43 is connected to the first connector 41, the second connector 44, and the fourth connector 46, respectively, and the second connector 44 is connected to the third connector 45.
  • the touch chip 43 , the second connector 44 , the third connector 45 , and the fourth connector 46 are respectively fixedly disposed on the board portion 41 of the adapter flexible circuit board.
  • the signal input structure is specifically used to input the voltage and signal for testing the test panel 200 to the test mating panel 200;
  • the sensing signal acquisition structure (including the touch sensing test box and the test device with the PC special test software)
  • the touch sensing signal on the touch chip 43 is collected, and the obtained touch sensing signal is analyzed to detect the voltage condition on each Rx line, thereby determining the connection status of each Rx line.
  • the test mating panel 200 when measuring the Rx line on the CF substrate 100 to be tested, may be a TFT substrate formed by the structure shown in FIG. 4, and the common electrode line on the TFT substrate is formed as A Tx line corresponding to the Rx line on the CF substrate 100 to be tested, wherein the TFT substrate further includes a connected main FPC 210 on which the display chip is disposed in order to meet the test requirements.
  • the test mating panel 200 can also be formed as a hybrid in-cell finished display module having the structure shown in FIG. 1 , including a CF substrate 1 and a TFT substrate 2 , and a main FPC 4 connected to the TFT substrate 2 .
  • a display chip is provided on the main FPC.
  • the common electrode line on the TFT substrate 2 is formed as a Tx line corresponding to the Rx line on the CF substrate 100 to be tested.
  • the test process when the above test device is used is as follows: the CF substrate 100 to be tested is fixed on the first fixed structure 10;
  • test mating panel 200 of the structure shown in FIG. 1 or FIG. 4 is fixed on the second fixing structure 20, and the second fixing structure 20 is flipped to cover the second fixing structure 20 with respect to the first fixing structure 10.
  • the CF substrate to be tested is to be tested. 100 is opposite to the test mating panel 200;
  • Rotating the vertical pressing lever 51 clockwise downward causes the pressing lever 51 to drive the moving structural portion 33 Moving down, even if the first joint 42 disposed on the moving structure portion 33 is moved down, the first joint 42 is connected to the metal contact end of the Rx line on the CF substrate 100 to be tested, through the fourth joint 46, and the flexible circuit board is transferred.
  • the touch chip 43 on the 43 and the first connector 42 connect the Rx line on the CF substrate 100 to the sensing signal acquisition structure.
  • the pressing lever 51 rotates the first joint 42 to the metal contact end of the Rx line on the CF substrate 100 to be tested
  • the display signal received by the test mating panel 200 is synchronized to the touch chip 43 to be tested.
  • the Rx line on the CF substrate 100 receives the touch signal of the Tx emission on the test panel 200, and after being processed by the touch chip 43 again, the fourth connector 46 feeds back to the sensing signal acquisition structure to complete the processing and judgment of the sensing signal.
  • the detection of the Rx line on the CF substrate 100 to be tested is realized.
  • the testing device of the above-mentioned implementation structure of the present disclosure is not limited to the detection of the Rx line in the CF substrate in the hybrid in-cell finished product. Based on the same principle, when the Tx line for the touch on the TFT substrate is not When other testing equipment is provided, the testing process can also be completed using the testing device of the present disclosure.
  • the TFT substrate is placed on the first fixed structure as the substrate to be tested, and the test mating panel including the CF substrate (which may include only the CF substrate or a hybrid in-cell product) is fixed on the second fixed structure.
  • the obtained touch is obtained by collecting the touch sensing signal on the Rx line on the CF substrate of the test matching panel.
  • the sensing signal is processed and judged, and the signal transmission condition of the Tx line on the TFT substrate can be detected, and the bad line can be determined.
  • test method includes:
  • the sensing signal acquisition structure collects a touch sensing signal on the other of the test mating panel and the substrate to be tested.
  • the testing device and the testing method of the embodiments of the present disclosure can be used for detecting the line of the touch line on the substrate to be tested by using the switching flexible circuit board in combination with the test matching panel, thereby realizing the effective effect on the touch line line.
  • Detection specifically for the manufacture of hybrid in-cell display products, in the cell stage, it can be used for the test of the touch signal receiving line on the CF substrate, and can also be used for the touch signal transmission line on the TFT substrate (that is, in the display line)
  • the test of the common signal line avoids the problem that the defective substrate flows to the subsequent process, thereby reducing the loss of additional materials and reducing the production cost.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

本公开提供一种测试装置及采用该测试装置的测试方法。该测试装置包括：用于固定待测基板的第一固定结构，待测基板上布置有第一触控线；用于固定测试配合面板的第二固定结构，测试配合面板上布置有第二触控线；第一触控线与第二触控线形成触控模组；用于承载一转接柔性线路板的第三固定结构；信号输入结构，用于通过转接柔性线路板与测试配合面板的线路板和第一触控线的其中一个电连接，并输入触发数据信号；感应信号采集结构，用于获取第一触控线或第二触控线上的触控感应信号。

Description

测试装置及采用该测试装置的测试方法
相关申请的交叉引用
本申请主张在2015年9月7日在中国提交的中国专利申请号No.201510562926.4的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造技术领域，尤其是指一种测试装置及采用该测试装置的测试方法。
背景技术
传统的触控显示装置中，触控感应Touch Sensor结构设计在触摸屏盖板(如OGS产品)和显示面板的彩膜表面(如On-Cell产品)，相对应的触控感应的Tx(电容发射端)和Rx(电容接收端)由同一柔性电路板FPC线路连接至触控芯片(Touch IC)，因此触控功能检测与产品显示信号无耦合现象，可以通过普通治具直接进行触控感应检测。
然而对于混合触屏(Hybrid In-cell，HIC)显示产品来说，如图1所示，显示面板的彩膜CF基板1表面设置有触控感应的Rx，Tx是与阵列TFT基板2显示线路中的Vcom信号线进行复用，对于Hybrid In-cell成品结构来说，如图1所示，CF基板1上的触控柔性线路板(Touch FPC)3与TFT基板2上的主柔性线路板4电连接，主柔性线路板4上设置有显示芯片，触控柔性线路板3上设置有触控芯片，分别用于图像显示和触控感应。
然而在显示器制程中的CELL阶段，在将CF基板1与TFT基板2组装之前，由于无法通过显示芯片发射Tx信号，因此无法通过传统方式进行触控感应功能检测。
发明内容
本公开技术方案的目的是提供一种测试装置及采用该测试装置的测试方法，能够实现对显示产品在未完成组装阶段前对触控线路的触控感应检测。
本公开提供一种测试装置，包括：
用于固定待测基板的第一固定结构，其中所述待测基板上布置有第一触控线；
用于固定一测试配合面板的第二固定结构，其中所述测试配合面板上布置有第二触控线；通过所述第一固定结构和所述第二固定结构，所述待测基板与所述测试配合面板相对合，所述第一触控线与所述第二触控线形成触控模组；
用于承载一转接柔性线路板的第三固定结构；
信号输入结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线的其中一个电连接，并输入触发数据信号；
感应信号采集结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线中的其中另一个电连接，获取电连接的所述第一触控线或所述测试配合面板上的所述第二触控线上的触控感应信号。
可选地，上述所述的测试装置，其中，所述第一固定结构包括一水平承载面，所述水平承载面上设置有用于水平地定位放置所述待测基板的多个定位点。
可选地，上述所述的测试装置，其中，所述第二固定结构可翻转的与所述第一固定结构连接，所述第二固定结构包括相对于所述第一固定结构翻转打开、使所述测试配合面板与所述待测基板之间远离的状态以及相对于所述第一固定结构扣合、使所述待测基板与所述测试配合面板相对合的状态。
可选地，上述所述的测试装置，其中，所述转接柔性线路板包括固定的板体部分和可移动地第一接头，所述第一接头能够在与所述第一触控线相连接的状态和脱离连接的状态之间动作。
可选地，上述所述的测试装置，其中，所述转接柔性线路板的所述板体部分上还设置有：触控芯片、用于与所述测试配合面板的线路板连接的第二接头、用于与所述信号输入结构连接的第三接头、用于与所述感应信号采集结构连接的第四接头，其中所述触控芯片分别与所述第一接头、所述第二接头和所述第四接头连接，所述第二接头与所述第三接头连接。
可选地，上述所述的测试装置，其中，所述第三固定结构包括固定结构 部分和设置于所述固定结构部分上、能够相对于所述固定结构部分相对移动的移动结构部分；其中所述转接柔性线路板的所述板体部分水平地设置于所述固定结构部分上，所述移动结构部分上设置有所述第一接头，通过所述移动结构部分相对于所述固定结构部分移动，使得所述第一接头与所述第一触控线相连接或者脱离连接。
可选地，上述所述的测试装置，其中，所述第三固定结构还包括驱动结构部分，设置于所述固定结构部分上，且与所述移动结构部分连接，用于驱动所述移动结构部分移动，使所述第一接头在与所述第一触控线相连接的状态和脱离连接的状态之间动作。
可选地，上述所述的测试装置，其中，所述固定结构部分上设置有竖直的滑轨，所述移动结构部分上设置有与所述滑轨配合的滑槽，通过所述滑槽与所述滑轨的配合，所述移动结构部分能够相对于所述固定结构部分上下移动。
可选地，上述所述的测试装置，其中，所述驱动结构部分包括压杆和与所述压杆连接的传动结构，所述传动结构与所述移动结构部分连接，通过所述压杆带动所述传动结构动作，使得所述移动结构部分相对于所述固定结构部分移动。
可选地，上述所述的测试装置，其中，所述待测基板为一第一彩膜基板，所述第一彩膜基板上布置有所述第一触控线；所述测试配合面板包括一阵列基板，所述阵列基板上的公共电极线形成为所述第二触控线。
可选地，上述所述的测试装置，其中，所述测试配合面板还包括与所述阵列基板相组合的第二彩膜基板。
可选地，上述所述的测试装置，其中，所述测试配合面板还包括与所述阵列基板相连接的线路板和设置于所述线路板上的显示芯片。
本公开还提供一种采用如上任一项所述测试装置的测试方法，其中，所述测试方法包括：
将所述待测基板固定于所述第一固定结构上；
将所述测试配合面板固定于所述第二固定结构上，并使所述待测基板与所述测试配合面板相对位对合；
使所述信号输入结构、所述感应信号采集结构分别与所述转接柔性线路板电连接；
使所述转接柔性线路板分别与所述待测基板和所述测试配合面板相连接；
使所述信号输入结构向所述测试配合面板和所述待测基板中的其中一个输入触发数据信号，使得在所述测试配合面板和所述待测基板上的其中一个接收到触发数据信号后，在所述触发数据信号的作用下，所述感应信号采集结构采集到所述测试配合面板和所述待测基板上的其中另一个上的触控感应信号。
本公开具体实施例上述技术方案中的至少一个具有以下有益效果：
当待测试基板上只包括用于信号发射的触控线或者只包括用于信号接收的触控线时，通过与测试配合面板组合，利用转换柔性线路板，能够用于该待测试基板上的触控线的线路检测，实现对触控线线路不良的有效检测。
附图说明
图1表示相关技术中Hybrid In-cell的显示模组的结构示意图；
图2表示本公开实施例所述测试装置的结构示意图。
图3表示本公开实施例所述测试装置中，转接柔性线路板的电路连接结构示意图；
图4表示本公开实施例所述测试装置中，所述测试配合面板的其中一种实施结构示意图。
具体实施方式
为使本公开的实施例要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
本公开实施例所述测试装置，包括：
用于固定待测基板的第一固定结构，其中所述待测基板上布置有第一触控线；
用于固定一测试配合面板的第二固定结构，其中所述测试配合面板上布 置有第二触控线；通过所述第一固定结构和所述第二固定结构，所述待测基板与所述测试配合面板相对合，所述第一触控线与所述第二触控线形成触控模组；
用于承载一转接柔性线路板的第三固定结构；
信号输入结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线的其中一个电连接，并输入触发数据信号；
感应信号采集结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线中的其中另一个电连接，获取电连接的所述第一触控线或所述测试配合面板上的所述第二触控线上的触控感应信号。
本公开上述结构的测试装置，通过测试配合面板与待测基板组合，使组合后的测试配合面板与待测基板上的第一触控线和第二触控线形成用于触控感应的触控模组，此外并利用转接柔性线路板的转接功能，实现触控膜组的测试信号的输入和触控信号的采集。因此当待测试基板上只包括用于信号发射的触控线或者只包括用于信号接收的触控线时，通过与测试配合面板组合，利用转接柔性线路板，能够用于该待测试基板上的触控线的线路检测，实现对触控线线路不良的有效检测，因此避免不良基板流通至后序工艺，达到减少额外资材损失和降低生产成本的效果。
本领域技术人员应该理解，在hybrid in-cell显示产品的制造中，在cell阶段，将CF基板与TFT基板对合组装之前，需要对CF基板与TFT基板上的线路进行检测，采用本公开实施例上述的测试装置，可以用于CF基板上触控信号接收线的测试，也可以用于TFT基板上触控信号发射线(也即显示线路中的公共信号线)的测试。
因此，所述待测基板可以为CF基板或者TFT基板。
以下以本公开所述测试装置用于CF基板上触控信号接收线的测试为例，对本公开所述测试装置的具体结构进行详细描述。
参阅图2本公开具体实施例所述测试装置的结构示意图。根据图2，所述测试装置包括：
第一固定结构10，包括一水平承载面11，该水平承载面11上设置有用于水平地定位放置待测CF基板100的多个定位点12；
用于固定一测试配合面板200的第二固定结构20，本实施例中，第二固定结构20与第一固定结构10之间通过翻转连接，包括相对于第一固定结构10翻转打开、使测试配合面板200与待测CF基板100之间远离的状态以及相对于待测CF基板100扣合、使待测CF基板100与测试配合面板200相对合的状态。另外，同样第二固定结构20包括用于定位放置测试配合面板200的承载面21，该承载面21上设置有用于定位并固定测试配合面板200的定位结构。
通过上述的第一固定结构10和第二固定结构20，当第二固定结构20相对于第一固定结构10翻转至打开状态，将待测CF基板100放置于第一固定结构10上，并通过定位点12进行定位；进一步使测试配合面板200放置于第二固定结构20的承载面21上，通过定位结构固定，将第二固定结构20朝靠近第一固定结构10的一侧翻转至盖合于第一固定结构10的水平承载面11后，待测CF基板100与测试配合面板20恰好处于组装为显示面板时的对合状态。
本领域技术人员应该能够了解在上述的第一固定结构10和第二固定结构20上分别设置用于固定并定位待测CF基板100和测试配合面板200的具体实施结构，且该结构并非为本公开的研究重点，在此不详细描述。
进一步地，本公开具体实施例所述测试装置如图2所示，还进一步包括：
第三固定结构30，用于承载一转接柔性线路板。
另外，第一固定结构10、第二固定结构20和第三固定结构30均设置于一承载底座40上，用于将三部分结构组装在一起，且使第三固定结构30相对于第一固定结构10保持预定间隔距离。
本公开实施例中，具体地，转接柔性线路板包括板体部分41和相对于板体部分可移动地第一接头42，第一接头42设置于板体部分41转接柔性线路板靠近第一固定结构10的一侧。利用可移动功能，第一接头42能够连接至待测CF基板100上第一触控线的连接端，并能够脱离与第一触控线的连接端相连接的状态，在与第一触控线的连接端相连接的状态和脱离连接的状态之间动作。
为了实现第一接头42的上述可移动功能，参阅图2，第三固定结构30 具体包括：
固定结构部分32和设置于固定结构部分32上、能够相对于固定结构部分32相对移动的移动结构部分33；其中转接柔性线路板的板体部分41水平地设置于固定结构部分32上，移动结构部分33上设置有第一接头42，通过移动结构部分33相对于固定结构部分32的移动，第一接头42与待测CF基板100上第一触控线的连接端相连接或者脱离连接。
进一步地，第三固定结构30还包括驱动结构部分，设置于固定结构部分32上，且与移动结构部分33连接，用于带动移动结构部分33移动，使第一接头42在与第一触控线的连接端相连接的状态和脱离连接的状态之间动作。如图2所示，固定结构部分32上设置有竖直的滑轨，移动结构部分33上设置有与滑轨配合的滑槽，通过滑槽与所述滑轨的配合，移动结构部分33能够相对于固定结构部分32上下移动。
具体地，驱动结构部分包括压杆51和与压杆51连接的传动结构，其中传动结构设置于固定结构部分32的内部，且传动结构连接至移动结构部分33。具体地，压杆51能够相对于固定结构部分32绕与固定结构部分32相连接的连接点转动，通过压杆51的转动带动传动结构动作，同时传动结构带动移动结构部分33动作，移动结构部分33能够相对于固定结构部分32上下移动，从而使设置于移动结构部分33上的第一接头42上下移动。具体地，当压杆51带动移动结构部分33动作的方式可以为：当压杆51从图2所示的竖直状态朝顺时针方向转动时，使移动结构部分33向下移动；当压杆51从处于水平状态朝逆时针方向转动时，使移动结构部分33向上移动。举例说明，该传动结构可以包括驱动轴和设置于驱动轴上的齿轮组，通过驱动轴与齿轮组之间的传动方式，实现通过压杆51的转动带动移动结构部分33的上下移动。本领域技术人员应该能够了解实现上述压杆51带动移动结构部分33之间动作的多种传动结构，在此不作一一详细描述。
进一步，如图2并参阅图3所示，本公开实施例中，转接柔性线路板还包括：
触控芯片43、用于与测试配合面板200的线路板连接的第二接头44、用于与一信号输入结构连接的第三接头45、用于与一感应信号采集结构连接的 第四接头46，其中触控芯片43分别与第一接头41、第二接头44和第四接头46连接，第二接头44与第三接头45连接。
上述触控芯片43、第二接头44、第三接头45、第四接头46分别固定设置于转接柔性线路板的板体部分41上。
另外上述的信号输入结构具体用于向测试配合面板200输入使测试配合面板200正常工作的电压和信号；感应信号采集结构(包括触控感应测试盒和安装有PC专用测试软件的测试装置)用于采集触控芯片43上的触控感应信号，对所获得的触控感应信号进行分析，检测各Rx线路上的电压情况，进而判断各Rx线路的连接状况。
本公开实施例所述测试装置中，用于测量待测CF基板100上的Rx线路时，其中测试配合面板200可以为一图4所示结构构成的TFT基板，TFT基板上的公共电极线形成为与待测CF基板100上的Rx线路相对应的Tx线，其中为了满足测试要求，TFT基板还包括相连接的主FPC 210，该主FPC210上设置有显示芯片。
另一实施例中，测试配合面板200也可以形成为图1所示结构构成的hybrid in-cell成品显示模组，包括CF基板1与TFT基板2，与TFT基板2相连接有主FPC 4，主FPC上设置有显示芯片。其中TFT基板2上的公共电极线形成为与待测CF基板100上的Rx线路相对应的Tx线。
结合图1至图4，采用上述测试装置时的测试过程如下：将待测CF基板100固定于第一固定结构10上；
将如图1或图4所示结构的测试配合面板200固定于第二固定结构20上，翻转第二固定结构20使第二固定结构20相对于第一固定结构10盖合，待测CF基板100与测试配合面板200相对位对合；
将信号输入结构与第三接头45连接；
将感应信号采集结构与第四接头46连接；
将测试配合面板200的主FPC连接至第二接头44，将感应信号采集结构连接至第四接头46；
通过信号输入结构向测试配合面板200输入电压和显示信号；
使竖直设置地压杆51顺时针向下转动，使压杆51带动移动结构部分33 下移，也即使设置于移动结构部分33上的第一接头42下移，第一接头42连接至待测CF基板100上Rx线路的金属接触端，通过第四接头46、转接柔性线路板43上的触控芯片43和第一接头42，待测CF基板100上Rx线路连接至感应信号采集结构。
通过上述的设置方式，当转动压杆51使第一接头42与待测CF基板100上Rx线路的金属接触端时，测试配合面板200所接收的显示信号同步至触控芯片43，使待测CF基板100上Rx线路接收到测试配合面板200上Tx发射的触控信号，再次通过触控芯片43进行数据处理后，通过第四接头46反馈至感应信号采集结构完成感应信号的处理和判断，实现对待测CF基板100上Rx线路的检测。
可以理解的是，本公开上述实施结构的测试装置，并不仅限应用于hybrid in-cell成品中CF基板中Rx线路的检测，基于同样的原理，当TFT基板上用于触控的Tx线路不具备其他检测设备时，采用本公开的测试装置也可以完成其检测过程。也即将TFT基板作为待测基板放置于第一固定结构上，将包括CF基板(可以仅包括CF基板，也可以为一hybrid in-cell成品)的测试配合面板固定于第二固定结构上，当通过转接柔性线路板将用于测试的数据或电压信号输入至TFT基板上的Tx线路上时，通过采集测试配合面板的CF基板上的Rx线路上的触控感应信号，对获得的触控感应信号进行理和判断，可以检测获得TFT基板上的Tx线路的信号传输情况，判断出不良线路。
本公开具体实施例另一方面还提供一种上述测试装置的测试方法，其中，所述测试方法包括：
将所述待测基板固定于所述第一固定结构上；
将所述测试配合面板固定于所述第二固定结构上，并使所述待测基板与所述测试配合面板相对位对合；
使所述信号输入结构、所述感应信号采集结构分别与所述转接柔性线路板电连接；
使所述转接柔性线路板分别与所述待测基板和所述测试配合面板相连接；
使所述信号输入结构向所述测试配合面板和所述待测基板中的其中一个输入触发数据信号，使得在所述测试配合面板和所述待测基板上的其中一个 接收到触发数据信号后，在所述触发数据信号的作用下，所述感应信号采集结构采集到所述测试配合面板和所述待测基板上的其中另一个上的触控感应信号。
本公开实施例的测试装置和测试方法，通过与测试配合面板组合，利用转接柔性线路板，能够用于该待测试基板上的触控线的线路检测，实现对触控线线路不良的有效检测；具体对于hybrid in-cell显示产品的制造中，在cell阶段，可以用于CF基板上触控信号接收线的测试，也可以用于TFT基板上触控信号发射线(也即显示线路中的公共信号线)的测试，避免不良基板流通至后序工艺，达到减少额外资材损失和降低生产成本的效果。
以上所述是本公开的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (13)

  1. 一种测试装置，包括：
    用于固定待测基板的第一固定结构，其中所述待测基板上布置有第一触控线；
    用于固定一测试配合面板的第二固定结构，其中所述测试配合面板上布置有第二触控线；通过所述第一固定结构和所述第二固定结构，所述待测基板与所述测试配合面板相对合，所述第一触控线与所述第二触控线形成触控模组；
    用于承载一转接柔性线路板的第三固定结构；
    信号输入结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线的其中一个电连接，并输入触发数据信号；
    感应信号采集结构，用于通过所述转接柔性线路板与所述测试配合面板的线路板和所述第一触控线中的其中另一个电连接，获取电连接的所述第一触控线或所述测试配合面板上的所述第二触控线上的触控感应信号。
  2. 如权利要求1所述的测试装置，其中，所述第一固定结构包括一水平承载面，所述水平承载面上设置有用于水平地定位放置所述待测基板的多个定位点。
  3. 如权利要求1所述的测试装置，其中，所述第二固定结构可翻转的与所述第一固定结构连接，所述第二固定结构包括相对于所述第一固定结构翻转打开、使所述测试配合面板与所述待测基板之间远离的状态以及相对于所述第一固定结构扣合、使所述待测基板与所述测试配合面板相对合的状态。
  4. 如权利要求1所述的测试装置，其中，所述转接柔性线路板包括固定的板体部分和可移动地第一接头，所述第一接头能够在与所述第一触控线相连接的状态和脱离连接的状态之间动作。
  5. 如权利要求4所述的测试装置，其中，所述转接柔性线路板的所述板体部分上还设置有：触控芯片、用于与所述测试配合面板的线路板连接的第二接头、用于与所述信号输入结构连接的第三接头、用于与所述感应信号采集结构连接的第四接头，其中所述触控芯片分别与所述第一接头、所述第二 接头和所述第四接头连接，所述第二接头与所述第三接头连接。
  6. 如权利要求4所述的测试装置，其中，所述第三固定结构包括固定结构部分和设置于所述固定结构部分上、能够相对于所述固定结构部分相对移动的移动结构部分；其中所述转接柔性线路板的所述板体部分水平地设置于所述固定结构部分上，所述移动结构部分上设置有所述第一接头，通过所述移动结构部分相对于所述固定结构部分移动，使得所述第一接头与所述第一触控线相连接或者脱离连接。
  7. 如权利要求6所述的测试装置，其中，所述第三固定结构还包括驱动结构部分，设置于所述固定结构部分上，且与所述移动结构部分连接，用于驱动所述移动结构部分移动，使所述第一接头在与所述第一触控线相连接的状态和脱离连接的状态之间动作。
  8. 如权利要求6所述的测试装置，其中，所述固定结构部分上设置有竖直的滑轨，所述移动结构部分上设置有与所述滑轨配合的滑槽，通过所述滑槽与所述滑轨的配合，所述移动结构部分能够相对于所述固定结构部分上下移动。
  9. 如权利要求7所述的测试装置，其中，所述驱动结构部分包括压杆和与所述压杆连接的传动结构，所述传动结构与所述移动结构部分连接，通过所述压杆带动所述传动结构动作，使得所述移动结构部分相对于所述固定结构部分移动。
  10. 如权利要求1所述的测试装置，其中，所述待测基板为一第一彩膜基板，所述第一彩膜基板上布置有所述第一触控线；所述测试配合面板包括一阵列基板，所述阵列基板上的公共电极线形成为所述第二触控线。
  11. 如权利要求10所述的测试装置，其中，所述测试配合面板还包括与所述阵列基板相组合的第二彩膜基板。
  12. 如权利要求10所述的测试装置，其中，所述测试配合面板还包括与所述阵列基板相连接的线路板和设置于所述线路板上的显示芯片。
  13. 一种采用权利要求1至12任一项所述测试装置的测试方法，所述测试方法包括：
    将所述待测基板固定于所述第一固定结构上；
    将所述测试配合面板固定于所述第二固定结构上，并使所述待测基板与所述测试配合面板相对位对合；
    使所述信号输入结构、所述感应信号采集结构分别与所述转接柔性线路板电连接；
    使所述转接柔性线路板分别与所述待测基板和所述测试配合面板相连接；
    使所述信号输入结构向所述测试配合面板和所述待测基板中的其中一个输入触发数据信号，使得在所述测试配合面板和所述待测基板上的其中一个接收到触发数据信号后，在所述触发数据信号的作用下，所述感应信号采集结构采集到所述测试配合面板和所述待测基板上的其中另一个上的触控感应信号。
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