WO2017033603A1 - Method for manufacturing heat dissipating substrate - Google Patents
Method for manufacturing heat dissipating substrate Download PDFInfo
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- WO2017033603A1 WO2017033603A1 PCT/JP2016/070538 JP2016070538W WO2017033603A1 WO 2017033603 A1 WO2017033603 A1 WO 2017033603A1 JP 2016070538 W JP2016070538 W JP 2016070538W WO 2017033603 A1 WO2017033603 A1 WO 2017033603A1
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- WIPO (PCT)
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- die
- forging
- heat dissipation
- molding
- base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/02—Die forging; Trimming by making use of special dies ; Punching during forging
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/62—Hybrid vehicles
Definitions
- the present invention relates to a method for manufacturing a heat dissipation board in which a heat sink is provided on a part of a base and related technology.
- a heat dissipating board provided with a (heat sink) is well known.
- Patent Documents 1 and 2 disclose a heat dissipation board in which a heat sink composed of a forged product of aluminum alloy or the like is attached to a base composed of an aluminum alloy die-cast product or a forged product.
- the heat sink part (heat dissipating part) has a complicated shape in which a large number of fins are formed at narrow intervals, while the part other than the heat sink of the base (base main body part) is only scattered by convex parts such as pedestals. It is a simple shape. For this reason, when manufacturing a heat dissipation board by forging, it is difficult to adjust the punch load because the degree of processing between the base body and the heat dissipation part is greatly different and the volume balance is poor. There arises a problem that it is very difficult to mold with high accuracy.
- the overall size of the heat dissipation substrate is larger than that of the heat dissipation portion, the overall size of the forging die is increased and the punch load is also increased. For this reason, there is a problem that the burden on the fin forming portion in the forging die is increased, and the die life is shortened. Further, since the base body portion having a simple shape and a plurality of fins having a complicated shape coexist, a discharge mechanism (knockout mechanism) for ejecting the molded product from the mold after molding becomes complicated. As a result, the configuration of the mold itself becomes complicated, and there is a problem that the mold production cost (cost) increases.
- the present invention has been made in view of the above-described problem, and a heat dissipation board capable of efficiently and inexpensively manufacturing a heat dissipation board excellent in heat dissipation performance, in which a plurality of fins are formed integrally with a base with high accuracy.
- An object is to provide a manufacturing method and related technology.
- the present invention has the following configuration.
- a method for manufacturing a substrate comprising: As a forming material of the heat dissipation substrate, a material preparation step of preparing an intermediate molded body provided with a molding portion corresponding to the heat dissipation portion and provided with a non-molding portion corresponding to a portion other than the heat dissipation portion; Including a forging step of forming the fin in the forming portion of the intermediate formed body, In the forging step, the fin is formed by plastically deforming the molded part by die forging while suppressing the non-molded part without being deformed.
- the forging die used in the forging step includes a die and a punch, A fin forming hole for forming the fin on the restraining surface of the punch is provided, The preceding item 1 or 2, wherein when the punch is driven into the intermediate formed body installed on the die, the fin is formed by backward extrusion that causes a metal material constituting the forming portion to flow into the fin forming hole.
- a forging die used in the forging step includes a molding die provided corresponding to the molding part and a suppression die provided corresponding to the non-molding part, 4.
- the inhibition die is configured to be relatively retractable in a direction opposite to the restraining direction with respect to the molding die,
- the forging die includes deterring force applying means for applying a deterring force in the restraining direction of the deterring die, 5.
- the forging die used in the forging step includes a molding die provided corresponding to the molding part, The outer periphery of the mold is provided with a surplus escape recess, 6.
- a heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat radiating portion, and a plurality of fins that are integrally formed with the heat radiating portion of the base and are erected with respect to the base.
- a forging die provided with a suppressing means provided to correspond to a portion other than the heat radiating portion of the heat radiating substrate and for suppressing a portion other than the heat radiating portion.
- the suppression means includes A deterrent mold configured to be relatively retractable in a direction opposite to the constraint direction with respect to the mold;
- a die and a punch are provided, 10.
- a heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat dissipating part, and a plurality of fins that are integrally formed with the heat dissipating part of the base and are erected with respect to the base A substrate, A heat dissipation board, wherein a surplus wall is integrally provided on the base along the outer periphery of the heat dissipation portion.
- the manufactured heat dissipation board is integrally formed with fins (heat sinks) on the base, a separate heat sink is attached to the base and the adhesive has low thermal conductivity.
- a heat dissipation board attached by heat treatment such as welding, it is possible to suppress the decrease in thermal conductivity and the occurrence of thermal distortion, maintain high dimensional accuracy and obtain sufficient heat dissipation performance Can do.
- the fins are integrally formed on the base, the number of manufacturing steps is small, and the production efficiency can be improved and the cost can be reduced.
- the fins can be formed with a load that is small enough to form the fins. For this reason, excessive pressure is not applied to the metal material in the forging die, deformation can be prevented and the dimensional accuracy can be further improved, and a large load is applied to the fin forming part of the forging die. In addition, it is possible to prevent early forging of the forging die and to improve the life of the die and reduce the cost more reliably. Furthermore, because of partial forging, the mold can be formed in a simple structure, and the cost can be further reduced.
- the metal material for forming the fin can be sufficiently secured, so that the fin with high dimensional accuracy can be more reliably formed.
- the fin is formed by backward extrusion, a fin having a small cross-sectional area such as a pin fin can be reliably formed with high accuracy.
- the non-molded portion of the intermediate molded body can be suppressed with an appropriate pressure, so that the processing accuracy of fins and the like can be further improved.
- the intermediate molded body and the heat dissipation substrate can be manufactured by a series of forging processes, so that the production efficiency can be improved.
- FIG. 1A is a cross-sectional view showing a primary forming forging die used in a method for manufacturing a heat dissipation board according to an embodiment of the present invention in an open state.
- FIG. 1B is a cross-sectional view showing the forging die for primary forming according to the embodiment in a closed state.
- FIG. 2A is a cross-sectional view showing the forging die for secondary forming used in the manufacturing method of the embodiment in an open state.
- FIG. 2B is a cross-sectional view showing the forging die for secondary forming according to the embodiment in a closed state.
- FIG. 3A is a perspective view of the intermediate molded body used in the manufacturing method of the embodiment as viewed from the surface side.
- FIG. 1A is a cross-sectional view showing a primary forming forging die used in a method for manufacturing a heat dissipation board according to an embodiment of the present invention in an open state.
- FIG. 1B is a cross-sectional view showing the for
- FIG. 3B is a perspective view of the intermediate molded body of the embodiment as viewed from the back side.
- FIG. 4A is a perspective view of the heat dissipation board manufactured by the manufacturing method of the embodiment as viewed from the back side.
- FIG. 4B is an enlarged plan view showing a heat radiating portion in the heat radiating substrate of the embodiment.
- FIG. 5 is a sectional view showing the periphery of a forming die in a punch of a forging die for secondary forming that is a first modification of the present invention.
- FIG. 6A is an enlarged cross-sectional view showing the periphery of a molded portion of an intermediate molded body used in the manufacturing method of the second modified example of the present invention.
- FIG. 6B is an enlarged cross-sectional view showing the periphery of a forming die of a forging die for secondary forming used in the manufacturing method of the second modified example.
- FIG. 7A is a perspective view of a heat dissipation board as a third modification of the present invention viewed from the back side.
- FIG. 7B is an enlarged plan view showing a heat radiating part in the heat radiating board of the third modified example.
- the heat dissipation substrate W2 manufactured by the manufacturing method according to the embodiment of the present invention is configured by a forged product. That is, in the manufacturing method of this embodiment, die forging as primary formation (1F) is performed on a rectangular plate-shaped forging material W as shown in FIG. 1A, and a primary molded product (1F as shown in FIG. 1B). Product). Subsequently, as shown in FIGS. 2A and 2B, die forging as secondary molding (2F) is performed on the intermediate molded body W1 as the primary molded product to produce a secondary molded product (2F product). The secondary molded product is employed as the heat dissipation substrate W2 of the present embodiment.
- a wrought material for example, a material obtained by cutting a flat bar (flat plate) shaped extruded material, a material obtained by cutting a plate-like rolled material, a continuous cast bar, What was cut
- a wrought material for example, a material obtained by cutting a flat bar (flat plate) shaped extruded material, a material obtained by cutting a plate-like rolled material, a continuous cast bar, What was cut
- Al alloy aluminum alloy
- Al alloys such as alloy numbers A1100, A6063, and A3003 can be preferably used.
- an intermediate molded body (primary molded product) W1 as a molding material for secondary molding includes a rectangular plate-like base 1.
- a plurality of large and small truncated cone-shaped bases 11 are integrally formed so as to protrude from the surface side (upward), and a mounting base 12 having a flat upper surface is provided on the surface side (upward) ) are integrally formed so as to protrude.
- a molding portion 15 having a rectangular shape in plan view is formed integrally with the mounting base 12 so as to protrude on the back surface side (downward).
- the non-molded portion 16 is configured by a portion other than the molded portion 15 of the intermediate molded body W1, that is, the entire area on the front surface side of the intermediate molded body W1 and the outer portion of the molded portion 15 on the back surface side. ing.
- a plurality of pin fins 21 aligned vertically and horizontally are perpendicular to the base 1 on the back surface side of the heat dissipation substrate W2 as a secondary molded product, except for the outer periphery of the molded portion 15. It is integrally formed so as to protrude (stand up) in the direction. Further, a surplus wall 22 continuous in the circumferential direction is integrally formed on the back surface side of the heat dissipation substrate W2 so as to surround the plurality of pin fins 21 at a portion corresponding to the outer periphery of the molding portion 15.
- the portion of the heat dissipation substrate W2 corresponding to the non-molded portion 16 has substantially the same shape as the intermediate molded body W1.
- the pedestal 11 and the mounting base 12 in the non-molded portion 16 of the intermediate molded body W1 have the pedestal 11 and the mounting base 12 having substantially the same shape in the same position also in the heat-radiating substrate W2 after the secondary molding.
- the pedestal 11 is for mounting other components
- the mounting base 12 is for mounting a heating element (heating element) such as a reactor, a converter, an inverter, or an IGBT.
- a heat radiating portion (heat sink) 2 is configured by a portion where the plurality of pin fins 21 of the heat radiating substrate W2 are formed.
- FIG. 1A and FIG. 1B are sectional views showing a forging die D1 for primary molding for producing an intermediate molded body (primary molded product) W1.
- the forging die D1 for primary forming includes a punch 3 as an upper die and a die 4 as a lower die.
- the upper surface of the die 4 is formed with a constraining recess 40 that is formed in a shape corresponding to the outer peripheral surface shape of the intermediate molded body W1 and opens upward. Further, on the inner peripheral surface of the constraining concave portion 40, a base molding concave portion 41 and a mounting base molding concave portion 42 for molding the base 11 and the mounting base 12 of the intermediate molded body W1 are formed, respectively.
- the inner peripheral surface of the constraining recess 40 of the die 4 is configured as a constraining surface.
- the punch 3 is disposed above the die 4 so as to correspond to the constraining recess 40, and can be driven up and down in the vertical direction by a driving means (not shown).
- the lower end portion of the punch 4 is formed in a shape that can be accommodated in the constraining recess 40 of the die 4, and the lower end portion of the die 4 is moved into the constraining recess 40 by lowering the punch 3 from the raised position. It can be driven with a load.
- a knockout pin 46 is provided at a required portion of the die 4.
- a knockout pin accommodation hole 45 penetrating in the vertical direction is formed on the bottom surface of the base molding recess 41 at an appropriate position, and at the end portion (such as the right end portion in FIGS. 1A and 1B) on the bottom surface of the restraint recess 40, Knockout pin accommodation holes 45 penetrating in the vertical direction are formed, and the knockout pins 46 are accommodated in the accommodation holes 45 so as to protrude upward.
- the knockout pin 46 protrudes immediately after molding by driving of a driving means (not shown) so that the intermediate molded body W1 as a primary molded product is pushed up and released from the constraining recess 40 of the die 4 and discharged. It has become.
- a molding part molding concave part 35 for molding the molding part 15 of the intermediate molded body W 1 is formed corresponding to the mounting base molding concave part 42 of the die 4.
- the intermediate forming body W1 is obtained by performing primary forming on the forging material W using the forging die D1 for primary forming having the above configuration. That is, as shown in FIG. 1A, the forging material W is loaded and set in the constraining recess 40 of the die 4 with the punch 3 raised.
- the heating temperature is set to 400 ° C. to 550 ° C.
- the temperature (die temperature) of the punch 3 and the die 4 is set to about 200 ° C.
- the punch 3 is lowered and driven into the constraining recess 40 of the die 4.
- the forged material W is clamped by the punch 3 and the die 4 to plastically flow a required portion of the metal material (metal) constituting the forged material W, and the base forming recess 41 and the mounting base
- the base 11 and the mounting base 12 are molded by filling the molding recess 42, and the molding part 15 is molded by filling the molding part molding recess 35 with a metal material.
- the punch 3 is raised, while the knockout pin 46 protrudes upward to push up the intermediate molded body W1, so that the intermediate molded body W1 restrains the die 4. It is discharged from the recess 40.
- the primary forming by the primary forming forging die D1 corresponds to the material preparation step.
- FIGS. 2A and 2B are cross-sectional views showing a forging die D2 for secondary forming for manufacturing a heat dissipation substrate (secondary molded product) W2.
- the forging die D2 for secondary forming includes a punch 5 as an upper die and a die 6 as a lower die.
- the die 6 has substantially the same configuration as the die 4 of the forging die D1 for primary forming. That is, a constraining recess 60 is formed on the upper surface of the die 6, and in the constraining recess 60, a pedestal receiving recess 61 corresponding to the pedestal forming recess 41 and the mounting base forming recess 42 of the primary forming forging die D 1. And the mounting base accommodation recessed part 62 is formed, respectively.
- the inner peripheral surface of the constraining recess 60 of the die 6 is configured as a constraining surface.
- a knockout pin 66 is disposed in a required portion of the die 6 so as to protrude through a knockout pin accommodation hole 65.
- the punch 5 is provided with an anvil 51 that can be driven up and down in the vertical direction by a driving means (not shown).
- a restraining die 53 is attached so as to be slidable in the vertical direction via a punch holder 52, and is configured to be able to rise upward (retracting direction) relative to the anvil 51.
- the inhibition mold 53 is formed with an opening 54 that accommodates and arranges a molding mold 55 described later.
- the opening 54 of the restraining die 53 penetrates vertically and is formed at a position corresponding to the molding portion 15 of the intermediate molded body W1 set in the constraining recess 60 of the die 6.
- type 53 is arrange
- a spring 7 such as a compression coil spring is interposed between the restraining die 53 and the anvil 51 so that the restraining force of the restraining die 53 can be applied by the elastic force (repulsive force) of the spring 7 as will be described later. It has become.
- the deterring force applying means is constituted by the spring 7 and the inhibiting means is constituted by the deterring mold 53 and the deterring force applying means.
- the deterrence applying means is not limited to the spring 7, and any means that can apply an appropriate pressure can be used.
- Examples of the deterrence imparting means other than the spring include a gas cushion and a knockout mechanism possessed by the press.
- a molding die 55 is fixed on the lower surface side of the anvil 51 so as to move up and down in synchronization with the anvil 51.
- the molding die 55 is inserted into the opening 54 of the restraining die 53 so that the lower surface of the molding die 56 is exposed below the restraining die 53.
- the forming die 55 is formed with a plurality of fin forming holes 56 having a circular cross section that open on the lower surface and penetrate in the vertical direction.
- a knockout pin 57 is accommodated in each fin forming hole 56 so as to be slidable in the vertical direction.
- the molding die 55 descends in synchronization with the anvil 51, when the punch 5 descends, the molding part 15 of the intermediate molded body W1 can be pressurized by the molding die 55 with a sufficient molding load. .
- the fin forming hole 56 of the forming die 55 is used for forming the pin fin 21 by flowing a metal material during forming.
- the tip surface (lower end surface) of the knockout pin 57 functions as a molding surface for molding the tip surface of the pin fin 21. Therefore, at the time of molding, the knockout pin 57 is disposed at a position where the lower end surface thereof is retracted (raised) by the length of the pin fin 21 with respect to the lower end surface of the molding die 55. Further, the knockout pin 57 is advanced (lowered) by a driving means (not shown) immediately after molding, so that the pin fin 21 protrudes downward from the fin molding hole 56 and is released.
- the lower surface of the mold 55 is configured as a constraining surface of the punch 5.
- the knockout pin 57 is biased downward by a biasing means such as a spring. Immediately before molding, the knockout pin 57 has its lower end surface disposed at or near the lower end opening position of the fin molding hole 56, and while molding, the knockout pin 57 is retracted (raised) by the flow pressure of the metal material. The metal material is caused to flow into the fin forming hole 56. As a result, resistance (back pressure) can be applied to the metal material flowing into the fin forming hole 56 in the direction opposite to the inflow direction (downward direction), and the pin fin 21 can be formed with high accuracy by preventing the lack of thickness. be able to.
- a biasing means such as a spring.
- a surplus escape portion 58 is formed on the outer periphery of the molding die 55 on the lower surface side of the restraining die 53 so that surplus metal material generated during molding is accommodated in the surplus recess portion 58. Yes.
- the intermediate molded body W1 is subjected to secondary molding to obtain the heat dissipation substrate W2. That is, as shown in FIG. 2A, with the punch 5 raised, the intermediate molded product W1 as the primary molded product is put into the constraining recess 60 of the die 6 and set. In this case, the base 11 and the mounting base 12 of the intermediate molded body W1 are respectively stored in the base receiving recess 61 and the mounting base receiving recess 62 of the die 6.
- the heating temperature of the intermediate molded body W1 is 250 ° C. to 600 ° C. Further, the temperature (die temperature) of the punch 5 and the die 6 is set to about 300 ° C.
- the secondary forming can be performed by cold forging instead of hot forging.
- the punch 5 is lowered and driven into the constraining recess 60 of the die 6. 2B, the lower surface of the inhibition mold 53 of the punch 5 hits the non-molded portion 16 (portion other than the molded portion 15) on the upper surface side (back surface side) of the intermediate molded body W1, and the descent stops. Rises (retreats) relative to the mold 55 that continues to descend. And with the rise, the spring 7 is compressed, and the inhibition mold 53 inhibits the non-molded portion 16 of the intermediate molded body W1 by the repulsive force.
- the non-molding part 16 of the intermediate molded body W1 is restrained by the restraining die 53 by the elastic force of the spring 7, it is possible to prevent an excessive pressure from being applied to the non-molding part 16 during molding. Therefore, it is possible to fix the position of the non-molded portion 16 in a stable state without plastic deformation.
- the forming die 55 of the punch 5 is lowered together with the anvil 51 and pressurizes the forming portion 15 of the intermediate formed body W1 with a sufficient forming load, so that the forming portion 15 is plastically deformed.
- the metal material constituting the molding portion 15 is plastically flowed and flows into the fin molding hole 56 of the molding die 55 to mold the pin fins 21, thereby manufacturing the heat dissipation substrate W ⁇ b> 2 as a secondary molded product.
- surplus metal material generated around the molding portion 15 is allowed to escape into the recess 58 and the material pressure in the mold is prevented from excessively rising.
- the punch 5 is raised.
- the knockout pin 57 of the punch 5 is advanced (lowered) and the pin fin 21 is protruded from the fin forming hole 56, and the knockout pin 66 of the die 6 is advanced (raised), and the heat dissipation substrate W2 is pushed up. And is discharged from the constraining recess 60 of the die 6.
- the surplus wall 22 is erected so as to surround the outer periphery of the pin fin 21, but in this embodiment, the surplus wall 22 is provided as necessary. It is cut and removed by machining and shipped as a heat dissipation board product.
- a part of the surplus wall 22 is used as a flow path wall through which a coolant flows, or the surplus wall 22 is used as a pedestal for mounting other parts, thereby allowing the heat dissipation substrate W2 to leave the surplus wall 22 remaining.
- secondary forming by the secondary forming forging die D2 corresponds to the forging step. Further, the restraining direction of the punch 5 such as the inhibition die 53 and the forming die 55 in the secondary forging die D2 is downward, and the restraining direction of the die 6 is upward.
- the pin fins 21 are integrally formed on the base 1, so that a separate heat sink is used as a base with an adhesive having low thermal conductivity.
- heat dissipation performance can be improved, and compared to the case where a separate heat sink is attached by heat treatment such as welding, the occurrence of thermal distortion can be suppressed and high dimensional accuracy is maintained. be able to.
- heat radiation is divided into overall forging (primary molding) in which the main part is molded except for the pin fins 21 (heat sink) having a dense shape and partial forging (secondary molding) in which the heat sink part is molded.
- the substrate W2 is manufactured.
- the intermediate molded body W1 manufactured by the primary molding does not include a pin fin (heat sink) having a dense and complicated shape, and there is no large deviation in the processing degree as a whole, and the volume balance is good. For this reason, in the primary molding, the punch load can be adjusted appropriately, and the intermediate molded body W1 can be molded with a substantially uniform pressure in a balanced manner as a whole, and the intermediate molded body W1 with high dimensional accuracy can be manufactured.
- a uniform load with a good balance can be applied to the entire area of the mold, and it is possible to prevent a problem that an excessive load is partially applied to the mold D1, and to prevent early forging of the forged mold D1.
- the mold life can be improved and the cost can be reduced.
- the pin fin 21 can be molded with a relatively small load that can be molded. it can. Therefore, an excessive load is not applied to the fin forming portion of the molding die 55 during the secondary molding, and the early forging die D2 can be prevented from being damaged. Similar to the forging die D1 for the next molding, the die life can be improved and the cost can be reduced.
- a surplus escape portion 58 is formed on the outer periphery of the forming die 55 of the forging die D2 for secondary forming, and surplus metal material generated during the secondary forming is filled into the recess portion 58.
- the non-molded portion 16 of the intermediate molded body W1 is restrained by the spring force of the spring 7 through the restraint die 23. It is possible to reliably prevent deformation of the non-molded portion 16 such as the base 1 without applying a load. Furthermore, since the non-molded portion 16 of the intermediate molded body W1 can be restrained with an appropriate pressure by the restraining die 23, the intermediate molded body W1 can be held in a stable state and secondary molding can be performed with high accuracy.
- the molding part 15 of the intermediate molded body W1 as a molding material for secondary molding is raised and formed thick, when the fin 21 is molded by pressurizing the molding part 15, the metal for fin molding Sufficient material can be secured and the fins 21 can be reliably formed.
- the heat dissipation substrate W2 can be efficiently manufactured.
- the intermediate formed body W1 subjected to secondary forming is formed by forging.
- the intermediate formed body W1 is not necessarily formed by forging.
- the intermediate molded body W1 may be formed of any molded product, for example, a die-cast molded product.
- the surplus relief part 58 formed in the punch 5 of the forging die D2 for secondary forming was formed in the suppression die 53
- the present invention is not limited to this.
- the excess relief portion 58 may be formed on the outer periphery of the mold 55.
- a concave step portion may be formed on the outer periphery of the molding die 55, and the extra thickness relief recess portion 58 may be configured by the concave step portion.
- the metal material M flowing into the surplus escape recess 58 at the time of molding is preferentially filled from the outside of the surplus escape recess 58.
- the excess thickness relief recess 58 is formed, the metal material is likely to enter the gap S between the outer peripheral surface of the molding die 55 and the suppression mold 53, and burrs are likely to occur in the gap S. Then, due to the influence of the burr, the sliding operation of the suppression mold 53 with respect to the molding die 55 may be hindered, and a sliding failure (operation failure) may occur. For this reason, as shown in the embodiment of FIG. 2A and FIG. 2B, it is preferable to form the excess thickness relief recess 58 on the inner periphery of the suppression die 53.
- the molded part 15 of the intermediate molded body W1 is built up and raised upward, but the molded part 15 of the intermediate molded body W1 does not necessarily need to be formed thick.
- the molded portion 15 of the intermediate molded body W1 can be formed flat so as to be flush with other regions.
- the tip surface (lower end surface) of the molding die 55 is disposed below the upper surface of the base 1 in the heat dissipation substrate W2,
- the lower end position (base position) of the fin 21 on the heat radiating substrate W ⁇ b> 2 is disposed below the upper surface of the base 1. Even if it is such a shape, it can be used without difficulty as a heat dissipation board product by appropriately dealing with a design change or the like.
- the pin fins 21 are formed on the heat sink (heat radiating portion) 2 of the heat radiating substrate W2, but the shape of the fins 21 is not particularly limited in the present invention.
- a plurality of plate-like or blade-like plate fins 21 may be formed in parallel on the heat radiation portion 2 of the heat radiation substrate W2.
- burr out forging such as semi-sealing forging or non-sealing forging may be used.
- the present invention is not limited to this, and in the present invention, the non-molded portion 16 is subjected to the secondary molding. Only a part of the non-molded part 16 may be suppressed and the remaining part of the non-molded part 16 may be set in an open state without being suppressed. Further, when suppressing the non-molded portion 16 of the intermediate molded body W, it is not always necessary to suppress the non-molded portion 16 with a mold such as a depressing mold, and it should be suppressed using a depressing jig different from the mold.
- the suppression means is constituted by the suppression jig.
- the fins 21 are formed by rearward extrusion in the secondary molding.
- the present invention is not limited to this, and in the present invention, fin forming holes are formed on the die (lower mold) side.
- the fins may be formed by forward extrusion.
- the fin 21 is formed in the back surface side of the thermal radiation board
- the primary forming and the secondary forming may be performed by one (one) forging device. It is good, and it may be performed by a separate mold apparatus. That is, the primary and secondary which are provided with two or more mold stages of a primary forging mold and a secondary forging mold, and the punches of both molds are moved up and down by one press mechanism.
- a continuous molding die device may be used, the forging die for primary molding and the forging die for secondary molding are independent, and each punch is moved up and down by separate press mechanisms.
- the primary forming and the secondary forming may be performed separately by using a table forging device.
- the method for manufacturing a heat dissipation board of the present invention can be suitably used when manufacturing a heat dissipation board for a power control unit for controlling driving of a hybrid vehicle or an electric vehicle, a heat dissipation board for a heat exchanger panel, and the like.
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
Provided is a method for manufacturing a heat dissipating substrate that can form fins with excellent precision.
The present invention is a method for manufacturing a heat dissipating substrate D2 provided with: a base 1 on which a heat dissipating part 2 is provided partially on at least one of a front surface and a back surface; and a plurality of fins 21 formed integratedly with the heat dissipating part 2 of the base 1 and provided so as to stand with respect to the base 1. The present invention includes a material preparation step for preparing an intermediate molded body W1 provided with a molded part 15 corresponding to the heat dissipating part 2 and provided with a non-molded part 16 corresponding to parts other than the heat dissipating part, and a forging step for forming fins 21 in the molded part 15 of the intermediate molded body W1. In the forging step, the fins 21 are formed by plastic deformation of the molded part 15 by die forging while preventing deformation of the non-molded part 16.
Description
本発明は、ベースの一部にヒートシンクが設けられた放熱基板の製造方法およびその関連技術に関する。
The present invention relates to a method for manufacturing a heat dissipation board in which a heat sink is provided on a part of a base and related technology.
ハイブリッド車や電気自動車の駆動を制御するためのパワーコントロールユニット(PCU)の筐体や、熱交換器(IGBT冷却器)用のパネル筐体として、ベースと、そのベースの一部に複数のフィン(ヒートシンク)が立設された放熱基板が周知である。
As a casing of a power control unit (PCU) for controlling the driving of a hybrid vehicle or an electric vehicle, or a panel casing for a heat exchanger (IGBT cooler), a base and a plurality of fins in a part of the base A heat dissipating board provided with a (heat sink) is well known.
例えば特許文献1,2においては、アルミニウム合金のダイカスト製品や鍛造製品等によって構成されるベースに、アルミニウム合金の鍛造製品等によって構成されるヒートシンクが取り付けられた放熱基板を開示している。
For example, Patent Documents 1 and 2 disclose a heat dissipation board in which a heat sink composed of a forged product of aluminum alloy or the like is attached to a base composed of an aluminum alloy die-cast product or a forged product.
しかしながら、上記特許文献1,2に示す放熱基板において、接着剤によってベースにヒートシンクを取り付けるような場合、接着剤は熱伝導性が低いため、放熱性能を低下させるおそれがあるという課題があった。また溶融溶接やろう付け溶接等の熱処理によってベースにヒートシンクを取り付けるような場合、加熱時の熱歪みによってヒートシンクやベースの寸法精度が低下してしまう。そうするとベースに対するヒートシンクの取付精度も低下してしまい、放熱性能を低下させてしまうという課題が発生する。
However, in the heat dissipating substrates shown in Patent Documents 1 and 2, when the heat sink is attached to the base with an adhesive, there is a problem that the heat dissipating performance may be deteriorated because the adhesive has low thermal conductivity. In addition, when a heat sink is attached to the base by heat treatment such as fusion welding or brazing welding, the dimensional accuracy of the heat sink or base decreases due to thermal distortion during heating. If it does so, the attachment accuracy of the heat sink with respect to a base will also fall, and the subject that heat dissipation performance will fall generate | occur | produces.
さらにベースにヒートシンクを取り付けるという作業が必要であるためその分、製造工程数が増加して製作が困難になり、生産効率の低下およびコストの増大を来すという課題があった。
Furthermore, since the work of attaching a heat sink to the base is necessary, the number of manufacturing steps increases, making the manufacturing difficult, and there is a problem that the production efficiency decreases and the cost increases.
一方近年においては、ベースにヒートシンク(複数のフィン)が一体に形成された放熱基板を鍛造加工によって製作する技術が提案されている。
On the other hand, in recent years, a technique has been proposed in which a heat dissipation substrate in which a heat sink (a plurality of fins) is integrally formed on a base is manufactured by forging.
しかしながら、ヒートシンクの部分(放熱部)は多数のフィンが狭い間隔で形成された複雑な形状である一方、ベースのヒートシンク以外の部分(ベース本体部)は、台座等の凸部が散在するだけの簡素な形状である。このため鍛造加工で放熱基板を製作する場合には、ベース本体部と放熱部との加工度合いが大きく異なりボリュームバランスが悪いため、パンチ荷重の調整等が困難となり、例えば放熱部において多数のフィンを精度良く成形することは非常に困難であるという課題が発生する。さらに放熱部に比べて放熱基板の全体サイズは大きいため、鍛造金型全体のサイズも大きくなり、パンチ荷重も大きくなってしまう。そのため鍛造金型におけるフィン形成用部位への負担が大きくなり、金型寿命が短くなってしまうという課題もあった。また簡素な形状のベース本体部と複雑な形状の複数のフィンとが共存しているため、成形後に金型から成形品を突き出すための排出機構(ノックアウト機構)も複雑になってしまう。その結果、金型自体の構成が複雑になって、金型制作費(コスト)の増大を来すという課題も発生する。
However, the heat sink part (heat dissipating part) has a complicated shape in which a large number of fins are formed at narrow intervals, while the part other than the heat sink of the base (base main body part) is only scattered by convex parts such as pedestals. It is a simple shape. For this reason, when manufacturing a heat dissipation board by forging, it is difficult to adjust the punch load because the degree of processing between the base body and the heat dissipation part is greatly different and the volume balance is poor. There arises a problem that it is very difficult to mold with high accuracy. Furthermore, since the overall size of the heat dissipation substrate is larger than that of the heat dissipation portion, the overall size of the forging die is increased and the punch load is also increased. For this reason, there is a problem that the burden on the fin forming portion in the forging die is increased, and the die life is shortened. Further, since the base body portion having a simple shape and a plurality of fins having a complicated shape coexist, a discharge mechanism (knockout mechanism) for ejecting the molded product from the mold after molding becomes complicated. As a result, the configuration of the mold itself becomes complicated, and there is a problem that the mold production cost (cost) increases.
本発明の好ましい実施形態は、関連技術における上述した及び/又は他の問題点に鑑みてなされたものである。本発明の好ましい実施形態は、既存の方法及び/又は装置を著しく向上させることができるものである。
The preferred embodiments of the present invention have been made in view of the above and / or other problems in the related art. Preferred embodiments of the present invention can significantly improve existing methods and / or apparatus.
この発明は、上記の課題に鑑みてなされたものであり、複数のフィンが精度良くベースに一体に形成されて、放熱性能に優れた放熱基板を効率良く安価に製造することができる放熱基板の製造方法およびその関連技術を提供することを目的とする。
The present invention has been made in view of the above-described problem, and a heat dissipation board capable of efficiently and inexpensively manufacturing a heat dissipation board excellent in heat dissipation performance, in which a plurality of fins are formed integrally with a base with high accuracy. An object is to provide a manufacturing method and related technology.
本発明のその他の目的及び利点は、以下の好ましい実施形態から明らかであろう。
Other objects and advantages of the present invention will be apparent from the following preferred embodiments.
上記の目的を達成するため、本発明は、以下の構成を備えている。
In order to achieve the above object, the present invention has the following configuration.
[1]表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板の製造方法であって、
前記放熱基板の成形素材として、前記放熱部に対応して成形部が設けられ、かつ前記放熱部以外の部分に対応して非成形部が設けられた中間成形体を準備する素材準備工程と、
前記中間成形体における前記成形部に前記フィンを成形する鍛造工程とを含み、
前記鍛造工程においては、前記非成形部を変形させずに抑止しつつ、型鍛造によって前記成形部を塑性変形させて前記フィンを形成するようにしたことを特徴とする放熱基板の製造方法。 [1] A heat dissipation provided with a base in which at least one of the front and back surfaces is partially provided with a heat dissipation portion, and a plurality of fins that are integrally formed with the heat dissipation portion of the base and are erected with respect to the base A method for manufacturing a substrate, comprising:
As a forming material of the heat dissipation substrate, a material preparation step of preparing an intermediate molded body provided with a molding portion corresponding to the heat dissipation portion and provided with a non-molding portion corresponding to a portion other than the heat dissipation portion;
Including a forging step of forming the fin in the forming portion of the intermediate formed body,
In the forging step, the fin is formed by plastically deforming the molded part by die forging while suppressing the non-molded part without being deformed.
前記放熱基板の成形素材として、前記放熱部に対応して成形部が設けられ、かつ前記放熱部以外の部分に対応して非成形部が設けられた中間成形体を準備する素材準備工程と、
前記中間成形体における前記成形部に前記フィンを成形する鍛造工程とを含み、
前記鍛造工程においては、前記非成形部を変形させずに抑止しつつ、型鍛造によって前記成形部を塑性変形させて前記フィンを形成するようにしたことを特徴とする放熱基板の製造方法。 [1] A heat dissipation provided with a base in which at least one of the front and back surfaces is partially provided with a heat dissipation portion, and a plurality of fins that are integrally formed with the heat dissipation portion of the base and are erected with respect to the base A method for manufacturing a substrate, comprising:
As a forming material of the heat dissipation substrate, a material preparation step of preparing an intermediate molded body provided with a molding portion corresponding to the heat dissipation portion and provided with a non-molding portion corresponding to a portion other than the heat dissipation portion;
Including a forging step of forming the fin in the forming portion of the intermediate formed body,
In the forging step, the fin is formed by plastically deforming the molded part by die forging while suppressing the non-molded part without being deformed.
[2]前記中間成形体における前記成形部の厚みが前記非成形部の厚みよりも厚く形成されている前項1に記載の放熱基板の製造方法。
[2] The method for manufacturing a heat dissipation board as recited in the aforementioned Item 1, wherein the thickness of the molded part in the intermediate molded body is formed to be greater than the thickness of the non-molded part.
[3]前記鍛造工程において用いられる鍛造金型は、ダイスと、パンチとを備え、
前記パンチの拘束面に前記フィンを成形するためのフィン成形孔が設けられ、
前記ダイスに設置した前記中間成形体に前記パンチを打ち込んだ際に、前記成形部を構成する金属材料を前記フィン成形孔内に流入させる後方押し出しによって前記フィンを形成するようにした前項1または2に記載の放熱基板の製造方法。 [3] The forging die used in the forging step includes a die and a punch,
A fin forming hole for forming the fin on the restraining surface of the punch is provided,
The preceding item 1 or 2, wherein when the punch is driven into the intermediate formed body installed on the die, the fin is formed by backward extrusion that causes a metal material constituting the forming portion to flow into the fin forming hole. The manufacturing method of the thermal radiation board | substrate of description.
前記パンチの拘束面に前記フィンを成形するためのフィン成形孔が設けられ、
前記ダイスに設置した前記中間成形体に前記パンチを打ち込んだ際に、前記成形部を構成する金属材料を前記フィン成形孔内に流入させる後方押し出しによって前記フィンを形成するようにした前項1または2に記載の放熱基板の製造方法。 [3] The forging die used in the forging step includes a die and a punch,
A fin forming hole for forming the fin on the restraining surface of the punch is provided,
The preceding
[4]前記鍛造工程において用いられる鍛造金型は、前記成形部に対応して設けられた成形型と、前記非成形部に対応して設けられた抑止型とを備え、
前記鍛造工程において、前記抑止型によって前記非成形部を抑止しつつ、前記成形型によって前記成形部に前記フィンを成形するようにした前項1~3のいずれか1項に記載の放熱基板の製造方法。 [4] A forging die used in the forging step includes a molding die provided corresponding to the molding part and a suppression die provided corresponding to the non-molding part,
4. The manufacturing of a heat dissipation board according to any one of the precedingitems 1 to 3, wherein, in the forging step, the fin is formed in the molded portion by the molding die while the non-formed portion is suppressed by the suppression die. Method.
前記鍛造工程において、前記抑止型によって前記非成形部を抑止しつつ、前記成形型によって前記成形部に前記フィンを成形するようにした前項1~3のいずれか1項に記載の放熱基板の製造方法。 [4] A forging die used in the forging step includes a molding die provided corresponding to the molding part and a suppression die provided corresponding to the non-molding part,
4. The manufacturing of a heat dissipation board according to any one of the preceding
[5]前記抑止型は、前記成形型に対し拘束方向と反対方向に相対的に後退可能に構成されるとともに、
前記鍛造金型は、前記抑止型を拘束方向に抑止力を付与する抑止力付与手段を備え、
前記鍛造工程において、前記抑止力付与手段の抑止力によって前記抑止型を介して前記非成形部を抑止するようにした前項4に記載の放熱基板の製造方法。 [5] The inhibition die is configured to be relatively retractable in a direction opposite to the restraining direction with respect to the molding die,
The forging die includes deterring force applying means for applying a deterring force in the restraining direction of the deterring die,
5. The method for manufacturing a heat dissipation substrate according toitem 4, wherein in the forging step, the non-molded portion is inhibited via the inhibition die by the inhibition force of the inhibition force applying means.
前記鍛造金型は、前記抑止型を拘束方向に抑止力を付与する抑止力付与手段を備え、
前記鍛造工程において、前記抑止力付与手段の抑止力によって前記抑止型を介して前記非成形部を抑止するようにした前項4に記載の放熱基板の製造方法。 [5] The inhibition die is configured to be relatively retractable in a direction opposite to the restraining direction with respect to the molding die,
The forging die includes deterring force applying means for applying a deterring force in the restraining direction of the deterring die,
5. The method for manufacturing a heat dissipation substrate according to
[6]前記鍛造工程において用いられる鍛造金型は、前記成形部に対応して設けられた成形型を備え、
前記成形型の外周に余肉逃がし凹部が設けられ、
前記鍛造工程において生じる余剰の金属材料を前記余肉逃がし凹部に流入させるようにしたことを前項1~5のいずれか1項に記載の放熱基板の製造方法。 [6] The forging die used in the forging step includes a molding die provided corresponding to the molding part,
The outer periphery of the mold is provided with a surplus escape recess,
6. The method for manufacturing a heat dissipation board according to any one of the precedingitems 1 to 5, wherein surplus metal material generated in the forging step is allowed to flow into the recessed portion.
前記成形型の外周に余肉逃がし凹部が設けられ、
前記鍛造工程において生じる余剰の金属材料を前記余肉逃がし凹部に流入させるようにしたことを前項1~5のいずれか1項に記載の放熱基板の製造方法。 [6] The forging die used in the forging step includes a molding die provided corresponding to the molding part,
The outer periphery of the mold is provided with a surplus escape recess,
6. The method for manufacturing a heat dissipation board according to any one of the preceding
[7]前記素材準備工程において、鍛造加工によって前記中間成形体を製作するようにした前項1~6のいずれか1項に記載の放熱基板の製造方法。
[7] The method for manufacturing a heat dissipation substrate according to any one of items 1 to 6, wherein the intermediate formed body is manufactured by forging in the material preparation step.
[8]表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板を成形するための鍛造金型であって、
前記放熱基板の前記放熱部に対応して設けられ、かつ前記フィンを成形するための成形型と、
前記放熱基板の前記放熱部以外の部分に対応して設けられ、かつ前記放熱部以外の部分を抑止するための抑止手段とを備えたことを特徴とする鍛造金型。 [8] A heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat radiating portion, and a plurality of fins that are integrally formed with the heat radiating portion of the base and are erected with respect to the base. A forging die for forming a substrate,
A mold for forming the fins, which is provided corresponding to the heat dissipation portion of the heat dissipation substrate;
A forging die provided with a suppressing means provided to correspond to a portion other than the heat radiating portion of the heat radiating substrate and for suppressing a portion other than the heat radiating portion.
前記放熱基板の前記放熱部に対応して設けられ、かつ前記フィンを成形するための成形型と、
前記放熱基板の前記放熱部以外の部分に対応して設けられ、かつ前記放熱部以外の部分を抑止するための抑止手段とを備えたことを特徴とする鍛造金型。 [8] A heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat radiating portion, and a plurality of fins that are integrally formed with the heat radiating portion of the base and are erected with respect to the base. A forging die for forming a substrate,
A mold for forming the fins, which is provided corresponding to the heat dissipation portion of the heat dissipation substrate;
A forging die provided with a suppressing means provided to correspond to a portion other than the heat radiating portion of the heat radiating substrate and for suppressing a portion other than the heat radiating portion.
[9]前記抑止手段は、
前記成形型に対し拘束方向と反対方向に相対的に後退可能に構成された抑止型と、
前記抑止型に拘束方向に抑止力を付与するための抑止力付与手段とを備える前項8に記載の鍛造金型。 [9] The suppression means includes
A deterrent mold configured to be relatively retractable in a direction opposite to the constraint direction with respect to the mold;
The forging die according to the preceding item, comprising deterrence applying means for applying deterrence to the deterring die in a restraining direction.
前記成形型に対し拘束方向と反対方向に相対的に後退可能に構成された抑止型と、
前記抑止型に拘束方向に抑止力を付与するための抑止力付与手段とを備える前項8に記載の鍛造金型。 [9] The suppression means includes
A deterrent mold configured to be relatively retractable in a direction opposite to the constraint direction with respect to the mold;
The forging die according to the preceding item, comprising deterrence applying means for applying deterrence to the deterring die in a restraining direction.
[10]ダイスと、パンチとを備え、
前記パンチに前記成形型および前記抑止型が設けられている前項8または9に記載の鍛造金型。 [10] A die and a punch are provided,
10. The forging die according to 8 or 9 above, wherein the punch and the inhibition die are provided.
前記パンチに前記成形型および前記抑止型が設けられている前項8または9に記載の鍛造金型。 [10] A die and a punch are provided,
10. The forging die according to 8 or 9 above, wherein the punch and the inhibition die are provided.
[11]前記成形型の外周に余肉逃がし凹部が設けられている前項8~10のいずれか1項に記載の鍛造金型。
[11] The forging die according to any one of items 8 to 10 above, wherein a surplus escape recess is provided on an outer periphery of the molding die.
[12]表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板であって、
前記放熱部の外周に沿って余肉壁が前記ベースに一体に立設されていることを特徴とする放熱基板。 [12] A heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat dissipating part, and a plurality of fins that are integrally formed with the heat dissipating part of the base and are erected with respect to the base A substrate,
A heat dissipation board, wherein a surplus wall is integrally provided on the base along the outer periphery of the heat dissipation portion.
前記放熱部の外周に沿って余肉壁が前記ベースに一体に立設されていることを特徴とする放熱基板。 [12] A heat dissipation comprising a base in which at least one of the front and back surfaces is partially provided with a heat dissipating part, and a plurality of fins that are integrally formed with the heat dissipating part of the base and are erected with respect to the base A substrate,
A heat dissipation board, wherein a surplus wall is integrally provided on the base along the outer periphery of the heat dissipation portion.
発明[1]の放熱基板の製造方法によれば、製造された放熱基板は、ベースにフィン(ヒートシンク)が一体に形成されているため、ベースに別体のヒートシンクを熱伝導性が低い接着剤で取り付けたり、溶接等の熱処理で取り付けた放熱基板と比較して、熱伝導性の低下や熱歪みの発生を抑制することができ、高い寸法精度を維持できるとともに、十分な放熱性能を得ることができる。さらにベースにフィンを一体に形成するものであるため、製造工程数も少なく、生産効率の向上およびコストの削減を図ることができる。また緻密で複雑な形状の複数のフィンを部分鍛造によって成形するようにしているため、フィンを成形できる程度の小さい荷重で成形することができる。このため鍛造金型内において金属材料に過度な圧力が加わらず、変形を防止できて寸法精度を一層向上させることができるとともに、鍛造金型のフィン形成用部位等に対し多大な負荷が加わることもなく、鍛造金型の早期破損を防止できて、金型寿命の向上およびコストの削減をより確実に図ることができる。さらに部分鍛造であるため、金型を簡素な構造に形成でき、より一層コストの削減を図ることができる。
According to the method for manufacturing a heat dissipation board of the invention [1], since the manufactured heat dissipation board is integrally formed with fins (heat sinks) on the base, a separate heat sink is attached to the base and the adhesive has low thermal conductivity. Compared with a heat dissipation board attached by heat treatment such as welding, it is possible to suppress the decrease in thermal conductivity and the occurrence of thermal distortion, maintain high dimensional accuracy and obtain sufficient heat dissipation performance Can do. Furthermore, since the fins are integrally formed on the base, the number of manufacturing steps is small, and the production efficiency can be improved and the cost can be reduced. Further, since a plurality of fins having a dense and complicated shape are formed by partial forging, the fins can be formed with a load that is small enough to form the fins. For this reason, excessive pressure is not applied to the metal material in the forging die, deformation can be prevented and the dimensional accuracy can be further improved, and a large load is applied to the fin forming part of the forging die. In addition, it is possible to prevent early forging of the forging die and to improve the life of the die and reduce the cost more reliably. Furthermore, because of partial forging, the mold can be formed in a simple structure, and the cost can be further reduced.
発明[2]の放熱基板の製造方法によれば、フィン成形用の金属材料を十分に確保できるため、寸法精度が高いフィンをより確実に形成することができる。
According to the manufacturing method of the heat dissipation board of the invention [2], the metal material for forming the fin can be sufficiently secured, so that the fin with high dimensional accuracy can be more reliably formed.
発明[3]の放熱基板の製造方法によれば、後方押し出しによってフィンを成形しているため、ピンフィン等の断面積が小さいフィンを高い精度で確実に形成することができる。
According to the manufacturing method of the heat dissipation board of the invention [3], since the fin is formed by backward extrusion, a fin having a small cross-sectional area such as a pin fin can be reliably formed with high accuracy.
発明[4]の放熱基板の製造方法によれば、中間成形体の非成形部を安定した状態に抑止できるため、フィン等の加工精度を一層向上させることができる。
According to the manufacturing method of the heat dissipation substrate of the invention [4], since the non-molded portion of the intermediate molded body can be suppressed to a stable state, the processing accuracy of fins and the like can be further improved.
発明[5]の放熱基板の製造方法によれば、中間成形体の非成形部を適度な圧力で抑止できるため、フィン等の加工精度をより一層向上させることができる。
According to the manufacturing method of the heat dissipation board of the invention [5], the non-molded portion of the intermediate molded body can be suppressed with an appropriate pressure, so that the processing accuracy of fins and the like can be further improved.
発明[6]の放熱基板の製造方法によれば、部分的に材料圧力が過度に上昇するのを防止できるため、ベースやフィン等の有害な変形を防止できて、高品質の放熱基板を確実に製造することができる。
According to the method for manufacturing a heat dissipation board of the invention [6], it is possible to prevent the material pressure from partially rising excessively, thereby preventing harmful deformation of the base, fins, etc., and ensuring a high-quality heat dissipation board. Can be manufactured.
発明[7]の放熱基板の製造方法によれば、中間成形体および放熱基板を一連の鍛造加工によって製作できるため、生産効率を向上させることができる。
According to the heat dissipation substrate manufacturing method of the invention [7], the intermediate molded body and the heat dissipation substrate can be manufactured by a series of forging processes, so that the production efficiency can be improved.
発明[8]~[11]の鍛造金型によれば、上記の方法発明を実施できるため、上記の方法発明と同様な効果を得ることができる。
According to the forging dies of the inventions [8] to [11], since the above-described method invention can be carried out, the same effects as the above-described method invention can be obtained.
発明[12]の放熱基板によれば、上記の方法発明の実施によって得ることができる。
According to the heat dissipation substrate of the invention [12], it can be obtained by carrying out the above method invention.
本発明の実施形態である製造方法によって製造される放熱基板W2は鍛造製品によって構成されている。すなわち本実施形態の製造方法では、図1Aに示すように矩形板状の鍛造素材Wに対し1次形成(1F)としての型鍛造を行って、図1Bに示すように1次成形品(1F品)を製作する。続いてその1次成形品としての中間成形体W1に対し図2Aおよび図2Bに示すように2次成形(2F)としての型鍛造を行って2次成形品(2F品)を製作する。そしてその2次成形品を本実施形態の放熱基板W2として採用するものである。
The heat dissipation substrate W2 manufactured by the manufacturing method according to the embodiment of the present invention is configured by a forged product. That is, in the manufacturing method of this embodiment, die forging as primary formation (1F) is performed on a rectangular plate-shaped forging material W as shown in FIG. 1A, and a primary molded product (1F as shown in FIG. 1B). Product). Subsequently, as shown in FIGS. 2A and 2B, die forging as secondary molding (2F) is performed on the intermediate molded body W1 as the primary molded product to produce a secondary molded product (2F product). The secondary molded product is employed as the heat dissipation substrate W2 of the present embodiment.
本実施形態において、1次成形に用いられる鍛造素材Wとしては、展伸材例えば、フラットバー(平板)形状の押出材を切断したもの、板状の圧延材を切断したもの、連続鋳造棒を切断して略平板状に横据込加工したもの等を好適に用いることができる。さらに素材Wの材質としては、アルミニウム合金(Al合金)や銅合金等を用いることができる。特に合金番号A1100、A6063、A3003等のAl合金を好適に用いることができる。
In this embodiment, as the forging material W used for the primary forming, a wrought material, for example, a material obtained by cutting a flat bar (flat plate) shaped extruded material, a material obtained by cutting a plate-like rolled material, a continuous cast bar, What was cut | disconnected and carried out the horizontal upsetting process in the substantially flat form etc. can be used suitably. Furthermore, as the material of the material W, an aluminum alloy (Al alloy), a copper alloy, or the like can be used. In particular, Al alloys such as alloy numbers A1100, A6063, and A3003 can be preferably used.
図3Aおよび図3Bに示すように2次成形の成形素材としての中間成形体(1次成形品)W1は、矩形板状のベース1を備えている。ベース1の表面側には、大小様々な円錐台形状の複数の台座11が表面側(上方)突出するように一体に形成されるとともに、上面が平坦面である取付台12が表面側(上方)に隆起するように一体に形成されている。さらにベース1の裏面側には上記取付台12に対応して、平面視矩形状の成形部15が裏面側(下方)に隆起するように一体に形成されている。ここで本実施形態においては、中間成形体W1の成形部15以外の部分、すなわち中間成形体W1の表面側における全域と、裏面側における成形部15の外側部分とによって非成形部16が構成されている。
As shown in FIGS. 3A and 3B, an intermediate molded body (primary molded product) W1 as a molding material for secondary molding includes a rectangular plate-like base 1. On the surface side of the base 1, a plurality of large and small truncated cone-shaped bases 11 are integrally formed so as to protrude from the surface side (upward), and a mounting base 12 having a flat upper surface is provided on the surface side (upward) ) Are integrally formed so as to protrude. Further, on the back surface side of the base 1, a molding portion 15 having a rectangular shape in plan view is formed integrally with the mounting base 12 so as to protrude on the back surface side (downward). Here, in the present embodiment, the non-molded portion 16 is configured by a portion other than the molded portion 15 of the intermediate molded body W1, that is, the entire area on the front surface side of the intermediate molded body W1 and the outer portion of the molded portion 15 on the back surface side. ing.
図4Aおよび図4Bに示すように2次成形品としての放熱基板W2の裏面側には、上記成形部15の外周の除く部分において、縦横に整列する複数のピンフィン21がベース1に対し垂直な方向に突出(立設)するように一体に形成されている。さらに放熱基板W2の裏面側には、上記成形部15の外周に対応する部分において、複数のピンフィン21を取り囲むように周方向に連続する余肉壁22が一体に形成されている。
As shown in FIG. 4A and FIG. 4B, a plurality of pin fins 21 aligned vertically and horizontally are perpendicular to the base 1 on the back surface side of the heat dissipation substrate W2 as a secondary molded product, except for the outer periphery of the molded portion 15. It is integrally formed so as to protrude (stand up) in the direction. Further, a surplus wall 22 continuous in the circumferential direction is integrally formed on the back surface side of the heat dissipation substrate W2 so as to surround the plurality of pin fins 21 at a portion corresponding to the outer periphery of the molding portion 15.
また放熱基板W2における上記非成形部16に対応する部分は、中間成形体W1に対し実質的に同じ形状を備えている。例えば中間成形体W1の非成形部16における台座11および取付台12は、2次成形後の放熱基板W2においても実質的に同じ形状の台座11および取付台12が同じ位置に形成されている。なお本実施形態において、台座11は、他の部品を取り付けるためのものであり、取付台12は、リアクトル、コンバータ、インバータ、IGBT等の発熱体(発熱素子)を取り付けるためのものである。
Further, the portion of the heat dissipation substrate W2 corresponding to the non-molded portion 16 has substantially the same shape as the intermediate molded body W1. For example, the pedestal 11 and the mounting base 12 in the non-molded portion 16 of the intermediate molded body W1 have the pedestal 11 and the mounting base 12 having substantially the same shape in the same position also in the heat-radiating substrate W2 after the secondary molding. In the present embodiment, the pedestal 11 is for mounting other components, and the mounting base 12 is for mounting a heating element (heating element) such as a reactor, a converter, an inverter, or an IGBT.
ここで本実施形態においては、放熱基板W2の複数のピンフィン21が形成される部分によって放熱部(ヒートシンク)2が構成されている。
Here, in the present embodiment, a heat radiating portion (heat sink) 2 is configured by a portion where the plurality of pin fins 21 of the heat radiating substrate W2 are formed.
次に本実施形態の中間成形体W1を形成するための1次成形用鍛造金型D1およびその金型D1を用いた中間成形体W1の製造方法について詳細に説明する。
Next, a forging mold D1 for primary molding for forming the intermediate molded body W1 of the present embodiment and a method for manufacturing the intermediate molded body W1 using the mold D1 will be described in detail.
図1Aおよび図1Bは中間成形体(1次成形品)W1を製作するための1次成形用鍛造金型D1を示す断面図である。両図に示すようにこの1次成形用鍛造金型D1は、上金型としてのパンチ3と、下金型としてのダイス4とを備えている。
FIG. 1A and FIG. 1B are sectional views showing a forging die D1 for primary molding for producing an intermediate molded body (primary molded product) W1. As shown in both figures, the forging die D1 for primary forming includes a punch 3 as an upper die and a die 4 as a lower die.
ダイス4の上面には、中間成形体W1の外周面形状に対応する形状に形成され、かつ上方に開放する拘束凹部40が形成されている。さらに拘束凹部40の内周面には、中間成形体W1の台座11および取付台12を成形するための台座成形凹部41および取付台成形凹部42がそれぞれ形成されている。
The upper surface of the die 4 is formed with a constraining recess 40 that is formed in a shape corresponding to the outer peripheral surface shape of the intermediate molded body W1 and opens upward. Further, on the inner peripheral surface of the constraining concave portion 40, a base molding concave portion 41 and a mounting base molding concave portion 42 for molding the base 11 and the mounting base 12 of the intermediate molded body W1 are formed, respectively.
ここで本実施形態においては、ダイス4の拘束凹部40の内周面が拘束面として構成されている。
Here, in the present embodiment, the inner peripheral surface of the constraining recess 40 of the die 4 is configured as a constraining surface.
一方パンチ3は、ダイス4の上方に拘束凹部40に対応して配置され、図示しない駆動手段によって上下方向に昇降駆動できるようになっている。パンチ4の下端部は、ダイス4の拘束凹部40内に適合状態に収容できる形状に形成されており、パンチ3を上昇位置から降下させることにより、ダイス4の下端部を拘束凹部40に所定の荷重で打ち込むことができるようになっている。
On the other hand, the punch 3 is disposed above the die 4 so as to correspond to the constraining recess 40, and can be driven up and down in the vertical direction by a driving means (not shown). The lower end portion of the punch 4 is formed in a shape that can be accommodated in the constraining recess 40 of the die 4, and the lower end portion of the die 4 is moved into the constraining recess 40 by lowering the punch 3 from the raised position. It can be driven with a load.
さらにダイス4の所要部分には、ノックアウトピン46が設けられている。例えば適当な位置の台座成形凹部41の底面に、上下方向に貫通するノックアウトピン収容孔45が形成されるとともに、拘束凹部40の底面における端部(図1Aおよび図1Bの右端部等)に、上下方向に貫通するノックアウトピン収容孔45がそれぞれ形成されており、各収容孔45にノックアウトピン46が上方に突出可能に収容配置されている。そしてノックアウトピン46は成形直後に図示しない駆動手段の駆動によって突出することによって、1次成形品としての中間成形体W1が突き上げられてダイス4の拘束凹部40から離型して排出されるようになっている。
Furthermore, a knockout pin 46 is provided at a required portion of the die 4. For example, a knockout pin accommodation hole 45 penetrating in the vertical direction is formed on the bottom surface of the base molding recess 41 at an appropriate position, and at the end portion (such as the right end portion in FIGS. 1A and 1B) on the bottom surface of the restraint recess 40, Knockout pin accommodation holes 45 penetrating in the vertical direction are formed, and the knockout pins 46 are accommodated in the accommodation holes 45 so as to protrude upward. The knockout pin 46 protrudes immediately after molding by driving of a driving means (not shown) so that the intermediate molded body W1 as a primary molded product is pushed up and released from the constraining recess 40 of the die 4 and discharged. It has become.
またパンチ3の下端面(拘束面)には、ダイス4の取付台成形凹部42に対応して、中間成形体W1の成形部15を成形するための成形部成形凹部35が形成されている。
Further, on the lower end surface (restraint surface) of the punch 3, a molding part molding concave part 35 for molding the molding part 15 of the intermediate molded body W 1 is formed corresponding to the mounting base molding concave part 42 of the die 4.
以上の構成の1次成形用鍛造金型D1を用いて、鍛造素材Wに対し1次成形を行って中間成形体W1を得るものである。すなわち図1Aに示すようにパンチ3を上昇させた状態で、ダイス4の拘束凹部40内に鍛造素材Wを投入してセットする。鍛造素材Wは例えばアルミニウム合金Al合金の場合には加熱温度を400℃~550℃とする。さらにパンチ3およびダイス4の温度(型温度)を200℃程度とする。
The intermediate forming body W1 is obtained by performing primary forming on the forging material W using the forging die D1 for primary forming having the above configuration. That is, as shown in FIG. 1A, the forging material W is loaded and set in the constraining recess 40 of the die 4 with the punch 3 raised. For example, when the forging material W is an aluminum alloy Al alloy, the heating temperature is set to 400 ° C. to 550 ° C. Further, the temperature (die temperature) of the punch 3 and the die 4 is set to about 200 ° C.
そしてパンチ3を降下させてダイス4の拘束凹部40内に打ち込む。これにより図1Bに示すように、鍛造素材Wがパンチ3およびダイス4によって挟圧されて鍛造素材Wを構成する金属材料(メタル)の所要部分が塑性流動して、台座成形凹部41および取付台成形凹部42内に充填されて台座11および取付台12が成形されるとともに、金属材料が成形部成形凹部35内に充填されて成形部15が成形される。こうして1次成形品としての中間成形体W1が成形された後、パンチ3が上昇する一方、ノックアウトピン46が上方に突出して中間成形体W1を突き上げることにより、中間成形体W1がダイス4の拘束凹部40から排出される。
Then, the punch 3 is lowered and driven into the constraining recess 40 of the die 4. As a result, as shown in FIG. 1B, the forged material W is clamped by the punch 3 and the die 4 to plastically flow a required portion of the metal material (metal) constituting the forged material W, and the base forming recess 41 and the mounting base The base 11 and the mounting base 12 are molded by filling the molding recess 42, and the molding part 15 is molded by filling the molding part molding recess 35 with a metal material. After the intermediate molded body W1 as the primary molded product is formed in this way, the punch 3 is raised, while the knockout pin 46 protrudes upward to push up the intermediate molded body W1, so that the intermediate molded body W1 restrains the die 4. It is discharged from the recess 40.
本実施形態においては、1次成形用鍛造金型D1による1次成形が素材準備工程に相当するものである。
In the present embodiment, the primary forming by the primary forming forging die D1 corresponds to the material preparation step.
次に本実施形態の放熱基板W2を形成するための2次成形用鍛造金型D2およびその金型D2を用いた放熱基板W2の製造方法について詳細に説明する。
Next, a secondary forming forging die D2 for forming the heat dissipation substrate W2 of the present embodiment and a method of manufacturing the heat dissipation substrate W2 using the die D2 will be described in detail.
図2Aおよび図2Bは放熱基板(2次成形品)W2を製作するための2次成形用鍛造金型D2を示す断面図である。両図に示すようにこの2次成形用鍛造金型D2は、上金型としてのパンチ5と、下金型としてのダイス6とを備えている。
2A and 2B are cross-sectional views showing a forging die D2 for secondary forming for manufacturing a heat dissipation substrate (secondary molded product) W2. As shown in both figures, the forging die D2 for secondary forming includes a punch 5 as an upper die and a die 6 as a lower die.
ダイス6は、上記1次成形用鍛造金型D1のダイス4と実質的に同じ構成を備えている。すなわちダイス6の上面に拘束凹部60が形成されるとともに、拘束凹部60内には、1次成形用鍛造金型D1の台座成形凹部41および取付台成形凹部42にそれぞれ対応して台座収容凹部61および取付台収容凹部62がそれぞれ形成されている。なお本実施形態においては、このダイス6の拘束凹部60の内周面が拘束面として構成されている。
The die 6 has substantially the same configuration as the die 4 of the forging die D1 for primary forming. That is, a constraining recess 60 is formed on the upper surface of the die 6, and in the constraining recess 60, a pedestal receiving recess 61 corresponding to the pedestal forming recess 41 and the mounting base forming recess 42 of the primary forming forging die D 1. And the mounting base accommodation recessed part 62 is formed, respectively. In the present embodiment, the inner peripheral surface of the constraining recess 60 of the die 6 is configured as a constraining surface.
さらにダイス6の所要部分には、ノックアウトピン収容孔65を介してノックアウトピン66が突出可能に配置されている。
Furthermore, a knockout pin 66 is disposed in a required portion of the die 6 so as to protrude through a knockout pin accommodation hole 65.
一方、パンチ5は、図示しない駆動手段によって上下方向に昇降駆動可能なアンビル51を備えている。アンビル51の下面側には、パンチホルダー52を介して抑止型53が上下方向にスライド自在に取り付けられており、アンビル51に対し上方(後退方向)に上昇可能に構成されている。抑止型53には、後述の成形型55を収容配置する開口部54が形成されている。抑止型53の開口部54は上下に貫通しており、ダイス6の拘束凹部60内にセットされる中間成形体W1の成形部15に対応する位置に形成されている。さらに抑止型53の下面(抑止面)における開口部54を除く部分は、中間成形体W1における表面側の非成形部16に対応して配置されている。
On the other hand, the punch 5 is provided with an anvil 51 that can be driven up and down in the vertical direction by a driving means (not shown). On the lower surface side of the anvil 51, a restraining die 53 is attached so as to be slidable in the vertical direction via a punch holder 52, and is configured to be able to rise upward (retracting direction) relative to the anvil 51. The inhibition mold 53 is formed with an opening 54 that accommodates and arranges a molding mold 55 described later. The opening 54 of the restraining die 53 penetrates vertically and is formed at a position corresponding to the molding portion 15 of the intermediate molded body W1 set in the constraining recess 60 of the die 6. Furthermore, the part except the opening part 54 in the lower surface (suppression surface) of the suppression mold | type 53 is arrange | positioned corresponding to the non-molding part 16 of the surface side in the intermediate molded body W1.
また抑止型53とアンビル51との間には圧縮コイルバネ等のスプリング7が介在されており、後述するようにこのスプリング7の弾性力(反発力)によって抑止型53の抑止力を付与できるようになっている。ここで本実施形態においては、スプリング7によって抑止力付与手段が構成されるとともに 抑止型53および抑止力付与手段によって抑止手段が構成されている。
A spring 7 such as a compression coil spring is interposed between the restraining die 53 and the anvil 51 so that the restraining force of the restraining die 53 can be applied by the elastic force (repulsive force) of the spring 7 as will be described later. It has become. Here, in the present embodiment, the deterring force applying means is constituted by the spring 7 and the inhibiting means is constituted by the deterring mold 53 and the deterring force applying means.
なお本発明において、抑止力付与手段はスプリング7に限定されるものではなく、適度な圧力を付与できる手段であればどのようなものでも用いることができる。スプリング以外の抑止力付与手段としては、ガスクッションや、プレス機が保有するノックアウト機構等を例示することができる。
In the present invention, the deterrence applying means is not limited to the spring 7, and any means that can apply an appropriate pressure can be used. Examples of the deterrence imparting means other than the spring include a gas cushion and a knockout mechanism possessed by the press.
またアンビル51の下面側にはアンビル51と同期して昇降するように成形型55が固定されている。この成形型55は上記抑止型53の開口部54に挿通配置されて、成形型56の下面が抑止型53の下方に露出するように配置されている。この成形型55には、下面に開口し、かつ上下方向に貫通する断面円形のフィン成形孔56が複数形成されている。各フィン成形孔56内にはノックアウトピン57が上下方向にスライド自在にそれぞれ収容されている。
Further, a molding die 55 is fixed on the lower surface side of the anvil 51 so as to move up and down in synchronization with the anvil 51. The molding die 55 is inserted into the opening 54 of the restraining die 53 so that the lower surface of the molding die 56 is exposed below the restraining die 53. The forming die 55 is formed with a plurality of fin forming holes 56 having a circular cross section that open on the lower surface and penetrate in the vertical direction. A knockout pin 57 is accommodated in each fin forming hole 56 so as to be slidable in the vertical direction.
パンチ5のうち抑止型53は、後述の成形時においてパンチ5(アンビル51)が降下した際には、中間成形体W1の非成形部16に当たって降下が停止し、降下し続けるアンビル51(成形型55)に対し相対的に上昇(後退)するようになっている。
When the punch 5 (anvil 51) is lowered during molding described later, the restraining die 53 among the punches 5 hits the non-molded portion 16 of the intermediate molded body W1, and the descent stops and the anvil 51 (molding die) continues to descend. 55) is relatively raised (retracted).
一方、成形型55は、アンビル51と同期して降下するため、パンチ5が降下した際に成形型55によって十分な成形荷重で中間成形体W1の成形部15を加圧できるようになっている。
On the other hand, since the molding die 55 descends in synchronization with the anvil 51, when the punch 5 descends, the molding part 15 of the intermediate molded body W1 can be pressurized by the molding die 55 with a sufficient molding load. .
成形型55のフィン成形孔56は、言うまでもなく成形時に金属材料を流入させてピンフィン21を成形するものである。この成形時にノックアウトピン57の先端面(下端面)は、ピンフィン21の先端面を成形する成形面として機能する。従って成形時にはノックアウトピン57は、その下端面が成形型55の下端面に対しピンフィン21の長さの分だけ後退(上昇)した位置に配置されている。またノックアウトピン57は成形直後に図示しない駆動手段によって進出(下降)することによって、ピンフィン21をフィン成形孔56から下方に突き出して離型させるようになっている。
Needless to say, the fin forming hole 56 of the forming die 55 is used for forming the pin fin 21 by flowing a metal material during forming. At the time of molding, the tip surface (lower end surface) of the knockout pin 57 functions as a molding surface for molding the tip surface of the pin fin 21. Therefore, at the time of molding, the knockout pin 57 is disposed at a position where the lower end surface thereof is retracted (raised) by the length of the pin fin 21 with respect to the lower end surface of the molding die 55. Further, the knockout pin 57 is advanced (lowered) by a driving means (not shown) immediately after molding, so that the pin fin 21 protrudes downward from the fin molding hole 56 and is released.
ここで本実施形態においては、成形型55の下面がパンチ5の拘束面として構成されている。
Here, in the present embodiment, the lower surface of the mold 55 is configured as a constraining surface of the punch 5.
なおピンフィン21を背圧鍛造で成形することも可能である。例えばノックアウトピン57をスプリング等の付勢手段によって下方に向けて付勢力を付与しておく。そして成形直前にはノックアウトピン57をその下端面がフィン成形孔56の下端開口位置またはその近傍に配置しておき、成形中には金属材料の流動圧力によってノックアウトピン57を後退(上昇)させつつ、金属材料をフィン成形孔56内に流入させるものである。これによりフィン成形孔56内に流入する金属材料に対し流入方向と反対方向(下方向)に抵抗(背圧)を付与することができ、欠肉等を防止できてピンフィン21を精度良く成形することができる。
It is also possible to form the pin fin 21 by back pressure forging. For example, the knockout pin 57 is biased downward by a biasing means such as a spring. Immediately before molding, the knockout pin 57 has its lower end surface disposed at or near the lower end opening position of the fin molding hole 56, and while molding, the knockout pin 57 is retracted (raised) by the flow pressure of the metal material. The metal material is caused to flow into the fin forming hole 56. As a result, resistance (back pressure) can be applied to the metal material flowing into the fin forming hole 56 in the direction opposite to the inflow direction (downward direction), and the pin fin 21 can be formed with high accuracy by preventing the lack of thickness. be able to.
また抑止型53の下面側における成形型55の外周には、余肉逃がし凹部58が形成されており、成形時に発生する余剰の金属材料が余肉逃がし凹部58内に収容されるようになっている。
Further, a surplus escape portion 58 is formed on the outer periphery of the molding die 55 on the lower surface side of the restraining die 53 so that surplus metal material generated during molding is accommodated in the surplus recess portion 58. Yes.
以上の構成の2次成形用鍛造金型D2を用いて、中間成形体W1に対し2次成形を行って放熱基板W2を得るものである。すなわち図2Aに示すようにパンチ5を上昇させた状態で、ダイス6の拘束凹部60内に1次成形品としての中間成形体W1を投入してセットする。この場合、中間成形体W1の台座11や取付台12はダイス6の台座収容凹部61および取付台収容凹部62にそれぞれ収容しておく。なお中間成形体W1の加熱温度は250℃~600℃とする。さらにパンチ5およびダイス6の温度(型温度)は300℃程度とする。もっともこの2次成形においては熱間鍛造ではなく、冷間鍛造で行うこともできる。
Using the forging die D2 for secondary molding having the above configuration, the intermediate molded body W1 is subjected to secondary molding to obtain the heat dissipation substrate W2. That is, as shown in FIG. 2A, with the punch 5 raised, the intermediate molded product W1 as the primary molded product is put into the constraining recess 60 of the die 6 and set. In this case, the base 11 and the mounting base 12 of the intermediate molded body W1 are respectively stored in the base receiving recess 61 and the mounting base receiving recess 62 of the die 6. The heating temperature of the intermediate molded body W1 is 250 ° C. to 600 ° C. Further, the temperature (die temperature) of the punch 5 and the die 6 is set to about 300 ° C. However, the secondary forming can be performed by cold forging instead of hot forging.
この状態でパンチ5を降下させてダイス6の拘束凹部60内に打ち込む。これにより図2Bに示すようにパンチ5の抑止型53の下面が中間成形体W1の上面側(裏面側)における非成形部16(成形部15以外の部分)に当たって降下が停止し、抑止型53は、降下し続ける成形型55に対し相対的に上昇(後退)する。そしてその上昇に伴ってスプリング7が圧縮されてその反発力によって、抑止型53が中間成形体W1の非成形部16を抑止する。このようにスプリング7の弾性力で抑止型53によって中間成形体W1の非成形部16を抑止するため、成形中において非成形部16に過度な加圧力が加わるのを防止できる。従って非成形部16を塑性変形させずに、安定した状態に位置固定することができる。
In this state, the punch 5 is lowered and driven into the constraining recess 60 of the die 6. 2B, the lower surface of the inhibition mold 53 of the punch 5 hits the non-molded portion 16 (portion other than the molded portion 15) on the upper surface side (back surface side) of the intermediate molded body W1, and the descent stops. Rises (retreats) relative to the mold 55 that continues to descend. And with the rise, the spring 7 is compressed, and the inhibition mold 53 inhibits the non-molded portion 16 of the intermediate molded body W1 by the repulsive force. Thus, since the non-molding part 16 of the intermediate molded body W1 is restrained by the restraining die 53 by the elastic force of the spring 7, it is possible to prevent an excessive pressure from being applied to the non-molding part 16 during molding. Therefore, it is possible to fix the position of the non-molded portion 16 in a stable state without plastic deformation.
一方、パンチ5の成形型55は、アンビル51と共に降下して十分な成形荷重をもって中間成形体W1の成形部15を加圧して成形部15が塑性変形する。これにより成形部15を構成する金属材料が塑性流動して、成形型55のフィン成形孔56に流入してピンフィン21が成形されて、2次成形品としての放熱基板W2が製作される。またこの成形中に成形部15の周辺に発生する余剰の金属材料は余肉逃がし凹部58内に流入して、金型内の材料圧力が極部的に過度に上昇するのが防止される。
On the other hand, the forming die 55 of the punch 5 is lowered together with the anvil 51 and pressurizes the forming portion 15 of the intermediate formed body W1 with a sufficient forming load, so that the forming portion 15 is plastically deformed. As a result, the metal material constituting the molding portion 15 is plastically flowed and flows into the fin molding hole 56 of the molding die 55 to mold the pin fins 21, thereby manufacturing the heat dissipation substrate W <b> 2 as a secondary molded product. Further, during this molding, surplus metal material generated around the molding portion 15 is allowed to escape into the recess 58 and the material pressure in the mold is prevented from excessively rising.
その後、パンチ5を上昇させる。このパンチ上昇時には、パンチ5のノックアウトピン57が進出(降下)してピンフィン21がフィン成形孔56から突き出されるとともに、ダイス6のノックアウトピン66が進出(上昇)して、放熱基板W2が突き上げられてダイス6の拘束凹部60から排出されるようになっている。
After that, the punch 5 is raised. When the punch is raised, the knockout pin 57 of the punch 5 is advanced (lowered) and the pin fin 21 is protruded from the fin forming hole 56, and the knockout pin 66 of the die 6 is advanced (raised), and the heat dissipation substrate W2 is pushed up. And is discharged from the constraining recess 60 of the die 6.
こうして製作された放熱基板W2(鍛造素形材)は、ピンフィン21の外周を取り囲むように余肉壁22が立設されているが、本実施形態においては必要に応じてこの余肉壁22を機械加工等によって切削除去して、放熱基板製品として出荷される。なお本発明においては、余肉壁22の全部または一部を残存させたままの状態で放熱基板を最終製品として構成することも可能である。例えば余肉壁22の一部を冷却液を流す流路壁として利用したり、余肉壁22を他部品を取り付けるための台座として利用することによって、余肉壁22を残存させた放熱基板W2を最終製品として構成することも可能である。
In the heat dissipation substrate W2 (forged raw material) manufactured in this way, the surplus wall 22 is erected so as to surround the outer periphery of the pin fin 21, but in this embodiment, the surplus wall 22 is provided as necessary. It is cut and removed by machining and shipped as a heat dissipation board product. In the present invention, it is also possible to configure the heat dissipation substrate as a final product with all or part of the surplus wall 22 remaining. For example, a part of the surplus wall 22 is used as a flow path wall through which a coolant flows, or the surplus wall 22 is used as a pedestal for mounting other parts, thereby allowing the heat dissipation substrate W2 to leave the surplus wall 22 remaining. Can be configured as a final product.
本実施形態においては、2次成形用鍛造金型D2による2次成形が鍛造工程に相当するものである。さらに2次成形用鍛造金型D2における抑止型53や成形型55等のパンチ5の拘束方向は下方となり、ダイス6の拘束方向は上方となる。
In the present embodiment, secondary forming by the secondary forming forging die D2 corresponds to the forging step. Further, the restraining direction of the punch 5 such as the inhibition die 53 and the forming die 55 in the secondary forging die D2 is downward, and the restraining direction of the die 6 is upward.
以上のように本実施形態の放熱基板の製造方法によれば、ベース1にピンフィン21(ヒートシンク)を一体に形成するものであるため、別体のヒートシンクを熱伝導性が低い接着剤でベースに接着する場合と比較して、放熱性能を向上させることができるとともに、別体のヒートシンクを溶接等の熱処理で取り付ける場合と比較して、熱歪みの発生を抑制できて、高い寸法精度を維持することができる。
As described above, according to the method for manufacturing a heat dissipation board of the present embodiment, the pin fins 21 (heat sinks) are integrally formed on the base 1, so that a separate heat sink is used as a base with an adhesive having low thermal conductivity. Compared to bonding, heat dissipation performance can be improved, and compared to the case where a separate heat sink is attached by heat treatment such as welding, the occurrence of thermal distortion can be suppressed and high dimensional accuracy is maintained. be able to.
また本実施形態においては、緻密な形状のピンフィン21(ヒートシンク)を除いて主要部を成形する全体鍛造(1次成形)と、ヒートシンク部分を成形する部分鍛造(2次成形)とに分けて放熱基板W2を製作するようにしている。そして1次成形によって製作される中間成形体W1は、緻密で複雑な形状のピンフィン(ヒートシンク)を備えておらず、全体的に加工度合いに大きな偏りがなく、ボリュームバランスが良好となっている。このため1次成形において、パンチ荷重を適正に調整できて、中間成形体W1を全体的にバランス良くほぼ均等な圧力で成形できて、高い寸法精度の中間成形体W1を製作することができる。さらに金型内の全域にバランス良く均等な荷重が加わるようになり、金型D1に部分的に過度な荷重が加わるような不具合も防止でき、鍛造金型D1の早期破損を防止できて、金型寿命の向上およびコストの削減を図ることができる。
Further, in the present embodiment, heat radiation is divided into overall forging (primary molding) in which the main part is molded except for the pin fins 21 (heat sink) having a dense shape and partial forging (secondary molding) in which the heat sink part is molded. The substrate W2 is manufactured. The intermediate molded body W1 manufactured by the primary molding does not include a pin fin (heat sink) having a dense and complicated shape, and there is no large deviation in the processing degree as a whole, and the volume balance is good. For this reason, in the primary molding, the punch load can be adjusted appropriately, and the intermediate molded body W1 can be molded with a substantially uniform pressure in a balanced manner as a whole, and the intermediate molded body W1 with high dimensional accuracy can be manufactured. Furthermore, a uniform load with a good balance can be applied to the entire area of the mold, and it is possible to prevent a problem that an excessive load is partially applied to the mold D1, and to prevent early forging of the forged mold D1. The mold life can be improved and the cost can be reduced.
また2次成形において、緻密で複雑な形状のヒートシンクの部分(複数のピンフィン21)のみを部分鍛造によって成形するようにしているため、ピンフィン21を成形できる程度の比較的小さい荷重で成形することができる。このため2次成形時に成形型55のフィン形成用部位等に過度な負荷が加わることがなく、鍛造金型D2の早期破損を防止できて、2次成形用鍛造金型D2においても、上記1次成形用鍛造金型D1と同様に金型寿命の向上およびコストの削減を図ることができる。
Further, in the secondary molding, only the dense and complicated heat sink portion (the plurality of pin fins 21) is molded by partial forging. Therefore, the pin fin 21 can be molded with a relatively small load that can be molded. it can. Therefore, an excessive load is not applied to the fin forming portion of the molding die 55 during the secondary molding, and the early forging die D2 can be prevented from being damaged. Similar to the forging die D1 for the next molding, the die life can be improved and the cost can be reduced.
また本実施形態においては、2次成形用鍛造金型D2の成形型55の外周に余肉逃がし凹部58を形成し、2次成形時に発生する余剰の金属材料を余肉逃がし凹部58内に充填させることにより、部分的に材料圧力が過度に上昇するのを防止することができる。このため成形品(放熱基板W2)におけるベース1やピンフィン21の変形等を防止できて、より一層高品質の放熱基板W2を製作することができる。
In the present embodiment, a surplus escape portion 58 is formed on the outer periphery of the forming die 55 of the forging die D2 for secondary forming, and surplus metal material generated during the secondary forming is filled into the recess portion 58. By doing so, it is possible to prevent the material pressure from partially rising excessively. For this reason, it is possible to prevent deformation of the base 1 and the pin fins 21 in the molded product (heat radiating substrate W2), and it is possible to manufacture a higher quality heat radiating substrate W2.
さらに2次成形用鍛造金型D2においては、スプリング7のバネ力によって抑止型23を介して中間成形体W1の非成形部16を抑止するようにしているため、非成形部16に多大な成形荷重が加わるようなことがなく、ベース1等の非成形部16が変形するのを確実に防止することができる。さらに中間成形体W1の非成形部16を抑止型23によって適度な圧力で抑止できるため、中間成形体W1を安定した状態で金型内に保持でき、2次成形を精度良く行うことができる。
Further, in the forging die D2 for secondary molding, the non-molded portion 16 of the intermediate molded body W1 is restrained by the spring force of the spring 7 through the restraint die 23. It is possible to reliably prevent deformation of the non-molded portion 16 such as the base 1 without applying a load. Furthermore, since the non-molded portion 16 of the intermediate molded body W1 can be restrained with an appropriate pressure by the restraining die 23, the intermediate molded body W1 can be held in a stable state and secondary molding can be performed with high accuracy.
また2次成形の成形素材としての中間成形体W1の成形部15を隆起させて厚肉に形成しているため、成形部15を加圧してフィン21を成形する際に、フィン成形用の金属材料を十分に確保できて、フィン21を確実に形成することができる。
Further, since the molding part 15 of the intermediate molded body W1 as a molding material for secondary molding is raised and formed thick, when the fin 21 is molded by pressurizing the molding part 15, the metal for fin molding Sufficient material can be secured and the fins 21 can be reliably formed.
また本実施形態においては、1次成形および2次成形を一連の鍛造加工によって行っているため、放熱基板W2を効率良く製造することができる。
Further, in the present embodiment, since the primary molding and the secondary molding are performed by a series of forging processes, the heat dissipation substrate W2 can be efficiently manufactured.
なお上記実施形態においては、2次成形に供される中間成形体W1を鍛造によって成形するようにしているが、中間成形体W1は必ずしも鍛造によって成形する必要はない。本発明においては、中間成形体W1をどのような成形品によって形成してもよく、例えばダイカストの成形品によって製作するようにしても良い。
In the above embodiment, the intermediate formed body W1 subjected to secondary forming is formed by forging. However, the intermediate formed body W1 is not necessarily formed by forging. In the present invention, the intermediate molded body W1 may be formed of any molded product, for example, a die-cast molded product.
また上記実施形態においては、2次成形用鍛造金型D2のパンチ5に形成される余肉逃がし凹部58を、抑止型53に形成する場合を例に挙げて説明したが、それだけに限られず、本発明においては余肉逃がし凹部58を成形型55の外周に形成するようにしても良い。例えば図5に示すように、成形型55の外周に凹段部を形成して、その凹段部によって余肉逃がし凹部58を構成するようにしても良い。もっとも動作信頼性の観点からは、図2Aおよび図2Bに示す上記実施形態の金型D2のように抑止型53の内周に余肉逃がし凹部58を形成するのが好ましい。すなわち図5に示すように成形時に余肉逃がし凹部58に流入する金属材料Mは、余肉逃がし凹部58の外側から優先的に充満してくるため、同図の変形例のように成形型55に余肉逃がし凹部58を形成しておくと、成形型55の外周面における抑止型53との隙間Sに金属材料が侵入し易く、その隙間Sにバリが発生し易くなってしまう。そうするとそのバリの影響によって、抑止型53の成形型55に対する摺動動作が阻害されて、摺動不良(動作不良)が発生するおそれがある。このため図2Aおよび図2Bの実施形態に示すように、余肉逃がし凹部58は、抑止型53の内周に形成するのが好ましい。
Moreover, in the said embodiment, although the case where the surplus relief part 58 formed in the punch 5 of the forging die D2 for secondary forming was formed in the suppression die 53 was described as an example, the present invention is not limited to this. In the present invention, the excess relief portion 58 may be formed on the outer periphery of the mold 55. For example, as shown in FIG. 5, a concave step portion may be formed on the outer periphery of the molding die 55, and the extra thickness relief recess portion 58 may be configured by the concave step portion. Of course, from the viewpoint of operational reliability, it is preferable to form a surplus escape portion 58 on the inner periphery of the inhibition die 53 as in the mold D2 of the above embodiment shown in FIGS. 2A and 2B. That is, as shown in FIG. 5, the metal material M flowing into the surplus escape recess 58 at the time of molding is preferentially filled from the outside of the surplus escape recess 58. In addition, if the excess thickness relief recess 58 is formed, the metal material is likely to enter the gap S between the outer peripheral surface of the molding die 55 and the suppression mold 53, and burrs are likely to occur in the gap S. Then, due to the influence of the burr, the sliding operation of the suppression mold 53 with respect to the molding die 55 may be hindered, and a sliding failure (operation failure) may occur. For this reason, as shown in the embodiment of FIG. 2A and FIG. 2B, it is preferable to form the excess thickness relief recess 58 on the inner periphery of the suppression die 53.
また上記実施形態においては、中間成形体W1の成形部15を肉盛りして上方に隆起させるようにしているが、中間成形体W1の成形部15を必ずしも厚肉に形成する必要はない。例えば図6Aに示すように中間成形体W1の成形部15を他の領域と面一となるように平坦に形成することもできる。この場合には図6Bに示すように、2次成形によってパンチ5を打ち込んだ際に、成形型55の先端面(下端面)が放熱基板W2におけるベース1の上面よりも下方に配置されて、放熱基板W2におけるフィン21の下端位置(付け根位置)がベース1の上面よりも下方に配置されることになる。このような形状であっても、設計変更等で適宜対応することによって、放熱基板製品として難なく使用することができる。
In the above embodiment, the molded part 15 of the intermediate molded body W1 is built up and raised upward, but the molded part 15 of the intermediate molded body W1 does not necessarily need to be formed thick. For example, as shown in FIG. 6A, the molded portion 15 of the intermediate molded body W1 can be formed flat so as to be flush with other regions. In this case, as shown in FIG. 6B, when the punch 5 is driven by secondary molding, the tip surface (lower end surface) of the molding die 55 is disposed below the upper surface of the base 1 in the heat dissipation substrate W2, The lower end position (base position) of the fin 21 on the heat radiating substrate W <b> 2 is disposed below the upper surface of the base 1. Even if it is such a shape, it can be used without difficulty as a heat dissipation board product by appropriately dealing with a design change or the like.
また上記実施形態においては、放熱基板W2のヒートシンク(放熱部)2にピンフィン21を形成するようにしているが、本発明においてはフィン21の形状は特に限定されるものではない。例えば本発明においては図7Aおよび図7Bに示すように放熱基板W2の放熱部2に板状ないし羽根状のプレートフィン21を複数並列に形成するようにしても良い。
In the above embodiment, the pin fins 21 are formed on the heat sink (heat radiating portion) 2 of the heat radiating substrate W2, but the shape of the fins 21 is not particularly limited in the present invention. For example, in the present invention, as shown in FIGS. 7A and 7B, a plurality of plate-like or blade-like plate fins 21 may be formed in parallel on the heat radiation portion 2 of the heat radiation substrate W2.
また上記実施形態においては、1次成形および2次成形として、バリがほとんど生じない密閉鍛造を用いる場合を例に挙げて説明したが、それだけに限られず、本発明においては、1次成形および/または2次成形として、半密閉鍛造や非密閉鍛造等のバリ出し鍛造を用いるようにしても良い。
In the above-described embodiment, the case where the closed forging that hardly generates burrs is used as an example of the primary molding and the secondary molding has been described as an example. However, the present invention is not limited thereto, and in the present invention, primary molding and / or As secondary forming, burr out forging such as semi-sealing forging or non-sealing forging may be used.
また上記実施形態では2次成形において、中間成形体W1の非成形部16の全域を金型によって抑止するようにしているが、それだけに限られず、本発明においては、2次成形時に非成形部16の一部のみを抑止して、非成形部16の残りの部分を抑止せずに開放した状態に設定するようにしても良い。さらに中間成形体Wの非成形部16を抑止するに際して、必ずしも非成形部16を抑止型等の金型で抑止する必要はなく、金型とは別の抑止用治具を用いて抑止するようにしても良い。この場合、当該抑止用治具によって抑止手段が構成される。
In the above embodiment, in the secondary molding, the entire region of the non-molded portion 16 of the intermediate molded body W1 is suppressed by the mold. However, the present invention is not limited to this, and in the present invention, the non-molded portion 16 is subjected to the secondary molding. Only a part of the non-molded part 16 may be suppressed and the remaining part of the non-molded part 16 may be set in an open state without being suppressed. Further, when suppressing the non-molded portion 16 of the intermediate molded body W, it is not always necessary to suppress the non-molded portion 16 with a mold such as a depressing mold, and it should be suppressed using a depressing jig different from the mold. Anyway. In this case, the suppression means is constituted by the suppression jig.
また上記実施形態では2次成形において、後方押し出しによってフィン21を形成するようにしているが、それだけに限られず、本発明においてはダイス(下金型)側にフィン成形孔を形成しておいて、前方押し出しによってフィンを形成するようにしても良い。
In the above embodiment, the fins 21 are formed by rearward extrusion in the secondary molding. However, the present invention is not limited to this, and in the present invention, fin forming holes are formed on the die (lower mold) side. The fins may be formed by forward extrusion.
さらに上記実施形態においては、放熱基板W2の裏面側にフィン21を形成するようにしているが、それだけに限られず、本発明においては放熱基板の表面側にフィンを形成しても良いし、表面側および裏面側の双方にフィンを形成するようにしても良い。
Furthermore, in the said embodiment, although the fin 21 is formed in the back surface side of the thermal radiation board | substrate W2, it is not restricted to it, In this invention, you may form a fin in the surface side of a thermal radiation board | substrate, In addition, fins may be formed on both the back side and the back side.
また本発明において、上記実施形態のように、中間成形体W1を型鍛造によって製造するような場合には、1次成形と2次成形とを一つ(1台)の鍛造装置で行っても良いし、別々の金型装置で行っても良い。すなわち1次成形用鍛造金型と2次成形用鍛造金型との2つ以上の金型ステージを備え、かつ両金型のパンチを一つのプレス機構によって昇降させるようにした1次および2次成形連続型の金型装置を用いても良いし、1次成形用鍛造金型と2次成形用鍛造金型とが独立し、かつ別々のプレス機構によって各パンチをそれぞれ昇降させるようにした2台の鍛造装置を用いて、1次成形と2次成形とを別々に行うようにしても良い。
In the present invention, when the intermediate formed body W1 is manufactured by die forging as in the above embodiment, the primary forming and the secondary forming may be performed by one (one) forging device. It is good, and it may be performed by a separate mold apparatus. That is, the primary and secondary which are provided with two or more mold stages of a primary forging mold and a secondary forging mold, and the punches of both molds are moved up and down by one press mechanism. A continuous molding die device may be used, the forging die for primary molding and the forging die for secondary molding are independent, and each punch is moved up and down by separate press mechanisms. The primary forming and the secondary forming may be performed separately by using a table forging device.
本願は、2015年8月26日付で出願された日本国特許出願の特願2015-166443号の優先権主張を伴うものであり、その開示内容は、そのまま本願の一部を構成するものである。
This application is accompanied by the priority claim of Japanese Patent Application No. 2015-166443 filed on August 26, 2015, the disclosure of which constitutes part of the present application as it is. .
ここに用いられた用語及び表現は、説明のために用いられたものであって限定的に解釈するために用いられたものではなく、ここに示され且つ述べられた特徴事項の如何なる均等物をも排除するものではなく、この発明のクレームされた範囲内における各種変形をも許容するものであると認識されなければならない。
The terms and expressions used herein are for illustrative purposes and are not to be construed as limiting, but represent any equivalent of the features shown and described herein. It should be recognized that various modifications within the claimed scope of the present invention are permissible.
本発明は、多くの異なった形態で具現化され得るものであるが、この開示は本発明の原理の実施例を提供するものと見なされるべきであって、それら実施例は、本発明をここに記載しかつ/または図示した好ましい実施形態に限定することを意図するものではないという了解のもとで、多くの図示実施形態がここに記載されている。
While this invention may be embodied in many different forms, this disclosure is to be considered as providing examples of the principles of the invention, which examples are hereby incorporated by reference. Many illustrated embodiments are described herein with the understanding that they are not intended to be limited to the preferred embodiments described and / or illustrated.
本発明の図示実施形態を幾つかここに記載したが、本発明は、ここに記載した各種の好ましい実施形態に限定されるものではなく、この開示に基づいていわゆる当業者によって認識され得る、均等な要素、修正、削除、組み合わせ(例えば、各種実施形態に跨る特徴の組み合わせ)、改良及び/又は変更を有するありとあらゆる実施形態をも包含するものである。クレームの限定事項はそのクレームで用いられた用語に基づいて広く解釈されるべきであり、本明細書あるいは本願のプロセキューション中に記載された実施例に限定されるべきではなく、そのような実施例は非排他的であると解釈されるべきである。本発明をここに記載しかつ/または図示した好ましい実施形態に限定することを意図するものではないという了解のもとで、多くの図示実施形態がここに記載されている。
Although several illustrated embodiments of the present invention have been described herein, the present invention is not limited to the various preferred embodiments described herein, and is equivalent to what may be recognized by those skilled in the art based on this disclosure. Any and all embodiments having various elements, modifications, deletions, combinations (eg, combinations of features across the various embodiments), improvements and / or changes are encompassed. Claim limitations should be construed broadly based on the terms used in the claims, and should not be limited to the embodiments described herein or in the process of this application, as such The examples should be construed as non-exclusive. Numerous illustrated embodiments are described herein with the understanding that the invention is not intended to be limited to the preferred embodiments described and / or illustrated herein.
本発明の図示実施形態を幾つかここに記載したが、本発明は、ここに記載した各種の好ましい実施形態に限定されるものではなく、この開示に基づいていわゆる当業者によって認識され得る、均等な要素、修正、削除、組み合わせ(例えば、各種実施形態に跨る特徴の組み合わせ)、改良及び/又は変更を有するありとあらゆる実施形態をも包含するものである。クレームの限定事項はそのクレームで用いられた用語に基づいて広く解釈されるべきであり、本明細書あるいは本願のプロセキューション中に記載された実施例に限定されるべきではなく、そのような実施例は非排他的であると解釈されるべきである。
Although several illustrated embodiments of the present invention have been described herein, the present invention is not limited to the various preferred embodiments described herein, and is equivalent to what may be recognized by those skilled in the art based on this disclosure. Any and all embodiments having various elements, modifications, deletions, combinations (eg, combinations of features across the various embodiments), improvements and / or changes are encompassed. Claim limitations should be construed broadly based on the terms used in the claims, and should not be limited to the embodiments described herein or in the process of this application, as such The examples should be construed as non-exclusive.
本発明の放熱基板の製造方法は、ハイブリッド車や電気自動車の駆動を制御するためのパワーコントロールユニットの放熱基板や、熱交換器用パネルの放熱基板等を製造する際に好適に用いることができる。
The method for manufacturing a heat dissipation board of the present invention can be suitably used when manufacturing a heat dissipation board for a power control unit for controlling driving of a hybrid vehicle or an electric vehicle, a heat dissipation board for a heat exchanger panel, and the like.
1:ベース
15:変形部
16:非変形部
2:放熱部
21:ピンフィン(プレートフィン)
22:余肉壁
5:パンチ
53:抑止型
55:成形型
56:フィン成形孔
58:余肉逃がし凹部
6:ダイス
7:スプリング(抑止力付与手段)
D2:2次成形用鍛造金型
M:金属材料
W1:中間成形体(成形素材)
W2:放熱基板 1: Base 15: Deformation part 16: Non-deformation part 2: Heat radiation part 21: Pin fin (plate fin)
22: surplus wall 5: punch 53: deterring die 55: mold 56: fin forming hole 58: surplus escaping recess 6: die 7: spring (suppressing force applying means)
D2: Forging die for secondary molding M: Metal material W1: Intermediate molded body (molding material)
W2: Heat dissipation board
15:変形部
16:非変形部
2:放熱部
21:ピンフィン(プレートフィン)
22:余肉壁
5:パンチ
53:抑止型
55:成形型
56:フィン成形孔
58:余肉逃がし凹部
6:ダイス
7:スプリング(抑止力付与手段)
D2:2次成形用鍛造金型
M:金属材料
W1:中間成形体(成形素材)
W2:放熱基板 1: Base 15: Deformation part 16: Non-deformation part 2: Heat radiation part 21: Pin fin (plate fin)
22: surplus wall 5: punch 53: deterring die 55: mold 56: fin forming hole 58: surplus escaping recess 6: die 7: spring (suppressing force applying means)
D2: Forging die for secondary molding M: Metal material W1: Intermediate molded body (molding material)
W2: Heat dissipation board
Claims (12)
- 表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板の製造方法であって、
前記放熱基板の成形素材として、前記放熱部に対応して成形部が設けられ、かつ前記放熱部以外の部分に対応して非成形部が設けられた中間成形体を準備する素材準備工程と、
前記中間成形体における前記成形部に前記フィンを成形する鍛造工程とを含み、
前記鍛造工程においては、前記非成形部を変形させずに抑止しつつ、型鍛造によって前記成形部を塑性変形させて前記フィンを形成するようにしたことを特徴とする放熱基板の製造方法。 Manufacture of a heat dissipation board comprising a base in which at least one of the front and back surfaces is partially provided with a heat dissipation portion, and a plurality of fins that are integrally formed with the heat dissipation portion of the base and are erected with respect to the base A method,
As a forming material of the heat dissipation substrate, a material preparation step of preparing an intermediate molded body provided with a molding portion corresponding to the heat dissipation portion and provided with a non-molding portion corresponding to a portion other than the heat dissipation portion;
Including a forging step of forming the fin in the forming portion of the intermediate formed body,
In the forging step, the fin is formed by plastically deforming the molded part by die forging while suppressing the non-molded part without being deformed. - 前記中間成形体における前記成形部の厚みが前記非成形部の厚みよりも厚く形成されている請求項1に記載の放熱基板の製造方法。 The method for manufacturing a heat dissipation substrate according to claim 1, wherein a thickness of the molded portion in the intermediate molded body is formed to be thicker than a thickness of the non-molded portion.
- 前記鍛造工程において用いられる鍛造金型は、ダイスと、パンチとを備え、
前記パンチの拘束面に前記フィンを成形するためのフィン成形孔が設けられ、
前記ダイスに設置した前記中間成形体に前記パンチを打ち込んだ際に、前記成形部を構成する金属材料を前記フィン成形孔内に流入させる後方押し出しによって前記フィンを形成するようにした請求項1または2に記載の放熱基板の製造方法。 The forging die used in the forging step includes a die and a punch,
A fin forming hole for forming the fin on the restraining surface of the punch is provided,
2. The fin is formed by backward extrusion that causes a metal material constituting the forming portion to flow into the fin forming hole when the punch is driven into the intermediate formed body placed on the die. The manufacturing method of the thermal radiation board of 2. - 前記鍛造工程において用いられる鍛造金型は、前記成形部に対応して設けられた成形型と、前記非成形部に対応して設けられた抑止型とを備え、
前記鍛造工程において、前記抑止型によって前記非成形部を抑止しつつ、前記成形型によって前記成形部に前記フィンを成形するようにした請求項1~3のいずれか1項に記載の放熱基板の製造方法。 The forging die used in the forging step includes a molding die provided corresponding to the molding part, and a suppression die provided corresponding to the non-molding part,
The heat dissipation substrate according to any one of claims 1 to 3, wherein, in the forging step, the fin is formed on the molded portion by the molding die while the non-formed portion is suppressed by the suppression die. Production method. - 前記抑止型は、前記成形型に対し拘束方向と反対方向に相対的に後退可能に構成されるとともに、
前記鍛造金型は、前記抑止型を拘束方向に抑止力を付与する抑止力付与手段を備え、
前記鍛造工程において、前記抑止力付与手段の抑止力によって前記抑止型を介して前記非成形部を抑止するようにした請求項4に記載の放熱基板の製造方法。 The inhibition mold is configured to be relatively retractable in a direction opposite to the constraint direction with respect to the molding mold,
The forging die includes deterring force applying means for applying a deterring force in the restraining direction of the deterring die,
The method of manufacturing a heat dissipation substrate according to claim 4, wherein, in the forging step, the non-molded portion is inhibited via the inhibition die by the inhibition force of the inhibition force applying means. - 前記鍛造工程において用いられる鍛造金型は、前記成形部に対応して設けられた成形型を備え、
前記成形型の外周に余肉逃がし凹部が設けられ、
前記鍛造工程において生じる余剰の金属材料を前記余肉逃がし凹部に流入させるようにしたことを請求項1~5のいずれか1項に記載の放熱基板の製造方法。 The forging die used in the forging step includes a molding die provided corresponding to the molding part,
The outer periphery of the mold is provided with a surplus escape recess,
6. The method of manufacturing a heat dissipation board according to claim 1, wherein surplus metal material generated in the forging process is allowed to flow into the recess escape recess. - 前記素材準備工程において、鍛造加工によって前記中間成形体を製作するようにした請求項1~6のいずれか1項に記載の放熱基板の製造方法。 The method for manufacturing a heat dissipation substrate according to any one of claims 1 to 6, wherein, in the material preparation step, the intermediate molded body is manufactured by forging.
- 表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板を成形するための鍛造金型であって、
前記放熱基板の前記放熱部に対応して設けられ、かつ前記フィンを成形するための成形型と、
前記放熱基板の前記放熱部以外の部分に対応して設けられ、かつ前記放熱部以外の部分を抑止するための抑止手段とを備えたことを特徴とする鍛造金型。 Forming a heat dissipating board comprising a base partially provided with a heat dissipating part on at least one of the front and back surfaces, and a plurality of fins integrally formed on the heat dissipating part of the base and standing on the base A forging die for
A mold for forming the fins, which is provided corresponding to the heat dissipation portion of the heat dissipation substrate;
A forging die provided with a suppressing means provided to correspond to a portion other than the heat radiating portion of the heat radiating substrate and for suppressing a portion other than the heat radiating portion. - 前記抑止手段は、
前記成形型に対し拘束方向と反対方向に相対的に後退可能に構成された抑止型と、
前記抑止型に拘束方向に抑止力を付与するための抑止力付与手段とを備える請求項8に記載の鍛造金型。 The deterring means is
A deterrent mold configured to be relatively retractable in a direction opposite to the constraint direction with respect to the mold;
The forging die according to claim 8, further comprising deterrence applying means for applying a deterring force in the restraining direction to the deterring die. - ダイスと、パンチとを備え、
前記パンチに前記成形型および前記抑止型が設けられている請求項8または9に記載の鍛造金型。 With dies and punches,
The forging die according to claim 8 or 9, wherein the punch is provided with the forming die and the restraining die. - 前記成形型の外周に余肉逃がし凹部が設けられている請求項8~10に記載の鍛造金型。 The forging die according to any one of claims 8 to 10, wherein a surplus escape recess is provided on an outer periphery of the molding die.
- 表裏面の少なくともいずれか一方に部分的に放熱部が設けられたベースと、そのベースの放熱部に一体に形成され、かつ前記ベースに対し立設する複数のフィンとを備えた放熱基板であって、
前記放熱部の外周に沿って余肉壁が前記ベースに一体に立設されていることを特徴とする放熱基板。
A heat dissipating board comprising a base partially provided with a heat dissipating part on at least one of the front and back surfaces, and a plurality of fins that are integrally formed with the heat dissipating part of the base and are erected with respect to the base. And
A heat dissipation board, wherein a surplus wall is integrally provided on the base along the outer periphery of the heat dissipation portion.
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