JP5656163B2 - Embossed metal plate and manufacturing method thereof - Google Patents
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- JP5656163B2 JP5656163B2 JP2010139892A JP2010139892A JP5656163B2 JP 5656163 B2 JP5656163 B2 JP 5656163B2 JP 2010139892 A JP2010139892 A JP 2010139892A JP 2010139892 A JP2010139892 A JP 2010139892A JP 5656163 B2 JP5656163 B2 JP 5656163B2
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本発明は、放熱性に優れ製造の容易なエンボス金属板及びその製造方法に関する。 The present invention relates to an embossed metal plate having excellent heat dissipation and easy manufacture, and a method for manufacturing the same.
大規模集積回路（ＬＳＩ）やＩＣ、トランジスタなどの電子機器は動作により発熱するため、効率的に放熱する必要があり、近年ではそれらの半導体部品の小型化に伴ってより効率的な放熱の必要性が高まっている。 Electronic devices such as large-scale integrated circuits (LSIs), ICs, and transistors generate heat due to their operation, so they need to dissipate heat efficiently. In recent years, more efficient heat dissipation is required with the miniaturization of these semiconductor components. The nature is increasing.
上記のような半導体部品の放熱については、部品本体に放熱機構を設けるだけでは不十分で、より大面積の放熱装置に接続して冷却する必要がある。 For heat dissipation of the semiconductor component as described above, it is not sufficient to provide a heat dissipation mechanism in the component main body, and it is necessary to connect and cool the heat dissipation device with a larger area.
このような放熱装置の最も一般的なものはモールド成型品であるが、多数の凹凸のある成形型に素材を注入すると、特にその凹凸が小さい場合離型が困難であるという問題点があった。 The most common type of such a heat dissipation device is a molded product. However, when a material is injected into a mold having a large number of irregularities, there is a problem that release is difficult particularly when the irregularities are small. .
また、金属材料に高圧力をかけて押出成形による凹凸形成を行う方法も知られているが、素材金属表面全体に圧力をかけなければならないため非常に高い圧力が必要であり、製造コストが高くなってしまうという問題点があった。 In addition, there is a known method of forming irregularities by extrusion by applying a high pressure to a metal material. However, since the pressure must be applied to the entire surface of the metal material, a very high pressure is required and the manufacturing cost is high. There was a problem of becoming.
このような問題点を解決するため、特許文献１や特許文献２に開示されているように、金属板の片面をパンチなどの工具により押圧し金属板の反対側表面に突起を形成する方法が提案されている。これらの方法では、金属板に対してパンチを圧入することにより突起を形成するため、金属板のパンチ圧入側表面には凹部が形成されることになる。このような放熱装置を上記のような半導体部品に使用した場合、凹部により部品と放熱装置との接触面積が減少し、また凹部内の空気は熱伝導率が低いため全体として放熱効率が低くなってしまうという問題点がある。 In order to solve such problems, as disclosed in Patent Document 1 and Patent Document 2, there is a method in which one side of a metal plate is pressed by a tool such as a punch to form a protrusion on the opposite surface of the metal plate. Proposed. In these methods, since the protrusion is formed by press-fitting a punch into the metal plate, a recess is formed on the surface of the metal plate on the punch press-fitting side. When such a heat dissipation device is used for a semiconductor component as described above, the contact area between the component and the heat dissipation device is reduced by the recess, and the heat dissipation efficiency of the air in the recess is low as a whole because the heat conductivity is low. There is a problem that.
本発明は上述のような従来技術の問題点に鑑みてなされたものであり、小型でも放熱効率が良いエンボス金属板及びその効果的な製造方法を提供することを課題とする。 The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide an embossed metal plate that is small in size and has good heat dissipation efficiency and an effective manufacturing method thereof.
上記課題を解決するため本発明によるエンボス金属板は、片側表面に複数の突起を有する金属板において、前記突起が形成された位置に対応した前記金属板の裏面側における部位に種金属塊が圧入されていることを特徴とする。 In order to solve the above problems, an embossed metal plate according to the present invention is a metal plate having a plurality of protrusions on one surface, and a seed metal mass is press-fitted into a portion on the back surface side of the metal plate corresponding to the position where the protrusions are formed. It is characterized by being.
前記突起の体積は、前記種金属塊の体積とほぼ同じであることが好適であり、前記種金属塊の高さは前記金属板の厚さ未満であることがより好都合である。また、前記種金属塊の硬度は前記金属板の硬度より高いことが好ましい。 It is preferable that the volume of the protrusion is substantially the same as the volume of the seed metal mass, and it is more convenient that the height of the seed metal mass is less than the thickness of the metal plate. Further, the hardness of the seed metal lump is preferably higher than the hardness of the metal plate.
前記種金属塊は、前記金属板と同種金属であっても、また異種金属であってもよい。ただし、同種金属を使用する場合は、加工硬化などにより金属板より硬度を高くすることが望ましい。 The seed metal mass may be the same metal as the metal plate or a different metal. However, when using the same kind of metal, it is desirable to make the hardness higher than that of the metal plate by work hardening or the like.
本発明によるエンボス金属板の製造方法としては、金属板の片側より複数の種金属塊を圧入し、圧入した前記各種金属塊を前記金属板内に残存させ、前記金属板の反対側表面には、前記圧入した前記各種金属塊によって複数の突起を形成することを特徴とする。 As a method for producing an embossed metal plate according to the present invention, a plurality of seed metal masses are press-fitted from one side of the metal plate, the various metal masses that have been press-fitted are left in the metal plate, A plurality of protrusions are formed by the press-fitted various metal lumps .
上記の製造方法では、複数の凹部を有する下型上に前記金属板を配置し、複数の貫通孔内に前記貫通孔の内径に沿った外形を有する前記種金属塊を収納した上型を前記金属板の上に載せ、前記貫通孔内を摺動可能に配置した押圧棒を前記貫通孔に沿って押し下げることにより前記種金属塊を前記金属板内に圧入して前記金属板の反対側表面に複数の突起を形成することが好適である。 In the above manufacturing method, the metal plate is disposed on a lower mold having a plurality of recesses, and the upper mold in which the seed metal mass having an outer shape along the inner diameter of the through hole is accommodated in the plurality of through holes is The seed metal lump is press-fitted into the metal plate by pressing down a pressing rod placed on the metal plate and slidably disposed in the through hole along the through hole, and the opposite surface of the metal plate It is preferable to form a plurality of protrusions on the surface.
また、前記種金属塊を直接圧入することが困難な場合は、金属板状の圧入予定箇所を予め半抜きするなどして凹部を形成しておくこともできる。さらに、複数の前記種金属塊を前もって一定形状に形成しておくことがより好都合である。 Further, when it is difficult to press-fit the seed metal lump directly, a concave portion can be formed by previously half-cutting a metal plate-like press-fitted portion. Furthermore, it is more convenient to form a plurality of the seed metal masses in a predetermined shape in advance.
本発明によるエンボス金属板では、種金属塊を圧入することにより金属板表面に突起を形成するため、種金属塊圧入側表面に凹部が形成されることなく平坦となるため、発熱部品との接触面積を最大限にすることができ、放熱効率を高めることが可能となる。 In the embossed metal plate according to the present invention, since the protrusion is formed on the surface of the metal plate by press-fitting the seed metal lump, the surface is flat without forming a concave portion on the surface of the seed metal lump press-fitting, so that it is in contact with the heat-generating component. The area can be maximized and the heat dissipation efficiency can be increased.
また、本発明によるエンボス金属板の製造方法においては、金属板に種金属塊を圧入するため、金属板全体を押圧して突起を形成する方法に比べて圧力を低くすることが可能であり、それにより製造コストを低減できる。 Moreover, in the method for producing an embossed metal plate according to the present invention, since the seed metal lump is press-fitted into the metal plate, it is possible to reduce the pressure as compared with a method of pressing the entire metal plate to form a protrusion, Thereby, the manufacturing cost can be reduced.
［実施例］
以下、図面に基づいて本発明の好適な実施例を説明する。図１は本発明によるエンボス金属板の片側表面を示す図であり、金属基板１内に複数の種金属塊２が収納されている。この金属基板１の反対側表面を示したのが図２である。こちら側表面には、複数の突起３が整然と形成されている。
[Example]
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a view showing one side surface of an embossed metal plate according to the present invention, and a plurality of seed metal masses 2 are accommodated in a metal substrate 1. FIG. 2 shows the opposite surface of the metal substrate 1. A plurality of protrusions 3 are formed in an orderly manner on the surface on this side.
図３には、上記実施例の部分断面図を示す。各種金属塊２が各突起３の上部、金属基板１内に配置されている。種金属塊２が金属基板１内に圧入され、その体積分が突起３として反対側表面に突出することになる。各突起３の強度を確保するためには、種金属塊２の高さは金属基板１の厚さ未満であることが望ましい。 FIG. 3 shows a partial cross-sectional view of the above embodiment. Various metal lumps 2 are arranged in the metal substrate 1 above the protrusions 3 . The seed metal mass 2 is press-fitted into the metal substrate 1, and the volume of the seed metal mass 2 projects as a protrusion 3 on the opposite surface. In order to ensure the strength of each protrusion 3 , it is desirable that the height of the seed metal mass 2 is less than the thickness of the metal substrate 1.
次に、上記実施例のエンボス金属板を製造する方法について説明する。その工程を図４の（ａ）、（ｂ）及び（ｃ）に示した。まず、（ａ）工程についてであるが、下型１５には厚さ方向に複数の貫通孔１６が形成されており、各貫通孔１６内部に突起受け治具１７が挿入されている。素材としてのアルミニウム金属基板１をこの下型１５上に配置する。このアルミニウム金属基板１の硬度はＨＶ４０〜７０程度である。この金属基板１の上部には中型１３を配置する。中型１３には、やはり厚さ方向に下型１５の各貫通孔１６に対応する位置に貫通孔１４が形成されていて、各貫通孔１４内に種金属塊２を収納する。ここで使用する種金属塊２としては、直径１．２ｍｍ、高さ２ｍｍの円柱状アルミニウムを使用する。この種金属塊２は金属基板１と同種金属であるが、円柱状に加工してあるため、硬度が若干硬くなっている。中型１３のさらに上部には上型１１を配置し、この上型１１には複数プランジャー１２が固定されており、この各プランジャー１２を中型１３の各貫通孔１４内の種金属塊２の上部に挿入しておく。 Next, a method for producing the embossed metal plate of the above embodiment will be described. The process is shown in FIGS. 4 (a), (b) and (c). First, regarding step (a), a plurality of through holes 16 are formed in the lower mold 15 in the thickness direction, and a projection receiving jig 17 is inserted into each through hole 16. An aluminum metal substrate 1 as a material is disposed on the lower mold 15. The hardness of the aluminum metal substrate 1 is about HV 40 to 70. A middle die 13 is disposed on the metal substrate 1. A through hole 14 is also formed in the middle mold 13 at a position corresponding to each through hole 16 of the lower mold 15 in the thickness direction, and the seed metal mass 2 is accommodated in each through hole 14. As the seed metal lump 2 used here, cylindrical aluminum having a diameter of 1.2 mm and a height of 2 mm is used. Although this seed metal lump 2 is the same kind of metal as the metal substrate 1, since it is processed into a columnar shape, the hardness is slightly increased. An upper die 11 is disposed further above the middle die 13, and a plurality of plungers 12 are fixed to the upper die 11, and each plunger 12 is connected to the seed metal mass 2 in each through hole 14 of the middle die 13. Insert it at the top.
次に図４の（ｂ）工程についてであるが、上型１１を下方に押し下げると、プランジャー１２が中型１３の貫通孔１４に沿って種金属塊２を押し下げ、金属基板１内に圧入する。圧入圧力としては、種金属塊２の１個当り１２０ｋｇ以上が必要である。種金属塊２を圧入することにより、中型１３と下型１５で上下を規制されている金属基板１は、下型１５の貫通孔１６内に侵入して突起受け治具１７を押し下げる。この動作により複数の突起３が貫通孔１６内に形成される。 Next, as for step (b) in FIG. 4, when the upper die 11 is pushed down, the plunger 12 pushes down the seed metal mass 2 along the through hole 14 of the middle die 13 and press-fits into the metal substrate 1. . As the press-fitting pressure, 120 kg or more per seed metal lump 2 is required. By press-fitting the seed metal mass 2, the metal substrate 1 that is vertically regulated by the middle mold 13 and the lower mold 15 enters the through-hole 16 of the lower mold 15 and pushes down the protrusion receiving jig 17. By this operation, a plurality of protrusions 3 are formed in the through hole 16.
最後に（ｃ）工程であるが、上型１１と中型１３を上方に退避させてから、突起受け治具１７を押し上げることにより、突起３が貫通孔１６より上部に解放され、エンボス金属基板を取り出すことができる。 Finally, in step (c), the upper die 11 and the middle die 13 are retracted upward, and then the protrusion receiving jig 17 is pushed up, so that the protrusion 3 is released above the through hole 16 and the embossed metal substrate is removed. It can be taken out.
上記実施例においては素材の金属基板１と種金属塊２とで同じアルミニウム素材を使用したが、他の金属を使用することももちろん可能であり、また、素材の金属基板１と種金属塊２とで異なる素材を用いることも可能である。また、種金属塊２の形状は円柱としたが、角柱や錐形状など、他の形状を用いることも可能である。 In the above embodiment, the same aluminum material is used for the metal substrate 1 and the seed metal lump 2, but it is of course possible to use other metals, and the material metal substrate 1 and the seed metal lump 2 are used. It is also possible to use different materials. Moreover, although the shape of the seed metal lump 2 is a cylinder, other shapes such as a prism or a cone can be used.
以上述べたように、本発明によるエンボス金属板によれば、種金属塊を圧入することにより金属板表面に突起を形成するため、種金属塊圧入側表面に凹部が形成されることなく平坦となるため、発熱部品との接触面積を最大限にすることができ、放熱効率を高めることが可能となる。また、本発明によるエンボス金属板の製造方法においては、金属板に種金属塊を圧入するため、金属板全体を押圧して突起を形成する方法に比べて圧力を低くすることが可能であり、それにより製造コストを低減できる。従って、放熱装置などの分野において大いに貢献できるものである。 As described above, according to the embossed metal plate according to the present invention, since the projection is formed on the surface of the metal plate by press-fitting the seed metal lump, the surface is flat without forming a recess on the surface of the seed metal lump press-fitting side. Therefore, the contact area with the heat generating component can be maximized, and the heat radiation efficiency can be increased. Moreover, in the method for producing an embossed metal plate according to the present invention, since the seed metal lump is press-fitted into the metal plate, it is possible to reduce the pressure as compared with a method of pressing the entire metal plate to form a protrusion, Thereby, the manufacturing cost can be reduced. Therefore, it can greatly contribute to the field of heat dissipation devices.
１ 金属基板
２ 種金属塊
３ 突起
１１ 上型
１２ プランジャー
１３ 中型
１４ 貫通孔
１５ 下型
１６ 貫通孔
１７ 突起受け治具
DESCRIPTION OF SYMBOLS 1 Metal substrate 2 Seed metal lump 3 Protrusion 11 Upper mold 12 Plunger 13 Middle mold 14 Through hole 15 Lower mold 16 Through hole 17 Projection receiving jig
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| JP2010139892A JP5656163B2 (en) | 2010-06-03 | 2010-06-03 | Embossed metal plate and manufacturing method thereof |
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| JP2010139892A JP5656163B2 (en) | 2010-06-03 | 2010-06-03 | Embossed metal plate and manufacturing method thereof |
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| JP2011251338A JP2011251338A (en) | 2011-12-15 |
| JP5656163B2 true JP5656163B2 (en) | 2015-01-21 |
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| JP6064191B2 (en) * | 2012-08-30 | 2017-01-25 | 太陽工業株式会社 | Heat sink and heat sink manufacturing method |
| CA2897285A1 (en) * | 2013-01-11 | 2014-07-17 | Futaba Industrial Co., Ltd. | Method for producing cooling device and heat-dissipating member |
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