WO2017033338A1 - Outil rotatif à matériau s'illuminant par contrainte, procédé de fabrication correspondant, et système de commande de machine-outil - Google Patents

Outil rotatif à matériau s'illuminant par contrainte, procédé de fabrication correspondant, et système de commande de machine-outil Download PDF

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Publication number
WO2017033338A1
WO2017033338A1 PCT/JP2015/074282 JP2015074282W WO2017033338A1 WO 2017033338 A1 WO2017033338 A1 WO 2017033338A1 JP 2015074282 W JP2015074282 W JP 2015074282W WO 2017033338 A1 WO2017033338 A1 WO 2017033338A1
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Prior art keywords
tool
stress
machine tool
rotary tool
control system
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PCT/JP2015/074282
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English (en)
Japanese (ja)
Inventor
一平 河野
進 石田
明理 楢原
隆浩 北川
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株式会社日立製作所
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Priority to PCT/JP2015/074282 priority Critical patent/WO2017033338A1/fr
Publication of WO2017033338A1 publication Critical patent/WO2017033338A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/04—Arrangements preventing overload of tools, e.g. restricting load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool

Definitions

  • the present invention relates to a rotary tool having a stress light emitter, a manufacturing method thereof, and a machine tool control system.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-291916
  • a machine tool controls a plurality of magnetic bearings 13, 14, 15 for supporting a rotating shaft 11 in a non-contact manner.
  • Bearing control means and processing control means 30 for controlling the cutting amount and feed speed of the grindstone 2.
  • the magnetic bearing control means has processing resistance calculation means 42 for calculating cutting resistance from the control current in real time.
  • the machining control means 30 controls the feed rate so that the cutting force becomes constant "(see the summary).
  • JP 2010-186374 A states that “a numerical value for generating a tool path based on at least a machining program designating material shape information and a cutting amount and controlling a machine tool having a main shaft and a movable shaft”.
  • the current detectors 24 and 26 for detecting the load of the servo motor 19 or the spindle motor 22, the position / speed detector 25 for detecting the position of the servo motor 19, and the current detectors 24 and 26 are detected.
  • the load current value is determined to be no load
  • the load current value is determined to be no load
  • the current tool path command is read and the material shape information, the tool path command, and the servo are read.
  • Patent Document 3 discloses a “measurement method and measurement system of stress or stress distribution using a stress luminescent material”, and “the material itself is proportional to the stress. Stress is applied to a subject including a stress-stimulated luminescent material that emits light, and the stress distribution in the subject is visualized based on the luminescence intensity of the stress-stimulated luminescent material in the subject. The stress or stress distribution in the subject can be determined by comparing the measured value with the correlation data between the light emission intensity and stress of the stress-stimulated luminescent material ”(see summary).
  • Patent Document 1 describes a machine tool that calculates a cutting force from a control current of a rotating spindle and controls a feed rate so that the cutting force becomes constant.
  • Patent Document 2 describes a numerical control device for a machine tool having a function of detecting tool breakage by detecting a no-load state from a load current of a motor including a servo motor.
  • a load signal related to machining is extracted from the motor current of the rotating spindle. It is difficult. Further, it is difficult to detect the servo motor of the machine tool because the machining load of the rotating small-diameter tool is small with respect to the motor load necessary for moving the table of the machine tool and the workpiece.
  • Patent Document 3 describes a method for measuring the stress or stress distribution of a subject using a stress-stimulated luminescent material, but does not disclose the detection of breakage or processing load of a rotating tool.
  • an object of the present invention is to provide a rotary tool capable of detecting tool breakage or cutting resistance during machining even in machining where it is difficult to detect a machining load such as a small-diameter tool.
  • the present application includes a plurality of means for solving the above-described problems, if an example of the rotary tool of the present invention is given, a rotary tool for cutting or grinding a workpiece, and a stress emission on a part of the tool surface. It has a member containing a body.
  • An example of a machine tool control system is a machine that controls a machine tool having a rotary tool for cutting or grinding a workpiece, the member having a stress light emitter on a part of the tool surface.
  • a machine control system a light receiving unit for measuring the light emission intensity of the stress light emitter provided on the rotary tool, a calculation unit for calculating a feed rate command according to the light emission intensity, and a machine tool according to the calculation result
  • a machine tool control unit that transmits a signal for controlling the machine tool, and controls the machine tool so that the light emission intensity approaches a predetermined value.
  • a machine tool including a rotary tool for cutting or grinding a workpiece having a member including a stress light emitter on a part of a tool surface.
  • a machine tool control system for controlling, a light receiving unit for measuring light emission of the stress light emitter provided on the rotary tool, and a breakage of the rotary tool according to light emission of the stress light emitter measured by the light receiver. And an arithmetic unit for determination.
  • the machine tool control system which can control a machine tool according to the detected process load can be provided.
  • This example is an example of a rotary tool having a stress light emitter.
  • FIG. 1 is a diagram showing the structure of a rotary tool coated with a stress luminescent material.
  • the tool 1 has a blade part 11, a neck part 12, a taper part 13, a shank part 14, and a stress light emitter part 10.
  • the blade portion 11 is a grindstone having a cutting edge or abrasive grains, and cuts or grinds the workpiece 2.
  • the neck portion 12 is a portion that is continuous with the blade portion 11, and is a round bar portion that has substantially the same diameter as the blade portion 11 or has a diameter equal to or smaller than the blade portion 11.
  • the taper portion 13 is a portion where the diameter changes between the neck portion 12 and the shank portion 14.
  • the shank portion 14 is gripped by a collet, a holder or the like when the tool 1 is connected to the machine tool 4.
  • the tool 1 does not necessarily need to have the taper part 13, and a tool with the same diameter of the neck part 12 and the taper part 14 may be sufficient.
  • the stress-stimulated luminescent part 10 is composed of stress-stimulated luminescent particles and a binder that emit light when given tool surface strain energy.
  • the stress luminescent particles include europium-added strontium aluminate SrAl 2 O 4 : Eu.
  • the binder is a material for forming a stress-stimulated luminescent part by containing stress-luminescent particles and may be either an organic substance such as an epoxy resin or an inorganic substance such as glass, or a mixture of both. It is a concept that also includes
  • stress-stimulated luminescent particles are materials that exhibit a phenomenon in which the luminescence intensity increases in proportion to the intensity of the stimulus in response to a mechanical stimulus in the elastic region, and further emits light in response to the repeated stimulus.
  • stress-stimulated luminescent particles have a crystal structure called stuffed tridymite structure as the matrix structure, aluminate compounds (SrAl2O4: Eu2 +), silicate compounds, alumina silicate compounds, phosphate compounds, Stress emission phenomenon has been confirmed in many materials such as perovskite compounds. Further, it has been confirmed that these materials emit light at various wavelengths from ultraviolet to near infrared.
  • aluminate compounds SrAl2O4: Eu2 +
  • silicate compounds alumina silicate compounds
  • phosphate compounds phosphate compounds
  • FIG. 2 is a diagram for explaining an example of a method for manufacturing a rotary tool in which the stress-stimulated luminescent body 10 is applied to the surface of the tool 1.
  • Masking 21 is applied to the portions of the blade 1 and the neck 12 of the tool 1 where the stress luminescent material is not applied (FIG. 2B).
  • the masking material is a material that can be removed by peeling, melting, or the like, such as a fluororesin or a resist material.
  • the tool 1 is dipped to a predetermined height in a liquid 22 in which stress-luminescent particles and a binder are mixed (FIG. 2 (c)), and the tool 1 is pulled up (FIG. 2 (d)).
  • the thickness of the stress-stimulated light emitter 10 from the pulling speed and the viscosity of the liquid.
  • concentration of the stress-stimulated luminescent particles As the concentration of the stress-stimulated luminescent particles is higher, a larger luminescence intensity can be obtained.
  • the liquid becomes highly viscous and it is difficult to control the thickness, it is desirable to set the concentration to about 10,000 mPa ⁇ s.
  • the tool 1 is allowed to stand, and the applied mixed solution of the stress luminescent material and the binder is cured. Finally, the masking 21 is removed to form the stress-stimulated light emitter 10 (FIG. 2 (e)).
  • the formation method of the stress light-emitting body part 10 is not restricted to the said method, For example, you may affix the resin tape containing a stress light-emitting body on the tool 1.
  • FIG. The resin tape is obtained by applying or pasting an adhesive member to a resin member having a stress light emitter, and attaching the adhesive portion to a tool. In this case, it can be attached more easily than other configurations.
  • the adhesive portion and the resin portion do not have to be separate bodies, and the stress light emitter may be mixed with the resin member before solidification, and attached to the tool before part of the resin member solidifies. In this case, since the resin member and the adhesive member are integrated, they can be manufactured without preparing each separately, and since the adhesive member is not interposed from the tool to the stress light emitter, the stress is more easily transmitted.
  • the stress light emitter 10 may be a coating portion including the stress light emitter, a portion having a stress light emitter layer between the tool base material and the coating, or a portion where the stress light emitter is doped or mixed in the tool base material.
  • FIG. 3 is a diagram showing an example of the relationship between the thickness of the stress luminescent resin and the light emission intensity.
  • the horizontal axis represents the thickness of the stress luminescent resin, and the vertical axis represents the luminescence intensity when the same load is applied to the stress luminescent resin.
  • the light emission intensity changes according to the thickness until the thickness of the stress-stimulated luminescent resin is less than 0.2 mm, but becomes a constant value when the thickness is 0.2 mm or more. For this reason, in order to obtain sufficient light emission intensity and to improve robustness with respect to thickness variations during manufacturing, it is desirable that the thickness of the stress-stimulated luminescent part is 0.2 mm or more.
  • FIG. 4 is a diagram showing an example of the relationship between tool flank wear and cutting force.
  • the horizontal axis represents flank wear, and the vertical axis represents cutting force.
  • This is a case where pre-hardened steel (hardness HRC58) is cut with a two-blade ball end mill having a diameter of 1 mm.
  • the processing conditions are a rotation speed of 9000 rpm, a feed rate of 40 mm / min, an axial cut of 0.1 mm, and a radial cut of 0.932 mm. It is.
  • the cutting force indicates a component in a direction perpendicular to the feed direction. Cutting force increases with the development of flank wear.
  • FIG. 5 is a diagram showing an example of the result of analyzing the magnitude of strain generated in the rotary tool.
  • the magnitude of strain generated in the tool when a load of 1 N was applied to the tool tip was determined by finite element analysis. However, the tool was assumed to have a diameter of 1 mm, a neck length of 10 mm, a tool material of cemented carbide, and a Young's modulus of 570 GPa and a Poisson's ratio of 0.24.
  • the strain was maximum near the boundary between the taper and neck of the tool, which was 180 ⁇ ST. For this reason, it is desirable that the stress-stimulated illuminant portion 10 be installed in the vicinity of the boundary between the tapered portion and the neck portion.
  • FIG. 6 is a diagram showing an example of the relationship between the flank wear of the tool and the magnitude of the maximum strain generated in the tool.
  • the horizontal axis represents flank wear, and the vertical axis represents the maximum strain.
  • the maximum strain is calculated from FIG. 4 and FIG. The strain becomes 400 ⁇ ST or more and increases with increasing flank wear.
  • FIG. 7 is a diagram illustrating an example of the relationship between the magnitude of strain and the emission intensity.
  • the horizontal axis indicates the magnitude of strain, and the vertical axis indicates the emission intensity.
  • a stress illuminant sensor used here as an example, a strontium aluminate SrAl 2 O 4 : Eu as a stress illuminant material, an epoxy resin as a binder, a weight ratio of 1: 1, and a resin prepared to an elastic modulus of 2000 MP It is a sensor.
  • the emission intensity also depends on the strain rate, and this data shows the data for a strain rate of 3370 ⁇ ST / s.
  • the emission intensity increases with strain at a strain of 200 ⁇ ST or more.
  • FIG. 8 is a diagram showing an example of the relationship between the flank wear of the tool and the light emission intensity.
  • the horizontal axis represents flank wear, and the vertical axis represents emission intensity.
  • the emission intensity was calculated from FIG. 6 and FIG.
  • the emission intensity is 80 cps or more, and an issuance intensity that can be detected by a CCD or the like of a commercially available digital camera can be obtained.
  • the emission intensity increases with increasing flank wear.
  • the strain rate increases, the light emission intensity also increases, and the strain rate applied to the tool depends on the rotational speed. For example, when the rotational speed is 6000 rpm, the strain rate of the tool is 40000 ⁇ ST / s or more. For this reason, the light emission intensity stronger than FIG. 8 is actually obtained.
  • the shank part 14 is a grip part of a tool, and it is desirable not to provide the stress light emitter part 10 in the shank part 14 in order to ensure gripping force and reduce swinging.
  • the blade portion 11 is a portion for processing the workpiece 2, and light is blocked by the workpiece 2 and chips, so it is desirable that the blade portion 11 is not provided with the stress light emitter portion 10.
  • the member including the stress illuminant that emits light according to the stress is provided in the stress concentration portion of the rotary tool, the tool breakage and the cutting resistance are detected even during machining with a small diameter tool. It becomes possible.
  • FIG. 9 is an example of a configuration diagram of a machine tool control system using a rotary tool having a stress light emitter.
  • the machine tool 3 is provided with a tool 1 and a workpiece 2.
  • the machine tool control system includes a light receiving unit 41, a calculation unit 42, a machining determination unit 43, and a machine tool control unit 44.
  • the light receiving part 41 measures the light emission intensity of the stress light emitter part 10 of the tool 1.
  • the light receiving unit 41 is composed of, for example, a photodiode or a CCD.
  • the calculation unit 42 calculates a target correction value for the feed rate of the machine tool according to the light emission intensity measured by the light receiving unit 41.
  • the machining determination unit 43 determines whether the tool 1 is machining the workpiece 2. For example, the machining determination unit 43 has a function of storing a machining start time, a tool path, and a workpiece shape data before machining, a function of calculating a workpiece shape during machining, and an elapsed time from the start of machining. It has a function of determining whether or not the tool 1 is processing the workpiece 2.
  • the machining determination unit 42 for example, a function of storing workpiece shape data before machining, a function of calculating the workpiece shape during machining, a function of detecting the position of the machine tool, and the current of the machine tool It has a function of determining whether the tool 1 is processing the workpiece 2 from the position.
  • the machine tool control unit 44 transmits a control signal for controlling the machine tool 3 according to the calculation result of the calculation unit 42.
  • the control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool.
  • FIG. 10 shows an example of a flowchart of a method for controlling the feed rate of the machine tool according to the light emission intensity.
  • the light emission intensity is measured by the light receiving unit 41 (S101).
  • the feed rate at which the light emission intensity specified by the calculation unit 42 is obtained is calculated (S102).
  • the machine tool control unit 44 when the light emission intensity is lower than the target light emission intensity so as to coincide with the target light emission intensity set so as to become a target processing load, the feed rate is increased, and the light emission intensity becomes If it is higher than the target light emission intensity, a command to decrease the feed rate is transmitted and the machine tool 3 is controlled (S103).
  • it determines with the process determination part 43 not being in process you may make it not control.
  • the fast feed speed may be set or a predetermined feed speed may be set.
  • the light emission intensity is larger than a certain value, it may be determined that the tool is broken or overloaded, and the machine tool feed stop may be commanded. Further, a retreat operation may be commanded after the stop.
  • the light from the stress-stimulated illuminant unit 10 is measured by the light receiving unit 41, it is desirable to process in a dry environment without using a cutting fluid.
  • air or mist spraying may be used.
  • a cutting fluid is unavoidably used, it is desirable to use a composition that transmits the light of the stress-stimulated luminescent material, for example, a transparent water-soluble cutting fluid such as a soluble type.
  • the excitation light is preferably light having a wavelength different from the emission wavelength of the stress-stimulated illuminant, and it is desirable to install a filter that transmits the emission wavelength and attenuates or blocks the excitation light in the light receiving unit 41.
  • the machining load can be detected based on the light emitted from the stress light emitter provided on the rotary tool, and the machine tool can be controlled in accordance with the detected machining load. Then, by detecting the light emission of the stress light emitter, the machining load can be detected even with a small diameter tool.
  • the deflection of the tool is stable and can be processed with high accuracy. Furthermore, the breakage of the tool can be prevented beforehand by monitoring the load applied to the tool.
  • FIG. 11 shows an example of a flowchart of a machine tool control system for controlling the feed of the machine tool and the tool path.
  • the movement of the tool 1 is started (S111), and when the approach to the workpiece 2 is started, the light emission intensity is measured by the light receiving unit 41 (S112).
  • the stress light emitter 10 emits light, so that it is determined that the machining is started when the emission intensity exceeds the threshold value (S113).
  • the set tool path is corrected using the position determined as the machining start as a reference, and the workpiece 2 is machined (S114).
  • the correction of the tool path for example, there is a method of offsetting the difference between the set machining start position and the measured machining start position. Moreover, the method of correcting the setting value of a tool diameter or a tool length using a tool diameter correction function or a tool length correction function may be used.
  • the machining start position is detected based on the position where the light emission of the stress light emitter 10 provided on the rotary tool is started, and the tool path is corrected based on the detected machining start position. Can do.
  • the calculation unit 42 determines the breakage of the tool according to the light emission intensity measured by the light receiving unit 41. Further, the machine tool control unit 44 transmits a control signal for controlling the machine tool 3 based on the determination result of the tool breakage.
  • the control signal includes, for example, a stop or acceleration / deceleration command for some or all axes of the machine tool. Further, it may include a retreat operation command for the machine tool. Furthermore, you may include the instruction
  • FIG. 12 is a diagram illustrating an example of the relationship between the light emission intensity and the indentation depth in a three-point bending test of a resin plate including a stress light emitter.
  • the horizontal axis represents the indentation depth, and the vertical axis represents the emission intensity.
  • the stress-stimulated illuminant linearly increases the luminescence intensity as the strain increases due to deformation, but exhibits a stronger luminescence intensity when the strain associated with the fracture occurs than when deformed. For this reason, it is possible to determine whether or not it has been destroyed based on the magnitude of the emission intensity. Therefore, the first method for determining tool breakage is determined as breakage when the light emission intensity measured by the light receiving unit 41 is greater than a certain threshold value.
  • the stress light emitter 10 continues to emit light due to the processing load, but if the tool tip breaks and the tip of the tool is lost, no processing load is generated, so the stress light emitter 10 does not emit light. For this reason, even if it is determined that the processing is being performed by the processing determination unit 43, a breakage is determined when the light emission intensity measured by the light receiving unit 41 is less than or equal to a threshold value. Further, in the present method, the breakage can be detected even when the stress-stimulated luminescent part 10 is scattered together with the blade part 11 due to breakage.
  • FIG. 13 is a diagram illustrating a third method for determining tool breakage.
  • the light receiving unit 41 is an optical sensor capable of acquiring a light emission shape such as a CCD.
  • a light emission shape such as a CCD.
  • FIG. 14 shows an example of the structure of the tool 1 suitable for the third tool breakage determination method.
  • a circumferential slit 101 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is reliably broken when the tool is broken.
  • the slit 101 in the circumferential direction may be a groove that completely divides the stress light emitter 10 or may not be completely divided.
  • the thickness of the stress light emitter 10 may be partially reduced, such as a V groove. It may be a groove.
  • FIG. 15 is an example of another structure of the tool 1 suitable for the third tool breakage determination method.
  • An axial slit 102 is provided in a part of the stress light emitter 10 so that the stress light emitter 10 is easily broken when the tool is broken.
  • the present embodiment it is possible to detect breakage even when the rotary tool breaks when the processing load is small, based on the light emitted from the stress light emitter provided on the rotary tool.
  • this invention is not limited to the above-mentioned Example, Various modifications are included.
  • the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
  • a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

L'invention concerne : un outil rotatif au moyen duquel la rupture d'un outil et la résistance à l'usinage peuvent être détectées même pendant l'usinage même lors d'un usinage lors duquel la charge d'usinage est faible, par exemple avec un outil de petit diamètre ; et un système de commande de machine-outil apte à commander une machine-outil en fonction de la charge d'usinage. L'outil rotatif est destiné à couper ou à meuler une pièce à travailler et a un élément comprenant un matériau s'illuminant par contrainte sur une partie de la surface de l'outil. Le système de commande de machine-outil comprend une unité de réception de lumière pour mesurer l'intensité de lumière émise par le matériau s'illuminant par contrainte disposé sur l'outil rotatif, une unité de calcul pour calculer des instructions de vitesse d'avance en fonction de l'intensité de lumière émise, et une unité de commande de machine-outil pour transmettre un signal pour commander la machine-outil en fonction des résultats de calcul, et commande la machine-outil de telle sorte que l'intensité de lumière émise par le matériau s'illuminant par contrainte s'approche d'une valeur déterminée au préalable.
PCT/JP2015/074282 2015-08-27 2015-08-27 Outil rotatif à matériau s'illuminant par contrainte, procédé de fabrication correspondant, et système de commande de machine-outil WO2017033338A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503770A (ja) * 1987-08-03 1990-11-08 カディア‐ダイアマント　マシーネン‐ウント　ウェルクゼウグファブリック　オー．コボ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング　アンド　カンパニー 切削加工するための工具
US20030177645A1 (en) * 2002-02-07 2003-09-25 Franz Flury Power tool assembly and associated method of use in rescue situations
JP2014176912A (ja) * 2013-03-14 2014-09-25 Toyo Univ 加工状態監視用センサー素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503770A (ja) * 1987-08-03 1990-11-08 カディア‐ダイアマント　マシーネン‐ウント　ウェルクゼウグファブリック　オー．コボ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング　アンド　カンパニー 切削加工するための工具
US20030177645A1 (en) * 2002-02-07 2003-09-25 Franz Flury Power tool assembly and associated method of use in rescue situations
JP2014176912A (ja) * 2013-03-14 2014-09-25 Toyo Univ 加工状態監視用センサー素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CERAMIC MASATSU: "Mage ni Oji Hakko", THE NIKKEI BUSINESS DAILY, 3 December 1997 (1997-12-03), pages 5 *

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