WO2017020372A1 - 柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏 - Google Patents

柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏 Download PDF

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Publication number
WO2017020372A1
WO2017020372A1 PCT/CN2015/088023 CN2015088023W WO2017020372A1 WO 2017020372 A1 WO2017020372 A1 WO 2017020372A1 CN 2015088023 W CN2015088023 W CN 2015088023W WO 2017020372 A1 WO2017020372 A1 WO 2017020372A1
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Prior art keywords
layer
glass substrate
flexible
flexible glass
display screen
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English (en)
French (fr)
Inventor
曾维静
周星宇
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/787,572 priority Critical patent/US20170162600A1/en
Publication of WO2017020372A1 publication Critical patent/WO2017020372A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible display panel, a flexible glass substrate, and a flexible display panel.
  • a flexible display also known as a rollable display, is an arbitrarily bendable display device constructed of a flexible panel made of a flexible material, including an electronic paper, a flexible liquid crystal display, and a flexible organic electroluminescent OLED (Organic) Light-Emitting Diode) display device.
  • the flexible display has many advantages: light weight, small size, thinness, convenient carrying, high temperature resistance, high impact resistance, strong shock resistance, and a wider working environment.
  • OLED displays are more self-illuminating, high brightness, wide viewing angle, high contrast, flexible, low energy consumption, etc., and are widely used in mobile phone screens, computer monitors, full color TVs, etc.
  • OLED display technology uses a very thin organic material luminescent layer and a flexible substrate that emits light when current is passed through.
  • the organic material is easily reacted with water and oxygen, a small amount of water vapor and oxygen can damage the organic light-emitting material, deteriorating the luminescent properties of the device. Therefore, the flexible OLED display not only requires the substrate to have a bendable characteristic, but also has good water and oxygen barrier properties.
  • the manufacturing method of the flexible OLED display generally comprises: using a plastic substrate of a polymer material, forming an inorganic thin film layer on the plastic substrate, and forming a TFT and an OLED.
  • the device layer is finally formed into a thin film package using an organic/inorganic material stack.
  • the disadvantage of this method is that most plastic polymer substrate can not withstand high temperature process, and it is necessary to form an inorganic film layer with sufficient water blocking capacity on the substrate, which increases the difficulty of the process; another method is to use flexible glass.
  • the surface characteristics of the substrate and the flexible glass substrate are better than those of the plastic substrate, and can withstand high temperature, and the water blocking ability of the substrate is strong, and no additional inorganic thin film layer is required, and the process is relatively simple.
  • the flexible glass substrate is fragile, which reduces the quality of the product, limits the yield of the product and the application of the product.
  • the invention provides a flexible display screen manufacturing method, a flexible glass substrate and a flexible display screen, which can solve the problem of the prior art that the product quality is degraded due to the fragile flexible glass substrate.
  • a technical solution adopted by the present invention is to provide a method for fabricating a flexible display panel, the method comprising the steps of: forming a TFT layer on one side of a flexible glass substrate. A polymer reinforcing layer is formed on the other side of the flexible glass substrate. The polymer reinforcing layer is cured. A display layer is formed on the TFT layer. An encapsulation layer is formed on a side of the flexible glass substrate on which the TFT layer is located.
  • the polymer reinforcing layer is PET, PI or epoxy resin.
  • curing is performed by baking or UV irradiation.
  • the polymer reinforcing layer is formed by at least one of spin coating, sputtering, spraying or screen printing.
  • the display layer is an OLED layer.
  • the OLED layer comprises an anode metal layer, an organic layer and a cathode metal layer; and the OLED layer is formed by a film forming method or a roll-to-roll process by inkjet printing or vacuum evaporation.
  • the encapsulation layer is formed by a surface package or a thin film package.
  • another technical solution adopted by the present invention is to provide a flexible glass substrate, and one side of the flexible glass substrate is provided with a polymer reinforcing layer.
  • the polymer reinforcing layer is PET, PI or epoxy resin.
  • another technical solution adopted by the present invention is to provide a flexible display screen including a TFT layer, a display layer, an encapsulation layer, and a flexible glass substrate;
  • one side of the flexible glass substrate is provided with a polymer reinforcing layer
  • the TFT layer is disposed on the flexible glass substrate on the other side opposite to the side where the polymer reinforcing layer is located
  • the display layer is provided Above the TFT layer, the encapsulation layer is disposed on one side of the flexible glass substrate where the TFT layer is located.
  • the polymer reinforcing layer is PET, PI or epoxy resin.
  • the display layer is an OLED layer.
  • the OLED layer comprises an anode metal layer, an organic layer and a cathode metal layer; and the OLED layer is formed by a film forming method or a roll-to-roll process by inkjet printing or vacuum evaporation.
  • the invention has the beneficial effects that the polymer reinforcing layer is formed on one side of the flexible glass substrate by the prior art, and the polymer material has the characteristics of high flexibility, high compressive strength and high mechanical strength. It alleviates the stress concentration caused by bending of the flexible glass surface, overcomes the shortcoming of the flexible glass substrate, and enhances the compressive strength of the flexible glass substrate, thereby realizing high temperature resistance, good surface characteristics and excellent in using flexible glass.
  • the water-resistance and the like are characterized by strong flexibility and high compressive strength, and also improve the packaging performance and display effect of the flexible display, thereby improving the quality of the product.
  • the present invention provides a polymer reinforcement layer on one side of the flexible glass substrate, which can increase the number of alternative processes.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for fabricating a flexible display screen according to the present invention
  • FIG. 2 is a schematic view showing a manufacturing process of a first embodiment of a method for fabricating a flexible display screen according to the present invention
  • FIG. 3 is a schematic flow chart of a second embodiment of a method for fabricating a flexible display screen according to the present invention.
  • FIG. 4 is a schematic cross-sectional structural view of an embodiment of a flexible glass substrate of the present invention.
  • FIG. 5 is a schematic cross-sectional view of an embodiment of a flexible display screen of the present invention.
  • the present invention provides a method for fabricating a flexible display screen, which specifically includes the following steps:
  • a TFT layer 11 is formed on one side of the flexible glass substrate 10.
  • the flexible glass substrate 10 is a thin, transparent glass that can be easily bent by people.
  • TFT Thin Film Transistor
  • TFT Thin Film Transistor
  • a polymer reinforcing layer 12 is formed on the other side of the flexible glass substrate 10.
  • Glass is a typical brittle material. Although flexible glass can be bent, its compressive strength is still relatively low, and there are defects on the surface and the inside. Crack propagation is likely to occur under the action of external force and environmental medium.
  • the polymer material has a certain flexibility, can produce elastic deformation, and can alleviate the stress concentration caused by the bending of the glass surface.
  • the polymer reinforcing layer 12 should have strong adhesion to the glass, high mechanical strength, and high compressive strength.
  • the polymer reinforcing layer 12 is formed on one side of the flexible glass substrate 10, and the polymer reinforcing layer 12 is adhered to the flexible glass substrate 10 at all times, so that the flexibility of the polymer can be utilized to improve the flexible glass to enhance Its compressive strength.
  • the TFT layer 11 is formed on one side of the flexible glass substrate 10, and then the polymer reinforcing layer 12 is formed on the other side of the flexible glass substrate 10, thereby avoiding damage to the polymer reinforcing layer 12 by the high-temperature process of the TFT. And there is no high-temperature process in the subsequent process, which avoids the peeling phenomenon of the glass substrate and the polymer layer due to different expansion coefficients.
  • the polymer reinforcing layer 12 may be PET, PI or epoxy.
  • PET refers to polyethylene terephthalate (polyethylene) Terephthalate), which has good mechanical properties, high impact strength, good folding resistance, excellent high and low temperature resistance, low gas and water vapor permeability, and excellent gas barrier, water, oil and odor properties. And high transparency, can block ultraviolet rays, and good gloss. Therefore, the use of PET as the polymer reinforcing layer 12 can improve the compressive strength of the flexible glass, and can also improve the waterproof, high temperature and low temperature resistance of the entire flexible glass substrate 10, and does not affect the flexible glass itself. Features such as transparency and gloss.
  • PI Polyimide
  • Epoxy resin has good physical and chemical properties, and it has excellent bonding strength to metal and non-metal materials, and has good flexibility.
  • the polymer reinforcing layer 12 may be other polymer materials having flexibility, high adhesion, and high compressive strength, and is not limited to the above materials.
  • the formation of the polymer reinforcing layer 12 can be formed by at least one of spin coating, sputtering, spray coating, or screen printing.
  • spin coating is the abbreviation of spin coating method.
  • Spin coating method includes three steps of batching, high-speed rotation and volatilization into film. The film formation is controlled by controlling the time of gel, the rotation speed, the amount of liquid drop and the concentration and viscosity of the solution used. thickness of.
  • the sputtering process has the advantages of low substrate temperature, pure film quality, uniform and compact structure, good firmness and reproducibility.
  • the spraying process is a coating method applied to the surface of the object by means of a spray gun or a dish atomizer, which is dispersed into a uniform and fine mist by means of pressure or centrifugal force, and the method has the characteristics of high production efficiency.
  • Screen printing has the advantages of soft layout, small embossing force and strong covering power.
  • the method of forming the polymer reinforcing layer 12 can be selected according to the characteristics of the polymer material, the environment and conditions of formation, and the like.
  • the curing method may be baking or UV irradiation.
  • the polymer reinforcing layer 12 of the present embodiment is PET, which is cured on the flexible glass substrate 10 by UV irradiation.
  • a display layer 13 is formed on the TFT layer 11.
  • the display layer 13 is an OLED (Organic Light-Emitting)
  • the Diode layer that is, the organic light emitting diode layer, specifically, the OLED layer includes an anode metal layer, an organic layer, and a cathode metal layer.
  • the OLED layer is formed by a method of inkjet printing or vacuum evaporation and is formed by a planar film formation or a roll-to-roll process.
  • an OLED layer is formed on the TFT layer 11 in a planar film formation by a method of inkjet printing.
  • the inkjet printer is composed of a system controller, an inkjet controller, a showerhead, a substrate driving mechanism, and the like.
  • the organic matter is ejected from the nozzle of the nozzle to be printed on the substrate under the control of the ink jet controller.
  • the display layer 13 will be the display layer 13 on the corresponding display screen.
  • an encapsulation layer 14 is formed on a side of the flexible glass substrate 10 where the TFT layer 11 is located.
  • the encapsulation layer 14 is formed in a surface package or a thin film package.
  • the thin film encapsulation is a stack of inorganic or organic materials, and the encapsulation material may be SiNx/SiOC/SiNx.
  • the method is to deposit a film having water vapor barrier properties at a low temperature to realize packaging of the display device.
  • a layer of high-resistance solid glue is adhered to the package cover, and then the substrate is bonded to complete the package.
  • the invention forms a polymer reinforcing layer on one side of the flexible glass substrate, and the flexible glass surface is relieved due to the flexibility, high compressive strength and high mechanical strength.
  • the stress concentration generated overcomes the shortcomings of the flexible glass substrate, and enhances the compressive strength of the flexible glass substrate, thereby realizing the advantages of high temperature resistance, good surface characteristics, and excellent water resistance of the flexible glass. It also achieves high flexibility and high compressive strength, and also improves the packaging performance and display effect of the flexible display, thus improving the quality of the product.
  • the present invention provides a polymer reinforcement layer on one side of the flexible glass substrate, which can increase the number of alternative processes.
  • FIG. 2 and FIG. 3 are schematic flowcharts of another embodiment of a method for fabricating a flexible display screen according to the present invention. Specifically, the manufacturing method of this embodiment includes the following steps:
  • the present embodiment forms a PI enhancement layer by sputtering.
  • the curing includes pre-curing and main curing, wherein the pre-curing temperature is from 90 ° C to 150 ° C, for example, 100 ° C in the present embodiment, and the curing time is from 1 min to 4 min, for example, 2 min in this embodiment.
  • the temperature of the main curing is from 200 ° C to 270 ° C, for example, 230 ° C, or 250 ° C in the present embodiment, and the main curing time is from 25 min to 33 min, and this embodiment is curing for 30 min.
  • the OLED layer is formed by vacuum evaporation and formed by a roll-to-roll process.
  • an encapsulation layer is formed on a side of the flexible glass substrate on which the TFT layer is located.
  • an encapsulation layer is formed by using a film package using SiNx/SiOC/SiNx as a material.
  • the present invention also provides a flexible glass substrate.
  • a flexible glass substrate 30 Referring to FIG. 4, one side of the flexible glass substrate 30 is provided with a polymer reinforcing layer 32.
  • the polymer reinforcing layer 32 is PET, PI or epoxy resin, and the polymer reinforcing layer 32 is formed on the flexible glass substrate 30 by at least one of spin coating, sputtering, spray coating or screen printing.
  • the present invention also provides a flexible display screen.
  • the flexible display screen includes a TFT layer 41, a display layer 43, an encapsulation layer 44, and a flexible glass substrate 40, wherein one side of the flexible glass substrate is provided with a polymer. Enhancement layer 42.
  • the TFT layer 41 is disposed on the flexible glass substrate 40 on the other side opposite to the side where the polymer enhancement layer 42 is located, the display layer 43 is disposed on the TFT layer 41, and the encapsulation layer 44 is disposed on the TFT layer 41.
  • the polymer reinforcing layer 42 is PET, PI or epoxy resin, and the polymer reinforcing layer 42 is formed on the flexible glass substrate 40 by at least one of spin coating, sputtering, spray coating or screen printing.
  • the display layer 43 is an OLED layer.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性显示屏的制作方法、柔性玻璃基板(10)及柔性显示屏。柔性显示屏的制作方法包括以下步骤：在柔性玻璃基板(10)的一侧形成TFT层(11)。在柔性玻璃基板(10)的另一侧形成高分子增强层(12)。将高分子增强层(12)进行固化。在TFT层(11)上形成显示层(13)。在柔性玻璃基板(10)的、TFT层(11)所在的一侧形成封装层(14)。增强了柔性玻璃基板(10)的抗压强度，因此提高了产品的质量。

Description

柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏
【技术领域】
本发明涉及显示技术领域，特别是涉及一种柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏。
【背景技术】
柔性显示器又称为可卷曲显示器，是采用柔性材料制成的可视面板而构成的可任意弯曲变形的显示装置，其包括电子纸、柔性液晶显示器和柔性有机电致发光OLED(Organic Light-Emitting Diode)显示器件。柔性显示器具有诸多优点：重量轻、体积小、薄型化，携带方便；耐高低温、耐冲击、抗震能力更强，能适应的工作环境更广等优点。
其中，OLED显示器更具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术采用非常薄的有机材料发光层和柔性基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水氧反应，很少量的水蒸气和氧气就能损害有机发光材料，使器件的发光性能劣化。因此，柔性OLED显示器不仅要求基板具有可弯曲的特点，同时应具有良好的水氧阻隔性。
目前柔性OLED显示器的制作方法一般包括，使用高分子材料的塑料基板，在塑料基板上形成无机薄膜层，并形成TFT及OLED device层，最后使用有机/无机材料堆叠形式形成薄膜封装。该方法的缺点是，大多数的塑料高分子材料基板无法承受高温制程，且需在基板上形成有足够阻水能力的无机薄膜层，增加了制程的难度；另一种方法是，使用柔性玻璃基板，柔性玻璃基板表面特性较塑料基板好，可耐高温，且其本身阻水能力强，无需额外制作无机薄膜层，制程较为简单。但柔性玻璃基板易碎，降低了产品质量，限制了生产的良率及产品的应用。
【发明内容】
本发明提供一种柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏，能够解决现有技术存在的因柔性玻璃基板易碎而导致产品质量下降的问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种柔性显示屏的制作方法，该方法包括以下步骤：在柔性玻璃基板的一侧形成TFT层。在所述柔性玻璃基板的另一侧形成高分子增强层。将所述高分子增强层进行固化。在所述TFT层上形成显示层。在所述柔性玻璃基板的、所述TFT层所在的一侧形成封装层。
其中，所述高分子增强层为PET、PI或者环氧树脂。
其中，将所述高分子增强层进行固化的步骤中，通过烘烤或UV照射的方式进行固化。
其中，所述高分子增强层通过旋涂、溅射、喷涂或者丝网印刷中至少一种方式形成。
其中，所述显示层为OLED层。
其中，所述OLED层包括阳极金属层、有机层和阴极金属层；所述OLED层通过喷墨印刷或者真空蒸镀的方法并以平面成膜或者卷对卷制程形成。
其中，所述封装层的形成方式为面封装或薄膜封装。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性玻璃基板，所述柔性玻璃基板的一侧设有高分子增强层。
其中，所述高分子增强层为PET、PI或者环氧树脂。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种柔性显示屏，该柔性显示屏包括TFT层、显示层、封装层以及柔性玻璃基板；
其中，所述柔性玻璃基板的一侧设有高分子增强层，所述TFT层设在所述柔性玻璃基板上、与所述高分子增强层所在侧相对的另一侧，所述显示层设在所述TFT层之上，所述封装层设在所述TFT层所在的、所述柔性玻璃基板的一侧。
其中，所述高分子增强层为PET、PI或者环氧树脂。
其中，所述显示层为OLED层。
其中，所述OLED层包括阳极金属层、有机层和阴极金属层；所述OLED层通过喷墨印刷或者真空蒸镀的方法并以平面成膜或者卷对卷制程形成。
本发明的有益效果是：区别于现有技术的情况，通过在柔性玻璃基板的一侧形成高分子增强层，由于高分子材料柔韧性强、抗压强度高、机械强度高的特点，从而能缓解柔性玻璃表面由于弯曲所产生的应力集中，克服了柔性玻璃基板易碎的缺点，增强了柔性玻璃基板的抗压强度，因而实现了在利用柔性玻璃好的可耐高温，表面特性好，优异的阻水性等特点的同时又能获得强柔韧性以及高抗压强度，并且还提高了柔性显示屏的封装效能及显示效果，因此提高了产品的质量。此外，本发明在柔性玻璃基板一侧设高分子增强层后，能使后续制程可选择的方式增多。
【附图说明】
图1是本发明一种柔性显示屏的制作方法第一实施例的流程示意图；
图2是本发明一种柔性显示屏的制作方法第一实施例的制作过程示意图；
图3是本发明一种柔性显示屏的制作方法第二实施例的流程示意图；
图4是本发明一种柔性玻璃基板实施例的截面结构示意图；
图5是本发明一种柔性显示屏实施例的截面结构示意图。
【具体实施方式】
下面结合附图和具体实施方式对本发明进行详细说明。
请参阅图1和图2，本发明提供了一种柔性显示屏的制作方法，具体包括以下步骤：
S100、在柔性玻璃基板10的一侧形成TFT层11。
柔性玻璃基板10是一种轻薄透明的玻璃，人们可以轻松将其压弯。TFT（Thin Film Transistor）即薄膜晶体管用于驱动显示屏上的液晶像素点。
S101、在柔性玻璃基板10的另一侧形成高分子增强层12。
玻璃是典型的脆性材料，柔性玻璃虽然可弯曲，但是其抗压强度仍然比较低，表面与内部存在缺陷，在外力与环境介质作用下极易发生裂纹扩展。
高分子材料具有一定的柔韧性，可产生弹性形变，能缓解玻璃表面由于弯曲所产生的应力集中。此外高分子增强层12应具有与玻璃粘附性强，机械强度高，抗压强度高等特点。
因此，在柔性玻璃基板10的一侧形成高分子增强层12，并且使该高分子增强层12一直粘附在柔性玻璃基板10上，从而可以利用高分子的柔韧性来改善柔性玻璃，以增强其抗压强度。
本发明通过先在柔性玻璃基板10的一侧形成TFT层11，然后再在该柔性玻璃基板10的另一侧形成高分子增强层12，避免了TFT高温制程对高分子增强层12的损害，且后续没有高温制程，避免了玻璃基板与高分子层由于膨胀系数不一样导致的二者剥离现象。
举例而言，高分子增强层12可以是PET、PI或者环氧树脂。例如，PET是指聚对苯二甲酸乙二醇酯（polyethylene terephthalate），其具有良好的力学性能，冲击强度高，耐折性好，同时具有优良的耐高、低温性能，气体和水蒸气渗透率低，即拥有优良的阻气、水、油及异味性能，并且透明度高，可阻挡紫外线，光泽性好。因此，使用PET作为高分子增强层12，能提高柔性玻璃的抗压强度的同时，还能提高整个柔性玻璃基板10的防水、耐高温、耐低温的性能，并且还不会影响柔性玻璃本身的透明度和光泽度等特性。PI（Polyimide），即聚酰亚胺，具有耐磨耗、耐高温、高抗冲击性能等优点。环氧树脂具有良好的物理、化学性能，它对金属和非金属材料的表面具有优异的粘接强度，且柔韧性较好。当然，该高分子增强层12还可以是其它具有柔韧性、粘附性强、抗压强度高的高分子材料，而不限于上述的材料。
高分子增强层12的形成可以通过旋涂、溅射、喷涂或者丝网印刷中至少一种方式形成。其中，旋涂是旋转涂抹法的简称，旋涂法包括配料，高速旋转，挥发成膜三个步骤，通过控制匀胶的时间，转速，滴液量以及所用溶液的浓度、粘度来控制成膜的厚度。溅射工艺具有基体温度低，薄膜质纯，组织均匀密实，牢固性和重现性好等优点。喷涂工艺则是通过喷枪或碟式雾化器，借助于压力或离心力，分散成均匀而微细的雾滴，施涂于被涂物表面的涂装方法，该方法具有生产效率高的特点。丝网印刷则具有版面柔软、压印力小、覆盖力强等优点。实际生产中，可以根据高分子材料的特性、形成的环境、条件等实际情况选择形成高分子增强层12的方式。
S102、将高分子增强层12进行固化。
其中，固化的方式可以是烘烤或UV照射。举例而言，本实施例的高分子增强层12是PET，通过UV照射的方式将其固化在柔性玻璃基板10上。
S103、在TFT层11上形成显示层13。
在本实施例中，显示层13为OLED（Organic Light-Emitting Diode）层，即有机发光二极管层，具体而言，OLED层包括阳极金属层、有机层和阴极金属层。OLED层通过喷墨印刷或者真空蒸镀的方法并以平面成膜或者卷对卷制程形成。具体地，本实施例是采用喷墨印刷的方法以平面成膜的方式将OLED层形成在TFT层11上。喷墨印刷机由系统控制器、喷墨控制器、喷头、承印物驱动机构等组成。有机物则在喷墨控制器的控制下，从喷头的喷嘴喷出喷印在承印物上。当然，若该柔性显示屏电子纸或者柔性液晶显示屏等的时候，该显示层13则会是相应的显示屏上的显示层13。
S104、在柔性玻璃基板10的、TFT层11所在的一侧形成封装层14。
由于柔性玻璃基板10相对与硬质的玻璃基板来说，对水、氧气的阻挡能力较弱，为了延长显示屏的使用寿命，需要在柔性玻璃基板10上进行有效封装。具体而言，封装层14的形成方式为面封装或薄膜封装。其中，薄膜封装为采用无机或有机材料堆叠，封装材料可以是SiNx/SiOC/SiNx，该方法是在低温下沉积具有水气阻挡性能的薄膜，来实现对显示器件的封装。面封装则是在封装盖板上先粘附一层具有高阻水性的固态胶，然后与基板贴合完成封装。
区别于现有技术，本发明通过在柔性玻璃基板的一侧形成高分子增强层，由于高分子材料柔韧性强、抗压强度高、机械强度高的特点，从而能缓解柔性玻璃表面由于弯曲所产生的应力集中，克服了柔性玻璃基板易碎的缺点，增强了柔性玻璃基板的抗压强度，因而实现了在利用柔性玻璃好的可耐高温，表面特性好，优异的阻水性等特点的同时又能获得强柔韧性以及高抗压强度，并且还提高了柔性显示屏的封装效能及显示效果，因此提高了产品的质量。此外，本发明在柔性玻璃基板一侧设高分子增强层后，能使后续制程可选择的方式增多。
请参阅图2和图3，是本发明柔性显示屏的制作方法的另一实施例的流程示意图。具体地，本实施例的制作方法包括以下步骤：
S200、在柔性玻璃基板的一侧形成TFT层。
S201、在柔性玻璃基板的另一侧形成PI增强层。具体地，本实施例通过溅射的方式形成PI增强层。
S202、将PI增强层进行固化。本步骤中，通过烘烤的方式将PI增强层进行固化。固化包括预固化和主固化，其中，预固化温度为90℃-150℃，例如本实施例为100℃，固化时间为1min-4min，例如本实施例为2min。主固化的温度为200℃-270℃，例如230℃，或者本实施例为250℃，主固化时间为25min-33min，本实施例为固化30min。
S203、在TFT层上形成OLED层。本实施例中，OLED层通过真空蒸镀的方式形成，并且使用卷对卷制程的方式形成。
S204、在柔性玻璃基板的、TFT层所在的一侧使用形成封装层。本实施例是使用SiNx/SiOC/SiNx作为材料使用薄膜封装的方式形成封装层。
本发明还提供了一种柔性玻璃基板，请参阅图4，该柔性玻璃基板30的一侧设有高分子增强层32。
具体地，该高分子增强层32为PET、PI或者环氧树脂，该高分子增强层32通过旋涂、溅射、喷涂或者丝网印刷中至少一种方式形成在柔性玻璃基板30上。
本发明还提供了一种柔性显示屏，请参阅图5，该柔性显示屏包括TFT层41、显示层43、封装层44以及柔性玻璃基板40，其中，柔玻璃基板的一侧设有高分子增强层42。
其中，TFT层41设在柔性玻璃基板40上、与述高分子增强层42所在侧相对的另一侧，显示层43设在TFT层41之上，封装层44设在TFT层41所在的、柔性玻璃基板40的一侧。
具体地，该高分子增强层42为PET、PI或者环氧树脂，该高分子增强层42通过旋涂、溅射、喷涂或者丝网印刷中至少一种方式形成在柔性玻璃基板40上。在本实施例中，显示层43为OLED层。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种柔性显示屏的制作方法，其中，包括以下步骤：
    在柔性玻璃基板的一侧形成TFT层；
    在所述柔性玻璃基板的另一侧形成高分子增强层；
    将所述高分子增强层进行固化；
    在所述TFT层上形成显示层；及
    在所述柔性玻璃基板的、所述TFT层所在的一侧形成封装层。
  2. 根据权利要求1所述的方法，其中，所述高分子增强层为PET、PI或者环氧树脂。
  3. 根据权利要求2所述的方法，其中，将所述高分子增强层进行固化的步骤中，通过烘烤或UV照射的方式进行固化。
  4. 根据权利要求3所述的方法，其中，所述高分子增强层通过旋涂、溅射、喷涂或者丝网印刷中至少一种方式形成。
  5. 根据权利要求4所述的方法，其中，所述显示层为OLED层。
  6. 根据权利要求5所述的方法，其中，所述OLED层包括阳极金属层、有机层和阴极金属层；所述OLED层通过喷墨印刷或者真空蒸镀的方法并以平面成膜或者卷对卷制程形成。
  7. 根据权利要求6所述的方法，其中，所述封装层的形成方式为面封装或薄膜封装。
  8. 一种柔性玻璃基板，其中，在所述柔性玻璃基板的一侧设有高分子增强层。
  9. 根据权利要求8所述的柔性玻璃基板，其中，所述高分子增强层为PET、PI或者环氧树脂。
  10. 一种柔性显示屏，其中，包括TFT层、显示层、封装层以及柔性玻璃基板；
    其中，所述柔性玻璃基板的一侧设有高分子增强层，所述TFT层设在所述柔性玻璃基板上、与所述高分子增强层所在侧相对的另一侧，所述显示层设在所述TFT层之上，所述封装层设在所述TFT层所在的、所述柔性玻璃基板的一侧。
  11. 根据权利要求10所述的柔性显示屏，其中，所述高分子增强层为PET、PI或者环氧树脂。
  12. 根据权利要求11所述的柔性显示屏，其中，所述显示层为OLED层。
  13. 根据权利要求12所述的柔性显示屏，其中，所述OLED层包括阳极金属层、有机层和阴极金属层；所述OLED层通过喷墨印刷或者真空蒸镀的方法并以平面成膜或者卷对卷制程形成。
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