WO2017016390A1 - 用于直流换流阀的晶闸管组件散热器 - Google Patents

用于直流换流阀的晶闸管组件散热器 Download PDF

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Publication number
WO2017016390A1
WO2017016390A1 PCT/CN2016/089942 CN2016089942W WO2017016390A1 WO 2017016390 A1 WO2017016390 A1 WO 2017016390A1 CN 2016089942 W CN2016089942 W CN 2016089942W WO 2017016390 A1 WO2017016390 A1 WO 2017016390A1
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WIPO (PCT)
Prior art keywords
radiator
heat sink
pipe
water
water outlet
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PCT/CN2016/089942
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English (en)
French (fr)
Inventor
张翔
方太勋
曹冬明
陈赤汉
张广泰
刘海彬
Original Assignee
南京南瑞继保电气有限公司
南京南瑞继保工程技术有限公司
常州博瑞电力自动化设备有限公司
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Application filed by 南京南瑞继保电气有限公司, 南京南瑞继保工程技术有限公司, 常州博瑞电力自动化设备有限公司 filed Critical 南京南瑞继保电气有限公司
Priority to BR112018001502-4A priority Critical patent/BR112018001502B1/pt
Priority to JP2018517397A priority patent/JP6352580B1/ja
Priority to RU2018105991A priority patent/RU2660293C1/ru
Priority to CA2992842A priority patent/CA2992842C/en
Priority to MX2018001178A priority patent/MX2018001178A/es
Priority to EP16829756.2A priority patent/EP3316293B1/en
Priority to AU2016300491A priority patent/AU2016300491B2/en
Priority to KR1020187004543A priority patent/KR101916914B1/ko
Priority to US15/747,769 priority patent/US10141243B2/en
Publication of WO2017016390A1 publication Critical patent/WO2017016390A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
    • H01L27/1027—Thyristors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/72—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region

Definitions

  • the invention belongs to the field of a direct current transmission converter valve, and particularly relates to a thyristor assembly radiator for a direct current converter valve.
  • the DC converter valve is the core equipment of DC transmission.
  • the converter valve is usually composed of multiple components.
  • the converter valve assembly includes a thyristor assembly, an anode reactor, etc.
  • the thyristor assembly also includes a thyristor, a heat sink, a damping resistor, a damping capacitor, and the like.
  • the matching cooling system, the structure of the converter valve is complex, and there are many parts. In the course of operation, it will be faulty for various reasons. After the fault occurs, it needs to be repaired in time to restore the normal operation of the converter valve as soon as possible. Therefore, the design of the converter valve In the process, it is necessary to consider the convenience of equipment maintenance in all aspects.
  • the damping resistors in the thyristor assembly mainly have two forms.
  • the first one is: the damping resistor is a water resistor, the damping resistor is in direct contact with the cooling water, and the heat is dissipated independently, and the thyristor radiator and the cooling water pipe do not interfere with each other, and the cooling system operates normally.
  • the damping resistor can get good heat dissipation.
  • the damping resistor is a rod.
  • Resistor a plurality of rod resistors are arranged in the through holes provided in the thyristor heat sink, and the damping resistor is indirectly radiated through the thyristor heat sink, thereby reducing the joints in the converter valve assembly, but some of the rod resistors and the cooling water pipes of the thyristor radiator are present.
  • the phenomenon of interference when repairing the rod resistance of the interference phenomenon with the cooling water pipe, the cooling water in the converter valve must be completely discharged before the cooling water pipe can be disassembled, and the maintenance is difficult.
  • the solution of the present invention is: a thyristor assembly heat sink for a DC converter valve, including a heat sink, and a thyristor disposed between two adjacent heat sinks;
  • the utility model comprises a casing, the upper part of the casing is provided with a water inlet, the lower part is provided with a water outlet, a through hole in the radiator housing for placing a damping resistor is arranged between the water inlet and the water outlet; and a water outlet of the Nth radiator
  • the water outlet of the N-2th radiator is connected through a pipe, and the water inlet of the Nth radiator and the water inlet of the N+2 radiator are connected by a pipe, or the water inlet of the Nth radiator and the Nth -
  • the water inlets of the two radiators are connected by pipes, and the water outlet of the Nth radiator is connected to the water outlet of the N+2 radiators through the pipeline, N ⁇ 3, and N is an odd number;
  • the Mth radiator The water outlet is connected to the water outlet
  • the Nth heat sink and the N-2th heat sink are connected by a vertical pipe, and the Nth heat sink and the N+2 heat sink are also connected by a vertical pipe.
  • the vertical water pipe comprises a longitudinal pipe and two parallel horizontal pipes; the horizontal pipe has one end communicating with the radiator and the other end communicating with the longitudinal pipe.
  • the Mth heat sink and the M-2th heat sink are connected by an elbow, and the Mth heat sink and the M+2 heat sink are also connected by the elbow;
  • the elbow It includes a straight tube and a bent tube that is in communication with the straight tube and is located at both ends of the straight tube.
  • the elbow includes a first horizontal tube, a inclined tube and a second horizontal tube; the first horizontal tube, the inclined tube and the second horizontal tube are sequentially connected, and the first horizontal tube and the first The two horizontal tubes are parallel.
  • the present invention has the following beneficial effects:
  • the damping resistor is arranged in the thyristor radiator to reduce the joint of the cooling system, reduce the risk of leakage and improve the reliability of the operation of the converter valve.
  • Figure 1 is a schematic view of the structure of the present invention.
  • FIG. 2 is a schematic view showing the structure of a straight pipe of the present invention.
  • Figure 3 is a schematic view showing the results of the bent pipe of the present invention.
  • the thyristor assembly heat sink for the DC converter valve includes a heat sink 2, and a thyristor 1 is disposed between two adjacent heat sinks 2;
  • the heat sink 2 comprises a casing, the upper part of the casing is provided with a water inlet 3, and the lower part is provided with a water outlet 4, and a through hole 5 in the radiator casing for placing a damping resistor is arranged between the water inlet 3 and the water outlet 4. 10;
  • the water outlet 4 of the first radiator 2 communicates with the water outlet 4 of the third radiator 2 through the duct 11, and the water inlet 3 of the third radiator 2 and the water inlet 3 of the fifth radiator 2 pass.
  • the pipeline is connected, and the water outlet 4 of the fifth radiator 2 and the water outlet 4 of the seventh radiator 2 are connected by the pipe 11; the water outlet 4 of the second radiator 2 and the water outlet 4 of the fourth radiator 2
  • the water inlet 3 of the fourth radiator 2 communicates with the water inlet 3 of the sixth radiator 2 through a pipe, and the water outlet 4 of the sixth radiator 2 and the water outlet 4 of the eighth radiator 2 Connected by pipes; the water pipes 3 of the last two radiators 2 are connected by pipes.
  • the odd heat sinks are connected by a vertical water pipe 11;
  • the vertical water pipe 11 includes a vertical pipe 15 and two parallel horizontal pipes 14; one end of the horizontal pipe 14 is connected to the radiator, and the other end is longitudinally
  • the tube 15 is connected.
  • the even heat sinks are connected by an elbow 12; the elbow 12 includes a straight tube 19 and an elbow that communicates with the straight tube 19 and is located at both ends of the straight tube 19.
  • the elbow includes a first horizontal tube 16, a inclined tube 17, and a second horizontal tube 18; the first horizontal tube 16, the inclined tube 17 and the second horizontal tube 18 are sequentially connected, and the first horizontal tube 16 and the second horizontal tube Tubes 18 are parallel.
  • the length of the lateral portion 14 of the vertical water pipe 11 is the length of the first horizontal pipe 16, the second curved pipe 18, and the inclined pipe 17 of the elbow 12.

Abstract

一种用于直流换流阀的晶闸管组件散热器，第N个散热器的下水口与第N-2个散热器的下水口连通，第N个散热器的上水口与第N+2个散热器的上水口连通，或者第N个散热器的上水口与第N-2个散热器的上水口连通，第N个散热器的下水口与第N+2个散热器的下水口连通；第M个散热器的下水口与第M-2个散热器的下水口连通，第M个散热器的上水口与第M+2个散热器的上水口连通，或者第M个散热器的上水口与第M-2个散热器的上水口连通，第M个散热器的下水口与第M+2个散热器的下水口连通；最后两个散热器的上水口相连通。该散热器减少了冷却系统接头，降低了泄漏风险，提高了换流阀运行可靠性，降低了检修难度、减少检修时间。

Description

用于直流换流阀的晶闸管组件散热器 技术领域
本发明属于直流输电换流阀领域，特别涉及一种用于直流换流阀的晶闸管组件散热器。
背景技术
直流换流阀是直流输电的核心设备，换流阀通常由多个组件组成，换流阀组件包括晶闸管组件、阳极电抗器等，晶闸管组件还包括晶闸管、散热器、阻尼电阻、阻尼电容以及与其配套的冷却系统，换流阀结构复杂、零件繁多，在运行过程中会因各种原因发生故障，故障发生后需及时进行检修以尽快恢复换流阀的正常运行，因此在换流阀的设计过程中需要在各环节考虑设备检修的便利性。
目前晶闸管组件内阻尼电阻主要有两种形式，第一种：阻尼电阻为水电阻，阻尼电阻与冷却水直接接触，独立散热，与晶闸管散热器及其冷却水管互不干涉，冷却系统正常运行时，阻尼电阻能够得到良好的散热，但若阻尼电阻异常需要检修时，需要将换流阀内的冷却水全部排出后才能开始检修工作，检修难度大、耗时长；第二种：阻尼电阻为棒电阻，多个棒电阻布置于晶闸管散热器内预先设置的通孔中，阻尼电阻通过晶闸管散热器间接散热，减少了换流阀组件内的接头，但部分棒电阻与晶闸管散热器的冷却水管存在干涉的现象，检修与冷却水管有干涉现象的棒电阻时仍需将换流阀内的冷却水全部排出后才能拆卸冷却水管，检修困难。
发明内容
本发明的目的是提供一种用于直流换流阀的晶闸管组件散热器。
为了达成上述目的，本发明的解决方案是：用于直流换流阀的晶闸管组件散热器，包括散热器，相邻的两个散热器之间用于设置一个晶闸管；其特征在于：所述散热器包括壳体，所述壳体上部设有上水口，下部设有下水口，上水口和下水口之间设有用于放置阻尼电阻的散热器壳体内通孔；第N个散热器的下水口与第N-2个散热器的下水口通过管道连通，第N个散热器的上水口与第N+2个散热器的上水口通过管道连通，或者第N个散热器的上水口与第N-2个散热器的上水口通过管道连通，第N个散热器的下水口与第N+2个散热器的下水口通过管道连通，N≥3,且N为奇数；第M个散热器的下水口与第M-2个散热器的下水口通过管道连通，第M个散热器的上水口与第M+2个散热器的上水口通过管道连通，或者第M个散热器的上水口与第M-2个散热器的上水口通过管道连通，第M个散热器的下水口与第M+2个散热器的下水口通过管道连通，M≥4且M为偶数；最后两个散热器的上水口之间通过管道连通。
作为本发明进一步改进的技术方案，第N个散热器与第N-2个散热器通过垂直管道连通，第N个散热器与第N+2个散热器也通过垂直管道连通。
作为本发明进一步改进的技术方案，所述垂直水管包括一个纵管和两个相平行的横管；所述横管一端与散热器连通，另一端与纵管连通。
作为本发明进一步改进的技术方案，第M个散热器与第M-2个散热器通过弯管连通，第M个散热器与第M+2个散热器也通过弯管连通；所述弯管包括直管和与直管相连通并且位于直管两端的弯管。
作为本发明进一步改进的技术方案，所述弯管包括第一横管、斜管和第二横管；第一横管、斜管和第二横管依次相连通，并且第一横管和第二横管相平行。
采用上述方案后，本发明具有以下有益效果：
1)阻尼电阻布置于晶闸管散热器内，减少冷却系统接头，降低泄漏风险，提高换流阀运行可靠性。
2)布置于晶闸管散热器内的阻尼电阻与散热器水管互不干涉，检修阻尼电阻时不需拆卸水管，降低了晶闸管组件的检修难度、减少检修时间。
附图说明
图1为本发明的结构示意图。
图2为本发明的直管结构示意图。
图3为本发明的弯管结果示意图。
具体实施方式
下面结合附图和具体实施例对本发明的技术方案进一步详细阐述。
实施例1
参见图1、图2和图3，本用于直流换流阀的晶闸管组件散热器，包括散热器2，相邻的两个散热器2之间用于设置一个晶闸管1；所 述散热器2包括壳体，所述壳体上部设有上水口3，下部设有下水口4，上水口3和下水口4之间设有用于放置阻尼电阻的散热器壳体内通孔5-10；第1个散热器2的下水口4与第3个散热器2的下水口4通过管道11连通，第3个散热器2的上水口3与第5个散热器2的上水口3通过管道连通，第5个散热器2的下水口4与第7个散热器2的下水口4通过管道11连通；第2个散热器2的下水口4与第4个散热器2的下水口4通过管道连通，第4个散热器2的上水口3与第6个散热器2的上水口3通过管道连通，第6个散热器2的下水口4与第8个散热器2的下水口4通过管道连通；最后两个散热器2的上水口3之间通过管道连通。
作为优选方案，奇数散热器之间通过垂直水管11连通；所述垂直水管11包括一个纵管15和两个相平行的横管14；所述横管14一端与散热器连通，另一端与纵管15连通。
偶数散热器之间通过弯管12连通；所述弯管12包括直管19和与直管19相连通并且位于直管19两端的弯管。所述弯管包括第一横管16、斜管17和第二横管18；第一横管16、斜管17和第二横管18依次相连通，并且第一横管16和第二横管18相平行。
所述垂直水管11的横向部分14的长度为所述弯管12的第一横管16、第二弯管18、斜管17的长度和。
以上实施例仅为说明本发明的技术思想，不能以此限定本发明的保护范围，凡是按照本发明提出的技术思想，在技术方案基础上所做的任何改动，均落入本发明保护范围之内。

Claims (5)

  1. 一种用于直流换流阀的晶闸管组件散热器，包括散热器，相邻的两个散热器之间用于设置一个晶闸管；其特征在于：
    所述散热器包括壳体，所述壳体上部设有上水口，下部设有下水口，上水口和下水口之间设有用于放置阻尼电阻的散热器壳体内通孔；
    第N个散热器的下水口与第N-2个散热器的下水口通过管道连通，第N个散热器的上水口与第N+2个散热器的上水口通过管道连通，或者第N个散热器的上水口与第N-2个散热器的上水口通过管道连通，第N个散热器的下水口与第N+2个散热器的下水口通过管道连通，N≥3,且N为奇数；
    第M个散热器的下水口与第M-2个散热器的下水口通过管道连通，第M个散热器的上水口与第M+2个散热器的上水口通过管道连通，或者第M个散热器的上水口与第M-2个散热器的上水口通过管道连通，第M个散热器的下水口与第M+2个散热器的下水口通过管道连通，M≥4且M为偶数；
    最后两个散热器的上水口之间通过管道连通。
  2. 根据权利要求1所述的用于直流换流阀的晶闸管组件散热器，其特征在于：第N个散热器与第N-2个散热器通过垂直管道连通，第N个散热器与第N+2个散热器也通过垂直管道连通。
  3. 根据权利要求2所述的用于直流换流阀的晶闸管组件散热器，其特征在于：所述垂直水管包括一个纵管和两个相平行的横管；所述横管一端与散热器连通，另一端与纵管连通。
  4. 根据权利要求1所述的用于直流换流阀的晶闸管组件散热器，其特征在于：第M个散热器与第M-2个散热器通过弯管连通，第M 个散热器与第M+2个散热器也通过弯管连通；所述弯管包括直管和与直管相连通并且位于直管两端的弯管。
  5. 根据权利要求4所述的用于直流换流阀的晶闸管组件散热器，其特征在于：所述弯管包括第一横管、斜管和第二横管；第一横管、斜管和第二横管依次相连通，并且第一横管和第二横管相平行。
PCT/CN2016/089942 2015-07-28 2016-07-13 用于直流换流阀的晶闸管组件散热器 WO2017016390A1 (zh)

Priority Applications (9)

Application Number Priority Date Filing Date Title
BR112018001502-4A BR112018001502B1 (pt) 2015-07-28 2016-07-13 Radiador de conjunto de tiristor para válvula conversora de dc
JP2018517397A JP6352580B1 (ja) 2015-07-28 2016-07-13 Ｄｃコンバータバルブのためのサイリスタアセンブリラジエータ
RU2018105991A RU2660293C1 (ru) 2015-07-28 2016-07-13 Тиристорный радиатор в сборе для предохранительного клапана постоянного тока
CA2992842A CA2992842C (en) 2015-07-28 2016-07-13 Thyristor assembly radiator for dc converter valve
MX2018001178A MX2018001178A (es) 2015-07-28 2016-07-13 Montaje de radiador de tiristor para valvula convertidora de corriente directa.
EP16829756.2A EP3316293B1 (en) 2015-07-28 2016-07-13 Thyristor assembly radiator for dc converter valve
AU2016300491A AU2016300491B2 (en) 2015-07-28 2016-07-13 Thyristor assembly radiator for DC converter valve
KR1020187004543A KR101916914B1 (ko) 2015-07-28 2016-07-13 직류 컨버터 밸브용 사이리스터 어셈블리 라디에이터
US15/747,769 US10141243B2 (en) 2015-07-28 2016-07-13 Thyristor assembly radiator for DC converter valve

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EP3316293A1 (en) 2018-05-02
AU2016300491A1 (en) 2018-02-22
JP2018525847A (ja) 2018-09-06
US20180218965A1 (en) 2018-08-02
JP6352580B1 (ja) 2018-07-04
CA2992842C (en) 2020-03-10
KR101916914B1 (ko) 2018-11-08
EP3316293B1 (en) 2021-06-16
BR112018001502B1 (pt) 2022-07-19
RU2660293C1 (ru) 2018-07-05
KR20180027592A (ko) 2018-03-14
US10141243B2 (en) 2018-11-27
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