WO2016203914A1 - 研磨材及び研磨材の製造方法 - Google Patents
研磨材及び研磨材の製造方法 Download PDFInfo
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- WO2016203914A1 WO2016203914A1 PCT/JP2016/065327 JP2016065327W WO2016203914A1 WO 2016203914 A1 WO2016203914 A1 WO 2016203914A1 JP 2016065327 W JP2016065327 W JP 2016065327W WO 2016203914 A1 WO2016203914 A1 WO 2016203914A1
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- polishing
- abrasive
- polishing layer
- layer
- abrasive grains
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
- B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
Definitions
- the present invention relates to an abrasive and a method for producing the abrasive.
- the present invention has been made in view of such disadvantages, and an object of the present invention is to provide an abrasive that is excellent in polishing rate and flattening accuracy and whose polishing rate does not easily decrease over a relatively long period of time.
- the invention made to solve the above problems includes a base material, a polishing layer laminated on the surface side of the base material and containing abrasive grains and its binder, and an adhesive layer laminated on the back surface side of the base material.
- the abrasive grains are diamond abrasive grains
- the abrasion amount of the polishing layer by the Taber abrasion test is 0.03 g or more and 0.18 g or less
- Asker measured from the surface side of the polishing layer is 80 ° or more and 98 ° or less.
- the abrasive has an Asker D hardness measured from the surface side of the polishing layer within the above range and the abrasive grains are diamond abrasive grains, the hardness is excellent in polishing rate and planarization accuracy. Further, since the abrasive has the abrasion amount of the polishing layer in the above range determined by the Taber abrasion test, new abrasive grains are likely to be exposed on the surface of the polishing layer, and the polishing rate is difficult to decrease over a relatively long period of time. . Therefore, the abrasive is excellent in polishing efficiency because the frequency of dressing can be reduced while achieving both excellent polishing rate and flattening accuracy.
- the main component of the binder is preferably an inorganic substance.
- a binder containing an inorganic substance as a main component is excellent in holding power of abrasive grains, and the abrasive grains are difficult to fall off. For this reason, a polishing rate is further raised by making the main component of the said binder into an inorganic substance.
- the binder preferably contains a filler mainly composed of an inorganic oxide. As described above, when the binder has a filler mainly composed of an inorganic oxide, the elastic modulus of the binder is improved and the abrasion of the polishing layer can be easily controlled.
- the polishing layer may have a plurality of grooves on the surface.
- the above polishing layer may be formed by a printing method.
- a printing method By forming the polishing layer by the printing method in this way, since the abrasive grains are easily exposed on the surface of the polishing layer when the polishing layer is formed, an excellent polishing rate can be realized from the start of use.
- the abrasive is suitably used for planar polishing of a substrate such as glass.
- a method for producing a polishing material comprising a layer, comprising the step of forming the polishing layer by printing the polishing layer composition, wherein the polishing layer composition has diamond abrasive grains, and the polishing layer forming step And forming a polishing layer having an abrasion amount of 0.03 g or more and 0.18 g or less by the Taber abrasion test and an Asker D hardness of 80 ° or more and 98 ° or less measured from the surface side of the polishing layer.
- the polishing layer composition has diamond abrasive grains, and the Asker D hardness measured from the surface side of the polishing layer in the polishing layer forming step is within the above range. Since the polishing layer having the abrasion amount within the above range is formed, it is possible to produce an abrasive that is excellent in polishing rate and flattening accuracy, and in which the polishing rate does not easily decrease over a relatively long period of time. Further, in the method for producing an abrasive, the abrasive layer is formed by printing the abrasive layer composition, so that abrasive grains are easily exposed on the surface of the abrasive layer when the abrasive layer is formed.
- the polishing material manufactured by the manufacturing method of the polishing material can realize an excellent polishing rate from the beginning of use. Furthermore, the manufacturing method of the said abrasive
- polishing material has good manufacturing efficiency, since a polishing layer is formed by printing of the composition for polishing layers.
- the “Asker D hardness” was measured with an Asker D rubber hardness meter in accordance with JIS-K-6253: 2012 in a state where an abrasive having a base material, an abrasive layer and an adhesive layer was fixed to a support. Value.
- the “wear amount” a test piece (average diameter 104 mm, average thickness 300 ⁇ m) was prepared, and the above test piece was used under the conditions of wear wheel H-18, load 4.9 N (500 gf) using a Taber abrasion tester. Is a value obtained by measuring the mass difference between the test pieces before and after 320 rotations.
- the “main component” is a component having the largest content, for example, a component having a content of 50% by mass or more.
- the polishing material of the present invention has an excellent polishing rate and flattening accuracy, and the polishing rate does not easily decrease over a relatively long period of time.
- FIG. 1B is a schematic cross-sectional view taken along line AA in FIG. 1A.
- FIG. 1B is a schematic cross-sectional view taken along line AA in FIG. 1A.
- [Abrasive] 1A and 1B includes a base material 10, a polishing layer 20 laminated on the front surface side of the base material 10, and an adhesive layer 30 laminated on the back surface side of the base material 10. . Further, the abrasive 1 includes a support 40 laminated via the adhesive layer 30 and a second adhesive layer 31 laminated on the back side of the support 40.
- the substrate 10 is a member for supporting the polishing layer 20.
- the shape of the base material 10 is a plate shape.
- the base material 10 Although it does not specifically limit as a material of the base material 10, Polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyimide (PI), polyethylene naphthalate (PEN), aramid, aluminum, copper etc. are mentioned. . Among these, aluminum having good adhesion to the polishing layer 20 is preferable. Moreover, the process which improves adhesiveness, such as a chemical process, a corona process, and a primer process, may be performed on the surface of the base material 10.
- PET Polyethylene terephthalate
- PP polypropylene
- PE polyethylene
- PI polyimide
- PEN polyethylene naphthalate
- aramid aluminum, copper etc.
- aluminum having good adhesion to the polishing layer 20 is preferable.
- the process which improves adhesiveness such as a chemical process, a corona process, and a primer process, may be performed on the surface of the base material 10.
- the base material 10 may have flexibility or ductility.
- the polishing material 1 follows the surface shape of the glass substrate, and the contact area between the polishing surface and the glass substrate is increased, so that the polishing rate is further increased.
- the material of the flexible base material 10 include PET and PI.
- aluminum, copper, etc. can be mentioned as a material of the base material 10 which has ductility.
- the shape and size of the substrate 10 are not particularly limited, for example, a square shape with one side of 140 mm or more and 160 mm or less, or an annular shape with an outer diameter of 600 mm or more and 650 mm or less and an inner diameter of 200 mm or more and 250 mm or less.
- the structure by which the several base material 10 juxtaposed on the plane is supported by a single support body may be sufficient.
- the average thickness of the substrate 10 is not particularly limited, but can be, for example, 75 ⁇ m or more and 1 mm or less.
- the average thickness of the base material 10 is less than the above lower limit, the strength and flatness of the abrasive 1 may be insufficient.
- the average thickness of the base material 10 exceeds the above upper limit, the abrasive 1 is unnecessarily thick and may be difficult to handle.
- the polishing layer 20 includes abrasive grains 21 and a binder 22 thereof.
- the polishing layer 20 has a plurality of grooves 23 on the surface.
- the polishing layer 20 is divided into a plurality of regions (convex portions 24) by the grooves 23.
- the average thickness of the polishing layer 20 (average thickness of only the convex portion 24 portion) is not particularly limited, but the lower limit of the average thickness of the polishing layer 20 is preferably 100 ⁇ m, and more preferably 130 ⁇ m.
- the upper limit of the average thickness of the polishing layer 20 is preferably 1000 ⁇ m, and more preferably 800 ⁇ m.
- the average thickness of the polishing layer 20 is less than the above lower limit, the durability of the polishing layer 20 may be insufficient.
- the average thickness of the polishing layer 20 exceeds the upper limit, the abrasive 1 is unnecessarily thick and may be difficult to handle.
- the lower limit of the abrasion amount by the Taber abrasion test of the polishing layer 20 is 0.03 g, more preferably 0.06 g, and further preferably 0.12 g.
- the upper limit of the abrasion amount by the Taber abrasion test of the polishing layer 20 is 0.18 g, more preferably 0.17 g, and further preferably 0.16 g.
- the abrasion amount by the Taber abrasion test of the polishing layer 20 exceeds the upper limit, the abrasion of the polishing layer 20 at the time of polishing the glass substrate is accelerated, and the durability of the abrasive 1 may be insufficient.
- the polishing layer 20 may be formed by a printing method. By forming the polishing layer 20 by the printing method in this way, the abrasive grains 21 are easily exposed on the surface of the polishing layer 20 when the polishing layer 20 is formed. Therefore, polishing is performed from the start of use of the abrasive 1 for polishing the glass substrate. Excellent rate.
- the abrasive grain 21 is a diamond abrasive grain.
- the diamond abrasive grains may be single crystal or polycrystal, or may be diamond that has been subjected to treatment such as Ni coating.
- the lower limit of the average particle diameter of the abrasive grains 21 is preferably 2 ⁇ m and more preferably 5 ⁇ m.
- the upper limit of the average particle diameter of the abrasive grains 21 is preferably 50 ⁇ m and more preferably 40 ⁇ m.
- the average particle diameter of the abrasive grains 21 is less than the above lower limit, the polishing rate at the time of polishing the glass substrate may be insufficient.
- the average particle diameter of the abrasive grains 21 exceeds the above upper limit, the flattening accuracy of the glass substrate polishing may be insufficient.
- the “average particle size” refers to a 50% value (50% particle size, D50) of a volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
- the upper limit of the content of the abrasive grains 21 with respect to the polishing layer 20 is preferably 55% by volume, and more preferably 35% by volume.
- polishing layer 20 of the abrasive grain 21 is less than the said minimum, there exists a possibility that the grinding
- the content of the abrasive grains 21 with respect to the polishing layer 20 exceeds the above upper limit, the polishing layer 20 may be difficult to hold the abrasive grains 21.
- binder Although the main component of the binder 22 is not specifically limited, For example, it can be made into an inorganic substance or resin.
- the resin examples include resins such as polyurethane, polyphenol, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacryl, acrylic ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, and polyamide.
- resins such as polyurethane, polyphenol, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacryl, acrylic ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, and polyamide.
- polyacryl, epoxy, polyester, and polyurethane which are easy to ensure good adhesion to the substrate 10, are preferable.
- at least a part of the resin may be crosslinked.
- Examples of the inorganic substance include silicate, phosphate, and polyvalent metal alkoxide.
- the main component of the binder 22 is preferably an inorganic substance, and among them, a silicate that is excellent in the holding power of the abrasive grains 21 is preferable.
- silicates include sodium silicate and potassium silicate.
- the binder 22 may contain a filler mainly composed of an inorganic oxide.
- the binder 22 since the binder 22 has the filler which has an inorganic oxide as a main component, the elasticity modulus of the binder 22 improves and it is easy to control abrasion of the polishing layer 20.
- the inorganic oxide examples include oxides such as alumina, silica, cerium oxide, magnesia, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. These may be used independently and may be used in combination of 2 or more type as needed. Among these, alumina that can provide excellent polishing power is preferable.
- the average particle diameter of the filler depends on the average particle diameter of the abrasive grains 21, but can be, for example, 0.01 ⁇ m or more and 20 ⁇ m or less.
- the average particle diameter of the filler is less than the lower limit, the elastic modulus of the binder 22 due to the filler may be reduced, and the wear control of the polishing layer 20 may be insufficient.
- the average particle diameter of the filler exceeds the upper limit, the filler may hinder the polishing power of the abrasive grains 21.
- the average particle diameter of the filler is preferably smaller than the average particle diameter of the abrasive grains 21.
- the lower limit of the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is preferably 0.1, and more preferably 0.2.
- the upper limit of the ratio of the average particle diameter of the filler to the average particle diameter of the abrasive grains 21 is preferably 0.8, and more preferably 0.6.
- the content of the filler with respect to the polishing layer 20 depends on the content of the abrasive grains 21, the lower limit of the content of the filler with respect to the polishing layer 20 is preferably 15% by volume, more preferably 30% by volume. .
- the upper limit of the content of the filler with respect to the polishing layer 20 is preferably 75% by volume, more preferably 60% by volume.
- the binder 22 may appropriately contain various auxiliary agents such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a coloring agent, additives, and the like according to the purpose.
- auxiliary agents such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoaming agent, and a coloring agent, additives, and the like according to the purpose.
- the grooves 23 are arranged on the surface of the polishing layer 20 in a lattice pattern with equal intervals. That is, the shape of the plurality of convex portions 24 is a regularly arranged block pattern shape.
- the bottom surface of the groove 23 that divides the convex portion 24 is formed by the surface of the base material 10.
- the lower limit of the average width of the grooves 23 is preferably 0.3 mm, and more preferably 0.5 mm.
- the upper limit of the average width of the grooves 23 is preferably 10 mm, and more preferably 8 mm.
- the average width of the groove 23 is less than the above lower limit, the polishing powder generated by polishing may be clogged in the groove 23.
- the average width of the groove 23 exceeds the above upper limit, the glass substrate may be damaged when the glass substrate is polished.
- the average area of convex part 24 As a minimum of the average area of convex part 24, 1 mm 2 is preferred and 2 mm 2 is more preferred. On the other hand, as an upper limit of the average area of the convex part 24, 150 mm ⁇ 2 > is preferable and 130 mm ⁇ 2 > is more preferable. When the average area of the convex portion 24 is less than the above lower limit, the convex portion 24 may be peeled off from the substrate 10. Conversely, when the average area of the convex portions 24 exceeds the above upper limit, the contact area of the polishing layer 20 with the glass substrate becomes too large during the polishing of the glass substrate, and the polishing rate may decrease due to frictional resistance.
- the lower limit of the area occupation ratio of the plurality of convex portions 24 with respect to the entire polishing layer 20 is preferably 5%, and more preferably 10%.
- the upper limit of the area occupation ratio of the plurality of convex portions 24 with respect to the entire polishing layer 20 is preferably 60%, and more preferably 55%.
- the “area of the entire polishing layer” is a concept including the area of the groove of the polishing layer.
- the adhesive layer 30 is a layer for fixing the abrasive 1 to a support 40 for mounting on a polishing apparatus.
- the adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include a reactive adhesive, an instantaneous adhesive, a hot melt adhesive, and an adhesive.
- a pressure-sensitive adhesive is preferable.
- a pressure-sensitive adhesive As the adhesive used for the adhesive layer 30, a pressure-sensitive adhesive is preferable.
- a pressure-sensitive adhesive As the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off and replaced by the support 40, so that the abrasive 1 and the support 40 can be easily reused.
- Such an adhesive is not particularly limited.
- the lower limit of the average thickness of the adhesive layer 30 is preferably 0.05 mm, more preferably 0.1 mm. Moreover, as an upper limit of the average thickness of the contact bonding layer 30, 0.3 mm is preferable and 0.2 mm is more preferable. When the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive force is insufficient, and the abrasive 1 may be peeled off from the support 40. On the other hand, when the average thickness of the adhesive layer 30 exceeds the above upper limit, for example, due to the thickness of the adhesive layer 30, there is a possibility that workability may be deteriorated, for example, when the abrasive 1 is cut into a desired shape.
- the support body 40 is laminated on the back surface side of the base material 10 via the adhesive layer 30 to facilitate handling of the abrasive 1.
- the material of the support 40 examples include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide, and polyethylene terephthalate.
- thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene, and polyvinyl chloride
- engineering plastics such as polycarbonate, polyamide, and polyethylene terephthalate.
- the average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less.
- the strength of the abrasive 1 may be insufficient.
- the average thickness of the support 40 exceeds the upper limit, it may be difficult to attach the support 40 to a polishing apparatus or the flexibility of the support 40 may be insufficient.
- the second adhesive layer 31 is a layer for mounting and fixing the abrasive 1 on a polishing apparatus.
- the second adhesive layer 31 can use the same adhesive as the adhesive layer 30.
- the second adhesive layer 31 can have an average thickness similar to that of the adhesive layer 30.
- the lower limit of Asker D hardness of the abrasive 1 measured from the surface side of the polishing layer 20 is 80 °, more preferably 82 °, and still more preferably 92 °.
- the upper limit of Asker D hardness of the abrasive 1 measured from the surface side of the polishing layer 20 is 98 °, more preferably 97 °, and still more preferably 96 °.
- the polishing layer 20 is not stable in the manner of contact with the glass substrate due to the shape distortion of the polishing layer 20, and the polishing rate is likely to fluctuate every polishing. May become difficult. Conversely, if the Asker D hardness of the abrasive 1 measured from the surface side of the polishing layer 20 exceeds the above upper limit, the glass substrate may be chipped or cracked during polishing of the glass substrate.
- the polishing material 1 is difficult to lower the polishing rate while achieving both excellent polishing rate and flattening accuracy. Therefore, the abrasive 1 can be suitably used for planar polishing of a substrate such as glass.
- the abrasive 1 can be manufactured by a step of preparing a polishing layer composition, a step of forming the polishing layer 20 by printing the polishing layer composition, and a step of laminating the support 40 on the back side of the substrate 10. .
- a polishing layer composition containing a binder 22 forming material mainly composed of an inorganic substance, a filler, and diamond abrasive grains 21 is prepared as a coating liquid.
- a diluent such as water or alcohol is added to control the viscosity and fluidity of the coating solution.
- the coating liquid prepared in the polishing layer composition preparing step is used, and the surface of the substrate 10 is composed of a plurality of convex portions 24 divided by grooves 23 by a printing method.
- a polishing layer 20 is formed.
- a mask having a shape corresponding to the shape of the groove 23 is prepared, and the coating liquid is printed through the mask.
- this printing method for example, screen printing, metal mask printing or the like can be used.
- the polishing layer 20 is formed by heat-dehydrating and heat-curing the printed coating liquid. Specifically, for example, the coating solution is dried at room temperature (25 ° C.) for 30 minutes or longer, dehydrated by heating at 70 ° C. or higher and 90 ° C. or lower for 1 hour, and then heated at 140 ° C. or higher and 160 ° C. or lower.
- the binder 22 is formed by curing in the range of at least 4 hours.
- the abrasion amount of the polishing layer 20 by the Taber abrasion test can be adjusted by, for example, the filler content in the polishing layer composition preparation step. Specifically, in order to increase the abrasion amount by the Taber abrasion test, the filler content may be increased. Further, the Asker D hardness of the abrasive 1 measured from the surface side of the polishing layer 20 can be adjusted by, for example, the average thickness of the polishing layer 20. Specifically, in order to increase Asker D hardness, the thickness of the polishing layer 20 is preferably increased.
- the manufacturing method of the abrasive is such that the amount of wear by the Asker D hardness and Taber abrasion test of the abrasive 1 measured from the surface side of the polishing layer 20 in the polishing layer forming step is predetermined.
- the polishing layer 20 within the range can be formed.
- the support 40 is stacked via the adhesive layer 30 in the support stacking step. Further, the second adhesive layer 31 is attached to the back surface of the support 40. In this way, the abrasive 1 can be manufactured.
- the abrasive 1 has an Asker D hardness measured from the surface side of the polishing layer 20 within a predetermined range and the abrasive grains 21 are diamond abrasive grains, the polishing material 1 is excellent in polishing rate and planarization accuracy. Further, since the abrasive 1 makes the abrasion amount of the abrasive layer 20 in the Taber abrasion test within a predetermined range, new abrasive grains 21 are easily exposed on the surface of the abrasive layer 20, and the polishing rate is maintained for a relatively long period of time. It is hard to decline. Accordingly, the abrasive 1 is excellent in polishing efficiency because the frequency of dressing can be reduced while achieving both excellent polishing rate and flattening accuracy.
- the manufacturing method of the abrasive has good manufacturing efficiency because the polishing layer 20 can be formed by printing the composition for polishing layer.
- the present invention is not limited to the above-described embodiment, and can be implemented in a mode in which various changes and improvements are made in addition to the above-described mode.
- the grooves are formed in a lattice pattern with equal intervals.
- the intervals between the lattices do not have to be equal, and for example, the intervals may be changed between the vertical direction and the horizontal direction.
- the groove interval is different, anisotropy may occur in the polishing, and therefore an equal interval is preferable.
- planar shape of the groove may not be a lattice shape, and may be, for example, a shape in which a polygon other than a quadrangle is repeated, a circular shape, a shape having a plurality of parallel lines, or a concentric shape. .
- the polishing layer has a plurality of grooves
- this groove is not an essential constituent element and can be omitted.
- the abrasive may have a configuration in which an abrasive layer is uniformly laminated on the surface of the base material.
- the method of simultaneously forming the polishing layer and the groove using a mask as a printing method of the polishing layer has been described.
- the polishing layer composition is printed on the entire surface of the substrate, the polishing layer is formed.
- the grooves may be formed by etching or laser processing.
- the polishing layer is formed by a printing method.
- the polishing layer may be formed by other methods such as spray coating or bar coating.
- the adhesive layer is not an essential component and can be omitted.
- the support is not an essential constituent element and can be omitted together with the second adhesive layer.
- Example 1 Diamond abrasive grains ("LS605FN" from Lands) were prepared, and the average particle diameter was measured using "Microtrac MT3300EXII” from Nikkiso Co., Ltd. The average particle diameter of the diamond abrasive grains was 7.5 ⁇ m. The type of diamond in this abrasive grain is treated diamond coated with 55% by mass nickel.
- Sodium silicate as a binder (“No. 3 silicate” from Fuji Chemical Co., Ltd.), the above diamond abrasive grains, and alumina as a filler (Al 2 O 3 , “LA4000” from Pacific Random Co., Ltd., average particle size) 4 ⁇ m) was mixed so that the content of the diamond abrasive grains relative to the polishing layer was 30% by volume and the content of the filler relative to the polishing layer was 40% by volume to obtain a coating solution.
- An aluminum plate having an average thickness of 300 ⁇ m was prepared as a base material, and a polishing layer having grid-like grooves was formed on the surface of the base material by printing using the above coating solution.
- channel was formed in the grinding
- the convex portions which are a plurality of regions whose surfaces are divided by grooves, were square with a side of 3 mm in plan view, and the average thickness of the polishing layer was 300 ⁇ m.
- the convex portions were in a regularly arranged block pattern shape, and the area occupation ratio of the convex portions with respect to the entire polishing layer was 36%.
- the coating solution was dried at room temperature (25 ° C.) for 30 minutes or longer, heated and dehydrated at 80 ° C. for 1 hour or longer, and then cured at 150 ° C. for 2 hours or longer and 4 hours or shorter.
- a hard vinyl chloride resin plate having an average thickness of 1 mm (“SP770” from Takiron Co., Ltd.) is used as a support that supports the substrate and is fixed to the polishing apparatus, and the back surface of the substrate and the surface of the support, The back surface of the support and a surface plate of a polishing machine, which will be described later, were bonded to each other with an adhesive having an average thickness of 130 ⁇ m.
- a double-sided tape (“# 5605HGD” from Sekisui Chemical Co., Ltd.) was used as the adhesive. In this way, an abrasive of Example 1 was obtained.
- Example 2 In the formation of the polishing layer of Example 1, the abrasive material of Example 2 was obtained in the same manner as Example 1 except that the area occupation ratio of the convex portion with respect to the entire polishing layer was 25%.
- Example 3 Diamond abrasive grains ("LS605FN” from Lands) were prepared, and the average particle diameter was measured using "Microtrac MT3300EXII” from Nikkiso Co., Ltd. The average particle diameter of the diamond abrasive grains was 35 ⁇ m. The type of diamond in this abrasive grain is treated diamond coated with 55% by mass nickel.
- Sodium silicate as a binder (“No. 3 sodium silicate” from Fuji Chemical Co., Ltd.), the above diamond abrasive grains, and alumina as a filler (Al 2 O 3 , “LA 1200” from Pacific Random Co., Ltd., average particle size 12 ⁇ m) was mixed, and the content of the diamond abrasive grains with respect to the polishing layer was adjusted to 5% by volume, and the content of the filler with respect to the polishing layer was adjusted to 71% by volume to obtain a coating solution.
- Example 3 The abrasive of Example 3 was obtained in the same manner as Example 1 except that the above coating solution was used.
- Example 4 In the formation of the polishing layer of Example 3, the abrasive material of Example 4 was obtained in the same manner as Example 3 except that the average thickness of the polishing layer was 600 ⁇ m.
- Example 5 Diamond abrasive grains (“EDD-X-UM” manufactured by EID) were prepared, and the average particle diameter was measured using “Microtrac MT3300EXII” manufactured by Nikkiso Co., Ltd. The average particle diameter of the diamond abrasive grains was 11 ⁇ m. The type of diamond in this abrasive grain is polycrystalline diamond.
- Sodium silicate as a binder (“No. 3 silicate” from Fuji Chemical Co., Ltd.), the above diamond abrasive grains, and alumina as a filler (Al 2 O 3 , “LA4000” from Pacific Random Co., Ltd., average particle size) 4 ⁇ m) was mixed, and the content of the diamond abrasive grains in the polishing layer was adjusted to 5% by volume, and the content of the filler in the polishing layer was adjusted to 62.5% by volume to obtain a coating solution.
- Example 5 The abrasive of Example 5 was obtained in the same manner as in Example 1 except that the above coating solution was used.
- Comparative Example 2 was carried out in the same manner as in Example 3 except that an ultra-low hardness gel sheet having an average thickness of 5 mm (“G5VU2” from Kitagawa Industries Co., Ltd.) was used for bonding the back surface of the substrate and the surface of the support. An abrasive was obtained.
- an ultra-low hardness gel sheet having an average thickness of 5 mm (“G5VU2” from Kitagawa Industries Co., Ltd.) was used for bonding the back surface of the substrate and the surface of the support. An abrasive was obtained.
- Comparative Example 3 A polishing material of Comparative Example 3 was obtained in the same manner as in Example 3 except that the coating liquid preparation of Example 3 was prepared so that the content of the filler with respect to the polishing layer was 50% by volume.
- Comparative Example 4 A polishing material of Comparative Example 4 was obtained in the same manner as in Example 3 except that the coating liquid preparation of Example 3 was prepared so that the content of the filler with respect to the polishing layer was 89% by volume.
- a polishing material of Comparative Example 5 was obtained in the same manner as Example 1 except that the above coating solution was used.
- Asker D hardness measurement The Asker D hardness measurement of the abrasive measured from the surface side of the polishing layer was performed for each of the abrasives obtained in Examples 1 to 5 and Comparative Examples 1 to 5 before being attached to the surface plate, that is, the back surface of the base material.
- the support was attached to the substrate through the first adhesive layer, and the second adhesive layer was further attached to the back surface of the support.
- an Asker rubber hardness meter (“D type” manufactured by Kobunshi Keiki Co., Ltd.) was used.
- the polishing rate is the weight change [g] of the substrate before and after polishing, the surface area [cm 2 ] of the glass substrate, the specific gravity [g / cm 3 ] of the glass substrate, and the polishing time [min]. Divided by the calculation.
- the polishing conditions for the glass substrate are as follows.
- “-” of the wear amount means that it has not been measured.
- the “abrasion layer wear” of the polishing rate means that the polishing layer was worn and measurement could not be performed, and the fifth (19) of Comparative Example 1 confirmed that the abrasion layer was worn at the end of the fifth time. means.
- “ ⁇ ” in the polishing rates of Comparative Example 3 and Comparative Example 5 means that the measurement has not been performed.
- the polishing rate was lower than that in Example 3, and the polishing rate ratio with respect to the first time was reduced to 86%. Therefore, the subsequent measurement was not performed.
- Comparative Example 5 the subsequent polishing rate was not performed because the first polishing rate was extremely low.
- “ ⁇ ” of the polishing rate ratio indicates that the polishing rate ratio obtained by dividing the fifth polishing rate by the first polishing rate cannot be calculated because there is no first or / and fifth polishing result. Means that.
- the polishing materials of Examples 1 to 5 have a higher polishing rate ratio than the polishing materials of Comparative Examples 1 to 5, and are close to 100%. That is, it can be seen that a polishing rate equivalent to the first polishing rate was obtained even in the fifth polishing, and that the polishing materials of Examples 1 to 5 maintained the polishing rate even in the fifth polishing. Moreover, when Example 3, Example 4, and Comparative Example 2 with the same amount of wear are compared, it can be seen that Example 3 and Example 4 have a higher polishing rate.
- the abrasives of Examples 1 to 5 were obtained by setting the abrasion amount of the polishing layer in the Taber abrasion test within a predetermined range and the Asker D hardness of the abrasive measured from the surface side of the polishing layer within the predetermined range. It is considered that the polishing rate was high and the polishing rate was maintained even in the fifth polishing.
- the abrasion amount of the polishing layer by the Taber abrasion test is larger than the predetermined range, so that the abrasion of the polishing layer has progressed too much and the abrasion of the polishing layer has occurred. It is done.
- the abrasive of Comparative Example 3 has a polishing layer wear amount smaller than a predetermined range by the Taber abrasion test, so that new abrasive grains are difficult to be exposed on the surface of the polishing layer when polishing the glass substrate, and the polishing rate is lowered. It is thought that occurred.
- the polishing material of Comparative Example 2 does not stabilize the manner in which the polishing layer contacts the glass substrate due to the distortion of the polishing layer. For this reason, it is considered that the polishing rate of the abrasive of Comparative Example 2 changed greatly every time polishing was performed. Further, the abrasive of Comparative Example 5 is considered to have a low polishing rate because the abrasive grains are not diamond abrasive grains.
- the abrasive grains are diamond abrasive grains
- the abrasion amount of the polishing layer by the Taber abrasion test is within a predetermined range
- the Asker D hardness of the abrasive measured from the surface side of the polishing layer is within the predetermined range. It can be said that the abrasives 1 to 5 are excellent in the polishing rate and are difficult to decrease over a relatively long period of time.
- the polishing rate and the flattening accuracy are excellent, and the polishing rate is difficult to decrease over a relatively long period of time. Accordingly, the abrasive is suitably used for planar polishing of a substrate such as glass.
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Abstract
Description
図1A及び図1Bに示す研磨材1は、基材10と、この基材10の表面側に積層される研磨層20と、上記基材10の裏面側に積層される接着層30とを備える。また、当該研磨材1は上記接着層30を介して積層される支持体40及びその支持体40の裏面側に積層される第二接着層31を備える。
基材10は、研磨層20を支持するための部材である。基材10の形状は板状である。
研磨層20は、砥粒21及びそのバインダー22を含む。また、研磨層20は、表面に複数の溝23を有する。研磨層20は、この溝23により複数の領域(凸状部24)に区分される。
砥粒21は、ダイヤモンド砥粒である。このダイヤモンド砥粒は、単結晶でも多結晶でもよく、またNiコーティング等の処理がされたダイヤモンドであってもよい。
バインダー22の主成分は、特に限定されないが、例えば無機物又は樹脂とすることができる。
溝23は、研磨層20の表面に等間隔の格子状に配設される。すなわち上記複数の凸状部24の形状は、規則的に配列されたブロックパターン状である。また、凸状部24を区分する溝23の底面は、基材10の表面で構成される。
接着層30は、研磨装置に装着するための支持体40に当該研磨材1を固定する層である。
支持体40は、接着層30を介して基材10の裏面側に積層され、当該研磨材1の取扱いを容易とする。
第二接着層31は、当該研磨材1を研磨装置に装着し、固定する層である。
研磨層20の表面側から測定した当該研磨材1のアスカーD硬度の下限としては、80°であり、82°がより好ましく、92°がさらに好ましい。一方、研磨層20の表面側から測定した当該研磨材1のアスカーD硬度の上限としては、98°であり、97°がより好ましく、96°がさらに好ましい。研磨層20の表面側から測定した当該研磨材1のアスカーD硬度が上記下限未満である場合、ガラス基板研磨時に研磨レートが不十分となるおそれがある。また、研磨層20の形状歪みによりガラス基板への研磨層20の当接の仕方が安定せず、研磨毎に研磨レートが変動し易くなるため終了すべき時間を予め決定して研磨をすることが困難となるおそれがある。逆に、研磨層20の表面側から測定した当該研磨材1のアスカーD硬度が上記上限を超える場合、ガラス基板研磨時にガラス基板の欠けや割れ等が発生するおそれがある。
当該研磨材1は、研磨層用組成物を準備する工程、研磨層用組成物の印刷により上記研磨層20を形成する工程及び基材10の裏面側に支持体40を積層する工程により製造できる。
当該研磨材1は、研磨層20の表面側から測定したアスカーD硬度を所定範囲内とし、砥粒21をダイヤモンド砥粒とするので、研磨レート及び平坦化精度に優れる。また、当該研磨材1は、テーバー摩耗試験による研磨層20の摩耗量を所定範囲内とするので、新たな砥粒21が研磨層20表面に露出し易く、比較的長期間に渡り研磨レートが低下し難い。従って、当該研磨材1は、優れた研磨レートと平坦化精度との両立を達成しつつ、ドレスを行う頻度が低減できるため、研磨効率に優れる。
本発明は上記実施形態に限定されるものではなく、上記態様の他、種々の変更、改良を施した態様で実施することができる。
ダイヤモンド砥粒(ランズ社の「LS605FN」)を用意し、日機装株式会社の「MicrotracMT3300EXII」を用いて平均粒子径を計測した。このダイヤモンド砥粒の平均粒子径は7.5μmであった。なお、この砥粒のダイヤモンドの種類は55質量%ニッケルコーティングされた処理ダイヤモンドである。
実施例1の研磨層の形成において、凸状部の研磨層全体に対する面積占有率を25%とした以外は、実施例1と同様にして実施例2の研磨材を得た。
ダイヤモンド砥粒(ランズ社の「LS605FN」)を用意し、日機装株式会社の「MicrotracMT3300EXII」を用いて平均粒子径を計測した。このダイヤモンド砥粒の平均粒子径は35μmであった。なお、この砥粒のダイヤモンドの種類は55質量%ニッケルコーティングされた処理ダイヤモンドである。
実施例3の研磨層の形成において、研磨層の平均厚さを600μmとした以外は、実施例3と同様にして実施例4の研磨材を得た。
ダイヤモンド砥粒(EID社の「EDD-X-UM」)を用意し、日機装株式会社の「MicrotracMT3300EXII」を用いて平均粒子径を計測した。このダイヤモンド砥粒の平均粒子径は11μmであった。なお、この砥粒のダイヤモンドの種類は多結晶ダイヤモンドである。
実施例3の塗工液調製において、ダイヤモンド砥粒の研磨層に対する含有量が5体積%及び充填剤の研磨層に対する含有量が71体積%となるようバインダーとしてのケイ酸カリウム(富士化学株式会社の「1号ケイ酸カリウム」)を水で希釈して調製した。上記以外は、実施例3と同様にして比較例1の研磨材を得た。
基材の裏面と支持体の表面との貼り合わせに、平均厚さ5mmの超低硬度ゲルシート(北川工業株式会社の「G5VU2」)を用いた以外は、実施例3と同様にして比較例2の研磨材を得た。
実施例3の塗工液調製において、充填剤の研磨層に対する含有量が50体積%となるよう調製した以外は、実施例3と同様にして比較例3の研磨材を得た。
実施例3の塗工液調製において、充填剤の研磨層に対する含有量が89体積%となるように調製した以外は、実施例3と同様にして比較例4の研磨材を得た。
バインダーとしてのケイ酸ナトリウム(富士化学株式会社の「3号ケイ酸ソーダ」)と、砥粒及び充填剤としてのアルミナ(Al2O3、太平洋ランダム株式会社の「LA8000」、平均粒子径30μm)とを混合し、アルミナの研磨層に対する含有量が73体積%となるよう調製し、塗工液を得た。
上記実施例1~5及び比較例1~5で得られた研磨材を用いて、テーバー摩耗試験による磨耗評価、硬度測定、及び研磨レートの算出を行った。評価結果を表1に示す。
テーバー磨耗試験による磨耗評価では、上記実施例1~5及び比較例1~5で得られた研磨材ごとに、試験片(平均直径104mm、平均厚さ300μm)を用意した。この試験片をテーバー摩耗試験機(Taber Instrument社の「MODEL174」)を用いて摩耗輪H-18、荷重4.9N(500gf)の条件で320回転し摩耗させた。この320回転前後の試験片の質量差[g]を測定し、磨耗量[g]とした。
研磨層の表面側から測定した研磨材のアスカーD硬度測定は、上記実施例1~5及び比較例1~5で得られた研磨材ごとに、定盤に貼り付ける前、すなわち基材の裏面に第一接着層を介して支持体を貼り付け、さらにその支持体の裏面にさらに第二接着層を貼り付けた状態で行った。測定には、アスカーゴム硬度計(高分子計器社の「D型」)を用いた。
研磨レートは、ガラス基板の研磨1回毎に、研磨前後の基板の重量変化[g]を、ガラス基板の表面積[cm2]、ガラス基板の比重[g/cm3]及び研磨時間[分]で除し、算出した。なお、ガラス基板の研磨条件は以下の通りである。
ガラス基板には、直径6.25cm、比重2.4の3枚のソーダライムガラス(平岡特殊硝子製作株式会社製)を用いた。また、研磨には、市販の両面研磨機(日本エンギス株式会社「EJD-5B-3W」)を用いた。両面研磨機のキャリアは、厚さ0.4mmのエポキシガラスである。研磨は、研磨圧力を150g/cm2とし、上定盤回転数60rpm、下定盤回転数90rpm及びSUNギア回転数10rpmの条件で15分間を5回続けて行った。その際、クーラントとして、パレス化学株式会社の「LAP-P―32」を毎分120cc供給した。
10 基材
20 研磨層
21 砥粒
22 バインダー
23 溝
24 凸状部
30 接着層
31 第二接着層
40 支持体
Claims (7)
- 基材と、この基材の表面側に積層され、砥粒及びそのバインダーを含む研磨層と、上記基材の裏面側に積層される接着層とを備える研磨材であって、
上記砥粒がダイヤモンド砥粒であり、
テーバー摩耗試験による上記研磨層の摩耗量が0.03g以上0.18g以下であり、
上記研磨層の表面側から測定したアスカーD硬度が80°以上98°以下であることを特徴とする研磨材。 - 上記バインダーの主成分が無機物である請求項1に記載の研磨材。
- 上記バインダーが、無機酸化物を主成分とする充填剤を含有する請求項2に記載の研磨材。
- 上記研磨層が、表面に複数の溝を有する請求項1、請求項2又は請求項3に記載の研磨材。
- 上記研磨層が印刷法により形成される請求項1から請求項4のいずれか1項に記載の研磨材。
- 基板の平面研磨に用いられる請求項1から請求項5のいずれか1項に記載の研磨材。
- 基材と、この基材の表面側に積層され、砥粒及びそのバインダーを含む研磨層と、上記基材の裏面側に積層される接着層とを備える研磨材の製造方法であって、
研磨層用組成物の印刷により上記研磨層を形成する工程を備え、
上記研磨層用組成物がダイヤモンド砥粒を有し、
上記研磨層形成工程で、テーバー摩耗試験による研磨層の摩耗量が0.03g以上0.18g以下であり、研磨層の表面側から測定したアスカーD硬度が80°以上98°以下である研磨層を形成することを特徴とする研磨材の製造方法。
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