Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
  • H01G2/02—Mountings
  • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
  • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/005—Electrodes
  • H01G4/012—Form of non-self-supporting electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
  • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Definitions

• aspects of the present disclosure relate to semiconductor devices, and more particularly to a capacitor structure for power delivery applications.
• the process flow for semiconductor fabrication of integrated circuits may include front-end-of-line (FEOL), middle-of-line (MOL), and back-end-of-line (BEOL) processes.
• the front-end-of-line process may include wafer preparation, isolation, well formation, gate patterning, spacer, extension and source/drain implantation, silicide formation, and dual stress liner formation.
• the middle-of-line process may include gate contact formation.
• Middle-of-line layers may include, but are not limited to, middle-of- line contacts, vias or other layers within close proximity to the semiconductor device transistors or other like active devices.
• the back-end-of-line process may include a series of wafer processing steps for interconnecting the semiconductor devices created during the front-end-of-line and middle-of-line processes. Successful fabrication of modern semiconductor chip products involves an interplay between the materials and the processes employed.
• a power delivery network supplies power to the various components of the overall system.
• a power delivery network may include a voltage regulator module that regulates voltage for a component. Resonance in a power delivery network is undesirable. Suppressing resonance in a power delivery network may be performed using a capacitor.
• SMT Surface mount technology
• a passive discrete device may include a first asymmetric terminal and a second asymmetric terminal.
• the passive discrete device may further include first internal electrodes extended to electrically couple to a first side and a second side of the first asymmetric terminal.
• the passive discrete device may also include second internal electrodes extended to electrically couple to a first side and a second side of the second asymmetric terminal.
• a method of fabricating a passive discrete device may include plating first internal electrodes and second internal electrodes within a multilayer ceramic body. The method may also include dipping the multilayer ceramic body at a non-orthogonal angle to define a first asymmetric terminal and a second asymmetric terminal. The method may further include plating the first asymmetric terminal to electrically couple the first internal electrodes at a first side and a second side of the first asymmetric terminal. The method may further include plating the second asymmetric terminal to electrically couple the second internal electrodes at a first side and a second side of the second asymmetric terminal.
• a passive discrete device may include a first asymmetric terminal and a second asymmetric terminal.
• the passive discrete device may further include a first means for electrically coupling to a first side and a second side of the first asymmetric terminal.
• the passive discrete device may also include a second means for electrically coupling to a first side and a second side of the second asymmetric terminal.
• FIGURE 1 illustrates a perspective view of a semiconductor wafer in an aspect of the present disclosure.
• FIGURE 2 illustrates a cross-sectional view of a die in accordance with an aspect of the present disclosure.
• FIGURES 3 A and 3B illustrate various views of a multilayer ceramic passive discrete device.
• FIGURES 4A to 4E illustrate various views of a passive discrete device with a modified internal/external electrode structure according to aspects of the present disclosure.
• FIGURE 5 further illustrates the passive discrete device of FIGURES 4A to 4E at various stages of fabrication according to aspects of the present disclosure.
• FIGURE 6 is a process flow diagram illustrating a method for fabricating a passive discrete device according to an aspect of the present disclosure.
• FIGURE 7 is a block diagram showing an exemplary wireless communication system in which a configuration of the disclosure may be advantageously employed.
• FIGURE 8 is a block diagram illustrating a design workstation used for circuit, layout, and logic design of a semiconductor component according to one configuration.
• a power delivery network supplies power to the various components of the overall system.
• a power delivery network may include a voltage regulator module that regulates voltage for a component. Suppressing resonance in a power delivery network may be performed using a capacitor.
• SMT surface mount technology
• capacitors may reduce power delivery network resonance/noise in high power, system on chip devices, such as application processors and graphics processors.
• a capacitor is an example of an electrical device used to store energy (e.g., charge) in an electrical field between closely spaced capacitor plates according to a capacitance value. This capacitance value provides a measure of the amount of charge stored by the capacitor at a certain voltage.
• capacitors are also useful as electronic filters because they enable differentiation between high frequency and low frequency signals.
• An exemplary capacitor for suppressing resonance in a power delivery network is a multilayer ceramic chip capacitor (MLCC).
• MLCC multilayer ceramic chip capacitor
• This type of capacitor includes alternating ceramic and conductive material (e.g., metal) layers that are stacked to form a multilayer chip.
• An MLCC may exhibit increased inductance when operating above a self-resonance frequency. This increased inductance, however, is undesirable in power delivery networks.
• an MLCC with less inductive (e.g., lower equivalent series inductance (ESL)) and more capacitive (higher capacitance) characteristics is desirable for improving a decoupling effect in power delivery networks.
• ESL equivalent series inductance
• One aspect of the present disclosure relates to a passive discrete device with a modified internal/external electrode structure that reduces equivalent series inductance and increases capacitance.
• the reduced equivalent series inductance and increased capacitance are provided by extended, internal electrodes that are better able to confine an electric field between the electrodes.
• terminals of the multilayer ceramic capacitor device are modified to hold the extended internal electrodes. That is, the terminals of the device are each extended on one side for increasing overall electrical contact. The increased contact is with an extended area of the internal electrodes.
• Various aspects of the disclosure provide techniques for fabrication of a passive discrete device having a modified internal/external electrode structure.
• the process flow for semiconductor fabrication of the passive discrete device may include front-end- of-line (FEOL) processes, middle-of-line (MOL) processes, and back-end-of-line (BEOL) processes.
• FEOL front-end- of-line
• MOL middle-of-line
• BEOL back-end-of-line
• layer includes film and is not to be construed as indicating a vertical or horizontal thickness unless otherwise stated.
• the term “substrate” may refer to a substrate of a diced wafer or may refer to a substrate of a wafer that is not diced.
• the terms chip and die may be used interchangeably unless such interchanging would tax credulity.
• a passive discrete device includes a first asymmetric terminal and a second asymmetric terminal.
• the passive discrete device also includes first internal electrodes that are extended to electrically couple to a first side and a second side of the first asymmetric terminal.
• the passive discrete device further includes second internal electrodes that are extended to electrically couple to a first side and a second side of the second
• first and second terminals exhibit an asymmetric shape because they are modified to hold the extended first and second internal electrodes.
• the first asymmetric terminal and the second asymmetric terminal may be extended on one side to enable electrical coupling to an extended area of the first and second internal electrodes.
• FIGURE 1 illustrates a perspective view of a semiconductor wafer in an aspect of the present disclosure.
• a wafer 100 may be a semiconductor wafer, or may be a substrate material with one or more layers of semiconductor material on a surface of the wafer 100.
• the wafer 100 may be grown from a seed crystal using the Czochralski process, where the seed crystal is dipped into a molten bath of semiconductor material and slowly rotated and removed from the bath. The molten material then crystalizes onto the seed crystal in the orientation of the crystal.
• the wafer 100 may be a compound material, such as gallium arsenide (GaAs) or gallium nitride (GaN), a ternary material such as indium gallium arsenide (InGaAs), quaternary materials, or any material that can be a substrate material for other semiconductor materials. Although many of the materials may be crystalline in nature, polycrystalline or amorphous materials may also be used for the wafer 100.
• the wafer 100 may be supplied with materials that make the wafer 100 more conductive.
• a silicon wafer may have phosphorus or boron added to the wafer 100 to allow for electrical charge to flow in the wafer 100.
• These additives are referred to as dopants, and provide extra charge carriers (either electrons or holes) within the wafer 100 or portions of the wafer 100.
• the wafer 100 has an orientation 102 that indicates the crystalline orientation of the wafer 100.
• the orientation 102 may be a flat edge of the wafer 100 as shown in FIGURE 1, or may be a notch or other indicia to illustrate the crystalline orientation of the wafer 100.
• the orientation 102 may indicate the Miller Indices for the planes of the crystal lattice in the wafer 100.
• the wafer 100 is divided up along dicing lines 104.
• the dicing lines 104 indicate where the wafer 100 is to be broken apart or separated into pieces.
• the dicing lines 104 may define the outline of the various integrated circuits that have been fabricated on the wafer 100.
• the wafer 100 may be sawn or otherwise separated into pieces to form the die 106.
• Each of the die 106 may be an integrated circuit with many devices or may be a single electronic device.
• the physical size of the die 106 which may also be referred to as a chip or a semiconductor chip, depends at least in part on the ability to separate the wafer 100 into certain sizes, as well as the number of individual devices that the die 106 is designed to contain.
• the die 106 may be mounted into packaging to allow access to the devices and/or integrated circuits fabricated on the die 106.
• Packaging may include single in-line packaging, dual in-line packaging, motherboard packaging, flip-chip packaging, indium dot/bump packaging, or other types of devices that provide access to the die 106.
• the die 106 may also be directly accessed through wire bonding, probes, or other connections without mounting the die 106 into a separate package.
• FIGURE 2 illustrates a cross-sectional view of a die 106 in accordance with an aspect of the present disclosure.
• a substrate 200 which may be a semiconductor material and/or may act as a mechanical support for electronic devices.
• the substrate 200 may be a doped semiconductor substrate, which has either electrons (designated N-channel) or holes (designated P-channel) charge carriers present throughout the substrate 200. Subsequent doping of the substrate 200 with charge carrier ions/atoms may change the charge carrying capabilities of the substrate 200.
• a substrate 200 e.g., a semiconductor substrate
• wells 202 and 204 which may be the source and/or drain of a field-effect transistor (FET), or wells 202 and/or 204 may be fin structures of a fin structured FET (FinFET).
• Wells 202 and/or 204 may also be other devices (e.g., a resistor, a capacitor, a diode, or other electronic devices) depending on the structure and other characteristics of the wells 202 and/or 204 and the surrounding structure of the substrate 200.
• the semiconductor substrate may also have a well 206 and a well 208.
• the well 208 may be completely within the well 206, and, in some cases, may form a bipolar junction transistor (BJT).
• BJT bipolar junction transistor
• the well 206 may also be used as an isolation well to isolate the well 208 from electric and/or magnetic fields within the die 106.
• Layers may be added to the die 106.
• the layer 210 may be, for example, an oxide or insulating layer that may isolate the wells (e.g., 202-208) from each other or from other devices on the die 106.
• the layer 210 may be silicon dioxide, a polymer, a dielectric, or another electrically insulating layer.
• the layer 210 may also be an interconnection layer, in which case it may comprise a conductive material such as copper, tungsten, aluminum, an alloy, or other conductive or metallic materials.
• the layer 212 may also be a dielectric or conductive layer, depending on the desired device characteristics and/or the materials of the layers (e.g., 210 and 214).
• the layer 214 may be an encapsulating layer, which may protect the layers (e.g., 210 and 212), as well as the wells 202-208 and the substrate 200, from external forces.
• the layer 214 may be a layer that protects the die 106 from mechanical damage, or the layer 214 may be a layer of material that protects the die 106 from electromagnetic or radiation damage.
• Electronic devices designed on the die 106 may comprise many features or structural components.
• the die 106 may be exposed to any number of methods to impart dopants into the substrate 200, the wells 202-208, and, if desired, the layers (e.g., 210-214).
• the die 106 may be exposed to ion implantation, deposition of dopant atoms that are driven into a crystalline lattice through a diffusion process, chemical vapor deposition, epitaxial growth, or other methods.
• the substrate 200, the wells 202-208, and the layers may be selectively removed or added through various processes.
• Chemical wet etching, chemical mechanical planarization (CMP), plasma etching, photoresist masking, damascene processes, and other methods may create the structures and devices of the present disclosure.
• FIGURES 3A and 3B illustrate various views of a passive discrete device 300.
• FIGURE 3A illustrates a perspective view of the passive discrete device 300 including layers of capacitor plates (e.g., 320) that are alternatingly coupled to external terminals (e.g., 310).
• the capacitor plates (e.g., 320) may be surrounded by a dielectric material (e.g., a multilayer ceramic body 302).
• the passive discrete device 300 may store energy (e.g., charge) in an electrical field between the capacitor plates (e.g., 320) according to a capacitance value.
• the passive discrete device 300 is also useful as an electronic filter by enabling differentiation between high frequency and low frequency signals.
• FIGURE 3B illustrates various views of the passive discrete device 300.
• the passive discrete device 300 may be used for suppressing resonance in a power delivery network when arranged as a multilayer ceramic capacitor (MLCC) device.
• the passive discrete device 300 includes a first symmetric terminal 310A, a second symmetric terminal 310B and a multilayer ceramic body 302.
• the passive discrete device 300 includes alternating ceramic and conductive material (e.g., metal) layers that are stacked to form a multilayer chip.
• first inner electrodes 320A are electrically coupled (e.g., shorted) at one end to the first symmetric terminal 310A.
• second inner electrodes 320B are electrically coupled (e.g., shorted) at one end to the second symmetric terminal 310B.
• the first inner electrodes 320A are electrically coupled to only a first side 312A of the first symmetric terminal 310A.
• the second inner electrodes 320B are electrically coupled to only a second side 312B of the second symmetric terminal 310B.
• the first symmetric terminal 310A and the second symmetric terminal 310B are of equal length.
• This arrangement of the passive discrete device 300 may exhibit increased inductance when operating above a self-resonance frequency. This increased inductance, however, is undesirable in power delivery networks.
• a passive discrete device with less inductive (e.g., lower equivalent series inductance (ESL)) and more capacitive (higher capacitance) characteristics is desirable for improving a decoupling effect in power delivery networks.
• FIGURES 4A to 4E illustrate various views of a passive discrete device with a modified internal/external electrode structure according to aspects of the present disclosure.
• a passive discrete device 400 includes a first asymmetric terminal 410A, a second asymmetric terminal 410B and a multilayer ceramic body 402 to conform with the modified internal/external electrode structure shown, for example, in FIGURES 4B to 4E.
• the modified internal/external electrode structure can provide reduced equivalent series inductance (ESL) and increased capacitance.
• ESL equivalent series inductance
• the reduced equivalent series inductance and increased capacitance are provided by extending internal electrodes to provide an extended area that improves confinement of an electric field between the internal electrodes.
• a first asymmetric terminal 410A includes a second side 414Athat is longer than a
• the second side 414A of the first asymmetric terminal 41 OA is lengthened to hold an extended area of a first internal electrode 420A. That is, the first asymmetric terminal 41 OA of the passive discrete device 400 is extended on one side to enable electrical coupling to an extended area of the first internal electrode 420A, for example, as shown in the side view of FIGURE 4D.
• FIGURE 4C is a top view further illustrating the passive discrete device 400 with a modified internal/external electrode structure according to aspects of the present disclosure.
• the passive discrete device 400 includes a first internal electrode 420 A that is extended to electrically couple to a portion 418A of a first side 412A and a second side 414A of the first asymmetric terminal 410A.
• the passive discrete device 400 also includes a second internal electrode 420B that is also extended to electrically couple to a portion 418B of a first side 412B and a second side 414B of the second asymmetric terminal 410B.
• the extension of the first internal electrode 420 A and the second internal electrode 420B provides a first extended area 43 OA and a second extended area 430B.
• the first side 414A of the first asymmetric terminal 410A is extended to electrically couple to the first extended area 43 OA of the first internal electrode 420 A.
• the first side 414B of the second asymmetric terminal 410B is extended to electrically couple to the second extended area 430B of the second internal electrode 420B.
• FIGURE 4E shows a perspective view of the passive discrete device 400 including extended areas of the modified internal electrode structure according to aspects of the present disclosure.
• the first extended area 430A and second extended area 430B may enhance an electrical field formed between the first internal electrode 420 A and the second internal electrode 420B.
• the first inner electrodes 320 A only contact the first side 312A of the first symmetric terminal 31 OA; and the second inner electrodes 320B only contact the first side 312B of the second symmetric terminal 310B.
• the passive discrete device 300 FIGURE 3B may exhibit increased inductance (e.g., increased equivalent series inductance (ESL)) when operating above a self-resonance frequency, which is undesirable in power delivery networks.
• ESL equivalent series inductance
• This ESL may be substantially decreased (e.g., a 30%) by the first extended area 430A and the second extended area 430B of the passive discrete device 400 shown in FIGURE 4E.
• FIGURE 5 is a diagram illustrating a process 500 for fabricating a passive discrete device according to aspects of the disclosure.
• a first internal electrode 420A and a second internal electrode 420B are plated within ceramic layers 404.
• the first internal electrode 420A and the second internal electrode 420B are printed on one of the ceramic layers 404 (e.g., a first ceramic layer or a second ceramic layer) using a conductive material (e.g., a nickel (Ni) alloy).
• the modified stencil is expanded to enable printing of the first extended area 43 OA and the second extended area 430B of the internal electrodes.
• the ceramic layer may be stacked with other ones of the ceramic layers 404, then laminated and cut to form multiple multilayer ceramic bodies.
• a sintering process forms a multilayer ceramic body 402.
• the terminal formation process is modified to provide electrical coupling to the extended areas (e.g., the first extended area 430A and the second extended area 430B) using a symmetric structure for the terminals.
• a termination dipping process is performed at a non-orthogonal angle (e.g., 45°) to define a first asymmetric terminal 41 OA and a second asymmetric terminal 410B.
• the multilayer ceramic body 402 is dipped into a conductive solution (e.g., Ni, Tin) at the non-orthogonal angle to conform with the extended areas of the extended internal electrodes.
• a conductive solution e.g., Ni, Tin
• a termination plating process is performed to complete the first asymmetric terminal 410A, which is plated to electrically couple to the first internal electrode 420 A at a first side and a second side of the first asymmetric terminal 41 OA.
• the second asymmetric terminal 410B is plated to electrically couple to the second internal electrode 420B at a first side and a second side of the second asymmetric terminal 410B.
• the first asymmetric terminal 410A and the second asymmetric terminal 410B may be plated with a copper (Cu) alloy.
• testing of the passive discrete device is performed.
• the passive discrete device 400 is provided with a modified internal/external electrode structure that reduces equivalent series inductance and increased capacitance.
• the reduced equivalent series inductance and increased capacitance are provided by extended, internal electrodes (e.g., the first extended area 430A and the second extended area 430B) that improve confinement of an electric field between the internal electrodes (e.g., 420A and 420B).
• the terminals (e.g., 41 OA and 41 OB) of the passive discrete device 400 are modified to hold the extended internal electrodes (e.g., 420A and 420B).
• the terminals e.g., 410A and 410B
• the terminals are extended on one side to enable electrical coupling to an extended area (e.g., 430A and 430B) of the internal electrodes (e.g., 420Aand 420B).
• FIGURE 6 is a flow diagram illustrating a method 600 for fabricating a passive discrete device according to aspects of the disclosure.
• a first internal electrode and a second internal electrode are plated within a multilayer ceramic body.
• a first internal electrode 420A and a second internal electrode 420B are plated on one of the ceramic layers 404.
• a printing stencil is modified to enable printing of extended areas (e.g., 430A and 430B) of the internal electrodes.
• This ceramic layer may be stacked with other ones of the ceramic layers 404, then laminated and cut to form multiple multilayer ceramic bodies.
• the multilayer ceramic body is dipped at a non-orthogonal angle to define a first asymmetric terminal and a second asymmetric terminal.
• the multilayer ceramic body 402 is dipped into a solution at a non-orthogonal angle (e.g., 45°) to define the first asymmetric terminal 410A and the second asymmetric terminal 410B.
• the first asymmetric terminal is plated to electrically couple the first internal electrodes at a first side and a second side of the first asymmetric terminal.
• the second asymmetric terminal is plated to electrically couple the second internal electrodes at a first side and a second side of the second asymmetric terminal.
• the first internal electrode 420A is electrically coupled (e.g., shorted) to the first side 412A and the second side 414B of the first asymmetric terminal 41 OA.
• the second internal electrode 420B is electrically coupled (e.g., shorted) to the first side 412B and the second side 414B of the second asymmetric terminal 410B.
• a first extended area 430A of the first internal electrode 420 A and a second extended area 43 OB of the second internal electrode 420B enable improved confinement of an electrical field between, for example, the first internal electrode 420 A and the second internal electrode 420B.
• a passive discrete device in one configuration, includes a first asymmetric terminal and a second asymmetric terminal.
• the passive discrete device further includes a first means for electrically coupling to a first side and a second side of the first asymmetric terminal.
• the passive discrete device also includes a second means for electrically coupling to a first side and a second side of the second asymmetric terminal.
• the first means is the first internal electrode of
• FIGURES 4B to 4E configured to perform the functions recited by the first means.
• the second means is the second internal electrode of FIGURES 4B to 4E, configured to perform the functions recited by the second means.
• the aforementioned means may be a device or any layer configured to perform the functions recited by the aforementioned means.
• An exemplary capacitor for suppressing resonance in a power delivery network is a multilayer ceramic chip capacitor (MLCC).
• MLCC multilayer ceramic chip capacitor
• This type of capacitor includes alternating ceramic and conductive material (e.g., metal) layers that are stacked to form a multilayer chip.
• An MLCC may exhibit increased inductance when operating above a self-resonance frequency. This increased inductance, however, is undesirable in power delivery networks.
• an MLCC with less inductive (e.g., lower equivalent series inductance (ESL)) and more capacitive (higher capacitance) characteristics is desirable for improved a decoupling effect in power delivery networks.
• ESL equivalent series inductance
• FIGURE 7 is a block diagram showing an exemplary wireless communication system 700 in which an aspect of the disclosure may be advantageously employed.
• FIGURE 7 shows three remote units 720, 730, and 750 and two base stations 740. It will be recognized that wireless communication systems may have many more remote units and base stations. Remote units 720, 730, and 750 include IC devices 725A, 725C, and 725B that include the disclosed passive discrete device. It will be recognized that other devices may also include the disclosed passive discrete device, such as the base stations, switching devices, and network equipment. FIGURE 7 shows forward link signals 780 from the base station 740 to the remote units 720, 730, and 750 and reverse link signals 790 from the remote units 720, 730, and 750 to base stations 740.
• IC devices 725A, 725C, and 725B that include the disclosed passive discrete device. It will be recognized that other devices may also include the disclosed passive discrete device, such as the base stations, switching devices, and network equipment.
• FIGURE 7 shows forward link signals 780 from the base station 740 to the remote units 720, 730, and 750 and reverse link signals 790 from the
• remote unit 720 is shown as a mobile telephone
• remote unit 730 is shown as a portable computer
• remote unit 750 is shown as a fixed location remote unit in a wireless local loop system.
• the remote units 720, 730, and 750 may be a mobile phone, a hand-held personal communication systems (PCS) unit, a portable data units such as a personal digital assistant (PDA), a GPS enabled device, a navigation device, a set top box, a music player, a video player, an
• PDA personal digital assistant
• FIGURE 7 illustrates remote units according to the aspects of the disclosure, the disclosure is not limited to these exemplary illustrated units. Aspects of the disclosure may be suitably employed in many devices, which include the disclosed devices.
• FIGURE 8 is a block diagram illustrating a design workstation used for circuit, layout, and logic design of a semiconductor component, such as the devices disclosed above.
• a design workstation 800 includes a hard disk 802 containing operating system software, support files, and design software such as Cadence or OrCAD.
• the design workstation 800 also includes a display 804 to facilitate design of a circuit 806 or a semiconductor component 808 such as a passive discrete device.
• the 810 is provided for tangibly storing the design of the circuit 806 or the semiconductor component 808.
• the design of the circuit 806 or the semiconductor component 808 may be stored on the storage medium 810 in a file format such as GDSII or GERBER.
• the storage medium 810 may be a CD-ROM, DVD, hard disk, flash memory, or other appropriate device. Furthermore, the design workstation 800 includes a drive apparatus 812 for accepting input from or writing output to the storage medium 810.
• Data recorded on the storage medium 810 may specify logic circuit
• the data may further include logic verification data such as timing diagrams or net circuits associated with logic
• Providing data on the storage medium 810 facilitates the design of the circuit 806 or the semiconductor component 808 by decreasing the number of processes for designing semiconductor wafers.
• the methodologies may be implemented with modules (e.g., procedures, functions, and so on) that perform the functions described herein.
• a machine-readable medium tangibly embodying instructions may be used in implementing the methodologies described herein.
• software codes may be stored in a memory and executed by a processor unit.
• Memory may be implemented within the processor unit or external to the processor unit.
• the term "memory" refers to types of long term, short term, volatile, nonvolatile, or other memory and is not to be limited to a particular type of memory or number of memories, or type of media upon which memory is stored.
• the functions may be stored as one or more instructions or code on a computer-readable medium. Examples include computer-readable media encoded with a data structure and computer-readable media encoded with a computer program.
• Computer-readable media includes physical computer storage media. A storage medium may be an available medium that can be accessed by a computer.
• such computer- readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer; disk and disc, as used herein, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD) and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
• instructions and/or data may be provided as signals on transmission media included in a communication apparatus.
• a communication apparatus may include a transceiver having signals indicative of instructions and data. The instructions and data are configured to cause one or more processors to implement the functions outlined in the claims.
• DSP digital signal processor
• ASIC application specific integrated circuit
• FPGA field programmable gate array
• a general- purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine.
• a processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
• a software module may reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
• An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium.
• the storage medium may be integral to the processor.
• the processor and the storage medium may reside in an ASIC.
• the ASIC may reside in a user terminal.
• the processor and the storage medium may reside as discrete components in a user terminal.
• the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium.
• Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another.
• a storage media may be any available media that can be accessed by a general purpose or special purpose computer.
• such computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store specified program code means in the form of instructions or data structures and that can be accessed by a general-purpose or special-purpose computer, or a general-purpose or special-purpose processor. Also, any connection is properly termed a computer-readable medium.
• Disk and disc includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD) and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer- readable media.

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