CN107690688A - 具有不对称端子的电容器结构 - Google Patents

具有不对称端子的电容器结构 Download PDF

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Publication number
CN107690688A
CN107690688A CN201680033348.8A CN201680033348A CN107690688A CN 107690688 A CN107690688 A CN 107690688A CN 201680033348 A CN201680033348 A CN 201680033348A CN 107690688 A CN107690688 A CN 107690688A
Authority
CN
China
Prior art keywords
asymmetric terminal
asymmetric
internal electrodes
discrete device
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680033348.8A
Other languages
English (en)
Chinese (zh)
Inventor
Y·K·宋
H·B·蔚
K-P·黄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN107690688A publication Critical patent/CN107690688A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN201680033348.8A 2015-06-10 2016-05-18 具有不对称端子的电容器结构 Pending CN107690688A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/736,219 US10079097B2 (en) 2015-06-10 2015-06-10 Capacitor structure for power delivery applications
US14/736,219 2015-06-10
PCT/US2016/033038 WO2016200574A1 (en) 2015-06-10 2016-05-18 Capacitor structure with asymmetric terminals

Publications (1)

Publication Number Publication Date
CN107690688A true CN107690688A (zh) 2018-02-13

Family

ID=56101792

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680033348.8A Pending CN107690688A (zh) 2015-06-10 2016-05-18 具有不对称端子的电容器结构

Country Status (6)

Country Link
US (1) US10079097B2 (enExample)
EP (1) EP3308389A1 (enExample)
JP (1) JP2018523299A (enExample)
KR (1) KR20180017012A (enExample)
CN (1) CN107690688A (enExample)
WO (1) WO2016200574A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102869401B1 (ko) * 2021-12-13 2025-10-16 주식회사 아모텍 세라믹 커패시터 및 이의 제조방법
KR102812724B1 (ko) * 2022-01-19 2025-05-27 주식회사 아모텍 세라믹 커패시터 및 그 제조방법
WO2025142270A1 (ja) * 2023-12-29 2025-07-03 パナソニックＩｐマネジメント株式会社 抵抗器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049038A (ja) * 1998-07-31 2000-02-18 Kyocera Corp 積層セラミックコンデンサ
JP2003257784A (ja) * 2002-02-28 2003-09-12 Tdk Corp 電子部品
US20080074826A1 (en) * 2006-09-22 2008-03-27 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
CN100576380C (zh) * 2002-03-07 2009-12-30 Tdk株式会社 陶瓷电子元件、浆涂方法及浆涂装置
CN101752084A (zh) * 2008-11-27 2010-06-23 株式会社村田制作所 电子部件以及电子部件内置基板
CN104051155A (zh) * 2013-03-14 2014-09-17 三星电机株式会社 嵌入式多层陶瓷电子元件和具有该电子元件的印刷电路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190063U (ja) * 1984-05-28 1985-12-16 関西日本電気株式会社 角チツプ部品
JPS61144812A (ja) * 1984-12-19 1986-07-02 株式会社村田製作所 積層セラミツクコンデンサの容量調整方法
JPH06260377A (ja) * 1993-02-12 1994-09-16 Sumitomo Metal Ind Ltd チップ形電子部品の端子電極形成方法
JP3771308B2 (ja) * 1996-02-13 2006-04-26 コーア株式会社 チップインダクタの製造方法
JPH11204367A (ja) * 1998-01-19 1999-07-30 Murata Mfg Co Ltd チップ状電子部品およびその製造方法
EP1179826A1 (en) 2000-07-12 2002-02-13 Littelfuse Ireland Development Company Limited An integrated passive device and a method for producing such a device
JP2004039937A (ja) * 2002-07-04 2004-02-05 Tdk Corp セラミック電子部品
DE102007044604A1 (de) 2007-09-19 2009-04-09 Epcos Ag Elektrisches Vielschichtbauelement
JP4370352B2 (ja) 2007-10-31 2009-11-25 Ｔｄｋ株式会社 積層コンデンサ
DE102011014965B4 (de) 2011-03-24 2014-11-13 Epcos Ag Elektrisches Vielschichtbauelement

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049038A (ja) * 1998-07-31 2000-02-18 Kyocera Corp 積層セラミックコンデンサ
JP2003257784A (ja) * 2002-02-28 2003-09-12 Tdk Corp 電子部品
CN100576380C (zh) * 2002-03-07 2009-12-30 Tdk株式会社 陶瓷电子元件、浆涂方法及浆涂装置
US20080074826A1 (en) * 2006-09-22 2008-03-27 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
CN101752084A (zh) * 2008-11-27 2010-06-23 株式会社村田制作所 电子部件以及电子部件内置基板
CN104051155A (zh) * 2013-03-14 2014-09-17 三星电机株式会社 嵌入式多层陶瓷电子元件和具有该电子元件的印刷电路板

Also Published As

Publication number Publication date
JP2018523299A (ja) 2018-08-16
KR20180017012A (ko) 2018-02-20
US10079097B2 (en) 2018-09-18
US20160365196A1 (en) 2016-12-15
EP3308389A1 (en) 2018-04-18
WO2016200574A1 (en) 2016-12-15

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180213