JP2018523299A - 電力送達用途のためのコンデンサ構造 - Google Patents
電力送達用途のためのコンデンサ構造 Download PDFInfo
- Publication number
- JP2018523299A JP2018523299A JP2017563315A JP2017563315A JP2018523299A JP 2018523299 A JP2018523299 A JP 2018523299A JP 2017563315 A JP2017563315 A JP 2017563315A JP 2017563315 A JP2017563315 A JP 2017563315A JP 2018523299 A JP2018523299 A JP 2018523299A
- Authority
- JP
- Japan
- Prior art keywords
- asymmetric terminal
- discrete device
- terminal
- internal electrodes
- passive discrete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/736,219 US10079097B2 (en) | 2015-06-10 | 2015-06-10 | Capacitor structure for power delivery applications |
| US14/736,219 | 2015-06-10 | ||
| PCT/US2016/033038 WO2016200574A1 (en) | 2015-06-10 | 2016-05-18 | Capacitor structure with asymmetric terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018523299A true JP2018523299A (ja) | 2018-08-16 |
| JP2018523299A5 JP2018523299A5 (enExample) | 2018-11-22 |
Family
ID=56101792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017563315A Pending JP2018523299A (ja) | 2015-06-10 | 2016-05-18 | 電力送達用途のためのコンデンサ構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10079097B2 (enExample) |
| EP (1) | EP3308389A1 (enExample) |
| JP (1) | JP2018523299A (enExample) |
| KR (1) | KR20180017012A (enExample) |
| CN (1) | CN107690688A (enExample) |
| WO (1) | WO2016200574A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025142270A1 (ja) * | 2023-12-29 | 2025-07-03 | パナソニックIpマネジメント株式会社 | 抵抗器 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102869401B1 (ko) * | 2021-12-13 | 2025-10-16 | 주식회사 아모텍 | 세라믹 커패시터 및 이의 제조방법 |
| KR102812724B1 (ko) * | 2022-01-19 | 2025-05-27 | 주식회사 아모텍 | 세라믹 커패시터 및 그 제조방법 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190063U (ja) * | 1984-05-28 | 1985-12-16 | 関西日本電気株式会社 | 角チツプ部品 |
| JPS61144812A (ja) * | 1984-12-19 | 1986-07-02 | 株式会社村田製作所 | 積層セラミツクコンデンサの容量調整方法 |
| JPH06260377A (ja) * | 1993-02-12 | 1994-09-16 | Sumitomo Metal Ind Ltd | チップ形電子部品の端子電極形成方法 |
| JPH09219333A (ja) * | 1996-02-13 | 1997-08-19 | Koa Corp | チップインダクタおよびその製造方法 |
| JPH11204367A (ja) * | 1998-01-19 | 1999-07-30 | Murata Mfg Co Ltd | チップ状電子部品およびその製造方法 |
| JP2000049038A (ja) * | 1998-07-31 | 2000-02-18 | Kyocera Corp | 積層セラミックコンデンサ |
| JP2003257784A (ja) * | 2002-02-28 | 2003-09-12 | Tdk Corp | 電子部品 |
| JP2004039937A (ja) * | 2002-07-04 | 2004-02-05 | Tdk Corp | セラミック電子部品 |
| JP2010129737A (ja) * | 2008-11-27 | 2010-06-10 | Murata Mfg Co Ltd | 電子部品及び電子部品内蔵基板 |
| JP2011054989A (ja) * | 2006-09-22 | 2011-03-17 | Samsung Electro-Mechanics Co Ltd | 積層型チップキャパシタ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1179826A1 (en) | 2000-07-12 | 2002-02-13 | Littelfuse Ireland Development Company Limited | An integrated passive device and a method for producing such a device |
| JP3885938B2 (ja) * | 2002-03-07 | 2007-02-28 | Tdk株式会社 | セラミック電子部品、ペースト塗布方法及びペースト塗布装置 |
| DE102007044604A1 (de) | 2007-09-19 | 2009-04-09 | Epcos Ag | Elektrisches Vielschichtbauelement |
| JP4370352B2 (ja) | 2007-10-31 | 2009-11-25 | Tdk株式会社 | 積層コンデンサ |
| DE102011014965B4 (de) | 2011-03-24 | 2014-11-13 | Epcos Ag | Elektrisches Vielschichtbauelement |
| KR101462767B1 (ko) * | 2013-03-14 | 2014-11-20 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
-
2015
- 2015-06-10 US US14/736,219 patent/US10079097B2/en not_active Expired - Fee Related
-
2016
- 2016-05-18 KR KR1020177035059A patent/KR20180017012A/ko not_active Ceased
- 2016-05-18 WO PCT/US2016/033038 patent/WO2016200574A1/en not_active Ceased
- 2016-05-18 EP EP16727263.2A patent/EP3308389A1/en not_active Withdrawn
- 2016-05-18 JP JP2017563315A patent/JP2018523299A/ja active Pending
- 2016-05-18 CN CN201680033348.8A patent/CN107690688A/zh active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190063U (ja) * | 1984-05-28 | 1985-12-16 | 関西日本電気株式会社 | 角チツプ部品 |
| JPS61144812A (ja) * | 1984-12-19 | 1986-07-02 | 株式会社村田製作所 | 積層セラミツクコンデンサの容量調整方法 |
| JPH06260377A (ja) * | 1993-02-12 | 1994-09-16 | Sumitomo Metal Ind Ltd | チップ形電子部品の端子電極形成方法 |
| JPH09219333A (ja) * | 1996-02-13 | 1997-08-19 | Koa Corp | チップインダクタおよびその製造方法 |
| JPH11204367A (ja) * | 1998-01-19 | 1999-07-30 | Murata Mfg Co Ltd | チップ状電子部品およびその製造方法 |
| JP2000049038A (ja) * | 1998-07-31 | 2000-02-18 | Kyocera Corp | 積層セラミックコンデンサ |
| JP2003257784A (ja) * | 2002-02-28 | 2003-09-12 | Tdk Corp | 電子部品 |
| JP2004039937A (ja) * | 2002-07-04 | 2004-02-05 | Tdk Corp | セラミック電子部品 |
| JP2011054989A (ja) * | 2006-09-22 | 2011-03-17 | Samsung Electro-Mechanics Co Ltd | 積層型チップキャパシタ |
| JP2010129737A (ja) * | 2008-11-27 | 2010-06-10 | Murata Mfg Co Ltd | 電子部品及び電子部品内蔵基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025142270A1 (ja) * | 2023-12-29 | 2025-07-03 | パナソニックIpマネジメント株式会社 | 抵抗器 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180017012A (ko) | 2018-02-20 |
| CN107690688A (zh) | 2018-02-13 |
| US10079097B2 (en) | 2018-09-18 |
| US20160365196A1 (en) | 2016-12-15 |
| EP3308389A1 (en) | 2018-04-18 |
| WO2016200574A1 (en) | 2016-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181009 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181009 |
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| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20181009 |
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| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20181019 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181029 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190603 |