WO2016197686A1 - 触摸屏、其制作方法及显示装置 - Google Patents

触摸屏、其制作方法及显示装置 Download PDF

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Publication number
WO2016197686A1
WO2016197686A1 PCT/CN2016/078828 CN2016078828W WO2016197686A1 WO 2016197686 A1 WO2016197686 A1 WO 2016197686A1 CN 2016078828 W CN2016078828 W CN 2016078828W WO 2016197686 A1 WO2016197686 A1 WO 2016197686A1
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WIPO (PCT)
Prior art keywords
touch
function layer
layer
touch function
frame
Prior art date
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Ceased
Application number
PCT/CN2016/078828
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English (en)
French (fr)
Inventor
邹富伟
胡明
陈军涛
谢涛峰
都智
史文杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/511,205 priority Critical patent/US20170269737A1/en
Publication of WO2016197686A1 publication Critical patent/WO2016197686A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a touch screen, a method for fabricating the same, and a display device.
  • touch screen As an intelligent human-computer interaction interface product, touch screen has been widely used in many fields of social production and life, and it is in the field of consumer electronics (such as smart phones, tablets, etc.). The development is especially rapid. There are many types of touch screen technologies, including resistive, capacitive, infrared, and acoustic waves. Capacitive touch screens are not only responsive, they support multi-touch, but also have a long life. Therefore, with the maturity of control integrated chip technology, capacitive touch screen has become the mainstream technology on the market.
  • the new generation of monolithic touch technology is a new development direction of capacitive touch screens. From a technical point of view, compared to the traditional two-layer tempered glass touch technology, the single-chip touch technology has a simpler product structure and is lighter, thinner and more translucent. Since the glass substrate and the bonding process are omitted, the production cost and the production yield of the product are improved.
  • the current single-chip touch screen mainly has two kinds of black borders and white borders.
  • the structure of a typical black-frame monolithic touch screen is formed by first forming a touch function layer on the tempered glass, and forming a black ink frame on the top of the touch function layer; then fabricating a via structure using black conductive ink Fill the vias and make the bonded electrodes; finally connect the flexible board with the integrated chip to the bonded electrodes to form a monolithic touch screen module.
  • the structure of the single-chip touch screen has the advantages of low cost, excellent performance, high production yield and the like.
  • the black border is replaced by a white border, it is difficult to implement the via structure in the module, for the following reasons: 1.
  • the embodiment of the invention provides a touch screen, a manufacturing method thereof and a display device, which are used to solve the problem that the white border structure of the touch screen is difficult to implement in the prior art.
  • the embodiment of the invention provides a touch screen, comprising: a glass substrate, a touch function layer on the glass substrate, a white ink frame on the touch function layer, and a black part partially covering the white ink frame.
  • the via hole is filled with a black conductive ink.
  • the extension portion extends along the touch function layer by a length of no more than 500 micrometers.
  • the thickness of the white ink frame in a direction perpendicular to the touch function layer is 6 micrometers to 8 micrometers.
  • the touch screen provided by the embodiment of the present invention further includes: a flexible circuit board: wherein the flexible circuit board includes an integrated chip, and the flexible circuit board passes through the via and the touch The control function layer is electrically connected.
  • An embodiment of the present invention provides a method for fabricating the above touch screen, including:
  • a via hole for electrically connecting the touch function layer is formed in the extended portion of the formed black ink layer.
  • the step of forming a touch function layer on the glass substrate comprises: forming a touch function layer on the glass substrate by a patterning process .
  • the step of forming a white ink frame on the glass substrate on which the touch function layer is formed specifically includes: forming a white ink frame on the glass substrate on which the touch function layer is formed by a screen printing process.
  • the step of forming a black ink layer on the glass substrate on which the touch function layer and the white ink frame are formed includes Forming, on a glass substrate on which the touch function layer and the white ink frame are formed, a black ink layer by a screen printing process, wherein the black ink layer partially covers the white ink frame and has along the And extending a touch function layer away from the white ink frame; and forming a via hole for electrically connecting the touch function layer by laser etching in the extended portion of the formed black ink layer.
  • a shape of a via hole formed by laser etching in an extended portion of the formed black ink layer is a line type, wherein The linear vias have a length of from 100 micrometers to 300 micrometers and a width of 20 micrometers and 40 micrometers.
  • the step of forming a black ink layer on the glass substrate on which the touch function layer and the white ink frame are formed includes Forming, on a glass substrate on which the touch function layer and the white ink frame are formed, a black ink layer and a via for electrically connecting the touch function layer by a screen printing process; wherein A black ink layer partially covers the white ink frame and has an extension extending away from the white ink frame along the touch function layer, and the via is located in the extension.
  • the via hole formed by the screen printing process has a hole diameter of 100 micrometers to 150 micrometers.
  • the method for fabricating the touch panel provided by the embodiment of the present invention further includes: filling a black conductive ink into the via hole by using a screen printing process.
  • the embodiment of the invention provides a display device, which comprises the above touch screen provided by the embodiment of the invention.
  • Embodiments of the present invention provide a touch screen, a manufacturing method thereof, and a display device.
  • the touch screen comprises: a glass substrate, a touch function layer on the glass substrate, a white ink frame on the touch function layer, and a black ink layer partially covering the white ink frame;
  • the black ink layer has an extension extending away from the white ink frame along the touch function layer, and the extension has a via for electrically connecting the touch function layer.
  • an electrical connection to the touch function layer is achieved by adding a black ink layer to the white ink frame and making a via structure on the extension of the black ink layer.
  • Such a touch screen structure not only has the advantages of low cost, excellent performance, high productivity, and the like of the black frame single-chip touch screen, but also avoids the problem that the white frame touch screen is difficult to realize the via structure. Therefore, the optical density value of the white border is increased, and the appearance expression of the product is further improved.
  • FIG. 1 is a schematic structural diagram of a touch screen according to an embodiment of the present invention.
  • FIG. 2 is a second schematic structural diagram of a touch screen according to an embodiment of the present invention.
  • FIG. 3 is a flowchart of a method for manufacturing a touch screen according to an embodiment of the present invention.
  • the embodiment of the present invention provides a touch screen, as shown in FIG. 1 and FIG. 2, comprising: a glass substrate 1, a touch function layer 2 on the glass substrate 1, and a white ink frame 3 on the touch function layer 2. And a black ink layer 4 partially covering the white ink frame 3; wherein the black ink layer 4 has an extension extending away from the white ink frame 3 along the touch function layer 2, and the extension portion has a function for electrically connecting the touch function layer 2 vias 5.
  • the touch screen provided by the embodiment of the invention includes: a glass substrate 1, a touch function layer 2 on the glass substrate 1, a white ink frame 3 on the touch function layer 2, and a black ink layer partially covering the white ink frame 3. 4; wherein the black ink layer 4 has an extension extending away from the white ink frame 3 along the touch function layer 2, and the extension has a via 5 for electrically connecting the touch function layer 2, such that the ink is passed through the white A black ink layer is added to the frame, and a via structure is formed on the extension of the black ink layer to realize electrical connection with the touch function layer.
  • Such a touch screen structure not only has the advantages of low cost, excellent performance, high productivity, and the like of the black frame single-chip touch screen, but also avoids the problem that the white frame touch screen is difficult to realize the via structure. Therefore, the optical contrast of the white border is improved The degree, and in turn, improves the appearance of the product.
  • the via hole is filled with black conductive ink.
  • the via hole formed in the extension portion of the black ink layer is filled with the black conductive ink.
  • the extension portion extends along the touch function layer by a length of no more than 500 micrometers.
  • a black ink layer is added on the white ink frame, and the black ink layer has an extension extending away from the white ink frame along the touch function layer.
  • the extension is used to fabricate a via structure, and the extension extends along the length of the touch function layer by no more than 500 microns, thus avoiding affecting the aperture ratio of the display area.
  • the thickness of the white ink frame in a direction perpendicular to the touch function layer is 6 micrometers to 8 micrometers.
  • a white ink frame is disposed on the touch function layer.
  • a via structure is disposed in a frame region of the touch screen structure.
  • a black ink layer is disposed on the white ink frame, and the black ink layer has an extension extending away from the white ink frame along the touch function layer, wherein the via structure Set in the extension.
  • a laser etching process or a screen printing process may be employed.
  • the frame structure should not be too thick. Therefore, the thickness of the white ink frame is set to 6 micrometers to 8 micrometers, which facilitates the implementation of the via process.
  • the touch screen provided by the embodiment of the present invention may further include: a flexible circuit board 6; wherein the flexible circuit board 6 includes an integrated chip, and the flexible circuit board 6 passes through the via 5 and the touch function.
  • Layer 2 is electrically connected.
  • the flexible circuit board 6 with the integrated chip and the touch function layer 2 are electrically connected to form a completed touch module. Structure and realize the touch function of the touch screen.
  • the via structure is filled with black conductive ink, and a bonded electrode is fabricated, in which the flexible circuit board 6 with the integrated chip is fabricated. It is connected to the bonding electrode, and is electrically connected to the touch function layer through the via hole.
  • an embodiment of the present invention provides a method for fabricating the above touch screen. As shown in FIG. 3, the following steps may be included:
  • a touch function layer is formed on the tempered glass substrate by a patterning process.
  • the film structure of the touch function layer may adopt a transparent conductive film structure, such as an ITO layer, a nano silver wire structure, a metal mesh structure, or a graphene film layer, and the graphic structure of the touch function layer is single-sided multi-touch. structure.
  • a via structure can be realized in the extension of the black ink layer, that is, a via structure is realized on the basis of the white ink frame structure. Therefore, the problem that the touch screen of the self-color frame structure in the prior art is difficult to realize the via structure is solved, and the optical density value of the white frame is also improved, thereby improving the appearance performance of the product.
  • the step S102 may specifically include: forming a white ink frame by using a screen printing process on the glass substrate on which the touch function layer is formed.
  • a white ink frame is formed on the touch function layer by using a screen printing process.
  • the thickness of the white ink frame is controlled to be between 6 microns and 8 microns. In this way, it is convenient to implement the via structure. Therefore, the flexible circuit board with the integrated chip can be electrically connected to the touch function layer through the via hole, thereby finally implementing the touch module structure.
  • the step S103 and the step S104 may specifically include: performing screen printing on the glass substrate on which the touch function layer and the white ink frame are formed.
  • the process forms a black ink layer, wherein the black ink layer partially covers the white ink frame and has a white oil that faces away from the touch function layer
  • An extension of the ink frame extension and a laser etch in the extension of the formed black ink layer to form a via for electrically connecting the touch function layer.
  • a black ink layer can be formed by a screen printing process on a glass substrate on which a touch function layer and a white ink frame are formed, so that the black ink layer partially covers the white color.
  • the ink frame has an extension that extends away from the white ink frame along the touch function layer.
  • a via structure is realized by a laser etching process in the extension of the black ink layer.
  • the shape of the via hole formed by laser etching in the extended portion of the formed black ink layer is a line type, wherein the line type via hole
  • the length is from 100 micrometers to 300 micrometers and the width is from 20 micrometers to 40 micrometers.
  • a via etching structure may be formed in the extension portion of the black ink layer by a laser etching process.
  • the via holes thus formed are in the form of a line, wherein the linear vias have a length of from 100 micrometers to 300 micrometers and a width of from 20 micrometers to 40 micrometers.
  • the binding electrode is fabricated in the via structure, and the flexible circuit board is connected to the bonding electrode, thereby electrically connecting with the touch function layer through the via structure, and finally implementing the touch function of the touch screen.
  • the step S103 and the step S104 may specifically include: performing screen printing on the glass substrate on which the touch function layer and the white ink frame are formed.
  • the process forms a black ink layer and a via for electrically connecting the touch function layer; wherein the black ink layer partially covers the white ink frame and has an extension extending away from the white ink frame along the touch function layer, and the via is located In the extension.
  • the black ink layer and the via structure can be simultaneously formed by a screen printing process. In this way, the black ink layer and the via structure can be formed by one patterning process, thereby facilitating the simplification of the manufacturing process of the touch screen and reducing the production cost.
  • the via hole formed by the screen printing process has a pore diameter of 100 micrometers to 150 micrometers.
  • a black ink layer and a via structure can be simultaneously formed by using a screen printing process.
  • the vias thus formed generally have a pore size of 100.
  • a bonded electrode is fabricated in the formed via structure, and in turn, the flexible circuit board can be attached to the bonded electrode. Thereby, the electrical connection with the touch function layer is realized through the via structure, and finally the touch function of the touch screen is realized.
  • the method for fabricating the touch panel provided by the embodiment of the present invention may further include: filling a black conductive ink into the via hole by using a screen printing process.
  • the flexible circuit board with the integrated chip needs to be electrically connected to the touch function layer.
  • a black conductive ink may be filled in the via hole by a screen printing process, a bonded electrode is formed in the via structure, and the flexible circuit board is attached to the bonded electrode.
  • the through-hole filled with the black conductive ink is electrically connected to the touch function layer, and finally the touch function of the touch screen is realized.
  • an embodiment of the present invention provides a display device, including the above touch screen provided by the embodiment of the present invention.
  • the display device can be applied to any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like. Since the principle of solving the problem is similar to that of the touch screen, the implementation of the display device can be referred to the implementation of the touch screen described above, and the repeated description is omitted.
  • the embodiment of the invention provides a touch screen, a manufacturing method thereof and a display device.
  • the touch screen comprises: a glass substrate, a touch function layer on the glass substrate, a white ink frame on the touch function layer, and a partially covered white ink. a black ink layer of the frame; wherein the black ink layer has an extension extending away from the white ink frame along the touch function layer, and the extension has a via for electrically connecting the touch function layer.
  • an electrical connection to the touch function layer is achieved by adding a black ink layer to the white ink frame and making a via structure on the extension of the black ink layer.
  • Such a touch screen structure not only has the advantages of low cost, excellent performance, high productivity, and the like of the black frame single-chip touch screen, but also avoids the problem that the white frame touch screen is difficult to realize the via structure. Therefore, the optical density value of the white border is increased, and the appearance expression of the product is further improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种触摸屏、其制作方法及包括触摸屏的显示装置。触摸屏包括：玻璃基板(1)，位于玻璃基板(1)上的触控功能层(2)，位于触控功能层(2)上的白色油墨边框(3)，以及部分覆盖白色油墨边框(3)的黑色油墨层(4)；其中，黑色油墨层(4)具有沿着触控功能层(2)背离白色油墨边框(3)延伸的延伸部，并且延伸部具有用于电性连接触控功能层(2)的过孔(5)。这样，通过在白色油墨边框(3)上增加一层黑色油墨层(4)，并且在黑色油墨层(4)的延伸部制作过孔(5)结构，实现了与触控功能层(2)的电性连接。这样的触摸屏结构既兼顾了黑色边框单片式触摸屏的低成本、优良性能、高生产率等优点，同时还避免了白色边框触摸屏难以实现过孔结构的问题。

Description

触摸屏、其制作方法及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种触摸屏、其制作方法及显示装置。
背景技术
触摸屏作为一种智能化的人机交互界面产品，已经在社会生产和生活中的很多领域得到了越来越广泛的应用，而其在消费电子产品领域(如智能手机、平板电脑等领域)中的发展尤其最为迅速。触摸屏技术的种类繁多，主要包括电阻式、电容式、红外式、表声波式等。电容式触摸屏不仅反应灵敏，支持多点触控，而且寿命长。因而，随着控制集成芯片技术的成熟，电容式触摸屏已成为目前市场上的主流技术。
新一代的单片式触控技术是电容式触摸屏的新发展方向。从技术层面来看，相比传统的双层钢化玻璃触控技术而言，单片式触控技术的产品结构更加简单，并且具有更轻、更薄、透光性更好的特点。由于省掉一片玻璃基材以及贴合工序，因而利于降低生产成本、提高产品生产良率。
目前的单片式触摸屏主要有黑色边框和白色边框两种。一般地，典型的黑色边框单片式触摸屏的结构通过以下过程形成：首先在钢化玻璃上制作触控功能层，在触控功能层上方制作黑色油墨边框；然后制作过孔结构，利用黑色导电油墨填充过孔，并制作绑定电极；最后将带有集成芯片的柔性电路板连接到绑定电极，形成单片式触摸屏模组。这种单片式触摸屏的结构具有成本低，性能优良、生产良率高等优点。然而，当将黑色边框换成白色边框时，会很难实现模组中的过孔结构，其原因包括：一、很难找到与白色边框匹配的白色导电油墨(银浆非白色)；二、很难采用激光刻蚀制作过孔，因为白色油墨对激光不敏感；三、如果采用印刷方式制作过孔，则过孔制作良率很难得到保证。由此可知，由于存在上述原因，所以白色边框的触摸屏模组结构中的过孔结构难以实现，因此难以实现触摸屏的白色边框结构。
因此，如何在现有触摸屏结构的基础上，实现触摸屏的白色边框 结构，是本领域技术人员亟待解决的技术问题。
发明内容
本发明实施例提供了一种触摸屏、其制作方法及显示装置，用以解决现有技术中存在的难以实现触摸屏的白色边框结构的问题。
本发明实施例提供了一种触摸屏，包括：玻璃基板，位于所述玻璃基板上的触控功能层，位于所述触控功能层上的白色油墨边框，以及部分覆盖所述白色油墨边框的黑色油墨层；其中，所述黑色油墨层具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部，并且所述延伸部具有用于电性连接所述触控功能层的过孔。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏中，所述过孔填充有黑色导电油墨。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏中，所述延伸部沿着所述触控功能层延伸的长度不大于500微米。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏中，所述白色油墨边框在垂直于所述触控功能层的方向上的厚度为6微米～8微米。
在一种可能的实施方式中，本发明实施例提供的上述触摸屏还包括：柔性电路板：其中，所述柔性电路板包括集成芯片，并且所述柔性电路板通过所述过孔与所述触控功能层电性连接。
本发明实施例提供了一种上述触摸屏的制作方法，包括：
在玻璃基板上形成触控功能层；
在形成有所述触控功能层的玻璃基板上形成白色油墨边框；
在形成有所述触控功能层和所述白色油墨边框的玻璃基板上形成黑色油墨层，其中所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部；以及
在所形成的黑色油墨层的延伸部中形成用于电性连接所述触控功能层的过孔。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的制作方法中，在玻璃基板上形成触控功能层的步骤具体包括：在玻璃基板上，通过构图工艺形成触控功能层。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的 制作方法中，在形成有所述触控功能层的玻璃基板上形成白色油墨边框的步骤具体包括：在形成有所述触控功能层的玻璃基板上，采用丝网印刷工艺形成白色油墨边框。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的制作方法中，在形成有所述触控功能层和所述白色油墨边框的玻璃基板上形成黑色油墨层的步骤具体包括：在形成有所述触控功能层和所述白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层，其中所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部；以及在所形成的黑色油墨层的延伸部中采用激光刻蚀形成用于电性连接所述触控功能层的过孔。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的制作方法中，在所形成的黑色油墨层的延伸部中采用激光刻蚀形成的过孔的形状为线型，其中所述线型过孔的长度为100微米～300微米且宽度为20微米40微米。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的制作方法中，在形成有所述触控功能层和所述白色油墨边框的玻璃基板上形成黑色油墨层的步骤具体包括：在形成有所述触控功能层和所述白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层和用于电性连接所述触控功能层的过孔；其中，所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部，并且所述过孔位于所述延伸部中。
在一种可能的实施方式中，在本发明实施例提供的上述触摸屏的制作方法中，采用丝网印刷工艺形成的过孔的孔径为100微米～150微米。
在一种可能的实施方式中，本发明实施例提供的上述触摸屏的制作方法还包括：采用丝网印刷工艺将黑色导电油墨填充于所述过孔。
本发明实施例提供了一种显示装置，包括本发明实施例提供的上述触摸屏。
本发明实施例提供了一种触摸屏、其制作方法及显示装置。该触摸屏包括：玻璃基板，位于玻璃基板上的触控功能层，位于触控功能层上的白色油墨边框，以及部分覆盖白色油墨边框的黑色油墨层；其 中，黑色油墨层具有沿着触控功能层背离白色油墨边框延伸的延伸部，并且延伸部具有用于电性连接触控功能层的过孔。这样，通过在白色油墨边框上增加一层黑色油墨层，并且在黑色油墨层的延伸部制作过孔结构，实现了与触控功能层的电性连接。这样的触摸屏结构既兼顾了黑色边框单片式触摸屏的低成本、优良性能、高生产率等优点，同时还避免了白色边框触摸屏难以实现过孔结构的问题。因此，提高了白色边框的光学浓度值，并且进而提高了产品的外观表现力。
附图说明
图1为本发明实施例提供的触摸屏的结构示意图之一；
图2为本发明实施例提供的触摸屏的结构示意图之二；以及
图3为本发明实施例提供的触摸屏的制作方法的流程图。
具体实施方式
下面结合附图，对本发明实施例提供的触摸屏、其制作方法及显示装置的具体实施方式进行详细地说明。
附图中各膜层的厚度和区域的大小形状不反映触摸屏各部件的真实比例，其目的只是示意说明本发明内容。
本发明实施例提供了一种触摸屏，如图1和图2所示，包括：玻璃基板1，位于玻璃基板1上的触控功能层2，位于触控功能层2上的白色油墨边框3，以及部分覆盖白色油墨边框3的黑色油墨层4；其中，黑色油墨层4具有沿着触控功能层2背离白色油墨边框3延伸的延伸部，并且延伸部具有用于电性连接触控功能层2的过孔5。
本发明实施例提供的上述触摸屏包括：玻璃基板1，位于玻璃基板1上的触控功能层2，位于触控功能层2上的白色油墨边框3，以及部分覆盖白色油墨边框3的黑色油墨层4；其中黑色油墨层4具有沿着触控功能层2背离白色油墨边框3延伸的延伸部，并且延伸部具有用于电性连接触控功能层2的过孔5，这样，通过在白色油墨边框上增加一层黑色油墨层，并且在黑色油墨层的延伸部制作过孔结构，实现了与触控功能层的电性连接。这样的触摸屏结构既兼顾了黑色边框单片式触摸屏的低成本、优良性能、高生产率等优点，同时还避免了白色边框触摸屏难以实现过孔结构的问题。因此，提高了白色边框的光学浓 度值，并且进而提高了产品的外观表现力。
在具体实施时，在本发明实施例提供的上述触摸屏中，过孔填充有黑色导电油墨。具体地，在本发明实施例提供的上述触摸屏中，为了实现触摸屏结构中的过孔与触控功能层的电性连接，利用黑色导电油墨填充制作在黑色油墨层的延伸部中的过孔，并且制作绑定电极，以用于将柔性电路板连接于绑定电极，由此通过过孔实现与触控功能层电性连接。最终，形成触摸屏模组结构，并且实现触摸屏的触控功能。
在具体实施时，在本发明实施例提供的上述触摸屏中，延伸部沿着触控功能层延伸的长度不大于500微米。具体地，为了实现白色边框的触摸屏结构，在白色油墨边框上增加一层黑色油墨层，并且该黑色油墨层具有沿着触控功能层背离白色油墨边框延伸的延伸部。该延伸部用于制作过孔结构，并且该延伸部沿着触控功能层延伸的长度不大于500微米，因此避免影响显示区域的开口率。
在具体实施时，在本发明实施例提供的上述触摸屏中，白色油墨边框在垂直于触控功能层的方向上的厚度为6微米～8微米。具体地，在本发明实施例提供的上述触摸屏中，为了实现触摸屏的白色边框结构，在触控功能层上设置白色油墨边框。进一步地，为了实现与触控功能层的电性连接，在触摸屏结构的边框区域设置过孔结构。进一步地，为了实现白色油墨边框触摸屏的过孔结构，在白色油墨边框上设置一层黑色油墨层，并且黑色油墨层具有沿着触控功能层背离白色油墨边框延伸的延伸部，其中过孔结构设置于延伸部中。在对延伸部进行过孔工艺时，可以采用激光刻蚀工艺，也可以采用丝网印刷工艺。为了更好地实现过孔工艺，边框结构不能太厚。因此，将白色油墨边框的厚度设置为6微米-8微米，这样便于过孔工艺的实施。
在具体实施时，如图1所示，本发明实施例提供的上述触摸屏还可以包括：柔性电路板6；其中柔性电路板6包括集成芯片，并且柔性电路板6通过过孔5与触控功能层2电性连接。具体地，在本发明实施例提供的上述触摸屏中，为了实现触摸屏的触控功能，将带有集成芯片的柔性电路板6与触控功能层2电性连接，进而组成完成的触控模组结构并且实现触摸屏的触控功能。此时，过孔结构中填充有黑色导电油墨，并且制作有绑定电极，其中带有集成芯片的柔性电路板6 连接于绑定电极，由此通过过孔与触控功能层电性连接。
基于同一发明构思，本发明实施例提供了一种上述触摸屏的制作方法，如图3所示，可以包括以下步骤：
S101、在玻璃基板上形成触控功能层；
S102、在形成有触控功能层的玻璃基板上形成白色油墨边框；
S103、在形成有触控功能层和白色油墨边框的玻璃基板上形成黑色油墨层，其中黑色油墨层部分覆盖白色油墨边框且具有沿着触控功能层背离白色油墨边框延伸的延伸部；以及
S104、在所形成的黑色油墨层的延伸部中形成用于电性连接触控功能层的过孔。
具体地，在本发明实施例提供的上述触摸屏的制作方法中，通过构图工艺在钢化玻璃基板上形成触控功能层。触控功能层的膜层结构可以采用透明导电薄膜结构，例如ITO层、纳米银线结构、金属网格结构，或石墨烯膜层等，并且触控功能层的图形结构为单面多点触摸结构。在形成的触控功能层上形成白色油墨边框，进而在白色油墨边框上形成一层黑色油墨层，其中黑色油墨层部分覆盖白色油墨边框且具有沿着触控功能层背离白色油墨边框延伸的延伸部。这样，在黑色油墨层的延伸部中可以实现过孔结构，即在白色油墨边框结构的基础上实现了过孔结构。因此，解决了现有技术中自色边框结构的触摸屏难以实现过孔结构的问题，同时还提高了白色边框的光学浓度值，进而提高了产品的外观表现力。
在具体实施时，在本发明实施例提供的上述触摸屏的制作方法中，步骤S102可以具体包括：在形成有触控功能层的玻璃基板上，采用丝网印刷工艺形成白色油墨边框。具体地，在本发明实施例提供的上述触摸屏的制作方法中，采用丝网印刷工艺在触控功能层上形成白色油墨边框。一般地，白色油墨边框的膜层厚度控制在6微米-8微米。这样，便于实现过孔结构。由此，带有集成芯片的柔性电路板可以通过过孔与触控功能层电性连接，从而最终实现触控模组结构。
在具体实施时，在本发明实施例提供的上述触摸屏的制作方法中，步骤S103和步骤S104可以具体包括：在形成有所述触控功能层和白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层，其中黑色油墨层部分覆盖白色油墨边框且具有沿着触控功能层背离白色油 墨边框延伸的延伸部；以及在所形成的黑色油墨层的延伸部中采用激光刻蚀形成用于电性连接触控功能层的过孔。具体地，在本发明实施例提供的上述触摸屏的制作方法中，在形成有触控功能层和白色油墨边框的玻璃基板上可以通过丝网印刷工艺制作黑色油墨层，使得黑色油墨层部分覆盖白色油墨边框且具有沿着触控功能层背离白色油墨边框延伸的延伸部。在此之后，在黑色油墨层的延伸部中通过激光刻蚀工艺实现过孔结构。由此，实现了白色边框触摸屏的过孔结构，从而解决了现有技术中自色边框结构的触摸屏难以实现过孔结构的问题，并且同时提高了白色边框的光学浓度值，进而提高了产品的外观表现力。
在具体实施时，在本发明实施例提供的上述触摸屏的制作方法中，在所形成的黑色油墨层的延伸部中采用激光刻蚀形成的过孔的形状为线型，其中线型过孔的长度为100微米-300微米且宽度为20微米-40微米。具体地，在本发明实施例提供的上述触摸屏的制作方法中，可以采用激光刻蚀的工艺在黑色油墨层的延伸部中形成过孔结构。这样形成的过孔的形状为线型，其中线型过孔的长度为100微米-300微米且宽度为20微米-40微米。在过孔结构中制作绑定电极，并且将柔性电路板连接于绑定电极，进而通过过孔结构实现与触控功能层电性连接，并且最终实现触摸屏的触控功能。
在具体实施时，在本发明实施例提供的上述触摸屏的制作方法中，步骤S103和步骤S104可以具体包括：在形成有所述触控功能层和白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层和用于电性连接触控功能层的过孔；其中，黑色油墨层部分覆盖白色油墨边框且具有沿着触控功能层背离白色油墨边框延伸的延伸部，并且过孔位于延伸部中。具体地，在本发明实施例提供的上述触摸屏的制作方法中，可以通过丝网印刷工艺同时形成黑色油墨层和过孔结构。这样，可以通过一次构图工艺形成黑色油墨层和过孔结构，从而有利于简化触摸屏的制作工艺并且降低生产成本。
在具体实施时，在本发明实施例提供的上述触摸屏的制作方法中，采用丝网印刷工艺形成的过孔的孔径为100微米～150微米。具体地，在本发明实施例提供的上述触摸屏的制作方法中，采用丝网印刷工艺可以同时形成黑色油墨层和过孔结构。这样形成的过孔一般孔径为100 微米～150微米。在形成的过孔结构制作绑定电极，并且进而可以将柔性电路板连接于绑定电极。由此，通过过孔结构实现与触控功能层电性连接，并且最终实现触摸屏的触控功能。
在具体实施时，本发明实施例提供的上述触摸屏的制作方法还可以包括：采用丝网印刷工艺将黑色导电油墨填充于过孔。具体地，在本发明实施例提供的上述触摸屏的制作方法中，为了实现触摸屏的触控功能，需要将带有集成芯片的柔性电路板与触控功能层电性连接。此时，可以采用丝网印刷工艺将黑色导电油墨填充于过孔，在过孔结构制作绑定电极，并且将柔性电路板连接于绑定电极。由此，通过填充有黑色导电油墨的过孔实现与触控功能层电性连接，并且最终实现触摸屏的触控功能。
基于同一发明构思，本发明实施例提供了一种显示装置，包括本发明实施例提供的上述触摸屏。该显示装置可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与触摸屏相似，因此该显示装置的实施可以参见上述触摸屏的实施，重复之处不再赘述。
本发明实施例提供了一种触摸屏、其制作方法及显示装置，该触摸屏包括：玻璃基板，位于玻璃基板上的触控功能层，位于触控功能层上的白色油墨边框，以及部分覆盖白色油墨边框的黑色油墨层；其中，黑色油墨层具有沿着触控功能层背离白色油墨边框延伸的延伸部，并且延伸部具有用于电性连接触控功能层的过孔。这样，通过在白色油墨边框上增加一层黑色油墨层，并且在黑色油墨层的延伸部制作过孔结构，实现了与触控功能层的电性连接。这样的触摸屏结构既兼顾了黑色边框单片式触摸屏的低成本、优良性能、高生产率等优点，同时还避免了白色边框触摸屏难以实现过孔结构的问题。因此，提高了白色边框的光学浓度值，并且进而提高了产品的外观表现力。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (14)

  1. 一种触摸屏，包括：玻璃基板，位于所述玻璃基板上的触控功能层，位于所述触控功能层上的白色油墨边框，以及部分覆盖所述白色油墨边框的黑色油墨层；其中，
    所述黑色油墨层具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部，并且
    所述延伸部具有用于电性连接所述触控功能层的过孔。
  2. 如权利要求1所述的触摸屏，其中所述过孔填充有黑色导电油墨。
  3. 如权利要求2所述的触摸屏，其中所述延伸部沿着所述触控功能层延伸的长度不大于500微米。
  4. 如权利要求3所述的触摸屏，其中所述白色油墨边框在垂直于所述触控功能层的方向上的厚度为6微米～8微米。
  5. 如权利要求1-4任一项所述的触摸屏，还包括：柔性电路板；其中，
    所述柔性电路板包括集成芯片，并且所述柔性电路板通过所述过孔与所述触控功能层电性连接。
  6. 一种如权利要求1-5任一项所述的触摸屏的制作方法，包括：
    在玻璃基板上形成触控功能层；
    在形成有所述触控功能层的玻璃基板上形成白色油墨边框；
    在形成有所述触控功能层和白色油墨边框的玻璃基板上形成黑色油墨层，其中所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部；以及
    在所形成的黑色油墨层的延伸部中形成用于电性连接所述触控功能层的过孔。
  7. 如权利要求6所述的触摸屏的制作方法，其中在玻璃基板上形成触控功能层的步骤包括：
    在玻璃基板上，通过构图工艺形成触控功能层。
  8. 如权利要求6所述的触摸屏的制作方法，其中在形成有所述触控功能层的玻璃基板上形成白色油墨边框的步骤包括：
    在形成有所述触控功能层的玻璃基板上，采用丝网印刷工艺形成 白色油墨边框。
  9. 如权利要求6所述的触摸屏的制作方法，其中在形成有所述触控功能层和白色油墨边框的玻璃基板上形成黑色油墨层的步骤包括：
    在形成有所述触控功能层和白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层，其中所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部；以及
    在所形成的黑色油墨层的延伸部中采用激光刻蚀形成用于电性连接所述触控功能层的过孔。
  10. 如权利要求9所述的触摸屏的制作方法，其中在所形成的黑色油墨层的延伸部中采用激光刻蚀形成的过孔的形状为线型，其中所述线型过孔的长度为100微米～300微米且宽度为20微米～40微米。
  11. 如权利要求6所述的触摸屏的制作方法，其中在形成有所述触控功能层和白色油墨边框的玻璃基板上形成黑色油墨层的步骤包括：
    在形成有所述触控功能层和白色油墨边框的玻璃基板上，通过丝网印刷工艺形成黑色油墨层和用于电性连接所述触控功能层的过孔；其中，
    所述黑色油墨层部分覆盖所述白色油墨边框且具有沿着所述触控功能层背离所述白色油墨边框延伸的延伸部，并且所述过孔位于所述延伸部中。
  12. 如权利要求11所述的触摸屏的制作方法，其中采用丝网印刷工艺形成的过孔的孔径为100微米～150微米。
  13. 如权利要求6-12任一项所述的触摸屏的制作方法，还包括：
    采用丝网印刷工艺将黑色导电油墨填充于所述过孔。
  14. 一种显示装置，包括如权利要求1-5任一项所述的触摸屏。
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