WO2016197496A1 - 一种led集成发光模组 - Google Patents

一种led集成发光模组 Download PDF

Info

Publication number
WO2016197496A1
WO2016197496A1 PCT/CN2015/091795 CN2015091795W WO2016197496A1 WO 2016197496 A1 WO2016197496 A1 WO 2016197496A1 CN 2015091795 W CN2015091795 W CN 2015091795W WO 2016197496 A1 WO2016197496 A1 WO 2016197496A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
printed wiring
wiring board
lighting module
led integrated
Prior art date
Application number
PCT/CN2015/091795
Other languages
English (en)
French (fr)
Inventor
唐刚
Original Assignee
唐刚
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 唐刚 filed Critical 唐刚
Publication of WO2016197496A1 publication Critical patent/WO2016197496A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to a lighting module, in particular to an LED integrated lighting module.
  • the so-called LED display It is a flat panel display consisting of small LED lighting modules.
  • the existing small-pitch LED lighting module implementation technology is divided into two types, one is the traditional surface-mounting technology, that is, a single packaged SMD lamp bead is sequentially arrayed on a PCB with a solder paste attached thereto ( Printed circuit board).
  • the high-temperature reflow soldering is used to realize the combination of the lamp bead and the PCB, and the change of each lamp bead is illuminated by the conductive line to realize the display effect.
  • the density and the single volume of the lamp bead array are required to be high.
  • the disadvantage is that the manufacturing process of a single SMD lamp bead is complicated, difficult, high cost, difficult to repair the whole board and high cost of scrapping.
  • COB packaging technology COB, chip On Board, chip on board
  • the red, green and blue bare chips are directly adhered to the PCB with conductive or non-conductive glue, and then the metal guide wires are bonded to the pads of the PCB to realize the conductive connection.
  • the chip uses a bare package process.
  • the thin copper on the PCB forms a positive and negative copper thin pad for bonding the LED wafer through the etching process of the line.
  • the copper thin pad can be made into a pad that adheres to the metal guide wire after being subjected to surface treatment such as gold plating or silver plating.
  • each of the illuminating wafers is illuminated by a conductive line to realize the display effect.
  • This COB packaging technology is currently used in the field of LED display screens, especially in the application of small-pitch LED displays. Its shortcoming one: Since the packaged wafer components and electronic components of the LED module are all on the same PCB, Electronic components need to be reflowed by SMT at high temperature. The PCB will have different degrees of deformation after passing through the high temperature. The deformed PCB will not only increase the difficulty of the packaging process, but also cause serious defects in the subsequent assembly modules.
  • the PCB of the module is forcibly flattened due to the strength of the locking screw, so that the wafer soldering layer, the metal guiding wire and the PCB soldering of some LED modules are caused.
  • Factors such as solder joints or poor connections between the disks. Therefore, the disadvantage is higher; its shortcomings are: Since the existing PCB bottom layer is covered with some electronic components (resistors, capacitors, various ICs and connectors), the temperature distribution of the bonding soldering machine directly heated on the PCB is uneven, resulting in obvious metal guiding lines.
  • the welding effect is different, which also causes a high defect rate; its shortcoming three:
  • the glue of the fixed wafer should be dehumidified and dried, and the glue for drying the package needs to be baked at a temperature of about 80 to 180 degrees Celsius.
  • the multiple baking in the production process will cause the surface of the mask. Colors have varying degrees of color degradation. This causes different degrees of chromatic aberration between the modules. The color consistency of the surface of the whole product is poor, and the process control is difficult, which cannot meet the requirements of product quality.
  • the technical problem to be solved by the invention is to provide an LED integrated light-emitting module, which can effectively avoid module deformation under the influence of high-temperature reflow soldering in the production process, the flatness of the module is good, and the surface color is good. Increased product manufacturability, reducing product defect rate and cost.
  • the present invention provides an LED integrated lighting module, comprising a first printed circuit board, the upper surface of the first printed circuit board is provided with a bonding pad, and the bonding pad passes through the state The fixed wire is connected to the first printed circuit board, and the bonding pad is provided with an LED chip;
  • the upper surface of the first printed circuit board is provided with a panel covered on the LED chip, and the panel is provided with a through hole matched with the LED chip, and the through hole is provided with an LED package for packaging the LED chip. gum.
  • the panel is bonded to the upper surface of the first printed wiring board by an adhesive member.
  • the adhesive member is a black rubber or a temperature resistant adhesive.
  • the lower surface of the first printed wiring board is provided with an electronic component assembly, and the lower surface of the first printed wiring board is provided with a bottom casing for being disposed on the electronic component assembly.
  • the electronic component assembly includes a second printed wiring board disposed on a lower surface of the first printed wiring board, and the second printed wiring board is provided with electronic components.
  • the panel is a carbon fiber board.
  • the bonding wire is a gold wire or an alloy wire or a copper wire.
  • the bonding pad is provided with a gold plating layer or a silver plating layer.
  • the substrate of the first printed wiring board is made of FR4 or BT.
  • the LED encapsulant is an AB glue or a package glue.
  • the present invention employs a bonding pad on the upper surface of the first printed wiring board, and the bonding pad is connected to the first printed wiring board through the bonding wire, the bonding pad
  • An LED chip is disposed on the upper surface of the first printed circuit board; a panel disposed on the LED chip is disposed on the upper surface of the first printed circuit board, and a through hole matching the LED chip is disposed on the panel, and the LED chip is disposed in the through hole
  • the LED encapsulates the glue to form an LED panel.
  • the electronic component assembly is provided with various PCBs and various electronic components, and is formed by reflow soldering to form an electronic component assembly, which is then assembled and soldered on the LED light board. Therefore, the LED lamp board is prevented from being deformed by high-temperature reflow soldering, the flatness of the module is good, and the surface color is good, which increases the productivity of the product and reduces the defect rate and cost of the product.
  • FIG. 1 is an exploded view of the structure of an LED integrated lighting module of the present invention.
  • Figure 2 is an enlarged view of a portion A in Figure 1.
  • the LED integrated light-emitting module of the present invention comprises a first printed wiring board 1, and a bonding pad 2 is disposed on the upper surface of the first printed wiring board 1, and the bonding pad 2 is passed through the state.
  • the fixed wire 3 is connected to the first printed wiring board 1, and the bonding pad 2 is provided with the LED chip 4; specifically, the bonding wire 3 is one of a gold wire or an alloy wire or a copper wire; the bonding pad 2 A gold plating layer or a silver plating layer is added to increase the bonding performance; the substrate of the first printed wiring board 1 is one of FR4 or BT materials.
  • the upper surface of the first printed wiring board 1 is provided with a panel 5 which is disposed on the LED chip 4.
  • the panel 5 is provided with a through hole 51 matching the LED chip 4, and the through hole 51 is provided for packaging the LED chip. 4 LED package adhesive 6.
  • the panel 5 is bonded to the upper surface of the first printed wiring board 1 by the adhesive member 8.
  • the adhesive member 8 is one of black rubber or special temperature resistant adhesive
  • the LED package adhesive 6 is AB glue or special color changeable package glue.
  • the lower surface of the first printed wiring board 1 is provided with an electronic component assembly 7, specifically, the electronic component assembly 7 includes a second printed wiring board 71 disposed on the lower surface of the first printed wiring board 1, and a second printed wiring board The electronic component 72 is provided on the 71.
  • the substrate of the second printed wiring board 71 is a PCB board or an FPCB board.
  • a bottom case 9 for covering the electronic component assembly 7 is further disposed on the lower surface of the first printed wiring board 1, and the bottom case 9 is a metal member, for the first printed circuit board 1, that is, for the LED light board
  • the fixing function facilitates the adjustment and fixing between the modules, and protects the LED lamp board from deformation and deformation, and at the same time acts as an anti-signal interference shielding function for the electronic component assembly 7.
  • the present invention adopts a bonding pad on the upper surface of the first printed circuit board, and the bonding pad is connected to the first printed circuit board through a bonding wire, and the bonding pad is provided with an LED chip; a panel covering the LED chip is disposed on the upper surface of the first printed circuit board, and a through hole matching the LED chip is disposed on the panel, and an LED package adhesive for packaging the LED chip is disposed in the through hole, thereby Form an LED light panel.
  • the electronic component assembly is provided with various PCBs and various electronic components, and is formed by reflow soldering to form an electronic component assembly, which is then assembled and soldered on the LED light board. Therefore, the LED lamp board is prevented from being deformed by high-temperature reflow soldering, the flatness of the module is good, and the surface color is good, which increases the productivity of the product and reduces the defect rate and cost of the product.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED集成发光模组，包括第一印刷线路板，第一印刷线路板的上表面设有邦定焊盘，邦定焊盘通过邦定导线与第一印刷线路板连接，邦定焊盘上设有LED晶片；第一印刷线路板的上表面设有罩设在LED晶片上的面板，面板上设有与LED晶片相匹配的贯通孔，贯通孔内设有用于封装LED晶片的LED封装胶。本发明可以有效的避免在生产过程中因高温回流焊接的影响下发生模组变形，模组的平整度好，表面目色好，增加了产品的可生产性，降低产品的不良率和成本。

Description

一种LED集成发光模组
技术领域
本发明涉及发光模组，尤其涉及一种LED集成发光模组。
背景技术
所谓LED显示屏， 是一种平板显示器，由一个个小的LED发光模组组成。现有的小间距LED发光模组实现技术分为两种，一种为传统的表面贴片技术，即把单颗封装好的SMD灯珠依次阵列的贴装在已附上锡膏的PCB(印制电路板)上。再通过高温回流焊接来实现灯珠与PCB的结合，通过导电线路来点亮每一颗灯珠的变化来实现其显示的效果。特别是在小间距模组中，对灯珠阵列的密度及单个体积的要求较高。其缺点在于单颗SMD灯珠的制造工艺复杂，难度大，成本高，整板维修难度大及报废成本高等主要因素。
另一种就是采用所谓的COB封装技术(COB， chip On board，板上芯片)，也就是将红绿蓝三色裸芯片用导电或非导电胶直接粘附在PCB上，然后进行金属引导线黏合在PCB的焊盘上，来实现其导电连接。其中芯片采用裸露封装工艺， PCB上的铜薄通过线路的蚀刻工艺后形成了用于LED晶片邦定的正负极铜薄焊盘， 铜薄焊盘在经过镀金或镀银等表面处理后可以做成其黏合金属引导线的焊盘。绑定完成后再通过表面封装胶固定，最后通过导电线路来点亮每一颗发光晶片来实现其显示的效果。此COB封装技术目前应用于LED显示屏领域技术问题较多，特别是在小间距LED显示屏的应用。其缺点一: 由于LED模组的封装晶片组件和电子元器件都在同一PCB上， 电子元器件需要经过SMT高温回流焊接，其PCB通过高温后则会有不同程度上的变形，变形后的PCB不仅会增加封装工艺的难度，而且还会再后续的装配模组中造成严重的不良，即通过模组四周的固定铜柱安装在底壳上时，由于锁螺丝的力度使得这个模组的PCB强行的拉平，因此会造成部分LED模组的晶片焊接层、金属引导线及PCB焊盘之间的虚焊或连接不良等因素。因此造成的不良较高；其缺点二: 由于现有的PCB底层都布满了一些电子元器件(电阻，电容，各种IC及连接器)，使得邦定焊接机直接加热在PCB上的温度热量分布不均匀，造成明显的金属引导线焊接效果不同，从而也造成了较高的不良率；其缺点三: 在封装的过程中，应除湿、烘干固定晶片的胶水，烘干封装的胶水都需要进行约80至180摄氏度的温度烘烤，此生产工艺环节中的多次烘烤会造成面罩的表面目色发生不同程度的颜色退化。致使模组之间发生不同程度的色差。整个产品的表面颜色一致性较差，工艺控制难度大，无法满足产品品质方面的要求。
发明内容
本发明所要解决的技术问题在于：提供一种LED集成发光模组，可以有效的避免在生产过程中因高温回流焊接的影响下发生模组变形，模组的平整度好，表面目色好，增加了产品的可生产性，降低产品的不良率和成本。
为解决上述技术问题，本发明提出了一种LED集成发光模组，包括第一印刷线路板，所述第一印刷线路板的上表面设有邦定焊盘，所述邦定焊盘通过邦定导线与第一印刷线路板连接，所述邦定焊盘上设有LED晶片；
所述第一印刷线路板的上表面设有罩设在LED晶片上的面板，所述面板上设有与LED晶片相匹配的贯通孔，所述贯通孔内设有用于封装LED晶片的LED封装胶。
进一步地，所述面板通过粘合件粘结在第一印刷线路板的上表面上。
进一步地，所述粘合件为黑胶或者耐温粘合胶。
进一步地，所述第一印刷线路板的下表面设有电子元器组件，所述第一印刷线路板的下表面上设有用于罩设在电子元器组件上的底壳。
进一步地，所述电子元器组件包括设置在第一印刷线路板下表面上的第二印刷线路板，第二印刷线路板上设有电子元器件。
进一步地，所述面板为碳纤维板。
进一步地，所述邦定导线为金线或者合金线或者铜线。
进一步地，所述邦定焊盘上设有镀金层或者镀银层。
进一步地，所述第一印刷线路板的基材为FR4或者BT材质。
进一步地，所述LED封装胶为AB胶水或者封装胶水。
上述技术方案至少具有如下有益效果：本发明采用在第一印刷线路板的上表面设有邦定焊盘，邦定焊盘通过邦定导线与第一印刷线路板连接，所述邦定焊盘上设有LED晶片；在第一印刷线路板的上表面设有罩设在LED晶片上的面板，在面板上设有与LED晶片相匹配的贯通孔，在贯通孔内设有用于封装LED晶片的LED封装胶，从而形成LED灯板。电子元器组件设有各种PCB和各种电子元器件，经过高温回流焊接后形成电子元器组件，再组装焊接在LED灯板上。从而避免LED灯板经过高温回流焊接时发生变形，模组的平整度好，表面目色好，增加了产品的可生产性，降低产品的不良率和成本。
附图说明
图1是本发明LED集成发光模组的结构爆炸图。
图2是图1中A处的放大图。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面结合附图对本发明做进一步描述。
如图1、图2所示，本发明LED集成发光模组包括第一印刷线路板1，在第一印刷线路板1的上表面设有邦定焊盘2，将邦定焊盘2通过邦定导线3与第一印刷线路板1连接，邦定焊盘2上设有LED晶片4；具体地，邦定导线3为金线或者合金线或者铜线中的一种；邦定焊盘2上设有镀金层或者镀银层，增加邦定接合性能；第一印刷线路板1的基材为FR4或者BT材质的一种。
第一印刷线路板1的上表面设有罩设在LED晶片4上的面板5，在面板5上设有与LED晶片4相匹配的贯通孔51，在贯通孔51内设有用于封装LED晶片4的LED封装胶6。较佳地，面板5通过粘合件8粘结在第一印刷线路板1的上表面上，具体地，粘合件8为黑胶或者特殊耐温粘合胶中的一种，LED封装胶6为AB胶水或者特殊可变色封装胶水。
第一印刷线路板1的下表面设有电子元器组件7，具体地，电子元器组件7包括设置在第一印刷线路板1下表面上的第二印刷线路板71，第二印刷线路板71上设有电子元器件72，具体地，第二印刷线路板71的基材为PCB板或者FPCB板。
在第一印刷线路板1的下表面上还设有用于罩设在电子元器组件7上的底壳9，底壳9为金属件，对第一印刷线路板1，即对LED灯板起到固定作用，便于模组之间的调节固定，对LED灯板受力变形起到保护作用，同时对电子元器组件7起到抗信号干扰屏蔽作用。
综上，本发明采用在第一印刷线路板的上表面设有邦定焊盘，邦定焊盘通过邦定导线与第一印刷线路板连接，所述邦定焊盘上设有LED晶片；在第一印刷线路板的上表面设有罩设在LED晶片上的面板，在面板上设有与LED晶片相匹配的贯通孔，在贯通孔内设有用于封装LED晶片的LED封装胶，从而形成LED灯板。电子元器组件设有各种PCB和各种电子元器件，经过高温回流焊接后形成电子元器组件，再组装焊接在LED灯板上。从而避免LED灯板经过高温回流焊接时发生变形，模组的平整度好，表面目色好，增加了产品的可生产性，降低产品的不良率和成本。
以上所述是本发明的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干修改，这些修改也视为本发明的保护范围。

Claims (10)

  1. 一种LED集成发光模组，其特征在于，包括第一印刷线路板，所述第一印刷线路板的上表面设有邦定焊盘，所述邦定焊盘通过邦定导线与第一印刷线路板连接，所述邦定焊盘上设有LED晶片；
    所述第一印刷线路板的上表面设有罩设在LED晶片上的面板，所述面板上设有与LED晶片相匹配的贯通孔，所述贯通孔内设有用于封装LED晶片的LED封装胶。
  2. 如权利要求1所述的LED集成发光模组，其特征在于，所述面板通过粘合件粘结在第一印刷线路板的上表面上。
  3. 如权利要求2所述的LED集成发光模组，其特征在于，所述粘合件为黑胶或者耐温粘合胶。
  4. 如权利要求1所述的LED集成发光模组，其特征在于，所述第一印刷线路板的下表面设有电子元器组件，所述第一印刷线路板的下表面上设有用于罩设在电子元器组件上的底壳。
  5. 如权利要求4所述的LED集成发光模组，其特征在于，所述电子元器组件包括设置在第一印刷线路板下表面上的第二印刷线路板，第二印刷线路板上设有电子元器件。
  6. 如权利要求1所述的LED集成发光模组，其特征在于，所述面板为碳纤维板。
  7. 如权利要求1所述的LED集成发光模组，其特征在于，所述邦定导线为金线或者合金线或者铜线。
  8. 如权利要求1所述的LED集成发光模组，其特征在于，所述邦定焊盘上设有镀金层或者镀银层。
  9. 如权利要求1所述的LED集成发光模组，其特征在于，所述第一印刷线路板的基材为FR4或者BT材质。
  10. 如权利要求1所述的LED集成发光模组，其特征在于，所述LED封装胶为AB胶水或者封装胶水。
PCT/CN2015/091795 2015-06-08 2015-10-13 一种led集成发光模组 WO2016197496A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510310189.9 2015-06-08
CN201510310189.9A CN104882531A (zh) 2015-06-08 2015-06-08 一种led集成发光模组

Publications (1)

Publication Number Publication Date
WO2016197496A1 true WO2016197496A1 (zh) 2016-12-15

Family

ID=53949942

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/091795 WO2016197496A1 (zh) 2015-06-08 2015-10-13 一种led集成发光模组

Country Status (2)

Country Link
CN (1) CN104882531A (zh)
WO (1) WO2016197496A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107633779A (zh) * 2017-11-24 2018-01-26 山西高科华烨电子集团有限公司 基于cob技术的led显示屏

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104882531A (zh) * 2015-06-08 2015-09-02 杨子龙 一种led集成发光模组
CN105977365A (zh) * 2016-05-19 2016-09-28 北京大学东莞光电研究院 一种cob led封装装置及方法
CN105810115B (zh) * 2016-05-30 2019-08-20 深圳市奥蕾达科技有限公司 全彩led发光面板
CN106875982B (zh) * 2017-03-01 2020-08-04 深圳市佳鑫一帆科技有限公司 一种医疗设备外壳弧面过渡连接板及其粘接方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0364806B1 (de) * 1988-10-21 1993-01-20 TEMIC TELEFUNKEN microelectronic GmbH Flächenhafter Strahler
CN1188984A (zh) * 1997-01-15 1998-07-29 国际商业机器公司 具有ic芯片和支座安装的金属基片
CN101460007A (zh) * 2007-12-12 2009-06-17 扬智科技股份有限公司 电路基板
CN102522488A (zh) * 2011-12-22 2012-06-27 陈林 一种照明用led灯条封装结构
CN104882531A (zh) * 2015-06-08 2015-09-02 杨子龙 一种led集成发光模组
CN204696158U (zh) * 2015-06-08 2015-10-07 杨子龙 一种led集成发光模组

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101640012B (zh) * 2009-09-04 2014-05-07 北京巨数数字技术开发有限公司 一种led显示模块
CN102005446A (zh) * 2010-11-03 2011-04-06 熊周成 Led封装结构及led发光显示模组
CN202523333U (zh) * 2012-03-15 2012-11-07 利亚德光电股份有限公司 Led显示装置
CN103258819A (zh) * 2013-04-16 2013-08-21 佛山市领华电子实业有限公司 Led多杯集成一体化cob封装实现方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0364806B1 (de) * 1988-10-21 1993-01-20 TEMIC TELEFUNKEN microelectronic GmbH Flächenhafter Strahler
CN1188984A (zh) * 1997-01-15 1998-07-29 国际商业机器公司 具有ic芯片和支座安装的金属基片
CN101460007A (zh) * 2007-12-12 2009-06-17 扬智科技股份有限公司 电路基板
CN102522488A (zh) * 2011-12-22 2012-06-27 陈林 一种照明用led灯条封装结构
CN104882531A (zh) * 2015-06-08 2015-09-02 杨子龙 一种led集成发光模组
CN204696158U (zh) * 2015-06-08 2015-10-07 杨子龙 一种led集成发光模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107633779A (zh) * 2017-11-24 2018-01-26 山西高科华烨电子集团有限公司 基于cob技术的led显示屏

Also Published As

Publication number Publication date
CN104882531A (zh) 2015-09-02

Similar Documents

Publication Publication Date Title
WO2020140727A1 (zh) Led显示装置
WO2016197496A1 (zh) 一种led集成发光模组
JP5350242B2 (ja) 光源装置及びこれを備えた液晶表示装置
CN108807356B (zh) 一种四合一mini-LED模组、显示屏及制造方法
WO2018176545A1 (zh) 显示模组及终端
WO2014008773A1 (zh) 一种贴片式led模组的制造方法
US8378370B2 (en) LED package structure
US10580350B2 (en) Micro light emitting diode module and manufacturing method thereof
US11127341B2 (en) Light emitting module and display device
US20060220051A1 (en) System and method for surface mountable display
CN205264271U (zh) 一种全彩rgb集成发光单元模块及led显示屏
US9730328B2 (en) Printed circuit board with embedded component and method for manufacturing same
WO2021045482A1 (en) Micro led display and method for manufacturing the same
TWI446599B (zh) 無邊框的ｌｅｄ晶片封裝方法及以該方法製成的發光裝置
CN103052258B (zh) 印刷电路板及其制造方法
CN212113055U (zh) 一种基板、背光模组及显示装置
WO2018192221A1 (zh) 一种集成表贴发光器件的生产工艺
US10810932B2 (en) Molded LED display module and method of making thererof
WO2011087319A2 (ko) 발광 장치
WO2016107094A1 (zh) 电路板及其制造方法，和显示装置
WO2016122053A1 (ko) 투명 전광 장치
CN2535926Y (zh) 发光二极管封装结构
CN204696158U (zh) 一种led集成发光模组
CN212011018U (zh) Led芯片单元及led器件
CN216528947U (zh) 用于led封装的mcpcb多层结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15894760

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15894760

Country of ref document: EP

Kind code of ref document: A1