WO2016190234A1 - Procédé de production d'un panneau d'affichage - Google Patents

Procédé de production d'un panneau d'affichage Download PDF

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Publication number
WO2016190234A1
WO2016190234A1 PCT/JP2016/064992 JP2016064992W WO2016190234A1 WO 2016190234 A1 WO2016190234 A1 WO 2016190234A1 JP 2016064992 W JP2016064992 W JP 2016064992W WO 2016190234 A1 WO2016190234 A1 WO 2016190234A1
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WIPO (PCT)
Prior art keywords
substrates
display panel
substrate
manufacturing
grinding
Prior art date
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PCT/JP2016/064992
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English (en)
Japanese (ja)
Inventor
仲西 洋平
昌行 兼弘
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to CN201680030061.XA priority Critical patent/CN107615365A/zh
Priority to US15/577,168 priority patent/US10088712B2/en
Publication of WO2016190234A1 publication Critical patent/WO2016190234A1/fr

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133351Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/56Substrates having a particular shape, e.g. non-rectangular

Definitions

  • the technology disclosed in this specification relates to a method for manufacturing a display panel.
  • a pair of substrates having a thin film pattern constituting a semiconductor element such as a TFT (Thin Film Transistor) is prepared on at least one substrate, and the thin film pattern is surrounded.
  • a display panel manufacturing method for manufacturing a display panel by bonding a pair of substrates through a sealing agent arranged in a shape and then cutting the bonded pair of substrates along the outer shape of the display panel.
  • a liquid crystal panel manufacturing method for manufacturing a liquid crystal panel by injecting liquid crystal between a pair of substrates bonded via a sealant and then dividing the pair of substrates bonded together Is disclosed.
  • the pair of substrates are cut at the same time as the sealing agent by a dicing method so that the divided section of the substrate and the divided section of the sealing agent coincide with each other. For this reason, the dimension in the width direction of the sealant is reduced after the pair of substrates is divided, and the manufactured display panel can be narrowed.
  • the display panel as described above generally has a rectangular or square outer shape in plan view.
  • the outer shape in plan view has a semicircular shape.
  • the technology disclosed in the present specification was created in view of the above-described problems, and aims to manufacture a display panel having a curved portion in an outer shape with good shape accuracy while realizing a narrow frame.
  • the technology disclosed in this specification is a method for manufacturing a display panel in which at least a part of a contour line forming an outer shape is curved, and includes a pair of substrates in which a thin film pattern is formed on at least one substrate. And a sealing agent application step of applying a sealing agent on the one substrate so as to surround the thin film pattern; and after the sealing agent application step, the pair of substrates are bonded and bonded via the sealing agent.
  • the bonded substrate in the display panel manufacturing method described above, in the dividing step, can be roughly divided by dividing a pair of substrates located outside the sealing agent surrounding the thin film pattern in the bonded substrate. For this reason, in the cutting step, the bonded substrate can be cut by a substantially straight dividing line even around the portion where the contour line forming the outer shape is curved, and a crack different from the intended dividing line is generated. This can be suppressed. Further, even if a crack different from the intended dividing line is generated, it is possible to suppress the influence on the shape accuracy of the display panel.
  • the end face of the display panel having a curved contour line is formed by collectively grinding the pair of substrates and the sealant, and therefore unintended cracks are formed in the vicinity of the end face. It is possible to suppress the occurrence.
  • the outer shape of the display panel is formed by collectively grinding the pair of substrates and the sealant along the outer shape of the display panel so that the ground surface of the pair of substrates and the ground surface of the sealant coincide with each other.
  • a curved contour line can be formed with good accuracy.
  • the pair of substrates and the sealing agent are collectively ground so that the grinding surface of the pair of substrates and the grinding surface of the sealing agent coincide with each other. Therefore, the display panel can be narrowed.
  • the display panel manufacturing method described above can manufacture a display panel having a curved portion in the outer shape with good shape accuracy while realizing a narrow frame.
  • the sealing agent in the sealing agent application step, may be applied with a predetermined width along the outer shape of the display panel.
  • the bonded substrate is peeled off, which may reduce the yield in the manufacturing process of the display panel.
  • the sealing agent application process after the bonded substrate is formed, the bonded substrate is applied in such a width that the bonded substrate can secure a good bonding strength. It can suppress that peeling arises.
  • the sealant along the outer shape of the display panel, the pair of substrates and the sealant are displayed while maintaining the bonding strength that can suppress the peeling of the bonded substrate in the subsequent grinding process. It is possible to grind together along the outer shape of the panel. As a result, it is possible to suppress a decrease in yield in the manufacturing process of the display panel.
  • the display panel manufacturing method according to claim 1, wherein the display panel includes a mounting region in which a driving component for driving the display panel is mounted in a part of a region in the panel surface of the display panel. You may divide the site
  • the part to be the end face of the mounting area is bonded along the outer shape of the display panel with a substantially linear dividing line.
  • the outer shape is a circular shape, and a mounting region in which a driving component for driving the display panel is mounted on a part of a region in the panel surface of the display panel. And in the said grinding process, you may grind the whole region of the end surface of the said bonded substrate.
  • the entire area of the end face of the bonded substrate is ground to ensure a mounting area for the drive component, and the curve that forms the outer shape of the display panel for the entire area of the end surface of the bonded substrate.
  • a contour line can be formed.
  • the through hole is formed along the thickness direction
  • the sealing agent application step at least around the portion of the plate surface of the one substrate where the through hole is formed
  • a preliminary through-hole forming step in which the sealing agent is further applied to the substrate, and a preliminary through-hole having a diameter smaller than that of the through-hole is formed in the bonded substrate after the bonding step.
  • the through holes may be formed by collectively grinding the pair of substrates and the sealant on the opening end surface of the preliminary through holes to increase the diameter of the preliminary through holes. Good.
  • the pair of substrates and the sealant are ground together to increase the diameter of the preliminary through-hole, thereby suppressing the occurrence of cracks different from the intended line, and the desired A through hole having a diameter of 5 mm can be formed.
  • a specific manufacturing method for manufacturing a display panel having a through hole along the thickness direction with good shape accuracy while realizing a narrow frame can be provided.
  • a method for manufacturing the display panel wherein a plurality of the display panels are manufactured in a lump.
  • the bonded substrate is divided into a plurality of pieces by dividing the bonded substrate, and the dividing step is performed.
  • the grinding step may be performed on each of the bonded substrates separated in (1).
  • a plurality of display panels having curved portions in the outer shape are collectively collected with good shape accuracy while realizing a narrow frame by grinding each of the bonded substrates separated into pieces. Can be manufactured.
  • a method for manufacturing the display panel wherein a plurality of the display panels are manufactured in a lump, wherein a lamination step of laminating the plurality of bonded substrates via a photo-curable adhesive, and light to the adhesive
  • a curing step of irradiating and curing the fixing agent and a peeling step of peeling the fixing agent for each of the laminated substrates laminated after the grinding step.
  • a plurality of the bonded substrates laminated by dividing the plurality of bonded substrates into a plurality of pieces, and the grinding step for each of the laminated bonded substrates separated in the dividing step May be performed.
  • the above manufacturing method in the dividing step, a plurality of laminated substrates are divided and separated into one piece, so that the plurality of bonded substrates are divided at a time according to the outer shape of the display panel. Can do. Thereafter, in the grinding step, each of the laminated substrate substrates separated into individual pieces is ground, so that each of the laminated substrate substrates separated into individual pieces has a curved shape that forms the outer shape of the display panel. The contour line can be formed at a time. As described above, the above manufacturing method can provide a specific method for manufacturing a plurality of display panels having curved portions in the outer shape at a time with good shape accuracy while realizing a narrow frame.
  • a display panel having a curved portion in its outer shape while realizing a narrow frame can be manufactured with good shape accuracy.
  • FIG. 1 is a schematic plan view of a liquid crystal panel according to Embodiment 1.
  • FIG. FIG. 2 is a sectional view taken along the line II-II in FIG. A photograph showing the cross section of a glass substrate ground by a grinder Plan view showing sealant application process Sectional drawing which shows the cutting process of a curved end surface Sectional drawing which shows grinding process (1) of curved end face Sectional drawing which shows grinding process (2) of curved end face Sectional drawing which shows the cutting process (1) of a linear end surface Sectional drawing which shows the cutting process (2) of a linear end surface
  • Schematic plan view of a liquid crystal panel according to Embodiment 2 Schematic plan view of a liquid crystal panel according to Embodiment 3
  • Schematic plan view of a liquid crystal panel according to Embodiment 4 The perspective view which shows the manufacturing process (1) of the liquid crystal panel which concerns on Embodiment 5.
  • FIG. The perspective view which shows the manufacturing process (2) of the liquid crystal panel which concerns on Embodiment 5.
  • FIG. The perspective view which shows the manufacturing process (3) of the liquid crystal panel which concerns on Embodiment 5.
  • FIG. The perspective view which shows the manufacturing process (4) of the liquid crystal panel which concerns on Embodiment 5.
  • FIG. The perspective view which shows the manufacturing process (5) of the liquid crystal panel which concerns on Embodiment 5.
  • FIG. The perspective view which shows the manufacturing process (6) of the liquid crystal panel which concerns on Embodiment 5.
  • FIGS. 1 The first embodiment will be described with reference to FIGS.
  • a method for manufacturing a liquid crystal panel (an example of a display panel) 10 constituting the liquid crystal display device will be described.
  • a part of each drawing shows an X-axis, a Y-axis, and a Z-axis, and each axis direction is drawn in a common direction in each drawing. 2 and FIGS. 5 to 9, the upper side of the figure is the upper side (front side) of the liquid crystal panel 10.
  • the configuration of the liquid crystal panel 10 will be described.
  • the outer shape in plan view is not a general rectangular shape or square shape, and a part of the contour line forming the outer shape is curved. Specifically, as shown in FIG. 1, the liquid crystal panel 10 has arcuate curves at three portions of the outline forming the outer shape.
  • a horizontally long display area A1 capable of displaying an image is arranged on a large part thereof, and an area outside the display area A1 is a non-display area A2 where no image is displayed.
  • a frame-shaped part surrounding the display area A1 is a frame part of the liquid crystal panel 10.
  • the position deviated to one end side (the lower side shown in FIG. 1) of the liquid crystal panel 10 in the Y-axis direction is such that the IC chip (an example of a driving component) 12 and the flexible substrate 14 are located.
  • the mounting area A3 is mounted.
  • the IC chip 12 is an electronic component for driving the liquid crystal panel 10, and the flexible substrate 14 is a substrate for connecting a control substrate 16 that supplies various input signals to the IC chip 12 from the outside with the liquid crystal panel 10. is there.
  • the mounting area A3 is a horizontally long rectangular area as shown in FIG. 1, and the outline forming the outer shape of the mounting area A3 is the long side along the X axis and the short side as the Y axis in FIG. Each extends linearly along the direction.
  • the liquid crystal panel 10 includes a pair of glass substrates 20 and 30 having excellent translucency, and liquid crystal molecules including liquid crystal molecules that are substances whose optical characteristics change with application of an electric field. And a layer 18.
  • the two substrates 20 and 30 constituting the liquid crystal panel 10 are bonded together by an ultraviolet curable sealant 40 while maintaining a cell gap corresponding to the thickness of the liquid crystal layer 18.
  • the front side (front side) substrate 20 is the color filter substrate 20
  • the back side (back side) substrate 30 is the array substrate 30.
  • Alignment films 10A and 10B for aligning liquid crystal molecules contained in the liquid crystal layer 18 are formed on the inner surfaces of both the substrates 20 and 30, respectively.
  • Polarizers 10C and 10D are disposed on the outer surface side of the first glass substrate (an example of the substrate) 20A constituting the color filter substrate 20 and on the outer surface side of the second glass substrate (an example of the substrate) 30A constituting the array substrate 30, respectively. Is pasted.
  • the first glass substrate 20A constituting the color filter substrate 20 has a thickness of, for example, 700 ⁇ m, and the array substrate 30 and the polarizing plate 10C are bonded to the main part thereof.
  • the color filter substrate 20 has a dimension in the X-axis direction that is substantially the same as that of the array substrate 30, but a dimension in the Y-axis direction is smaller than that of the array substrate 30, and the Y-axis with respect to the array substrate 30. It is bonded together in a state in which one end portion in the direction (the upper side shown in FIG. 1, the side having an arcuate curve in the contour line) is aligned. Accordingly, the color filter substrate 20 does not overlap the other end (the lower side shown in FIG. 1) of the array substrate 30 in the Y-axis direction, and both the front and back plate surfaces are exposed to the outside.
  • a mounting area A3 for the IC chip 12 and the flexible substrate 14 is secured.
  • the second glass substrate 30A constituting the array substrate 30 has a thickness of, for example, 700 ⁇ m.
  • the color filter substrate 20 and the polarizing plate 10D are bonded to the main portion thereof, and the mounting area for the IC chip 12 and the flexible substrate 14 The portion where A3 is secured is not overlapped with the color filter substrate 20 and the polarizing plate 10D.
  • the sealant 40 for bonding the two substrates 20 and 30 constituting the liquid crystal panel 10 is in a form along the outer shape of the color filter substrate 20 so as to surround the display area A1 in the portion where the substrates 20 and 30 overlap. It is arranged in the non-display area A2 (see FIG. 2).
  • a plurality of laminated thin film patterns are formed on the inner surface side (liquid crystal layer 18 side) of the second glass substrate 30A constituting the array substrate 30.
  • a thin film pattern of a TFT 32 as a switching element and a transparent conductive film such as ITO (Indium Tin Oxide) are connected to the TFT32.
  • a plurality of thin film patterns of the pixel electrodes 34 are arranged in a matrix in a plan view.
  • gate wiring, source wiring, and capacitance wiring (not shown) are respectively arranged.
  • the end portion of the array substrate 30 is provided with a terminal portion routed from the gate wiring and the capacitor wiring and a terminal portion routed from the source wiring. These terminals are supplied with respective signals or reference potentials from the control board 16 shown in FIG. 1, thereby controlling the driving of the TFT 32.
  • the color filters 22 arranged in parallel in a matrix are provided side by side.
  • the color filter 22 is composed of colored portions such as R (red), G (green), and B (blue).
  • the substantially lattice-shaped light-shielding part (black matrix) 23 for preventing color mixing is formed.
  • the light shielding portion 23 is arranged so as to overlap the gate wiring, the source wiring, and the capacitor wiring provided on the array substrate 30 in a plan view.
  • one display pixel which is a display unit, is configured by a set of three colored portions of R (red), G (green), and B (blue) and three pixel electrodes 34 facing the colored portions. Yes.
  • the display pixel includes a red pixel having an R colored portion, a green pixel having a G colored portion, and a blue pixel having a B colored portion. These pixels of each color are arranged repeatedly along the row direction (X-axis direction) on the plate surface of the liquid crystal panel 10 to constitute a pixel group, and this pixel group forms a column direction (Y-axis direction). Many are arranged side by side.
  • a counter electrode 24 facing the pixel electrode 34 on the array substrate 30 side is provided on the inner surface side of the color filter 22 and the light shielding portion 23.
  • the non-display area A2 of the liquid crystal panel 10 is provided with a counter electrode wiring (not shown), and this counter electrode wiring is connected to the counter electrode 24 through a contact hole (not shown).
  • a reference potential is applied to the counter electrode 24 from the counter electrode wiring, and a predetermined potential is applied between the pixel electrode 34 and the counter electrode 24 by controlling the potential applied to the pixel electrode 34 by the TFT 32. A potential difference can be generated.
  • a pair of contour lines forming the outer shape are linear (on the left end surface in FIG. 2, hereinafter referred to as “linear end surfaces”),
  • the glass substrates 20A and 30A slightly protrude outside the sealant 40, whereas the contour line forming the outer shape is curved (referred to as the “curved end surface” on the right side in FIG. 2).
  • the end surfaces of the pair of glass substrates 20 ⁇ / b> A and 30 ⁇ / b> A coincide with the end surfaces of the sealant 40.
  • the dimension in the width direction (Y-axis direction dimension) of the sealing agent 40 on the curved end surface is smaller than the dimension in the width direction of the sealing agent 40 on the linear end surface.
  • the width of the frame portion on the curved end surface (the width of the non-display area A2 shown on the left side of FIG. 2) is 700 ⁇ m or less, and a narrow frame is realized.
  • the pair of glass substrates 20A, 30A and the sealing agent 40 are in the above-described manner on the curved end surface of the liquid crystal panel 10, as described later, the curved end surfaces are the glass substrates 20A, 30A and the seal.
  • the agent 40 is formed by a grinding process in which the agent 40 is collectively ground by a grinder.
  • the processed cross section 30A1 of the second glass substrate 30A at the curved end face is a cross section like a frosted glass as shown in FIG. 3 (the same applies to the processed cross section of the first glass substrate 20A).
  • the above is the configuration of the liquid crystal panel 10 according to the present embodiment.
  • the CF layer (an example of a thin film pattern) is a collection of the above configurations formed on the first glass substrate 20A except the alignment film 10A. 20L, and the configuration formed on the second glass substrate 30A excluding the alignment film 10B is collectively referred to as a TFT layer (an example of a thin film pattern) 30L. From FIG. 5 onward, the alignment films 10A and 10B and the polarizing plates 10C and 10D are not shown.
  • a method for manufacturing the liquid crystal panel 10 configured as described above will be described.
  • a first glass substrate 20A constituting the color filter substrate 20 and a second glass substrate 30A constituting the array substrate 30 are prepared.
  • the CF layer 20L is formed on one plate surface of the first glass substrate 20A
  • the TFT layer 30L is formed on one plate surface of the second glass substrate 30A.
  • a known photolithography method is used.
  • the first glass substrate 20A and the second glass substrate 30A are transported between each apparatus such as a film forming apparatus, a resist coating apparatus, and an exposure apparatus used in the photolithography method,
  • the thin films constituting the CF layer 20L and the TFT layer 30L are sequentially stacked in a predetermined pattern on the glass substrate 30A.
  • the bonded substrate 50 on which the first glass substrate 20A and the second glass substrate 30A are bonded is divided and separated into individual pieces.
  • the bonded substrate 50 By grinding the bonded substrate 50, six liquid crystal panels 10 are manufactured from the single bonded substrate 50. That is, the CF layer 20L is formed at 6 locations on the first glass substrate 20A, and the TFT layer 30L is formed at 6 locations on the second glass substrate 30A (see FIG. 4).
  • Each CF layer 20L and each TFT layer 30L are formed on both glass substrates 20A and 30A, respectively, so as to face each other when the glass substrates 20A and 30A are bonded together.
  • an alignment film 10A is formed on the first glass substrate 20A so as to cover each CF layer 20L formed on the first glass substrate 20A, and each TFT layer 30L formed on the second glass substrate 30A is formed.
  • An alignment film 10B is formed on the second glass substrate 30A so as to cover it.
  • the sealing agent 40 is applied on the second glass substrate 30A so as to surround each TFT layer 30L on the second glass substrate 30A (sealing agent application step).
  • the thick dashed-two dotted line in FIG. 4 has shown the part to which the sealing compound 40 on 30 A of 2nd glass substrates is apply
  • the sealing agent 40 is applied with a predetermined width (for example, 700 ⁇ m similar to the thickness of the second glass substrate 30A) along the outer shape of the liquid crystal panel 10 to be manufactured.
  • the dropped liquid crystal expands in the direction of the plate surface of the second glass substrate 30A, and the region surrounded by the sealant 40 is filled with the liquid crystal.
  • a liquid crystal layer 18 is formed between 20A and 30A.
  • one bonded substrate 50 is roughly divided into six so as to correspond to the outer shapes of the six liquid crystal panels 10 manufactured from one bonded substrate 50 (a dividing step).
  • the thin dashed-dotted line in FIG. 4 has shown the parting line on the 2nd glass substrate 30A parted by this parting process.
  • a dicing saw 60 is used to seal the sealing agent 40 surrounding each CF layer 20L and each TFT layer 30L in a plan view of the bonded substrate 50.
  • a pair of glass substrate 20A, 30A located outside is divided.
  • FIGS. 8 and 9 show the liquid crystal panel to be manufactured.
  • 10 is a cross-sectional view of the vicinity of the end face corresponding to 10 linear end faces, that is, the left end face in FIG.
  • the alternate long and short dash line in FIG. 5 and FIG. 8 indicates the dividing line of each glass substrate 20A, 30A that is divided in the dividing process.
  • the pair of glass substrates 20A and 30A constituting the bonded substrate 50 are divided so that the sectional surfaces of both glass substrates 20A and 30A coincide with each other as shown in FIG. To do.
  • each glass substrate 20A, 30A is parted so that the dividing surface of the 1st glass substrate 20A and the dividing surface of the 2nd glass substrate 30A may differ.
  • each glass substrate 20A, 30A is divided along the outer shape of the mounting region A3 so that the dividing surface of the second glass substrate 30A is located farther from the sealing agent 40 than the dividing surface of the first glass substrate 20A. To do. As a result, a region that does not overlap the first glass substrate 20A over a predetermined range is formed on the second glass substrate 30A, and this region is a mounting region A3 of the liquid crystal panel 10 to be manufactured.
  • the bonded substrates 50 separated into six pieces by the dividing step will be referred to as individual bonded substrates 50A, respectively.
  • the curved end surfaces of the individual bonded substrates 50A are ground using a grinder 70, that is, an apparatus for grinding a workpiece by rotating a grinding wheel (grinding step).
  • a portion surrounded by an alternate long and short dash line indicates a portion of the singulated bonded substrate 50 ⁇ / b> A that is ground in this grinding step.
  • the pair of glass substrates 20 ⁇ / b> A and 30 ⁇ / b> A slightly protrudes to the outside of the sealing agent 40 on the curved end surface of the singulated bonded substrate 50 ⁇ / b> A after the dividing step.
  • the pair of glass substrates 20A and 30A are ground by the grinder 70. Then, when the grinder 70 reaches the sealing agent 40, the pair of glass substrates 20A, 30A and the sealing agent 40 so that the grinding surfaces of the pair of glass substrates 20A, 30A and the grinding surface of the sealing agent 40 are coincident with each other. Are collectively ground along the outer shape of the liquid crystal panel 10 to be manufactured. On the other hand, the grinding step is not performed on the linear end surface.
  • the grinding step grinding is performed until the dimension in the width direction of the sealant 40 becomes small (for example, 200 ⁇ m to 500 ⁇ m).
  • the curved end surface of the liquid crystal panel 10 to be manufactured has a smaller dimension in the width direction of the sealing agent 40, and the liquid crystal panel 10 can be narrowed.
  • the grinding step is performed along the outer shape of the liquid crystal panel 10 manufactured so that the contour line in the plan view of the processed end surface after the grinding step is curved, and the curved end surface is curved by grinding by the grinder 70. Since the end face is processed, unintended cracks are not generated in the vicinity of the end face, and the end face can be processed with good shape accuracy.
  • the six liquid crystal panels 10 according to the present embodiment are completed by affixing the polarizing plates 10C and 10D to the outer surface sides of the two glass substrates 20A and 30A for the individual bonded substrates.
  • the bonded substrate 50 in the dividing step, the pair of glass substrates 20A positioned outside the sealing agent 40 surrounding the CF layer 20L and the TFT layer 30L in the bonded substrate substrate 50, By dividing 30A, the bonded substrate 50 can be roughly divided according to the outer shape of the liquid crystal panel 10 to be manufactured. For this reason, in the dividing step, the bonded substrate 50 can be divided by a substantially straight dividing line even around the portion that is the curved end surface, and the occurrence of cracks different from the intended dividing line is suppressed. Can do. Further, even if a crack different from the intended dividing line is generated, the dividing line is separated from the portion that becomes the outline forming the outer shape, so that the influence on the shape accuracy of the liquid crystal panel 10 is suppressed. be able to.
  • the pair of glass substrates 20A, 30A and the sealing agent 40 are collectively ground to form the curved end surface, so that unintended cracks are formed near the curved end surface. It is possible to suppress the occurrence. Then, the pair of glass substrates 20A, 30A and the sealing agent 40 are collectively ground along the outer shape of the liquid crystal panel 10 so that the grinding surfaces of the pair of glass substrates 20A, 30A and the grinding surface of the sealing agent 40 coincide with each other. By doing so, a curved contour line forming the outer shape of the liquid crystal panel 10 can be formed with good accuracy.
  • the pair of glass substrates 20A and 30A and the sealing agent 40 are collectively ground so that the grinding surfaces of the pair of glass substrates 20A and 30A and the grinding surface of the sealing agent 40 coincide with each other. Since the subsequent dimension in the width direction (Y-axis direction dimension) of the sealant 40 is reduced, the frame of the liquid crystal panel 10 can be narrowed. Thus, in the manufacturing method of the liquid crystal panel 10 of the present embodiment, the liquid crystal panel 10 having a curved portion in the outer shape can be manufactured with good shape accuracy while realizing a narrow frame.
  • the sealing agent 40 is applied with a predetermined width along the outer shape of the liquid crystal panel 10 in the sealing agent application step.
  • the sealing agent 40 is applied with a predetermined width along the outer shape of the liquid crystal panel 10 in the sealing agent application step.
  • narrowing the frame of the liquid crystal panel 10 by making the dimension in the width direction of the sealing agent 40 applied on the second glass substrate 30 ⁇ / b> A extremely small, good bonding is performed after the bonded substrate 50 is formed. The strength is not obtained, and as a result, the bonded substrate 50 is peeled off in the dividing step, and the yield may be reduced in the manufacturing process of the liquid crystal panel 10.
  • the sealing agent 40 in the sealing agent application step, has such a width (for example, 700 ⁇ m) that the bonded substrate 50 can ensure good bonding strength after the bonded substrate 50 is formed. By applying, it is possible to suppress the peeling of the bonded substrate 50 in the dividing step.
  • the sealing agent 40 along the outer shape of the liquid crystal panel 10, in a subsequent grinding step, a pair of glass substrates 20 ⁇ / b> A is maintained while maintaining a bonding strength that can suppress peeling of the bonded substrate 50.
  • 30A and the sealant 40 can be collectively ground along the outer shape of the liquid crystal panel 10. As a result, it is possible to suppress a decrease in yield in the manufacturing process of the liquid crystal panel 10.
  • the portion that is the end surface of the mounting area A3 in which the outline is linear in plan view is divided into a substantially linear shape along the outer shape of the liquid crystal panel 10.
  • the end face of the mounting area A3 of the liquid crystal panel 10 is formed while suppressing the occurrence of cracks different from the intended dividing line. Therefore, the end surface of the liquid crystal panel 10 can be formed in the mounting region A3 of the liquid crystal panel 10 without performing a grinding process, and the manufacturing process of the liquid crystal panel 10 can be simplified.
  • the bonded substrate 50 is divided into six by dividing the bonded substrate 50 into six, and the bonded substrate 50 separated into pieces in the dividing step is obtained. A grinding process is performed for each. For this reason, the six liquid crystal panels 10 having a curved portion in the outer shape can be collectively manufactured with good shape accuracy.
  • the thickness of the first glass substrate 120A constituting the color filter substrate and the thickness of the second glass substrate 130A constituting the array substrate are respectively compared with those of the first embodiment. It has been made smaller. Specifically, both glass substrates 120A and 130A have a thickness of 150 ⁇ m.
  • the width direction of the sealing agent 40 can be obtained by grinding both the glass substrates 120A and 130A and the sealing agent 40 on the curved end faces in the grinding process. Can be reduced (for example, 200 ⁇ m to 500 ⁇ m). As a result, the width of the frame portion on the curved end surface can be set to 1 mm or less, and the liquid crystal panel to be manufactured can be narrowed.
  • the liquid crystal panel 210 exemplified in the present embodiment has an outer shape that is substantially the same as that exemplified in the first embodiment, but on both sides of the display area A1 in the X-axis direction, respectively.
  • a through hole 210 ⁇ / b> H is formed along the thickness direction of the liquid crystal panel 210.
  • the part obtained by adding the numeral 200 to the reference numeral in FIG. 1 is the same as that described in the first embodiment.
  • the liquid crystal panel 210 of the present embodiment having the above-described shape can be manufactured as follows. That is, in the sealing agent application step, a sealing agent is further applied around at least a portion where each through-hole 210H is formed on the plate surface of one glass substrate. Then, after performing a bonding step, a preliminary through-hole forming step is performed in which a preliminary through-hole having a diameter smaller than that of the through-hole 210H is formed in a portion of the bonded substrate where each through-hole 210H is formed. Thereafter, in the grinding step, the pair of glass substrates and the sealant on the opening end face of each preliminary through-hole are collectively ground to increase the diameter of each preliminary through-hole, thereby forming each through-hole 210H.
  • the pair of glass substrates and the sealant are collectively ground to increase the diameter of the preliminary through hole, which is different from the intended line.
  • a through hole having a desired diameter can be formed while suppressing the occurrence of cracks.
  • the third embodiment will be described with reference to FIG.
  • the contour line of the horizontally long display area A1 in the liquid crystal panel 310 has a shape in which a plurality of horizontally oblong contour lines are cut out by arc-shaped notches. Note that, in FIG. 12, the part in which the numeral 300 is added to the reference numeral in FIG. 1 is the same as that described in the first embodiment.
  • liquid crystal panel 310 of the present embodiment having the outer shape as described above, a portion of the end surface of the display area A1 in which the contour line is linear in a plan view is divided in the manufacturing process in the manufacturing process.
  • the end face can be formed without performing a grinding process while suppressing the occurrence of cracks different from the intended dividing line. For this reason, the manufacturing process of the liquid crystal panel 310 can be simplified.
  • Embodiment 4 will be described with reference to FIG.
  • the liquid crystal panel 410 exemplified in the present embodiment has a substantially circular outer shape in plan view, and all contour lines forming the outer shape are curved. Therefore, a part of the outline forming the outer shape of the mounting area A3 is also curved.
  • the part obtained by adding the numeral 400 to the reference numeral in FIG. 1 is the same as that described in the first embodiment.
  • the liquid crystal panel 410 of the present embodiment having the shape as described above can be manufactured by grinding the entire end face of the bonded substrate in the grinding step. Therefore, a curved contour line that forms the outer shape of the liquid crystal panel 410 can be formed over the entire end face of the bonded substrate while securing the IC chip mounting area A3.
  • the fifth embodiment will be described with reference to FIGS.
  • a method of manufacturing a plurality of liquid crystal panels (specifically, 28 liquid crystal panels) in a batch with respect to a liquid crystal panel whose outer shape is a substantially semicircular shape in plan view will be exemplified.
  • the straight line portion of the contour line of the outer shape having a substantially semicircular shape in plan view becomes the contour line forming the outer shape of the mounting region A3 (see FIG. 19).
  • a CF layer is formed on the first glass substrate 520A by a multiple of 4, and when the two glass substrates 520A and 530A are bonded together, the first CF layer is opposed to each CF layer.
  • Two TFT layers are formed in the same number as the CF layers at positions on the glass substrate 530A.
  • the sealing agent 40 is applied along the outer shape of the liquid crystal panel on the second glass substrate 530A so as to surround each TFT layer on the second glass substrate 530A.
  • the alignment marks AM1 (see FIG. 14) provided on both glass substrates 520A and 530A are used so that each CF layer and each TFT layer 30L face each other.
  • the two glass substrates 520A and 530A are bonded together to form a bonded substrate before the first cutting described below.
  • a linear cut line 520C (see FIG. 14) is put in a portion that becomes a boundary between a mounting area of each liquid crystal panel to be manufactured and another area.
  • the primary bonded substrate before the primary division is primarily divided so that the four liquid crystal panels to be manufactured exist on one substrate, and a bonded substrate 550 shown in FIG. 14 is formed.
  • two bonded substrates 550 are laminated via a photo-curable laminating resin (an example of a fixing agent) 580 (lamination step). Thereafter, pressure is applied to one of the bonded substrates 550 to extrude excess resin from the laminating resin 580 while excluding bubbles, to make the thickness of the laminating resin 580 constant, and then to bond the two sheets again.
  • the substrate 550 is aligned.
  • the above-mentioned lamination process is performed at a predetermined exposure amount (for example, 5 to 500 mJ / cm 2 ) at the four corners of the lamination resin 580, specifically, at the four corners of the bonded substrate 550 located outside the liquid crystal panel to be manufactured.
  • each is performed while irradiating spot ultraviolet rays (see arrows shown in FIG. 16).
  • the lamination resin 580 is cured to some extent, and the space between the glass substrates 520A and 530A is temporarily fixed (curing step).
  • the 7 bonded substrates 550 are laminated
  • the lamination resin 580 disposed between the seven bonded substrates 550 is irradiated with ultraviolet rays and heated.
  • the lamination resin 580 is fully cured, and the gap between the bonded substrates 550 is fixed via the lamination resin 580 (curing step).
  • the dividing substrate is divided into four by performing the above-described dividing step on the laminated substrate on which the seven bonded substrates 550 are laminated. In this dividing step, the laminated substrate is divided at once.
  • a laminated substrate 550A after four grinding steps (hereinafter, referred to as “post-ground laminated substrate 550A”) is formed.
  • the four laminated substrates 550A after grinding are each immersed in warm water (for example, 85 ° C.), the lamination resin 580 is peeled off from each bonded substrate 550, and the laminated substrates 550A after grinding are bonded after a plurality of grinding steps. Separated into substrates (peeling step). Then, a part of 1st glass substrate 520A is removed according to the cut line 520C about each bonding board
  • the plurality of laminated substrates 550 are divided and separated into individual pieces so as to match the outer shape of the liquid crystal panel to be manufactured.
  • a plurality of bonded substrates 550 can be divided at a time.
  • each of the laminated substrate substrates separated into individual pieces is ground to form a curve that forms the outer shape of the liquid crystal panel to be manufactured for each of the laminated substrate substrates separated into individual pieces.
  • a plurality of liquid crystal panels having curved portions in the outer shape can be manufactured at a time with good shape accuracy while realizing a narrow frame.
  • liquid crystal layer is formed between the two glass substrates by the ODF method, but the method of forming the liquid crystal layer between the two glass substrates is not limited.
  • a liquid crystal layer may be formed by injecting liquid crystal between both glass substrates after the glass substrates are bonded together to form a bonded substrate.
  • the method for manufacturing the liquid crystal panel constituting the liquid crystal display device has been exemplified, but the type of the display device including the display panel manufactured by the manufacturing method of the present invention is not limited.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention comprend : une étape d'application de produit d'étanchéité dans laquelle une paire de substrats est préparée, un motif de film mince étant formé sur au moins un des substrats, et un agent d'étanchéité est appliqué sur le ou les substrats dans une forme entourant le motif de film mince ; une étape de liaison qui est réalisée après l'étape d'application de produit d'étanchéité et dans laquelle les deux substrats sont liés l'un à l'autre au moyen du produit d'étanchéité pour former un substrat lié ; une étape de division qui est réalisée après l'étape de liaison et dans laquelle les deux substrats dans le substrat lié, qui sont positionnés à l'extérieur du produit d'étanchéité entourant le motif de film mince dans une vue en plan, sont divisés ; et une étape de broyage qui est réalisée après l'étape de division et dans laquelle les deux substrats et le produit d'étanchéité, dans au moins une partie d'une zone du substrat lié où se superposent les deux substrats et le produit d'étanchéité dans une vue en plan, sont broyés en masse le long de la forme externe de façon à ce que les surfaces au sol des deux substrats et la surface au sol du produit d'étanchéité correspondent afin de former une surface d'extrémité de panneau d'affichage qui forme une ligne de profil incurvée.
PCT/JP2016/064992 2015-05-27 2016-05-20 Procédé de production d'un panneau d'affichage WO2016190234A1 (fr)

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US11294224B2 (en) * 2019-04-04 2022-04-05 Sharp Kabushiki Kaisha Method of producing round shape display including polarizing plate

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JPS56107214A (en) * 1980-01-31 1981-08-26 Citizen Watch Co Ltd Manufacture of circular liquid crystal display cell
JPH02289823A (ja) * 1990-04-20 1990-11-29 Casio Comput Co Ltd 電気光学表示セルの製造方法
JPH11326883A (ja) * 1998-05-12 1999-11-26 Casio Comput Co Ltd 液晶表示パネルの製造方法
JP2008224802A (ja) * 2007-03-09 2008-09-25 Sharp Corp 表示装置及びその製造方法
JP2009116214A (ja) * 2007-11-09 2009-05-28 Epson Imaging Devices Corp 液晶パネル及びその製造方法
JP2010020221A (ja) * 2008-07-14 2010-01-28 Toshiba Mobile Display Co Ltd 液晶セルおよび液晶セルの製造方法
JP2013152310A (ja) * 2012-01-24 2013-08-08 Panasonic Liquid Crystal Display Co Ltd 一以上の液晶表示素子の製造方法
JP2014210670A (ja) * 2011-09-01 2014-11-13 旭硝子株式会社 強化ガラスパネルの製造方法

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JP3874899B2 (ja) 1997-07-24 2007-01-31 株式会社半導体エネルギー研究所 液晶パネルの作製方法
KR20060087577A (ko) * 2003-09-24 2006-08-02 샤프 가부시키가이샤 액정 표시 패널의 제조 방법 및 액정 표시 패널의 제조장치

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Publication number Priority date Publication date Assignee Title
JPS541317A (en) * 1977-06-06 1979-01-08 Hitachi Ltd Method of cutting glass sheet
JPS56107214A (en) * 1980-01-31 1981-08-26 Citizen Watch Co Ltd Manufacture of circular liquid crystal display cell
JPH02289823A (ja) * 1990-04-20 1990-11-29 Casio Comput Co Ltd 電気光学表示セルの製造方法
JPH11326883A (ja) * 1998-05-12 1999-11-26 Casio Comput Co Ltd 液晶表示パネルの製造方法
JP2008224802A (ja) * 2007-03-09 2008-09-25 Sharp Corp 表示装置及びその製造方法
JP2009116214A (ja) * 2007-11-09 2009-05-28 Epson Imaging Devices Corp 液晶パネル及びその製造方法
JP2010020221A (ja) * 2008-07-14 2010-01-28 Toshiba Mobile Display Co Ltd 液晶セルおよび液晶セルの製造方法
JP2014210670A (ja) * 2011-09-01 2014-11-13 旭硝子株式会社 強化ガラスパネルの製造方法
JP2013152310A (ja) * 2012-01-24 2013-08-08 Panasonic Liquid Crystal Display Co Ltd 一以上の液晶表示素子の製造方法

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US10088712B2 (en) 2018-10-02
US20180180912A1 (en) 2018-06-28

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