WO2016180053A1 - 指纹识别模组 - Google Patents

指纹识别模组 Download PDF

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Publication number
WO2016180053A1
WO2016180053A1 PCT/CN2016/071701 CN2016071701W WO2016180053A1 WO 2016180053 A1 WO2016180053 A1 WO 2016180053A1 CN 2016071701 W CN2016071701 W CN 2016071701W WO 2016180053 A1 WO2016180053 A1 WO 2016180053A1
Authority
WO
WIPO (PCT)
Prior art keywords
end surface
fingerprint identification
disposed
receiving portion
transmitting member
Prior art date
Application number
PCT/CN2016/071701
Other languages
English (en)
French (fr)
Inventor
李扬渊
丁绍波
Original Assignee
苏州迈瑞微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州迈瑞微电子有限公司 filed Critical 苏州迈瑞微电子有限公司
Priority to US15/570,777 priority Critical patent/US20180322326A1/en
Priority to KR1020177031362A priority patent/KR20180025845A/ko
Priority to JP2018509955A priority patent/JP2018529158A/ja
Priority to EP16791903.4A priority patent/EP3296921A4/en
Publication of WO2016180053A1 publication Critical patent/WO2016180053A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147—Details of sensors, e.g. sensor lenses
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to the field of manufacturing and packaging of fingerprint recognition modules.
  • the fingerprint identification module is a device that uses fingerprint recognition technology to conveniently and quickly acquire a fingerprint image of a user, thereby identifying the identity of the user.
  • the fingerprint identification module disclosed in the prior art includes an electrical mechanism (the electrical mechanism includes a fingerprint identification chip and a circuit board), but no independent mechanical mechanism is provided, and the electrical mechanism is directly fixed between the upper cover and the lower cover during manufacture. Since the upper and lower end faces of the electrical mechanism are fixedly connected to the upper and lower cover plates respectively, the force exerted by the user's finger pressing the fingerprint recognition module is directly transmitted to the electrical mechanism, which may easily cause mechanical damage of the electrical mechanism or cause an electrical mechanism. The conductive material between the various components is loosened, which leads to poor contact, and the above faults directly affect the service life of the fingerprint recognition module.
  • fingerprint identification module manufacturers also have some existing solutions.
  • Apple uses the avoidance method to not solder on the back of the fingerprint identification chip, but to connect the circuit board from the side of the chip.
  • This design leads to fingerprints.
  • the identification module has high manufacturing cost and low yield.
  • the fingerprint module used by Huawei Mate7 adopts a layer of foam under the fingerprint identification chip and maximizes the solder area on the back of the chip. In essence, the chip's resistance to pressure is improved, so Huawei puts the fingerprint module on the back of the phone that is not often stressed. At the same time, because of its large size, it is not suitable for the industrial design of small and medium-sized mobile phones.
  • a fingerprint identification module comprising:
  • the mechanical mechanism includes an upper cover plate and a centrally hollowed force transmitting member, and the upper cover plate is disposed on the top of the force transmitting member and the force transmitting member to form a receiving space.
  • the electrical mechanism includes a circuit board and a fingerprint identification chip, the circuit board includes an extension portion and a connection portion, the fingerprint identification chip is disposed in the receiving space, and is electrically connected to the connecting portion through a conductive material;
  • the top end surface of the fingerprint identification chip is fixedly connected to the bottom end surface of the upper cover, and the horizontal height of the bottom end surface of the connecting portion is higher than the horizontal height of the bottom end surface of the mechanical mechanism.
  • a support arm is disposed on an inner wall of the hollow portion of the force transmitting member, and the support arm forms a step with a top end surface of the force transmitting member, and the receiving space is divided into a first receiving portion of the top end surface of the force transmitting member and a second receiving portion adjacent to the bottom end surface of the force conducting member, wherein the upper cover is disposed in the first receiving portion, the fingerprint identification chip and the The connecting portion is disposed in the second receiving portion, and a bottom end surface of the upper cover is fixedly coupled to an upper surface of the support arm.
  • the bottom of the receiving space is open, and the inner wall of the hollow portion of the force transmitting member is provided with a supporting arm, and the mechanical mechanism further includes a lower cover, and a bottom end surface of the upper cover The top surface of the lower cover is fixedly connected to the lower surface of the support arm, and a gap is left between the connecting portion and the lower cover.
  • the support arm and the top end surface and the bottom end surface of the force transmitting member respectively form a step, and the receiving space is divided closer to the force transmitting member than the supporting arm a first receiving portion of the top end surface, a third receiving portion closer to the bottom end surface of the force transmitting member than the supporting arm, and a second receiving portion between the first receiving portion and the third receiving portion
  • the upper cover is disposed in the first receiving portion
  • the lower cover is disposed in the third receiving portion
  • the fingerprint identification chip and the connecting portion are disposed in the second receiving portion
  • the upper cover and the lower cover close the second receiving portion.
  • the upper cover and the force transmitting member are of a unitary structure.
  • the mechanical mechanism further includes a lower cover, a top end surface of the lower cover is fixedly connected to a bottom end surface of the mechanical mechanism, and the lower cover closes the receiving space.
  • the mechanical mechanism further includes a reinforcing plate disposed under the circuit board and hollowed out at the middle, the hollowed out position and the conductive material on the back surface of the fingerprint identification chip The location corresponds.
  • the electrical mechanism further includes a substrate disposed between the fingerprint identification chip and the connecting portion.
  • the edge of the substrate extends into the mechanical mechanism.
  • the edge of the connecting portion of the circuit board extends into the mechanical mechanism.
  • the technical effect of the present invention is that the fingerprint recognition module of the present invention is provided with a mechanical mechanism on the periphery of the electrical mechanism, and the applied stress during the use of the user's finger is dispersed by the mechanical mechanism to the fingerprint recognition module.
  • the electrical mechanism only bears a small amount of pressure, and leaves a gap at the bottom of the electrical mechanism, which provides the electrical mechanism with an elastic deformation allowance to prevent the electrical mechanism from being in contact with other components after being deformed by pressure, and can be used for the electrical mechanism during use.
  • the life of the fingerprint recognition module can be significantly improved.
  • FIG. 1 is a cross-sectional structural view of a fingerprint recognition module according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional structural diagram of a fingerprint identification module according to Embodiment 2 of the present invention.
  • FIG. 3 is a schematic diagram of an explosion structure of a fingerprint identification module according to Embodiment 2 of the present invention.
  • FIG. 4 is a cross-sectional structural diagram of a fingerprint identification module according to Embodiment 3 of the present invention.
  • FIG. 5 is a cross-sectional structural diagram of a fingerprint identification module according to Embodiment 4 of the present invention.
  • FIG. 6 is a schematic exploded view of an electrical mechanism and a reinforcing plate according to Embodiment 5 of the present invention.
  • FIG. 7 is a cross-sectional structural view of a fingerprint identification module in a case where the circuit board does not exceed the receiving space of the fingerprint recognition chip according to Embodiment 5 of the present invention
  • FIG. 8 is a cross-sectional structural view of a fingerprint recognition module in a case where a circuit board exceeds a receiving space of a fingerprint recognition chip according to Embodiment 5 of the present invention
  • FIG. 9 is a cross-sectional structural view of a fingerprint recognition module in a case where a circuit board exceeds a receiving space of a fingerprint recognition chip according to Embodiment 5 of the present invention.
  • FIG. 10 is a cross-sectional structural view of a fingerprint recognition module in a case where the circuit board and the substrate do not exceed the receiving space of the fingerprint recognition chip according to Embodiment 6 of the present invention
  • FIG. 11 is a cross-sectional view showing the structure of a fingerprint recognition module in which the circuit board of the sixth embodiment of the present invention exceeds but the substrate does not exceed the receiving space of the fingerprint recognition chip;
  • FIG. 12 is a cross-sectional structural view of a fingerprint recognition module in a case where the circuit board does not extend but the substrate exceeds the receiving space of the fingerprint recognition chip according to Embodiment 6 of the present invention
  • FIG. 13 is a cross-sectional view showing the structure of a fingerprint recognition module in which the circuit board and the substrate are both outside the receiving space of the fingerprint recognition chip according to Embodiment 6 of the present invention.
  • FIG. 1 shows a fingerprint identification module using a TSV (Through Silicon Via) package technology.
  • the TSV package technology is a prior art and will not be described here.
  • the fingerprint identification module includes:
  • the electrical mechanism 11 and the mechanical mechanism 12 disposed on the periphery of the electrical mechanism 11 for dividing the pressure of the electrical mechanism 11 are provided.
  • the mechanical mechanism 12 includes an upper cover 121 and a hollowed-out force transmitting member 122.
  • the upper cover 121 and the force transmitting member 122 together form a receiving space.
  • the bottom of the receiving space An opening that communicates with the hollowed middle portion.
  • the electrical mechanism 11 includes a circuit board 111 and a fingerprint identification chip 112.
  • the fingerprint identification chip 112 is configured to collect fingerprint image signals of a user.
  • the circuit board 111 includes an extension portion (not shown in FIG. 1) and is disposed in the housing. In the connection portion in the space, the fingerprint recognition chip 112 is disposed in the accommodating space, and the signal output pad is located on the back surface, and is electrically connected to the signal input pad on the front surface of the connection portion by the solder 113.
  • a support arm 1221 is disposed on an inner wall of the hollow portion of the force transmitting member 122, and the support arm 1221 forms a step with a top end surface of the force conducting member 122, and the receiving space is divided into the force conducting member.
  • the upper cover 121 is disposed in the first receiving portion, and the fingerprint identification chip 112 and the The connecting portion is disposed in the second receiving portion, and a bottom end surface of the upper cover 121 and a top surface of the support arm 1221 are fixedly connected by glue.
  • the top end surface of the fingerprint identification chip 112 and the bottom end surface of the upper cover 121 are fixedly connected by glue.
  • the applied stress is pressed by the mechanical mechanism 12 to the fingerprint recognition module.
  • the electrical mechanism 11 is only subjected to a small amount of pressure, which can reduce the mechanical damage probability of the electrical mechanism 11, and at the same time, the electrical mechanism 11 is subjected to The smaller the pressure, the smaller the deformation that occurs during use, and the more difficult the solder 113 between the fingerprint identification chip 112 and the connection portion is to loosen.
  • a horizontal height of the bottom end surface of the connecting portion is higher than a horizontal height of the bottom end surface of the force transmitting member 122, that is, a gap 13 is left at the bottom of the connecting portion, and the gap 13 provides an elastic deformation allowance to the electrical mechanism 11,
  • the electrical mechanism 11 is prevented from being in contact with other components after being deformed by pressure, and the electrical mechanism 11 can be protected during use.
  • the circuit board 111 is preferably a flexible printed circuit board 111, which helps to reduce the overall thickness of the electrical mechanism 11, so that the gap 13 at the bottom of the electrical mechanism 11 can be designed without changing the thickness of the fingerprint recognition module. It is bigger.
  • FIG. 2 and FIG. 3 show a fingerprint identification module using TSV (Through Silicon Via) packaging technology.
  • TSV packaging technology is prior art and is no longer used here. Narration.
  • the fingerprint identification module includes:
  • the mechanical mechanism 22 includes an upper cover plate 221, a lower cover plate 222, and a centrally hollowed force transmitting member 223.
  • the inner wall of the central portion of the force transmitting member 223 is provided with a support arm 2231, and the support arm 2231 is The top end surface and the bottom end surface of the force transmitting member 223 respectively form a step, and the receiving space is divided into a first receiving portion 24 closer to the top end surface of the force conducting member 223 than the supporting arm 2231 and compared with The support arm 2231 is closer to the third 26 receiving portion of the bottom end surface of the force conducting member 223, and the second receiving portion 25 between the first receiving portion 24 and the third receiving portion 26, the upper cover
  • the plate 221 is disposed in the first receiving portion 24, the lower cover plate 222 is disposed in the third receiving portion 26, and the fingerprint identification chip 212 and the connecting portion 2111 are disposed in the second receiving portion
  • the middle cover 25 and the upper cover 221 and the lower cover 222 close the second receiving portion 25.
  • the bottom end surface of the upper cover plate 221 is fixedly connected to the upper surface of the support arm 2231, and the top end surface of the lower cover plate 222 is fixedly connected to the lower surface of the support arm 2231.
  • the embodiment can prevent the reverse stress (the stress from the bottom to the top) from damaging the electrical mechanism 21.
  • the electrical mechanism 21 includes a circuit board 211 and a fingerprint identification chip 212.
  • the fingerprint recognition chip 212 is configured to collect a fingerprint image signal of the user.
  • the circuit board 211 includes an extension portion 2112 and a connection disposed in the second receiving portion 25.
  • the fingerprint recognition chip 212 is disposed in the second accommodating portion 25, and the signal output pad is located on the back surface, and is electrically connected to the signal input pad on the front surface of the connecting portion 2111 via the solder 213.
  • the top end surface of the fingerprint recognition chip 212 and the bottom end surface of the upper cover 221 are fixedly connected by glue.
  • the applied stress is pressed by the mechanical mechanism 22 to the fingerprint recognition module.
  • the electrical mechanism 21 is only subjected to a small amount of pressure, which can reduce the mechanical damage probability of the electrical mechanism 21, and at the same time, the electrical mechanism 21 is subjected to The smaller the pressure, the smaller the deformation that occurs during use, and the less the solder 213 between the fingerprint identification chip 212 and the connecting portion 2111 is loosened.
  • a gap 23 is left between the connecting portion 2111 and the lower cover 222, and the gap 23 provides an elastic deformation allowance to the electrical mechanism 21 to prevent the electrical mechanism 21 from being pressed and deformed and then touched with other components.
  • the electrical mechanism 21 is protected during use.
  • neither the fingerprint identification chip 212 nor the connecting portion 2111 is in contact with the inner wall of the hollow portion of the force transmitting member 223.
  • the circuit board 211 is preferably a flexible printed circuit board 211, which helps to reduce the overall thickness of the electrical mechanism 21, so that the gap at the bottom of the electrical mechanism 21 can be designed without changing the thickness of the fingerprint recognition module. Bigger.
  • FIG. 4 shows a fingerprint identification module using a plastic packaging technology.
  • the plastic packaging technology is prior art and will not be described herein.
  • the fingerprint identification module includes:
  • the mechanical mechanism 32 in the embodiment is manufactured by a plastic packaging technology, and the upper cover 321 and the force transmitting member 322 in the mechanical mechanism 32 are a unitary structure.
  • the electrical mechanism 31 includes a circuit board 311 and a fingerprint identification chip 312 disposed on the circuit board 311.
  • the fingerprint identification chip 312 is configured to collect fingerprint image signals of the user.
  • the fingerprint identification chip and the connecting portion may be in contact with the inner wall of the hollow portion of the force transmitting member, or may not be in contact with the inner wall of the hollow portion of the force transmitting member. This embodiment is not limited thereto.
  • connection relationship between the components included in the electrical mechanism 31 and the connection relationship between the electrical mechanism 31 and the mechanical mechanism 32 are the same as those in the first embodiment and the second embodiment.
  • the bottom of the electrical mechanism 31 is provided with a gap 33, and the suspension is disposed at the mechanical mechanism 32. It can be in the accommodating space formed.
  • FIG. 5 shows a fingerprint identification module using a plastic packaging technology, which is different from the fingerprint identification module provided in the third embodiment.
  • the mechanical mechanism 42 in this embodiment further includes a lower cover 421.
  • the top end surface of the lower cover plate 421 and the lower end surface of the force transmitting member 422 are fixedly connected by glue to close the receiving space.
  • the structure of the lower cover 421 which is increased in this embodiment as compared with the fourth embodiment can prevent the reverse stress (the stress from the bottom to the top) from damaging the electrical mechanism 41.
  • the fingerprint identification module in the embodiment is also manufactured by using a plastic packaging technology, and is different from the first, second, third, and fourth embodiments of the circuit board of the embodiment.
  • the reinforcing plate 523 is used as a reinforcing structure of the circuit board 511.
  • the middle portion of the reinforcing plate 523 is hollowed out corresponding to the solder 513 on the back surface of the fingerprint identification chip 512, so as to ensure a gap is left in the bottom of the electrical connection of the electrical connection.
  • the circuit board 511 may extend beyond the receiving space where the fingerprint identification chip 512 is located, or extend into the mechanical mechanism 52 and extend to the mechanical mechanism 52.
  • the portion of the circuit board 511 can withstand the strain caused by the conduction of the pressure in the mechanical mechanism 52.
  • the above structure can be flexibly adjusted according to the size of the circuit board 511. This embodiment is not limited thereto.
  • circuit board 511 extends into the mechanical mechanism 52, it will be subjected to pressure, but since this part of the circuit board 511 is not electrically connected to the fingerprint identification chip 512 (the pad is not provided). Even if it is pressed, it does not cause the solder 513 between the fingerprint recognition chip 512 and the circuit board 511 to be loose.
  • the fingerprint identification module in the embodiment is also manufactured by using a plastic packaging technology, and is different from the first, second, third, and fourth embodiments of the circuit board 612 of the embodiment.
  • the electrical mechanism 61 further includes a substrate 613 which is disposed between the fingerprint identification chip 611 and the connection portion of the circuit board 612 as an electrical connection member.
  • the circuit board 612 and the substrate 613 may extend beyond the receiving space where the fingerprint identifying chip is located, or extend beyond the receiving space of the fingerprint identifying chip 611 to the mechanical mechanism 62, and extend to the circuit board 612 in the mechanical mechanism 62.
  • the portion of the substrate 613 can withstand the strain caused by the conduction of the pressure in the mechanical mechanism 62.
  • the above structure can be flexibly adjusted according to the size of the circuit board 612 and the substrate 613. This embodiment is not limited thereto.
  • the circuit board 612 and/or the substrate 613 although extending into the mechanical mechanism 62, are subject to pressure, but since this portion of the circuit board 612 and/or the substrate 613 is not associated with the fingerprint recognition chip.
  • the 611 is electrically connected (no pad is provided), and even if it is pressed, the solder between the fingerprint chip 611 and the circuit board 612 and the substrate 613 is not loosened.

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Abstract

一种指纹识别模组，指纹识别模组包括：电学机构(11)和设置在电学机构(11)外围用于分导电学机构(11)所受压力的力学机构(12)；力学机构(12)包括上盖板(121)和中部镂空的力传导部件(122)，上盖板(121)设置于力传导部件(122)顶部与力传导部件(122)共同组成一收容空间；电学机构(11)包括电路板(111)和指纹识别芯片(112)，电路板(111)包括延伸部和连接部，指纹识别芯片(112)设置在收容空间内，并通过导电物与连接部电性连接；指纹识别芯片(112)的顶部端面与上盖板(121)的底部端面固定连接，连接部底部端面的水平高度高于力学机构(12)底部端面的水平高度。相较于现有技术，该指纹识别模组，使用力学机构(12)分散电学机构(11)所受的压力，可以在使用过程中对电学机构(11)起到保护作用，能够显著提升指纹识别模组的使用寿命。

Description

指纹识别模组
本申请要求了申请日为2015年05月08日，申请号为201510233087.1，发明名称为“指纹识别模组”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及指纹识别模组的制造和封装技术领域。
背景技术
由于指纹具有终身不变性、唯一性等特性，因此，通过识别指纹可以准确可靠地识别用户身份。指纹识别模组就是使用指纹识别技术，便捷、快速地获取用户的指纹图像，进而对用户的身份进行识别的装置。
现有技术所公开的指纹识别模组包括电学机构(电学机构包括指纹识别芯片和电路板)，但是未设置独立的力学机构，制造时直接将电学机构固定在上盖板和下盖板之间，由于电学机构的上下端面分别与上下盖板固定接触连接，使用时，用户手指按压指纹识别模组所施加的力全部直接传递到电学机构上，容易导致电学机构的机械损坏，或者造成电学机构的各个部件之间的导电物质松脱，进而导致接触不良，上述故障都会直接影响到指纹识别模组的使用寿命。
针对上述问题，指纹识别模组制造厂商也有一些现有的解决方式，例如：苹果公司采用回避做法，不在指纹识别芯片背面做焊锡，而是从芯片侧面接线与电路板连接，这种设计导致指纹识别模组制造成本高，而且良品率低；华为Mate7所采用的指纹模组采用的做法是在指纹识别芯片下方垫一层泡棉和尽量扩大芯片背面的焊锡面积，但这两种做法并未本质改善芯片的耐压力，所以华为将指纹模组置于不常受压的手机背面，同时因为尺寸较大，不适合中小尺寸手机的工业设计。
发明内容
本发明的目的在于提供一种体积小且经久耐用的指纹识别模组。
为实现上述发明目的，本发明采用如下技术方案：
一种指纹识别模组，所述指纹识别模组包括：
电学机构和设置在所述电学机构外围用于分导所述电学机构所受压力的力学机构。
所述力学机构包括上盖板和中部镂空的力传导部件，所述上盖板设置于所述力传导部件顶部与所述力传导部件共同组成一收容空间。
所述电学机构包括电路板和指纹识别芯片，所述电路板包括延伸部和连接部，所述指纹识别芯片设置在所述收容空间内，并通过导电物与所述连接部电性连接；所述指纹识别芯片的顶部端面与所述上盖板的底部端面固定连接，所述连接部底部端面的水平高度高于所述力学机构底部端面的水平高度。
作为本发明进一步改进的技术方案：所述力传导部件中部镂空处的内壁上设有支撑臂，所述支撑臂与所述力传导部件的顶部端面形成一台阶，将所述收容空间分为靠近所述力传导部件顶部端面的第一收容部以及靠近所述力传导部件底部端面的第二收容部，所述上盖板设置于所述第一收容部中，所述指纹识别芯片和所述连接部设置在所述第二收容部中，所述上盖板的底部端面与所述支撑臂的上表面固定连接。
作为本发明进一步改进的技术方案：所述收容空间底部开口，所述力传导部件中部镂空处的内壁上设有支撑臂，所述力学机构还包括下盖板，所述上盖板的底部端面与所述支撑臂的上表面固定连接，所述下盖板的顶部端面与所述支撑臂的下表面固定连接，所述连接部与所述下盖板之间留有空隙。
作为本发明进一步改进的技术方案：所述支撑臂与所述力传导部件的顶部端面和底部端面分别形成一台阶，将所述收容空间分为相较所述支撑臂更靠近所述力传导部件顶部端面的第一收容部以及相较所述支撑臂更靠近所述力传导部件底部端面的第三收容部，以及位于所述第一收容部和所述第三收容部之间的第二收容部，所述上盖板设置于所述第一收容部中，所述下盖板设置在所述第三收容部中，所述指纹识别芯片和所述连接部设置在所述第二收容部中，且所述上盖板和所述下盖板封闭所述第二收容部。
作为本发明进一步改进的技术方案：所述上盖板和所述力传导部件为一体式结构。
作为本发明进一步改进的技术方案：所述力学机构还包括下盖板，所述下盖板的顶部端面与所述力学机构底部端面固定连接，所述下盖板封闭所述收容空间。
作为本发明进一步改进的技术方案：所述力学机构还包括补强板，所述补强板设置在所述电路板下方且中部镂空，所述镂空的位置与所述指纹识别芯片背面导电物的位置相对应。
作为本发明进一步改进的技术方案：所述电学机构还包括基板，所述基板设置在所述指纹识别芯片和所述连接部之间。
作为本发明进一步改进的技术方案：所述基板的边沿延伸至所述力学机构中。
作为本发明进一步改进的技术方案：所述电路板的连接部的边沿延伸至所述力学机构中。
相对于现有技术，本发明的技术效果在于：本发明的指纹识别模组在电学机构外围设置有力学机构，使用过程中用户手指按压所施加的应力由力学机构分散到指纹识别模组各处，电学机构只承受少量压力，并在电学机构的底部留有空隙，给电学机构提供了弹性形变余量，防止电学机构受压变形后与其他部件碰触，可以在使用过程中对电学机构起到保护作用，能够显著提升指纹识别模组的使用寿命。
附图说明
图1是本发明实施例一所提供的指纹识别模组的剖视结构示意图；
图2是本发明实施例二所提供的指纹识别模组的剖视结构示意图；
图3是本发明实施例二所提供的指纹识别模组的爆炸结构示意图；
图4是本发明实施例三所提供的指纹识别模组的剖视结构示意图；
图5是本发明实施例四所提供的指纹识别模组的剖视结构示意图；
图6是本发明实施例五中电学机构和补强板的爆炸结构示意图；
图7是本发明实施例五中电路板不超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图8是本发明实施例五中电路板超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图9是本发明实施例五中电路板超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图10是本发明实施例六中电路板和基板均不超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图11是本发明实施例六中电路板超出但基板不超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图12是本发明实施例六中电路板不超出但基板超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图；
图13是本发明实施例六中电路板和基板均超出指纹识别芯片所处收容空间情况下的指纹识别模组剖视结构示意图。
具体实施方式
以下将结合附图所示的具体实施方式对本发明进行详细描述。但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
实施例一
请参照图1，图1显示的是一种采用TSV(Through Silicon Via,穿透硅通孔)封装技术的指纹识别模组，TSV封装技术是现有技术，在此不再赘述。所述指纹识别模组包括：
电学机构11和设置在所述电学机构11外围用于分导所述电学机构11所受压力的力学机构12。
所述力学机构12包括上盖板121和中部镂空的力传导部件122，所述上盖板121与所述力传导部件122共同组成一收容空间，在本实施方式中，所述收容空间的底部开口，连通所述镂空的中部。
所述电学机构11包括电路板111和指纹识别芯片112，指纹识别芯片112用于采集用户的指纹图像信号，所述电路板111包括延伸部(图1中未画出)和设置于所述收容空间内的连接部，所述指纹识别芯片112设置在所述收容空间内，其信号输出焊盘位于背面，并通过焊锡113与连接部正面的信号输入焊盘电性连接。
所述力传导部件122中部镂空处的内壁上设有支撑臂1221，所述支撑臂1221与所述力传导部件122的顶部端面形成一台阶，将所述收容空间分为靠近所述力传导部件122顶部端面的第一收容部14以及靠近所述力传导部件122底部端面的第二收容部15，所述上盖板121设置于所述第一收容部中，所述指纹识别芯片112和所述连接部设置在所述第二收容部中，所述上盖板121的底部端面与所述支撑臂1221的上表面通过胶水固定连接。
指纹识别芯片112的顶部端面与上盖板121的底部端面之间使用胶水固定连接。使用过程中，用户手指按压所施加的应力由力学机构12分散引导到指纹识别模组各处，电学机构11只承受少量压力，可以降低电学机构11的机械损坏几率，同时，电学机构11所承受的压力越小，其在使用过程中所发生的形变也越小，指纹识别芯片112与连接部之间的焊锡113越不易松脱。
所述连接部底部端面的水平高度高于所述力传导部件122底部端面的水平高度，也就是在连接部的底部留有空隙13，所述空隙13给电学机构11提供了弹性形变余量，防止电学机构11受压变形后与其他部件碰触，可以在使用过程中对电学机构11起到保护作用。
所述电路板111最好是挠性印刷电路板111，有助于降低电学机构11的整体厚度，如此，在指纹识别模组厚度不变的情况下，可以将电学机构11底部的空隙13设计得更大。
实施例二
请参照图2至3，图2、图3显示的是一种采用TSV(Through Silicon Via,穿透硅通孔)封装技术的指纹识别模组，TSV封装技术是现有技术，在此不再赘述。所述指纹识别模组包括：
电学机构21和设置在所述电学机构21外围用于分导所述电学机构21所受压力的力学机构22。
所述力学机构22包括上盖板221、下盖板222和中部镂空的力传导部件223，所述力传导部件223中部镂空处的内壁上设有支撑臂2231，所述支撑臂2231与所述力传导部件223的顶部端面和底部端面分别形成一台阶，将所述收容空间分为相较所述支撑臂2231更靠近所述力传导部件223顶部端面的第一收容部24以及相较所述支撑臂2231更靠近所述力传导部件223底部端面的第三26收容部，以及位于所述第一收容部24和所述第三收容部26之间的第二收容部25，所述上盖板221设置于所述第一收容部24中，所述下盖板222设置在所述第三收容部中26，所述指纹识别芯片212和所述连接部2111设置在所述第二收容部中25，且所述上盖板221和所述下盖板222封闭所述第二收容部25。
所述上盖板221的底部端面与所述支撑臂2231的上表面固定连接，所述下盖板222的顶部端面与所述支撑臂2231的下表面固定连接。
本实施例相较于实施例一所增加的下盖板222结构可以防止反向应力(由下至上的应力)损坏电学机构21。
所述电学机构21包括电路板211和指纹识别芯片212，指纹识别芯片212用于采集用户的指纹图像信号，所述电路板211包括延伸部2112和设置于所述第二收容部25内的连接部2111，所述指纹识别芯片212设置在所述第二收容部25内，其信号输出焊盘位于背面，并通过焊锡213与连接部2111正面的信号输入焊盘电性连接。
指纹识别芯片212的顶部端面与上盖板221的底部端面之间使用胶水固定连接。使用过程中，用户手指按压所施加的应力由力学机构22分散引导到指纹识别模组各处，电学机构21只承受少量压力，可以降低电学机构21的机械损坏几率，同时，电学机构21所承受的压力越小，其在使用过程中所发生的形变也越小，指纹识别芯片212与连接部2111之间的焊锡213越不易松脱。
所述连接部2111与所述下盖板222之间留有空隙23，所述空隙23给电学机构21提供了弹性形变余量，防止电学机构21受压变形后与其他部件碰触，可以在使用过程中对电学机构21起到保护作用。
优选的，指纹识别芯片212和连接部2111均不与力传导部件223中部镂空处的内壁接触。
所述电路板211最好是挠性印刷电路板211，有助于降低电学机构21的整体厚度，如此，在指纹识别模组厚度不变的情况下，可以将电学机构21底部的空隙设计得更大。
实施例三
请参照图4，图4显示的是一种采用塑料封装技术的指纹识别模组，塑料封装技术是现有技术，在此不再赘述。所述指纹识别模组包括：
电学机构31和设置在所述电学机构31外围用于分导所述电学机构31所受压力的力学机构32。
区别于实施例一、二所提供的指纹识别模组，本实施例中的力学机构32采用塑料封装技术制造，力学机构32中的上盖板321和力传导部件322是一体式结构。
所述电学机构31包括电路板311和设置在所述电路板311上的指纹识别芯片312，指纹识别芯片312用于采集用户的指纹图像信号。
指纹识别芯片和连接部可以与力传导部件中部镂空处的内壁接触，也可以不与力传导部件中部镂空处的内壁接触，本实施例不以此为限。
电学机构31所含部件的连接关系以及电学机构31与力学机构32之间的连接关系均与实施例一、二一致，制造时保证电学机构31底部留有空隙33，悬空设置在力学机构32所形成的收容空间内即可。
实施例四
请参照图5，图5显示的是一种采用塑料封装技术的指纹识别模组，区别于实施例三所提供的指纹识别模组，本实施例中的力学机构42还包括下盖板421，所述下盖板421的顶部端面与所述力传导部件422的下端面通过胶水固定连接，封闭所述收容空间。
本实施例相较于实施例四所增加的下盖板421结构可以防止反向应力(由下至上的应力)损坏电学机构41。
实施例五
请参照图6至9，本实施例中的指纹识别模组同样是采用塑料封装技术所制造的，区别于实施例一、二、三、四，本实施例的电路板的连接部下方设有补强板523，用作电路板511的补强结构，补强板523中部与指纹识别芯片512背面焊锡513对应的位置镂空，用以保证电性连接的电学机构底部留有空隙。
请参照图7至9，电路板511可以不超出指纹识别芯片512所处的收容间，也可以超出指纹识别芯片512所处的收容空间，延伸到力学机构52中去，延伸到力学机构52中的电路板511部分可承受压力在所述力学机构52中传导所导致的应变，上述结构可以根据电路板511的大小灵活调整，本实施例并不以此为限。
值得说明的是，图8和图9中，电路板511虽然延伸到力学机构中52，会承受压力，但是由于这部分电路板511并未与指纹识别芯片512电性连接(未设置焊盘)，其即使受压也不会导致指纹识别芯片512和电路板511之间的焊锡513松脱。
实施例六
请参照图10至13，本实施例中的指纹识别模组同样是采用塑料封装技术所制造的，区别于实施例一、二、三、四，本实施例的电路板612的连接部下方设有补强板623， 而且电学机构61还包括基板613，基板613设置在指纹识别芯片611和电路板612的连接部之间，作为电连接部件。
电路板612和基板613可以不超出指纹识别芯片所处的收容间，也可以超出指纹识别芯片611所处的收容空间，延伸到力学机构62中去，延伸到力学机构62中的电路板612和基板613部分可承受压力在所述力学机构62中传导所导致的应变，上述结构可以根据电路板612以及基板613的大小灵活调整，本实施例并不以此为限。
值得说明的是，图11至图13中，电路板612和/或基板613虽然延伸到力学机构62中，会承受压力，但是由于这部分电路板612和/或基板613并未与指纹识别芯片611电性连接(未设置焊盘)，其即使受压也不会导致指纹识别芯片611和电路板612、基板613之间的焊锡松脱。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (10)

  1. 一种指纹识别模组，其特征在于，所述指纹识别模组包括：
    电学机构和设置在所述电学机构外围用于分导所述电学机构所受压力的力学机构；
    所述力学机构包括上盖板和中部镂空的力传导部件，所述上盖板设置于所述力传导部件顶部与所述力传导部件共同组成一收容空间；
    所述电学机构包括电路板和指纹识别芯片，所述电路板包括延伸部和连接部，所述指纹识别芯片设置在所述收容空间内，并通过导电物与所述连接部电性连接；所述指纹识别芯片的顶部端面与所述上盖板的底部端面固定连接，所述连接部底部端面的水平高度高于所述力学机构底部端面的水平高度。
  2. 根据权利要求1所述的指纹识别模组，其特征在于，所述力传导部件中部镂空处的内壁上设有支撑臂，所述支撑臂与所述力传导部件的顶部端面形成一台阶，将所述收容空间分为靠近所述力传导部件顶部端面的第一收容部以及靠近所述力传导部件底部端面的第二收容部，所述上盖板设置于所述第一收容部中，所述指纹识别芯片和所述连接部设置在所述第二收容部中，所述上盖板的底部端面与所述支撑臂的上表面固定连接。
  3. 根据权利要求1所述的指纹识别模组，其特征在于，所述收容空间底部开口，所述力传导部件中部镂空处的内壁上设有支撑臂，所述力学机构还包括下盖板，所述上盖板的底部端面与所述支撑臂的上表面固定连接，所述下盖板的顶部端面与所述支撑臂的下表面固定连接，所述连接部与所述下盖板之间留有空隙。
  4. 根据权利要求3所述的指纹识别模组，其特征在于，所述支撑臂与所述力传导部件的顶部端面和底部端面分别形成一台阶，将所述收容空间分为相较所述支撑臂更靠近所述力传导部件顶部端面的第一收容部以及相较所述支撑臂更靠近所述力传导部件底部端面的第三收容部，以及位于所述第一收容部和所述第三收容部之间的第二收容部，所述上盖板设置于所述第一收容部中，所述下盖板设置在所述第三收容部中，所述指纹识别芯片和所述连接部设置在所述第二收容部中，且所述上盖板和所述下盖板封闭所述第二收容部。
  5. 根据权利要求1所述的指纹识别模组，其特征在于，所述上盖板和所述力传导部件为一体式结构。
  6. 根据权利要求5所述的指纹识别模组，其特征在于，所述力学机构还包括下盖板，所述下盖板的顶部端面与所述力学机构底部端面固定连接，所述下盖板封闭所述收容空间。
  7. 根据权利要求5所述的指纹识别模组，其特征在于，所述力学机构还包括补强板，所述补强板设置在所述电路板下方且中部镂空，所述镂空的位置与所述指纹识别芯片背面导电物的位置相对应。
  8. 根据权利要求7所述的指纹识别模组，其特征在于，所述电学机构还包括基板，所述基板设置在所述指纹识别芯片和所述连接部之间。
  9. 根据权利要求8所述的指纹识别模组，其特征在于，所述基板的边沿延伸至所述力学机构中。
  10. 根据权利要求7所述的指纹识别模组，其特征在于，所述电路板的连接部的边沿延伸至所述力学机构中。
PCT/CN2016/071701 2015-05-08 2016-01-22 指纹识别模组 WO2016180053A1 (zh)

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