WO2015085786A1 - 指纹识别装置和移动终端 - Google Patents
指纹识别装置和移动终端 Download PDFInfo
- Publication number
- WO2015085786A1 WO2015085786A1 PCT/CN2014/084423 CN2014084423W WO2015085786A1 WO 2015085786 A1 WO2015085786 A1 WO 2015085786A1 CN 2014084423 W CN2014084423 W CN 2014084423W WO 2015085786 A1 WO2015085786 A1 WO 2015085786A1
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- WO
- WIPO (PCT)
- Prior art keywords
- dielectric cover
- electrically connected
- identification device
- fingerprint identification
- bracket
- Prior art date
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- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 36
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 3
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012634 optical imaging Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the field of fingerprint recognition technologies, and in particular, to a capacitive fingerprint recognition device, and a mobile terminal having the same. Background technique
- Fingerprint identification devices have begun to be widely used in various terminal devices, such as mobile terminals, banking systems, time and attendance systems, and the like.
- the most commonly used fingerprint recognition devices are finger swipe type and optical imaging type, in which finger swip type sensitivity is poor, finger staining or poor direction may cause induction failure; meanwhile, finger swipe type and optical imaging type fingerprint
- the identification device is poor in security and is easily cracked by fingerprint copying.
- the capacitive fingerprint recognition device comprises a dielectric cover sheet, a sensor chip connected to the dielectric cover sheet, a flexible circuit board electrically connected to the sensor chip, and a flexible circuit board extending outwardly to a peripheral circuit such as an external control circuit and a filter circuit.
- the lead wire on the top of the sensor chip is electrically connected to the flexible circuit board. Since the top of the sensor chip is closely connected to the dielectric cover sheet, in order to avoid the influence of the wire bond on the flatness of the dielectric cover sheet, it is necessary to process the groove on the sensor chip. To accommodate the wire.
- a primary object of the present invention is to provide a fingerprint recognition apparatus and a mobile terminal, which are intended to reduce processing difficulty, improve yield and production efficiency, and reduce production costs through structural improvement.
- the present invention provides a fingerprint identification device comprising a dielectric cover sheet, a support having a through hole, a sensor chip, a control circuit and a bottom plate, and the dielectric cover sheet is received in the through hole and coupled to the sensor chip
- the sensor chip is used for collecting fingerprints and generating an analog signal
- the control circuit processes the analog signal and recognizes the fingerprint
- the sensor chip includes a sensing portion and a connection extending radially at an edge of the sensing portion.
- the sensing portion is connected to the dielectric cover sheet, and the connecting portion is electrically connected to the bottom plate.
- connection portion is electrically connected to the bottom plate through a wire bond or a through silicon via structure.
- the connecting portion is electrically connected to the bottom plate by a bonding wire
- the bracket is provided with a groove or a notch at a position corresponding to the bonding wire.
- the connecting portion is electrically connected to the bottom plate by a bonding wire
- the dielectric cover sheet includes a boss connected to the sensing portion through the through hole, and a space for accommodating the bonding wire is formed between the protruding portion and the bracket.
- the bottom plate is a flexible circuit board or substrate.
- the bottom plate is a substrate, and the control circuit is disposed on a control chip.
- the control chip is electrically connected to the substrate, and the substrate is electrically connected to a flexible circuit board and electrically connected to the external circuit through the flexible circuit board.
- the fingerprint identification device further includes a bottom cover, and the substrate, the sensing chip and the control chip are located between the bottom cover and the dielectric cover sheet.
- the dielectric cover sheet is recessed in the through hole, and the control circuit is electrically connected to the bracket.
- control circuit is electrically connected to the bottom plate, and the bottom plate is provided with at least one conductive terminal electrically connected to the bracket, and the control circuit is electrically connected to the bracket through the conductive terminal.
- the invention also provides a mobile terminal, which comprises a fingerprint identification device, which comprises a dielectric cover sheet, a support having a through hole, a sensor chip, a control circuit and a bottom plate, and the dielectric cover sheet is received in the through hole And connected to the sensor chip, the sensor chip is used for collecting fingerprints and generating an analog signal, the control circuit processes the analog signal and recognizes the fingerprint, and the sensor chip includes a sensing portion and a connecting portion formed by extending radially at an edge of the sensing portion The sensing portion is connected to the dielectric cover sheet, and the connecting portion is electrically connected to the bottom plate.
- a fingerprint identification device which comprises a dielectric cover sheet, a support having a through hole, a sensor chip, a control circuit and a bottom plate, and the dielectric cover sheet is received in the through hole
- the sensor chip is used for collecting fingerprints and generating an analog signal
- the control circuit processes the analog signal and recognizes the fingerprint
- the sensor chip includes a sensing portion and a connecting portion formed
- a fingerprint identification device forms a connecting portion by radially extending from the edge of the sensing portion of the sensing chip, so that the connecting portion avoids the dielectric cover sheet. Therefore, it is only necessary to process the groove or the notch on the bracket, or to provide a boss on the dielectric cover sheet to form a stepped shape to avoid the position of the bonding wire; or to make the connection portion of the sensing chip pass through the through-silicon via structure and the bottom plate. connection. Finally, the groove is not processed on the sensor chip to avoid the position of the bonding wire, thereby reducing the processing difficulty, improving the yield and production efficiency, and reducing the production cost.
- FIG. 1 is a schematic structural view of a first embodiment of a fingerprint identification device of the present invention
- Figure 2 is an exploded view of the fingerprint recognition device of Figure 1; 3 is a schematic structural view of a second embodiment of a fingerprint identification device of the present invention;
- Figure 4 is a cross-sectional view taken along line A-A of the fingerprint recognition device of Figure 3;
- Figure 5 is a cross-sectional view showing a third embodiment of the fingerprint recognition apparatus of the present invention.
- Figure 6 is a cross-sectional view showing a fourth embodiment of the fingerprint recognition apparatus of the present invention.
- the fingerprint identification device of the present invention is a capacitive fingerprint recognition device, and can be applied to mobile terminals such as mobile phones, tablet computers, and notebook computers, and can also be applied to financial terminal devices such as ATMs.
- the fingerprint identification device includes a support 100, a dielectric cover sheet 200, a sensor chip 300, a control chip (not shown), and a bottom plate.
- the substrate 410 or the flexible circuit board 420 is preferably a substrate 410.
- a flexible circuit board 420 (or other conductive component such as a wire) is connected to the substrate 410 to externally connect an external circuit.
- the dielectric cover sheet 200 is an anisotropic dielectric material, preferably an artificial sapphire glass or tempered glass containing A1 2 0 3 as a main component, which serves to protect the internal structure and provides a flat interface for finger contact.
- the dielectric cover sheet 200 preferably has a dielectric constant of 9.3 to 11.5, a thickness of 35011 or 111, a flatness of less than 10 um, and a surface accuracy of 0.1 ⁇ .
- the parameters of the dielectric cover sheet 200 are only preferred embodiments and are not limited thereto.
- the color gradation of the dielectric cover sheet 200 mainly comes from deposition formation or formation of a plating layer by a special technique or bonding the ink layer underneath, in order to ensure that the dielectric cover sheet 200 is opaque, and the user is prevented from seeing the underlying device structure, the edge of the dielectric cover sheet 200.
- the stent 100 can be bonded using a heat activated film and a peripheral sealant.
- the bracket 100 is made of a conductive material, preferably of a metal material, for supporting the entire module on the one hand and for transmitting a pulse signal on the other hand.
- the bracket 100 has a through hole 110 for receiving the dielectric cover sheet 200.
- a grounding ring is disposed around the dielectric cover sheet 200 in contact with the inner wall of the through hole 110 of the bracket 100.
- the sensor chip 300 collects the fingerprint by the finger pressing the dielectric cover sheet 200 and generates an analog signal, which is a multi-channel high-efficiency sensor chip 300, and includes a sensing portion 310 and a connecting portion 320 formed by extending radially around the edge of the sensing portion 310.
- the sensing portion 310 has a sensing circuit and is connected to the dielectric cover sheet 200, and the connecting portion 320 is electrically connected to the bottom plate.
- the sensing circuit is used to sense the user's fingerprint and convert the fingerprint signal into an analog signal. It can be packaged in a single in-line package (SiP), or a single chip. Components can be added below, can be filled with a gel to protect it, or directly underfill for padding protection.
- the sensing circuit can be encapsulated in an epoxy or other elastomeric material (or alternatively, encapsulated in a ceramic or transparent high dielectric constant material), and then the colloid or cover of the sensing area is removed, completely exposed, or It just barely exposes the top to form an Exposed die package, which allows the sensor chip to use less vertical space and is properly protected from collision damage during assembly.
- the sensing circuit exhibits a capacitive connection mode, which forms a capacitance with the ridge and valley of the fingerprint of the user's finger.
- the skin characteristic of the user's finger has a constant dielectric constant. When the body fluid changes or the finger is replaced, the capacitance is read. The values are different, so as to achieve the purpose of distinguishing different fingers or fingerprints.
- the control chip receives and processes the analog signal to identify the fingerprint, and integrates a control circuit to electrically connect to the backplane.
- the control circuit converts the analog signal into a digital signal, and generates a fingerprint image through a corresponding algorithm, thereby implementing fingerprint recognition.
- the sensing circuit and the control circuit can be molded in a monolithic package with the sensor chip 300 attached to the top, and the control chip 700 or flash chip attached to the bottom. If the space permits, even more peripheral components can be attached.
- the integral package is electrically connected through a backplane, which may be a substrate 410 or a flexible circuit board 420. If it is the substrate 410, it is necessary to consider that the additional flexible circuit board 420 (or other conductive components such as wires) is connected to the external circuit, and the number and position of the pins will be limited; if it is the flexible circuit board 420, Connection, no additional flexible circuit board 420 is required, but COF/COB process capability is required.
- the dielectric cover sheet 200 is received in the through hole 110 of the bracket 100, and the front surface is provided with a human hand to press and press, and the back surface is formed by a non-conductive adhesive film or a liquid non-conductive adhesive to form an adhesive film 800 (see FIG. 4). - shown in Fig. 6) is closely connected to the sensing portion 310 of the sensor chip 300.
- the thickness of the adhesive film 800 is preferably less than 50 um to ensure that the signal is not excessively weakened, affecting the sensitivity of command reading.
- the sensor chip 300 is located on the front surface of the substrate 410, and the connecting portion 320 is electrically connected to the substrate 410 through the bonding wire 500.
- the bracket 100 is provided with a notch 120 at the position of the bonding wire 500 to form a vacant position of the bonding wire 500. In some embodiments, the bracket 100 may also be provided with a groove at the position of the bonding wire 500 to accommodate the bonding wire 500.
- the control chip is located on the back surface of the substrate 410 and electrically connected to the substrate 410 through the bonding wire 500. In some embodiments, the control chip and the sensing chip 300 are juxtaposed on the front surface of the substrate 410, and the bracket 100 corresponds to the position of the bonding wire 500 of the control chip 700.
- a groove or notch 120 is provided.
- Substrate 410 A peripheral circuit such as a filter circuit may be integrated, and a peripheral circuit such as a DC-DC boost circuit may be connected to the flexible circuit board 420 connected to the substrate 410 and extended outward, and the flexible circuit board 420 is electrically connected to the motherboard of the terminal device.
- control circuit is electrically connected to the bracket 100 to ensure that the basic pulse signal or the high-voltage pulse signal can be stably sent to the edge of the through hole 110 of the bracket 100; the dielectric cover sheet 200 is recessed in the through hole 110 of the bracket 100, that is, The surface of the cover slip sheet 200 is lower than the top of the through hole 110 of the bracket 100 (about 0.1 to 0.25 mm), thereby guiding and ensuring that the user's finger contacts the edge of the through hole 110 of the bracket 100 when pressing the dielectric cover sheet 200.
- the pulse signal emitted from the edge of the through hole 110 of the conduction bracket 100 is made to enable the sensor chip 300 to read the electric field change value.
- At least one conductive terminal 411 (such as a metal terminal) is disposed on the bottom plate to electrically connect the bottom plate with the bracket 100 at least one contact point, and then the control circuit is electrically connected to the bracket 100 through the conductive terminal 411. connection. Therefore, it is not necessary to additionally provide electrodes on the inner wall of the through hole 110 of the bracket 100, which saves material and assembly costs.
- the fingerprint identification device further includes a bottom cover 600 that fixes the flexible circuit board 420 drawn from the substrate 410 to ensure stable connection, and on the other hand, the substrate 410, the sensor chip 300 and the control chip are located at the bottom. Between the cover 600 and the dielectric cover sheet 200, they are protected from collision damage.
- physical buttons such as the "Home” button
- the bottom cover 600 can isolate the fingerprint identification system from the physical keys to protect the internal structure.
- the backplane is a flexible circuit board 420 that is partially internal to the fingerprinting device and another portion that extends outwardly.
- the sensing chip 300 and the control circuit are electrically connected to the flexible circuit board 420.
- the control circuit can be located inside or outside the fingerprint identification device, or can be externally attached to the motherboard of the terminal device.
- the fingerprint identification device of the present invention may be combined with a control button or a switching element, or may be disposed under the screen main control panel of the terminal device, and may be close to the physical home button or the main control board position of the virtual Home button in the smart phone.
- the combination of control buttons or display elements can be directly formed using the high hardness, wear resistance, etc. of the sapphire glass. Or embedded in a cover glass system or a housing of a fixed structure or device. In short, some moderate adjustments can be made according to the conditions of the terminal equipment, so that the fingerprint features can be easily and sensitively recognized. System password lock to prevent information leakage and protect privacy.
- the second to fourth embodiments of the fingerprint identification device of the present invention have a common feature that the dielectric cover sheet 200 includes a boss 210 that passes through the bracket 100.
- the hole is connected to the sensing portion 310 of the sensor chip 300 such that a space for accommodating the bonding wire 500 is formed between the boss 210 and the bracket 100. Therefore, it is not necessary to additionally provide the notch 120 or the groove on the bracket 100 to avoid the bonding wire 500.
- the control chip 700 and the sensing chip 300 can be electrically connected to the same side of the substrate 410, which can make the fingerprint identification device more light and thin.
- control chip 700, the sensor chip 300 and the bottom plate are completely accommodated in the accommodating space formed by the dielectric cover sheet 200, the bracket 100 and the bottom cover 600, and can be better. protection.
- the fingerprint identification device includes a dielectric cover sheet 200 having a through hole, a holder 100 having a through hole, a sensing chip 300 having a sensing portion 310 and a connecting portion 320, A control chip 700, a substrate 410 and a bottom cover 600 are provided.
- the dielectric cover sheet 200 is recessed in the through hole of the bracket 100.
- the boss 210 of the dielectric cover sheet 200 passes through the through hole and passes through an adhesive film. 800 is closely connected to the sensing portion 310 of the sensor chip 300.
- the connecting portion 320 of the sensing chip 300 is electrically connected to the substrate 410 through the bonding wire 500.
- the control chip 700 and the sensing chip 300 are located on the same side of the substrate 410 and pass through the bonding wire 500.
- the bottom cover 600 is connected to the bottom of the bracket 100 to protect the sensor chip 300, the control chip 700 and the substrate 410.
- the flexible circuit board 420 is connected to the substrate 410.
- the flexible circuit board 420 extends outward through the bottom cover.
- the motherboard of the 600 external terminal device is connected to the motherboard of the 600 external terminal device.
- a third embodiment of the fingerprint identification device shown in FIG. 5 differs from the second embodiment in that the control chip 700 is electrically connected to the substrate 410 through a through-silicon via structure, thereby preventing the bonding wire 500 from being drawn from the top layer of the control chip 700.
- the problem of flatness of the dielectric cover sheet 200 is at the same time, and at the same time, it is ensured that the circuit on the control chip 700 can be connected elsewhere.
- the fingerprint recognition device is made lighter and thinner.
- the control chip 700 and the sensing chip 300 in the first embodiment can also be electrically connected to the substrate 410 (or the flexible circuit board 420) through the through silicon via structure. There is no need to provide a notch 120 or a groove on the bracket 100.
- the fingerprint recognition device of the present invention has the following advantages: (1) A connecting portion 320 is formed by radially extending the edge of the sensing portion 310 of the sensing chip 300 such that the connecting portion 320 avoids the dielectric cover sheet 200. Therefore, it is only necessary to process the groove or the notch 120 on the bracket 100, or to provide a boss 210 on the dielectric cover sheet 200 to form a stepped shape to avoid the position of the bonding wire 500; or to connect the connecting portion 320 of the sensing chip 300.
- the silicon via structure is electrically connected to the bottom plate.
- the groove is not processed on the sensor chip 300 to avoid the position of the bonding wire 500, thereby reducing the processing difficulty and reducing the production cost.
- the peripheral circuit such as the control circuit and the filter circuit is integrated with the sensor chip 300 and packaged inside the fingerprint identification device, which simplifies the circuit structure, reduces the manufacturing cost, and improves the production yield (up to 85). More than %), the overall structure of the module and the number of components are relatively simple, there is no bottleneck in the assembly process, the assembly equipment can be realized based on or modified by the original equipment, and the assembly process has no special requirements; on the other hand, the stability of the circuit is improved, and the signal strength is improved. And the sensing sensitivity, can maintain signal consistency and accurate algorithm interpretation and feedback process, so that the internal sensing circuit and the control circuit can communicate stably and can read and feedback the fingerprint information in the shortest time.
- the control circuit is electrically connected to the bracket 100, and the dielectric cover sheet 200 is recessed in the through hole of the bracket 100, so that when the user presses the dielectric cover sheet 200, the edge of the through hole of the bracket 100 can be contacted to form a pulse circuit. Therefore, it is not necessary to additionally provide electrodes on the inner wall of the through hole of the bracket 100, which further saves material and assembly costs.
- the invention also provides a mobile terminal, which comprises a motherboard and a fingerprint identification device.
- the fingerprint identification device comprises a dielectric cover sheet, a bracket with a through hole, a sensor chip, a control circuit and a bottom plate, and the dielectric cover sheet is accommodated.
- the sensor chip In the through hole and connected to the sensor chip, the sensor chip is used for collecting fingerprints and generating an analog signal, the control circuit processes the analog signal and recognizes the fingerprint, and the sensor chip includes a sensing portion and a radial extension at the edge of the sensing portion
- the connecting portion is connected to the dielectric cover sheet, the connecting portion is electrically connected to the bottom plate, and the bottom plate is electrically connected to the main board.
- the fingerprint identification device described in this embodiment is the fingerprint identification device according to the above embodiment of the present invention, and details are not described herein again.
- the fingerprint identification device is used, and a connecting portion is formed by radially extending the edge of the sensing portion of the sensing chip so that the connecting portion avoids the dielectric cover sheet. Therefore, it is only necessary to process the groove or the notch on the bracket, or to provide a boss on the dielectric cover sheet to form a stepped shape to avoid the position of the bonding wire; or to make the connection portion of the sensing chip pass through the through-silicon via structure and the bottom plate. connection. Finally, the groove is not processed on the sensor chip to avoid the position of the wire, thus reducing the processing difficulty and reducing the production. Cost.
- peripheral circuits such as control circuit and filter circuit are integrated and packaged together with the sensor chip in the fingerprint identification device, which simplifies the circuit structure and reduces the production cost; on the other hand, improves the stability of the circuit and improves the product quality. .
- control circuit is electrically connected to the bracket, and the dielectric cover sheet is recessed in the through hole of the bracket, so that when the user presses the dielectric cover sheet, the edge of the through hole of the bracket can be contacted to form a pulse loop. Therefore, it is not necessary to additionally provide electrodes on the inner wall of the through hole of the bracket, which further saves raw materials and assembly costs.
- a fingerprint identification device forms a connecting portion by radially extending from the edge of the sensing portion of the sensing chip, so that the connecting portion avoids the dielectric cover sheet. Therefore, it is only necessary to process the groove or the notch on the bracket, or to provide a boss on the dielectric cover sheet to form a stepped shape to avoid the position of the bonding wire; or to make the connection portion of the sensing chip pass through the through-silicon via structure and the bottom plate. connection. Finally, the groove is not processed on the sensor chip to avoid the position of the bonding wire, thereby reducing the processing difficulty, improving the yield and production efficiency, and reducing the production cost.
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Abstract
本发明公开了一种指纹识别装置和移动终端,指纹识别装置包括介电盖片、具有一通孔的支架、传感芯片、控制电路和底板,介电盖片容置于通孔内并与传感芯片紧密连接,传感芯片通过手指按压介电盖片来釆集指纹并生成模拟信号,控制电路处理模拟信号并识别指纹,传感芯片包括感应部和于该感应部边缘径向延伸而形成的连接部,感应部连接介电盖片,连接部电连接底板。由于连接部避开了介电盖片,只需在支架上加工沟槽或缺口,或者在介电盖片上设置一凸台而呈阶梯状,来避开焊线位置,最终避免在传感芯片上加工沟槽来避开焊线位置,因此降低了加工难度和生产成本。
Description
说 明 书 指紋识别装置和移动终端 技术领域
本发明涉及指纹识别技术领域, 尤其是涉及一种电容型指纹识别装置, 及具有该指纹识别装置的移动终端。 背景技术
指纹识别装置已开始广泛应用于各种终端设备, 如移动终端、 银行系统、 考勤系统等。 最常用的指纹识别装置是手指划动型和光学成像型, 其中手指 划动型灵敏度较差, 手指有沾污或者方向不佳均会导致感应失灵; 同时, 手 指划动型和光学成像型指纹识别装置的安全性差, 容易被指纹复制方式破解。
目前, 出现了电容型指纹识别装置, 并开始应用于移动终端。 该电容型 指纹识别装置包括介电盖片、 与介电盖片连接的传感芯片、 与传感芯片电连 接的柔性电路板, 柔性电路板向外延伸外挂控制电路、 滤波电路等外围电路。 传感芯片顶部引出焊线与柔性电路板电连接, 由于传感芯片顶部与介电盖片 紧密连接, 为了避免焊线影响介电盖片的平面度, 因此需要在传感芯片上加 工沟槽以容纳焊线。 然而在传感芯片上加工沟槽的加工难度较大, 生产良率 和效率较低, 因此生产成本很高。 同时在柔性电路板上外挂外围电路, 使得 整个模组的结构比较复杂, 原材工艺及模组封装工艺的要求都比较高, 进一 步提高了生产成本。 发明内容
本发明的主要目的在于提供一种指纹识别装置和移动终端, 旨在通过结 构改良降低加工难度, 提高良品率和生产效率, 降低生产成本。
为达以上目的, 本发明提出一种指纹识别装置, 包括介电盖片、 具有一 通孔的支架、 传感芯片、 控制电路和底板, 介电盖片容置于通孔内并与传感 芯片连接, 传感芯片用于釆集指纹并生成模拟信号, 控制电路处理模拟信号 并识别指纹, 传感芯片包括感应部和于该感应部边缘径向延伸而形成的连接
部, 感应部连接介电盖片, 连接部电连接底板。
优选地, 连接部通过焊线或硅通孔结构与底板电连接。
优选地, 连接部通过焊线与底板电连接, 支架对应焊线位置处设有沟槽 或缺口。
优选地, 连接部通过焊线与底板电连接, 介电盖片包括一穿过通孔与感 应部连接的凸台, 凸台与支架之间形成一容纳焊线的空间。
优选地, 底板为柔性电路板或基板。
优选地, 底板为基板, 控制电路设于一控制芯片, 该控制芯片电连接基 板, 基板电连接一柔性电路板并通过该柔性电路板与外部电路电连接。
优选地, 指纹识别装置还包括一底盖, 基板、 传感芯片和控制芯片位于 底盖和介电盖片之间。
优选地, 介电盖片凹置于通孔内, 控制电路与支架电连接。
优选地, 控制电路与底板电连接, 底板上设有至少一与支架电连接的导 电端子, 控制电路通过导电端子与支架电连接。
本发明同时提出一种移动终端, 其包括一指纹识别装置, 该指纹识别装 置包括介电盖片、 具有一通孔的支架、 传感芯片、 控制电路和底板, 介电盖 片容置于通孔内并与传感芯片连接, 传感芯片用于釆集指纹并生成模拟信号, 控制电路处理模拟信号并识别指纹, 传感芯片包括感应部和于该感应部边缘 径向延伸而形成的连接部, 感应部连接介电盖片, 连接部电连接底板。 本发明所提供的一种指纹识别装置, 通过于传感芯片感应部边缘径向延 伸而形成一连接部, 使得连接部避开了介电盖片。 从而只需在支架上加工沟 槽或缺口, 或者在介电盖片上设置一凸台而呈阶梯状, 来避开焊线位置; 或 者让传感芯片的连接部通过硅通孔结构与底板电连接。 最终避免在传感芯片 上加工沟槽来避开焊线位置, 因此降低了加工难度, 提高了良品率和生产效 率, 降低了生产成本。 附图说明
图 1是本发明的指纹识别装置第一实施例的结构示意图;
图 2是图 1中的指纹识别装置的爆炸图;
图 3是本发明的指纹识别装置第二实施例的结构示意图;
图 4是图 3中指纹识别装置的 A-A剖视图;
图 5是本发明的指纹识别装置第三实施例的剖视图;
图 6是本发明的指纹识别装置第四实施例的剖视图。
本发明目的的实现、 功能特点及优点将结合实施例, 参照附图做进一步 说明。 具体实施方式
应当理解, 此处所描述的具体实施例仅仅用以解释本发明, 并不用于限 定本发明。
本发明的指纹识别装置为电容型指纹识别装置, 可以应用于手机、 平板 电脑、 笔记本电脑等移动终端, 也可以应用于 ATM机等金融终端设备。
参见图 1、 图 2, 提出本发明的指纹识别装置第一实施例, 指纹识别装置 包括支架 100、 介电盖片 200、 传感芯片 300、 控制芯片 (图未示)和底板, 底板可以为基板 410或柔性电路板 420, 本实施例优选基板 410, 则此时需在 基板 410上连接一柔性电路板 420 (或导线等其它传导部件)外接外部电路。
介电盖片 200为各向异性的介电材料,优选以 A1203为主要成分的人造蓝 宝石玻璃或钢化玻璃, 其用于保护内部结构, 提供一平整界面供手指接触。 介电盖片 200的介电常数优选 9.3 ~ 11.5,厚度35011111以下,平面度小于 10um, 面形精度 0.1λ, 前述介电盖片 200的参数仅做优选实施例, 并不对其做限制。 介电盖片 200 的颜色层次主要来自于沉积形成或者由特殊技术形成镀层或者 于底下贴合油墨层, 目的是保证介电盖片 200 不透明, 避免用户看见底层器 件结构, 介电盖片 200边缘可以使用热活化膜和周边密封剂粘结于支架 100。
支架 100 为导电材料, 优选金属材质, 一方面起构架支撑作用以固定整 个模组, 另一方面用于传导脉冲信号。 支架 100具有一通孔 110, 该通孔 110 用于容置介电盖片 200。 在某些实施例中, 介电盖片 200与支架 100通孔 110 内壁接触的四周设置有接地环。
传感芯片 300通过手指按压介电盖片 200釆集指纹并生成模拟信号, 其 为多通道高效传感芯片 300,包括感应部 310和于该感应部 310边缘径向延伸 而形成的连接部 320, 感应部 310具有传感电路并连接介电盖片 200, 连接部 320电连接底板。 传感电路用于感知用户指纹并将指纹信号转换成模拟信号,
其可以封装在单列直插式封装(SiP)内, 或者单颗芯片, 下面可以添加元器件, 可以填充胶体来保护, 或者直接 underfill进行填充保护。 传感电路可以被封 装于环氧树脂或其它弹性体材料内 (或替代地, 封装于陶瓷或者透明高介电 常数材料内), 然后去除感应区域的胶体或遮盖物, 完全棵露出来, 或者只是 勉强露出顶部形成一个 Exposed die封装, 使得传感器芯片可以使用较少垂直 空间, 并得到合理保护, 避免装配时被碰撞损坏。 传感电路呈现电容型连接 模式, 与用户手指指纹的脊和谷形成电容的另一极, 用户手指的表皮特征具 有恒介电系数, 当体液变化或者更换手指的时候, 会导致读出的电容值不同, 从而达到区分不同手指或指纹的目的。
控制芯片接收并处理模拟信号从而识别指纹, 其上集成了控制电路, 与 底板电连接。 控制电路将模拟信号转化成数字信号, 通过相应的算法生成指 纹图像, 进而实现指纹识别。
传感电路及控制电路可以被塑封在一个整体封装内, 上方贴传感芯片 300, 下方贴控制芯片 700或 flash芯片, 如果空间允许甚至可以贴更多的外 围元件。 整体封装通过底板来进行电路连接, 底板可以是基板 410或柔性电 路板 420。 如果是基板 410, 需要考虑另加柔性电路板 420 (或导线等其它传 导部件)连出来与外部电路电连接, 并且针脚(pin ) 的数量和位置将受限; 如果是柔性电路板 420则直接连接, 不需再加另外的柔性电路板 420,但需具 备 COF/COB 制程能力。
本实施例中, 介电盖片 200容置于支架 100的通孔 110内, 其正面供人 手触摸按压, 背面通过非导电胶膜或液态非导电胶所形成的粘结膜 800 (如图 4-图 6所示)与传感芯片 300的感应部 310紧密连接,该粘结膜 800的厚度优 选小于 50um, 以确保不会过度削弱信号, 影响指令读取的灵敏度。 传感芯片 300位于基板 410正面, 其连接部 320通过焊线 500与基板 410电连接, 为了 确保焊线 500稳定, 避免塌线, 焊接完后做 underfill底部填充固化, 以保证 结构稳定。 支架 100对应焊线 500位置处设有一缺口 120, 以形成焊线 500的 避空位; 在某些实施例中, 支架 100对应焊线 500位置处也可以设置沟槽来 容纳焊线 500。控制芯片位于基板 410背面, 并通过焊线 500与基板 410电连 接; 在某些实施例中, 控制芯片与传感芯片 300并列设置于基板 410正面, 支架 100对应控制芯片 700的焊线 500位置处设置沟槽或缺口 120。 基板 410
上还可以集成滤波电路等外围电路, 连接于基板 410 并向外延伸的柔性电路 板 420上还可以连接 DC-DC升压电路等外围电路, 柔性电路板 420电连接终 端设备的主机板。
进一步地, 控制电路与支架 100 电连接, 确保基本脉冲信号或者加高压 的脉冲信号能稳定送出到支架 100通孔 110边缘; 介电盖片 200凹置于支架 100的通孔 110内, 即介电盖片 200的表面低于支架 100通孔 110顶部(大约 在 0.1~0.25mm之间), 从而引导并确保用户的手指在按压介电盖片 200时会 接触到支架 100通孔 110边缘, 以形成脉冲回路, 传导支架 100通孔 110边 缘发射的脉冲信号, 使传感芯片 300 能读到电场变化数值。 作为优选, 本实 施例中, 底板上设有至少一个导电端子 411 (如金属端子), 以使底板与支架 100保持至少一个接触点而电连接,继而使得控制电路通过导电端子 411与支 架 100电连接。 从而无需在支架 100的通孔 110内壁额外设置电极, 节省了 原料及装配成本。
进一步地, 指纹识别装置还包括一底盖 600, 该底盖 600—方面固定从基 板 410上引出的柔性电路板 420确保连接稳定, 另一方面使得基板 410、传感 芯片 300和控制芯片位于底盖 600和介电盖片 200之间, 保护它们免于碰撞 受损。 在某些实施例中, 需要在指纹识别装置底部设置物理按键(如 "Home" 键), 因为物理按键信号也需要走控制电路的端口, 比如同柔性电路板 420— 起引出到终端设备的主电路, 此时底盖 600就可以将指纹识别系统与物理按 键隔离开, 保护内部结构。
在某些实施例中,底板为柔性电路板 420, 该柔性电路板 420一部分位于 指纹识别装置内部, 另一部分向外延伸。 传感芯片 300与控制电路均与该柔 性电路板 420 电连接, 控制电路可以位于指纹识别装置内部或外部, 也可以 外挂于终端设备的主机板上。
本发明的指纹识别装置, 可以与控制按钮或者开关元件组合, 也可以设 置在终端设备的屏幕主控面板下方, 在智能手机中可能接近物理 Home键或 者虚拟 Home键的主控板位置。 在一些实施例中, 可以利用蓝宝石玻璃的高 硬度、 耐磨等特点, 直接形成控制按钮或者显示元件的组合。 或者嵌入到一 个盖玻璃系统或者固定结构或装置的壳体内。 总之, 能根据终端设备的条件 进行一些适度的适应性调整, 以便能够方便、 灵敏的识别出指纹特征, 作为
系统密码锁, 防止信息泄露, 保护隐私。
如图 3-图 6所示, 为本发明的指纹识别装置第二到第四实施例, 它们的 共同特点是其介电盖片 200包括一凸台 210,该凸台 210穿过支架 100通孔与 传感芯片 300的感应部 310连接, 从而使得凸台 210与支架 100之间形成一 容纳焊线 500的空间。 因此无需在支架 100上额外设置缺口 120或沟槽来避 开焊线 500,控制芯片 700和传感芯片 300均可以电连接于基板 410的同一侧, 可以使得指纹识别装置更加轻薄。 同时, 控制芯片 700、 传感芯片 300和底板 (基板 410或柔性电路板 420 )完全容置于介电盖片 200、支架 100和底盖 600 所形成的容置空间内, 能够得到更好的保护。
如图 4 所示的指纹识别装置的第二实施例, 指纹识别装置包括具有通孔 的介电盖片 200、 具有通孔的支架 100、 具有感应部 310和连接部 320的传感 芯片 300、设有控制电路的控制芯片 700、基板 410和底盖 600,介电盖片 200 凹置于支架 100的通孔内, 介电盖片 200的凸台 210穿过通孔并通过一粘结 膜 800与传感芯片 300的感应部 310紧密连接, 传感芯片 300的连接部 320 通过焊线 500与基板 410电连接,控制芯片 700与传感芯片 300位于基板 410 的同一侧并通过焊线 500与基板 410电连接, 底盖 600连接于支架 100底部 以保护传感芯片 300、 控制芯片 700和基板 410, 基板 410上连接一柔性电路 板 420, 该柔性电路板 420向外延伸穿过底盖 600外接终端设备的主机板。
如图 5 所示的指纹识别装置的第三实施例, 其与第二实施例的区别是, 控制芯片 700通过硅通孔结构与基板 410电连接, 从而避免焊线 500从控制 芯片 700顶层引出而导致介电盖片 200平面度的问题, 同时可以保证控制芯 片 700上的电路可以连到别处。
如图 6所示的指纹识别装置的第四实施例, 其中基板 410紧贴或连接支 架 100底部, 基板 410上具有一供介电盖片 200的凸台 210穿过的穿孔, 控 制芯片 700和传感芯片 300均通过硅通孔电连接于基板 410 (或柔性电路板 420 ) 背面。 从而使得指纹识别装置更加轻薄化。
由于硅通孔结构可以避免焊线 500从电路板的顶部引出, 因此第一实施 例中控制芯片 700和传感芯片 300也可以通过硅通孔结构与基板 410 (或柔性 电路板 420 ) 电连接, 且无需在支架 100上设置缺口 120或沟槽。
据此, 本发明的指纹识别装置具有以下优势:
( 1 )通过于传感芯片 300感应部 310边缘径向延伸而形成一连接部 320, 使得连接部 320避开了介电盖片 200。从而只需在支架 100上加工沟槽或缺口 120, 或者在介电盖片 200上设置一凸台 210而呈阶梯状, 来避开焊线 500位 置; 或者让传感芯片 300的连接部 320通过硅通孔结构与底板电连接。 最终 避免在传感芯片 300上加工沟槽来避开焊线 500位置, 因此降低了加工难度, 降低了生产成本。
( 2 ) 同时, 将控制电路及滤波电路等外围电路与传感芯片 300—起集成 封装于指纹识别装置内部, 一方面简化了电路结构, 降低了制造成本, 提高 了生产良率(可达 85%以上), 模组整体结构及组成器件数量较精简, 组装过 程没有瓶颈, 组装设备可以基于或修改原设备实现, 组装工艺没有特殊要求; 另一方面提高了电路的稳定性, 提升了信号强度和感应灵敏度, 能够保持信 号一致性和准确的算法解读及反馈过程, 使得内部传感电路与控制电路能稳 定通信并能在最短时间内读出和反馈指纹信息。
( 3 )控制电路与支架 100电连接, 介电盖片 200凹置于支架 100的通孔 内, 使得用户按压介电盖片 200时就能接触到支架 100通孔边缘而形成脉冲 回路。 从而无需在支架 100 的通孔内壁额外设置电极, 进一步节省了原料及 装配成本。 本发明同时提出一种移动终端, 该移动终端包括主机板和指纹识别装置, 指纹识别装置包括介电盖片、 具有一通孔的支架、 传感芯片、 控制电路和底 板, 介电盖片容置于通孔内并与传感芯片连接, 传感芯片用于釆集指纹并生 成模拟信号, 控制电路处理模拟信号并识别指纹, 传感芯片包括感应部和于 该感应部边缘径向延伸而形成的连接部, 感应部连接介电盖片, 连接部电连 接底板, 底板电连接主机板。 本实施例中所描述的指纹识别装置为本发明中 上述实施例所涉及的指纹识别装置, 在此不再赘述。
本发明的移动终端, 釆用了上述指纹识别装置, 通过于传感芯片感应部 边缘径向延伸而形成一连接部, 使得连接部避开了介电盖片。 从而只需在支 架上加工沟槽或缺口, 或者在介电盖片上设置一凸台而呈阶梯状, 来避开焊 线位置; 或者让传感芯片的连接部通过硅通孔结构与底板电连接。 最终避免 在传感芯片上加工沟槽来避开焊线位置, 因此降低了加工难度, 降低了生产
成本。
同时, 将控制电路及滤波电路等外围电路与传感芯片一起集成封装于指 纹识别装置内部, 一方面简化了电路结构, 降低了生产成本; 另一方面提高 了电路的稳定性, 提升了产品质量。
此外, 控制电路与支架电连接, 介电盖片凹置于支架的通孔内, 使得用 户按压介电盖片时就能接触到支架通孔边缘而形成脉冲回路。 从而无需在支 架的通孔内壁额外设置电极, 进一步节省了原料及装配成本。 应当理解的是, 以上仅为本发明的优选实施例, 不能因此限制本发明的 专利范围, 凡是利用本发明说明书及附图内容所作的等效结构或等效流程变 换, 或直接或间接运用在其他相关的技术领域, 均同理包括在本发明的专利 保护范围内。 工业实用性
本发明所提供的一种指纹识别装置, 通过于传感芯片感应部边缘径向延 伸而形成一连接部, 使得连接部避开了介电盖片。 从而只需在支架上加工沟 槽或缺口, 或者在介电盖片上设置一凸台而呈阶梯状, 来避开焊线位置; 或 者让传感芯片的连接部通过硅通孔结构与底板电连接。 最终避免在传感芯片 上加工沟槽来避开焊线位置, 因此降低了加工难度, 提高了良品率和生产效 率, 降低了生产成本。
Claims
1、 一种指纹识别装置, 包括介电盖片、 具有一通孔的支架、 传感芯片、 控制电路和底板, 所述介电盖片容置于所述通孔内并与所述传感芯片连接, 所述传感芯片用于釆集指纹信息并生成模拟信号, 所述控制电路用于处理所 述模拟信号并识别指纹; 所述传感芯片包括感应部和于该感应部边缘径向延 伸而形成的连接部, 所述感应部连接所述介电盖片, 所述连接部电连接所述 底板。
2、 根据权利要求 1所述的指纹识别装置, 其中, 所述连接部通过焊线或 硅通孔结构与所述底板电连接。
3、 根据权利要求 1所述的指纹识别装置, 其中, 所述连接部通过焊线与 所述底板电连接, 所述支架对应所述焊线位置处设有沟槽或缺口。
4、 根据权利要求 1所述的指纹识别装置, 其中, 所述连接部通过焊线与 所述底板电连接, 所述介电盖片包括一穿过所述通孔与所述感应部连接的凸 台, 所述凸台与所述支架之间形成一容纳所述焊线的空间。
5、 根据权利要求 1-4任一项所述的指纹识别装置, 其中, 所述底板为柔 性电路板或基板。
6、 根据权利要求 1-4任一项所述的指纹识别装置, 其中, 所述底板为基 板, 所述控制电路设于一控制芯片, 该控制芯片电连接所述基板, 所述基板 电连接一柔性电路板并通过该柔性电路板与外部电路电连接。
7、 根据权利要求 6所述的指纹识别装置, 其中, 所述指纹识别装置还包 括一底盖, 所述基板、 传感芯片和控制芯片位于所述底盖和介电盖片之间。
8、 根据权利要求 1-4任一项所述的指纹识别装置, 其中, 所述介电盖片 凹置于所述通孔内, 所述控制电路与所述支架电连接。
9、 根据权利要求 8所述的指纹识别装置, 其中, 所述控制电路与所述底 板电连接, 所述底板上设有至少一与所述支架电连接的导电端子, 所述控制 电路通过所述导电端子与所述支架电连接。
10、 一种移动终端, 包括如权利要求 1-9任一项所述的指纹识别装置。
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