WO2016169481A1 - 一种电热膜器件及其制备方法以及电热装置 - Google Patents

一种电热膜器件及其制备方法以及电热装置 Download PDF

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Publication number
WO2016169481A1
WO2016169481A1 PCT/CN2016/079763 CN2016079763W WO2016169481A1 WO 2016169481 A1 WO2016169481 A1 WO 2016169481A1 CN 2016079763 W CN2016079763 W CN 2016079763W WO 2016169481 A1 WO2016169481 A1 WO 2016169481A1
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Prior art keywords
film device
electrothermal film
electrode
conductive layer
bus bar
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PCT/CN2016/079763
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English (en)
French (fr)
Inventor
冯冠平
谭化兵
刘海滨
朱惠忠
Original Assignee
冯冠平
无锡格菲电子薄膜科技有限公司
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Priority claimed from CN201510203320.1A external-priority patent/CN104883760B/zh
Priority claimed from CN201510203373.3A external-priority patent/CN104869676A/zh
Application filed by 冯冠平, 无锡格菲电子薄膜科技有限公司 filed Critical 冯冠平
Priority to KR1020177033959A priority Critical patent/KR102041029B1/ko
Priority to EP16782628.8A priority patent/EP3288337B1/en
Priority to JP2018506470A priority patent/JP6802835B2/ja
Priority to ES16782628T priority patent/ES2908327T3/es
Publication of WO2016169481A1 publication Critical patent/WO2016169481A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/006—Heaters using a particular layout for the resistive material or resistive elements using interdigitated electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to an electrothermal film device, a preparation method thereof and an electric heating device, in particular to a low voltage electrothermal film device, a preparation method thereof and an electric heating device.
  • the electrothermal film is usually formed by plating a conductive layer on the surface of the film and then forming an electrode on the surface of the conductive layer.
  • the electrodes are usually two parallel metal strips, and the two metal strips are respectively connected to the positive and negative electrodes of the power source, and current flows through the conductive layer to generate heat.
  • Figure 1 see the publication No. CN103828482A in which two electrodes sandwich a conductive layer.
  • conductive layer materials such as graphene, carbon nanotubes, ITO, FTO, AZO, etc. are used, and the sheet resistance is large when the film thickness is thin. This results in the need to use a higher supply voltage to meet the heating requirements, which is detrimental to the safety and portability requirements of the electric heating film. Moreover, the increase in thickness can reduce the use voltage, but increases the material cost while reducing the production efficiency.
  • CN102883486A discloses a transparent electric heating film comprising a transparent flexible substrate, a graphene film on the transparent flexible substrate, a conductive connecting mesh film on the graphene film, electrodes on the conductive connecting net film, electrodes and conductive
  • the connection film and the graphene film are electrically connected; a protective layer is disposed on the electrode, and the protective layer covers the electrode and covers the graphene film and the conductive connecting mesh film.
  • the patent proposes a transparent heating material using graphene and a conductive connecting mesh film as an electric heating film. The method can reduce the square resistance of the whole transparent conductive material through the conductive connecting mesh film, but has the following disadvantages:
  • the square resistance of the conductive connection membrane is usually much smaller than the graphene square resistance, and the two are connected in parallel.
  • the main effect of this heating is the conductive connection of the mesh film instead of graphene.
  • the wire diameter of the conductive connection membrane is ⁇ 5 ⁇ m. Conventional metal materials are easily burnt when energized Destroyed, causing the electrothermal film to fail.
  • Some electrothermal films do not achieve low operating voltages using new materials or patterned electrodes, and must have multiple layers (5-6 layers) of conductive layers. Furthermore, uniform heating cannot be obtained in such devices, and there is a temperature difference of 60 K or more on the same device. These factors make such devices not of any practical use.
  • Embodiments of the present invention provide an electrothermal film device capable of achieving a desired temperature at a low voltage (12 V or less).
  • One aspect of the invention provides an electrothermal film device comprising:
  • first electrode has a first bus bar and at least one first inner electrode extending from the first bus bar
  • second electrode having a second bus bar and at least one second inner electrode extending from the second bus bar, the first inner electrode and the second inner electrode being alternately disposed and isolated from each other.
  • the first bus bar when the first bus bar is connected to the positive power supply terminal and the second bus bar is connected to the negative power supply terminal, current flows sequentially through the first bus bar, the first inner An electrode, the conductive layer, the second internal electrode, and the second bus bar.
  • the first and second electrodes are on the same side of the conductive layer.
  • the first and second electrodes are respectively located on different sides of the conductive layer.
  • a protective layer covering the conductive layer and the electrodes on the conductive layer is further included.
  • the first and second inner electrodes are linear, wavy or zigzag.
  • the first and second bus bars form a linear shape, a curved shape, a circular or elliptical shape.
  • the first and second electrodes are located between the substrate and the conductive layer between. In one embodiment, the first and second inner electrodes have the same width.
  • At least one of the first and second internal electrodes includes at least two internal electrodes, and a gap is provided between the internal electrodes.
  • the sub-internal electrodes have the same width.
  • the width of the sub-internal electrode is the same as the gap between the sub-internal electrodes.
  • the gap is 2 microns and the width of the sub-internal electrodes is determined based on the current carrying capacity of each sub-electrode.
  • the first and second bus bars have a plurality of apertures.
  • the hole of the first bus bar is located at a position where the second inner electrode is pointed, and the hole of the second bus bar is located at a position pointed by the first inner electrode At the office.
  • the holes of the first and second bus bars have a rectangular shape with two rounded ends and a distance between the two rounded ends Corresponds to the width of the inner electrode.
  • the portion of the conductive layer at the spacing between adjacent inner electrodes has at least one additional aperture.
  • the additional aperture has a diameter of no more than 1 millimeter.
  • the electrothermal film device is designed to conform to the formula n(n+1) l ⁇ 1 /WHR ⁇ 1/5 such that the voltage at the portion of the bus bar that engages the inner electrode does not vary by more than 10%.
  • n is the number of intervals between adjacent inner electrodes
  • ⁇ 1 is the resistivity of the bus bar material, the unit is ⁇ m
  • l is the length of the longest inner electrode, the unit is m
  • W is the bus bar Width, unit is m
  • H is the thickness of the bus bar, the unit is m
  • R is the sheet resistance of the conductive layer, the unit is ⁇ / square.
  • the electrothermal film device is designed to conform to the formula nl 2 ⁇ 2 /whLR ⁇ 1/5 such that the voltage variation across the same internal electrode does not exceed 10%, wherein: n is the adjacent inner electrode The number of intervals generated between; l is the length of the longest inner electrode, the unit is m; ⁇ 2 is the resistivity of the inner electrode material, the unit is ⁇ m; w is the inner electrode width, the unit is m; h is the inner electrode thickness , the unit is m; L is the longest distance between the two internal electrodes on each bus bar, the unit is m; and R is the sheet resistance of the conductive layer, and the unit is ⁇ /square.
  • the conductive layer comprises at least one of graphene, carbon nanotubes, indium tin oxide, fluorine-doped tin oxide, or aluminum-doped zinc oxide.
  • the first and second electrodes comprise at least one of silver, silver paste, copper, copper paste, aluminum, ITO or graphene.
  • the substrate comprises glass or a polymer.
  • the polymer comprises at least one of polyethylene terephthalate, polyvinyl chloride, polyethylene, polycarbonate, polymethyl methacrylate, polyvinylidene fluoride, and polyaniline. .
  • the protective layer comprises a flexible material.
  • the flexible material comprises at least one of polyethylene terephthalate, polyvinyl chloride, polyethylene, and polycarbonate.
  • the electrothermal film device includes at least two sets of first and second electrodes, wherein one of the at least two groups is connected in series or in parallel with another of the at least two groups.
  • Yet another aspect of the present invention provides an electric heating device including the electrothermal film device of the above embodiment.
  • the electric heating device includes an electric heater, a thermal underwear, a knee brace, and a waist guard.
  • the electric heater is in the form of a frame.
  • the electric heater is a picture frame
  • the electrothermal film device is disposed in at least one of: a frame of the picture frame; and a decorative layer and a back of the picture frame Between the boards.
  • the picture frame further includes a thermally conductive layer, the thermally conductive layer being located in at least one of: between the electrothermal film device and the decorative layer; and in the electrothermal film device Between the back plates.
  • the thermally conductive layer comprises a thermal grease.
  • the electrothermal film device is disposed between an inner layer and an outer side of the thermal underwear.
  • the electric heater and the thermal underwear include a temperature control module and a temperature sensor to control the heating temperature.
  • Yet another aspect of the present invention provides a method for fabricating an electrothermal film device, comprising:
  • the first and second electrodes are on the same side of the conductive layer.
  • the first and second electrodes are respectively located on different sides of the conductive layer.
  • disposing the conductive layer on the substrate and attaching the first electrode and the second electrode to the conductive layer comprises: disposing the conductive layer on a metal foil; Bonding a conductive layer to the substrate; and patterning the metal foil to form the first and second electrodes.
  • a protective layer is formed overlying the conductive layer and the electrodes on the conductive layer.
  • the method further includes forming a plurality of holes in the first and second bus bars.
  • the hole of the first bus bar is located at a position where the second inner electrode is pointed, and the hole of the second bus bar is located at a position pointed by the first inner electrode At the office.
  • Figure 1 shows a prior art electrothermal film device
  • FIG. 2A is a schematic top view of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 2B is a schematic cross-sectional view of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 3A is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention
  • FIG. 3B is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention
  • FIG. 4 is a schematic top view of an electrothermal film device in accordance with an embodiment of the present invention.
  • 5A is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • 5B is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • Figure 6 is a schematic top plan view of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 7 is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 8 is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 9 is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 10 is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • FIG. 11 is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • Figure 13 is a schematic top plan view of an electrothermal film device in accordance with an embodiment of the present invention.
  • Figure 16 is a schematic top plan view of an electrothermal film device in accordance with an embodiment of the present invention.
  • 17A is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • 17B is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • Figure 18 is a schematic top plan view of an electrothermal film device in accordance with an embodiment of the present invention.
  • 19A is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • 19B is an image representation of a temperature distribution of an electrothermal film device in accordance with an embodiment of the present invention.
  • the resistivities of the materials involved in the following examples are well known in the art, for example, the resistivity of copper is 1.75 x 10 -8 ⁇ m, the resistivity of silver paste is 8 x 10 -8 ⁇ m, graphene.
  • the (single layer) has a resistivity of 1 ⁇ 10 -8 ⁇ m.
  • the low voltage electrothermal film device according to an embodiment of the present invention can be powered by a conventional lithium battery and quickly reaches 90-180 °C.
  • the input voltage can be less than 12V.
  • the operating voltage may be less than 1.5 V and the heating effect is provided by the conductive layer.
  • the inner electrodes each have a width of 1 mm and are spaced apart from each other by a pitch of 6 mm.
  • the inner electrode may have a straight shape, a wave shape, or a zigzag shape.
  • the first and second electrode combinations form a shape including, but not limited to, a linear shape, a curved shape, a circular shape, or an elliptical shape.
  • the electrothermal film device further includes at least two sets of first and second electrodes, wherein one of the at least two groups is connected in series or in parallel with the other of the at least two groups.
  • device 2000a is configured to be connected in series or in parallel with another similar device.
  • the first and second internal electrodes are alternately arranged and evenly distributed.
  • the first and second inner electrodes have the same width.
  • the first bus bar is configured to be connected to the positive power input terminal and the second bus bar is configured to be connected to the negative power input terminal, or vice versa.
  • the power is turned on, current flows from one bus bar to the inner electrode on the bus bar, but reaches the conductive layer 1, and then reaches the inner electrode of the other bus bar, but arrives at the other bus bar.
  • the conductive layer 1 may be a semiconductor or ceramic layer.
  • the material of the conductive layer includes at least one of graphene, carbon nanotubes, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), or aluminum-doped zinc oxide (AZO).
  • the material of the electrode may include at least one of silver, silver paste, copper, copper paste, aluminum, ITO, or graphene.
  • the inner electrode is a copper foil inner electrode.
  • the material of the substrate includes glass or a polymer.
  • the polymer comprises at least one of polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), polycarbonate (PC), polymethacrylic acid. Methyl ester (PMMA), polyvinylidene fluoride (PVDF), and polyaniline (PANI).
  • FIG. 2B is a schematic cross-sectional view of an electrothermal film device 2000b in accordance with an embodiment of the present invention. Note that devices 2000a and 2000b can be the same device viewed from different views.
  • the device 2000b includes a conductive layer 1, an electrode 2, a substrate 3, and a protective layer 4.
  • the material of the protective layer 4 is preferably a flexible material comprising at least one of the following materials: PET, PVC, PE, and PC.
  • a method of fabricating device 2000a or 2000b includes the following steps (some steps are optional):
  • the graphene is placed on the substrate.
  • the graphene may be a single layer of graphene, preferably doped with an organic or inorganic dopant such as Fe(NO 3 ) 3 , HNO 3 , and AuCl 3 .
  • the single layer graphene has a sheet resistance of 250 ⁇ /square.
  • the substrate was PET with a width of 150 mm, a length of 150 mm, and a thickness of 125 microns.
  • the curing step consisted of heating in a furnace at a temperature of 130 ° C for 40 minutes.
  • OCA optically clear adhesive
  • a protective layer having an OCA paste was placed on top of the substrate patterned by the silver paste.
  • FIG. 3A shows an image representation 3000a of the temperature distribution of the electrothermal film device formed by steps 1-7 above, in accordance with an embodiment of the present invention.
  • This image indicates that 3000a is captured by an infrared camera.
  • the device's resistance was measured to be 2.7 ohms.
  • a steady state is reached 60 seconds after the device is connected to a 5V voltage.
  • Image representation 3000a describes the temperature distribution of the electrothermal film device upon heating.
  • the coefficient k can be obtained by first fabricating the sample device, obtaining the structural parameter d of the sample device, and then measuring all the parameters other than K in the above formula by the test, but bringing the measured parameters into the The formula K can obtain the coefficient K.
  • Figure 3B shows an image representation 3000b derived from the temperature profile of Figure 3A. 3000b describes the temperature distribution across devices.
  • the device 4000 includes a conductor 1, bus bars 421a and 421b, and inner electrodes 422a and 422b.
  • the above components form a planar pattern.
  • the bus bars 421a and 421b are arranged in a circle having a diameter of 96 mm.
  • the longest inner electrode has a length of 73 mm.
  • the internal electrodes have a pitch of 6 mm.
  • Each inner electrode has a width of 1 mm.
  • the bus bar has a width of 8 mm. On the bus bar, The furthest distance between the two internal electrodes is about 130 mm.
  • a method of fabricating device 4000 includes the following steps (some steps are optional):
  • the graphene is placed on the substrate.
  • the graphene may be a bilayer graphene, preferably doped.
  • the double layer graphene has a sheet resistance of 120 ⁇ /square.
  • the substrate was PET with a width of 120 mm, a length of 120 mm, and a thickness of 125 microns.
  • the printing includes screen printing.
  • the silver paste pattern may be the one described above with reference to FIG.
  • the printed silver paste is used as an electrode.
  • the silver paste has a thickness of 25 microns.
  • the curing step consisted of heating in a furnace at a temperature of 130 ° C for 40 minutes.
  • OCA optically clear adhesive
  • Drilling is performed at a position of the protective layer and the OCA paste corresponding to the bus bar on the substrate to form a plurality of holes to expose the electrodes. Drilling can be done by laser. The hole size is 5 mm x 5 mm.
  • a protective layer having an OCA paste was placed on top of the substrate patterned by the silver paste.
  • Figure 5A shows an image representation 5000a of the temperature distribution of the electrothermal film device formed by steps 1-7 above, in accordance with an embodiment of the present invention.
  • This image indicates that 5000a was captured by an infrared camera. The resistance of the device was measured to be 2 ohms. The steady state is reached 40 seconds after the device is connected to a 5V voltage.
  • Image representation 5000a describes the temperature distribution of the electrothermal film device upon heating.
  • Figure 5B shows an image representation 5000b derived from the temperature profile of Figure 5A. 5000b describes the temperature distribution across the device.
  • the heating power of the device reaches about 1300 W/m 2 , which is much higher than the heating power of the conventional electrothermal film device at a passing voltage of about 5 W/m 2 .
  • conventional electrothermal film devices require an input voltage of 60V to achieve the same heating power, which far exceeds the safe voltage that the human body can withstand.
  • the voltage change across the bus bar does not exceed 0.2% and the voltage across the internal electrode does not vary by more than 0.004%.
  • a method of fabricating an electrothermal film device 6000 includes the following steps (some steps are optional):
  • the graphene is placed on the metal foil and bonded to the substrate by the adhesive graphene.
  • the graphene may be a single layer of graphene, preferably doped.
  • the single layer graphene has a sheet resistance of 250 ⁇ /square.
  • the substrate is PET.
  • the metal foil is glued by an adhesive, which is an ultraviolet curable adhesive, hot glue or silica gel.
  • the metal foil has a size of 140 x 280 mm and the metal foil has a thickness of 25 microns.
  • the size of the substrate was 150 x 300 mm and the thickness of the substrate was 135 microns.
  • the metal foil may be a copper foil, a nickel foil or a copper-nickel alloy foil.
  • UV curing Curing the adhesive. If UV curing is used, the UV light has a wavelength of 365 nm and has an energy of 1000 mJ/cm 2 .
  • a mask is placed on the metal foil.
  • the mask is peelable.
  • the mask can be printed by a printing method such as screen printing.
  • the mask has the pattern described with reference to FIG.
  • OCA optically clear adhesive
  • Drilling is performed at a position of the protective layer and the OCA paste corresponding to the bus bar on the substrate to form a plurality of holes to expose the electrodes. Drilling can be done by laser. The hole size is 5 mm x 5 mm.
  • a protective layer with OCA glue is placed on top of the substrate.
  • the resistance of the device was 2.5 ohms.
  • the device When connected to a voltage of 3.7V (1.85V per half), the device reaches 45°C in 70 seconds.
  • U is 1.85 V
  • d is 3 mm
  • R is 250 ⁇ /square
  • t is 22 ° C
  • k is 151 ° C cm 2 W -1 .
  • the voltage change on the bus bar does not exceed 0.2%
  • the voltage change on the internal electrode does not exceed 0.004%.
  • a method of making an electrothermal film device includes the following steps (some steps are optional):
  • the ITO film was placed on the substrate, and a silver paste pattern was printed on the ITO film.
  • the ITO film has a sheet resistance of 400 ⁇ /square.
  • the substrate was PET with a width of 150 mm and a length of 150 mm.
  • Printing includes screen printing.
  • the silver paste pattern is the pattern described above with reference to FIG. 2A.
  • Silver paste is used as the electrode.
  • the inner electrode has a pitch of 6 mm, the inner electrode has a length of 108 mm, and the width is 1 mm. There are 15 internal electrodes and 15 corresponding intervals.
  • the bus bar has a width of 8 mm.
  • the thickness of the silver paste is 25 microns.
  • the curing step consisted of heating in a furnace at a temperature of 130 ° C for 40 minutes.
  • OCA optically clear adhesive
  • Drilling is performed at a position of the protective layer and the OCA paste corresponding to the bus bar on the substrate to form a plurality of holes to expose the electrodes. Drilling can be done by laser. The hole size is 5 mm x 5 mm.
  • a protective layer having an OCA paste was placed on top of the substrate patterned by the silver paste.
  • a method of making an electrothermal film device includes the steps and graphics described with reference to FIG. 2A.
  • the conductive layer is a single-layer graphene having a sheet resistance of 250 ⁇ /square.
  • the electrode is 10 layers of graphene. In the formation of the 10-layer graphene, 10 single-layer graphenes were sequentially laminated by a transfer operation or direct growth.
  • the inner electrode has a spacing of 3 mm, a length of 108 mm and a width of 1 mm. There are 15 internal electrodes and thus 15 intervals.
  • the bus bar has a width of 8 mm. On the bus bar, the farthest distance between the two internal electrodes is 60 mm.
  • the electrode (10 layers of graphene) has a thickness of 35 nm.
  • FIG. 9 shows an image representation 9000 of the temperature distribution of an electrothermal film device in accordance with this embodiment of the invention.
  • This image indicates that 9000 was captured by an infrared camera.
  • the resistance of the device was measured to be 0.4 ohms.
  • the steady state temperature of 103 ° C was reached 100 seconds after the device was connected to a voltage of 3.7V.
  • t 22 ° C
  • k 110.9 ° C cm 2 W -1 .
  • the voltage on the bus bar does not vary by more than 3% and the voltage across the internal electrodes does not vary by more than 1.2%.
  • a method of fabricating an electrothermal film device includes the steps described with reference to FIG. And the graph described with reference to FIG. 2A.
  • the inner electrode has a spacing of 3 mm, a length of 108 mm and a width of 1 mm. There are 15 internal electrodes and thus 15 intervals.
  • the bus bar has a width of 8 mm.
  • the silver paste has a thickness of 25 microns.
  • a method of fabricating an electrothermal film device includes the steps described with reference to FIG. 2A and the pattern described with reference to FIG.
  • the inner electrode has a spacing of 2 mm, a length of 108 mm and a width of 1 mm.
  • the electrode is a copper foil. There are 16 internal electrodes and thus 17 intervals.
  • the bus bar has a width of 8 mm.
  • the copper foil has a thickness of 25 microns.
  • the conductive layer is a single layer graphene having a sheet resistance of 250 ⁇ /square.
  • FIG. 11 shows an image representation 11000 of the temperature distribution of an electrothermal film device in accordance with this embodiment of the invention.
  • This image indicates that 11000 was captured by an infrared camera.
  • the resistance of the device was measured to be 2 ohms.
  • the steady state temperature of 143.8 ° C was reached 100 seconds after the device was connected to a voltage of 3.7V.
  • U is 3.7 V
  • d 2 mm
  • R 250 ⁇ /square
  • t 22 ° C
  • k 89 ° C cm 2 W -1 .
  • the voltage change across the bus bar does not exceed 0.04% and the voltage across the internal electrodes does not vary by more than 3%.
  • the electrode is 5-10 layers of graphene or 10-30 microns of metal (for example, copper) A foil in which the former is applied in the present embodiment.
  • the bus bar has a width of 8 mm.
  • the conductive layer is a single layer graphene having a sheet resistance of 250 ⁇ /square.
  • FIG. 14 shows an image representation 14000 of the temperature distribution of an electrothermal film device in accordance with this embodiment of the invention.
  • This image indicates that 14000 was captured by an infrared camera.
  • the resistance of the device was measured to be 0.32 ohms.
  • the steady state temperature of 86.3 ° C was reached 30 seconds after the device was connected to a voltage of 7.5V.
  • U 7.5 V
  • d 10 mm
  • R is 41.6 ⁇ /square
  • t 22 ° C
  • k 47.6 ° C cm 2 W -1 .
  • the voltage change across the bus bar does not exceed 2.4% and the voltage across the internal electrodes does not vary by more than 0.3%.
  • a method of fabricating an electrothermal film device includes the steps described with reference to FIG. 2A and the pattern described with reference to FIG. 2A. Further, the parameters n, 1, W, and H conform to the formula: n(n+1)l ⁇ 1 /WHR ⁇ 1/5, so that the voltage at the portion of the bus bar that engages the inner electrode does not vary by more than 10%.
  • a method of fabricating an electrothermal film device includes the steps described with reference to FIG. 2A and the pattern described with reference to FIG. 2A.
  • the parameters n, l, W and H conform to the formula: nl 2 ⁇ 2 /whLR ⁇ 1/5, so that the voltage variation on the same internal electrode does not exceed 10%, where n is the interval between adjacent internal electrodes Number; l is the length of the longest inner electrode, the unit is m; ⁇ 2 is the internal electrode material resistivity, the unit is ⁇ m; w is the inner electrode width, the unit is m; h is the inner electrode thickness, the unit is m L is the longest distance between the two internal electrodes on each bus bar, in m; and R is the sheet resistance of the conductive layer in ⁇ / ⁇ .
  • the internal electrode was 108 mm long and had a total of 15 internal electrodes, each having an inner width of 1 mm and a thickness of 25 ⁇ m, and a total of 15 intervals were generated.
  • the bus bar is 8 mm wide and the longest distance between the two internal electrodes on the bus bar is 99 mm. After testing, the voltage change on the internal electrode was within 0.05%.
  • the steady state temperature of 77.4 ° C was reached 60 seconds after the device was connected to a voltage of 7.5V. In this example, t It is 22 °C.
  • the internal electrodes can promote more uniform heating across the device.
  • the internal electrodes can also increase the flexibility of the device, i.e., the device becomes foldable or bendable without compromising the heating effect. After 200,000 folds (2 minutes of bending the left edge to the right edge and 2 minutes of bending the top edge to the bottom edge), the heating effect is not compromised.
  • the flexibility of the device with the sub-electrodes is at least 7 times the flexibility of a similar device without sub-electrodes. Some similar parts are not marked to keep them tidy.
  • the above components form a planar pattern.
  • a method of fabricating an electrothermal film device 16000 includes the following steps (some steps are optional):
  • the graphene is placed on the substrate by growth or transfer.
  • the graphene may be a single layer of graphene, preferably doped.
  • the graphene may be a doped single layer graphene having a sheet resistance of 250 ⁇ /square.
  • the substrate was PET with a thickness of 125 microns.
  • Printing a silver paste pattern on graphene includes screen printing.
  • the silver paste pattern is the one described with reference to FIG.
  • the printed silver paste was used as an electrode.
  • the silver paste has a thickness of 25 microns.
  • the curing step consisted of heating in a furnace at a temperature of 130 ° C for 40 minutes.
  • the inner electrode of the cured silver paste pattern was cut into sub-internal electrodes.
  • the portion at the gap 1633 is cut away so that the gap 1633 and the sub-internal electrodes 1632a and 1632b each have a width of 1 mm.
  • a plurality of holes 5a and 5b are formed on the bus bar. Every The holes may have a rectangular shape having two rounded ends, and the distance between the two rounded ends corresponds to the inner electrode (or in this example, the two sub-electrodes constitute one inside) The width of the electrode).
  • OCA optically clear adhesive
  • Drilling is performed at a position of the protective layer and the OCA paste corresponding to the bus bar on the substrate to form a plurality of holes to expose the electrodes. Drilling can be done by laser.
  • a protective layer having an OCA paste was placed on top of the substrate patterned by the silver paste.
  • the conductive layer also has a plurality of apertures, such as apertures having a diameter of no more than 1 millimeter, the apertures being evenly distributed between the inner electrodes and aligned parallel to the inner electrodes (ie, the apertures are in two adjacent Arranged between the inner electrodes). These holes can also increase the overall flexibility of the device.
  • Figure 17A shows an image representation 17000a of the temperature distribution of the electrothermal film device formed by the above steps, in accordance with an embodiment of the present invention. This image indicates that 17000a was captured by an infrared camera. Image representation 17000a describes the temperature distribution of the electrothermal film device upon heating.
  • Figure 17B shows an image representation 17000b derived from the temperature profile of Figure 17A.
  • 17000b describes the temperature distribution across devices.
  • the device's resistance was measured to be 2.7 ohms.
  • the steady state temperature of 92.3 ° C was reached 60 seconds after the device was connected to a voltage of 7.5V.
  • U is 7.5 V
  • d 6 mm
  • R 250 ⁇ /square
  • t 22 ° C
  • k 112 ° C cm 2 W -1 .
  • the heating power of the device reaches about 1300 W/m 2 , which is much higher than the heating power of the conventional electrothermal film device at a passing voltage of about 5 W/m 2 .
  • conventional electrothermal film devices require an input voltage of 60V to achieve the same heating power, which far exceeds the safe voltage that the human body can withstand.
  • Figure 18 is a schematic top view of an electrothermal film device 18000 in accordance with an embodiment of the present invention.
  • Device 18000 includes a conductive layer 1, bus bars 1821a and 1821b, and inner electrodes 1822a and 1822b. There is a gap between the inner electrodes.
  • the at least one inner electrode may include a plurality of sub-internal electrodes, for example, sub-internal electrodes 1832a and 1832b. There is a gap 1833 between the sub-internal electrodes 1832a and 1832b.
  • the inner electrode may comprise only a single sub-internal electrode, such as sub-internal electrode 1832c.
  • Graphene is placed on the metal foil and bonded to the substrate by the adhesive graphene.
  • Graphene is a double layer graphene.
  • the graphene is doped and has a sheet resistance of 120 ⁇ /square.
  • the substrate was PET with a thickness of 125 microns.
  • the adhesive is a UV curable adhesive.
  • a metal foil such as a copper foil has a thickness of 25 ⁇ m.
  • the adhesive is cured by UV exposure.
  • the UV light has a wavelength of 365 nm and has an energy of 1000 mJ/cm 2 .
  • a mask is placed on the metal film.
  • the mask is peelable.
  • the mask is set by printing.
  • the mask has the pattern described with reference to Figure 18, except that no gap 1833 has been formed.
  • the spacing between the internal electrodes is 3 mm.
  • the longest internal electrode is 108 mm.
  • Device 18000 includes 11 internal electrodes and 10 spaces that alternately divide the internal electrodes.
  • a protective layer with OCA glue is placed on top of the substrate.
  • the resistance of device 18000 is 2.5 ohms. When connected to a voltage of 3.7V, the device reaches a steady state within 50 seconds.
  • Figure 19B shows an image representation 19000b derived from the temperature profile of Figure 19A.
  • 19000b describes the temperature distribution across devices.
  • U is 3.7 V
  • d is 3 mm
  • R is 120 ⁇ /square
  • t is 22 ° C
  • k is 96 ° C cm 2 W -1 .
  • the width of the bus bar and the number of sub-internal electrodes are adjusted based on the device described with reference to embodiment 16 such that the variation in voltage across the bus bar is within 10%.
  • 11 inner electrodes of up to 108 mm in length have 10 intervals of 4 mm between each other.
  • the bus bar has a width of 8 mm.
  • the change in voltage on the bus bar is within 3.6%.
  • the present invention also provides an electric heating device comprising the electrothermal film device described in the above embodiments.
  • the electric heating device includes, but is not limited to, electric heating, thermal underwear, knee pads and waist protectors.
  • the electric heater also includes a temperature control module and a temperature sensor to control the heating temperature.
  • the electric heater is in the form of a frame, preferably a picture frame.
  • the picture frame includes not only the frame portion but also other components such as a decorative layer and a back sheet.
  • the electrothermal film device layer according to the present invention is disposed in at least one of the following positions: in the frame of the picture frame; and between the decorative layer of the picture frame and the back plate.
  • the picture frame includes a thermally conductive layer in at least one of: between the electrothermal film device layer and the decorative layer; and between the electrothermal film device layer and the backing plate.
  • the thermally conductive layer includes a thermal grease.
  • the thermal underwear also includes a temperature control module and a temperature sensor to control the heating temperature.
  • the electrothermal film device layer according to the present invention is disposed between the inner layer and the outer layer of the thermal underwear.

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Abstract

一种电热膜器件（2000a）及其制备方法以及电热装置。电热膜器件包括：衬底（3）；位于衬底上的导电层（1）；附着于导电层的第一电极和第二电极，其中第一电极具有第一汇流条（21a）和从第一汇流条延伸出的至少一个第一内电极（22a），第二电极具有第二汇流条（21b）和从第二汇流条延伸出的至少一个第二内电极（22b），第一内电极和第二内电极交替设置且彼此隔离。

Description

一种电热膜器件及其制备方法以及电热装置
相关申请的交叉引用
本申请要求于2015年04月24日递交的中国专利申请第201510203373.3号和第201510203320.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明涉及一种电热膜器件及其制备方法和电热装置，特别地，一种低电压电热膜器件及其制备方法和电热装置。
背景技术
本部分所提供的背景信息并不一定都是现有技术。
电热膜通常采用在膜材表面镀导电层，然后在导电层表面制作电极。电极通常为两平行的金属条，两金属条分别接电源正极和负极，电流流经导电层产生热量。一种这样的电热膜如图1所示(参见公开号为CN103828482A的专利)，其中两个电极将导电层夹在中间。
目前常用的诸如石墨烯、碳纳米管、ITO、FTO、AZO等的导电层材料，在膜厚较薄时方块电阻较大。这导致必须使用较高的供电电压才能满足加热要求，不利于电热膜的安全和便携性要求。而且，厚度增加虽可以降低使用电压，但增加了材料成本，同时降低了生产效率。
CN102883486A公开了一种透明电加热薄膜，其包括透明柔性衬底，透明柔性衬底上设置石墨烯膜，石墨烯膜上设有导电连接网膜，导电连接网膜上设有电极，电极与导电连接网膜及石墨烯膜电连接；电极上设置防护层，防护层覆盖在电极上，并覆盖在石墨烯膜及导电连接网膜上。该专利提出采用石墨烯和导电连接网膜作为电热膜的透明加热材料，该方法可以通过导电连接网膜降低整体透明导电材料的方阻，但存在如下缺点：
1)导电连接网膜的方阻通常远小于石墨烯方阻，而二者是并连关系。这样起加热作用的主要是导电连接网膜而不是石墨烯。
2)导电连接网膜的线径<5μm。采用的常规金属材料在通电时极易被烧 毁，导致电热膜失效。
一些电热膜使用新材料或图案化电极也不能实现低操作电压，并且必须具有多层(5-6层)的导电层。此外，在这样的器件中不能获得均匀地加热，在同一器件上具有60K以上的温度差别。这些因素使得这样的器件不具有任何实际用途。
发明内容
本部分提供本公开的总体概述，而不是其全部范围或所有特征的全面公开。
本发明的实施例提供了一种电热膜器件，能够在低电压(小于等于12V)达到希望的温度。
本发明的一个方面提供了一种电热膜器件，包括：
衬底；
位于所述衬底上的导电层；
附着于所述导电层的第一电极和第二电极，其中所述第一电极具有第一汇流条和从所述第一汇流条延伸出的至少一个第一内电极，所述第二电极具有第二汇流条和从所述第二汇流条延伸出的至少一个第二内电极，所述第一内电极和所述第二内电极交替设置且彼此隔离。
在一个实施例中，在所述第一汇流条被连接到正电源端子以及所述第二汇流条被连接到负电源端子时，电流依次流动通过所述第一汇流条、所述第一内电极、所述导电层、所述第二内电极以及所述第二汇流条。
在一个实施例中，所述第一和第二电极位于所述导电层的同一侧。
在一个实施例中，所述第一和第二电极分别位于所述导电层的不同侧。
在一个实施例中，还包括覆盖所述导电层和所述导电层上的电极的保护层。
在一个实施例中，所述第一和第二内电极为直线形状、波浪形或锯齿形。
在一个实施例中，所述第一和第二汇流条形成直线形状、曲线形状、圆形或椭圆形的形状。
在一个实施例中，所述第一和第二电极位于所述衬底与所述导电层之 间。在一个实施例中，所述第一和第二内电极具有相同的宽度。
在一个实施例中，所述第一和第二内电极中的至少一个内电极包括至少两个子内电极，以及在所述子内电极之间具有间隙。
在一个实施例中，所述子内电极具有相同的宽度。
在一个实施例中，所述子内电极的宽度与所述子内电极之间的所述间隙相同。
在一个实施例中，所述间隙为2微米，以及所述子内电极的宽度基于每个子电极的电流承载能力确定。
在一个实施例中，所述第一和第二汇流条具有多个孔。
在一个实施例中，所述第一汇流条的所述孔位于所述第二内电极所指向的位置处，所述第二汇流条的所述孔位于所述第一内电极所指向的位置处。
在一个实施例中，所述第一和第二汇流条的所述孔具有矩形形状，所述矩形形状具有两个倒圆的端部，并且所述两个倒圆的端部之间的距离对应于内电极的宽度。
在一个实施例中，所述导电层的在邻近的内电极之间的间隔处的部分具有至少一个附加的孔。
在一个实施例中，所述附加的孔具有不大于1毫米的直径。
在一个实施例中，所述电热膜器件被配置为符合公式T＝kU2/d2R+t，其中：t为起始温度，单位为℃；T为所述电热膜器件的最终升温的稳定温度，单位为℃；U为供电电压，单位为V，U≤12V；d为内电极间距，单位为cm；R为所述导电层的方块电阻，单位为Ω/方块；k为常数，取值范围为10-200，k取值范围根据所述电热膜器件与空气之间的热传导系数会有不同，与所述电热膜器件与空气之间的热传导系数成反比。
在一个实施例中，所述电热膜器件被设计为符合公式n(n+1)lρ1/WHR＜1/5，以便所述汇流条的接合内电极的部分处的电压变化不超过10％，其中：n为邻近的内电极之间产生的间隔数目；ρ1为汇流条材料的电阻率，单位为Ω·m；l为最长的内电极的长度，单位为m；W为汇流条宽度，单位为m；H为汇流条厚度，单位为m；R为导电层的方块电阻，单位为Ω/方块。
在一个实施例中，所述电热膜器件被设计为符合公式nl2ρ2/whLR<1/5，以便在同一内电极上的电压变化不超过10％，其中：n为邻近的内电极之间产生的间隔数目；l为最长的内电极的长度，单位为m；ρ2为内电极材料电阻率，单位为Ω·m；w为内电极宽度，单位为m；h为内电极厚度，单位为m；L为每根汇流条上的两个内电极之间的最长距离，单位m；以及R为所述导电层的方块电阻，单位为Ω/方块。
在一个实施例中，所述导电层包括石墨烯、碳纳米管、氧化铟锡、氟掺杂的氧化锡或铝掺杂的氧化锌中的至少一种。
在一个实施例中，所述第一和第二电极包括银、银浆、铜、铜浆、铝、ITO或石墨烯中的至少一种。
在一个实施例中，所述衬底包括玻璃或聚合物。
在一个实施例中，所述聚合物包括聚对苯二甲酸乙二酯、聚氯乙烯、聚乙烯、聚碳酸酯、聚甲基丙烯酸甲脂、聚偏氟乙烯以及聚苯胺中的至少一种。
在一个实施例中，所述保护层包括柔性材料。
在一个实施例中，所述柔性材料包括聚对苯二甲酸乙二酯、聚氯乙烯、聚乙烯以及聚碳酸酯中的至少一种。
在一个实施例中，所述电热膜器件包括至少两组的第一和第二电极，其中该至少两组中的一组与该至少两组中的另一组串联或并联连接。
本发明的又一方面提供了一种包括上述实施例的电热膜器件的电热装置。
在一个实施例中，所述电热装置包括电暖气、保暖内衣、护膝以及护腰。
在一个实施例中，所述电暖气为框架形式。
在一个实施例中，所述电暖气为画框，以及所述电热膜器件被设置在下列位置中的至少一者中：所述画框的框架中；以及所述画框的装饰层和背板之间。
在一个实施例中，该画框还包括导热层，所述导热层位于下列位置中的至少一者中：在所述电热膜器件与所述装饰层之间；以及在所述电热膜器件与所述背板之间。
在一个实施例中，所述导热层包括导热脂。
在一个实施例中，所述电热膜器件被设置在所述保暖内衣的内层与外侧之间。
在一个实施例中，所述电暖气和所述保暖内衣包括温度控制模块和温度传感器以控制加热温度。
本发明的又一方面提供了一种用于制造电热膜器件的方法，包括：
提供衬底；
在所述衬底上设置导电层；
将第一电极和第二电极附着于所述导电层，其中所述第一电极具有第一汇流条和从所述第一汇流条延伸出的至少一个第一内电极，所述第二电极具有第二汇流条和从所述第二汇流条延伸出的至少一个第二内电极，所述第一内电极和所述第二内电极交替设置且彼此隔离。
在一个实施例中，所述第一和第二电极位于所述导电层的同一侧。
在一个实施例中，所述第一和第二电极分别位于所述导电层的不同侧。
在一个实施例中，在所述衬底上设置所述导电层以及将所述第一电极和第二电极附着于所述导电层，包括：在金属箔上设置所述导电层；将所述导电层的接合到所述衬底；以及构图所述金属箔以形成所述第一和第二电极。在一个实施例中，还包括形成覆盖所述导电层和所述导电层上的电极的保护层。
在一个实施例中，还包括将所述第一和第二内电极中的至少一个内电极形成为包括至少两个子内电极，在所述子内电极之间具有间隙。
在一个实施例中，还包括在所述第一和第二汇流条上形成多个孔。
在一个实施例中，所述第一汇流条的所述孔位于所述第二内电极所指向的位置处，所述第二汇流条的所述孔位于所述第一内电极所指向的位置处。
在一个实施例中，还包括在所述导电层的位于邻近的内电极之间的间隔处的部分中形成至少一个附加的孔。
进一步的方面和适用性的领域将从此处提供的描述变得显而易见。但是应当理解，本公开的各个实施例可以与一个或多个其它实施例单独或组合来实现。还应该理解的是，描述和具体实例在本文中仅用于说明的目的， 而不是意在限制本公开的范围。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。在附图中：
图1示出了一种现有电热膜器件；
图2A是根据本发明的实施例的电热膜器件的示意性顶视图；
图2B是根据本发明的实施例的电热膜器件的示意性截面图；
图3A为根据本发明的实施例的电热膜器件的温度分布的图像表示；图3B为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图4是根据本发明的实施例的电热膜器件的示意性顶视图；
图5A为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图5B为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图6是根据本发明的实施例的电热膜器件的示意性顶视图；
图7为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图8为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图9为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图10为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图11为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图12为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图13是根据本发明的实施例的电热膜器件的示意性顶视图；
图14为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图15为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图16是根据本发明的实施例的电热膜器件的示意性顶视图；
图17A为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图17B为根据本发明的实施例的电热膜器件的温度分布的图像表示；
图18是根据本发明的实施例的电热膜器件的示意性顶视图；
图19A为根据本发明的实施例的电热膜器件的温度分布的图像表示；以及
图19B为根据本发明的实施例的电热膜器件的温度分布的图像表示。
具体实施方式
下面结合附图和实施例，对本发明实施例作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
以下实施例中涉及到材料的电阻率都是本领域公知的，比如，铜的电阻率为1.75×10-8Ω·m，银浆的电阻率为8×10-8Ω·m，石墨烯(单层)的电阻率为1×10-8Ω·m。根据本发明实施例的低电压电热膜器件能够由常规锂电池供电并迅速到达90-180℃。输入电压可以小于12V。当单层石墨烯被用作电热器件的导电层时，操作电压可以小于1.5V并且加热效果由导电层提供。
实施例1：
图2A是根据本发明的实施例的电热膜器件的示意性顶视图。根据本发明的该实施例的电热膜器件不必是透明的。在一些其它实施例中，器件可以是不透明的或半透明的。该电热器件2000a包括位于衬底(未示出)上的导电层1、附着于导电层1的第一电极和第二电极，其中第一电极包括第一汇流条21a和从第一汇流条延伸出的至少一个第一内电极22a，第二电极包括第二汇流条21b和从第二汇流条21b延伸出的至少一个第二内电极22b。第一内电极22a和所述第二内电极22b交替设置且彼此隔离。第一和第二电极可被设置在导电层1的同一侧或两个不同侧，以促进跨器件的均匀加热。在一些实施例中，导电层1为透明的、不透明或半透明的。一些相似的部件没有被标记以保持示例的整洁。汇流条21a和21b以及内电极22a和22b可以具有下面描述的多种配置。优选地，上述部件形成平面图形。
在一个实施例中，内电极每个具有1毫米的宽度并且以6毫米的间距彼此间隔。内电极可以为直线形状、波浪形状或锯齿形状。第一和第二电极组合形成包括但不限于直线形状、曲线形状、圆形或椭圆形的形状。
在一个实施例中，该电热膜器件进一步包括至少两组的第一和第二电极，其中该至少两组中的一组与该至少两组中的另一组串联或并联连接。在一个实施例中，器件2000a被配置为与另一相似的器件串联或并联连接。
根据一个实施例，第一和第二内电极交替设置并均匀分布。优选地，第一和第二内电极具有相同的宽度。第一汇流条被配置为连接到正电源输入端子以及第二汇流条被配置为连接到负电源输入端子，或反之亦然。当接通电源时，电流从一个汇流条流到该汇流条上的内电极，然而到达导电层1，然后到达另一汇流条的内电极，然而到达另一汇流条。
导电层1可以为半导体或陶瓷层。导电层的材料包括石墨烯、碳纳米管、氧化铟锡(ITO)、氟掺杂的氧化锡(FTO)或铝掺杂的氧化锌(AZO)等中的至少一种。电极的材料可以包括银、银浆、铜、铜浆、铝、ITO或石墨烯中的至少一种。在一个实施例中，内电极为铜箔内电极。
衬底的材料包括玻璃或聚合物。优选地，该聚合物包括下列中的至少一种：聚对苯二甲酸乙二酯(PET)、聚氯乙烯(PVC)、聚乙烯(PE)、聚碳酸酯(PC)、聚甲基丙烯酸甲脂(PMMA)、聚偏氟乙烯(PVDF)、以及聚苯胺(PANI)。
图2B是根据本发明的实施例的电热膜器件2000b的示意性截面图。注意，器件2000a和2000b可以为从不同视图观察的相同器件。该器件2000b包括导电层1、电极2、衬底3以及保护层4。保护层4的材料优选为柔性材料，包括下列材料中的至少一种：PET、PVC、PE、以及PC。
在一个实施例中，一种制造器件2000a或2000b的方法包括以下步骤(一些步骤是可选的):
1:在衬底上设置石墨烯。石墨烯可以为单层石墨烯，优选通过有机或无机掺杂剂(例如，Fe(NO3)3、HNO3、以及AuCl3)掺杂。该单层石墨烯具有250Ω/方块的方块电阻。衬底为PET，具有150毫米的宽度、150毫米的长度以及125微米的厚度。
2：在石墨烯上印刷银浆。该印刷包括丝网印刷。银浆图形可以为上述参考图2A描述的图形。印刷的银浆被用作电极。该银浆的厚度为25微米。
3：固化银浆。固化步骤包括在炉中以130℃的温度加热40分钟。
4：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。保护层匹配基板的尺寸，例如，150毫米宽且150毫米长。OCA胶为50微米厚。
5：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。孔尺寸为5毫米×5毫米。
6：在通过银浆构图的衬底的顶上设置具有OCA胶的保护层。
7：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
图3A示出了根据本发明的实施例的通过上述步骤1-7形成的电热膜器件的温度分布的图像表示3000a。该图像表示3000a通过红外相机捕获。器件的电阻经测量为2.7欧姆。在将器件连接到5V电压后60秒便到达稳定状态。图像表示3000a描述了加热时电热膜器件的温度分布。电热器件的平均温度为66℃，符合公式T＝kU2/d2R+t，其中：t为起始温度，单位为℃；T为器件升温所至的稳定温度，单位为℃；U为供电电压，单位为V，U≤12V；d为内电极间距，单位为cm；R为透明导电层方块电阻，单位为Ω/□；k为常数，取值范围为10-200，k取值范围根据电热膜器件与空气之间的热传导系数会有不同，与器件与空气之间的热传导系数成反比。在该实例中，U为5V，d为6mm，R为250Ω/方块，t为22℃且k为158℃ cm2W-1。在首次使用上述公式时，系数k可通过以下方式获得：首先制造样品器件，获得样品器件的结构参数d，之后通过试验测量上述公式中除K以外的所有参数，然而将测量的参数带入该公式便可以获得系数K。图3B示出了源自图3A的温度分布的图像表示3000b。3000b描述了跨器件的温度分布。
在一个实例中，当施加3.7V的电压时，该器件的加热功率达到约1300W/m2，远高于常规电热膜器件在通过电压下达到的约5W/m2的加热功率。此外，常规电热膜器件要实现相同的加热功率需要具有60V的输入电压，这远超过了人体能承受的安全电压。
实施例2：
图4是根据本发明的实施例的电热膜器件的示意性顶视图。器件4000包括导体1、汇流条421a和421b以及内电极422a和422b。在附图中，一些相似的部件没由被标记以保持示例的简洁。上述部件形成平面图形。汇流条421a和421b以圆形设置，该圆形的直径为96毫米。最长的内电极的长度为73毫米。内电极的间距为6毫米。在内电极之间总共有17个间隔。每个内电极的宽度为1毫米。汇流条的宽度为8毫米。在汇流条上， 两个内电极之间的最远距离为约130毫米。
在一个实施例中，一种制造器件4000的方法包括以下步骤(一些步骤是可选的):
1:在衬底上设置石墨烯。石墨烯可以为双层石墨烯，优选为掺杂的。该双层石墨烯具有120Ω/方块的方块电阻。衬底为PET，具有120毫米的宽度、120毫米的长度以及125微米的厚度。
2：在石墨烯上印刷银浆。该印刷包括丝网印刷。银浆图形可以为上述参考图4描述的图形。印刷的银浆被用作电极。该银浆的厚度为25微米。
3：固化银浆。固化步骤包括在炉中以130℃的温度加热40分钟。
4：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。保护层匹配基板的尺寸，例如，120毫米宽且120毫米长。OCA胶为50微米厚。
5：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。孔尺寸为5毫米×5毫米。
6：在通过银浆构图的衬底的顶上设置具有OCA胶的保护层。
7：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
图5A示出了根据本发明的实施例的通过上述步骤1-7形成的电热膜器件的温度分布的图像表示5000a。该图像表示5000a通过红外相机捕获。器件的电阻经测量为2欧姆。在将器件连接到5V电压后40秒便到达稳定状态。图像表示5000a描述了加热时电热膜器件的温度分布。图5B示出源自图5A的的温度分布的图像表示5000b。5000b描述了跨器件的温度分布。电热器件的稳定温度为90.9℃，符合公式T＝kU2/d2R+t。在该实例中，U为5V，d为6mm，R为120Ω/方块，t为22℃且k为119.1℃ cm2W-1。
在该实例中，当施加3.7V的电压时，器件的加热功率达到约1300W/m2，远高于常规电热膜器件在通过电压下达到的约5W/m2的加热功率。此外，常规电热膜器件要实现相同的加热功率需要具有60V的输入电压，这远超过了人体能承受的安全电压。
在该实例中，汇流条上的电压变化不超过0.2％，内电极上的电压变化不超过0.004％。
实施例3：
图6是根据本发明的实施例的电热膜器件的示意性顶视图。器件6000包括导体1、汇流条621a和621b以及内电极622a和622b。在附图中，一些相似的部件没由被标记以保持示例的简洁。上述部件形成平面图形。内电极的间距为3毫米，长度为108毫米，宽度为1毫米。总共存在32个内电极，在内电极之间总共有30个间隔。每个汇流条的宽度为8毫米。在汇流条上，两个内电极之间的最远距离为100毫米。器件6000的左半部分和右半部分串联连接，以便在每半部分上施加的电压为施加都器件6000的电压的一半。
在一个实施例中，一种制造电热膜器件6000的方法包括以下步骤(一些步骤是可选的):
1：在金属箔上设置石墨烯，并将通过粘合剂石墨烯粘合到衬底。石墨烯可以为单层石墨烯，优选为掺杂的。该单层石墨烯具有250Ω/方块的方块电阻。衬底为PET。金属箔通过粘合剂胶合，粘合剂为紫外可固化粘合剂、热胶或硅胶。金属箔的尺寸为140×280毫米，金属箔的厚度为25微米。衬底的尺寸为150×300毫米，衬底的厚度为135微米。金属箔可以为铜箔、镍箔或铜-镍合金箔。
2：固化粘合剂。如采用UV固化，UV光波长为365纳米，并具有1000mJ/cm2的能量。
3：在金属箔上设置掩模。掩模为可剥脱的。掩模可通过诸如丝网印刷的印刷方法印刷。掩模具有参考图6描述的图形。
4：加热来自先前步骤的产品以固化掩模。该加热包括在135℃下加热40分钟。
5：蚀刻来自先前步骤的产品，并剥脱掩模，蚀刻包括将产品浸入到30％的FeCl3蚀刻液中，之后在将产品水洗并吹干。
6：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。保护层匹配基板的尺寸，例如，150毫米宽且150毫米长。OCA胶为50微米厚。
7：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。孔尺寸为5毫米×5毫米。
8：在衬底的顶上设置具有OCA胶的保护层。
9：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
在通过上述步骤1-9制造的电热器件中，器件的电阻为2.5欧姆。在连接到3.7V的电压时(每半部分上1.85V的电压)，器件在70秒内达到45℃。器件的稳定温度为45℃，符合公式T＝kU2/d2R+t。在该实例中，U为1.85V，d为3mm，R为250Ω/方块，t为22℃且k为151℃ cm2W-1。在该实例中，汇流条上的电压变化不超过0.2％，内电极上的电压变化不超过0.004％
实施例4：
在一些实施例中，一种制造电热膜器件的方法包括以下步骤(一些步骤是可选的):
1：在衬底上设置ITO膜，并在ITO膜上印刷银浆图形。该ITO膜具有400Ω/方块的方块电阻。衬底为PET，具有150毫米的宽度、150毫米的长度。印刷包括丝网印刷。银浆图形为上述参考图2A描述的图形。银浆被用作电极。内电极的间距为6毫米，内电极的长度为108毫米，宽度为1毫米。存在15个内电极以及相应的15个间隔。汇流条的宽度为8毫米。银浆的厚度为25微米。
2：固化银浆。固化步骤包括在炉中以130℃的温度加热40分钟。
3：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。保护层匹配基板的尺寸，例如，150毫米宽且150毫米长。OCA胶为50微米厚。
4：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。孔尺寸为5毫米×5毫米。
5：在通过银浆构图的衬底的顶上设置具有OCA胶的保护层。
6：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
图7示出了根据本发明的实施例的通过上述步骤1-6形成的电热膜器件的温度分布的图像表示7000。该图像表示7000通过红外相机捕获。器件的电阻经测量为5欧姆。在将器件连接到12V电压后55秒便到达92℃。电热器件的稳定温度为92℃，符合公式T＝kU2/d2R+t。在该实例中，U为12V，d为6mm，R为400Ω/方块，t为22℃且k为70℃ cm2W-1。在 该实例中，汇流条上的电压变化不超过0.05％，内电极上的电压变化不超过0.01％。
实施例5：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和图形。此外，导电层为具有250Ω/方块的方块电阻的单层石墨烯。电极为10层石墨烯。在形成该10层石墨烯时，通过转移操作或直接生长依次层叠10个单层石墨烯。内电极具有3毫米的间隔、108毫米的长度和1毫米的宽度。存在15个内电极以及由此的15个间隔。汇流条具有8毫米的宽度。在汇流条上，两个内电极之间的最远距离为60毫米。电极(10层石墨烯)的厚度为35纳米。
图8示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示8000。该图像表示8000通过红外相机捕获。器件的电阻经测量为2欧姆。在将器件连接到1.5V电压后85秒便到达稳定状态温度34℃。电热器件的稳定温度为34℃，符合公式T＝kU2/d2R+t。在该实例中，U为1.5V，d为3mm，R为250Ω/方块，t为22℃且k为120℃ cm2W-1。在该实例中，汇流条上的电压变化不超过0.1％，内电极上的电压变化不超过0.02％。
实施例6：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图4描述的图形。此外，导电层为具有62.5Ω/方块的方块电阻的四层石墨烯。电极为ITO。内电极具有4毫米的间隔和1毫米的宽度。存在16个内电极以及由此的17个间隔。汇流条具有8毫米的宽度。在汇流条上，两个内电极之间的最远距离为60毫米。银浆厚度为25微米。
图9示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示9000。该图像表示9000通过红外相机捕获。器件的电阻经测量为0.4欧姆。在将器件连接到3.7V电压后100秒便到达稳定状态温度103℃。电热器件的稳定温度为103℃，符合公式T＝kU2/d2R+t。在该实例中，t为22℃且k为110.9℃ cm2W-1。在该实例中，汇流条上的电压变化不超过3％，内电极上的电压变化不超过1.2％。
实施例7：
在一些实施例中，一种制造电热膜器件的方法包括参考图6描述的步 骤和参考图2A描述的图形。内电极具有3毫米的间隔、108毫米的长度和1毫米的宽度。存在15个内电极以及由此的15个间隔。汇流条具有8毫米的宽度。银浆厚度为25微米。
图10示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示10000。该图像表示10000通过红外相机捕获。器件的电阻经测量为1.7欧姆。在将器件连接到12V电压后100秒便到达稳定状态温度226℃。电热器件的稳定温度为226℃，符合公式T＝kU2/d2R+t。在该实例中，U为12V，d为3mm，R为250Ω/方块，t为22℃且k为32℃ cm2W-1。在该实例中，汇流条上的电压变化不超过0.9％，内电极上的电压变化不超过0.1％。
实施例8：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图4描述的图形。内电极具有2毫米的间隔、108毫米的长度和1毫米的宽度。电极为铜箔。存在16个内电极以及由此的17个间隔。汇流条具有8毫米的宽度。铜箔厚度为25微米。导电层为具有250Ω/方块的方块电阻的单层石墨烯。
图11示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示11000。该图像表示11000通过红外相机捕获。器件的电阻经测量为2欧姆。在将器件连接到3.7V电压后100秒便到达稳定状态温度143.8℃。电热器件的稳定温度为143.8℃，符合公式T＝kU2/d2R+t。在该实例中，U为3.7V，d为2mm，R为250Ω/方块，t为22℃且k为89℃ cm2W-1。在该实例中，汇流条上的电压变化不超过0.04％，内电极上的电压变化不超过3％。
实施例9：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图2A描述的图形。此外，每个汇流条和对应的内电极被设置在导电层的不同侧，即，汇流条21a和内电极22a被设置在导电层的顶侧上，而汇流条21b和内电极22b被设置在导电层的底侧上。内电极具有4毫米的间隔、108毫米的长度和1毫米的宽度。存在15个内电极以及由此的15个间隔。电极为5-10层的石墨烯或10-30微米的金属(例如，铜) 箔，其中前者被应用于本实施例中。汇流条具有8毫米的宽度。导电层为具有250Ω/方块的方块电阻的单层石墨烯。
图12示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示12000。该图像表示12000通过红外相机捕获。器件的电阻经测量为2.1欧姆。在将器件连接到7.5V电压后30秒便到达稳定状态温度210℃。电热器件的平均温度为210℃，符合公式T＝kU2/d2R+t。在该实例中，U为7.5V，d为4mm，R为250Ω/方块，t为22℃且k为134℃ cm2W-1。在该实例中，汇流条上的电压变化不超过7％，内电极上的电压变化不超过4％。
实施例10：
图13是根据本发明的实施例的电热膜器件13000的示意性顶视图。内电极1322a和1322b具有10毫米的间隔和1毫米的宽度。存在9个内电极以及由此的9个间隔。汇流条1321a和1321b具有8毫米的宽度。导电层为具有41.6Ω/方块的方块电阻的六层石墨烯。电极为25微米厚的铜箔。
图14示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示14000。该图像表示14000通过红外相机捕获。器件的电阻经测量为0.32欧姆。在将器件连接到7.5V电压后30秒便到达稳定状态温度86.3℃。电热器件的稳定温度为86.3℃，符合公式T＝kU2/d2R+t。在该实例中，U为7.5V，d为10mm，R为41.6Ω/方块，t为22℃且k为47.6℃ cm2W-1。在该实例中，汇流条上的电压变化不超过2.4％，内电极上的电压变化不超过0.3％。
实施例11：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图2A描述的图形。此外，内电极和汇流条由不同的材料形成，例如，内电极为透明导电材料以及汇流条为金属，或反之亦然，或内电极和汇流条为不同的金属。在该实例中，内电极为至少5层(例如10)层的石墨烯，以及汇流条为金属(例如，铂)箔或银浆，优选为铜箔。在该实例中，导电层为单层石墨烯。内电极具有5毫米的间隔、108毫米的长度和1毫米的宽度。存在32个内电极。汇流条具有8毫米的宽度和25微米的厚度。
图15示出了根据本发明的该实施例的电热膜器件的温度分布的图像表示15000。该图像表示15000通过红外相机捕获。器件的电阻经测量为1.9欧姆。在将器件连接到12V电压后30秒便到达稳定状态温度243℃。电热器件的稳定温度为243℃，符合公式T＝kU2/d2R+t。在该实例中，U为12V，d为5mm，R为250Ω/方块，t为22℃且k为96℃ cm2W-1。在该实例中，汇流条上的电压变化不超过1.5％，内电极上的电压变化不超过2.3％。
实施例12：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图2A描述的图形。此外，参数n、l、W和H符合公式：n(n+1)lρ1/WHR＜1/5，以便汇流条的接合内电极的部分处的电压变化不超过10％。在上述公式中，n为邻近的内电极之间产生的间隔数目；ρ1为汇流条材料电阻率，单位为Ω·m；l为最长的内电极的长度，单位为m；W为汇流条宽度，单位为m；H为汇流条厚度，单位为m；R为导电层的方块电阻，单位为Ω/□。
另外，内电极长108mm，共产生15个间隔，汇流条宽8mm，厚25μm。经测试，汇流条上的电压变化在0.2％内。在将器件连接到1.5V电压后75秒便到达稳定状态温度51℃。在该实例中，t为22℃。
实施例13：
在一些实施例中，一种制造电热膜器件的方法包括参考图2A描述的步骤和参考图2A描述的图形。此外，参数n、l、W和H符合公式：nl2ρ2/whLR<1/5，以便在同一内电极上的电压变化不超过10％，其中n为邻近的内电极之间产生的间隔数目；l为最长的内电极的长度，单位为m；ρ2为内电极材料电阻率，单位为Ω·m；w为内电极宽度，单位为m；h为内电极厚度，单位为m；L为每根汇流条上的两个内电极之间的最长距离，单位m；以及R为导电层的方块电阻，单位为Ω/□。
另外，内电极长108mm，共15根内电极，每根内电极的宽度均为1mm、厚25μm，共产生15个间隔。汇流条宽8mm，在汇流条上的两个内电极之间的最长距离为99mm。经测试，内电极上电压变化在0.05％内。在将器件连接到7.5V电压后60秒便到达稳定状态温度77.4℃。在该实例中，t 为22℃。
实施例14：
图16是根据本发明的实施例的电热膜器件16000的示意性顶视图。器件16000包括导电层1、汇流条1621a和1621b，内电极1622a和1622b。在内电极之间存在间隔，以及在汇流条上存在多个孔5a和5b。内电极中的至少一个可以包括多个子内电极，例如，子内电极1632a和1632b。在邻近的子内电极1632a和1632b之间存在间隙1633。然而，在器件的边缘处，内电极可以仅包括单一子内电极，例如，子内电极1632c。子内电极可以具有相同的宽度，这基于每个子电极的电流承载能力。子内电极可以以预定间隙均匀地间隔(例如，子内电极1632a和1632b之间的2微米间隔)，优选地，该预定间隙等于子内电极的宽度。子内电极可以为直线形状、波浪形状或锯齿形状。子电极1632a、1632b和1632c可以具有形同的形状和材料。内电极具有6毫米的间隔，108毫米的长度。存在11个内电极和其间的10个间隔。子内电极可以促进跨器件的较均匀的加热。子内电极还可以增加器件的柔性，即，器件变得可折叠或可弯曲而不会妥协加热效果。在200000次折叠之后(将左边缘弯曲到右边缘上2分钟以及将顶部边缘弯曲到底部边缘上2分钟)，加热效果不会被妥协。具有子电极的器件的柔性至少为不具有子电极的相似器件的柔性的7倍。一些相似的部件没有被标示以保持整洁。优选地，上述部件形成平面图形。
在一个实施例中，一种制造电热膜器件16000的方法包括以下步骤(一些步骤是可选的):
1：通过生长或转移在衬底上设置石墨烯。石墨烯可以为单层石墨烯，优选为掺杂的。石墨烯可以为掺杂的单层石墨烯，具有250Ω/方块的方块电阻。衬底为PET，具有125微米的厚度。
2：在石墨烯上印刷银浆图形。印刷包括丝网印刷。银浆图形为参考图16描述的图形。该印刷的银浆被用作电极。银浆具有25微米的厚度。
3：固化银浆。固化步骤包括在炉中以130℃的温度加热40分钟。
4：将固化的银浆图形的内电极切割为子内电极。在一个实例中，位于间隙1633处的部分被切除，以便间隙1633和子内电极1632a和1632b均具有1毫米的宽度。此外，优选地，在汇流条上形成多个孔5a和5b。每 个孔可以具有矩形形状，该矩形形状具有两个倒圆的端部，并且两个倒圆的端部之间的距离对应于内电极(或这在该实例中，2个子内电极构成一个内电极)的宽度。在一个实施例中，在一个汇流条的由从另一汇流条延伸出的内电极所指向的位置处具有孔5a和5b。这样的孔能够增加整个器件的柔性。对孔的尺寸没有特别的限制，只要不会过多地影响电流流动即可。
5：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。OCA胶为50微米厚。
6：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。
7：在通过银浆构图的衬底的顶上设置具有OCA胶的保护层。
8：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
在一些实施例中，导电层也具有多个孔，例如具有不大于1毫米的直径的孔，这些孔在内电极之间均匀地分布并平行于内电极排列(即，孔在两个邻近的内电极之间排列)。这些孔同样能够增加器件的总体柔性。
图17A示出了根据本发明的实施例的通过上述步骤形成的电热膜器件的温度分布的图像表示17000a。该图像表示17000a通过红外相机捕获。图像表示17000a描述了加热时电热膜器件的温度分布。
图17B示出了源自图17A的温度分布的图像表示17000b。17000b描述了跨器件的温度分布。器件的电阻经测量为2.7欧姆。在将器件连接到7.5V电压后60秒便到达稳定状态温度92.3℃。电热器件的稳定温度为92.3℃，符合公式T＝kU2/d2R+t。在该实例中，U为7.5V，d为6mm，R为250Ω/方块，t为22℃且k为112℃ cm2W-1。
在该实例中，当施加3.7V的电压时，器件的加热功率达到约1300W/m2，远高于常规电热膜器件在通过电压下达到的约5W/m2的加热功率。此外，常规电热膜器件要实现相同的加热功率需要具有60V的输入电压，这远超过了人体能承受的安全电压。
实施例15：
在一些实施例中，汇流条的宽度和子内电极的数目在参考实施例14所描述的器件的基础上被调整，以便在汇流条上的电压的变化在10％内。 在一个实例中，108毫米长的15个内电极具有在彼此间的6毫米的14个间隔。汇流条的宽度为8毫米。在汇流条上的电压的变化在0.5％内。
实施例16：
图18是根据本发明的实施例的电热膜器件18000的示意性顶视图。器件18000包括导电层1、汇流条1821a和1821b，内电极1822a和1822b。在内电极之间存在间隔。至少一个内电极可以包括多个子内电极，例如，子内电极1832a和1832b。在子内电极1832a和1832b之间存在间隙1833。然而，在器件的边缘处，内电极可以仅包括单一子内电极，例如，子内电极1832c。
1：在金属箔上设置石墨烯并将通过粘合剂石墨烯粘合到衬底。石墨烯为双层石墨烯。该石墨烯被掺杂并具有120Ω/方块的方块电阻。衬底为PET，具有125微米的厚度。粘合剂为紫外固化粘合剂。诸如铜箔的金属箔的厚度为25微米。
2：通过UV暴露来固化粘合剂。UV光波长为365纳米，并具有1000mJ/cm2的能量。
3:在金属膜上设置掩模。在一个实例中，掩模是可剥脱的。掩模通过印刷设置。该掩模具有参考图18描述的图形，除了还没有形成间隙1833之外。内电极之间的间隔为3毫米。最长的内电极为108毫米。器件18000包括11个内电极和交替分割内电极的10个间隔。
4：加热来自步骤3的产品以固化掩模。该加热包括在135℃下加热40分钟。
5:切割对应于内电极的掩模图形以形成对应于子电极的掩模图形。
6：蚀刻来自先前步骤5的产品，并剥脱掩模。蚀刻可通过光刻完成。蚀刻包括将产品浸入到30％的FeCl3蚀刻液中，之后在将产品水洗并吹干。
7：在保护层上设置光学透明粘合剂(OCA)胶。保护层的材料可以为PET。OCA胶为50微米厚。
8：在保护层和OCA胶的对应于衬底上的汇流条的位置处进行钻孔以形成多个孔以暴露电极。钻孔可以通过激光实施。
9：在衬底的顶上设置具有OCA胶的保护层。
10：形成与暴露的电极的电接触，例如将引线接合到暴露的电极。
根据该实施例，器件18000的电阻为2.5欧姆。在连接到3.7V的电压时，器件在50秒内达到稳定状态。
图19A示出了根据本发明的实施例的通过上述步骤形成的电热膜器件的温度分布的图像表示19000a。该图像表示19000a通过红外相机捕获。图像表示19000a描述了加热时电热膜器件的温度分布。
图19B示出了源自图19A的温度分布的图像表示19000b。19000b描述了跨器件的温度分布。电热器件的稳定温度为143.8℃，符合公式T＝kU2/d2R+t。在该实例中，U为3.7V，d为3mm，R为120Ω/方块，t为22℃且k为96℃ cm2W-1。
实施例17：
在一些实施例中，汇流条的宽度和子内电极的数目在参考实施例16所描述的器件的基础上被调整，以便在汇流条上的电压的变化在10％内。在一个实例中，最长108毫米长的11个内电极具有在彼此间的4毫米的10个间隔。汇流条的宽度为8毫米。在汇流条上的电压的变化在3.6％内。
实施例18：
本发明还提供一种包括上述实施例中描述的电热膜器件的电热装置。该电热装置包括但不限于电暖气、保暖内衣、护膝以及护腰。
该电暖气还包括温度控制模块和温度传感器以控制加热温度。根据一个实施例，电暖气为框架形式，优选为画框。在本公开中，画框不仅包括框架部分而且包括诸如装饰层和背板等的其他部件。在采用画框的情况下，根据本发明的电热膜器件层被设置在下列位置中的至少一者中：画框的框架中；以及画框的装饰层和背板之间。优选地，画框包括导热层，该导热层位于下列位置中的至少一者中：在电热膜器件层与装饰层之间；以及在电热膜器件层与背板之间。该导热层包括导热脂。
该保暖内衣同样包括温度控制模块和温度传感器以控制加热温度。优选地，据本发明的电热膜器件层被设置保暖内衣的内层和外层之间。
以上实施方式仅用于说明本发明，而并非对本发明的限制，有关技术领域的普通技术人员，在不脱离本发明的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明的范畴，本发明的专利保护范围应由权利要求限定。

Claims (45)

  1. 一种电热膜器件，包括：
    衬底；
    位于所述衬底上的导电层；
    附着于所述导电层的第一电极和第二电极，其中所述第一电极具有第一汇流条和从所述第一汇流条延伸出的至少一个第一内电极，所述第二电极具有第二汇流条和从所述第二汇流条延伸出的至少一个第二内电极，所述第一内电极和所述第二内电极交替设置且彼此隔离。
  2. 根据权利要求1所述的电热膜器件，其中，在所述第一汇流条被连接到正电源端子以及所述第二汇流条被连接到负电源端子时，电流依次流动通过所述第一汇流条、所述第一内电极、所述导电层、所述第二内电极以及所述第二汇流条。
  3. 根据权利要求1所述的电热膜器件，其中，所述第一和第二电极位于所述导电层的同一侧。
  4. 根据权利要求1所述的电热膜器件，其中，所述第一和第二电极分别位于所述导电层的不同侧。
  5. 根据权利要求1所述的电热膜器件，其中，还包括覆盖所述导电层和所述导电层上的电极的保护层。
  6. 根据权利要求1所述的电热膜器件，其中，所述第一和第二内电极为直线形状、波浪形或锯齿形。
  7. 根据权利要求1所述的电热膜器件，其中，所述第一和第二汇流条形成直线形状、曲线形状、圆形或椭圆形的形状。
  8. 根据权利要求1所述的电热膜器件，其中，所述第一和第二电极位于所述衬底与所述导电层之间。
  9. 根据权利要求1所述的电热膜器件，其中，所述第一和第二内电极具有相同的宽度。
  10. 根据权利要求1所述的电热膜器件，其中，所述第一和第二内电极中的至少一个内单极包括至少两个子内电极，以及在所述子内电极之间具有间隙。
  11. 根据权利要求10所述的电热膜器件，其中，所述子内电极具有 相同的宽度。
  12. 根据权利要求10所述的电热膜器件，其中，所述子内电极的宽度与所述子内电极之间的所述间隙相同。
  13. 根据权利要求10所述的电热膜器件，其中，所述间隙为2微米，以及在所述子内电极的宽度基于每个子电极的电流承载能力确定。
  14. 根据权利要求10所述的电热膜器件，其中，所述第一和第二汇流条具有多个孔。
  15. 根据权利要求14所述的电热膜器件，其中，所述第一汇流条的所述孔位于所述第二内电极所指向的位置处，所述第二汇流条的所述孔位于所述第一内电极所指向的位置处。
  16. 根据权利要求15所述的电热膜器件，其中，所述第一和第二汇流条的所述孔具有矩形形状，所述矩形形状具有两个倒圆的端部，并且所述两个倒圆的端部之间的距离对应于所述内电极的宽度。
  17. 根据权利要求10所述的电热膜器件，其中，所述导电层的在邻近的内电极之间的间隔处的部分具有至少一个附加的孔。
  18. 根据权利要求10所述的电热膜器件，其中，所述附加的孔具有不大于1毫米的直径。
  19. 根据权利要求1所述的电热膜器件，其中，所述电热膜器件被配置为符合公式T＝kU2/d2R+t，其中：t为起始温度，单位为℃；T为所述电热膜器件的最终升温的稳定温度，单位为℃；U为供电电压，单位为V，U≤12V；d为内电极间距，单位为cm；R为所述导电层的方块电阻，单位为Ω/方块；k为常数，取值范围为10-200，与所述电热膜器件与空气之间的热传导系数成反比。
  20. 根据权利要求1所述的电热膜器件，其中，所述电热膜器件被设计为符合公式n(n+1)lρ1/WHR＜1/5，以便所述汇流条的接合内电极的部分处的电压变化不超过10％，其中：n为邻近的内电极之间产生的间隔数目；ρ1为汇流条材料的电阻率，单位为Ω·m；l为最长的内电极的长度，单位为m；W为汇流条宽度，单位为m；H为汇流条厚度，单位为m；R为导电层的方块电阻，单位为Ω/方块。
  21. 根据权利要求1所述的电热膜器件，其中，所述电热膜器件被 设计为符合公式nl2ρ2/whLR<1/5，以便在同一内电极上的电压变化不超过10％，其中：n为邻近的内电极之间产生的间隔数目；l为最长的内电极的长度，单位为m；ρ2为内电极材料电阻率，单位为Ω·m；w为内电极宽度，单位为m；h为内电极厚度，单位为m；L为每根汇流条上的两个内电极之间的最长距离，单位m；以及R为所述导电层的方块电阻，单位为Ω/方块。
  22. 根据权利要求1所述的电热膜器件，其中，所述导电层包括石墨烯、碳纳米管、氧化铟锡、氟掺杂的氧化锡或铝掺杂的氧化锌中的至少一种。
  23. 根据权利要求1所述的电热膜器件，其中，所述第一和第二电极包括银、银浆、铜、铜浆、铝、ITO或石墨烯中的至少一种
  24. 根据权利要求1所述的电热膜器件，其中，所述衬底包括玻璃或聚合物。
  25. 根据权利要求24所述的电热膜器件，其中，所述聚合物包括聚对苯二甲酸乙二酯、聚氯乙烯、聚乙烯、聚碳酸酯、聚甲基丙烯酸甲脂、聚偏氟乙烯以及聚苯胺中的至少一种。
  26. 根据权利要求5所述的电热膜器件，其中，所述保护层包括柔性材料。
  27. 根据权利要求5所述的电热膜器件，其中，所述柔性材料包括聚对苯二甲酸乙二酯、聚氯乙烯、聚乙烯以及聚碳酸酯中的至少一种。
  28. 根据权利要求1所述的电热膜器件，其中，所述电热膜器件包括至少两组的第一和第二电极，其中该至少两组中的一组与该至少两组中的另一组串联或并联连接。
  29. 一种包括上述权利要求1-28中任一项所述的电热膜器件的电热装置。
  30. 根据权利要求29所述的电热装置，其中，所述电热装置包括电暖气、保暖内衣、护膝以及护腰。
  31. 根据权利要求30所述的电热装置，其中，所述电暖气为框架形式。
  32. 根据权利要求31所述的电热装置，其中，所述电暖气为画框， 以及所述电热膜器件被设置在下列位置中的至少一者中：所述画框的框架中；以及所述画框的装饰层和背板之间。
  33. 根据权利要求32所述的电热装置，其中，还包括导热层，所述导热层位于下列位置中的至少一者中：在所述电热膜器件与所述装饰层之间；以及在所述电热膜器件与所述背板之间。
  34. 根据权利要求33所述的电热装置，其中，所述导热层包括导热脂。
  35. 根据权利要求30所述的电热装置，其中，所述电热膜器件被设置在所述保暖内衣的内层与外侧之间。
  36. 根据权利要求30所述的电热装置，其中，所述电暖气和所述保暖内衣包括温度控制模块和温度传感器以控制加热温度。
  37. 一种用于制造电热膜器件的方法，包括：
    提供衬底；
    在所述衬底上设置导电层；
    在所述导电层上设置第一电极和第二电极，其中所述第一电极具有第一汇流条和从所述第一汇流条延伸出的至少一个第一内电极，所述第二电极具有第二汇流条和从所述第二汇流条延伸出的至少一个第二内电极，所述第一内电极和所述第二内电极交替设置且彼此隔离。
  38. 根据权利要求37所述的方法，其中，所述第一和第二电极位于所述导电层的同一侧。
  39. 根据权利要求37所述的方法，其中，所述第一和第二电极分别位于所述导电层的不同侧。
  40. 根据权利要求37所述的方法，其中，在所述衬底上设置所述导电层以及将所述第一电极和第二电极附着于所述导电层的步骤包括：在金属箔上设置所述导电层；将所述导电层的与所述金属箔相对的一侧接合到所述衬底；以及构图所述金属箔以形成所述第一和第二电极。
  41. 根据权利要求37所述的方法，其中，还包括形成覆盖所述导电层和所述导电层上的电极的保护层。
  42. 根据权利要求37所述的方法，其中，还包括将所述第一和第二内电极中的至少一个内电极形成为包括至少两个子内电极，在所述子内 电极之间具有间隙。
  43. 根据权利要求37所述的方法，其中，还包括在所述第一和第二汇流条上形成多个孔。
  44. 根据权利要求43所述的方法，其中，所述第一汇流条的所述孔位于所述第二内电极所指向的位置处，所述第二汇流条的所述孔位于所述第一内电极所指向的位置处。
  45. 根据权利要求37所述的方法，其中，还包括在所述导电层的位于邻近的内电极之间的间隔处的部分中形成至少一个附加的孔。
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KR20170139152A (ko) 2017-12-18
EP3288337A4 (en) 2019-08-28
US20200221547A1 (en) 2020-07-09
EP3288337B1 (en) 2021-12-15
US20160316520A1 (en) 2016-10-27
JP2018513544A (ja) 2018-05-24
ES2908327T3 (es) 2022-04-28
JP6802835B2 (ja) 2020-12-23
EP3288337A1 (en) 2018-02-28
KR102041029B1 (ko) 2019-11-27

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