WO2016165514A1 - 封装设备及显示基板封装方法 - Google Patents

封装设备及显示基板封装方法 Download PDF

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Publication number
WO2016165514A1
WO2016165514A1 PCT/CN2016/076367 CN2016076367W WO2016165514A1 WO 2016165514 A1 WO2016165514 A1 WO 2016165514A1 CN 2016076367 W CN2016076367 W CN 2016076367W WO 2016165514 A1 WO2016165514 A1 WO 2016165514A1
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WO
WIPO (PCT)
Prior art keywords
packaged
substrate
pressure
processor
movable portion
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PCT/CN2016/076367
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English (en)
French (fr)
Inventor
全威
张家豪
刘晴
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/321,617 priority Critical patent/US10270068B2/en
Publication of WO2016165514A1 publication Critical patent/WO2016165514A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0056—Provisional sheathings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a packaging device and a display substrate packaging method.
  • Organic electroluminescent devices such as organic light-emitting diodes (OLEDs) have been widely used due to their low power consumption, light weight, high brightness, wide field of view, high contrast, and reaction speed.
  • OLEDs organic light-emitting diodes
  • the OLED is packaged.
  • a sheet-like glue is attached to the surface of the OLED by using a film packaging device (Laminator) to complete the packaging of the OLED.
  • the film packaging device may include a glass carrier, the carrier of the glass carrier facing downward, and the OLED is adsorbed by the glass carrier, so that the OLED is fixedly disposed on the bearing surface of the glass carrier.
  • a sheet of glue may be placed under the OLED, that is, the sheet glue is in contact with the OLED, and the roller is used to roll on the surface of the sheet rubber, and the roller is axially rolled when the roller rolls. The sheet glue is pressed to make the sheet glue closely adhere to the OLED to complete the encapsulation of the OLED.
  • the carrying platform further includes: a processor and a pressure sensor, wherein the processor and the pressure sensor are electrically connected to each other,
  • the pressure sensor is disposed on a surface of the loading platform facing the side of the substrate to be packaged, and is configured to generate a pressure corresponding to each movable portion according to a pressure between the roller and each movable portion on the loading platform. value;
  • the processor is configured to acquire a pressure value corresponding to each of the active parts generated by the pressure sensor.
  • the packaging device further includes: an adjustment mechanism, the adjustment mechanism and the processor are electrically connected to each other,
  • the processor is further configured to adjust an adjustment mechanism to adjust a position of each movable portion on the loading platform according to a pressure value corresponding to each of the movable portions.
  • the carrying platform includes a plurality of the movable portions, and the plurality of movable portions are connected by a vacuum suction interface.
  • the moving parts are arranged in a matrix form.
  • An embodiment of the present invention further provides a display substrate packaging method using the above-mentioned packaging device, and the display substrate packaging method includes:
  • the adjusting, by the processor, the adjusting mechanism to adjust the position of the movable portion on the loading platform according to the pressure value corresponding to each movable portion includes:
  • the processor is used to obtain a difference between the pressure value and a preset standard value, and according to the absolute value of the difference, the adjusting mechanism is driven to drive the The movable portion corresponding to the pressure value is moved downward in a direction perpendicular to the substrate to be packaged.
  • the adjustment mechanism adjusts the position of the movable portion on the loading platform according to the pressure value corresponding to each of the movable portions, the method further includes:
  • the substrate to be packaged is fixedly disposed on the bearing surface of the carrier, such that the surface of the substrate to be packaged facing the package surface is in contact with the bearing surface of the carrier;
  • the roller is used to roll on the surface to be packaged of the substrate to be packaged, and the roller is axially loaded with pressure when rolling.
  • the method further comprises: before using the pressure sensor to generate a pressure value corresponding to each of the movable portions according to a pressure between the roller and each movable portion on the loading platform, the method further comprising:
  • FIG. 1 is a schematic diagram of an application scenario of a package device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of another packaging device according to an embodiment of the present invention.
  • FIG. 6 is a flowchart of a method for adjusting an active part according to an embodiment of the present invention.
  • an embodiment of the present invention provides a schematic diagram of an application scenario of a package device.
  • the package device 0 may include a loading platform 00.
  • the bearing surface a of the loading platform 00 may be downward, for example, the substrate 10 to be packaged may be set.
  • the surface b1 of the substrate to be packaged 10 facing the package surface b2 can be in contact with the bearing surface a of the carrier 00 below the carrier 00.
  • the sheet-like glue 20 can be placed under the substrate 10 to be packaged, that is, the sheet-like glue 20 is in contact with the surface to be packaged b2 of the substrate 10 to be packaged, and the roller 30 is used.
  • the surface of the sheet-like glue 20 is rolled.
  • the roller 30 rolls the roller 30 applies pressure to the sheet-like glue 20, so that the sheet-like glue 20 is in close contact with the surface to be packaged b2 of the substrate 10 to be packaged.
  • a plurality of movable portions that can be moved in a direction perpendicular to the substrate to be packaged are provided, and in the process of packaging, the roller and the carrier can be different according to different regions.
  • the pressure between the two adjusts the position of each movable portion so that the pressure between each movable portion on the loading table and the roller are equal, and each of the sheet rubber is rolled while the roller rolls.
  • the pressure applied to the regions is equal. Therefore, different regions on the surface of the sheet rubber can undergo the same deformation, which reduces the streaks of the surface of the substrate to be packaged by the sheet rubber, and enhances the display effect.
  • the embodiment of the present invention provides another encapsulating device 0, which may include a carrying station 00, which may further include: a processor 002, a pressure sensor 003, and an adjusting mechanism 004, the processor 002 can be electrically connected to the pressure sensor 003 and the adjusting mechanism 004, respectively.
  • the pressure sensor 003 can be disposed on a surface of the loading platform 00 facing the substrate to be packaged, that is, the carrying platform 00 Bearing surface a.
  • the pressure sensor 003 can be used to generate a pressure value corresponding to each movable portion 001 according to the pressure between the roller 30 in FIG. 1 and each movable portion 001 on the platform 00.
  • the processor 002 can be used to obtain a pressure value corresponding to each active part 001 generated by the pressure sensor 003, and the processor 002 is further configured to use the pressure corresponding to each active part 001.
  • the value control adjustment mechanism 004 adjusts the position of the movable portion 001 on the stage.
  • the package device 0 may be provided with a plurality of pressure sensors 003 and a plurality of adjustment mechanisms 004, and the pressure sensor 003 and the adjustment mechanism 004 may respectively correspond to the movable portion 001.
  • the processor 002 may store a correspondence between the pressure sensor 003 and the movable portion 001, and a corresponding relationship between the movable portion 001 and the adjustment mechanism 004. If the pressure sensor B of the plurality of pressure sensors 003 corresponds to the movable portion C, the movable portion C corresponds to the adjustment mechanism D.
  • the substrate to be packaged is fixedly disposed on the bearing surface of the loading platform, and the roller is used to roll on the surface to be packaged of the substrate to be packaged.
  • Pressure is generated between the roller and each movable portion 001 on the stage 00.
  • the pressure sensor B can generate a pressure value corresponding to the movable portion C according to the pressure between the roller and the movable portion C.
  • the processor 002 can obtain the pressure value generated by the pressure sensor B, and the processor 002 can acquire the identifier of the pressure sensor B that generates the pressure value while acquiring the pressure value generated by the pressure sensor B.
  • the identifier of the movable portion C corresponding to the pressure sensor B is obtained according to the identifier of the pressure sensor B and the corresponding relationship between the pressure sensor 003 and the movable portion 001. Then, based on the identification of the movable portion C and the correspondence relationship between the movable portion 001 and the adjustment mechanism 004, the identification of the adjustment mechanism D corresponding to the movable portion C is obtained.
  • the processor 002 can control the adjustment mechanism D to adjust the position of the movable portion C on the loading platform 00 according to the pressure value.
  • the adjusting mechanism D can be disposed on the movable portion C on the loading platform 00, and the processor 002 can be used to control the adjusting mechanism D to move upward or downward in a direction x perpendicular to the substrate to be packaged, thereby driving The movable portion 001 on the stage 00 moves upward or downward in a direction x perpendicular to the substrate to be packaged.
  • the adjustment mechanism 004 can be a cylinder.
  • the movable portion 001 on the loading platform 00 is moved upward by a corresponding distance in a direction x perpendicular to the substrate to be packaged; if the pressure value is less than the preset standard value, the processor 002 can The difference between the preset standard values is controlled to move the adjustment mechanism D downward by a corresponding distance in a direction x perpendicular to the substrate to be packaged, thereby driving the movable portion 001 on the loading table 00 in a direction perpendicular to the direction of the substrate to be packaged. Move the corresponding distance down.
  • the processor 002 If the pressure value generated by the pressure sensor B obtained by the processor 002 is 0N, the pressure value is less than the preset standard value, and the difference between the pressure value and the preset standard value is 1N, then the processor 002 The adjustment mechanism D can be moved downward in a direction x perpendicular to the substrate to be packaged to a moving distance corresponding to 1N, thereby driving the movable portion 001 on the loading table 00 to move downward and 1N in a direction perpendicular to the substrate to be packaged. The corresponding moving distance.
  • a plurality of movable portions that can be moved in a direction perpendicular to the substrate to be packaged are provided, and in the process of packaging, the roller and the carrier can be different according to different regions.
  • the pressure between the two movable parts is adjusted correspondingly, so that the pressure between each movable part and the roller on the stage is equal, and the roller is axially applied to each area on the sheet rubber when the roller rolls.
  • the pressures are all equal. Therefore, different regions of the surface of the sheet rubber can undergo the same deformation, which reduces the streaks of the surface of the substrate to be packaged by the sheet rubber, and enhances the display effect.
  • an embodiment of the present invention provides a display substrate packaging method.
  • the display substrate packaging method may include a packaging device as shown in FIG. 2 or FIG. 3, and the display substrate packaging method may include:
  • Step 401 Using a pressure sensor to generate a pressure value corresponding to each movable portion according to a pressure between the roller and each movable portion on the loading platform.
  • Step 402 The processor obtains a pressure value corresponding to each active part generated by the pressure sensor.
  • Step 403 The processor controls the adjustment mechanism to adjust the position of the movable portion on the carrying platform according to the pressure value corresponding to each movable portion.
  • the processor can control the plurality of movable parts on the carrying platform according to the pressure between the roller and the loading platform of different regions, perpendicular to the package to be packaged.
  • the direction of the substrate moves.
  • each movable portion can be adjusted according to the pressure between the roller and the loading table of different regions, so that the pressure between each movable portion and the roller on the loading platform is equal, in the roller
  • the pressure applied to each area of the sheet-like glue is equal, so that different areas of the surface of the sheet-like glue can undergo the same deformation, and the surface of the substrate to be packaged by the sheet-like glue is reduced. Stripes enhance the display.
  • the processor compares the pressure value with the preset standard value; if the pressure value is greater than the preset standard value, the processor obtains the difference between the pressure value and the preset standard value, and controls the adjustment mechanism according to the absolute value of the difference
  • the movable portion corresponding to the pressure value is moved upward in a direction perpendicular to the substrate to be packaged; if the pressure value is less than the preset standard value, the difference between the pressure value and the preset standard value is obtained by the processor, and according to the absolute value of the difference
  • the value of the control mechanism drives the movable portion corresponding to the pressure value to move downward in a direction perpendicular to the substrate to be packaged.
  • the processor can control the plurality of movable portions on the loading platform to be perpendicular to the substrate to be packaged according to the pressure between the roller and the loading platform of different regions.
  • the direction of movement During the encapsulation process, each movable portion can be adjusted according to the pressure between the roller and the loading table of different regions, so that the pressure between each movable portion and the roller on the loading platform is equal, in the roller
  • the pressure applied to each area of the sheet-like glue is equal, so that different areas of the surface of the sheet-like glue can undergo the same deformation, and the surface of the substrate to be packaged by the sheet-like glue is reduced. Stripes enhance the display.
  • the embodiment of the present invention provides another display substrate packaging method.
  • the display substrate packaging method may include a packaging device as shown in FIG. 2 or FIG. 3, and the display substrate packaging method may include:
  • Step 501 The substrate to be packaged is fixedly disposed on the bearing surface of the carrier, so that the surface of the substrate to be packaged facing the package surface is in contact with the bearing surface of the carrier.
  • the carrying surface of the carrying platform may be located at the bottom of the carrying platform, and the carrying platform may adsorb the substrate to be packaged to the carrying surface of the carrying platform, and the surface of the substrate to be packaged facing the package surface and the The bearing surfaces of the carrier are in contact with each other, so that the substrate to be packaged is fixedly disposed on the bearing surface of the carrier.
  • Step 503 The pressure sensor on the carrying platform generates a pressure value corresponding to each movable portion according to the pressure between the roller and each movable portion on the carrying platform.
  • the movable portion C corresponds to the adjustment mechanism D. After the pressure is generated between the movable portion C and the roller, the pressure sensor B can generate a pressure value corresponding to the movable portion C according to the pressure between the roller and the movable portion C.
  • the processor and the pressure sensor are connected, after the pressure sensor generates the pressure value corresponding to each movable part, the processor can acquire the pressure value corresponding to each movable part.
  • Step 505 The processor controls the adjustment mechanism to adjust the position of the movable portion on the carrying platform according to the pressure value corresponding to each movable portion.
  • step 505 can include:
  • Step 5051 The processor acquires a difference between a pressure value corresponding to each active part and a preset standard value. Go to step 5052.
  • the preset standard value may be stored in the processor, and after obtaining the pressure value corresponding to each active part, the processor may select the pressure value corresponding to each active part and the preset standard value. The difference is obtained, and the difference between the pressure value corresponding to each active part and the preset standard value is obtained.
  • Step 5052 The processor detects whether the difference is equal to zero. If yes, go to step 506; if no, go to step 5053.
  • the processor may directly perform step 506 without processing.
  • Step 5054 The processor controls, according to the absolute value of the difference, the movable portion corresponding to the pressure value of the adjusting mechanism to move up in a direction perpendicular to the substrate to be packaged.
  • the processor may control the adjusting mechanism to drive the movable portion corresponding to the pressure value in a direction perpendicular to the substrate to be packaged.
  • the package device may include a plurality of pressure sensors and a plurality of adjustment mechanisms, and the plurality of pressure sensors and the plurality of adjustment mechanisms are in one-to-one correspondence with the movable portion, and the processor may store pressure Correspondence between the sensor and the active part and the correspondence between the active part and the adjustment mechanism. It should be noted that, in step 503, the figure The processor 002 shown in FIG.
  • the processor 002 can control the adjustment mechanism D to move upward by a corresponding distance in a direction x perpendicular to the substrate to be packaged according to the difference between the pressure value and the preset standard value. Therefore, the movable portion 001 on the loading platform 00 is moved upward by a corresponding distance in a direction x perpendicular to the substrate to be packaged.
  • the processor 002 may also be configured with a difference between the pressure value and the preset standard value and a corresponding relationship between the moving distances, and the preset standard value is assumed to be 1N (bovine), if the pressure sensor B acquired by the processor 002 is generated.
  • the pressure value is 5N
  • the pressure value is greater than the preset standard value, and the difference between the pressure value and the preset standard value is 4N
  • the processor 002 can control the adjusting mechanism D to be perpendicular to the substrate to be packaged.
  • the direction x is moved upward by the moving distance corresponding to 4N, so that the movable portion 001 on the loading table 00 is moved upward in a direction x perpendicular to the substrate to be packaged by a moving distance corresponding to 4N.
  • Step 5055 The processor controls, according to the absolute value of the difference, the movable portion corresponding to the pressure value of the adjusting mechanism to move downward in a direction perpendicular to the substrate to be packaged.
  • the processor may control the adjusting mechanism to drive the movable portion corresponding to the pressure value to be perpendicular to the direction of the substrate to be packaged.
  • the package device may include a plurality of pressure sensors and a plurality of adjustment mechanisms, and the plurality of pressure sensors and the plurality of adjustment mechanisms are in one-to-one correspondence with the movable portion, and the processor may store Correspondence between the pressure sensor and the movable part and the correspondence between the movable part and the adjustment mechanism. It should be noted that, in step 503, the processor 002 shown in FIG.
  • the processor 002 can control the adjustment mechanism D to move downward in a direction x perpendicular to the substrate to be packaged according to the difference between the pressure value and the preset standard value.
  • the distance is such that the movable portion 001 on the loading table 00 is moved downward by a corresponding distance in a direction x perpendicular to the substrate to be packaged.
  • the processor 002 may also be configured with a difference between the pressure value and the preset standard value and a corresponding relationship between the moving distances.
  • the processor 002 can control the adjustment mechanism D moves downward along the direction x perpendicular to the substrate to be packaged by a moving distance corresponding to 1N, thereby driving the movable portion 001 on the loading table 00 to move downward by a moving distance corresponding to 1N in a direction x perpendicular to the substrate to be packaged.
  • Step 506 Place a sheet of glue on the surface to be packaged of the substrate to be packaged.
  • the sheet-like glue can be placed under the substrate to be packaged, that is, the sheet-like glue is in contact with the surface to be packaged of the substrate to be packaged.
  • the processor can control the plurality of movable portions on the loading platform to be perpendicular to the substrate to be packaged according to the pressure between the roller and the loading platform of different regions.
  • the direction of movement During the encapsulation process, each movable portion can be adjusted according to the pressure between the roller and the loading table of different regions, so that the pressure between each movable portion and the roller on the loading platform is equal, in the roller
  • the pressure applied to each area of the sheet-like glue is equal, so that different areas of the surface of the sheet-like glue can undergo the same deformation, and the surface of the substrate to be packaged by the sheet-like glue is reduced. Stripes enhance the display.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Optics & Photonics (AREA)
  • Basic Packing Technique (AREA)
  • Package Closures (AREA)

Abstract

一种封装设备（0）及显示基板封装方法，用于显示器技术。该封装设备（0）包括用于承载待封装基板（10）的承载台（00）；该承载台（00）包括至少一个能够沿垂直于该待封装基板（10）方向移动的活动部（001），能够减少待封装基板（10）表面的条纹，增强显示效果。

Description

封装设备及显示基板封装方法
交叉引用
本申请要求于2015年4月14日递交中国专利局的、申请号为201510176397.4的中国专利申请的权益，该申请的全部内容以引用方式并入本文。
技术领域
本发明涉及显示器技术领域，特别涉及一种封装设备及显示基板封装方法。
背景技术
有机电致发光器件(例如有机发光二极管(简称OLED))由于具有功耗低、轻便、亮度高、视野宽、高对比度和反应速度等特点而得到了广泛的应用，在生产OLED时，需要对OLED进行封装。
现有技术中，使用贴膜封装设备(英文：Laminator)在该OLED的表面贴上片状胶，完成该OLED的封装。贴膜封装设备可以包括玻璃承载台，该玻璃承载台的承载面向下，通过该玻璃承载台吸附该OLED，使得该OLED固定设置于该玻璃承载台的承载面上。在封装该OLED时，可以将片状胶置于该OLED下方，即该片状胶与该OLED相接触，并使用滚轴在该片状胶表面进行滚动，在滚轴滚动时滚轴向该片状胶施加压力，使得该片状胶与该OLED紧密贴合，完成该OLED的封装。
发明内容
本发明提供了一种封装设备及显示基板封装方法。所述技术方案如下：
本发明的一实施例提供了一种封装设备，所述封装设备包括用于承载待封装基板的承载台；
所述承载台包括至少一个能够沿垂直于所述待封装基板方向移动的活动部。
在一实施例中，所述承载台还包括：处理器和压力传感器，所述处理器与所述压力传感器相互电连接，
所述压力传感器设置于所述承载台面向所述待封装基板一侧的表面，用于根据滚轴与所述承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值；
所述处理器用于获取所述压力传感器生成的所述每一个活动部对应的压力值。
在一实施例中，所述封装设备还包括：调节机构，所述调节机构与所述处理器相互电连接，
所述处理器还用于根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上每一个活动部的位置。
在一实施例中，所述调节机构包括气缸。
在一实施例中，所述承载台包括多个所述活动部，多个所述活动部通过真空吸附接口连接。
在一实施例中，所述活动部以矩阵形式排列。
本发明的一实施例还提供了一种采用上述封装设备的显示基板封装方法，所述显示基板封装方法包括：
利用压力传感器根据滚轴与承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值；
利用处理器获取所述压力传感器生成的所述每一个活动部对应的压力值；
利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置。
在一实施例中，利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置包括：
利用所述处理器比较所述压力值与预设标准值的大小；
若所述压力值大于所述预设标准值，则利用所述处理器获取所述压力值与预设标准值的差值，并根据所述差值的绝对值，控制所述调节机构带动所述压力值对应的活动部沿垂直于待封装基板方向上移；
若所述压力值小于所述预设标准值，则利用所述处理器获取所述压力值与预设标准值的差值，并根据所述差值的绝对值，控制所述调节机构带动所述压力值对应的活动部沿垂直于所述待封装基板方向下移。
在一实施例中，在利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置之后，所述方法还包括：
将待封装基板固定设置于承载台的承载面上，使得该待封装基板的背对待封装面的面与该承载台的承载面相接触；以及
使用滚轴在该待封装基板的待封装面上进行滚动，在滚动时滚轴向承载台施加压力。
在一实施例中，在利用压力传感器根据滚轴与承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值之前，所述方法还包括：
将片状胶置于该待封装基板的待封装面上；以及
使用滚轴在该片状胶的表面进行滚动，使片状胶封装该待封装基板。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种封装设备的应用场景示意图；
图2是本发明实施例提供的一种封装设备的结构示意图；
图3是本发明实施例提供的另一种封装设备的结构示意图；
图4是本发明实施例提供的一种显示基板封装方法的方法流程图；
图5是本发明实施例提供的另一种显示基板封装方法的方法流程图；
图6是本发明实施例提供的一种调节活动部的方法流程图。
通过上述附图，已示出本发明明确的实施例，后文中将有更详细的描述。这些附图和文字描述并不是为了通过任何方式限制本发明构思的范围，而是通过参考特定实施例为本领域技术人员说明本发明的概念。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
本发明的实施例提供了一种封装设备，包括用于承载待封装基板的承载台，所述承载台包括至少一个能够沿垂直于所述待封装基板方向移动的活动部。
在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
如图1所示，本发明实施例提供了一种封装设备的应用场景示意图，该封装设备0可以包括承载台00，该承载台00的承载面a例如可以向下，待封装基板10可以设置在该承载台00的下方，即该待封装基板10的背对待封装面b2的面b1可以与该承载台00的承载面a相接触。在封装该待封装基板10时，可以将片状胶20置于该待封装基板10下方，即该片状胶20与该待封装基板10的待封装面b2相接触，并使用滚轴30在该片状胶20表面进行滚动，在滚轴30滚动时，滚轴30向该片状胶20施加压力，使得该片状胶20与该待封装基板10的待封装面b2紧密贴合。
如图2所示，本发明实施例提供了一种封装设备0，该封装设备0可以包括用于承载图1中待封装基板10的承载台00，该承载台00可以包括至少一个能够沿垂直于该待封装基板的方向移动的活动部001。示例的，该活动部001移动的方向可以为方向x(如图2所示)。该至少一个活动部001可以使承载台00的承载面a的不同区域沿垂直于该待封装基板的方向移动。
综上所述，由于在本发明实施例提供的封装设备中，设置了多个可以沿垂直于待封装基板的方向移动的活动部，在封装的过程中，可以根据不同区域滚轴和承载台之间的压力情况相应的调节每一个活动部的位置，使得承载台上的每一个活动部与滚轴之间的压力均相等，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，片状胶的表面上不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
进一步的，如图3所示，本发明实施例提供了另一种封装设备0，该封装设备0可以包括承载台00，该承载台00还可以包括：处理器002、压力传感器003和调节机构004，该处理器002可以分别与该压力传感器003和该调节机构004电连接，作为示例，该压力传感器003可以设置于该承载台00面向待封装基板一侧的表面，即该承载台00的承载面a。该压力传感器003可以用于根据图1中滚轴30与该承载台00上每一个活动部001之间的压力生成每一个活动部001对应的压力值。在该压力传感器003生成压力值后，该处理器002可以用于获取该压力传感器003生成的每一个活动部001对应的压力值，该处理器002还用于根据每一个活动部001对应的压力值控制调节机构004调节承载台上活动部001的位置。
示例的，请参考图3，该封装设备0中可以设置有多个压力传感器003和多个调节机构004，且该压力传感器003和该调节机构004可以分别与该活动部001一一对应。该处理器002中可以存储有压力传感器003与活动部001的对应关系，以及活动部001与调节机构004的对应关系。若该多个压力传感器003中的压力传感器B对应活动部C，该活动部C对应调节机构D。
在为该待封装基板进行封装之前，可以将该待封装基板固定设置于该承载台的承载面上，并使用滚轴在该待封装基板的待封装面滚动，在该滚轴滚动时，可以在该滚轴与该承载台00上的每一个活动部001之间产生压力。若该活动部C与滚轴之间产生压力后，该压力传感器B可以根据滚轴与该活动部C之间的压力生成该活动部C对应的压力值。该处理器002可以获取该压力传感器B生成的压力值，且该处理器002在获取该压力传感器B生成的压力值的同时，可以获取生成该压力值的压力传感器B的标识。并根据压力传感器B的标识以及压力传感器003与活动部001的对应关系得到该压力传感器B对应的活动部C的标识。然后根据活动部C的标识以及活动部001与调节机构004的对应关系得到活动部C对应的调节机构D的标识。
该处理器002在获取该调节机构D的标识后，可以根据该压力值控制该调节机构D调节该承载台00上活动部C的位置。具体的，该调节机构D可以设置在该承载台00上的活动部C上，该处理器002可以用于控制该调节机构D沿垂直于待封装基板的方向x向上或向下移动，从而带动该承载台00上活动部001沿垂直于待封装基板的方向x向上或向下移动。示例的，该调节机构004可以为气缸。该处理器002中可以设置有预设标准值，该处理器002可以比较该压力值与该预设标准值的大小，并获取该 压力值与该预设标准值的差值。若该压力值大于该预设标准值，则该处理器002可以根据该压力值与该预设标准值的差值，控制该调节机构D沿垂直于待封装基板的方向x向上移动相应的距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向上移动相应的距离；若该压力值小于该预设标准值，则该处理器002可以根据该压力值与该预设标准值的差值，控制该调节机构D沿垂直于待封装基板的方向x向下移动相应的距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向下移动相应的距离。
该处理器002中也可以设置有压力值与预设标准值的差值以及移动距离的对应关系，假设该预设标准值为1N(牛)，若该处理器002获取的该压力传感器B生成的压力值为5N，则该压力值大于该预设标准值，且该压力值与该预设标准值的差值为4N，则该处理器002可以控制该调节机构D沿垂直于待封装基板的方向x向上移动与4N对应的移动距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向上移动与4N对应的移动距离。若该处理器002获取的该压力传感器B生成的压力值为0N，则该压力值小于该预设标准值，且该压力值与该预设标准值的差值为1N，则该处理器002可以控制该调节机构D沿垂直于待封装基板的方向x向下移动与1N对应的移动距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向下移动与1N对应的移动距离。
然后可以将片状胶置于该待封装基板下方，即该片状胶与该待封装基板的待封装面相接触，并使用滚轴在该片状胶表面进行滚动，使得该片状胶与该待封装基板紧密贴合，完成该待封装基板的封装。由于在调整该承载台00上的活动部001后，该承载台00上的每一个活动部001与滚轴之间的压力均相等，所以，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，该片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
请参考图3，承载台00设有多个活动部001，该多个活动部001之间可以通过真空吸附接口A连接，使用该真空吸附接口A将该多个活动部001相连接，可以使得在根据压力反馈进行伸缩调整时，该多个活动部001之间的相对位移较小，能够减小在调整该多个活动部001位置时对该承载台00的承载面整体平整度的影响。需要说明的是，该多个活动部001可以以矩阵形式排列，该多个活动部001还可以以其他形式排列，本发明实施例对此不做限定。
综上所述，由于在本发明实施例提供的封装设备中，设置了多个可以沿垂直于待封装基板的方向移动的活动部，在封装的过程中，可以根据不同区域滚轴和承载台之间的压力情况相应的调节每一个活动部，使得承载台上的每一个活动部与滚轴之间的压力均相等，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
如图4所示，本发明实施例提供了一种显示基板封装方法，该显示基板封装方法可以采用如图2或图3所示的封装设备，该显示基板封装方法可以包括：
步骤401、利用压力传感器根据滚轴与承载台上每一个活动部之间的压力生成每一个活动部对应的压力值。
步骤402、利用处理器获取压力传感器生成的每一个活动部对应的压力值。
步骤403、利用处理器根据每一个活动部对应的压力值控制调节机构调节承载台上的活动部的位置。
综上所述，由于在本发明实施例提供的显示基板封装方法中，处理器可以根据不同区域滚轴和承载台之间的压力来控制承载台上的多个活动部，沿垂直于待封装基板的方向移动。在封装的过程中，可以根据不同区域滚轴和承载台之间的压力情况相应的调节每一个活动部，使得承载台上的每一个活动部与滚轴之间的压力均相等，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
作为示例，步骤403可以包括：
利用处理器比较压力值与预设标准值的大小；若压力值大于预设标准值，则利用处理器获取压力值与预设标准值的差值，并根据差值的绝对值，控制调节机构带动该压力值所对应的活动部沿垂直于待封装基板方向上移；若压力值小于预设标准值，则利用处理器获取压力值与预设标准值的差值，并根据差值的绝对值，控制调节机构带动该压力值所对应的活动部沿垂直于待封装基板方向下移。
综上所述，由于在本发明实施例提供的显示基板封装方法中，处理器可以控制承载台上的多个活动部根据不同区域滚轴和承载台之间的压力，沿垂直于待封装基板的方向移动。在封装的过程中，可以根据不同区域滚轴和承载台之间的压力情况相应的调节每一个活动部，使得承载台上的每一个活动部与滚轴之间的压力均相等，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
如图5所示，本发明实施例提供了另一种显示基板封装方法，该显示基板封装方法可以采用如图2或图3所示的封装设备，该显示基板封装方法可以包括：
步骤501、将待封装基板固定设置于承载台的承载面上，使得该待封装基板的背对待封装面的面与该承载台的承载面相接触。
示例的，该承载台的承载面可以位于该承载台的底部，该承载台可以将该待封装基板吸附至该承载台的承载面上，且该待封装基板的背对待封装面的面与该承载台的承载面相接触，从而将该待封装基板固定设置在该承载台的承载面上。
步骤502、使用滚轴在该待封装基板的待封装面上进行滚动，在滚动时滚轴向承载台施加压力。
可以使用该滚轴沿该待封装基板的长度方向进行滚动，滚轴在该待封装基板的待封装面上滚动时，该滚轴向该待封装基板的待封装面施加压力。
步骤503、承载台上的压力传感器根据滚轴与承载台上每一个活动部之间的压力生成每一个活动部对应的压力值。
请参考图3，若该多个压力传感器003中的压力传感器B对应活动部C，该活动部C对应调节机构D。该活动部C与滚轴之间产生压力后，该压力传感器B可以根据滚轴与该活动部C之间的压力生成该活动部C对应的压力值。
步骤504、处理器获取压力传感器生成的每一个活动部对应的压力值。
由于该处理器和压力传感器相连接，所以在该压力传感器生成每一个活动部对应的压力值后，该处理器可以获取该每一个活动部所对应的压力值。
步骤505、处理器根据每一个活动部所对应的压力值控制调节机构调节承载台上活动部的位置。
具体的，如图6所示，步骤505可以包括：
步骤5051、处理器获取该每一个活动部所对应的压力值与预设标准值的差值。执行步骤5052。
示例的，该处理器中可以存储有该预设标准值，该处理器在获取到该每一个活动部对应的压力值后，可以将该每一个活动部对应的压力值与该预设标准值做差，得到该每一个活动部对应的压力值与预设标准值的差值。
步骤5052、处理器检测该差值是否等于零。若是，执行步骤506；若否，执行步骤5053。
若该压力值与预设标准值的差值为零，则处理器可以不做处理，直接执行步骤506。
步骤5053、处理器判断该差值是否大于零，若是，执行步骤5054；若否，执行步骤5055。
步骤5054、处理器根据该差值的绝对值，控制调节机构带动压力值对应的活动部沿垂直于待封装基板方向上移。
若该压力值与预设标准值的差值大于零，即该压力值大于该预设标准值，则该处理器可以控制该调节机构带动压力值对应的活动部沿垂直于待封装基板方向上移，具体的，该封装设备中可以包括多个压力传感器和多个调节机构，且该多个压力传感器和该多个调节机构均与该活动部一一对应，该处理器中可以存储有压力传感器与活动部的对应关系以及活动部与调节机构的对应关系。需要说明的是，在步骤503中，图 3所示的该处理器002在获取该压力传感器B生成的压力值的同时，可以获取生成该压力值的压力传感器B的标识。并根据压力传感器B的标识以及压力传感器003与活动部001的对应关系得到该压力传感器B对应的活动部C的标识。然后根据活动部C的标识以及活动部001与调节机构004的对应关系得到活动部C对应的调节机构D的标识。具体的，该调节机构D可以设置在该承载台00上的活动部C上，该调节机构004可以为气缸。
若该压力值大于该预设标准值，则该处理器002可以根据该压力值与该预设标准值的差值，控制该调节机构D沿垂直于待封装基板的方向x向上移动相应的距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向上移动相应的距离。该处理器002中也可以设置有压力值与预设标准值的差值以及移动距离的对应关系，假设该预设标准值为1N(牛)，若该处理器002获取的该压力传感器B生成的压力值为5N，则该压力值大于该预设标准值，且该压力值与该预设标准值的差值为4N，则该处理器002可以控制该调节机构D沿垂直于待封装基板的方向x向上移动与4N对应的移动距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向上移动与4N对应的移动距离。
步骤5055、处理器根据该差值的绝对值，控制调节机构带动压力值对应的活动部沿垂直于待封装基板方向下移。
若该压力值与预设标准值的差值小于零，即该压力值小于该预设标准值，则该处理器可以控制该调节机构带动与压力值对应的活动部沿垂直于待封装基板方向下移，作为示例，该封装设备中可以包括多个压力传感器和多个调节机构，且该多个压力传感器和该多个调节机构均与该活动部一一对应，该处理器中可以存储有压力传感器与活动部的对应关系以及活动部与调节机构的对应关系。需要说明的是，在步骤503中，图3所示的该处理器002在获取该压力传感器B生成的压力值的同时，可以获取生成该压力值的压力传感器B的标识。并根据压力传感器B的标识以及压力传感器003与活动部001的对应关系得到该压力传感器B对应的活动部C的标识。然后根据活动部C的标识以及活动部001与调节机构004的对应关系得到活动部C对应的调节机构D的标识。具体的，该调节机构D可以设置在该承载台00上的活动部C上，该调节机构004可以为气缸。
若该压力值小于该预设标准值，则该处理器002可以根据该压力值与该预设标准值的差值，控制该调节机构D沿垂直于待封装基板的方向x向下移动相应的距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向下移动相应的距离。该处理器002中也可以设置有压力值与预设标准值的差值以及移动距离的对应关系，若该处理器002获取的该压力传感器B生成的压力值为0N，则该压力值小于该预设标准值，且该压力值与该预设标准值的差值为1N，则该处理器002可以控制该调节机构 D沿垂直于待封装基板的方向x向下移动与1N对应的移动距离，从而带动该承载台00上的活动部001沿垂直于待封装基板的方向x向下移动与1N对应的移动距离。
步骤506、将片状胶置于该待封装基板的待封装面上。
具体的，可以将片状胶置于该待封装基板下方，即该片状胶与该待封装基板的待封装面相接触。
步骤507、使用滚轴在该片状胶的表面进行滚动，使片状胶封装该待封装基板。
使用滚轴在该片状胶表面进行滚动，使得该片状胶与该待封装基板紧密贴合，完成该待封装基板的封装。由于在调整该承载台上的活动部后，该承载台上的每一个活动部与滚轴之间的压力均相等，所以，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，该片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
综上所述，由于在本发明实施例提供的显示基板封装方法中，处理器可以控制承载台上的多个活动部根据不同区域滚轴和承载台之间的压力，沿垂直于待封装基板的方向移动。在封装的过程中，可以根据不同区域滚轴和承载台之间的压力情况相应的调节每一个活动部，使得承载台上的每一个活动部与滚轴之间的压力均相等，在滚轴滚动时滚轴向该片状胶上的每个区域施加的压力均相等，因此，片状胶的表面不同的区域能够发生相同的变形，减少了由该片状胶封装的待封装基板表面的条纹，增强了显示效果。
上述所有可选技术方案，可以采用任意结合形成本发明的可选实施例，在此不再一一赘述。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种封装设备，包括用于承载待封装基板的承载台；
    所述承载台包括至少一个能够沿垂直于所述待封装基板方向移动的活动部。
  2. 根据权利要求1所述的封装设备，其中，
    所述承载台还包括：处理器和压力传感器，所述处理器与所述压力传感器相互电连接，
    所述压力传感器设置于所述承载台面向所述待封装基板一侧的表面，用于根据滚轴与所述承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值；
    所述处理器用于获取所述压力传感器生成的所述每一个活动部对应的压力值。
  3. 根据权利要求2所述的封装设备，
    还包括：调节机构，所述调节机构与所述处理器相互电连接，
    所述处理器还用于根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上每一个活动部的位置。
  4. 根据权利要求3所述的封装设备，其中，
    所述调节机构包括气缸。
  5. 根据权利要求1至4任一权利要求所述的封装设备，其中，
    所述承载台包括多个所述活动部，多个所述活动部通过真空吸附接口连接。
  6. 根据权利要求5所述的封装设备，其中，
    所述活动部以矩阵形式排列。
  7. 一种采用权利要求3或4所述的封装设备的显示基板封装方法，所述显示基板封装方法包括：
    利用压力传感器根据滚轴与承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值；
    利用处理器获取所述压力传感器生成的所述每一个活动部对应的压力值；
    利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置。
  8. 根据权利要求7所述的显示基板封装方法，其中，利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置，包括：
    利用所述处理器比较所述压力值与预设标准值的大小；
    若所述压力值大于所述预设标准值，则利用所述处理器获取所述压力值与预设标准值的差值，并根据所述差值的绝对值，控制所述调节机构带动所述压力值对应的活动部沿垂直于待封装基板方向上移；
    若所述压力值小于所述预设标准值，则利用所述处理器获取所述压力值与预设标准值的差值，并根据所述差值的绝对值，控制所述调节机构带动所述压力值对应的活动部沿垂直于所述待封装基板方向下移。
  9. 根据权利要求7所述的显示基板封装方法，在利用所述处理器根据所述每一个活动部对应的压力值控制调节机构调节所述承载台上活动部的位置之后，还包括：
    将待封装基板固定设置于承载台的承载面上，使得该待封装基板的背对待封装面的面与该承载台的承载面相接触；以及
    使用滚轴在该待封装基板的待封装面上进行滚动，在滚动时滚轴向承载台施加压力。
  10. 根据权利要求7所述的显示基板封装方法，在利用压力传感器根据滚轴与承载台上每一个活动部之间的压力生成所述每一个活动部对应的压力值之前，还包括：
    将片状胶置于该待封装基板的待封装面上；以及
    使用滚轴在该片状胶的表面进行滚动，使片状胶封装该待封装基板。
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