WO2016161730A1 - 一种阵列基板、在其上喷墨印刷的方法及相关装置 - Google Patents

一种阵列基板、在其上喷墨印刷的方法及相关装置 Download PDF

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WO2016161730A1
WO2016161730A1 PCT/CN2015/086455 CN2015086455W WO2016161730A1 WO 2016161730 A1 WO2016161730 A1 WO 2016161730A1 CN 2015086455 W CN2015086455 W CN 2015086455W WO 2016161730 A1 WO2016161730 A1 WO 2016161730A1
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pixel
array substrate
region
area
hole
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PCT/CN2015/086455
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English (en)
French (fr)
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洪晓雯
井口真介
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京东方科技集团股份有限公司
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Priority to US14/912,908 priority Critical patent/US9780304B2/en
Publication of WO2016161730A1 publication Critical patent/WO2016161730A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an array substrate, a method of inkjet printing thereon, an organic electroluminescence display device, and a display panel.
  • the film formation methods of organic electroluminescent display devices mainly include an evaporation process and a solution process.
  • the evaporation process is relatively mature in small-sized devices, and the technology is currently used in mass production.
  • the evaporation process faces great drawbacks, such as the visor being highly susceptible to the high temperature environment in the process, which causes it to be difficult to maintain a uniform deposition rate on the substrate.
  • the method of film formation by solution process mainly includes inkjet printing, nozzle coating, spin coating, screen printing, etc. Among them, inkjet printing can be deposited by spraying liquid organic material to form a uniform film layer, which has high material utilization rate. It is easy to achieve large size and is considered to be an important way to achieve mass production of large-size OLEDs.
  • inkjet printing is a continuous printing method, and it is required to continuously spray a liquid on a substrate, so that in the printing process, the side view of the existing OLED device shown in FIG. 1 is empty outside the display area (AA area).
  • the exclusion zone of the ⁇ area and the contact hole area is sprayed with liquid, and an additional process is required after the printing is completed to remove the liquid at the exclusion zone to prevent the residual liquid from damaging the OLED device to form a display defect.
  • there are methods for cleaning the residual liquid at the exclusion zone such as plasma dry etching, laser cleaning, edge rubbing, etc. These cleaning methods are generally difficult to clean in areas with micropatterns in the exclusion zone, such as in contact. If liquid remains in the via hole at the hole area, it is difficult to clean it, and if liquid remains in the via hole, display defects are easily caused.
  • embodiments of the present invention provide an array substrate, a method of inkjet printing thereon, an organic electroluminescence display device, and a display panel, which can effectively avoid residual liquid in a region with a micro pattern in an exclusion region.
  • an array substrate includes a display area having a plurality of pixel regions arranged in an array, a contact hole area outside the display area and having a plurality of contact holes, and a method further comprising:
  • An anti-overflow region between the contact hole region and the display region and having at least one pixel hole is provided.
  • an open area having at least one column of open pixel areas is further included between an outer side of the display area and the anti-overflow area;
  • the open pixel area has the same shape and the same size as the pixel area.
  • the length of the pixel hole in the column direction of the pixel region is not less than the total length of the pixel region in the column direction.
  • the pixel region and the pixel hole satisfy the following formula:
  • P represents the length of one of the pixel regions in the row direction
  • L represents the length of the pixel hole in the row direction of the pixel region
  • S represents the sum of the areas of a column of the pixel regions
  • S' represents the pixel hole Area
  • the pixel region and the pixel hole satisfy the following formula:
  • P represents the length of one of the pixel regions in the row direction
  • L represents the length of one of the pixel holes in the row direction of the pixel region
  • S represents the area of one of the pixel regions
  • S' represents one of the pixel holes Area.
  • a hole depth of the pixel hole is larger than a hole depth of the contact hole.
  • each of the pixel holes of the anti-overflow region is a groove formed by etching a substrate substrate of the array substrate by a photolithography process.
  • An embodiment of the present invention provides an organic electroluminescent display device comprising the above array substrate provided by the embodiment of the present invention.
  • An embodiment of the present invention further provides a display panel comprising the above organic electroluminescent display device provided by the embodiment of the present invention.
  • An embodiment of the present invention further provides a method for inkjet printing on the above array substrate provided by the embodiment of the present invention, comprising:
  • the desired ink is sprayed on the array substrate in such a manner that the traveling direction of the array substrate and the traveling direction of the head are perpendicular to each other.
  • the foregoing method provided by an embodiment of the present invention further includes:
  • a masking plate is used to shield the contact hole area on the array substrate before spraying the desired ink.
  • An embodiment of the present invention provides an array substrate, a method of inkjet printing thereon, an organic electroluminescence display device, and a display panel, comprising: a display region having a plurality of pixel regions arranged in an array, located outside the display region and a contact hole region having a plurality of contact holes; and an anti-overflow region having at least one pixel hole is disposed by a space between the display region and the contact hole region.
  • the pixel hole in the increased anti-overflow region can cause ink flowing from the display region to the contact hole region to flow into the pixel hole of the anti-overflow region when inkjet printing is performed on the array substrate, thereby alleviating contact in the contact hole region. If there is liquid remaining in the hole, it is difficult to clean and display defects.
  • FIG. 1 is a schematic structural view of an OLED in the prior art
  • FIG. 2 is a schematic structural diagram of an array substrate according to an embodiment of the present invention.
  • 3a and 3b are partial views of an array substrate according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a traveling direction when inkjet printing is performed on an array substrate according to an embodiment of the present invention.
  • An array substrate includes a display region 100 having a plurality of pixel regions arranged in an array, and a contact hole region 300 having a plurality of contact holes outside the display region 100. Also included is an anti-overflow region 400 between the contact hole region 300 and the display region 100 and having at least one pixel aperture.
  • the outer side of the display area 100 and the anti-overflow area 400 further include: an open area 200 having at least one column of open pixel areas.
  • the empty pixel area has the same shape and the same size as the pixel area.
  • 3a and 3b illustrate the case where two columns of open pixel regions 210 are disposed in the open region 200, and the open pixel regions 210 disposed in the open region 200 may serve to perform pixel regions of the display region 100.
  • the empty pixel area 210 in the open area 200 and the pixel area of the display area 100 should be the same, that is, when inkjet printing is performed on the array substrate, the ink should also be filled into the open area 200.
  • the pixel area 210 is empty.
  • the contact hole 310 of the contact hole region 300 outside the open area 200 serves to connect the pixel area of the display area 100 with an external circuit. If ink remains in the contact hole 310, the subsequent contact hole may be connected. The effect is adversely affected, and therefore, it is necessary to remove the ink remaining in the contact hole 310.
  • an anti-overflow region 400 having at least one pixel hole 410 is provided by using a space between the display region 100 and the contact hole region 300, and the pixel hole 410 in the anti-overflow region 400 is increased.
  • the inkjet printing is performed on the array substrate, the ink flowing from the display region 100 to the contact hole region 300 can flow into the pixel hole 410 of the overflow prevention region 400, and the residual in the contact hole 310 of the contact hole region 300 can be alleviated. Display defects caused by liquids that are difficult to clean.
  • the pixel hole 410 may be disposed in the anti-overflow region 400.
  • the anti-overflow region 400 may be Only one pixel hole 410 is provided, and the length of the pixel hole 410 in the column direction of the pixel region (ie, equivalent to the empty pixel region 210) should be not less than the total length of the pixel region (ie, equivalent to the open pixel region 210) in the column direction. This injects the array substrate At the time of printing, as shown in FIG.
  • the traveling direction of the array substrate and the traveling direction of the head are perpendicular to each other, that is, the traveling direction of the array substrate is the same as the column direction of the open pixel area of the open area, the head travels.
  • the direction is directed from the open area to the contact hole area, such that the length of the pixel hole 410 in the column direction of the pixel area (ie, equivalent to the empty pixel area 210) is set to be not smaller than the pixel area (ie, equivalent to the empty pixel area 210).
  • the total length of the column direction can ensure that the ink flowing from the display region 100 to the contact hole region 300 flows into the overflow prevention region 400 as much as possible.
  • the pixel region ie, equivalent to the space
  • the pixel area 210) and the pixel hole 410 are set to satisfy the following formula:
  • P represents the length of one pixel region (ie, equivalent to the empty pixel region 210) in the row direction;
  • L represents the length of the pixel hole 410 in the pixel region (ie, equivalent to the empty pixel region 210);
  • S represents a column of pixels The sum of the areas of the regions 410;
  • S' represents the area of the pixel holes 410.
  • the pixel hole 410 is disposed in the anti-overflow region 400 except that only one pixel hole 410 is disposed in the anti-overflow region 400 as shown in FIG. 3a.
  • at least one column of pixel holes 410 may be disposed in the anti-overflow region 400.
  • the total length of the pixel holes 410 in the column direction is not less than the pixel region (ie, equivalent to the empty pixel region 210). The total length of the direction.
  • each column of pixel holes 410 may be disposed in one-to-one correspondence with each column of pixel regions (ie, equivalent to the empty pixel region 210).
  • the traveling direction of the array substrate and the traveling direction of the head are perpendicular to each other, that is, the traveling direction of the array substrate and the open pixel area of the open area.
  • the column direction is the same, and the traveling direction of the head is directed from the open area to the contact hole area, so that the total length of the pixel hole 410 in the column direction is set to be not smaller than the pixel area (ie, equivalent to the empty pixel area 210) in the column direction.
  • the total length can ensure that the ink flowing from the display region 100 to the contact hole region 300 flows into the overflow prevention region 400 as much as possible.
  • the ink flowing from the display region 100 to the contact hole region 300 flows into the overflow prevention region 400.
  • the pixel region ie, equivalent to the space
  • the pixel area 210) and the pixel hole 410 are set to satisfy the following formula:
  • P represents the length of one pixel region (ie, equivalent to the empty pixel region 210) in the row direction;
  • L represents the length of one pixel hole 410 in the pixel region (ie, equivalent to the empty pixel region 210);
  • S represents a The area of the pixel area (i.e., equivalent to the empty pixel area 210);
  • S' represents the area of one pixel hole 410.
  • the hole depth of the pixel hole 410 may be set to be larger than the hole depth of the contact hole 310. Even if ink flows into the contact hole region 300, it will first flow into the pixel hole 410 having a deep hole depth due to the action of gravity, and will not flow into the contact hole 310.
  • each of the pixel holes 410 of the anti-overflow region 400 may adopt a method of etching a substrate of the array substrate by a photolithography process to form a groove. achieve.
  • an embodiment of the present invention further provides a method for inkjet printing on the array substrate provided by the embodiment of the present invention, comprising the steps of: using a traveling direction of the array substrate and a traveling direction of the nozzle perpendicular to each other. The way, the required ink is sprayed on the array substrate.
  • the traveling direction of the general array substrate is the same as the column direction of the open pixel area of the open area, that is, the vertical direction, and the traveling direction of the head is directed from the open area to the contact hole area, that is, the horizontal direction. .
  • an anti-overflow region having a pixel hole is added between the contact hole region and the open region, it is possible to cause ink flowing from the open region to the contact hole region to flow into the overflow prevention when inkjet printing is performed on the array substrate.
  • the problem of display defects caused by the liquid remaining in the contact hole of the contact hole region and being difficult to clean is alleviated.
  • the inkjet printing method provided by one embodiment of the present invention may further include the following steps: masking the contact hole region on the array substrate by using a mask before spraying the required ink. This can further prevent ink from flowing into the contact hole area.
  • an embodiment of the present invention further provides an organic electroluminescent display device comprising the above array substrate provided by the embodiment of the present invention.
  • the principle of solving the problem is similar to the foregoing array substrate, so the device For the implementation of the array substrate, refer to the implementation of the array substrate, and the repeated description is omitted.
  • an embodiment of the present invention further provides a display device.
  • the above-mentioned organic electroluminescent display device provided by the embodiment of the present invention may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display device reference may be made to the embodiment of the above organic electroluminescent display device, and the repeated description is omitted.
  • An embodiment of the present invention provides an array substrate, a method of inkjet printing thereon, an organic electroluminescence display device, and a display panel, comprising: a display region having a plurality of pixel regions arranged in an array, located outside the display region and a contact hole region having a plurality of contact holes; and an anti-overflow region having at least one pixel hole is disposed by a space between the display region and the contact hole region.
  • the pixel hole in the increased anti-overflow region can cause ink flowing from the display region to the contact hole region to flow into the pixel hole of the anti-overflow region when inkjet printing is performed on the array substrate, thereby alleviating contact in the contact hole region. If there is liquid remaining in the hole, it is difficult to clean and display defects.

Abstract

一种阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板。阵列基板包括具有呈阵列排布的多个像素区的显示区域（100），位于显示区域（100）外侧且具有多个接触孔（310）的接触孔区域（300）；且利用显示区域（100）和接触孔区域（300）之间的空间设置具有至少一个像素孔（410）的防溢流区域（400）。增加的防溢流区域（400）中的像素孔（410）可以在对阵列基板进行喷墨印刷时，使从显示区域（100）流向接触孔区域（300）的墨水流入到防溢流区域（400）的像素孔（410）内，而缓解在接触孔区域（300）的接触孔（310）内若残留有液体而难以清理干净造成的显示缺陷问题。

Description

一种阵列基板、在其上喷墨印刷的方法及相关装置 技术领域
本发明涉及显示技术领域，尤其涉及一种阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板。
背景技术
有机电致发光显示器件(OLED，Organic Electroluminesecent Display)的成膜方式主要有蒸镀制程和溶液制程。蒸镀制程在小尺寸器件的应用较为成熟，目前该技术已经应用于量产中。在面对大型化器件时，蒸镀制程面临极大的缺陷，如遮光板极易受工艺流程中的高温环境影响而发生偏移，导致难以在基板上保持均匀的沉积率。而溶液制程成膜的方式主要有喷墨印刷、喷嘴涂覆、旋涂、丝网印刷等；其中，喷墨印刷可以通过喷涂液态有机材料而沉积形成均匀的薄膜层，其材料利用率较高，易于实现大尺寸化，被认为是大尺寸OLED实现量产的重要方式。
但是，喷墨印刷属于连续打印方式，需要在基板上连续喷涂液体，这样在打印过程中，如图1所示的现有的OLED器件的侧视图，在显示区域(AA区域)以外的诸如空佘区域和接触孔区域的除外区域均会喷涂有液体，在打印完成后需要采用额外的工艺来清除掉除外区域处的液体，避免残留的液体对OLED器件造成伤害而形成显示缺陷。目前采用的清洁除外区域处残留的液体的方式有等离子(Plasma)干刻，激光(Laser)清洁，擦边方式等，这些清洁方式一般难以清理在除外区域带有微图案的区域，例如在接触孔区域处的过孔内若残留有液体则难以清理干净，而该过孔内若残留有液体很容易会造成显示缺陷。
因此，如何有效避免除外区域内带有微图案的区域残留液体，是本领域技术人员亟需解决的技术问题。
发明内容
有鉴于此，本发明实施例提供了一种阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板，可以有效避免除外区域内带有微图案的区域残留液体。
因此，本发明一个实施例提供的一种阵列基板，包括具有呈阵列排布的多个像素区的显示区域，位于所述显示区域外侧且具有多个接触孔的接触孔区域；还包括：
位于所述接触孔区域和显示区域之间，且具有至少一个像素孔的防溢流区域。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，在所述显示区域的外侧与防溢流区域之间还包括具有至少一列空佘像素区的空佘区域；所述空佘像素区与所述像素区形状相同，大小一致。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，
在所述防溢流区域内具有一个所述像素孔，所述像素孔在所述像素区列方向的长度不小于所述像素区在列方向的总长度。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，所述像素区与所述像素孔满足以下公式：
L/P×S≤S′
其中，P表示一个所述像素区在行方向的长度；L表示所述像素孔在所述像素区行方向的长度；S表示一列所述像素区的面积之和；S’表示所述像素孔的面积。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，
在所述防溢流区域内具有至少一列所述像素孔，所述像素孔在列方向的总长度不小于所述像素区在列方向的总长度。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，所述像素区与所述像素孔满足以下公式：
L/P×S≤S′
其中，P表示一个所述像素区在行方向的长度；L表示一个所述像素孔在所述像素区行方向的长度；S表示一个所述像素区的面积；S’表示一个所述像素孔的面积。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列基板中，所述像素孔的孔深大于所述接触孔的孔深。
在一种可能的实施方式中，在本发明一个实施例提供的上述阵列 基板中，所述防溢流区域具有的各所述像素孔为通过光刻工艺刻蚀阵列基板的衬底基板形成的凹槽。
本发明一个实施例提供了一种有机电致发光显示器件，包括本发明实施例提供的上述阵列基板。
本发明一个实施例还提供了一种显示面板，包括本发明实施例提供的上述有机电致发光显示器件。
本发明一个实施例还提供了一种在本发明实施例提供的上述阵列基板上喷墨印刷的方法，包括：
采用阵列基板的行进方向与喷头的行进方向相互垂直的方式，在阵列基板上喷涂所需的墨水。
在一种可能的实施方式中，本发明一个实施例提供的上述方法，还包括：
在喷涂所需的墨水之前，采用掩膜板遮挡所述阵列基板上的接触孔区域。
本发明实施例的有益效果包括：
本发明实施例提供的一种阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板，包括具有呈阵列排布的多个像素区的显示区域，位于显示区域外侧且具有多个接触孔的接触孔区域；且利用显示区域和接触孔区域之间的空间设置具有至少一个像素孔的防溢流区域。增加的防溢流区域中的像素孔可以在对阵列基板进行喷墨印刷时，使从显示区域流向接触孔区域的墨水流入到防溢流区域的像素孔内，而缓解在接触孔区域的接触孔内若残留有液体而难以清理干净造成的显示缺陷问题。
附图说明
图1为现有技术中OLED的结构示意图；
图2为本发明实施例提供的阵列基板的结构示意图；
图3a和图3b为本发明实施例提供的阵列基板的局部图；
图4为本发明一个实施例提供的在对阵列基板进行喷墨打印时的行进方向示意图。
具体实施方式
下面结合附图，对本发明实施例提供的阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板的具体实施方式进行详细地说明。
附图中各层薄膜厚度和形状不反映阵列基板的真实比例，目的只是示意说明本发明内容。
本发明一个实施例提供的一种阵列基板，如图2所示，包括具有呈阵列排布的多个像素区的显示区域100，位于显示区域100外侧且具有多个接触孔的接触孔区域300；还包括：位于接触孔区域300和显示区域100之间，且具有至少一个像素孔的防溢流区域400。
一般地，在本发明一个实施例提供的上述阵列基板中，如图2所示，显示区域100的外侧与防溢流区域400之间还包括：具有至少一列空佘像素区的空佘区域200；空佘像素区与像素区形状相同，大小一致。图3a和图3b中示出了在空佘区域200设置两列空佘像素区210的情况，在空佘区域200内设置的空佘像素区210的可以起到对显示区域100的像素区进行修补或补偿的作用，因此，空佘区域200内的空佘像素区210和显示区域100的像素区域应相同，即在对阵列基板进行喷墨打印时，墨水也应填充到空佘区域200的空佘像素区210内。而位于空佘区域200外侧的接触孔区域300的接触孔310是起到将显示区域100的像素区与外部电路进行连接的作用，在接触孔310内若残留有墨水会对后续接触孔的衔接作用起到不良影响，因此，需要将接触孔310内残留的墨水清除。
本发明一个实施例提供的上述阵列基板，利用显示区域100和接触孔区域300之间的空间设置具有至少一个像素孔410的防溢流区域400，增加的防溢流区400中的像素孔410可以在对阵列基板进行喷墨印刷时，使从显示区域100流向接触孔区域300的墨水流入到防溢流区域400的像素孔410内，而缓解在接触孔区域300的接触孔310内若残留有液体而难以清理干净造成的显示缺陷问题。
在具体实施时，本发明一个实施例提供的上述阵列基板中，在防溢流区域400内设置像素孔410的方式可以有多种，例如如图3a所示，在防溢流区域400内可以仅设置一个像素孔410，并且像素孔410在像素区(即等同于空佘像素区210)列方向的长度应不小于像素区(即等同于空佘像素区210)在列方向的总长度。这样在对阵列基板进行喷墨 印刷时，如图4所示，由于采用阵列基板的行进方向与喷头的行进方向相互垂直的方式时，即阵列基板的行进方向与空佘区域的空佘像素区的列方向相同，喷头的行进方向从空佘区域指向接触孔区域，这样由于将像素孔410在像素区(即等同于空佘像素区210)列方向的长度设置为不小于像素区(即等同于空佘像素区210)在列方向的总长度，可以尽可能的保证从显示区域100流向接触孔区域300的墨水流入到防溢流区域400。
并且，进一步地，为了尽可能的保证从显示区域100流向接触孔区域300的墨水流入到防溢流区域400，在具体实施时，如图3a所示，可以将像素区(即等同于空佘像素区210)与像素孔410设置为满足以下公式：
L/P×S≤S′
其中，P表示一个像素区(即等同于空佘像素区210)在行方向的长度；L表示像素孔410在像素区(即等同于空佘像素区210)行方向的长度；S表示一列像素区410的面积之和；S’表示像素孔410的面积。
在具体实施时，本发明实施例提供的上述阵列基板中，在防溢流区域400内设置像素孔410的方式除了采用如图3a所示的在防溢流区域400内仅设置一个像素孔410的方式，还可以如图3b所示，在防溢流区域400内设置至少一列像素孔410，像素孔410在列方向的总长度不小于像素区(即等同于空佘像素区210)在列方向的总长度。并且，还可以如图3a所示，将各列像素孔410设置为与各列像素区(即等同于空佘像素区210)一一对应。这样在对阵列基板进行喷墨印刷时，如图4所示，由于采用阵列基板的行进方向与喷头的行进方向相互垂直的方式时，即阵列基板的行进方向与空佘区域的空佘像素区的列方向相同，喷头的行进方向从空佘区域指向接触孔区域，这样由于将像素孔410在列方向的总长度设置为不小于像素区(即等同于空佘像素区210)在列方向的总长度，可以尽可能的保证从显示区域100流向接触孔区域300的墨水流入到防溢流区域400。
并且，进一步地，为了尽可能的保证从显示区域100流向接触孔区域300的墨水流入到防溢流区域400，在具体实施时，如图3b所示，可以将像素区(即等同于空佘像素区210)与像素孔410设置为满足以下公式：
L/P×S≤S′
其中，P表示一个像素区(即等同于空佘像素区210)在行方向的长度；L表示一个像素孔410在像素区(即等同于空佘像素区210)行方向的长度；S表示一个像素区(即等同于空佘像素区210)的面积；S’表示一个像素孔410的面积。
在具体实施时，本发明一个实施例提供的上述阵列基板中，为了尽可能的防止墨水流入到接触孔区域300，还可以将像素孔410的孔深设置为大于接触孔310的孔深，这样，即使有墨水流入到接触孔区域300内，由于重力的作用，也会首先流入到孔深较深的像素孔410内，而不会流入到接触孔310内。
并且，在具体实施时，本发明一个实施例提供的上述阵列基板中，防溢流区域400具有的各像素孔410可以采用通过光刻工艺刻蚀阵列基板的衬底基板以形成凹槽的方式实现。
基于同一发明构思，本发明一个实施例还提供了一种在本发明实施例提供的上述阵列基板上喷墨印刷的方法，包括以下步骤：采用阵列基板的行进方向与喷头的行进方向相互垂直的方式，在阵列基板上喷涂所需的墨水。如图4所示，一般的阵列基板的行进方向与空佘区域的空佘像素区的列方向相同，即为竖直方向，喷头的行进方向从空佘区域指向接触孔区域，即为水平方向。
由于在接触孔区域和空佘区域之间增加了具有像素孔的防溢流区域，可以起到在对阵列基板进行喷墨印刷时，使从空佘区域流向接触孔区域的墨水流入到防溢流区域的像素孔内，而缓解在接触孔区域的接触孔内若残留有液体而难以清理干净造成的显示缺陷问题。
进一步地，在具体实施时，本发明一个实施例提供的上述喷墨打印方法中，还可以包括以下步骤：在喷涂所需的墨水之前，采用掩膜板遮挡阵列基板上的接触孔区域。这样可以进一步防止墨水流入接触孔区域。
基于同一发明构思，本发明一个实施例还提供了一种有机电致发光显示器件包括本发明实施例提供的上述阵列基板，由于该器件解决问题的原理与前述一种阵列基板相似，因此该器件的实施可以参见阵列基板的实施，重复之处不再赘述。
基于同一发明构思，本发明一个实施例还提供了一种显示装置， 包括本发明实施例提供的上述有机电致发光显示器件，该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。该显示装置的实施可以参见上述有机电致发光显示器件的实施例，重复之处不再赘述。
本发明实施例提供的一种阵列基板、在其上喷墨印刷的方法、有机电致发光显示器件及显示面板，包括具有呈阵列排布的多个像素区的显示区域，位于显示区域外侧且具有多个接触孔的接触孔区域；且利用显示区域和接触孔区域之间的空间设置具有至少一个像素孔的防溢流区域。增加的防溢流区域中的像素孔可以在对阵列基板进行喷墨印刷时，使从显示区域流向接触孔区域的墨水流入到防溢流区域的像素孔内，而缓解在接触孔区域的接触孔内若残留有液体而难以清理干净造成的显示缺陷问题。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (12)

  1. 一种阵列基板，包括具有呈阵列排布的多个像素区的显示区域，位于所述显示区域外侧且具有多个接触孔的接触孔区域；其特征在于，还包括：
    位于所述接触孔区域和显示区域之间，且具有至少一个像素孔的防溢流区域。
  2. 如权利要求1所述的阵列基板，其特征在于，在所述显示区域的外侧与防溢流区域之间还包括具有至少一列空余像素区的空余区域；所述空余像素区与所述像素区形状相同，大小一致。
  3. 如权利要求1或2所述的阵列基板，其特征在于，
    在所述防溢流区域内具有一个所述像素孔，所述像素孔在所述像素区列方向的长度不小于所述像素区在列方向的总长度。
  4. 如权利要求3所述的阵列基板，其特征在于，所述像素区与所述像素孔满足以下公式：
    L/P×S≤S′
    其中，P表示一个所述像素区在行方向的长度；L表示所述像素孔在所述像素区行方向的长度；S表示一列所述像素区的面积之和；S’表示所述像素孔的面积。
  5. 如权利要求1或2所述的阵列基板，其特征在于，
    在所述防溢流区域内具有至少一列所述像素孔，所述像素孔在列方向的总长度不小于所述像素区在列方向的总长度。
  6. 如权利要求5所述的阵列基板，其特征在于，所述像素区与所述像素孔满足以下公式：
    L/P×S≤S′
    其中，P表示一个所述像素区在行方向的长度；L表示一个所述像素孔在所述像素区行方向的长度；S表示一个所述像素区的面积；S’表示一个所述像素孔的面积。
  7. 如权利要求1-6任一项所述的阵列基板，其特征在于，所述像素孔的孔深大于所述接触孔的孔深。
  8. 如权利要求1-6任一项所述的阵列基板，其特征在于，所述防溢流区域具有的各所述像素孔为通过光刻工艺刻蚀阵列基板的衬底基 板形成的凹槽。
  9. 一种有机电致发光显示器件，其特征在于，包括如权利要求1-8任一项所述的阵列基板。
  10. 一种显示面板，其特征在于，包括如权利要求9所述的有机电致发光显示器件。
  11. 一种在如权利要求1-8任一项所述的阵列基板上喷墨印刷的方法，其特征在于，包括：
    采用阵列基板的行进方向与喷头的行进方向相互垂直的方式，在阵列基板上喷涂所需的墨水。
  12. 如权利要求11所述的方法，其特征在于，还包括：
    在喷涂所需的墨水之前，采用掩膜板遮挡所述阵列基板上的接触孔区域。
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