WO2016161692A1 - 一种在金属表面制造微凸点的方法 - Google Patents
一种在金属表面制造微凸点的方法 Download PDFInfo
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- WO2016161692A1 WO2016161692A1 PCT/CN2015/078916 CN2015078916W WO2016161692A1 WO 2016161692 A1 WO2016161692 A1 WO 2016161692A1 CN 2015078916 W CN2015078916 W CN 2015078916W WO 2016161692 A1 WO2016161692 A1 WO 2016161692A1
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- metal surface
- microbumps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Definitions
- the invention belongs to the field of laser micromachining, in particular to a method for manufacturing microbumps on a metal surface.
- Metal surfaces with microbump morphology have a wide range of applications in the industry.
- the production of high-hardness textured bumps on the surface of the rolls not only improves the service life of the rolls, but also produces corresponding pit topography on the surface of the rolled steel sheets, improving the stamping forming properties and surface of the rolled steel sheets.
- the methods for processing micro-bump morphology on the surface of metal materials are: mechanical method, chemical etching, EDM, etc.
- the technical advantage of laser texturing is that the design results can be optimized according to tribology, and the microbump morphology can be controllably processed on the metal surface.
- the direction and pressure of the external auxiliary gas must be carefully controlled during the processing, or the pulse width of the applied laser must be carefully selected in order to obtain a suitable gasification recoil pressure. Get a convex shape. Therefore, from the reliable realization of the metal surface convex angle, the conventional laser texturing process has certain process complexity and uncertainty.
- the contour shape of the metal surface texturing point is determined by the shape of the light intensity distribution in the laser beam.
- the conventional laser output spot is generally circular, so the hair produced by the conventional laser texturing process is
- the bumps can only be rounded, and other shapes of textured bumps, such as squares, chevrons, circles, etc., cannot be obtained. Therefore, in this sense, the conventional laser texturing process cannot be completely realized.
- Tribology optimizes design and manufacturing.
- the laser shock peening technology can only strengthen the metal surface, and can not make the convex surface on the metal surface; while the laser texturing technology can only make the convex surface on the metal surface, but can not strengthen the entire surface.
- Chinese patent CN201410439453.4 discloses a device and a method for manufacturing a surface micro-protrusion by laser shock, and simultaneously realizes laser impact surface modification and laser surface micro-shape, but cannot obtain a desired shape, size and minute. The bulge of the cloth.
- the present invention provides a method for manufacturing microbumps on a metal surface.
- the method is simple, and the convex angle of the metal surface can be reliably obtained, and bumps of arbitrary shapes can be obtained, and at the same time,
- the metal surface creates a raised topography and a reinforced metal surface.
- the present invention achieves the above technical objects by the following technical means.
- a method of fabricating microbumps on a metal surface characterized by
- the metal workpiece is copper, aluminum or an aluminum alloy.
- the method of applying the adhesive layer is spraying, brushing or pasting.
- the adhesive layer is high temperature resistant silica gel, black lacquer, petrolatum, paper, double-sided tape, and the adhesive layer has a thickness of 20 ⁇ m to 100 ⁇ m.
- the method of processing holes on the bonding layer is laser etching.
- the absorbing layer is an aluminum foil, and the absorbing layer has a thickness of 50 ⁇ m to 200 ⁇ m.
- the transparent constraining layer is colorless and transparent water or glass, and the transparent constraining layer has a thickness of 1 mm to 5 mm.
- the laser beam has a pulse width of 1 ns to 100 ns, a pulse energy of at least 1 J, and a diameter of the laser generated spot of 1 mm to 5 mm.
- the method for manufacturing microbumps on a metal surface according to the present invention does not require additional application of an auxiliary gas, and does not require careful control of the pulse width, and the principle is intuitive and the process is simple;
- the method for manufacturing microbumps on a metal surface according to the present invention can conveniently set the shape, size and distribution of holes in the adhesive layer, and the contour shape and lateral dimension of the microbump shape produced by the method And the distribution position is completely determined by the shape, size and distribution of the holes, so that the appearance of the textured microbump array on the surface of the metal workpiece can be completely actively designed and actively set;
- FIG. 1 is a schematic view showing the structure of a process for fabricating microbumps on a metal surface according to the present invention.
- FIG. 2 is a schematic diagram of the laser gasification ionization of the present invention to generate a high amplitude shock wave.
- Fig. 3 is a schematic view showing the formation of a transmission wave according to the present invention.
- FIG. 4 is a schematic view showing a process of forming a microbump by a transmission wave acting on a metal surface according to the present invention.
- FIG. 5 is a schematic view showing the shape of a micro-bump on a metal surface according to the present invention.
- FIG. 6 is a schematic view of a dot-like microcavity array on a bonding layer according to the present invention.
- Figure 7 is a top view of a dot-shaped microbump array fabricated on a metal surface according to the present invention.
- Figure 8 is a schematic view of a V-shaped microcavity array on the bonding layer of the present invention.
- Figure 9 is a top view of a V-shaped microbump array fabricated on a metal surface according to the present invention.
- Figure 10 is a schematic view of a well-type microcavity array on a bonding layer according to the present invention.
- Figure 11 is a top view of a well-type microbump array fabricated on a metal surface according to the present invention.
- Figure 12 is a partial hardness distribution curve of a dot-shaped microbump array fabricated on the metal surface of Figure 7.
- the reference numerals are as follows: 1. metal workpiece; 2. bonding layer; 3. hole; 4. absorption layer; 5. transparent constraining layer; 6. laser beam; 7. plasma; 8. high amplitude shock wave; Transmission shockwave; 10. Microbumps.
- a bonding layer 2 is coated on the surface of the metal workpiece 1, a plurality of transparent holes 3 are processed on the surface of the bonding layer 2, and the absorbing layer 4 is attached to the bonding layer 2, and then in the absorbing layer 4. Overlying the transparent constraining layer 5, after surface treatment Metal workpiece.
- the laser beam 6 illuminates the treated metal workpiece, and the laser beam 6 is irradiated to the absorption layer 4 through the transparent constraining layer 5, and the absorption layer 4 absorbs the laser energy to form a high-temperature and high-pressure plasma by gasification and ionization in a very short time.
- the plasma 7 is constrained by the constraining layer 5 to produce a high amplitude shock wave 8.
- the adhesive layer 2 has a plurality of transparent holes 3, that is, the adhesive layer 2 is composed of a bonding material and a cavity 3, the high-amplitude shock wave 8 is transmitted to the absorption layer-bonding layer section.
- the amplitude of the transmitted shock wave at the interface of the absorbent layer-bonding material is approximately equal to
- the amplitude of the transmitted shock wave at the absorption layer-hole interface is approximately equal to
- P 0 is the amplitude of the original shock wave induced by laser
- the impedance of the absorption layer is Z 1
- the impedance of the bonding material is Z 2
- the impedance of the air in the cavity is Z 3 , Z 2 >Z 3 , and thus P 1 >P 2 ;
- the impedance of the bonding material is greater than the impedance of the air in the cavity 3, the amplitude of the high-amplitude shock wave 8 after passing through the bonding layer 2 is spatially modulated to form a transmission shock wave 9 and a shock wave amplitude transmitted into the
- the transmission shock wave 9 having different spatial amplitudes finally acts on the surface of the metal workpiece 1.
- the surface material of the metal workpiece is impacted and extruded out of the pit; Under the influence of the overall force balance, the surface material of the metal workpiece is squeezed and flows into the cavity gap to form a protrusion.
- the micro-bumps 10 formed on the surface of the metal workpiece have a shape, a size, and a topography of the micro-bumps 10 in one-to-one correspondence with the holes 3.
- the laser impact energy source is a 1064nm laser with Nd 3+ :YAG output.
- the pulse width is 10 ns
- the energy is 9 J
- the spot size is 2 mm
- the light intensity distribution in the laser output spot is flat top distribution.
- the laser frequency is 1Hz.
- Water is used as the constraining layer
- aluminum foil is used as the absorbing layer
- black lacquer is used as the bonding material
- the metal workpiece is 1cm thick copper block
- the impedance of the copper block is 3.6852 ⁇ 10 6 g/(cm 2 ⁇ s)
- the impedance of the black lacquer is 0.315.
- the impedance of the aluminum foil was 1.5058 ⁇ 10 6 g / (cm 2 ⁇ s)
- the impedance of air was 43.96 g / (cm 2 ⁇ s).
- a copper block covered with aluminum foil and black lacquer is placed in the water tank, and the height of the copper block submerged below the water surface is adjusted, so that the thickness of the water layer on the surface of the copper block sample is about 2 mm, and the water layer serves as Constraint layer.
- a laser pulse acts on the metal workpiece through the water layer.
- the laser and the aluminum foil interact to vaporize to generate plasma.
- the expansion of the plasma is restrained by the water layer, which will generate a shock wave.
- the shock wave passes through the bonding layer, the impedance of the black lacquer in the bonding layer is different from the air resistance.
- the shock wave is spatially modulated; the amplitude of the shock wave transmitted through the aluminum foil-black lacquer interface, transmitted into the black lacquer, and ultimately on the surface of the copper block Through the aluminum foil-hole interface, the amplitude of the shock wave transmitted into the cavity and finally acting on the surface of the copper block
- P 0 is the amplitude of the original laser-induced shock waves generated by the impedance of the absorbent layer is an aluminum foil
- the aluminum foil is Z
- the impedance Z of the adhesive material black black paint the air cavity impedance Z air, black Z> Z air
- FIG. 7 is a topographical view of the dot-shaped microbump array fabricated on the surface of the copper block.
- the hardness of the material is also significantly improved under the laser shock strengthening, that is, the material is strengthened, as shown by the hardness distribution curve in Fig. 12, before the impact, the original hardness of the metal material is 58 HV, after the impact
- the hardness of the top of the bump can reach 80HV, and the hardness of the material between the two bumps can be nearly 90HV. Therefore, this manufacturing method not only produces a micro-bump topography on the metal surface but also strengthens the metal surface.
- the laser impact energy source is a 1064nm laser with Nd 3+ :YAG output.
- the pulse width is 1 ns
- the energy is 1 J
- the spot size is 1 mm
- the light intensity distribution in the laser output spot is flat top distribution.
- the laser frequency is 1Hz.
- Water as the constraining layer, aluminum foil as the absorption layer, high temperature resistant silica gel as the bonding material, metal workpiece is 1cm thick aluminum block, the impedance of aluminum block is 1.5058 ⁇ 10 6 g/(cm 2 ⁇ s), the impedance of high temperature resistant silica gel
- the resistivity of the aluminum foil was 1.5058 ⁇ 10 6 g / (cm 2 ⁇ s) and the impedance of air was 43.96 g / (cm 2 ⁇ s) of 0.1 ⁇ 10 6 g / (cm 2 ⁇ s).
- a 50 ⁇ m aluminum foil is attached to the surface of the high temperature resistant silicone as an absorption layer, which is covered with aluminum foil and
- the aluminum block of the high temperature resistant silica gel is placed in the water tank, and the height of the aluminum block is submerged below the water surface, so that the thickness of the water layer on the surface of the aluminum block sample is about 1 mm, and the water layer serves as a constraining layer.
- a laser pulse acts on the surface of the aluminum block through the water layer.
- the laser and the aluminum foil interact to vaporize to generate plasma.
- the expansion of the plasma is restrained by the water layer, which will generate a shock wave.
- the shock wave passes through the bonding layer, the impedance and air resistance of the high temperature resistant silicone in the bonding layer are different.
- the shock wave is spatially modulated; the amplitude of the shock wave transmitted through the aluminum foil-high temperature silicone interface, transmitted into the high temperature resistant silica gel, and finally acting on the surface of the aluminum block
- the amplitude of the shock wave transmitted into the cavity and finally acting on the surface of the aluminum block P 0 is the amplitude of the original shock wave induced by laser
- the impedance of the aluminum foil of the absorption layer is Z aluminum foil
- the impedance of the high temperature resistant silica gel of the bonding material is Z high temperature resistant silica gel
- the air impedance of the cavity is Z air
- Z high temperature resistant silica gel > Z air from which P 1 >P 2 is known .
- FIG. 9 is a topographical view of the V-shaped microbump array fabricated on the surface of the aluminum block.
- the hardness of the material is also significantly improved, that is, the material is strengthened, the original hardness of the metal material is 40HV, and the hardness of the top of the bump can reach 48HV after impact, two convex
- the hardness of the material in the middle of the point can be nearly 50 HV. Therefore, this manufacturing method not only produces a micro-bump topography on the metal surface but also strengthens the metal surface.
- the laser impact energy source is 1064nm laser output from Nd 3+ :YAG, the pulse width is 100ns, the energy is 50J, the spot size is 5mm, the light intensity distribution in the laser output spot is flat top distribution, the laser frequency It is 1 Hz.
- Vaseline with a well-shaped microcavity array is a bonding layer.
- a layer of 200 ⁇ m aluminum foil is attached to the Vaseline surface as an absorption layer, which will be covered with aluminum foil and Vaseline.
- a 5 mm colorless transparent glass was placed on the aluminum alloy, and the colorless transparent glass was used as a constraining layer.
- a laser pulse is applied to the surface of the aluminum alloy through the glass.
- the laser and the aluminum foil interact to vaporize to generate plasma.
- the expansion of the plasma is restrained by the glass layer, and a shock wave is generated.
- the aluminum foil absorbing layer and the bonding layer are different in impedance and air resistance of the Vaseline in the bonding layer when the shock wave passes through the bonding layer.
- the shock wave is spatially modulated; through the aluminum foil-Vaseline interface, the amplitude of the shock wave transmitted into the Vaseline and ultimately on the surface of the aluminum alloy Through the aluminum foil-hole interface, the amplitude of the shock wave transmitted into the cavity and finally acting on the surface of the aluminum alloy
- P 0 is the amplitude of the original shock wave induced by the laser
- the impedance of the aluminum foil of the absorbing layer is Z aluminum foil
- the impedance of the bonding material Vaseline is Z Vaseline
- the air impedance of the cavity is Z air
- Z Vaseline > Z air thereby knowing P 1 >P 2 .
- FIG. 11 is a topographical view of the well-type microbump array fabricated on the surface of the aluminum alloy.
- the hardness of the material is also significantly improved, that is, the material is strengthened.
- the original hardness of the metal material is 160 HV.
- the hardness of the top of the bump can reach 200 HV.
- the middle of the two bumps is a material with a hardness of approximately 210 HV. Therefore, this manufacturing method not only produces a micro-bump topography on the metal surface but also strengthens the metal surface.
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Abstract
Description
Claims (8)
- 一种在金属表面制造微凸点的方法,其特征在于,包括S1、在金属工件(1)表面涂覆粘结层(2),在所述粘结层(2)上加工多个通透的空穴(3),在所述粘结层(2)上贴覆吸收层(4),所述吸收层(4)上方覆盖透明约束层(5);S2、根据金属工件(1)的硬度选取激光光束(6),所述激光光束(6)透过透明约束层(5)照射吸收层(4),所述吸收层(4)吸收激光能量,产生等离子体(7),所述等离子体(7)产生高幅冲击波(8),所述高幅冲击波(8)经过所述粘结层(2)形成透射冲击波(9),所述透射冲击波(9)作用于所述金属工件(1)表面,在所述金属工件(1)表面形成与所述空穴的形状、尺寸和形貌对应的微凸点(10)。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述金属工件(1)为铜、铝或铝合金。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述涂覆粘结层(2)的方法为喷涂、刷涂或粘贴。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述粘结层(2)为耐高温硅胶、黑漆、凡士林、纸、双面胶,所述粘结层(2)的厚度为20μm~100μm。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,在所述粘结层(2)上加工空穴(3)的方法为激光刻蚀。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述吸收层(4)为铝箔,所述吸收层(4)的厚度为50μm~200μm。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述透明约束层(5)为无色透明的水或玻璃,所述透明约束层(5)的厚度为1mm~5mm。
- 如权利要求1所述的在金属表面制造微凸点的方法,其特征在于,所述激光光束(6)的脉冲宽度为1ns~100ns,脉冲能量为至少为1J,产生光斑的直径为1mm~5mm。
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- 2015-04-09 CN CN201510167452.3A patent/CN104842068B/zh active Active
- 2015-05-14 WO PCT/CN2015/078916 patent/WO2016161692A1/zh active Application Filing
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CN107931843A (zh) * | 2017-09-30 | 2018-04-20 | 武汉武钢华工激光大型装备有限公司 | 一种聚氨酯张力辊表面高粗糙度激光处理机床 |
CN112692434A (zh) * | 2021-01-08 | 2021-04-23 | 吉林大学 | 纳秒激光辐照制备非晶合金微凹、凸结构的方法 |
CN112692434B (zh) * | 2021-01-08 | 2021-09-28 | 吉林大学 | 纳秒激光辐照制备非晶合金微凹、凸结构的方法 |
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GB2555250B (en) | 2021-10-13 |
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