GB2555250A - Method for forming micro-bump on metal surface - Google Patents
Method for forming micro-bump on metal surface Download PDFInfo
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- GB2555250A GB2555250A GB1717482.2A GB201717482A GB2555250A GB 2555250 A GB2555250 A GB 2555250A GB 201717482 A GB201717482 A GB 201717482A GB 2555250 A GB2555250 A GB 2555250A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 78
- 239000002184 metal Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000035939 shock Effects 0.000 claims abstract description 65
- 238000010521 absorption reaction Methods 0.000 claims abstract description 38
- 229910052782 aluminium Inorganic materials 0.000 claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 43
- 239000011888 foil Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000003973 paint Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 239000000741 silica gel Substances 0.000 claims description 19
- 229910002027 silica gel Inorganic materials 0.000 claims description 19
- 229940099259 vaseline Drugs 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 4
- -1 vaseline Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 10
- 238000012876 topography Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 23
- 238000005728 strengthening Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 241001270131 Agaricus moelleri Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002635 electroconvulsive therapy Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011089 mechanical engineering Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000010056 xuefu Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to the field of laser micro-processing. Provided is a method for forming micro-bumps on a metal surface. The method comprises: sequentially, coating a bonding layer (2) onto a surface of a metal workpiece (1), punching holes on the bonding layer (2), attaching with an absorption layer (4) and covering with a transparent restraint layer (5); via laser radiation, the absorption layer (4) absorbs laser energy and generates plasma (7); the plasma (7) generates high-amplitude shock waves (8); the high-amplitude shock waves (8) pass through the bonding layer (2) and form penetrating shock waves (9); and the shock waves act on the surface of the metal workpiece (1), forming micro-bumps (10) on the surface of the metal workpiece (1) having the corresponding shape, size and distribution to the holes (3). The method is simple, reliably realizes a convex angle of the metal surface, obtains the bumps in any shape, forms a convex topography on the metal surface and strengthens the metal surface.
Description
(56) Documents Cited:
WO 2001/056736 A2 CN 102626826 A JPH01262087
CN 104308361 A (58) Field of Search:
INT CL B23K
Other: Online: CNKI, CNABS, CNTXT, WPI, EPODOC (87) International Publication Data:
WO2016/161692 Zh 13.10.2016 (71) Applicant(s):
Jiangsu University
301 Xuefu Road Zhenjiang, Jiangsu 212013, China (72) Inventor(s):
Yunxia Ye Ting Xuan Hui Zou Feng Wang Xijun Hua Jianzhong Zhou Yonghong Fu (74) Agent and/or Address for Service:
Forresters IP LLP
Sherborne House, 119-121 Cannon Street, LONDON, EC4N 5AT, United Kingdom (54) Title of the Invention: Method for forming micro-bump on metal surface Abstract Title: Method for forming micro-bump on metal surface (57) The present invention relates to the field of laser micro-processing. Provided is a method for forming micro-bumps on a metal surface. The method comprises: sequentially, coating a bonding layer (2) onto a surface of a metal workpiece (1), punching holes on the bonding layer (2), attaching with an absorption layer (4) and covering with a transparent restraint layer (5); via laser radiation, the absorption layer (4) absorbs laser energy and generates plasma (7); the plasma (7) generates high-amplitude shock waves (8); the high-amplitude shock waves (8) pass through the bonding layer (2) and form penetrating shock waves (9); and the shock waves act on the surface of the metal workpiece (1), forming micro-bumps (10) on the surface of the metal workpiece (1) having the corresponding shape, size and distribution to the holes (3). The method is simple, reliably realizes a convex angle of the metal surface, obtains the bumps in any shape, forms a convex topography on the metal surface and strengthens the metal surface.
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This international application has entered the national phase early.
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Fig. 9
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Fig. 12
Specifications
METHOD FOR FORMING MICRO-BUMP ON METAL SURFACE
Technical field
The invention relates to the field of laser micro processing, more specially, it relates to a method for manufacturing micro bumps on the metal surface.
Background technique
Metal surfaces with micro bumps are widely used in industry. For example, fabricating micro bumps on the roller surface, not only can improve the service life of the roller, but also can produce micro dimples on the formed metal sheet, improving the formability of these metal sheet, surface image clarity and coatability properties etc.Through fabricating micro bumps on the moulds and dies, it is helpful to improve the formability performance of the metal sheet, enhance its flow evenness and obtain metal parts with higher quality. At present, there are some methods to fabricate the micro bumps on the metal surface: mechanical method, chemical etching, electro discharge texturing etc. The above methods have a common shortcoming: the arrangments of the obtained micro bumps are random, unable to be actively designed and controlled. In recent years, with the development of laser technology, laser texturing technology, which can realize the active design and manufacturing of the surface topography, has developed rapidly.To realize laser texturing technology,high energy laser (104-106W/cm2) pulse is irradiated on the metal surface, forming a plurality of micro molten pools. Then under the recoil pressure induced by the assistant gas pressure or the gasified materialfrom the molten pools, the melted material in the molten pool can accumulate to the edge of the pool according to the specified requirements,forming some convex points. Ultimately the metal surface with the convex micro bumps is formed.
The advantage of laser texturing is that the micro convex shape can be controlled on the metal surface according to the tribology designing results.However, in order to garantee the formation of micro bump morphology, the pressure and blowing angle of the assistant gas must be carefully chosen, or some key laser parameters, e.g. laser pulse width , must be carefully chosen.Therefore, the traditional laser texturing process has certain process complexity and uncertainty for forming the designed micro bumps on the metal surface. On the other hand, during the traditional laser texturing technology, the laser beam usually is circular. Accordingly, the micro bumps manufactured always are circular. It is difficult to obtain bumps with other profiles, such as square,
Specifications
V-shape, annular and so on. Therefore, in this sense, the traditional laser texturing process can not achieve the tribology optimization design and manufacturing . Additionally, traditional laser texturing technology can only make surface textures on the metal surface, but can not strengthen the entire surface. On the other hand, laser shock strengthening technology can only strengthen the metal surface, without the ability to fabricate surface texture.
CN201410439453.4 patent discloses a device and a method for fabricating the conex point on the metal surface through laser induced shock wave, while it can not achieve the micro bumps with the desired profiles, sizes and arrangements.
The research report from Chinese Journal of Mechanical Engineering(Experimental in investigation of laser texture on roller with micro convex topography, 2003,39 (7) : 107-110)discloses a method to fabricate surface texture on the roller surface through controlling the laser parameters. But it needs to control the external assistant gas. So this method has certain process complexity and uncertainty.
The research report from Chinese mechanical engineering(Study on tribological performances of laser textured surfaces,2011,22(19) :2269-2274) also discloses the method to fabricate the micro bumps on the metal surface through laser surface texture and conduct the triboloty experiments. In the report, during laser texturing, assistant gas must be used and it can only obtained spherical cap-like bumps.
Contents of the invention
In view of the defects in the prior art, the invention provides a method for manufacturing micro bumps on the metal surface.Furthermore, the method provided by this invention can realize manufacturing the convexed surface and strengthening the metal surface simultaneously.
The present invention realize the purpose through the following technique.
A method for manufacturing micro bumps on the metal surface,which is characterized by
SL· The bonding layer (2) is coated on the surface of the metal workpiece (1). Through holes are drilled on the said bonding layer(2). The absorption layer(4) is adhereing to the said bonding layer and then the transparent confinement layer(5) is covered on the absorption layer (4).
S2, Laser beam is chosen according to the metal strength. The said laser beam (6) irradiates on the absorption layer (4) through a transparent confinement layer (5). The absorption layer (4) absorbs laser energy, producing a plasma (7). The plasma (7) generates a high amplitude shock wave (8), The high amplitude shock wave (8) transmits through the bonding layer forming a
Specifications transmitted shock wave (9) . The transmitted shock wave (9) impacts on the surface of the metal workpiece(l). Micro bumps with the profiles, sizes and arrangments coincident with those of the holes on the bonding layer(2), are formed on the surface of the metal workpiece(l).
In the above scheme, the metal workpiece is copper, aluminum or aluminum alloy.
In the above scheme, the bonding layer (2) is sprayed, brushed or pasted on the metal surface.
In the above scheme, the bonding layer (2) can be silica gel with the ability to resist high temperature, black paint, vaseline, paper, or double sided adhesive tape. The thickness of the bonding layer (2) is 20 pm~100 pm.
In the above scheme, the method for drilling holes (3) on the bonding layer (2) can be realized by laser drilling.
In the above scheme, the absorption layer (4) is an aluminum foil, and the thickness of the absorption layer (4) is 50 pm~200 pm.
In the above scheme, the transparent confinment layer (5) is colorless transparent water or glass, and the thickness of the transparent confinement layer (5) is 1 mm~5 mm.
In the above scheme, the laser beam (6) has a pulse width of 1 ns~100 ns and a pulse energy of at least 1 J. The diameter of laser beam on the metal surface is 1 mm~5 mm.
The beneficial effects of the invention:
(1) The method of making micro bumps on the metal surface does not need additional assistant gas, nor needs to carefully control the laser pulse width. The principle is easy to understand and very practicle.
(2/Through the method provided by this invention, the micro bumps on the metal surface can easily to be controlled, because the profiles, sizes and arrangements of the micro bumps mainly depend on those of the holes on the bonding layers. So the micro bumps produced with the method of this invention can be actively designed and controlled.
(3 ) This invention relates to a method for manufacturing micro bumps on the surface of the metal. When forming micro bumps on the metal surface, simultaneously, the metal surface material is strengthened as the result of laser shock. Finally, the comprehensive mechanical performance of metal surface can be improved.
Description of Figures
Fig, 1 is a schematic diagram of the process for manufacturing micro bumps on the metal
Specifications surface.
Fig. 2 is a schematic diagramof shock wave induced by laser vaporization and ionization
Fig. 3 is a schematic diagram of a transmitted wave described in the present invention.
Fig. 4 is a schematic diagram of forming convex micro bumps by the transmitted wave
Fig. 5 is a schematic diagram of the surface micro bumps of the present invention.
Fig. 6 is the picture of the circular holes on the bonding layer
Figure 7 is circular micro bumps formed on the metal surface through the method of this invention
Fig. 8 is is the picture of the V-shape holes on the bonding layer
Figure 9 is V-shape micro bumps formed on the metal surface through the method of this invention
Fig. 10 is is the picture of the #-shape holes on the bonding layer
Figure. 11 is #-shape micro bumps formed on the metal surface through the method of this invention
Fig. 12 is a point hardness distribution around the circular micro bump in Fig. 7.
1. metal workpiece; 2. bonding layer; 3. hole; 4. absorption layer; 5. transparent confinement layer; 6. laser beam; 7. plasma; 8. high amplitude shockwave; 9.transmitted shockwave; 10. micro bumps.
Detailed description of the Invention
The present invention is described detailedly now. But the present invention is not limited to this.
In Figure 1, The bonding layer (2) is coated on the surface of the metal workpiece (1). Through holes are drilled on the said bonding layer(2). The absorption layer(4) is adhereing to the said bonding layer and then the transparent confinement layer(5) is covered on the absorption layer (4).
In Figure 2, Laser beam is chosen according to the metal strength. The said laser beam (6) irradiates on the absorption layer (4) through a transparent confinement layer (5). The absorption layer (4) absorbs laser energy, producing a plasma (7). The plasma (7) generates a high amplitude shock wave (8).
As shown in Fig. 3, on the the bonding layer(2), there are a plurality of through holes (3), i.e, the bonding layer (2) is composed of adhesive material and through holes(air). Because the bonding layer material and the air have the different acoustic impedance, when the high amplitude shock
Specifications wave transmit through the absorption layer Reaching the interface of absorption layer and bonding layer, the shock wave will be modulated. The transmission shock amplitude at interface of
2Z absorption layer and bonding material, is = --—, while at the interface of absorption
Z2 +ZX
2Z layer and air hole, the amplitude is P2 = Po--—. Po is the original shock wave amplitude
Z. -1- Z| induced by laser, the absorption layer impedance is Zi, the adhesive material impedance is Z2 and the air hole impedance is Z3. Z2> Z3, thus Pi>P2. So the modulated transmitted wave (9) is formed. The shock wave amplitude at the location of air hole is much smaller than that at the location of bonding material. The amplitude distribution of the shock wave(8) is shown in Figure 3 (b), and the amplitude of the modulated transmitted shock wav is shown in Figure 3 (c)
As shown in Fig. 4, the transmitted shock wave 9 with different spatial amplitudes ultimately acts on the surface of the metal workpiece 1. Under the higher amplitude , the surface of metal workpiece material is extruded out to form dent. Because of the overall force balance, the extruded surface material flows into the air hole and form the convex point.
As shown in Figure 5, the profiles, sizes and arrangements of the micro bumps 10 are coincident with those of the air holes on the bonding layers.
Example 1
Nd :YAG is applied, the wavelength of which is 1064nm. The laser pulse width is 10ns, laser energy is 9J,and the laser spot size is 2 mm. The laser intensity distribution is flat-top and the laser pulse frequency is 1Hz.
Water is chosen as the transparent confinment layer, aluminum foil as the absorption layer, and black paint as bonding layer materials. Then work piece is the copper block of 1cm thickness.The acoustic impedance of copper, black paint, aluminum and air are respectively 3.6852><106g/(cm2s), 0.315><106g/ (cm2 · s) , 1.5058><106g/ (cm2 · s)and43.96g/ (cm2 · s) .
Firstly, black paint is sprayed on the surface of copper block, and the thickness of copper block and black paint are respectively 1cm and 50 pm respectively. After the black paint is completely dried, laser marking machine is used to fabricate micro hole array on the black paint, as shown in Figure 6.The single pulse energy of the laser marker must be carefully chosen to ensure that the surface of the copper block will not be ablated. The diameter of the hole in the black paint is about 80 pm. This layer of black paint with through holes act as the bonding layer. A layer of 100 pm
Specifications aluminum foil was applied on the black paint as an absorption layer. Then place the copper covered with aluminum foil and black paint in the water sink. The distance between the work piece surface and water surface is about 2mm through adjusting the position of the copper block. The water layer serves as a transparent confinment layer.
Turn on the laser and set it as described above. A laser pulse impacts on the metal workpiece through the water layer.First, the laser interacts with aluminum foil to produce plasma. Then the expansion of the plasma is constrained by the water layer and produces a shock wave, which passes through the aluminum foil absorption layer, and the bonding layer. When the shock wave passes through the bonding layer, due to the different impedance of the air and the bonding layer of black paint,the shock wave is modulated. More specific, when the shock wave transmits through the aluminum foil-black paint interface into the black paint layer, and finally impacts on the surface of copper blocks,the shock wave amplitude on the copper surface is
R =pn-blackpaml-= 0 346// · When the shock wave transmits through the aluminum foil 7 +7 black paint aluminum foil air interface into the air hole, and finally impacts on the surface of copper blocks,the shock wave
2Z amplitude is // = Po-32-« 0 , Po is the amplitude original laser-induced shock wave. The
Til r 4 ^aluminum foil impedance of the absorption layer aluminum foil ,the bonding layer black paint, and the air in the hole are respectively Zaiuminum foil, ZWack paint andZair. Zbiack paint > Z air, thus Pi>P2.This makes the intensity distribution of the shock wave acting on the copper surface uneven. The shock wave amplitude at the hole position is almost zero, while the shock wave at the black paint position is strong.Therefore, at the location of the black paint, the metal material is impacted and extruded to form a pit. At the hole position, under the overall force balance, the material is squeezed into the cavity and finally convex bumps form on the surface of the copper block.The transverse size and the profile shape of the bump depend on those of the air holes on the bonding layer. Fig. 7 gives the circular bump array on the surface of the copper block.
Between bumps, because of the effect of laser shock strengthening, the hardness of the material is significantly improved. As shown in Fig. 12, before the impact, the original hardness of metallic materials is 58 HV. After the laser shock treatment ,the hardness of the bump top reach up to 80 HV. The hardness between two convex points, the hardness of the material can reach nearly 90
HV. Therefore, the method provided by this invention can realize manufacturing the convexed
Specifications surface and strengthening the metal surface simultaneously.
Example 2
Nd :YAG is applied, the wavelength of which is 1064nm. The laser pulse width is Ins, laser energy is 1 J,and the laser spot size is 1 mm. The laser intensity distribution is flat-top and the laser pulse frequency is 1Hz.
Water is chosen as the transparent confinment layer, aluminum foil as the absorption layer, and high heat-resistant silica gel as bonding layer materials. The work piece is the aluminum block of lcm thickness.The acoustic impedance of aluminum, high heat-resistant silica gel, and air are respectively 1.5058xl06g/ (cm2 s) , 0.1xl06g/ (cm2 · s) ,and43.96g/ (cm2 · s) .
Firstly, high heat-resistant silica gel is sprayed on the surface of aluminum block, and the thickness of aluminum block and high heat-resistant silica gel are respectively lcm and 20 pm respectively. After the high heat-resistant silica gel is completely dried, laser marking machine is used to fabricate V-shape micro hole array on the high heat-resistant silica gel, as shown in Figure
8.The single pulse energy of the laser marker must be carefully chosen to ensure that the surface of the aluminum block will not be ablated. This layer of high heat-resistant silica gel with V-shape micro cavities act as the bonding layer. A layer of 50 pm aluminum foil was applied on the high heat-resistant silica gel as an absorption layer. Then place the aluminum pieces covered with aluminum foil and high heat-resistant silica gel in the water sink. The distance between work piece surface and water surface is about 1mm through adjusting the position of the aluminum block. The water layer serves as a transparent confinment layer.
Turn on the laser and set it as described above. A laser pulse impacts on the metal workpiece through the water layer.First, the laser interacts with aluminum foil to produce plasma. Then the expansion of the plasma is constrained by the water layer and produces a shock wave, which passes through the aluminum foil absorption layer, and the bonding layer. When the shock wave passes through the bonding layer, due to the different impedance of the air and the bonding layer of high heat-resistant silica gel,the shock wave is modulated. When the shock wave transmits through the aluminum foil-high heat-resistant silica gel interface into the high heat-resistant silica gel material, and finally impacts on the surface of aluminum blocks,the shock wave amplitude is .
p = p-high heat-resistant sihca gei-= 0 12573 · When the shock wave transmits through the + 7 high heat-resistant silica gel aluminumfoil aluminum foil - air interface into the air cavity, and finally impacts on the surface of aluminum
Specifications blocks,the shock wave amplitude is P2 = Po-22-« 0 . Po is the amplitude original ^air F ^aluminum foil laser-induced shock wave. The impedance of the absorption layer aluminum foil ,the bonding layer high heat-resistant silica gel, and the air in the cavity are respectively Zaiuminumfoii, Zhigh heat-resistant silica gei andZair. Z high heat-resistant silica gel > Z air, thus Pi>P2.This makes the intensity distribution of the shock wave acting on the aluminum surface uneven. The shock wave amplitude at the cavity position is almost zero, while the shock wave at the high heat-resistant silica gel position is strong.Therefore, at the location of the high heat-resistant silica gel, the metal material is impacted and extruded to form a pit. At the hole position, under the overall force balance, the material is squeezed into the cavity and finally convex bumps form on the surface of the aluminum block.The transverse size and the profile shape of the bump depend on those of the air holes on the bonding layer. Fig. 9 gives the V-shape bump array on the surface of the aluminum block.
Between bumps, because of the effect of laser shock strengthening, the hardness of the material is significantly improved. Before the impact,the original hardness of metallic materials is 40 HV. After the laser shock treatment ,the hardness of the bump top reach up to 48 HV. The hardness between two convex points, the hardness of the material can reach nearly 50 HV. Therefore, the method provided by this invention can realize manufacturing the convexed surface and strengthening the metal surface simultaneously.
Example 3 b
Nd :YAG is applied, the wavelength of which is 1064nm. The laser pulse width is 100ns, laser energy is 50J,and the laser spot size is 5 mm. The laser intensity distribution is flat-top and the laser pulse frequency is 1Hz.
Glass is chosen as the transparent confinment layer, aluminum foil as the absorption layer, and vaseline as bonding layer materials. Then work piece is the aluminum alloy block of 1cm thickness.The acoustic impedance of aluminum alloy, vaseline, aluminum and air are respectively 1.71><106g/ (cm2-s) , 0.3><106g/ (cm2 · s) , 1.5058xl06g/ (cm2 · s)and43.96g/ (cm2 · s) .
Firstly, vaseline is sprayed on the surface of aluminum alloy block, and the thickness of aluminum alloy block and vaseline are respectively 1cm and 100 pm respectively.Then laser marking machine is used to fabricate #-shape micro cavity array on the vaseline, as shown in Figure
10. The single pulse energy of the laser marker must be carefully chosen to ensure that the surface of the aluminum alloy block will not be ablated. This layer of vaseline with #-shape micro cavities act
Specifications as the bonding layer. A layer of 200 pm aluminum foil was applied on the vaseline as an absorption layer. 5 mm colorless transparent glass is placed on the surface of aluminum alloy covered with aluminum foil and vaseline. The colorless transparent glass is used as the transparent confinement layer.
Turn on the laser and set it as described above. A laser pulse impacts on the metal workpiece through the glass layer.First, the laser interacts with aluminum foil to produce plasma. Then the expansion of the plasma is constrained by the glass layer and produces a shock wave, which passes through the aluminum foil absorption layer, and the bonding layer. When the shock wave passes through the bonding layer, due to the different impedance of the air and the bonding layer of vaseline,the shock wave is modulated. When the shock wave transmits through the aluminum foil-vaseline interface into the vaseline material, and finally impacts on the surface of aluminum alloy blocks,the shock wave amplitude is P.=Pn-vasdl,K-= 0 332/2· When the shock υ 7 7 vaseline aluminumfoil wave through the aluminum foil - hole interface into the air cavity, and finally impacts on the surface of aluminum alloy blocks,the shock wave amplitude isP2 = Po-32-» 0 , Po is the
Z;nr 3” ^aluminum foil amplitude original laser-induced shock wave. The impedance of the absorption layer aluminum foil ,the bonding layer aluminum alloy, and the air in the hole are respectively Zaiuminumfoii, ZVaseime andZair. Z vaseline > Z air, thus Pi>P2.This makes the intensity distribution of the shock wave acting on the aluminum alloy surface uneven. The shock wave amplitude at the hole position is almost zero, while the shock wave at the vaseline position is strong. Therefore, at the location of the vaseline, the metal material is impacted and extruded to form a pit. At the hole position, under the overall force balance, the material is squeezed into the cavity and finally convex bumps form on the surface of the aluminum alloy block. The transverse size and the profile shape of the bump depend on those of the air holes on the bonding layer. Fig. 11 gives the #-shape micro bump array on the surface of the aluminum alloy block.
Between bumps, because of the effect of laser shock strengthening, the hardness of the material is significantly improved. ,Before the impact, the original hardness of metallic materials is 160HV. After the laser shock treatment ,the hardness of the bump top reach up to 200 HV. The hardness between two convex points, the hardness of the material can reach nearly 210 HV. Therefore, the method provided by this invention can realize manufacturing the convexed surface
Specifications and strengthening the metal surface simultaneously.
Examples described above is the preferred examples of the invention , but the invention is not limited to the above examples.If the substance of the method applied by the technician does not deviate from the esscential of this invention belongs to the scope of this invention.
Claims (8)
1. A method for manufacturing micro bumps on the metal surface, which is characterized by
Sl> The bonding layer (2) is coated on the surface of the metal workpiece (1), Through holes are drilled on the said bonding layer(2), The absorption layer(4) is adhereing to the said bonding layer and then the transparent confinement layer(5) is covered on the absorption layer (4);
S2, Laser beam is chosen according to the metal strength, The said laser beam (6) irradiates on the absorption layer (4) through a transparent confinement layer (5), The absorption layer (4) absorbs laser energy, producing a plasma (7), The plasma (7) generates a high amplitude shock wave (8), The high amplitude shock wave (8) transmits through the bonding layer forming a transmitted shock wave (9) , The transmitted shock wave (9) impacts on the surface of the metal workpiece(l), Micro bumps with the profiles, sizes and arrangments coincident with those of the holes on the bonding layer(2), are formed on the surface of the metal workpiece(l).
2. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the metal workpiece is copper, aluminum or aluminum alloy.
3. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the bonding layer (2) is sprayed, brushed or pasted on the metal surface.
4. The method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the bonding layer (2) can be silica gel with the ability to resist high temperature, black paint, vaseline, paper, or double sided adhesive tape, The thickness of the bonding layer (2) is 20 pm~100 pm.
5. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the method for drilling holes (3) on the bonding layer (2) can be realized by laser drilling.
6. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the absorption layer (4) is an aluminum foil, and the thickness of the absorption layer (4) is 50 pm~200 pm.
7. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the transparent confinment layer (5) is colorless transparent water or glass, and the thickness of the transparent confinement layer (5) is 1 mm~5 mm.
8. A method for manufacturing micro bumps on the metal surface as described in claim 1, is characterized that the laser beam (6) has a pulse width of 1 ns~100 ns and a pulse energy of at least 1 J, The diameter of laser beam on the metal surface is 1 mm~5 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510167452.3A CN104842068B (en) | 2015-04-09 | 2015-04-09 | A kind of method manufacturing micro convex point in metal surface |
| PCT/CN2015/078916 WO2016161692A1 (en) | 2015-04-09 | 2015-05-14 | Method for forming micro-bump on metal surface |
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| CN106023791A (en) * | 2016-07-11 | 2016-10-12 | 东阿阿胶股份有限公司 | Laser marking structure on surface of metal box |
| CN107931843A (en) * | 2017-09-30 | 2018-04-20 | 武汉武钢华工激光大型装备有限公司 | A kind of high roughness laser treatment lathe in Polyurethane Tension Roll surface |
| CN108660308A (en) * | 2018-04-19 | 2018-10-16 | 江苏大学 | A method of laser peening is carried out to air cylinder sleeve of engine-piston ring |
| JP2021000803A (en) * | 2019-06-24 | 2021-01-07 | 東芝テック株式会社 | Liquid discharge head, liquid discharge head manufacturing method and liquid discharge device |
| CN110732780B (en) * | 2019-09-30 | 2021-10-12 | 江苏大学 | Manufacturing method of high-efficiency microtexture based on laser shock wave coupling effect |
| CN112692434B (en) * | 2021-01-08 | 2021-09-28 | 吉林大学 | Method for preparing amorphous alloy micro concave and convex structure by nanosecond laser irradiation |
| CN112958917A (en) * | 2021-02-05 | 2021-06-15 | 中国航发中传机械有限公司 | Laser impact marking method for metal components |
| CN113118631B (en) * | 2021-03-17 | 2023-01-17 | 江苏大学 | Method for removing thick coating and modifying surface of matrix based on laser shock |
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| JPH01262087A (en) * | 1988-04-13 | 1989-10-18 | Fujitsu Ltd | Laser machining method for silicon nitride ceramics |
| WO2001056736A2 (en) * | 2000-02-04 | 2001-08-09 | Optomec Design Company | Laser assisted direct material deposition with modified absorption |
| CN102626826A (en) * | 2012-04-26 | 2012-08-08 | 江苏大学 | High efficiency apparatus and method based on laser shock wave for manufacturing micro grooves |
| CN104308361A (en) * | 2014-09-01 | 2015-01-28 | 江苏大学 | Laser shock device and laser shock method for manufacturing morphology of surface micro-protrusions |
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| CN1986387A (en) * | 2006-09-15 | 2007-06-27 | 江苏大学 | Laser loaded 3D micron and nano size forming process and equipment |
| JP4478184B2 (en) * | 2008-01-17 | 2010-06-09 | 株式会社レーザーシステム | Laser cleaving method and laser processing apparatus |
| CN102626828A (en) * | 2012-04-26 | 2012-08-08 | 江苏大学 | Method and device for producing micro micro pits with high efficiency based on laser shock waves |
| CN102962656B (en) * | 2012-11-09 | 2015-04-22 | 江苏大学 | Compound model processing method and device for cutter |
| CN103331105B (en) * | 2013-07-19 | 2015-08-26 | 江苏大学 | A kind of metal porous membrane preparation method based on laser blast wave effect and device |
| CN104044017B (en) * | 2014-06-06 | 2016-07-13 | 江苏大学 | A kind of finishing method based on laser blast wave |
| CN104175001B (en) * | 2014-08-26 | 2016-04-27 | 江苏大学 | A kind of micro-pit array manufacturing installation of laser and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH01262087A (en) * | 1988-04-13 | 1989-10-18 | Fujitsu Ltd | Laser machining method for silicon nitride ceramics |
| WO2001056736A2 (en) * | 2000-02-04 | 2001-08-09 | Optomec Design Company | Laser assisted direct material deposition with modified absorption |
| CN102626826A (en) * | 2012-04-26 | 2012-08-08 | 江苏大学 | High efficiency apparatus and method based on laser shock wave for manufacturing micro grooves |
| CN104308361A (en) * | 2014-09-01 | 2015-01-28 | 江苏大学 | Laser shock device and laser shock method for manufacturing morphology of surface micro-protrusions |
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| WO2016161692A1 (en) | 2016-10-13 |
| CN104842068A (en) | 2015-08-19 |
| CN104842068B (en) | 2016-08-24 |
| GB2555250B (en) | 2021-10-13 |
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