WO2016158917A1 - Procédé de fabrication d'une plaque à buses de tête d'éjection de liquide, plaque à buses de tête d'éjection de liquide, et tête d'éjection de liquide - Google Patents

Procédé de fabrication d'une plaque à buses de tête d'éjection de liquide, plaque à buses de tête d'éjection de liquide, et tête d'éjection de liquide Download PDF

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Publication number
WO2016158917A1
WO2016158917A1 PCT/JP2016/060046 JP2016060046W WO2016158917A1 WO 2016158917 A1 WO2016158917 A1 WO 2016158917A1 JP 2016060046 W JP2016060046 W JP 2016060046W WO 2016158917 A1 WO2016158917 A1 WO 2016158917A1
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WO
WIPO (PCT)
Prior art keywords
nozzle plate
diameter portion
layer
liquid discharge
discharge head
Prior art date
Application number
PCT/JP2016/060046
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English (en)
Japanese (ja)
Inventor
洋明 香西
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コニカミノルタ株式会社
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Priority to JP2017510006A priority Critical patent/JPWO2016158917A1/ja
Publication of WO2016158917A1 publication Critical patent/WO2016158917A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles

Definitions

  • the present invention relates to a method for manufacturing a nozzle plate for a liquid discharge head, a nozzle plate for a liquid discharge head, and a liquid discharge head.
  • inkjet printers are required to print at high speed and high resolution.
  • a method for manufacturing the components of the ink jet recording head used in this printer there is a method using a semiconductor process for a silicon substrate or the like, which is a fine processing technique in the micromachine field.
  • a nozzle plate As one of the components of such an ink jet recording head, there is a nozzle plate, and a nozzle hole for discharging droplets (a through hole having one discharge opening as an opening) is formed by etching a silicon substrate. It is known to be a thing.
  • an anisotropic etching method is known in which etching and sidewall protective film formation (deposition) are alternately switched. Yes.
  • the Bosch process is known as a technique for forming deep grooves in silicon by such an anisotropic etching method.
  • holes are formed by performing etching by repeating an etching step and a deposition step. It is known that the side wall of the formed hole has a corrugated shape as seen on the surface of a scallop shell called scallop.
  • a method of manufacturing a nozzle plate by the Bosch process for example, a method of forming nozzle holes using an ICP (Inductively Coupled Plasma) type RIE (Reactive Ion Etching) apparatus is known (see Patent Document 1).
  • ICP Inductively Coupled Plasma
  • RIE Reactive Ion Etching
  • a method for manufacturing a nozzle plate for a liquid discharge head wherein a nozzle hole having a small diameter portion opened on one surface and a large diameter portion communicating with the small diameter portion and larger than the small diameter portion opened on the other surface is provided.
  • a nozzle hole having a small diameter portion opened on one surface and a large diameter portion communicating with the small diameter portion and larger than the small diameter portion opened on the other surface is provided.
  • D and the diameter R of the opening of the etching mask pattern for forming the small diameter portion by optimizing the etching processing conditions so that “D ⁇ 0.1 ⁇ R”,
  • a manufacturing method of a nozzle plate is disclosed in which the opening shape of the discharge port of the nozzle hole can be formed faithfully to the etching mask pattern (see Patent Document 2).
  • the scallop width is narrowed to achieve high precision. Etching is performed.
  • the large-diameter portion of the nozzle hole is manufactured with a higher scallop width and higher etching rate because the required accuracy is lower than that of the smaller-diameter portion and the processing area is wide.
  • the inventors have found that when a large diameter portion with a wide scallop width is formed on the nozzle plate by a nozzle plate manufacturing method using a conventional Bosch process, missing nozzles and injection blur are likely to occur. . This is because a wide scallop is likely to become small due to the trapping of fine bubbles, so that when the enlarged bubbles flow, it is difficult for the bubbles to escape from the nozzle holes, and there is no missing nozzle or injection blurring. This is probably because of the cause.
  • the present invention has been made in view of the above problems, and the object of the present invention is to optimize the scallop width of the large-diameter portion, thereby obtaining a stable injection performance with high processing accuracy, and a nozzle. It is to provide a method for manufacturing a nozzle plate for a liquid discharge head, a liquid discharge head nozzle plate, and a liquid discharge head.
  • the invention according to claim 2 is the method of manufacturing a nozzle plate for a liquid discharge head according to claim 1, When the middle layer between the top layer and the bottom layer, Forming the middle layer with an average scallop width Wm; The following formula (2) is satisfied.
  • the anisotropic etching method is performed using a Bosch process.
  • the Si substrate includes a bonding layer made of a SiO 2 layer having a low etching rate between two Si layers.
  • Claim 5 is the manufacturing method of the nozzle plate for liquid discharge heads as described in any one of Claim 1- Claim 4.
  • a liquid repellent layer is formed on the surface where the small diameter portion opens.
  • a sixth aspect of the present invention is the method of manufacturing a nozzle plate for a liquid discharge head according to the fifth aspect,
  • the thickness of the liquid repellent layer is in the range of 0.1 to 3.0 ⁇ m.
  • the invention described in claim 7 An anisotropic etching method that alternately repeats etching and formation of the sidewall protective film on the Si substrate, and opens from the communication port communicating with the small-diameter portion to the other surface through the small-diameter portion that opens to one surface,
  • a nozzle plate for a liquid ejection head that has a nozzle hole having a larger diameter part than a smaller diameter part,
  • the invention according to claim 8 is the nozzle plate for a liquid discharge head according to claim 7,
  • the average scallop width Wm of the middle layer satisfies the following formula (2).
  • the invention according to claim 9 is the nozzle plate for a liquid discharge head according to claim 7 or claim 8, A liquid repellent layer is provided on the surface where the small diameter portion opens.
  • the thickness of the liquid repellent layer is in the range of 0.1 to 3.0 ⁇ m.
  • a liquid discharge head comprising a head chip having the nozzle plate for a liquid discharge head according to any one of claims 7 to 10.
  • a method of manufacturing a nozzle plate for a liquid discharge head, a nozzle plate for a liquid discharge head, and a liquid discharge head which have high nozzle bubble removal properties and stable ejection performance.
  • An ink jet head 1 as a liquid discharge head includes a head chip 2, a holding plate 3, a connection member 4, an ink flow path member 5, and the like (see FIG. 1 and the like).
  • the head chip 2 is configured by stacking and integrating three substrates of a nozzle plate 21, an intermediate plate 22, and a body plate 23 in order from the lower side.
  • the nozzle plate 21 is provided with nozzle holes 211 for ejecting ink.
  • the intermediate plate 22 is provided with a communication hole 221 that becomes an ink flow path when ink is ejected.
  • the body plate 23 includes a pressure chamber 231 filled with ink.
  • the pressure chamber 231 includes an ink common channel 232 that is used for supplying or discharging ink, and ink passage ports 236 that open to the upper surface of the body plate 23 at both ends of the ink common channel 232.
  • a piezoelectric element 234 as a pressure generating means is provided on the upper surface of the body plate 23, and the ink filled in the pressure chamber 231 inside the head chip 2 is pressurized by the displacement of the piezoelectric element 234, Ink droplets are ejected from the nozzle holes 211.
  • the holding plate 3 is bonded to the upper surface of the head chip 2 using an adhesive in order to maintain the strength of the head chip 2.
  • the holding plate 3 has an opening 31 at the center, and the piezoelectric element 234 on the upper surface of the body plate 23 is configured to be stored inside the opening 31. Further, in the vicinity of both end portions in the left-right direction of the holding plate 3, through holes 32 and 32 that communicate the ink passage port 236 and the ink flow path member 5 are formed.
  • the through holes 32 and 32 are used as ink flow paths that communicate between the ink flow path members 5 and 5 and the head chip 2, respectively.
  • the connecting member 4 is a wiring member made of, for example, FPC, and the width direction of the connecting member 4 is bonded to the vicinity of the rear side of the upper surface of the holding plate 3 along the left-right direction of the holding plate 3 and is provided at the center of the holding plate 3.
  • the piezoelectric element 234 is electrically connected through the opening 31.
  • the connection member 4 is connected to a drive unit (not shown), and power can be supplied from the drive unit to the piezoelectric element 234 through the connection member 4.
  • One ink flow path member 5 is joined to each of both end portions of the upper surface of the holding plate 3 in the left-right direction, and an ink flow path port 51 for supplying and discharging ink is provided on the upper surface of the ink flow path member 5. .
  • One of the two ink flow path members 5 may be used for supplying ink, the other may be used for discharging ink, and both may be used for supplying ink.
  • the head chip 2 will be described in detail.
  • the head chip 2 is configured by laminating and integrating three substrates of a nozzle plate 21, an intermediate plate 22, and a body plate 23 in order from the lower side (FIG. 2).
  • the nozzle plate 21 is made of, for example, a Si substrate having a thickness of about 100 to 300 ⁇ m, and the nozzle plate has a nozzle hole 211 penetrating in the vertical direction for ejecting droplets of ink or the like.
  • the nozzle hole 211 is formed by a small-diameter portion 212 that opens on one surface, and a large-diameter portion 213 that communicates with the small-diameter portion 212 and opens on the other surface and is larger than the small-diameter portion 212.
  • the intermediate plate 22 is made of, for example, a glass substrate of about 100 to 300 ⁇ m, and penetrates the intermediate plate 22 at a position corresponding to the large-diameter portion 213 of the nozzle plate 21 so as to serve as an ink flow path when ink is ejected. Is formed.
  • the communication hole 221 adjusts the shape of the ink flow path, such as a shape that narrows the diameter of the path through which the ink passes, and adjusts the kinetic energy applied to the ink during ink ejection.
  • borosilicate glass for example, Tempax glass
  • the body plate 23 is made of, for example, a Si substrate of about 100 to 300 ⁇ m, and includes a pressure chamber 231 that communicates with the communication hole 221 of the intermediate plate 22, an inlet 233 that individually supplies ink to the pressure chamber 231, and the body plate 23.
  • An ink common channel 232 that supplies ink to each of the plurality of inlets 233 provided is formed.
  • a vibration plate 235 that is thin and has a thickness of about 20 to 30 ⁇ m and is elastically deformable is formed.
  • the vibration plate 235 vibrates in accordance with the operation of the piezoelectric element 234 provided on the upper surface of the vibration plate 235, and pressure can be applied to the ink in the pressure chamber 231.
  • the nozzle plate 21 in the present invention will be described in detail.
  • the nozzle plate 21 is formed by an anisotropic etching method that alternately repeats etching and formation of a sidewall protective film, and a small diameter portion 212 that opens to the lower surface, and an upper surface from the communication port 212a that communicates with the small diameter portion 212.
  • a nozzle hole 211 having a large diameter portion 213 larger than the small diameter portion 212 is formed (FIG. 3).
  • the inner wall of the small diameter portion 212 and the large diameter portion 213 in FIG. 3 is schematically a scallop that can be seen because it is formed using anisotropic etching that repeatedly performs etching and formation of a sidewall protective film (deposition). Show.
  • the nozzle plate 21 is made of a Si substrate, and in particular, from the viewpoint of improving workability, it is preferable to use a so-called SOI wafer in which a bonding layer 21b made of a SiO 2 layer is provided between two Si layers 21a.
  • the coupling layer 21b is thinner than the Si layer (for example, 0.3 to 1.0 ⁇ m) and has a very low etching rate. Therefore, when the small diameter portion 212 and the large diameter portion 213 are each processed toward the bonding layer 21b, the processing can be controlled by the bonding layer 21b even when there is processing unevenness.
  • the “scallop width” in the present invention refers to the interval between the widths of the scallops per cycle when the repeating unit of alternately repeating etching and the formation of the sidewall protective film is one cycle in the anisotropic etching method.
  • the “average scallop width” in the present invention means an average value of individual scallop widths.
  • the smoothness of the side wall of the bottom layer 213b is improved, It is possible to make it difficult for bubbles to accumulate in the bottom layer 213b. Thereby, the foaming property of the nozzle is high, and stable injection performance can be obtained.
  • the average scallop width Wm of the middle layer 213m satisfies the following formula (2).
  • the smoothness of the side wall of the middle layer 213m is improved, it is considered that minute bubbles are hardly caught in the middle layer 213m. And it is thought that the bubble which generate
  • the ratio of the large diameter portions of the top layer 213t, middle layer 213m, and bottom layer 213b to the overall length in the vertical direction is within the range of 5 to 50% (for example, 20%) for the top layer 213t, and 0 to 90 for the middle layer 213m. % (For example, 60%), the bottom layer is preferably in the range of 5 to 50% (for example, 20%), and the total of each is preferably 100%.
  • the average scallop width Wt, the average scallop width Wm, and the average scallop width Wb are not particularly limited, but are preferably 2.5 ⁇ m or less, and 2.0 ⁇ m from the viewpoint of difficulty in catching bubbles. It is particularly preferred that
  • the small-diameter portion 212 is preferably formed with a thickness of 10 to 20 ⁇ m, for example, and the average scallop width is preferably 0.2 ⁇ m or less. Since the small-diameter portion 212 serves as an ejection port for ejecting droplets, the scallop width (etching width) is preferably narrowed and formed with high processing accuracy.
  • a liquid repellent layer 215 is preferably provided on the surface of the nozzle plate 21 where the small diameter portion 212 is opened.
  • the liquid repellent layer 215 it is possible to prevent the liquid ejected from the nozzle hole 211 from seeping out and spreading on the lower surface of the nozzle plate 21.
  • a material having water repellency is used if the liquid ejected from the nozzle hole 211 is aqueous, and a material having oil repellency is used if the liquid ejected from the nozzle hole 211 is oily. .
  • fluorine resins such as FEP (tetrafluoroethylene, hexafluoropropylene), PTFE (polytetrafluoroethylene), fluorosiloxane, fluoroalkylsilane, and amorphous perfluororesin.
  • FEP tetrafluoroethylene, hexafluoropropylene
  • PTFE polytetrafluoroethylene
  • fluorosiloxane fluoroalkylsilane
  • amorphous perfluororesin a film is formed on the lower surface of the nozzle plate by a known method such as vapor deposition.
  • the thickness of the liquid repellent layer 215 is not particularly limited, but is preferably in the range of 0.1 to 3.0 ⁇ m.
  • nozzle plate manufacturing method An example of the nozzle plate manufacturing method will be described.
  • a method of forming the small diameter portion 212 after forming the large diameter portion 213 and removing the bonding layer 21b made of the SiO 2 layer by a wet etching method using a diluted hydrofluoric acid solution can be selected as appropriate, and the present invention is not limited to the example shown below.
  • the bonding layer 21b made of the SiO 2 layer may be removed by a dry etching method, or the processing order may be reversed to form the large diameter portion 213 after forming the small diameter portion 212.
  • the nozzle plate 21 of the present invention As a method for manufacturing the nozzle plate 21 of the present invention, a method for forming nozzle holes in a Si substrate will be described.
  • the large diameter portion 213 is first formed from one surface of the nozzle plate (FIGS. 4A to I), and then the small diameter portion 212 is formed from the other surface of the nozzle plate ( Figures 5A-G).
  • the Bosch process is used as the anisotropic etching method
  • the Si substrate for manufacturing the nozzle plate 21 is SiO 2 between the two Si layers 21a.
  • an SOI wafer provided with a bonding layer 21b made of layers is used, the present invention is not limited to this.
  • a photoresist 218 is applied to the surface other than the upper surface where the large-diameter portion 213 is to be formed.
  • a photoresist pattern 218a is formed so as to achieve the above state (FIG. 4C).
  • a thermal oxide film pattern is formed by dry etching using, for example, CHF 3 using the photoresist pattern 218a as an etching mask, and this is used as an etching mask pattern 217a in the anisotropic etching method (FIG. 4D).
  • the etching condition and the deposition condition are set to the conditions that allow the etching with the average scallop width Wt by the anisotropic etching method in which the etching and the deposition are alternately repeated.
  • the top layer 213t of the part 213 is formed (FIG. 4F).
  • an ICP type RIE apparatus is preferable as an etching apparatus that performs the anisotropic etching method.
  • sulfur hexafluoride (SF 6 ) is used as an etching gas during etching
  • carbon fluoride is used as a deposition gas during deposition.
  • Use C 4 F 8 ) alternately.
  • the etching conditions and the deposition conditions are changed to conditions that allow etching with the average scallop width Wm, and the middle layer 213m of the large diameter portion 213 is formed (FIG. 4G).
  • the etching conditions and the deposition conditions are changed to conditions that allow etching with the average scallop width Wb, and etching is performed until the bonding layer 21b is exposed, thereby forming the bottom layer 213b of the large-diameter portion 213 (FIG. 4H).
  • the step of forming the large diameter portion 213 is completed by removing the etching mask pattern 217a (FIG. 4I).
  • the step of forming the large diameter portion 213 in the present invention includes the step of forming the top layer 213t with the average scallop width Wb, the step of forming the bottom layer 213b with the average scallop width Wb, and the middle layer 213m. Forming with an average scallop width Wm.
  • the average scallop widths Wt, Wm, and Wb described above satisfy at least the following formula (1), and preferably satisfy the following formula (2).
  • etching is performed until the bonding layer 21b is exposed by an anisotropic etching method in which etching and deposition are alternately repeated to form the small-diameter portion 212 (FIG. 5). 5F). Then, the step of immersing in a diluted hydrofluoric acid solution to remove the etching mask pattern 216a and the bonding layer 21b exposed on the surface and forming the small diameter portion 212 is completed (FIG. 5G).
  • the nozzle plate manufacturing method of the present invention a method using an SOI wafer has been shown, but the present invention is not limited to this, and the nozzle plate 21 may be manufactured using a Si substrate that does not use an SOI wafer.
  • the manufacturing method in which the average etching rate is changed in each of the top layer 213t, the middle layer 213m, and the bottom layer 213b has been described. It is not necessary to have a layer structure. For example, a two-layer configuration of a top layer 213t and a bottom layer 213b in which the average etching rate is changed only once may be used, or a configuration of four layers or more in which the average etching rate is changed three or more times may be used.
  • the shape of the large diameter portion 213 is not limited to the large diameter portion 213 formed in the direction perpendicular to the nozzle plate 21 as shown in FIG. 3, and can be selected as appropriate.
  • a tapered shape may be used so that the diameter of the large diameter portion 213 on the top layer 213t side is increased.
  • the large-diameter portion 213 is formed to have two or more steps so that the diameter decreases from the upper side to the lower side in FIG. 3, and the top layer 213t, the middle layer 213m, and the bottom layer are formed on each step.
  • 213b may be provided so that each scallop width Wt, Wm, and Wb satisfies the above formula (1) or the above formula (2).
  • Nozzle plates 1 to 4 having nozzle holes 211 composed of a small diameter portion 212 and a large diameter portion 213 were manufactured by an anisotropic etching method using a Bosch process.
  • a thermal oxide film 216, 217 made of SiO 2 serving as an etching mask and having a thickness of 1 ⁇ m is provided on both surfaces, and a thickness of 200 ⁇ m.
  • An SOI wafer was prepared (FIG. 4A). The thickness of the bonding layer 21b of the SOI wafer was 0.5 ⁇ m.
  • the photoresist 218 is applied to the surface other than the upper surface where the large-diameter portion 213 is to be formed.
  • a photoresist pattern 218a having a diameter of 100 ⁇ m was formed so as to be in a dry state (FIG. 4C).
  • a thermal oxide film pattern having a diameter of 100 ⁇ m was formed by dry etching using CHF 3 using the photoresist pattern 218a as an etching mask, and this was used as an etching mask pattern 217a in the anisotropic etching method (FIG. 4D).
  • the photoresist pattern 218a was removed (FIG. 4E).
  • a large-diameter portion 213 having a diameter of 100 ⁇ m was formed by an anisotropic etching method in which etching and deposition were alternately repeated (FIGS. 4F, 4G, and FIG. 4). 4H). Thereafter, the etching mask pattern 217a was removed by dry etching using CHF 3 (FIG. 4I).
  • the large diameter portion 213 is formed so as to have an average scallop width Wt of the top layer 213t, an average scallop width Wm of the middle layer 213m, and an average scallop width Wt of the top layer 213t.
  • the large diameter portion 213 of the nozzle plates 1 to 4 was formed by adjusting the anisotropic etching conditions.
  • the top layer 213t is formed to be 36 ⁇ m
  • the middle layer 213m is formed to be 108 ⁇ m
  • the bottom layer 213b is formed to be 36 ⁇ m.
  • the Si substrate having a thickness of 200 ⁇ m is used, the thickness of the remaining Si substrate was 20 ⁇ m.
  • Photoresist 219 was applied to the surface of the thermal oxide film 216 on the side where the small diameter portion 212 is to be formed (FIG. 5B) on the Si substrate on which the large diameter portion 213 was formed (FIG. 5A).
  • a photoresist pattern 219a having a diameter of 20 ⁇ m and concentric with the hole of the large-diameter portion 213 was formed so that the photoresist 219 was applied on the surface other than the upper surface of the position where the small-diameter portion 212 was formed (FIG. 5C). .
  • a thermal oxide film pattern having a diameter of 20 ⁇ m was formed using the photoresist pattern 219a as an etching mask, and this was used as an etching mask pattern 216a in the anisotropic etching method (FIG. 5D).
  • the photoresist pattern 219a was removed (FIG. 5E).
  • etching is performed until the bonding layer 21b is exposed by an anisotropic etching method in which etching and deposition are alternately repeated, and the small-diameter portion 212 having a diameter of 20 ⁇ m is formed. Formed (FIG. 5F). Then, it was immersed in a diluted hydrofluoric acid solution to remove the etching mask pattern 216a and the bonding layer 21b exposed on the surface (FIG. 5G).
  • the small-diameter portion 212 in the nozzle plates 1 to 4 it is formed by adjusting the anisotropic etching conditions so that the average scallop width is 0.2 ⁇ m, and the nozzle plates 1 to 4 have the same small diameter. Part 212 was formed. Moreover, the thickness of the formed small diameter part 212 was 20 micrometers.
  • 1024 nozzle holes 211 constituted by the large diameter portion 213 and the small diameter portion 212 as described above were formed in the nozzle plates 1 to 4. Further, in the nozzle plates 1 to 4 manufactured by the above method, the liquid repellent layer 215 as shown in FIG. 3 was not provided.
  • each of the ink jet heads 1 to 4 is mounted on an ink jet recording apparatus, and ink is discharged from each of the 1024 nozzle holes 211 through the ink flow path member 5 through the inside of the head chip 2 for 10 seconds at 70 kPa.
  • the ink was initially filled.
  • the ink was additionally charged by passing the ink from the ink flow path member 5 through the inside of the head chip 2 and discharging the ink from each of the 1024 nozzle holes 211 at 100 kPa for 10 seconds.
  • ejection blur occurred in the ejected ink droplets.
  • the evaluation of ejection blur is based on the arrival position at which the ejected ink droplet is 1 mm away from the bottom surface of the nozzle plate 21 when the flying trajectory of 20 ink droplets ejected from each nozzle hole 211 is photographed with a strobe camera. In FIG.
  • the ejection performance of the inkjet heads 1 to 4 was evaluated according to the following criteria, and ⁇ and ⁇ were accepted.
  • ⁇ Injection blur occurred in 1 to 4 of 1024 nozzle holes.
  • ⁇ Injection blur occurred in 5 to 9 of 1024 nozzle holes.
  • X Injection blur occurred in 10 or more of 1024 nozzle holes.
  • the present invention can be used for a method for manufacturing a nozzle plate for a liquid discharge head, a nozzle plate for a liquid discharge head, and a liquid discharge head.
  • Liquid ejection head (inkjet head) 2 Head chip 21 Nozzle plate 211 Nozzle hole 212 Small diameter part 213 Large diameter part 213t Top layer 213m Middle layer 213b Bottom layer 215 Liquid repellent layer Wt Average scallop width Wm of top layer Average scallop width Wb of middle layer Average scallop width of bottom layer

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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

La présente invention traite le problème de la mise en place d'un procédé de fabrication d'une plaque à buses de tête d'éjection de liquide à l'aide de laquelle des performances stables d'injection peuvent être obtenues avec une haute précision de traitement, et qui présente de bonnes propriétés de rupture des bulles de buses. La présente invention concerne un procédé de fabrication d'une plaque à buses de tête d'éjection de liquide 21, le procédé de fabrication the plaque à buses de tête d'éjection de liquide 21 comportant l'utilisation d'une gravure anisotrope pour réaliser, dans un substrat en Si, un trou 211 de buse comprenant une partie 212 de petit diamètre débouchant au niveau d'une surface du substrat en Si, et une partie 213 de grand diamètre plus grande que la partie 212 de petit diamètre et débouchant au niveau de son autre surface à partir d'un trou 212a de communication communiquant avec la partie 212 de petit diamètre. Si la partie 213 de grand diamètre comprend une couche supérieure 213t en contact avec l'autre surface et une couche inférieure 213b en contact avec l'orifice 212a de communication, le procédé est caractérisé en ce qu'il comporte une étape consistant à former la couche supérieure 213t présentant une largeur moyenne de dentelure Wt et une étape consistant à former la couche inférieure 213b présentant une largeur moyenne de dentelure Wb, la formule suivante (1) étant satisfaite: Formule (1): Wt > Wb.
PCT/JP2016/060046 2015-03-30 2016-03-29 Procédé de fabrication d'une plaque à buses de tête d'éjection de liquide, plaque à buses de tête d'éjection de liquide, et tête d'éjection de liquide WO2016158917A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110831769A (zh) * 2017-07-10 2020-02-21 柯尼卡美能达株式会社 喷墨头、喷墨记录装置以及喷墨头的制造方法
JP2020082671A (ja) * 2018-11-30 2020-06-04 株式会社リコー 液体吐出ヘッド、液体吐出ユニットおよび液体を吐出する装置

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