WO2016123853A1 - 蒸镀换料一体化设备及其使用方法 - Google Patents

蒸镀换料一体化设备及其使用方法 Download PDF

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Publication number
WO2016123853A1
WO2016123853A1 PCT/CN2015/075688 CN2015075688W WO2016123853A1 WO 2016123853 A1 WO2016123853 A1 WO 2016123853A1 CN 2015075688 W CN2015075688 W CN 2015075688W WO 2016123853 A1 WO2016123853 A1 WO 2016123853A1
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Prior art keywords
vapor deposition
refueling
evaporation
region
valve
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Ceased
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PCT/CN2015/075688
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English (en)
French (fr)
Inventor
李金川
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/781,586 priority Critical patent/US9647244B2/en
Publication of WO2016123853A1 publication Critical patent/WO2016123853A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Definitions

  • the present invention relates to the field of manufacturing of organic light emitting diode display devices, and in particular, to an evaporation and refueling integrated device and a method for using the same.
  • OLED Organic Light-Emitting Diode
  • the OLED display device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
  • the existing OLED display device manufacturing method is mainly vacuum thermal evaporation method, and the organic material is first formed on the ITO anode layer by vacuum thermal evaporation using an evaporation device, and then the metal cathode is vacuum evaporated or splashed. The plating method is deposited.
  • One implementation of full colorization of OLED display devices is to superimpose a white organic light emitting diode (WOLED) and a color filter (CF).
  • WOLED white organic light emitting diode
  • CF color filter
  • the OLED production line has been developed to the G8.5 generation, the size of the glass substrate has reached 2250 ⁇ 2500mm, and the volume of the vapor deposition equipment has reached more than 30m 3 , which requires a lot of vacuum for such a large volume.
  • at least 5 hours or more is required to bring the internal pressure of the chamber to 5 ⁇ 10 -5 Pa or less, thereby satisfying the vacuum conditions required for production.
  • the vacuum evaporation process is performed by using the existing vapor deposition equipment, after each evaporation material is consumed, the cavity must be opened by vacuuming, and the vapor deposition material is re-applied and vacuumed again, when the cavity is satisfied.
  • the evaporation material is heated again, and the time required for refueling and heating up to resume production is more than 10 hours, and this form of refueling is required every week in the normal production process. At least once, it accumulates a lot of production time waste, reduces production efficiency, affects production capacity, increases production costs, and reduces the competitiveness of enterprises.
  • the object of the present invention is to provide an integrated material for vapor deposition and refueling, which can replace the vapor deposition material and the pre-heating evaporation material without destroying the vacuum in the evaporation zone, thereby greatly reducing waste of production time and improving production efficiency. To increase production capacity, reduce production costs, and improve the competitiveness of enterprises.
  • the invention also provides a method for using the vapor deposition refueling integrated device, which can realize rapid replacement of the evaporation material without breaking the vacuum in the evaporation region, and preheating the evaporation material before replacing the evaporation material, and replacing the steaming After the plating material, the evaporation process can be directly performed without heating for a long time, thereby greatly reducing waste of production time, improving production efficiency, increasing production capacity, reducing production cost, and improving the competitiveness of the enterprise.
  • the present invention firstly provides an evaporation and refueling integrated device, comprising an evaporation chamber region, a refueling cavity region, and a region between the vapor deposition cavity region and the refueling cavity region. a valve that separates the two;
  • the evaporation chamber region and the refueling cavity region are respectively provided with a carrying platform, a plurality of evaporation sources disposed on the carrying platform, and a plurality of fixing and conveying the plurality of evaporation sources.
  • a switching device, and a separate vacuuming device wherein the carrying platform is provided with a heating and heating device;
  • a substrate is further disposed in the evaporation chamber region;
  • a filler gate is further disposed on a side of the refueling cavity region away from the valve;
  • a high vacuum state is always maintained in the vapor deposition chamber region; when the vapor deposition is performed, the valve is closed, and evaporation of a plurality of vapor deposition sources in the vapor deposition chamber region and the region in the refueling cavity region
  • the preheating of the plurality of vapor deposition sources is performed simultaneously; when the refueling is performed, the valve is opened, and the exchange device divides the vapor deposition source in the evaporation chamber region and the evaporation source not consumed in the refueling chamber region.
  • the displacement is performed; when the filler is closed, the valve is closed, the packing door is opened, and the displaced spent evaporation source is filled in the region of the refueling chamber.
  • the valve is a pneumatic valve.
  • the evaporation source includes a crucible and an evaporation material filled in the crucible.
  • the carrying platform and the switching device have a 360° rotation function, so that when the substrate is in different positions in the evaporation chamber region, the carrying platform and the switching device cooperate to make the gas outlet of the evaporation source Directly facing the substrate.
  • the switching device is a telescopic link structure, one end of which is fixed on a base, and the other end is fixed to the evaporation source by a clamp.
  • the invention also provides an evaporation and refueling integrated device, comprising: an evaporation chamber region, a refueling cavity region, and a region disposed between the vapor deposition cavity region and the refueling cavity region to separate the two Open valve door;
  • the evaporation chamber region and the refueling cavity region are respectively provided with a carrying platform, a plurality of evaporation sources disposed on the carrying platform, and a plurality of fixing and conveying the plurality of evaporation sources.
  • a switching device, and a separate vacuuming device wherein the carrying platform is provided with a heating and heating device;
  • a substrate is further disposed in the evaporation chamber region;
  • a filler gate is further disposed on a side of the refueling cavity region away from the valve;
  • a high vacuum state is always maintained in the vapor deposition chamber region; when the vapor deposition is performed, the valve is closed, and evaporation of a plurality of vapor deposition sources in the vapor deposition chamber region and the region in the refueling cavity region The preheating of the plurality of vapor deposition sources is performed simultaneously; when the refueling is performed, the valve is opened, and the exchange device divides the vapor deposition source in the evaporation chamber region and the evaporation source not consumed in the refueling chamber region. Performing a displacement; when the filler is closed, the valve is closed, the packing door is opened, and the displaced exhausted evaporation source is filled in the refueling cavity region;
  • valve is a pneumatic valve
  • the evaporation source comprises a crucible and an evaporation material filled in the crucible.
  • the invention also provides a method for using an evaporation and refueling integrated device, comprising the following steps:
  • Step 1 Providing an integrated device for vapor deposition and refueling, and an evaporation material
  • the vapor deposition refueling integrated device comprises a vapor deposition cavity region, a refueling cavity region, and a valve disposed between the vapor deposition cavity region and the refueling cavity region to separate the two; a vapor deposition chamber region and a refueling chamber region are respectively provided with a carrying platform, a plurality of evaporation sources disposed on the carrying platform, and a plurality of exchanges for fixing and transmitting the plurality of vapor deposition sources.
  • a device, and a separate vacuuming device wherein the carrying platform is provided with a heating and heating device; a substrate is further disposed in the evaporation chamber region; and the refueling cavity region is further away from the side of the valve Have a packing door;
  • Step 2 closing the filling door and the valve, vacuuming the evaporation chamber region and the refueling chamber region through the independent vacuuming device, and simultaneously performing heating and heating devices in the loading platform Pre-evaporation of a plurality of vapor deposition sources in the vapor deposition chamber region and pre-heating of a plurality of vapor deposition sources in the refueling cavity region;
  • Step 3 After a certain evaporation source in the evaporation chamber region is consumed, the valve is opened, and the evaporation source and the refueling chamber in the evaporation chamber region are exhausted by the exchange device. The evaporation source that is not consumed in the area is replaced, and then the valve is closed, and evaporation is continued in the evaporation chamber region;
  • Step 4 while the vapor deposition chamber is normally vapor-deposited, the refueling cavity region is vacuumed, the filler door is opened, and the replaced vapor deposition source is filled with the vapor deposition material. After the filling is completed, the packing door is closed, and then the refueling chamber area is evacuated and passed through the bearing The heating and heating device in the platform preheats the vapor deposition source after the filling, and waits for the next replacement.
  • the step 3 specifically includes:
  • Step 31 moving the evaporated evaporation source in the evaporation chamber region to the valve through the switching device, and opening the valve;
  • Step 32 Move a vacant position of the load bearing platform in the refueling cavity area to the valve, and then place the evaporated evaporation source in the vapor deposition cavity area in the vacant position through the exchange device. on;
  • Step 33 Move a position on the carrying platform in the refueling cavity area corresponding to the unconsumed evaporation source to the valve, and then replace the unconsumed evaporation source with the exchange device to the a position where the carrying platform in the evaporation chamber region is vacant;
  • step 34 the valve is closed, and evaporation is continued in the vapor deposition chamber region.
  • the valve is a pneumatic valve; the evaporation source includes a crucible and an evaporation material filled in the crucible.
  • the carrying platform and the switching device have a 360° rotation function, so that when the substrate is in different positions in the evaporation chamber region, the carrying platform and the switching device cooperate to make the gas outlet of the evaporation source Directly facing the substrate.
  • the switching device is a telescopic link structure, one end of which is fixed on a base, and the other end is fixed to the evaporation source by a clamp.
  • the invention provides an evaporation and refueling integrated device and a using method thereof, and the inside of the device is separated into a vapor-depositable cavity region and a refueling cavity region which can be independently vacuumed through a valve. And heating heating device and a plurality of switching devices are respectively disposed in the vapor deposition chamber region and the refueling cavity region.
  • the valve When vapor deposition, the valve is closed, and several steaming in the vapor deposition cavity region The evaporation of the plating source is performed simultaneously with the pre-heating of the plurality of evaporation sources in the region of the refueling chamber; when refueling, the valve is opened, and the switching device steams the exhaust in the evaporation chamber region.
  • the plating source is replaced with an evaporation source that is not consumed in the refueling cavity region; when the filler is filled, the valve is closed, and the replaced exhausted evaporation source is filled in the refueling cavity region;
  • the evaporation source in the refueling cavity region has been preheated before refueling, and the vapor deposition material is advanced in advance.
  • Predetermined evaporation rate no need for long time after refueling Heating evaporation process can be carried out, significantly reducing the waste of production time, improve productivity, enhance productivity, reduce production costs and improve the competitiveness of enterprises.
  • FIG. 1 is a schematic structural view of an evaporation and refueling integrated device of the present invention
  • FIG. 2 is a cross-sectional view showing the vapor deposition chamber region and the internal structure of the refueling chamber region of the vapor deposition refueling integrated device of the present invention
  • FIG. 3 is a flow chart of a method of using the vapor deposition refueling integrated device of the present invention.
  • the present invention firstly provides an evaporation and refueling integrated device, including an evaporation chamber region 1, a refueling cavity region 2, and a vapor deposition chamber region 1 and A valve 3 separating the two between the refueling chamber regions 2.
  • the evaporation chamber region 1 and the refueling cavity region 2 are respectively provided with a loading platform 41, and a plurality of evaporation sources 43 disposed on the loading platform 41 for fixing and conveying the plurality of steaming
  • a plurality of switching devices 45 of the plating source 43 and a separate vacuuming device are provided, and the heating platform is provided in the carrying platform 41.
  • a substrate is also disposed in the vapor deposition chamber region 1.
  • a filling door 5 is further provided on a side of the refueling chamber region 2 remote from the valve 3.
  • the refueling cavity region 2 is sufficient to accommodate a plurality of evaporation sources 43.
  • the vapor deposition cavity region 1 accommodates the substrate in addition to the plurality of evaporation sources 43.
  • the volume of the refueling cavity region 2 is much smaller than the volume of the vapor deposition cavity region 1, and the corresponding operation of vacuuming and vacuuming the refueling cavity region 2 is simpler and shorter.
  • valve 3 is a pneumatic valve.
  • the evaporation source 43 includes a crucible and a vapor deposition material filled in the crucible, and the evaporation material is an organic material or an inorganic material such as lithium fluoride (LiF).
  • the carrying platform 41 and the switching device 45 can realize a 360° rotation function by the prior art, so that when the substrate is in different positions in the vapor deposition cavity region 1, the carrier is placed horizontally or vertically.
  • the platform 41 and the exchange device 45 cooperate to make the gas outlet 431 of the vapor deposition source 43 face the substrate, and ensure that the vapor deposition process is smoothly performed.
  • the switching device 45 is a telescopic link structure, one end of which is fixed on a base 7 , and the other end is fixed to the vapor deposition source 43 by a clamp 9 , and the telescopic link structure can transmit the evaporation source 43 Send to the desired location.
  • the inside thereof is maintained in a high vacuum state with a pressure of 5 ⁇ 10 -5 Pa or less.
  • the valve 3 is closed, and vapor deposition of a plurality of vapor deposition sources 43 in the vapor deposition chamber region 1 is simultaneously performed with pre-heating of a plurality of vapor deposition sources 43 in the refueling cavity region 2.
  • the valve 3 is opened, and the exchange device 45 replaces the vapor deposition source 43 consumed in the vapor deposition chamber region 1 with the evaporation source 43 that is not consumed in the refueling cavity region 2;
  • the valve 3 is closed, the packing door 5 is opened, and the displaced spent vapor deposition source 43 is filled in the refueling chamber region 2.
  • the evaporation source 43 in the refueling cavity region 2 has been preheated, in advance.
  • the vapor deposition material is brought to a predetermined vapor deposition rate, and the vapor deposition process can be performed without heating for a long time after the refueling.
  • the production time waste caused by the open cavity refueling is greatly reduced, and the production efficiency is improved. Increased production capacity, reduced production costs, and increased competitiveness of enterprises.
  • the vapor deposition chamber region 1 and the refueling cavity region 2 of the vapor deposition and refueling integrated device are provided with a plurality of evaporation sources 43, in the evaporation process, if the evaporation When a part of the vapor deposition material in the plating chamber region 1 blocks the gas outlet 431 of the vapor deposition source 43, the replacement can be immediately performed by the exchange device 45, and the problematic vapor deposition source 43 is placed in the refueling chamber.
  • Timely processing in Zone 2 ensures the normal progress of the evaporation process and enables continuous and uninterrupted long-term production.
  • the present invention also provides a method for using an evaporation and refueling integrated device, comprising the following steps:
  • Step 1 Provide an integrated equipment for vapor deposition and refueling, and a vapor deposition material.
  • the vapor deposition refueling integrated device includes an evaporation chamber region 1, a refueling cavity region 2, and a vapor deposition chamber region 1 and a refueling cavity region 2; A valve 3 that separates the two.
  • the evaporation chamber region 1 and the refueling cavity region 2 are respectively provided with a loading platform 41, and a plurality of evaporation sources 43 disposed on the loading platform 41 for fixing and conveying the plurality of steaming
  • a plurality of switching devices 45 of the plating source 43 and a separate vacuuming device are provided, and the heating platform is provided in the carrying platform 41.
  • a substrate is also disposed in the vapor deposition chamber region 1.
  • a filling door 5 is further provided on a side of the refueling chamber region 2 remote from the valve 3.
  • a portion of the load bearing platform 41 in the refueling cavity region 2 is vacant.
  • the refueling cavity region 2 is sufficient to accommodate a plurality of evaporation sources 43.
  • the vapor deposition cavity region 1 accommodates the substrate in addition to the plurality of evaporation sources 43.
  • Setting office The volume of the refueling chamber region 2 is much smaller than the volume of the vapor deposition chamber region 1.
  • the valve 3 is a pneumatic valve.
  • the evaporation source 43 includes a crucible and a vapor deposition material filled in the crucible, and the evaporation material is an organic material or an inorganic material such as lithium fluoride (LiF).
  • the carrying platform 41 and the switching device 45 can realize a 360° rotation function by the prior art, so that when the substrate is in different positions in the vapor deposition cavity region 1, the carrier is placed horizontally or vertically.
  • the platform 41 and the exchange device 45 cooperate to make the air outlet 431 of the vapor deposition source 43 face the substrate.
  • the switching device 45 is a telescopic link structure, one end of which is fixed on a base 7 and the other end is fixed to the evaporation source 43 by a clamp 9 , and the telescopic link structure can transmit the evaporation source 43 to The location you need.
  • Step 2 closing the filling door 5 and the valve 3, and vacuuming the vapor deposition chamber region 1 and the refueling cavity region 2 through the independent vacuuming device, respectively, through the loading platform 41
  • the heating and heating device simultaneously performs vapor deposition of a plurality of vapor deposition sources 43 in the vapor deposition chamber region 1 and pre-heating of a plurality of vapor deposition sources 43 in the refueling cavity region 2.
  • Step 3 After a certain evaporation source 43 in the vapor deposition chamber region 1 is consumed, the valve 3 is opened, and the evaporation source in the vapor deposition chamber region 1 is exhausted by the exchange device 45. 43 is replaced with an evaporation source 43 that is not consumed in the refueling chamber region 2, and then the valve 3 is closed, and evaporation is continued in the vapor deposition chamber region 1.
  • step 3 can be subdivided into:
  • Step 31 through the exchange device 45, the evaporation source 43 in the evaporation chamber region 1 is moved to the valve 3, the valve 3 is opened;
  • Step 32 Move a vacant position of the load bearing platform 41 in the refueling cavity region 2 to the valve 3, and then use the exchange device 45 to drain the vapor deposition source in the vapor deposition cavity region 1. 43 placed in the vacant position;
  • Step 33 Move a position on the carrying platform 41 in the refueling cavity region 2 corresponding to the unconsumed evaporation source 43 to the valve 3, and then perform the unconsumed evaporation by the switching device 45.
  • the source 43 is displaced to a position where the carrying platform 41 in the vapor deposition chamber region 1 is vacated;
  • step 34 the valve 3 is closed, and evaporation is continued in the vapor deposition chamber region 1.
  • the step 3 does not need to vacuum the evaporation chamber region 1 to realize rapid refueling, and before the refueling, the evaporation source 43 in the refueling cavity region 2 has been preheated.
  • the vapor deposition material is brought to a predetermined vapor deposition rate in advance, and the vapor deposition process can be performed without heating for a long time after the refueling.
  • the production time waste caused by the open cavity refueling is greatly reduced, the production efficiency is improved, the production capacity is increased, the production cost is lowered, and the competitiveness of the enterprise is improved.
  • Step 4 While the vapor deposition chamber region 1 is normally vapor-deposited, the refueling cavity region 2 is vacuumed, the filler door 5 is opened, and the replaced exhausted vapor deposition source 43 is steamed. The plating material is filled, the filling door 5 is closed after the filling is completed, the vacuuming chamber region 2 is evacuated, and the vapor deposition source 43 after the filling is preheated by the heating and heating device in the carrying platform 41, waiting for the next time. Replacement.
  • the vacuuming of the refueling cavity region 2 is sequentially performed, and the discharged vapor deposition source 43 is replaced, and again.
  • Vacuuming the refueling cavity region 2 since the volume of the refueling cavity region 2 is much smaller than the volume of the vapor deposition cavity region 1, the refueling cavity region 2 is vacuumed and evacuated. The operation is simpler, the time is short, and the uninterrupted evaporation process is carried out normally, which achieves the effects of saving production time, improving production efficiency, increasing production capacity, and reducing production cost.
  • the vapor-exchange refueling integrated device of the present invention and the method of using the same, the interior of the device is separated into an independently evacuatable vapor deposition chamber region and a refueling cavity region by a valve, and A heating and heating device and a plurality of switching devices are respectively disposed in the vapor deposition chamber region and the refueling cavity region.
  • the valve is closed, and steaming of the plurality of vapor deposition sources in the vapor deposition chamber region is performed.
  • the plating is performed simultaneously with the pre-heating of the plurality of vapor deposition sources in the refueling cavity region; when the refueling is performed, the valve is opened, and the exchange device exchanges the evaporated evaporation source in the evaporation chamber region. Displacement of the unconsumed evaporation source in the region of the material cavity; when the filler is filled, the valve is closed, and the displaced exhausted evaporation source is filled in the refueling cavity region; The evaporation chamber is broken under vacuum to realize rapid refueling, and before the refueling, the evaporation source in the refueling cavity region has been preheated, and the vapor deposition material is preliminarily vaporized in advance. Rate, steaming without reheating for a long time after refueling Process, significantly reducing the waste of production time, improve productivity, enhance productivity, reduce production costs and improve the competitiveness of enterprises.

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Abstract

　一种蒸镀换料一体化设备，包括：蒸镀腔体区域（1）、换料腔体区域（2）以及设于蒸镀腔体区域（1）与换料腔体区域（2）之间将二者分隔开的阀门（3）；蒸镀腔体区域（1）和换料腔体区域（2）内均设有一承载平台（41）、设于承载平台（41）上的数个蒸镀源（43）、用于固定与传送数个蒸镀源（43）的数个交换装置（45）以及一独立的抽真空装置，承载平台（41）内设有加热升温装置；蒸镀腔体区域（1）内设有基板；换料腔体区域（2）远离阀门（3）的一侧设有一填料门（5）。还提供该设备的使用方法。该设备能够在不破坏蒸镀区域真空的条件下完成蒸镀材料的更换及预升温，提高生产效率。

Description

蒸镀换料一体化设备及其使用方法 技术领域
本发明涉及有机发光二极管显示器件的制程领域，尤其涉及一种蒸镀换料一体化设备及其使用方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)是一种极具发展前景的显示技术，它不仅具有十分优异的显示性能，还具有自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前，OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED显示器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极。现有的OLED显示器件制作方法主要是真空热蒸镀法，使用蒸镀设备先将有机材料以真空热蒸镀的方式成膜于ITO阳极层上，再将金属阴极以真空热蒸镀或溅镀的方式沉积上去。
OLED显示器件全彩化的一种实现方式是将白色有机发光二极管(White Organic Light Emitting Diode，WOLED)和彩色滤光层(Color Filter，CF)进行叠加。
随着大尺寸WOLED的研制，OLED生产线发展到G8.5世代，玻璃基板的尺寸达到2250×2500mm，而蒸镀设备的腔体体积达到30m3以上，对如此大体积的腔体抽真空需要很长的时间，至少达到5小时以上才能使腔体内部压强达到5×10-5Pa以下，从而满足生产需要的真空条件。这样就使得在利用现有的蒸镀设备进行真空蒸镀制程时，每次蒸镀材料消耗完以后，都必须破真空打开腔体，重新加蒸镀材料后再次抽真空，当腔体达到满足要求的高真空后，再对蒸镀材料进行升温，每次换料、升温到恢复生产所需的时间都在10个小时以上，而这种形式的换料在正常生产过程中每周都需要进行至少一次，累积起来便造成大量生产时间的浪费，降低了生产效率，影响了产能，增加了生产成本，降低了企业的竞争力。
发明内容
本发明的目的在于提供一种蒸镀换料一体化设备，能够在不破坏蒸镀区域真空的条件下完成更换蒸镀材料与预升温蒸镀材料，大幅减少对生产时间的浪费，提高生产效率，提升产能，降低生产成本，提高企业的竞争力。
本发明还提供一种蒸镀换料一体化设备的使用方法，无需对蒸镀区域破真空即可实现快速更换蒸镀材料，并在更换蒸镀材料前对蒸镀材料进行预升温，更换蒸镀材料后无需长时间加热即可直接进行蒸镀制程，大幅减少对生产时间的浪费，提高生产效率，提升产能，降低生产成本，提高企业的竞争力。
为实现上述目的，本发明首先提供一种蒸镀换料一体化设备，包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀门；
所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；
所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
所述蒸镀腔体区域内始终保持高真空状态；蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，所述填料门打开，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料。
所述阀门为气动阀门。
所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
所述承载平台、及交换装置具有360°旋转功能，从而当所述基板处于蒸镀腔体区域内的不同位置时，所述承载平台、及交换装置共同作用使所述蒸镀源的出气口正对基板。
所述交换装置为可伸缩连杆结构，其一端固定于一基座上，另一端通过夹具固定所述蒸镀源。
本发明还提供一种蒸镀换料一体化设备，包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀 门；
所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；
所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
所述蒸镀腔体区域内始终保持高真空状态；蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，所述填料门打开，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料；
其中，所述阀门为气动阀门；
其中，所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
本发明还提供一种蒸镀换料一体化设备的使用方法，包括如下步骤：
步骤1、提供蒸镀换料一体化设备、及蒸镀材料；
所述蒸镀换料一体化设备包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀门；所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
所述换料腔体区域内的承载平台的部分位置空置；
步骤2、关闭所述填料门、与阀门，将所述蒸镀腔体区域、换料腔体区域分别通过所述独立的抽真空装置抽真空，通过所述承载平台内的加热升温装置同时进行所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温；
步骤3、当所述蒸镀腔体区域内的某一蒸镀源消耗完毕后，打开所述阀门，通过所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换，然后再关闭所述阀门，所述蒸镀腔体区域内继续进行蒸镀；
步骤4、在所述蒸镀腔体区域内正常进行蒸镀的同时，将所述换料腔体区域破真空后打开填料门，对置换出的消耗完毕的蒸镀源进行蒸镀材料填充，填料完成后关闭填料门，再对换料腔体区域抽真空，并通过所述承载 平台内的加热升温装置对填料后的蒸镀源进行预升温，等待下一次置换。
所述步骤3具体包括：
步骤31、通过所述交换装置将所述蒸镀腔体区域内消耗完毕的蒸镀源移动至阀门处，打开所述阀门；
步骤32、将所述换料腔体区域内的承载平台的一空置位置移动至阀门处，再通过所述交换装置将所述蒸镀腔体区域内消耗完毕的蒸镀源放置于该空置位置上；
步骤33、将所述换料腔体区域内的承载平台上对应设有未消耗的蒸镀源的位置移动至阀门处，再通过所述交换装置将该未消耗的蒸镀源置换至所述蒸镀腔体区域内的承载平台空出的位置上；
步骤34、关闭所述阀门，所述蒸镀腔体区域内继续进行蒸镀。
所述阀门为气动阀门；所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
所述承载平台、及交换装置具有360°旋转功能，从而当所述基板处于蒸镀腔体区域内的不同位置时，所述承载平台、及交换装置共同作用使所述蒸镀源的出气口正对基板。
所述交换装置为可伸缩连杆结构，其一端固定于一基座上，另一端通过夹具固定所述蒸镀源。
本发明的有益效果：本发明提供的一种蒸镀换料一体化设备及其使用方法，通过阀门将该设备内部分隔为可独立抽真空的蒸镀腔体区域、及换料腔体区域，并在所述蒸镀腔体区域、及换料腔体区域内分别设置加热升温装置、及数个交换装置，蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料；整个过程中无需对所述蒸镀腔体区域破真空，即可实现快速换料，且在换料前，所述换料腔体区域内的蒸镀源已经进行了预升温，提前使蒸镀材料达到预定的蒸镀速率，换料后无需长时间加热即可进行蒸镀制程，大幅减少了对生产时间的浪费，提高了生产效率，提升了产能，降低了生产成本，提高了企业的竞争力。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为本发明的蒸镀换料一体化设备的结构示意图；
图2为本发明的蒸镀换料一体化设备的蒸镀腔体区域、及换料腔体区域的内部结构的剖面示意图；
图3为本发明的蒸镀换料一体化设备的使用方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图1、图2，本发明首先提供一种蒸镀换料一体化设备，包括蒸镀腔体区域1、换料腔体区域2、及设于所述蒸镀腔体区域1与换料腔体区域2之间将二者分隔开的阀门3。
所述蒸镀腔体区域1、与换料腔体区域2内均设有一承载平台41、设于所述承载平台41上的数个蒸镀源43、用于固定与传送所述数个蒸镀源43的数个交换装置45、及一独立的抽真空装置，所述承载平台41内设有加热升温装置。所述蒸镀腔体区域1内还设有基板。所述换料腔体区域2远离所述阀门3的一侧还设有一填料门5。
所述换料腔体区域2足够容纳数个蒸镀源43即可，所述蒸镀腔体区域1则除需容纳数个蒸镀源43外，还要容纳所述基板，因此设置所述换料腔体区域2的体积远小于所述蒸镀腔体区域1的体积，相应的对所述换料腔体区域2进行破真空、抽真空的操作更简单，耗时较短。
具体地，所述阀门3为气动阀门。
所述蒸发源43包括坩埚及填充于所述坩埚内的蒸镀材料，所述蒸镀材料为有机材料、或氟化锂(LiF)等无机材料。
所述承载平台41、及交换装置45可通过现有技术实现360°旋转功能，从而当所述基板处于蒸镀腔体区域1内的不同位置时，无论基板水平放置或垂直放置，所述承载平台41、及交换装置45共同作用使所述蒸镀源43的出气口431正对基板，保证蒸镀制程顺利进行。
所述交换装置45为可伸缩连杆结构，其一端固定于一基座7上，另一端通过夹具9固定所述蒸镀源43，所述可伸缩连杆结构能够将蒸镀源43传 送至需要的位置。
上述蒸镀换料一体化设备的蒸镀腔体区域1内在首次通过所述独立的抽真空装置抽真空后，其内部始终保持压强在5×10-5Pa以下的高真空状态。蒸镀时，所述阀门3关闭，所述蒸镀腔体区域1内的数个蒸镀源43的蒸镀与所述换料腔体区域2内的数个蒸镀源43的预升温同时进行；换料时，所述阀门3打开，所述交换装置45将蒸镀腔体区域1内消耗完毕的蒸镀源43与换料腔体区域2内未消耗的蒸镀源43进行置换；填料时，所述阀门3关闭，所述填料门5打开，在所述换料腔体区域2内对置换出的消耗完毕的蒸镀源43进行填料。整个过程中无需对所述蒸镀腔体区域1破真空，即可实现快速换料，且在换料前，所述换料腔体区域2内的蒸镀源43已经进行了预升温，提前使蒸镀材料达到预定的蒸镀速率，换料后无需长时间加热即可进行蒸镀制程，与现有技术相比，大幅减少了因开腔换料造成的生产时间浪费，提高了生产效率，提升了产能，降低了生产成本，提高了企业的竞争力。
值得一提的是，由于所述蒸镀换料一体化设备的蒸镀腔体区域1与换料腔体区域2内均设有数个蒸镀源43，在蒸镀过程中，若所述蒸镀腔体区域1内的部分蒸镀材料堵塞蒸镀源43的出气口431时，也可立即通过所述交换装置45进行置换，并将出问题的蒸镀源43在所述换料腔体区域2内进行及时处理，确保了蒸镀制程的正常进行，实现连续不间断的长时间生产。
请参阅图3，本发明还提供一种蒸镀换料一体化设备的使用方法，包括如下步骤：
步骤1、提供蒸镀换料一体化设备、及蒸镀材料。
结合图1、图2，所述蒸镀换料一体化设备包括蒸镀腔体区域1、换料腔体区域2、及设于所述蒸镀腔体区域1与换料腔体区域2之间将二者分隔开的阀门3。
所述蒸镀腔体区域1、与换料腔体区域2内均设有一承载平台41、设于所述承载平台41上的数个蒸镀源43、用于固定与传送所述数个蒸镀源43的数个交换装置45、及一独立的抽真空装置，所述承载平台41内设有加热升温装置。所述蒸镀腔体区域1内还设有基板。所述换料腔体区域2远离所述阀门3的一侧还设有一填料门5。
所述换料腔体区域2内的承载平台41的部分位置空置。
具体地，所述换料腔体区域2足够容纳数个蒸镀源43即可，所述蒸镀腔体区域1则除需容纳数个蒸镀源43外，还要容纳所述基板，因此设置所 述换料腔体区域2的体积远小于所述蒸镀腔体区域1的体积。
所述阀门3为气动阀门。
所述蒸发源43包括坩埚及填充于所述坩埚内的蒸镀材料，所述蒸镀材料为有机材料、或氟化锂(LiF)等无机材料。
所述承载平台41、及交换装置45可通过现有技术实现360°旋转功能，从而当所述基板处于蒸镀腔体区域1内的不同位置时，无论基板水平放置或垂直放置，所述承载平台41、及交换装置45共同作用使所述蒸镀源43的出气口431正对基板。
所述交换装置45为可伸缩连杆结构，其一端固定于一基座7上，另一端通过夹具9固定所述蒸镀源43，所述可伸缩连杆结构能够将蒸镀源43传送至需要的位置。
步骤2、关闭所述填料门5、与阀门3，将所述蒸镀腔体区域1、换料腔体区域2分别通过所述独立的抽真空装置抽真空，通过所述承载平台41内的加热升温装置同时进行所述蒸镀腔体区域1内的数个蒸镀源43的蒸镀与所述换料腔体区域2内的数个蒸镀源43的预升温。
步骤3、当所述蒸镀腔体区域1内的某一蒸镀源43消耗完毕后，打开所述阀门3，通过所述交换装置45将蒸镀腔体区域1内消耗完毕的蒸镀源43与换料腔体区域2内未消耗的蒸镀源43进行置换，然后再关闭所述阀门3，所述蒸镀腔体区域1内继续进行蒸镀。
具体地，该步骤3可细分为：
步骤31、通过所述交换装置45将所述蒸镀腔体区域1内消耗完毕的蒸镀源43移动至阀门3处，打开所述阀门3；
步骤32、将所述换料腔体区域2内的承载平台41的一空置位置移动至阀门3处，再通过所述交换装置45将所述蒸镀腔体区域1内消耗完毕的蒸镀源43放置于该空置位置上；
步骤33、将所述换料腔体区域2内的承载平台41上对应设有未消耗的蒸镀源43的位置移动至阀门3处，再通过所述交换装置45将该未消耗的蒸镀源43置换至所述蒸镀腔体区域1内的承载平台41空出的位置上；
步骤34、关闭所述阀门3，所述蒸镀腔体区域1内继续进行蒸镀。
所述步骤3无需对所述蒸镀腔体区域1破真空，即可实现快速换料，且在换料前，所述换料腔体区域2内的蒸镀源43已经进行了预升温，提前使蒸镀材料达到预定的蒸镀速率，换料后无需长时间加热即可进行蒸镀制程。与现有技术相比，大幅减少了因开腔换料造成的生产时间浪费，提高了生产效率，提升了产能，降低了生产成本，提高了企业的竞争力。
步骤4、在所述蒸镀腔体区域1内正常进行蒸镀的同时，将所述换料腔体区域2破真空后打开填料门5，对置换出的消耗完毕的蒸镀源43进行蒸镀材料填充，填料完成后关闭填料门5，再对换料腔体区域2抽真空，并通过所述承载平台41内的加热升温装置对填料后的蒸镀源43进行预升温，等待下一次置换。
所述步骤4在蒸镀腔体区域1内保持真空状态并正常进行蒸镀的同时，依次进行对换料腔体区域2破真空、对置换出的消耗完毕的蒸镀源43填料、及再次对换料腔体区域2抽真空，由于所述换料腔体区域2的体积远小于所述蒸镀腔体区域1的体积，对所述换料腔体区域2进行破真空、抽真空的操作更简单，耗时较短，且不间断蒸镀制程的正常进行，达到了节约生产时间，提高生产效率，提升产能，降低生产成本的效果。
综上所述，本发明的蒸镀换料一体化设备及其使用方法，通过阀门将该设备内部分隔为可独立抽真空的蒸镀腔体区域、及换料腔体区域，并在所述蒸镀腔体区域、及换料腔体区域内分别设置加热升温装置、及数个交换装置，蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料；整个过程中无需对所述蒸镀腔体区域破真空，即可实现快速换料，且在换料前，所述换料腔体区域内的蒸镀源已经进行了预升温，提前使蒸镀材料达到预定的蒸镀速率，换料后无需长时间加热即可进行蒸镀制程，大幅减少了对生产时间的浪费，提高了生产效率，提升了产能，降低了生产成本，提高了企业的竞争力。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (13)

  1. 一种蒸镀换料一体化设备，包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀门；
    所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；
    所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
    所述蒸镀腔体区域内始终保持高真空状态；蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，所述填料门打开，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料。
  2. 如权利要求1所述的蒸镀换料一体化设备，其中，所述阀门为气动阀门。
  3. 如权利要求1所述的蒸镀换料一体化设备，其中，所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
  4. 如权利要求1所述的蒸镀换料一体化设备，其中，所述承载平台、及交换装置具有360°旋转功能，从而当所述基板处于蒸镀腔体区域内的不同位置时，所述承载平台、及交换装置共同作用使所述蒸镀源的出气口正对基板。
  5. 如权利要求1所述的蒸镀换料一体化设备，其中，所述交换装置为可伸缩连杆结构，其一端固定于一基座上，另一端通过夹具固定所述蒸镀源。
  6. 一种蒸镀换料一体化设备，包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀门；
    所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；
    所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
    所述蒸镀腔体区域内始终保持高真空状态；蒸镀时，所述阀门关闭，所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温同时进行；换料时，所述阀门打开，所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换；填料时，所述阀门关闭，所述填料门打开，在所述换料腔体区域内对置换出的消耗完毕的蒸镀源进行填料；
    其中，所述阀门为气动阀门；
    其中，所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
  7. 如权利要求6所述的蒸镀换料一体化设备，其中，所述承载平台、及交换装置具有360°旋转功能，从而当所述基板处于蒸镀腔体区域内的不同位置时，所述承载平台、及交换装置共同作用使所述蒸镀源的出气口正对基板。
  8. 如权利要求6所述的蒸镀换料一体化设备，其中，所述交换装置为可伸缩连杆结构，其一端固定于一基座上，另一端通过夹具固定所述蒸镀源。
  9. 一种蒸镀换料一体化设备的使用方法，包括如下步骤：
    步骤1、提供蒸镀换料一体化设备、及蒸镀材料；
    所述蒸镀换料一体化设备包括蒸镀腔体区域、换料腔体区域、及设于所述蒸镀腔体区域与换料腔体区域之间将二者分隔开的阀门；所述蒸镀腔体区域、与换料腔体区域内均设有一承载平台、设于所述承载平台上的数个蒸镀源、用于固定与传送所述数个蒸镀源的数个交换装置、及一独立的抽真空装置，所述承载平台内设有加热升温装置；所述蒸镀腔体区域内还设有基板；所述换料腔体区域远离所述阀门的一侧还设有一填料门；
    所述换料腔体区域内的承载平台的部分位置空置；
    步骤2、关闭所述填料门、与阀门，将所述蒸镀腔体区域、换料腔体区域分别通过所述独立的抽真空装置抽真空，通过所述承载平台内的加热升温装置同时进行所述蒸镀腔体区域内的数个蒸镀源的蒸镀与所述换料腔体区域内的数个蒸镀源的预升温；
    步骤3、当所述蒸镀腔体区域内的某一蒸镀源消耗完毕后，打开所述阀门，通过所述交换装置将蒸镀腔体区域内消耗完毕的蒸镀源与换料腔体区域内未消耗的蒸镀源进行置换，然后再关闭所述阀门，所述蒸镀腔体区域内继续进行蒸镀；
    步骤4、在所述蒸镀腔体区域内正常进行蒸镀的同时，将所述换料腔体区域破真空后打开填料门，对置换出的消耗完毕的蒸镀源进行蒸镀材料填 充，填料完成后关闭填料门，再对换料腔体区域抽真空，并通过所述承载平台内的加热升温装置对填料后的蒸镀源进行预升温，等待下一次置换。
  10. 如权利要求9所述的蒸镀换料一体化设备的使用方法，其中，所述步骤3具体包括：
    步骤31、通过所述交换装置将所述蒸镀腔体区域内消耗完毕的蒸镀源移动至阀门处，打开所述阀门；
    步骤32、将所述换料腔体区域内的承载平台的一空置位置移动至阀门处，再通过所述交换装置将所述蒸镀腔体区域内消耗完毕的蒸镀源放置于该空置位置上；
    步骤33、将所述换料腔体区域内的承载平台上对应设有未消耗的蒸镀源的位置移动至阀门处，再通过所述交换装置将该未消耗的蒸镀源置换至所述蒸镀腔体区域内的承载平台空出的位置上；
    步骤34、关闭所述阀门，所述蒸镀腔体区域内继续进行蒸镀。
  11. 如权利要求9所述的蒸镀换料一体化设备的使用方法，其中，所述阀门为气动阀门；所述蒸发源包括坩埚及填充于所述坩埚内的蒸镀材料。
  12. 如权利要求9所述的蒸镀换料一体化设备的使用方法，其中，所述承载平台、及交换装置具有360°旋转功能，从而当所述基板处于蒸镀腔体区域内的不同位置时，所述承载平台、及交换装置共同作用使所述蒸镀源的出气口正对基板。
  13. 如权利要求9所述的蒸镀换料一体化设备的使用方法，其中，所述交换装置为可伸缩连杆结构，其一端固定于一基座上，另一端通过夹具固定所述蒸镀源。
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